JPH0436460Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a semiconductor testing device for testing semiconductors such as integrated circuit chips.

[Conventional technology]

Conventionally, in order to test a semiconductor, an actuator inserts the semiconductor into a plug-in socket, operates the semiconductor under predetermined conditions while connected to a peripheral circuit, and extracts data generated from the semiconductor to the outside to determine various parameters of the semiconductor. 2. Description of the Related Art Semiconductor inspection devices for measuring or determining quality are known.

[Problem that the invention attempts to solve]

However, in conventional semiconductor testing equipment, the types of semiconductors that can be tested are fixed, and it is necessary to have multiple types of semiconductor testing equipment depending on the types of semiconductors. In addition, when inserting a semiconductor into a plug-in socket, the contact pressure of the socket is relatively strong, which may cause the pins of the semiconductor to bend or
It was necessary to use a large actuator to insert the semiconductor.

This invention uses a clamp-type socket as an inspection socket and provides a mechanism that automatically positions the socket and semiconductor, making it easy to attach and detach the semiconductor and make it compatible with many types of semiconductors. The purpose is to

[Means and actions for solving problems]

In the present invention, after the semiconductor being transported is stopped at a predetermined position by a stopper, the semiconductor is inserted into an inspection socket while being fixed by a clamp means, and the semiconductor is inspected.After the inspection, the semiconductor is In a semiconductor testing device for separating the testing socket from the testing socket, the testing socket comprises a clamp type shaft, and means for moving either the testing socket or the stopper in a direction parallel to the transport direction. , a positioning socket provided on the fixed member into which a semiconductor of the same type as the semiconductor to be inserted into the testing socket is inserted; and a positioning socket provided on the movable member of the testing socket and the stopper; By providing a positioning member that comes into contact with the end face of the semiconductor inserted into the positioning socket, it is possible to easily attach and detach the semiconductor, and it is also possible to immediately respond to different types of semiconductors.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a front view of a semiconductor inspection apparatus according to the present invention, FIG. 2 is a cross-sectional view of the same, and FIG. 3 is an enlarged view of the main part of FIG. 1.

In the figure, 1 is a resin-molded semiconductor to be inspected (hereinafter referred to as a workpiece), 2 is a guide guide that transports the workpiece 1 along the flow surface of the workpiece, 3 is a stopper that stops the workpiece 1 at a predetermined position, and 4 5 is an actuator for driving a stopper; 5 is a chute that communicates with a vacuum generator 6 to suck the workpiece 1; and 7 is an actuator for driving the chute.

Further, 8 is an inspection socket into which the workpiece 1 is inserted, and in the present invention, a clamp type socket is used. This clamp type socket has a contact part that can be opened and closed in conjunction with the lever 9,
The lever 9 is a lever driving actuator 10
By being driven by the link mechanism 11, the contact portion thereof is opened and closed. This socket 8 is fixed to a substrate 13 built into the head 12.

A pair of nuts 15a, 15b are coaxially fixed at a predetermined distance to the base 14 to which the head 12 is fixed, screws 16 are screwed into these nuts 15a, 15b, and screws are inserted into the middle part of the screws 16. Pick 17
Attach. Further, the rotary bearing body 1 has both ends of the screw 16 fixed to an external casing or an external frame.
It is pivotally supported by 8a and 18b. Therefore, by rotating the knob 17, the nuts 15a and 15b move, and the base 14 fixed thereto moves in the direction of arrow P or arrow WQ with respect to the external casing or external frame.
move in the direction. Note that 19 is a position fixing screw, which is tightened to the nut 15a side after adjusting the movement to prevent the screw 16 from rotating.

The above nuts 15a, 15b, screw 16, knob 1
7. A base moving mechanism 20 is constituted by the rotary bearing bodies 18a and 18b.

Further, a positioning mechanism 21 is provided on the base 14 so that even if the type of workpiece to be inspected is changed, it can be easily handled.

As shown in detail in FIG. 3, the positioning mechanism 21 includes an L-shaped positioning plate 22 fixed to the base 14 with screws, etc., and an external base (not shown) provided separately from the base 14. It consists of a fixed positioning socket 23 and a workpiece 24 inserted into this socket 23.

Next, the basic operation of the semiconductor inspection apparatus of the present invention will be explained.

First, the work 1 is moved along the guide 2 with the stopper 3 protruding into the guide 2, and the end of the mold of the work 1 is brought into contact with the stopper 3, and the contact part of the inspection socket 8 is moved. Positioning is performed so that the position of the workpiece 1 matches the position of the pin of the workpiece 1.

Next, the workpiece 1 is sucked into the chute 5 by the vacuum generator 6 and fixed therein, and the chute drive actuator 7 is driven leftward in FIG. 2 to insert the sucked workpiece 1 into the socket 8. At this time, since the contact portion of the socket 8 is in an open state, the pin of the workpiece 1 is easily inserted into the contact portion with a small force. After that, the lever 9 is driven by the lever driving actuator 10,
By closing the contact portion, the workpiece 1 is clamped to the socket 8.

Thereafter, a predetermined voltage and signal are applied to the workpiece 1 via the socket 8 to cause it to perform a predetermined operation, and data signals generated inside the head 12 are taken out to the outside to measure various parameters or to determine whether the workpiece is good or bad.

After the inspection is completed, first open the contact part of the socket 8, and then, while the workpiece 1 is sucked and fixed by the chute 5, the chute drive actuator 7 is driven to the right in FIG. is removed from the socket 8 and returned to the work flow surface.

Next, the stopper 3 is pulled by the stopper driving actuator 4, and the negative pressure of the vacuum generator 6 is released to release the work 1, and the work 1 is sent to the guide 2.

By the above-described operation, the semiconductor inspection work is completed. Note that if you use the socket 8 that corresponds to the semiconductor with the largest number of pins among the semiconductors that may be inspected, the number of pins can be reduced with one device if the nominal dimensions of the MIL standard are the same. Different semiconductors can be measured.

Next, the operation of the positioning mechanism 21 will be explained with reference to FIG.

Now, assuming that the distance between the mold end surface on the stopper 3 side of the workpiece 1 to be inspected and the center of the pin closest to this end surface is _A1 , a workpiece 24 of the same type as the workpiece 1 is placed in the positioning socket 23. The distance A ₂ between the center of the pin and the positioning plate 22 that comes into contact with the mold end surface of this work 24 is as shown above.
The positioning plate 22 is fixed on the base 14 so that A1 is equal to the positioning plate ₂₂ .

Next, the distance between the mold end face and the center of the pin is
When measuring another workpiece with B ₁ larger than A ₁ above, the pin of the workpiece when the workpiece is stopped by the stopper 3 is
It is located above the contact portion of the socket 8 by the difference between the distance B ₁ and the distance A ₁ , that is, the distance (B ₁ −A ₁ ) in FIG. 3, and insertion is impossible. Here, by rotating the knob 17 shown in FIG. 1, the base 14 is moved in the direction shown by the arrow P in FIG. If a workpiece of the same type as the workpiece is inserted into the positioning socket 23 and the positioning plate 22 is brought into contact with the mold end face of this workpiece, the positioning plate 22 will be located at a distance B ₂ from the center of the pin of the workpiece. will be located. Therefore, the base 14, which is integrated with the positioning plate 22, moves upward in FIG. 3 by the difference between the distance B ₂ and the distance A ₂ , that is, the distance (B ₂ - A ₂ ), and the socket 8 also moves upward. do.
At this time, since A ₁ = A ₂ and B ₁ = B ₂ , the pin and socket 8 of the above other work
The positions of the contacts automatically match.

That is, according to the present invention, a workpiece of the same type as the workpiece to be inspected is placed in the socket 2 of the positioning mechanism 21.
3 and by moving the base 14 using the base moving mechanism 20 so that the positioning plate 22 comes into contact with this work, the pins of the work to be inspected and the contact portions of the socket 8 can be automatically aligned. .

In the embodiment of the present invention, the base 14 is moved, but the base 14 may be fixed and the stopper 3 or the head 12 may be moved.

Further, as a means for moving the base 14 and the like, other slide mechanisms may be used instead of the above-mentioned moving mechanism using screws and nuts.

Further, instead of fixing the workpiece by vacuum suction, it may be mechanically clamped.

[Effect of idea]

As described above, according to the present invention, the following effects can be obtained.

() Since a clamp-type socket is used, compared to conventional plug-in sockets, a large force is not required to insert and remove a workpiece, and bending of the pin when inserting a workpiece can be greatly prevented. The actuator is now ready for use.

() Positioning of sockets and workpieces can be performed easily and accurately even for many types of workpieces.

[Brief explanation of the drawing]

FIG. 1 is a front view of a semiconductor inspection apparatus according to the present invention, FIG. 2 is a cross-sectional view of the same, and FIG. 3 is an enlarged view of the main part of FIG. 1. 1...Workpiece, 2...Guidance guide, 3...Stopper, 4...Stopper drive actuator, 6
... Vacuum generator, 5 ... Chute, 7 ... Shute drive actuator, 8 ... Clamp type socket, 9 ... Lever, 10 ... Lever drive actuator, 11 ... Link mechanism, 12 ... Head, 13...Substrate, 14...Base, 15a, 1
5b...Natsuto, 16...Neji, 17...Pick,
18a, 18b... Rotation bearing body, 19... Screw for position fixing, 20... Base moving mechanism, 21... Positioning mechanism, 22... Positioning plate, 23... Socket for positioning, 24... Work.

Claims (1)

[Scope of utility model registration request] After the transported semiconductor is stopped at a predetermined position by a stopper, the semiconductor is inspected by being fixed by a clamping means and inserted into an inspection socket.After inspection, the semiconductor is inserted into the inspection socket by the clamping means. In the semiconductor inspection apparatus, the inspection socket is configured as a clamp-type socket, and means for moving either the inspection socket or the stopper in a direction parallel to the conveyance direction, and a fixing member provided with means for moving either the inspection socket or the stopper in a direction parallel to the conveyance direction. a positioning socket into which a semiconductor of the same type as the semiconductor to be inserted into the testing socket is inserted; and a positioning socket provided on the movable member of the testing socket and the stopper; A semiconductor inspection device comprising: a positioning member that abuts an end face of an inserted semiconductor.