JPWO2015173879A1 - Lead correction device, mounting system, and board manufacturing method - Google Patents

Abstract

The correction unit includes a determination unit that determines the state of the lead of the electronic component, and a correction mechanism unit that corrects the shape of the lead based on the determination result of the determination unit.

Description

  The present invention relates to a lead correction device, a mounting system, and a substrate manufacturing method.

  There is an electronic component having an element portion and a plurality of leads extending from the element portion. When this electronic component is attached to the substrate, the lead of the electronic component is inserted into a hole provided in the substrate. For this reason, if the lead extending from the element portion is bent, it cannot be inserted into the hole provided in the substrate. For example, Patent Document 1 describes an apparatus for inserting a lead into a hole in a substrate while guiding the lead with a guide portion.

JP-A-6-37492

  Here, when an electronic component having a lead is attached to a substrate, it is required that the lead of the electronic component can be appropriately inserted into a hole provided in the substrate. Therefore, an object of the present disclosure is to provide a lead correction device, a mounting system, and a substrate manufacturing method that correct the shape of a lead of an electronic component.

  A lead correction apparatus according to the present disclosure includes a determination unit that determines the state of a lead of an electronic component, and a lead correction unit that corrects the shape of the lead based on the determination result of the determination unit.

  The electronic component includes an element portion and a lead extending from the element portion, and the lead correction portion includes a holding portion that holds the element portion, an engaging portion that engages with the lead, and positions of the holding portion and the engaging portion. And a control unit that controls the position changing unit so that the positions of the holding unit and the engaging unit change relatively based on the determination result of the determination unit. May be.

  The lead correction device may further include an imaging unit that images the lead, and the determination unit may determine the state of the lead based on the imaging result captured by the imaging unit.

  The position changing unit may change the position of the engaging unit in a state where the position of the holding unit is fixed.

  The imaging unit images the lead from the leading end side of the lead along the extending direction of the lead, and the determining unit determines the position of the leading end of the lead determined based on the imaging result and the position of the predetermined leading end of the lead The lead state may be determined based on the comparison result.

  The holding unit includes a first holding body and a second holding body, and the holding unit sandwiches and holds the element portion between the first holding body and the second holding body, and holds the first holding body. The body is movable along a first axial direction that is a direction close to the second holding body and a second axial direction that intersects the first axial direction, and the second holding body is It may be movable along the first axial direction and the second axial direction.

  The engaging part may include a chuck part for gripping the lead, a hook part for hooking the lead, or an annular part having a hole through which the lead passes.

  A plurality of engaging portions may be provided.

  The position changing unit may change the position of the holding unit in a state where the position of the engaging unit is fixed.

  The imaging unit images the lead from a direction intersecting the lead extending direction, and the determination unit reads the lead based on a comparison result between the lead state determined based on the imaging result and a predetermined lead state. The state may be determined.

  The engaging portion may include a pressing surface to which the lead is pressed, a hook portion for hooking the lead, or an annular portion having a hole through which the lead is passed.

  A mounting system according to the present disclosure includes a lead correction device and a mounting device that mounts an electronic component on a substrate, and the determination unit determines a state of a lead of the electronic component mounted by the mounting device, and the lead correction unit Corrects the shape of the lead of the electronic component mounted by the mounting device based on the determination result of the determination unit.

  A substrate manufacturing method according to the present disclosure controls a lead correction device having a determination unit that determines a state of a lead of an electronic component and a lead correction unit that corrects the shape of the lead, and a mounting device that mounts the electronic component on the substrate. A board manufacturing method for manufacturing a component mounting board in which an electronic component is mounted on a board, wherein the mounting apparatus is controlled so that the electronic component is mounted on the board, and the electronic component is mounted on the board by the mounting apparatus. Before the electronic component is mounted on the board by the mounting device, the lead shape is corrected based on the determination result of the determination unit. Controlling the lead correction part.

  According to the present disclosure, it is possible to provide a lead correction device, a mounting system, and a substrate manufacturing method that correct the shape of a lead of an electronic component.

It is a figure which shows schematic structure of the mounting system which concerns on 1st and 2nd embodiment. It is a block diagram which shows the hardware constitutions of a conveyance control part. It is a top view of a correction part. It is a top view of the correction | amendment part which removed the holding | maintenance part and the upper base board. It is sectional drawing which shows schematic structure at the time of seeing the correction | amendment part from the side. It is a block diagram which shows the structure of the correction control part. It is sectional drawing which shows schematic structure at the time of seeing a mounting part from the side. It is a flowchart which shows the flow of the process which manufactures a component mounting board. It is a perspective view which shows the modification of an engaging part. It is a perspective view which shows the modification of an engaging part. It is a side view which shows schematic structure of the correction part which concerns on 2nd embodiment. It is a block diagram which shows the structure of the correction control part.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

(First embodiment)
A first embodiment will be described. As shown in FIG. 1, the mounting system 1 according to the first embodiment includes a transport device 2, a storage unit 3, a correction unit (lead correction device) 4, and a mounting unit 5.

  The conveyance device 2 includes a conveyance holding unit 21, a conveyance control unit 22, and a drive unit 23. The conveyance holding unit 21 holds and holds the element unit Wa of the electronic component W. The conveyance control unit 22 controls the holding and release of the electronic component W in the conveyance holding unit 21. The conveyance control unit 22 controls the driving unit 23 so that the electronic component W held by the conveyance holding unit 21 is conveyed from the storage unit 3 to the correction unit 4 and from the correction unit 4 to the mounting unit 5. The drive unit 23 moves the conveyance holding unit 21 so that the electronic component W held by the conveyance holding unit 21 is conveyed from the storage unit 3 to the correction unit 4 and from the correction unit 4 to the mounting unit 5.

  Various mechanisms can be used as a mechanism for the conveyance holding unit 21 to grip the electronic component W and a mechanism for moving the conveyance holding unit 21. For example, the electronic component W may be transported from the storage unit 3 to the correction unit 4 or the like by extending or contracting an arm to which the transport holding unit 21 is attached. Moreover, you may convey the electronic component W from the accommodating part 3 to the correction | amendment part 4 grade | etc., By moving the conveyance holding | maintenance part 21 along a rail.

  As shown in FIG. 2, the transport control unit 22 physically includes, for example, a processor 22a, a memory 22b, an input / output unit (I / O) 22c, a storage 22d, and a bus 22e that interconnects them. And have. The processor 22a executes a program in cooperation with at least one of the memory 22b and the storage 22d, and performs input / output of data via the input / output unit 22c according to the execution result. Thereby, various functions of the conveyance control unit 22 are realized.

  The accommodating portion 3 accommodates a plurality of electronic components W. The accommodating part 3 may accommodate the electronic component W conveyed by the conveying apparatus which is not shown in figure. The accommodating part 3 may accommodate the electronic component W carried by the operator. The electronic component W has an element part Wa and a lead Wb extending from the element part Wa. In the present embodiment, an electronic component W having three leads Wb is illustrated as an example, but the number of leads Wb is not limited to three. The shape of the element portion Wa is not limited.

  The correction unit 4 corrects the shape of the lead Wb of the electronic component W transferred from the storage unit 3 by the transfer device 2. The correction unit 4 does not perform correction when the shape of the lead Wb is a shape that does not need to be corrected. An electronic component W whose shape of the lead Wb has been corrected by the correction unit 4 or an electronic component W that has not been corrected because there is no need for correction is transferred to the mounting unit 5 by the transfer device 2. The mounting unit 5 attaches the electronic component W conveyed from the correction unit 4 to the substrate B, and manufactures a component mounting substrate Bx (see FIG. 7) in which the electronic component W is mounted on the substrate B.

  Details of the correction unit 4 will be described with reference to FIGS. 3 to 5. FIG. 5 is a diagram showing a positional relationship between the holding unit 110 and the correction mechanism unit 120 and the like, and the shape and the like of each unit are shown in a simplified manner. In FIG. 5, only the first correction unit 121 and the second correction unit 122 of the correction mechanism unit 120 are illustrated. 3 and 4 show a state in which the electronic component W is not held by the holding unit 110, and FIG. 5 shows a state in which the electronic component W is held by the holding unit 110.

  As shown in FIGS. 3 to 5, the correction unit 4 includes a holding unit 110, a correction mechanism unit 120, a housing 130, a camera (imaging unit) 140, and a correction control unit 150 (see FIG. 6). Has been. The housing 130 includes an upper base plate 131, a spacer 132, and a lower base plate 133. The spacer 132 is disposed between the upper base plate 131 and the lower base plate 133. The upper base plate 131 is disposed so as to overlap the lower base plate 133 with the spacer 132 interposed therebetween. The upper base plate 131 and the spacer 132 are connected to each other by a bolt or the like. The spacer 132 and the lower base plate 133 are connected to each other by a bolt or the like. Hereinafter, for convenience, the side on which the upper base plate 131 is disposed with respect to the lower base plate 133 is referred to as “upper”, and the side on which the lower base plate 133 is disposed with respect to the upper base plate 131 is referred to as “lower”. Explain the relationship. Actually, the upper base plate 131 and the lower base plate 133 are not limited to be arranged in the vertical direction, and for example, the lower base plate 133 and the upper base plate 131 are arranged in the horizontal direction. May be.

  The holding unit 110 is disposed on the upper surface of the upper base plate 131. The holding unit 110 includes a first holding unit 111 and a second holding unit 112. The electronic component W is held by being sandwiched between the first holding unit 111 and the second holding unit 112.

  The first holding unit 111 includes a main body (first holding body) 111a, a V-axis drive unit 111b, and an X-axis drive unit 111c. A holding surface 111d that holds the electronic component W with the second holding portion 112 is provided on the surface of the main body portion 111a on the second holding portion 112 side. The V-axis drive unit 111b moves the main body 111a with respect to the upper base plate 131 along a V-axis direction (first axial direction) that is a direction close to the second holding unit 112. The X-axis drive unit 111c moves the main body 111a with respect to the upper base plate 131 along the X-axis direction (second axial direction) intersecting the V-axis direction. In the present embodiment, the X-axis direction is shifted by 45 ° as an example with respect to the V-axis direction. Accordingly, the main body 111a moves along the V-axis direction and the X-axis direction on the upper surface of the upper base plate 131.

  The second holding unit 112 includes a main body (second holding body) 112a, a V-axis drive unit 112b, and an X-axis drive unit 112c. A holding surface 112d that holds the electronic component W with the first holding portion 111 is provided on the surface of the main body portion 112a on the first holding portion 111 side. The V-axis drive unit 112b moves the main body 112a with respect to the upper base plate 131 along the V-axis direction. The X-axis drive part 112c moves the main body part 112a with respect to the upper base plate 131 along the X-axis direction. Accordingly, the main body 112a moves along the V-axis direction and the X-axis direction on the upper surface of the upper base plate 131.

  The holding surface 111d and the holding surface 112d are provided with a stepped portion 111e and a stepped portion 112e, respectively. Accordingly, when the electronic component W is sandwiched between the holding surface 111d and the holding surface 112d, the electronic component W is engaged with the stepped portion 111e and the stepped portion 112e. By moving the main body portion 111a of the first holding portion 111 and the main body portion 112a of the second holding portion 112 in accordance with the size or shape of the electronic component W, the electronic components are moved to the stepped portion 111e and the stepped portion 112e. The electronic component W can be reliably held by engaging W.

  The main body 111a of the first holding unit 111 and the main body 112a of the second holding unit 112 are movable along the V-axis direction and the X-axis direction. Accordingly, the electronic component W can be held at a predetermined position regardless of the shape of the electronic component W conveyed by the conveying device 2. More specifically, the holding unit 110 is positioned at the center of the electronic component W when the electronic component W is viewed along the alignment direction of the upper base plate 131 and the lower base plate 133 (hereinafter referred to as “Z-axis direction”). And the optical axis P of the camera 140 (hereinafter referred to as “reference position”) and the orientation of the electronic component W is determined in advance (hereinafter referred to as “reference orientation”).

  Here, in order to hold the electronic component W at the reference position by the holding unit 110, the transport device 2 transports the electronic component W toward the reference position toward the reference direction, and holds the electronic component W facing the reference direction at the reference position. The unit 110 may hold it. Further, in a state where the electronic component W is held by the holding unit 110, the main body 111a of the first holding unit 111 and the main body 112a of the second holding unit 112 are moved to move the electronic component W to the reference position. Also good.

  The stepped portion 111e and the stepped portion 111e may be arcuate. In this case, when the electronic component W is sandwiched between the holding surface 111d and the holding surface 112d, the electronic component W can be held (centered and held) at a predetermined position with respect to the main body 111a and the main body 112a. it can.

  As shown in FIG. 5, the holding unit 110 holds the element portion Wa of the electronic component W conveyed by the conveyance device 2 such that the lead Wb extends downward from the element portion Wa. The upper base plate 131 is provided with an opening 131a. The holding unit 110 holds the electronic component W such that the lead Wb of the electronic component W passes through the opening 131a.

  The correction mechanism 120 is disposed on the upper surface of the lower base plate 133. The correction mechanism unit 120 corrects the shape of the lead Wb of the electronic component W. The correction mechanism unit 120 includes a first correction unit 121, a second correction unit 122, and a third correction unit 123.

  The first correction part 121 includes a main body part 121a, a Y-axis drive part 121b, an X-axis drive part 121c, a rising part 121d, and a chuck part (engagement part) 121e. The Y-axis drive unit 121b moves the main body 121a relative to the lower base plate 133 along the Y-axis direction that intersects the X-axis direction. In the present embodiment, the Y-axis direction is shifted by 90 ° as an example with respect to the X-axis direction. The X-axis drive unit 121c moves the main body 121a along the X-axis direction. Accordingly, the main body 121a moves along the X-axis direction and the Y-axis direction on the lower base plate 133.

  The rising portion 121d connects the main body portion 121a and the chuck portion 121e. The rising portion 121d lifts the chuck portion 121e from the main body portion 121a toward the opening 131a of the upper base plate 131. The chuck part 121e has a grip part 121ea and a grip part 121eb. The chuck part 121e grips the lead Wb of the electronic component W held by the holding part 110 (engages with the lead Wb) by bringing the grip part 121ea and the grip part 121eb closer to each other. The lead Wb can be bent by the Y-axis drive part 121b and the X-axis drive part 121c moving the main body part 121a while the chuck part 121e grips the lead Wb.

  That is, in the present embodiment, the Y-axis drive unit 121b and the X-axis drive unit 121c function as position changing units that relatively change the position of the holding unit 110 and the position of the main body 121a to which the chuck unit 121e is connected. To do.

  Similar to the first correction part 121, the second correction part 122 includes a main body part 122a, a Y-axis drive part 122b, an X-axis drive part 122c, a rising part 122d, and a chuck part (engagement part) 122e. It consists of Similar to the first correction part 121, the third correction part 123 includes a main body part 123a, a Y-axis drive part 123b, an X-axis drive part 123c, a rising part 123d, and a chuck part (engagement part) 123e. It consists of Since the second correction unit 122 and the third correction unit 123 have the same configuration and operation as the first correction unit 121, detailed description thereof will be omitted.

  In this embodiment, the Y-axis drive part 122b and the X-axis drive part 122c of the second correction part 122 relatively change the position of the holding part 110 and the position of the main body part 122a to which the chuck part 122e is connected. Functions as a position changing unit. The Y-axis driving unit 123b and the X-axis driving unit 123c of the third correction unit 123 function as a position changing unit that relatively changes the position of the holding unit 110 and the position of the main body unit 123a to which the chuck unit 123e is connected. To do. Holding unit 110, chuck unit 121e, chuck unit 122e, chuck unit 123e, Y-axis drive unit 121b, X-axis drive unit 121c, Y-axis drive unit 122b, X-axis drive unit 122c, Y-axis drive unit 123b, X-axis drive unit 123c and the drive control unit 155 (see FIG. 6) function as a lead correction unit.

  The lower base plate 133 is provided with an opening 133a. The opening 133a provided in the lower base plate 133 and the opening 131a provided in the upper base plate 131 are opposed to each other in the Z-axis direction.

  A camera 140 is attached to the lower surface side of the lower base plate 133 (see FIG. 5). The camera 140 images the lead Wb of the electronic component W held at the reference position by the holding unit 110 through the opening 133 a of the lower base plate 133. The camera 140 images the front end surface of the lead Wb from the front end side of the lead Wb along the extending direction of the lead Wb of the electronic component W. An illumination device that illuminates the electronic component W may be attached in the vicinity of the camera 140. The correction unit 4 may be provided with a drive unit that moves the correction unit 4 along the Z-axis direction. By moving the correction unit 4 along the Z-axis direction, the focal position can be adjusted to the lead Wb of the electronic component W or the focal position can be adjusted to the element unit Wa. Thereby, the electronic component W can be imaged with high accuracy.

  The correction control unit 150 illustrated in FIG. 6 controls the holding unit 110 and the correction mechanism unit 120. The correction control unit 150 may be provided in the vicinity of the holding unit 110 or the like, or may be provided at a position away from the holding unit 110 or the like. The correction control unit 150 physically includes, for example, a processor, a memory, an input / output unit, a storage, and a bus that interconnects them in the same manner as the transfer control unit 22 described with reference to FIG. Have.

  FIG. 6 illustrates various functions of the correction control unit 150 as virtual blocks (hereinafter referred to as “functional blocks”). As illustrated in FIG. 6, the correction control unit 150 includes an imaging result acquisition unit 151, a component information acquisition unit 152, a storage unit 153, a determination unit 154, and a drive control unit 155 as functional blocks. .

  The imaging result acquisition unit 151 acquires image data of the distal end surface of the lead Wb from the camera 140. That is, the correction control unit 150 can execute acquisition of image data of the distal end surface of the lead Wb from the camera 140.

  The component information acquisition unit 152 acquires information on the electronic component W held by the holding unit 110. That is, the correction control unit 150 can execute acquisition of information on the electronic component W. Here, the information of the electronic component W includes the type of the electronic component W. For example, the information on the electronic component W may be acquired from a control unit that controls the entire mounting system 1, or a conveyance control unit 22 that controls the conveyance device 2. In addition to acquiring information about the electronic component W from another control unit, the type of the electronic component W may be determined by the correction unit 4. For example, the correction control unit 150 may determine the type of the electronic component W based on the image data of the electronic component W captured by the camera 140. In this case, the camera 140 may be moved in the Z-axis direction to perform imaging while focusing on the element portion Wa of the electronic component W. Note that when there is only one type of electronic component W for correcting the lead Wb, the information on the electronic component W does not have to be acquired.

  The storage unit 153 stores lead information for each type of electronic component W in advance. That is, the correction control unit 150 stores lead information for each type of electronic component W in advance. In the present embodiment, the lead information includes position information of the leading end portion of the lead Wb with respect to the element portion Wa of the electronic component W. The position information of the leading end portion of the lead Wb is positional information of the leading end portion of the lead Wb when the lead Wb is not bent and the state of the lead Wb is a predetermined state. Further, the state in which the lead Wb is not bent and the state of the lead Wb is predetermined is a state in which the lead Wb can be properly inserted into the hole Ba (see FIG. 7) of the substrate B.

  The determination unit 154 acquires lead information corresponding to the type of the electronic component W held by the holding unit 110 from the storage unit 153 based on the information on the electronic component W acquired by the component information acquisition unit 152. The determination unit 154 determines the state of the lead Wb of the electronic component W held by the holding unit 110 based on the image data acquired by the imaging result acquisition unit 151 and the lead information acquired from the component information acquisition unit 152. .

  Specifically, the determination unit 154 detects the position of the leading end portion of the lead Wb from the image data using an existing image processing technique. For example, the determination unit 154 may detect the position of the leading end portion of the lead Wb based on light reflected by the leading end surface of the lead Wb. Here, the electronic component W is held at the reference position. Thereby, when the electronic component W held by the holding unit 110 is imaged by the camera 140, the position of the tip of the lead Wb with respect to the element unit Wa can be grasped based on the imaged image data.

  The determination unit 154 compares the position of the leading end portion of the lead Wb detected from the image data with the position of the leading end portion of the lead Wb with respect to the element portion Wa included in the lead information. Based on the comparison result, the determination unit 154 determines whether or not the state of the lead Wb of the electronic component W held by the holding unit 110 is a state that requires correction or a state that does not require correction. As an example, the determination unit 154 has an amount of deviation between the position of the tip of the lead Wb detected from the image data and the position of the tip of the lead Wb with respect to the element part Wa included in the lead information equal to or greater than a predetermined amount of deviation. In this case, it is determined that correction is necessary. When determining that the state of the lead Wb of the electronic component W is a state requiring correction, the determination unit 154 determines the bending direction of the lead Wb.

  That is, the correction control unit 150 can determine whether the state of the lead Wb of the electronic component W is a state that requires correction or a state that does not require correction. In addition, when the correction control unit 150 determines that the state of the lead Wb of the electronic component W is a state that requires correction, the correction control unit 150 can determine the bending direction of the lead Wb.

  The drive control unit 155 is configured such that the V-axis drive unit 111b, the X-axis drive unit 111c, and the V-axis drive unit 112b of the holding unit 110 are held so that the electronic component W conveyed by the conveyance device 2 is held in the reference direction and the reference position. And the X-axis drive unit 112c is controlled. Further, when the determination unit 154 determines that the state of the lead Wb of the electronic component W is a state requiring correction, the drive control unit 155 determines the lead based on the bending direction of the lead determined by the determination unit 154. The Y-axis drive unit 121b, the X-axis drive unit 121c, the Y-axis drive unit 122b, the X-axis drive unit 122c, the Y-axis drive unit 123b, and the X-axis drive unit 123c of the correction mechanism unit 120 so that the shape is corrected. To control. That is, the correction control unit 150 corrects the shape of the lead Wb based on the determination result of the lead state, so that the Y-axis drive unit 121b, the X-axis drive unit 121c, and the Y-axis drive unit of the correction mechanism unit 120 are corrected. It is possible to control 122b, the X-axis drive unit 122c, the Y-axis drive unit 123b, and the X-axis drive unit 123c.

  Specifically, the drive control unit 155 controls the chuck unit 121e of the first correction unit 121 so that the lead Wb of the electronic component W is gripped by the chuck unit 121e. Then, the drive control unit 155 controls the Y-axis drive unit 121b and the X-axis drive unit 121c to move the main body 121a so that the state of the lead Wb becomes a predetermined state. To correct. At this time, the drive control unit 155 may move the main body 121a based on the characteristics related to the bending of the lead Wb to be corrected. Thereby, the lead Wb can be appropriately corrected according to the characteristics relating to bending. Similarly to the first correction unit 121, the drive control unit 155 controls each part of the second correction unit 122 and the third correction unit 123 to correct the shape of the lead Wb. The drive control unit 155 controls each part of the first correction unit 121, the second correction unit 122, and the third correction unit 123 to simultaneously correct the shapes of the three leads Wb included in the electronic component W. Alternatively, the shapes of the three leads Wb may be corrected at different timings.

  In the present embodiment, the drive control unit 155 includes a Y axis drive unit 121b, an X axis drive unit 121c, a Y axis drive unit 122b, an X axis drive unit 122c, a Y axis drive unit 123b, and an X axis as position change units. It functions as a control unit that controls the drive unit 123c.

  While the shape of the lead Wb is being corrected by the first correction unit 121, the second correction unit 122, and the third correction unit 123, the holding unit 110 holds the electronic component W in the reference direction and the reference position. Maintain state. As described above, when correcting the shape of the lead Wb, the positions of the main body portions 111a and 112a of the first holding unit 111 and the second holding unit 112, the first correction unit 121, and the second correction unit 122. And the position of the main-body parts 121a, 122a, and 123a of the 3rd correction | amendment part 123 changes relatively. In the present embodiment, the first correction unit 121, the second correction unit 122, and the third correction are performed with the positions of the main body portions 111a and 112a of the first holding unit 111 and the second holding unit 112 fixed. The positions of the main body parts 121a, 122a and 123a of the part 123 are changed.

  After correction of the lead Wb by the first correction unit 121 or the like, the determination unit 154 again detects the position of the leading end portion of the lead Wb detected from the image data of the leading end surface of the corrected lead Wb and the element included in the lead information. The position of the tip of the lead Wb with respect to the part Wa is compared. The drive control unit 155 controls the first correction unit 121 and the like to correct the lead Wb until the determination unit 154 determines that correction is not necessary.

  Details of the mounting unit 5 will be described with reference to FIG. The mounting unit 5 mounts (attaches) the electronic component W to the board B. The mounting unit 5 includes a holding unit 201, a soldering unit 202, and a mounting control unit 203. The holding unit 201 holds the substrate B. The transport device 2 installs the electronic component W at the mounting position of the electronic component W on the substrate B. At this time, the transport device 2 inserts the lead Wb of the electronic component W into the hole Ba provided in the substrate B. The soldering portion 202 solders the wiring portion provided on the substrate B and the lead Wb.

  The mounting control unit 203 controls the holding and release of the substrate B in the holding unit 201. Further, the mounting control unit 203 controls the soldering unit 202 so that the wiring unit provided on the substrate B and the lead Wb are soldered. In FIG. 7, signal lines that connect the mounting control unit 203 and the holding unit 201 and signal lines that connect the mounting control unit 203 and the soldering unit 202 are indicated by broken lines. Thereby, the component mounting board Bx in which the electronic component W is mounted on the board B is manufactured. The mounting control unit 203 physically includes, for example, a processor, a memory, an input / output unit, a storage, and a bus that interconnects them in the same manner as the transport control unit 22 described with reference to FIG. Have.

  The electronic component W mounted on the board B in the mounting unit 5 is an electronic component W in which the shape of the lead Wb is corrected in the correction unit 4 or a state in which the state of the lead Wb is determined in the correction unit 4 and correction is unnecessary. It is the electronic component W determined to be. For this reason, the lead Wb can be appropriately inserted into the hole Ba of the substrate B by the transport device 2.

  In the present embodiment, the transport device 2 and the mounting unit 5 function as a mounting device that mounts the electronic component W on the substrate B. The transport control unit 22 of the transport device 2 and the mounting control unit 203 of the mounting unit 5 function as a control unit that controls the mounting device configured by the transport device 2 and the mounting unit 5. In other words, the transport control unit 22 and the mounting control unit 203 can execute control of the transport device 2 and the mounting unit 5 as mounting devices so that the electronic component W is mounted on the substrate B.

  Here, the transport device 2 has installed the electronic component W on the substrate B, but the electronic component W may be installed on the substrate B by a device other than the transport device 2. For example, the mounting unit 5 may have an installation device for installing the electronic component W on the board B. In this case, the installation device may receive the electronic component W from the transport device 2 and install the electronic component W on the substrate B.

  Next, a board manufacturing method for manufacturing the component mounting board Bx in the mounting system 1 will be described. As illustrated in FIG. 8, the transport device 2 transports the electronic component W housed in the housing unit 3 to the correction unit 4 (Step S <b> 101). When the electronic component W is conveyed to the correction unit 4, the drive control unit 155 controls each unit of the holding unit 110 and sandwiches and holds the electronic component W by the first holding unit 111 and the second holding unit 112. .

  The determination unit 154 determines whether or not the state of the lead Wb of the electronic component W held by the holding unit 110 is a state that requires correction or a state that does not require correction (step S102). When the state of the lead Wb is a state requiring correction (step S102: YES), the drive control unit 155 controls each part of the correction mechanism unit 120 to correct the shape of the lead Wb of the electronic component W (step S103). .

  After correction of the lead Wb (after step S103) or when the state of the lead Wb is a state where correction is not required (step S102: NO), the transport device 2 transfers the electronic component W from the correction unit 4 to the mounting unit 5. Is conveyed (step S104). The mounting unit 5 mounts the electronic component W conveyed from the correction unit 4 on the substrate B (step S105). Thereby, the component mounting board Bx in which the electronic component W is mounted on the board B is manufactured.

  The present embodiment is configured as described above, and the determination unit 154 determines whether or not the state of the lead Wb of the electronic component W requires correction. The correction mechanism unit 120 corrects the shape of the lead Wb based on the determination result of the determination unit 154. Thus, by using the determination result of the determination unit 154, the correction mechanism unit 120 can correct the shape of the lead Wb.

  When correcting the shape of the lead Wb of the electronic component W, the positions of the main body portions 111a and 112a of the first holding unit 111 and the second holding unit 112, the first correcting unit 121, and the second correcting unit 122 are used. And the position of the main-body parts 121a, 122a, and 123a of the 3rd correction | amendment part 123 changes relatively. As described above, the positions of the main body portions 111a and 112a of the first holding portion 111 and the second holding portion 112, and the main body portions of the first correction portion 121, the second correction portion 122, and the third correction portion 123. By relatively changing the positions of 121a, 122a, and 123a, the shape of the lead Wb of the electronic component W can be easily corrected.

  The determination unit 154 determines the state of the lead Wb of the electronic component W based on the image captured by the camera 140. Thereby, the determination unit 154 can easily detect the state of the lead Wb based on the image data captured by the camera 140. Further, the determination unit 154 can easily determine whether or not the state of the lead Wb is a state requiring correction based on the detected state of the lead Wb.

  When correcting the shape of the lead Wb of the electronic component W, the first correction unit 121, the second correction unit 121, the second correction unit 121, and the second correction unit 121 are fixed in a state where the positions of the main body portions 111a and 112a of the first holding unit 111 and the second holding unit 112 are fixed. The main body parts 121a, 122a and 123a of the straightening part 122 and the third straightening part 123 are moved. Thereby, the shape of the lead Wb of the electronic component W can be easily corrected by controlling only the correction mechanism portion 120 side.

  The camera 140 images the front end surface of the electronic component W from the front end side of the lead Wb along the extending direction of the lead Wb of the electronic component W. Thereby, the determination unit 154 can easily detect the position of the tip of the lead Wb based on the light reflected by the tip of the lead Wb.

  The main body part 111a of the first holding part 111 and the main body part 112a of the second holding part 112 are respectively movable along the V-axis direction and the X-axis direction. As a result, the electronic component W can be held at the reference position regardless of the shape of the electronic component W conveyed by the conveying device 2. Since the electronic component W can be held at the reference position, the influence of aberration can be suppressed when the electronic component W is imaged by the camera 140. Therefore, the position of the tip of the lead Wb of the electronic component W can be detected with high accuracy.

  The chuck portions 121e, 122e, and 123e grip the lead Wb of the electronic component W. As a result, the lead Wb can be bent in either the X-axis direction or the Y-axis direction, which is the moving direction of the main body 121a of the first correction unit 121, and the shape of the lead Wb can be easily corrected. be able to.

  In addition, the shape of the lead Wb is corrected by the three correction units, the first correction unit 121, the second correction unit 122, and the third correction unit 123. As a result, the shapes of the three leads Wb can be corrected simultaneously, and the time required for correction can be shortened.

  The mounting system 1 includes a correction unit 4 and a mounting device configured by the transport device 2 and the mounting unit 5. Thereby, the shape of the lead Wb can be corrected and the electronic component W can be mounted on the substrate B. Therefore, the component mounting board Bx in which the electronic component W is mounted on the board B can be easily obtained.

  In the first embodiment, when correcting the shape of the lead Wb of the electronic component W, the positions of the main body portions 111a and 112a of the first holding portion 111 and the second holding portion 112 are fixed, The main body parts 121a, 122a and 123a of the first correction part 121, the second correction part 122 and the third correction part 123 were moved. Without being limited thereto, the main body portions 111a and 112a of the first holding portion 111 and the second holding portion 112 are moved, and the first correction portion 121, the second correction portion 122, and the third correction portion 123 are moved. You may fix the position of the main-body parts 121a, 122a, and 123a. Alternatively, the positions of the main body portions 111 a and 112 a of the first holding portion 111 and the second holding portion 112, and the main body portions 121 a of the first correction portion 121, the second correction portion 122, and the third correction portion 123. , 122a and 123a may both be moved. In this case, the shape of the lead Wb can be corrected in a shorter time than when the main body of either the holding unit 110 or the correction mechanism unit 120 is moved.

  Although the chuck portions 121e, 122e, and 123e for gripping the lead Wb are provided, other engaging portions may be used as long as the shape can be corrected by engaging with the lead Wb. For example, as shown in FIG. 9, instead of the chuck portions 121e, 122e, and 123e, a hook portion (engagement portion) 125e having a tip formed in a hook shape may be used. In this case, the lead Wb is engaged with the tip of the hook portion 125e formed in a hook shape, and the body portion 121a and the like of the first correction portion 121 are moved to correct the shape of the lead Wb. Further, as shown in FIG. 10, an annular portion (engagement portion) 126e having a hole through which the lead Wb is passed may be used. In this case, the lead Wb is inserted into the hole provided in the annular portion 126 and the lead Wb is engaged with the annular portion 126. In a state where the lead Wb is engaged with the annular portion 126e, the body portion 121a and the like of the first correction portion 121 are moved to correct the shape of the lead Wb. Even when the hook portion 125e or the annular portion 126e is used, the shape of the lead Wb can be corrected.

  In this embodiment, the conveyance control unit 22 that controls the conveyance device 2, the correction control unit 150 that controls the correction unit 4, and the mounting control unit 203 that controls the mounting unit 5 are individually provided. It is not limited to providing. For example, two or more control units of the transport control unit 22, the correction control unit 150, and the mounting control unit 203 may be configured by a single control unit.

  In the present embodiment, the three correction parts, the first correction part 121, the second correction part 122, and the third correction part 123 are provided, but the number of correction parts is not limited to three. For example, one or more correction parts may be provided, such as providing only the first correction part 121.

(Second embodiment)
A second embodiment will be described. As shown in FIG. 1, the mounting system 1 </ b> A according to the second embodiment includes a transport device 2 </ b> A, a storage unit 3, a correction unit 4 </ b> A, and a mounting unit 5. The mounting system 1A according to the second embodiment includes a transport device 2A and a correction unit 4A instead of the transport device 2 and the correction unit 4 of the mounting system 1 according to the first embodiment. Configurations other than the transport device 2A and the correction unit 4A are the same as those in the first embodiment, and the same reference numerals are given and detailed description thereof is omitted.

  As shown in FIG. 11, the correction unit 4A includes an annular part (engagement unit) 310, a camera (imaging unit) 320, and a correction control unit 150A (see FIG. 12). The annular portion 310 is a tubular member having an engagement hole 310a inside. The engagement hole 310a is a hole through which the lead Wb of the electronic component W is passed. The extending direction of the engagement hole 310a is defined as the Z-axis direction, and the direction orthogonal to the Z-axis is defined as the X-axis direction. A direction orthogonal to the X axis and the Z axis is defined as a Y axis direction.

  The camera 320 captures an image of the lead Wb from a direction (for example, a direction orthogonal) intersecting the extending direction of the lead Wb of the electronic component W.

  Here, the conveyance holding unit 21 of the conveyance device 2A moves along the X-axis direction, the Y-axis direction, and the Z-axis direction. When the conveyance holding portion 21 moves along the Z-axis direction, the lead Wb of the electronic component W is inserted into the engagement hole 310a of the annular portion 310. In the present embodiment, the transport holding unit 21 of the transport apparatus 2A can rotate about the Z axis. That is, the conveyance holding unit 21 can rotate the electronic component W around the Z axis as a central axis. In this case, when the camera 320 images the electronic component W in a different rotation state twice or more, the bending direction of the lead Wb can be detected based on the imaging result.

  When the conveyance holding unit 21 of the conveyance device 2A does not rotate around the Z axis, two cameras 320 may be provided in the correction unit 4A. In this case, by imaging the lead Wb of the electronic component W from two directions using the two cameras 320, the bending direction of the lead Wb can be detected based on the imaging result.

  The correction control unit 150A illustrated in FIG. 12 may be provided in the vicinity of the camera 320 or may be provided at a position away from the camera 320. As with the transport control unit 22 described with reference to FIG. 2, the correction control unit 150A physically includes, for example, a processor, a memory, an input / output unit, a storage, and a bus that interconnects them. Have.

  FIG. 12 shows various functions of the correction control unit 150A as functional blocks. As illustrated in FIG. 12, the correction control unit 150A includes an imaging result acquisition unit 151A, a component information acquisition unit 152A, a storage unit 153A, a determination unit 154A, and an output unit 156 as functional blocks.

  The imaging result acquisition unit 151A acquires the image data of the lead Wb captured by the camera 320. That is, the correction control unit 150 </ b> A can execute acquisition of the image data of the lead Wb from the camera 320.

  The component information acquisition unit 152A acquires information on the electronic component W that has been transported to the correction unit 4A by the transport device 2A. That is, the correction control unit 150 </ b> A can execute acquisition of information on the electronic component W. Similar to the component information acquisition unit 152 according to the first embodiment, the component information acquisition unit 152A can acquire information on the electronic component W from a control unit or the like that controls the entire mounting system 1A. In addition to acquiring information on the electronic component W from another control unit, the type of the electronic component W may be determined by the correction unit 4A.

  The storage unit 153A stores lead information for each type of electronic component W in advance. That is, the correction control unit 150A stores lead information for each type of electronic component W in advance. In the present embodiment, the lead information includes information indicating the state of the lead Wb of the electronic component W. The information indicating the state of the lead Wb is information indicating the state of the lead Wb when the lead Wb is not bent or the like and the state of the lead Wb is a predetermined state. Further, the state in which the lead Wb is not bent and the state of the lead Wb is predetermined is a state in which the lead Wb can be properly inserted into the hole Ba (see FIG. 7) of the substrate B.

  The determination unit 154A acquires, from the storage unit 153A, lead information corresponding to the type of the electronic component W transported by the transport device 2A based on the information on the electronic component W acquired by the component information acquisition unit 152A. The determination unit 154A determines the state of the lead Wb of the electronic component W transferred by the transfer device 2A based on the image data acquired by the imaging result acquisition unit 151A and the lead information acquired from the component information acquisition unit 152A. To do.

  Specifically, the determination unit 154A detects the state of the lead Wb from the image data using an existing image processing technique. For example, the determination unit 154A may detect the state of the lead Wb based on the light reflected by the side surface of the lead Wb. Since the camera 320 images the lead Wb from the direction intersecting the extending direction of the lead Wb of the electronic component W, the side surface of the lead Wb can be easily detected. The side surface of the lead Wb has a larger area than the tip surface of the lead Wb. For this reason, the determination unit 154A can easily detect the side surface of the lead Wb as compared with the case where the tip surface of the lead Wb is detected.

  The determination unit 154A compares the state of the lead Wb detected from the image data with the state of the lead Wb included in the lead information. Based on the comparison result, the determination unit 154A determines whether the state of the lead Wb of the electronic component W transported by the transport device 2A is a state that requires correction or a state that does not require correction. When determining that the state of the lead Wb of the electronic component W is a state requiring correction, the determination unit 154A determines the bending direction of the lead Wb. That is, the correction control unit 150A can determine whether the state of the lead Wb of the electronic component W is a state that requires correction or a state that does not require correction. Further, when the correction control unit 150A determines that the state of the lead Wb of the electronic component W is a state that requires correction, the correction control unit 150A can determine the bending direction of the lead Wb.

  The output unit 156 outputs the determination result of the determination unit 154A to the conveyance control unit 22A of the conveyance device 2A.

  The transport device 2 </ b> A includes a transport holding unit 21, a transport control unit 22 </ b> A, and a drive unit 23. The drive unit 23 moves the conveyance holding unit 21 so that the electronic component W held by the conveyance holding unit 21 is conveyed from the storage unit 3 to the correction unit 4A and from the correction unit 4A to the mounting unit 5. The conveyance control unit 22 </ b> A controls the holding and release of the electronic component W in the conveyance holding unit 21. The conveyance control unit 22A controls the drive unit 23 so that the electronic component W held by the conveyance holding unit 21 is conveyed from the storage unit 3 to the correction unit 4A and from the correction unit 4A to the mounting unit 5. The conveyance control unit 22A controls the drive unit 23 so that the camera W 320 images the lead Wb when conveying the electronic component W to the correction unit 4A.

  The conveyance control unit 22A acquires the determination result of the determination unit 154A output by the output unit 156. When the determination unit 154A determines that the state of the lead Wb of the electronic component W is in a state that requires correction, the transport control unit 22A inserts the lead Wb that needs correction into the engagement hole 310a of the annular portion 310. Thus, the drive unit 23 is controlled. The conveyance control unit 22A moves the conveyance holding unit 21 by controlling the driving unit 23 so that the shape of the lead Wb is corrected based on the bending direction of the lead determined by the determination unit 154A. That is, the conveyance control unit 22A can control the drive unit 23 based on the determination result of the lead state to correct the shape of the lead Wb.

  Specifically, the engagement hole 310a of the annular portion 310 and the lead Wb of the electronic component W are engaged. For this reason, the lead Wb is bent by moving the conveyance holding unit 21 in at least one of the X-axis direction and the Y-axis direction (see FIG. 11) while the conveyance holding unit 21 holds the electronic component W. Can do. The conveyance control unit 22A controls the driving unit 23 to move the conveyance holding unit 21, thereby correcting the shape of the lead Wb so that the state of the lead Wb becomes a predetermined state.

  Similarly to the transport control unit 22 described with reference to FIG. 2, the transport control unit 22A physically includes, for example, a processor, a memory, an input / output unit, a storage, and a bus that interconnects them. Have. Various mechanisms can be used as a mechanism for the conveyance holding unit 21 to grip the electronic component W and a mechanism for moving the conveyance holding unit 21.

  In the present embodiment, the conveyance holding unit 21 functions as a holding unit that holds the element portion Wa of the electronic component W. The drive unit 23 functions as a position changing unit that relatively changes the position of the conveyance holding unit 21 and the position of the annular unit 310. The conveyance control unit 22A functions as a control unit that controls the drive unit 23 so that the positions of the conveyance holding unit 21 and the annular portion 310 change relatively. The transport device 2A and the correction unit 4A function as a lead correction device that corrects the shape of the lead Wb of the electronic component W.

  In the mounting unit 5, the configuration for mounting the electronic component W on the substrate B is the same as in the first embodiment, and detailed description thereof is omitted. In the present embodiment, the transfer device 2 </ b> A and the mounting unit 5 function as a mounting device that mounts the electronic component W on the substrate B. The transport control unit 22A of the transport device 2A and the mounting control unit 203 of the mounting unit 5 function as a control unit that controls the mounting apparatus configured by the transport device 2A and the mounting unit 5.

  Next, a board manufacturing method for manufacturing the component mounting board Bx in the mounting system 1A will be described. As illustrated in FIG. 8, the transport device 2A transports the electronic component W housed in the housing unit 3 to the correction unit 4A (step S101).

  The determination unit 154A determines whether the state of the lead Wb of the electronic component W transported by the transport device 2A is a state that requires correction or a state that does not require correction (step S102). When the state of the lead Wb is a state that requires correction (step S102: YES), the transport control unit 22A controls the drive unit 23 to move the transport holding unit 21 to correct the shape of the lead Wb of the electronic component W. (Step S103).

  After correction of the lead Wb (after step S103) or when the state of the lead Wb is not necessary to be corrected (step S102: NO), the transport device 2A transfers the electronic component W from the correction unit 4A to the mounting unit 5. Is conveyed (step S104). The mounting unit 5 mounts the electronic component W transported from the correction unit 4A on the substrate B (step S105). Thereby, the component mounting board Bx in which the electronic component W is mounted on the board B is manufactured.

  The present embodiment is configured as described above, and the determination unit 154A determines whether or not the state of the lead Wb of the electronic component W requires correction. The conveyance control unit 22A corrects the shape of the lead Wb by moving the conveyance holding unit 21 based on the determination result of the determination unit 154A. Thus, by using the determination result of the determination unit 154A, the transport device 2A and the correction unit 4A can correct the shape of the lead Wb.

  When correcting the shape of the lead Wb of the electronic component W, the position of the conveyance holding portion 21 that holds the electronic component W and the position of the annular portion 310 that engages with the lead Wb relatively change. As described above, the shape of the lead Wb of the electronic component W can be easily corrected by relatively changing the position of the conveyance holding portion 21 and the position of the annular portion 310.

  The determination unit 154A determines the state of the lead Wb of the electronic component W based on an image captured by the camera 320. Accordingly, the determination unit 154A can easily detect the state of the lead Wb based on the image data captured by the camera 320. Further, the determination unit 154A can easily determine whether or not the state of the lead Wb is a state requiring correction based on the detected state of the lead Wb.

  When correcting the shape of the lead Wb of the electronic component W, only the conveyance holding unit 21 is moved in a state where the position of the annular portion 310 is fixed. Thereby, the shape of the lead Wb of the electronic component W can be easily corrected by controlling only the conveying device 2A side.

  The camera 320 images the lead Wb from a direction that intersects with the direction in which the lead Wb of the electronic component W extends. As a result, the side surface of the lead Wb having a larger area than the front end surface can be imaged by the camera 320. Therefore, the state of the lead Wb can be easily detected based on the imaging result.

  The lead Wb of the electronic component W is engaged with the annular portion 310 by being inserted into the engagement hole 310 a of the annular portion 310. Thereby, the annular part 310 and the lead Wb of the electronic component W can be easily engaged. Further, the shape of the lead Wb can be easily corrected only by moving the transport holding unit 21 with the lead Wb engaged with the annular portion 310.

  The mounting system 1 </ b> A includes a lead correction device configured by the transport device 2 </ b> A and the correction unit 4 </ b> A, and a mounting device configured by the transport device 2 </ b> A and the mounting unit 5. Thereby, the shape of the lead Wb can be corrected and the electronic component W can be mounted on the substrate B. Therefore, the component mounting board Bx in which the electronic component W is mounted on the board B can be easily obtained.

  In the second embodiment, when the shape of the lead Wb of the electronic component W is corrected, the transport holding unit 21 that holds the electronic component W is moved while the position of the annular portion 310 is fixed. However, the present invention is not limited to this, and the position of the conveyance holding unit 21 that holds the electronic component W may be fixed by moving the annular portion 310. Alternatively, both the position of the annular portion 310 and the position of the conveyance holding portion 21 that holds the electronic component W may be moved. In this case, the shape of the lead Wb can be corrected in a shorter time than when either the annular portion 310 or the conveyance holding portion 21 is moved.

  Although the annular portion 310 that engages with the lead Wb is provided, other engaging portions may be used as long as the shape can be corrected by engaging with the lead Wb. For example, as shown in FIG. 9, a hook portion (engagement portion) 125e having a tip formed in a hook shape may be used instead of the annular portion 310. Further, instead of the annular portion 310, the chuck portion (engagement portion) 121e used in the first embodiment may be used. When the annular part 310 does not have the engagement hole 310a, the conveyance holding part 21 may correct the shape of the lead Wb by pressing the lead Wb against the outer surface 310b of the annular part 310. In this case, the outer surface 310b of the annular portion 310 is a pressing surface that is pressed against the lead Wb and engages with the lead Wb. Thus, if it has a pressing surface against which the lead Wb is pressed, such as the outer surface 310b of the annular portion 310, engaging portions of various shapes can be used. Thus, even when the engaging portion other than the annular portion 310 is used and when the outer surface 310b of the annular portion 310 is used as the pressing surface, the shape of the lead Wb can be corrected.

  In this embodiment, the conveyance control unit 22A that controls the conveyance device 2A, the correction control unit 150A that controls the correction unit 4A, and the mounting control unit 203 that controls the mounting unit 5 are individually provided. It is not limited to providing. For example, two or more control units may be configured by one control unit among the conveyance control unit 22A, the correction control unit 150A, and the mounting control unit 203.

  It is possible to provide a lead correction device, a mounting system, and a substrate manufacturing method that correct the shape of a lead of an electronic component.

  DESCRIPTION OF SYMBOLS 1,1A ... mounting system, 2 ... conveying apparatus (mounting apparatus), 2A ... conveying apparatus (lead correction apparatus, mounting apparatus), 4, 4A ... correction part (lead correction apparatus), 5 ... mounting part (mounting apparatus), DESCRIPTION OF SYMBOLS 21 ... Conveyance holding part (holding part), 22A ... Conveyance control part (control part), 23 ... Drive part (position change part), 110 ... Holding part (lead correction part), 111a ... Main body part (first holding body) ), 112a... Main body (second holder), 121e, 122e, 123e... Chuck (lead correction part, engagement part), 121b, 122b, 123b... Y-axis drive part (lead correction part, position change part) ), 121c, 122c, 123c ... X-axis drive unit (lead correction unit, position change unit), 140,320 ... Camera (imaging unit), 154,154A ... determination unit, 155 ... Drive control unit (lead correction unit, control) Part), 310 ... annular part ( Engagement part), 310b ... outer surface (pressing surface), B ... substrate, Bx ... component mounting board, W ... electronic component, Wa ... element portion, Wb ... lead.

Claims (13)

A determination unit for determining the state of the lead of the electronic component;
A lead correction apparatus comprising: a lead correction unit that corrects the shape of the lead based on a determination result of the determination unit. The electronic component has an element part and the lead extending from the element part,
The lead correction part is
A holding part for holding the element part;
An engaging portion for engaging with the lead;
A position changing unit that relatively changes the positions of the holding unit and the engaging unit;
The lead according to claim 1, further comprising: a control unit that controls the position changing unit so that positions of the holding unit and the engaging unit are relatively changed based on a determination result of the determination unit. Straightening device. An imaging unit for imaging the lead;
The lead correction apparatus according to claim 2, wherein the determination unit determines the state of the lead based on an imaging result captured by the imaging unit.   The lead correction apparatus according to claim 3, wherein the position changing unit changes the position of the engaging unit in a state where the position of the holding unit is fixed. The imaging unit images the lead from the leading end side of the lead along the extending direction of the lead,
The determination unit determines the state of the lead based on a comparison result between the position of the tip of the lead determined based on the imaging result and the position of the tip of the lead determined in advance. Item 5. The lead correction apparatus according to Item 4. The holding portion includes a first holding body and a second holding body,
The holding unit sandwiches and holds the element unit between the first holding body and the second holding body,
The first holding body is movable along a first axial direction that is a direction close to the second holding body, and a second axial direction that intersects the first axial direction,
6. The lead correction device according to claim 4, wherein the second holding body is movable along the first axial direction and the second axial direction. 7.   The lead according to any one of claims 4 to 6, wherein the engaging portion includes a chuck portion for gripping the lead, a hook portion for hooking the lead, or an annular portion having a hole through which the lead is passed. Straightening device.   The lead correction device according to any one of claims 4 to 7, wherein a plurality of the engaging portions are provided.   The lead correction apparatus according to claim 3, wherein the position changing unit changes the position of the holding unit in a state where the position of the engaging unit is fixed. The imaging unit images the lead from a direction intersecting the extending direction of the lead,
The lead according to claim 9, wherein the determination unit determines the state of the lead based on a comparison result between the state of the lead determined based on the imaging result and a predetermined state of the lead. Straightening device.   11. The lead correction device according to claim 9, wherein the engagement portion includes a pressing surface to which the lead is pressed, a hook portion to hook the lead, or an annular portion having a hole through which the lead is passed. The lead straightening device according to any one of claims 1 to 11,
A mounting device for mounting the electronic component on a substrate,
The determination unit determines a state of the lead of the electronic component mounted by the mounting device,
The lead correction unit corrects the shape of the lead of the electronic component mounted by the mounting device based on a determination result of the determination unit. A lead correction device having a determination unit that determines the state of the lead of the electronic component and a lead correction unit that corrects the shape of the lead, and a mounting device that mounts the electronic component on a substrate are controlled, and the electronic A board manufacturing method for manufacturing a component mounting board on which a component is mounted,
Controlling the mounting apparatus so that the electronic component is mounted on the substrate;
Controlling the determination unit to determine the state of the lead before the electronic component is mounted on the substrate by the mounting apparatus;
Controlling the lead correction unit so that the shape of the lead is corrected based on the determination result of the determination unit before the electronic component is mounted on the substrate by the mounting apparatus. Method.

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