CN103249295B

CN103249295B - Electronic component mounting method, electronic component mounting apparatus and electronic component mounting system

Info

Publication number: CN103249295B
Application number: CN201310050006.5A
Authority: CN
Inventors: 伊藤直也
Original assignee: Juki Corp
Current assignee: Juki Corp
Priority date: 2012-02-08
Filing date: 2013-02-08
Publication date: 2017-07-07
Anticipated expiration: 2033-02-08
Also published as: CN107148211A; CN107148211B; CN103249295A

Abstract

The present invention provides a kind of electronic component mounting method, electronic component mounting apparatus and electronic component mounting system, and it can efficiently and accurately install electronic unit.Mounting type electronic unit is supplied to the 1st holding position, electronic unit retainer belt is conveyed, the electronic unit retainer belt possesses multiple radial lead type electronic units of main body and the lead linked with the radial direction of the main body, and keep the retainer belt main body of multiple radial lead type electronic units, the lead cut-out of the radial lead type electronic unit for being kept, supplied to the 2nd holding position, transferred by while being kept to the mounting type electronic unit supplied to the 1st holding position using suction nozzle, carried on the loading position of substrate, transferred by while being kept to supplying to the main body of the radial lead type electronic unit of the 2nd holding position using suction nozzle, by the insertion that inserts in the hole from lead to substrate, so as to it be installed on substrate.

Description

Electronic component mounting method, electronic component mounting apparatus and electronic unit are installed System

Technical field

Electronic unit is kept using suction nozzle and move the present invention relates to one kind, and by it to the electronic unit installed on substrate Installation method, electronic component mounting apparatus and electronic component mounting system.

Background technology

To the electronic component mounting apparatus that electronic unit is carried on substrate, possesses the boarded head with suction nozzle, using the suction Mouth keeps electronic unit and is carried on substrate.Electronic component mounting apparatus are by making the suction nozzle of boarded head along the surface with substrate Orthogonal direction movement, so as to the part being pointed in electronic part feeder is adsorbed, then, makes boarded head edge and base The direction that the surface of plate is parallel is relatively moved, after the loading position for reaching adsorbed part, by making the suction of boarded head Mouth along with the movement of the direction of the surface normal of substrate and close to substrate, so as to the electronic unit that will be adsorbed is carried on substrate.

Herein, as the electronic unit installed to substrate, in addition to the mounting type electronic unit being equipped on substrate, Also there is the lead-type electronic-part of the lead linked with main body and with main body.In the present invention, lead-type electronic-part It is the part by the way that lead is installed to insertion in the hole formed on substrate.In addition, in the present invention, will not be to slotting Enter hole（Substrate aperture）It is middle insertion and be equipped on the electronic unit on substrate, such as SOP, QFP etc., as mounting type electronic unit. , to the electronic component mounting apparatus installed on substrate, exist described in such as patent document 1 and 2 as by lead-type electronic-part Device.A kind of electronic components mounting machine is recorded in patent document 1, it has component assembling machine, the component assembling machine is used In installing following two kinds of electronic units, i.e. the mounting type electronic unit that is adsorbed by absorption boarded head and pressed from both sides by clamping boarded head Hold and to substrate insert after carry out stickfast（clinch）Lead-type electronic-part.A kind of electronics has been recorded in patent document 2 Apparatus for mounting component, it is integrally formed the boarded head installed to mounting type electronic unit and to lead-type electronic-part The insertion boarded head installed.

Patent document 1：Japanese Unexamined Patent Publication 5-335782 publications

Patent document 2：Japanese Unexamined Patent Publication 9-83121 publications

By using the device described in patent document 1 and 2, lead-type electronic-part can be carried to substrate.At this In, the device described in patent document 1 and 2 is that Special mounting device is carried in mixing, and it is provided integrally with and is respectively for insertion into axle Special suction to the special clamping boarded head of lead-type electronic-part and for mounting type electronic unit to be carried to substrate Attached boarded head, both mounting type electronic unit and lead-type electronic-part can be installed to substrate.Herein, patent document Special mounting device is carried in mixing described in 1 and 2, it is impossible to using above-mentioned absorption boarded head by lead-type electronic-part to insertion Hole（Substrate aperture）Middle insertion, in addition, cannot be carried mounting type electronic unit to substrate using above-mentioned clamping boarded head.That is, it Be boarded head for mounting type electronic unit and lead-type electronic-part variety of components without interchangeability device. Therefore, the species of electronic unit that is corresponding with the species of the boarded head on erecting device and can carrying is limited to, And due to various boarded heads, so as very expensive device.

The content of the invention

The present invention is exactly to propose in view of the foregoing, can efficiently and accurately its object is to, there is provided one kind Install the electronic component mounting method of radial lead type electronic unit and mounting type electronic unit, electronic component mounting apparatus and Electronic component mounting system.

The present invention provides a kind of electronic component mounting method, electronic component mounting apparatus and electronic component mounting system, They have the feedway for supplying, also, not only using a boarded head mounting type electronic unit can be kept to go forward side by side Row substrate is carried, and lead-type electronic-part can also be kept and to patchhole（Substrate aperture）Insertion, so as to have exchange Property, therefore, it can that a greater variety of electronic units are installed.

In order to solve above-mentioned problem, purpose is realized, the present invention provides a kind of electronic component mounting method, in the method, While being kept to electronic unit using the holder main body with suction nozzle, the holder main body is transferred, Electronic unit is installed on substrate, it is characterised in that with following step：Mounting type electronic unit supplying step, in the step In rapid, mounting type electronic unit is supplied to the 1st holding position；Radial lead type electronic unit supplying step, in this step, Electronic unit retainer belt is conveyed, the electronic unit retainer belt possesses main body and connects with the radial direction of the main body Multiple radial lead type electronic units of the lead of knot and the guarantor kept to the multiple radial lead type electronic unit Band main body is held, the lead of the radial lead type electronic unit that the electronic unit retainer belt is kept cuts off, will radially Lead-type electronic-part is supplied to the 2nd holding position；Mounting type electronic unit installation steps, in this step, by utilizing The suction nozzle is transferred while holding to the mounting type electronic unit supplied to the 1st holding position, to described Carried on the loading position of substrate, so as to the mounting type electronic unit be installed on the substrate；And radial lead type Electronic unit installation steps, in this step, draw by using the suction nozzle to the radial direction supplied to the 2nd holding position The main body of line style electronic unit is transferred while holding, and the lead is slotting to inserting in the hole for the substrate Enter, so as to the radial lead type electronic unit be installed on the substrate.

It is preferred that also having：Detecting step, in this step, to the radial lead type ministry of electronics industry kept by the suction nozzle The state of part is detected；And determination step, in this step, based on the suction nozzle detected in the detecting step The state of the radial lead type electronic unit for being kept, the state to the lead of the electronic unit judges, In the radial lead type electronic unit installation steps, the lead of the electronic unit is judged in the determination step In the case that state meets condition, by loading position from the electronic unit to the substrate described in insert in the hole insertion.

Additionally, it is preferred that also having recycling step, in this step, the institute of the electronic unit is judged in the determination step State lead state be unsatisfactory for condition in the case of, by the electronic unit to recovering mechanism convey.

Additionally, it is preferred that in the detecting step, by the laser measurement of laser sensor, the radial direction to measure object is drawn The shape of line style electronic unit is measured.

Additionally, it is preferred that also there is substrate state detecting step, in this step, described in after the carrying electronic unit Whether the state of substrate is detected, based on the state of the substrate for detecting, to by the radial lead type ministry of electronics industry Part and mounting type electronic unit configuration are judged in installation site.

Additionally, it is preferred that in the radial lead type electronic unit supplying step, the electronic unit retainer belt is protected The lead of the radial lead type electronic unit held is cut to specific length shortlyer, is supplied to the 2nd holding position.

In order to solve above-mentioned problem, purpose is realized, the present invention provides a kind of electronic component mounting apparatus, and it is using in level The boarded head moved on face, will be located on loading position of the electronic unit of holding position to substrate and transfers and installed, its It is characterised by having：Substrate carrying mechanism, it conveys the substrate to the region for carrying the electronic unit；Radial lead Type electronic part feeder, its load electronic unit retainer belt, the electronic unit retainer belt possess main body and with it is described Multiple radial lead type electronic units of the lead that the radial direction of main body links and the multiple radial lead type electricity of holding The retainer belt main body of subassembly, the institute that the radial lead type electronic part feeder is kept the electronic unit retainer belt The lead cut-out of radial lead type electronic unit is stated, radial lead type electronic unit is separated from the retainer belt main body, Xiang Bao Hold region supply；Mounting type electronic part feeder, it on the substrate by being carried on the substrate to installing Mounting type electronic unit supplied；Holder main body, it has to from the radial lead type electronic part feeder The main body of the radial lead type electronic unit of supply and the mounting type electricity from mounting type electronic part feeder supply Suction nozzle that subassembly is kept successively, the suction nozzle is driven up and down and the suction nozzle drive division of rotation driving and right The boarded head supporter that the suction nozzle and the suction nozzle drive division are supported；And control unit, its to the holder main body, The action of the radial lead type electronic part feeder and the mounting type electronic part feeder is controlled, institute State control unit to insert the radial lead type electronic unit kept from the suction nozzle to the substrate, will be protected by the suction nozzle The mounting type electronic unit held is carried on the substrate.

It is preferred that also there is unit status test section, its radial lead type electronic unit kept to the suction nozzle State detected, the control unit based on the suction nozzle detected as the unit status test section described in kept The state of radial lead type electronic unit, in the case of judging that the state of the lead of the electronic unit meets condition, by this Electronic unit is inserted to the substrate.

Additionally, it is preferred that the control unit is unsatisfactory for the situation of condition in the state of the lead for judging the electronic unit Under, the electronic unit is conveyed to recovering mechanism.

Additionally, it is preferred that the control unit is based on interval and the patchhole of the substrate of the lead of the electronic unit Interval, whether condition is met to the state of the lead of the electronic unit and is judged.

Additionally, it is preferred that the unit status test section is laser sensor, its configuration is under the boarded head supporter Side, measures along horizontal irradiation laser to the shape of the electronic unit of measure object.

Additionally, it is preferred that also there is substrate state test section, its state to carrying the substrate after the electronic unit Detected, the control unit is based on the state of the substrate detected by the substrate state test section, to the radial direction Lead-type electronic-part and whether the mounting type electronic unit is configured is judged in installation site.

Additionally, it is preferred that grasping suction nozzle of the suction nozzle comprising the grasping electronic unit.

Additionally, it is preferred that absorption suction nozzle of the suction nozzle comprising the absorption electronic unit.

In order to solve above-mentioned problem, purpose is realized, the present invention provides a kind of electronic component mounting system, it is characterised in that Have：Patterning device, its to the substrate the filling solder that inserts in the hole, and on the surface of the substrate print weldering The pattern of material；Electronic component mounting apparatus described in any of the above-described, it fills solder to using the patterning device The insertion radial lead type electronic unit that inserts in the hole afterwards, on the surface for being printed with the pattern of the solder On, the mounting type electronic unit is installed；And reflow treatment device, it using the electronic component mounting apparatus to installing institute State the substrate after radial lead type electronic unit and the mounting type electronic unit to be flowed back, by the radial lead Type electronic unit and the mounting type electronic unit are welded on the substrate.

The effect of invention

The present invention has following effects, i.e. can efficiently and accurately install radial lead type electronic unit and carrying Type electronic unit.

Brief description of the drawings

Fig. 1 is the schematic diagram of the schematic configuration for representing electronic component mounting apparatus.

Fig. 2 is the oblique view of the schematic configuration of the framework for representing electronic component mounting apparatus.

Fig. 3 A are the front views of the framework shown in Fig. 2.

Fig. 3 B are the top views of the framework shown in Fig. 2.

Fig. 3 C are the right side views of the framework shown in Fig. 2.

Fig. 3 D are the left side views of the framework shown in Fig. 2.

Fig. 3 E are the rearviews of the framework shown in Fig. 2.

Fig. 4 is the explanatory diagram of the schematic configuration of the cover for representing framework.

Fig. 5 is the explanatory diagram of the schematic configuration of the lockable mechanism for representing framework.

Fig. 6 is the schematic diagram of the schematic configuration for representing electronic component mounting apparatus.

Fig. 7 is the schematic diagram of the schematic configuration for representing front side receptacle.

Fig. 8 is the schematic diagram of the schematic configuration for representing rear side receptacle.

Fig. 9 is the schematic diagram of the schematic configuration of the other examples of the part feed unit for representing rear side.

Figure 10 is the schematic diagram of the schematic configuration of the boarded head for representing electronic component mounting apparatus.

Figure 11 is the schematic diagram of the schematic configuration of the boarded head for representing electronic component mounting apparatus.

Figure 12 is a schematic diagram for the schematic configuration of example for representing electronic unit retainer belt.

Figure 13 is the schematic diagram of the schematic configuration of the other examples for representing electronic unit retainer belt.

Figure 14 is the oblique view of the schematic configuration of the electronic part feeder of the part feed unit for representing rear side.

Figure 15 is the oblique view that the electronic part feeder shown in Figure 14 is observed from the direction different from Figure 14.

Figure 16 is the explanatory diagram of the schematic configuration of the electronic part feeder for representing part feed unit.

Figure 17 is the explanatory diagram of the schematic configuration of the grip unit for representing electronic part feeder.

Figure 18 is the explanatory diagram of the schematic configuration of the feeder unit for representing electronic part feeder.

Figure 19 is the explanatory diagram of the schematic configuration in the front support portion for representing feeder unit.

Figure 20 is the explanatory diagram of the schematic configuration of the retainer belt feeding claw unit for representing feeder unit.

Figure 21 is the explanatory diagram for illustrating the action of feeder unit.

Figure 22 is the explanatory diagram of the schematic configuration of the cutting unit for representing electronic part feeder.

Figure 23 is the explanatory diagram of the schematic configuration of the cutting unit for representing electronic part feeder.

Figure 24 is the explanatory diagram of the schematic configuration of the cutting unit for representing electronic part feeder.

Figure 25 is the oblique view of the schematic configuration of the other examples for representing cutting unit.

Figure 26 is the oblique view for representing the schematic configuration that the cutting unit shown in Figure 25 is observed from other directions.

Figure 27 is the oblique view for representing the relation between the cutting unit shown in Figure 25 and framework.

Figure 28 is the oblique view of the schematic configuration of the other examples for representing cutting unit.

Figure 29 is the explanatory diagram of the action for the cutting unit shown in explanatory diagram 25.

Figure 30 is the explanatory diagram of the action for the cutting unit shown in explanatory diagram 25.

Figure 31 A are the explanatory diagrams of the schematic configuration of the maintaining body for representing cutting unit.

Figure 31 B are the explanatory diagrams of the schematic configuration of the other examples of the maintaining body for representing cutting unit.

Figure 32 is the explanatory diagram of the schematic configuration of the other examples of the feeder unit for representing electronic part feeder.

Figure 33 is the oblique view for representing the schematic configuration that the feeder unit shown in Figure 32 is observed from other directions.

Figure 34 is the front view of the schematic configuration for representing the feeder unit shown in Figure 32.

Figure 35 is the top view of the schematic configuration for representing the feeder unit shown in Figure 32.

Figure 36 is the front view of the schematic configuration of other states for representing the feeder unit shown in Figure 32.

Figure 37 is the top view of the schematic configuration of other states for representing the feeder unit shown in Figure 32.

Figure 38 is the explanatory diagram of the schematic configuration for representing the feeder unit shown in Figure 32.

Figure 39 is the explanatory diagram of the schematic configuration of other states for representing the feeder unit shown in Figure 32.

Figure 40 is the explanatory diagram of the schematic configuration of the link gear for representing the feeder unit shown in Figure 32.

Figure 41 is the explanatory diagram of the schematic configuration of the other examples for representing framework.

Figure 42 is the explanatory diagram of the action for the feeder unit shown in explanatory diagram 32.

Figure 43 is the explanatory diagram of the action for the feeder unit shown in explanatory diagram 32.

Figure 44 is the explanatory diagram of the schematic configuration of the other examples for representing assembly supply device.

Figure 45 is by the explanatory diagram of a part of enlarged representation of Figure 44.

Figure 46 is the explanatory diagram of the schematic configuration of the other examples for representing assembly supply device.

Figure 47 is by the explanatory diagram of a part of enlarged representation of Figure 46.

Figure 48 is the explanatory diagram of the schematic configuration of the other examples for representing assembly supply device.

Figure 49 is by the explanatory diagram of a part of enlarged representation of Figure 48.

Figure 50 is to represent a bowl oblique view for the schematic configuration of formula feeder assembly.

Figure 51 is the oblique view of the schematic configuration for representing the bowl formula feeder assembly shown in Figure 50.

Figure 52 is the side view of the other examples for representing part feed unit.

Figure 53 is the top view of the other examples for representing part feed unit.

Figure 54 is to represent the side view that the state after bowl dismounting will be housed from the part feed unit shown in Figure 52.

Figure 55 is collecting bowl and the vibration section of the electronic part feeder for representing the part feed unit shown in Figure 53 The explanatory diagram of the relation between supporting part.

Figure 56 is the explanatory diagram of the schematic configuration for representing the collecting bowl shown in Figure 55.

Figure 57 A are the outline knots of the supporting mechanism of the electronic part feeder for representing the part feed unit shown in Figure 53 The oblique view of structure.

Figure 57 B are the front views of the schematic configuration for representing the supporting mechanism shown in Figure 57 A.

Figure 58 A are the oblique views of other states for representing the supporting mechanism shown in Figure 57 A.

Figure 58 B are the front views of the schematic configuration for representing the supporting mechanism shown in Figure 58 A.

Figure 59 is the top view of the schematic configuration of the drive device for representing the part feed unit shown in Figure 53.

Figure 60 is the oblique view of the schematic configuration for representing the drive device shown in Figure 59.

Figure 61 is by the amplification plan view of the schematic configuration enlarged representation of the drive device shown in Figure 59.

Figure 62 is the side view of the schematic configuration for representing the drive device shown in Figure 59.

Figure 63 is the side cutaway view of the schematic configuration for representing the drive device shown in Figure 59.

Figure 64 is the explanatory diagram of the action for the drive device shown in explanatory diagram 59.

Figure 65 is by the oblique view of a part of enlarged representation of electronic part feeder.

Figure 66 is by the oblique view of a part of enlarged representation of electronic part feeder.

Figure 67 A are by the oblique view of a part of enlarged representation of electronic part feeder.

Figure 67 B are the oblique views for the part that the electronic part feeder shown in Figure 67 A is represented from other directions.

Figure 68 is the explanatory diagram for illustrating the identification maneuver of the shape of the electronic unit of electronic component mounting apparatus.

Figure 69 is the explanatory diagram for illustrating the identification maneuver of the shape of the electronic unit of electronic component mounting apparatus.

Figure 70 is the explanatory diagram for illustrating the identification maneuver of the shape of the electronic unit of electronic component mounting apparatus.

Figure 71 is the explanatory diagram for illustrating the identification maneuver of the shape of the electronic unit of electronic component mounting apparatus.

Figure 72 is the explanatory diagram for illustrating the identification maneuver of the shape of the electronic unit of electronic component mounting apparatus.

Figure 73 is a schematic diagram for example of the testing result for representing identification maneuver.

Figure 74 is a schematic diagram for example of the testing result for representing identification maneuver.

Figure 75 is the explanatory diagram for illustrating the identification maneuver of the shape of the electronic unit of electronic component mounting apparatus.

Figure 76 is a flow chart for example of the action for representing electronic component mounting apparatus.

Figure 77 is an explanatory diagram for example for representing operation screen.

Figure 78 is the explanatory diagram for the part for representing operation screen.

Figure 79 A are an explanatory diagrams for example for representing part feed angle degree.

Figure 79 B are an explanatory diagrams for example for representing part feed angle degree.

Figure 80 is an explanatory diagram for example for representing operation screen.

Figure 81 is an explanatory diagram for example for representing operation screen.

Figure 82 is the explanatory diagram for the part for representing operation screen.

Figure 83 A are locate explanatory diagrams for example for representing electronic unit.

Figure 83 B are locate explanatory diagrams for example for representing electronic unit.

Figure 83 C are locate explanatory diagrams for example for representing electronic unit.

Figure 83 D are locate explanatory diagrams for example for representing electronic unit.

Figure 84 is a flow chart for example of the action for representing electronic component mounting apparatus.

Figure 85 is a flow chart for example of the action for representing electronic component mounting apparatus.

Figure 86 is a flow chart for example of the action for representing electronic component mounting apparatus.

Figure 87 A are an explanatory diagrams for example for representing electronic unit.

Figure 87 B are an explanatory diagrams for example of the measurement result for representing lead.

Figure 88 A are an explanatory diagrams for example for representing electronic unit.

Figure 88 B are an explanatory diagrams for example of the measurement result for representing lead.

Figure 89 is a flow chart for example of the action for representing electronic component mounting apparatus.

Figure 90 is the explanatory diagram for representing the relation between lead and patchhole.

Figure 91 is a flow chart for example of the action for representing electronic component mounting apparatus.

Figure 92 is the explanatory diagram for illustrating the action of electronic component mounting apparatus.

Figure 93 is a flow chart for example of the action for representing electronic component mounting apparatus.

Figure 94 is a flow chart for example of the action for representing electronic component mounting apparatus.

Figure 95 is a flow chart for example of the action for representing electronic component mounting apparatus.

Figure 96 is a flow chart for example of the action for representing electronic component mounting apparatus.

Figure 97 is a flow chart for example of the action for representing electronic component mounting apparatus.

Figure 98 A are the explanatory diagrams for illustrating the action of electronic component mounting apparatus.

Figure 98 B are the explanatory diagrams for illustrating the action of electronic component mounting apparatus.

Figure 99 is an explanatory diagram for example for representing suction nozzle.

Figure 100 is the explanatory diagram of the holding action for the suction nozzle of explanatory diagram 99.

Figure 101 A are an explanatory diagrams for example for representing suction nozzle.

Figure 101 B are an explanatory diagrams for example for representing suction nozzle.

Figure 101 C are an explanatory diagrams for example for representing suction nozzle.

Figure 101 D are an explanatory diagrams for example for representing suction nozzle.

Figure 102 is a flow chart for example of the action for representing electronic component mounting apparatus.

Figure 103 is a flow chart for example of the action for representing electronic component mounting apparatus.

Figure 104 is the explanatory diagram for illustrating the action of electronic component mounting apparatus.

Figure 105 is a flow chart for example of the action for representing electronic component mounting apparatus.

Figure 106 is a flow chart for example of the action for representing electronic component mounting apparatus.

Figure 107 is a flow chart for example of the action for representing electronic component mounting apparatus.

Figure 108 is the schematic diagram of the schematic configuration for representing electronic component mounting system.

Figure 109 is a flow chart for example of the action for representing electronic component mounting system.

The explanation of symbol

1 installation system, 2 patterning devices, 4 reflow treatment devices, 6,7 conveying devices, 8 substrates, 10 electronic units peace Assembling device, 11 frameworks, 11a main bodys, 11b, 11f, 11r cover, 11c openings, 11d cover supporting parts, 11e lockable mechanisms, 12 substrates are defeated Send portion, 14,14f, 14r part feed unit, 15 boarded heads, 16XY travel mechanisms, 17VCS units, 18 change suction nozzles keeps machines Structure, 19 component storage portions, 20 control devices, 22X axle drive divisions, 24Y axle drive divisions, 30 holder main bodies, the support of 31 boarded heads Body, 32 suction nozzles, 34 suction nozzle drive divisions, 38 laser identifying devices, 40 operating portions, 42 display parts, 44 front side receptacles, 46 rear sides are received Container, 48,49 connectors, 60 control units, 62 boarded head control units, 64 part supply control parts, 70 electronic unit retainer belts, 72 Retainer belt main body, 80 electronic units, 82 main bodys（Electronic component body）, 84 leads, 90 bowls of formula feeder assemblys, 100, The electronic part feeder of 100a, 200,402,404,406,102 supporting tables, 110 frameworks, 112 grip units, 114 feeders Unit, 116,116a cutting units, 118 air pressure adjustment portions, 120 guiding grooves, 302 lists, 304 carrying order lists, 400 House bowl feeder unit, 408 drive devices, 410 fixed parts, 420,420a, 420b, 420c house bowl, 422,422a, 422b, 422c guide rail, 424,424a, 424b, 424c supporting mechanism, 426,426a, 426b, 426c linking part, 580a, 580b, 580c initiating terminal sidepiece part detection sensors, 582a, 582b, 582c holding position sidepiece part detection sensor, 590 air supplying parts

Specific embodiment

Below, referring to the drawings, the present invention is described in detail.Additionally, the present invention not by following for carrying out an invention Mode（Hereinafter referred to as implementation method）Limit.In addition, in inscape in following implementation methods, comprising art technology Key element in the so-called equivalency ranges such as key element, substantially the same key element that personnel can be readily apparent that.In addition, in following implementations Inscape disclosed in mode can be with appropriately combined.

Below, based on accompanying drawing, to electronic component mounting apparatus and electronic component mounting method involved in the present invention Implementation method is described in detail.Additionally, the present invention is not limited by present embodiment.Fig. 1 is to represent that electronic unit installs dress The schematic diagram of the schematic configuration put.

Electronic component mounting apparatus 10 shown in Fig. 1 are to the device that electronic unit is carried on substrate 8.Electronic unit is installed Device 10 has：Framework 11, substrate delivery section 12, part feed unit 14f, 14r, boarded head 15, XY travel mechanisms 16, VCS Unit 17, replacing suction nozzle maintaining body 18, component storage portion 19, control device 20, operating portion 40 and display part 42.Additionally, XY travel mechanisms 16 have X-axis drive division 22 and Y-axis drive division 24.Herein, the electronic unit of present embodiment installs dress 10 are put as shown in figure 1, there is part feed unit 14f, 14r respectively in front side and rear side centered on substrate delivery section 12. In electronic component mounting apparatus 10, part feed unit 14f configurations are in the front side of electronic component mounting apparatus 10, part supply Unit 14r configures the rear side in electronic component mounting apparatus 10.In addition, not distinguishing 2 part feed units especially below In the case of 14f, 14r, part feed unit 14 is referred to as.

Fig. 2 is the oblique view of the schematic configuration of the framework for representing electronic component mounting apparatus.Fig. 3 A are the frameworks shown in Fig. 2 Front view.Fig. 3 B are the top views of the framework shown in Fig. 2.Fig. 3 C are the right side views of the framework shown in Fig. 2.Fig. 3 D are Fig. 2 The left side view of shown framework.Fig. 3 E are the rearviews of the framework shown in Fig. 2.Fig. 4 is the schematic configuration of the cover for representing framework Explanatory diagram.Fig. 5 is the explanatory diagram of the schematic configuration of the lockable mechanism for representing framework.Additionally, in Fig. 3 A to Fig. 3 E, omission portion The diagram of part feed unit 14f, 14r, shows to be more readily understood framework 11.

Framework 11 as shown in Fig. 3 A to Fig. 3 E, with main body 11a and cover 11bf, 11br.Main body 11a is to house to constitute electronics The casing of each several part of apparatus for mounting component 10.Main body 11a is received in front side configuration cover 11bf, operating portion 40, display part 42, front side Container 44 and connector 48, cover 11br, rear side receptacle 46 and connector 49 are formed in rear side.Main body 11a is 2 sides Upper to form 2 opening 11c respectively, they are used to that substrate 8 to be moved into and discharged in device.The operating portion 40 of present embodiment has There is keyboard 40a and mouse 40b.The display part 42 of present embodiment has touch panel 42a and picture monitor 42b.Additionally, touching Touch the panel 42a also parts as operating portion 40.Front side receptacle 44 and rear side receptacle 46 are respectively to supply list to part The part that first 14f, 14r are supported.The detailed configuration of front side receptacle 44 and rear side receptacle 46 is described below.Connector 48 are connected with the distribution of each several part of part feed unit 14f described later.In addition, connector 49 and part feed unit described later The distribution connection of each several part of 14r.Herein, as distribution, the pipeline of distribution and supply air with transmission electric signal.

Below, cover 11bf, 11br are illustrated.Additionally, cover 11bf, 11br only allocation position front side and rear side this Point is different, and structure is identical.Below, in the case where not distinguishing especially, referred to as cover 11b and illustrate.Cover 11bf be The coaming plate set in a part for the front side of main body 11a, configures on the upside of vertical.Cover 11br is the rear side in main body 11a A part on set coaming plate, configure on the upside of vertical.Front or the back side of the cover 11b with covering main body 11a The shape of a part for a part and upper surface, section turns into L-shaped.Cover 11b relative to main body 11a as shown in figure 4, can open Close.Turn into open mode by making cover 11b, operation can be carried out to configuring each several part inside main body 11a.Cover 11b's is upper The front end on surface links with main body 11a, with linking portion as fulcrum.In addition, cover 11b is supported by cover supporting part 11d.Cover branch Support part 11d is flexible bar-like member, and a side end links with main body 11a, and end side links with cover 11b.Cover supporting part 11d is accordingly stretched with the opening and closing of cover 11b.In addition, be provided with lockable mechanism 11e on cover supporting part 11d, it is by cover branch The flexible locking of support part 11d.Lockable mechanism 11e is by as lockup state, making cover supporting part 11d turn into the shape that cannot be stretched State, by as released state, making cover supporting part 11d turn into the state that can be stretched.If lockable mechanism 11e turns into locking shape State, then cover 11b and be fixed on current location.Thus, it is possible to the cover 11b for suppressing open mode is closed because of deadweight.

Fig. 1 is returned to, continuation is illustrated to electronic component mounting apparatus 10.As long as substrate 8 is used to carry electronic unit Part, its structure is not specially limited.The substrate 8 of present embodiment is plate-shaped member, and surface is provided with Wiring pattern. On the surface of the Wiring pattern being arranged on substrate 8, attachment flows back the Wiring pattern of plate-shaped member and the ministry of electronics industry as utilization The solder of the attachment of part engagement.In addition, on the substrate 8, also forming the through hole for inserting electronic unit（Patchhole, base Plate hole）.

Substrate delivery section 12 is by the conveying mechanism of the X-direction conveying along figure of substrate 8.Substrate delivery section 12 has：Along X The guide rail that direction of principal axis extends；And conveying mechanism, it is supported to substrate 8, substrate 8 is moved along guide rail.Substrate delivery section 12 direction to cause the carrying object surface of substrate 8 relative with boarded head 15, makes substrate 8 be moved along guide rail using conveying mechanism, So as to substrate 8 be conveyed along X-direction.Substrate delivery section 12 will be come from the equipment supply supplied to electronic component mounting apparatus 10 Substrate 8, be delivered to the assigned position on guide rail.Boarded head 15 at above-mentioned assigned position, by table from electronic unit to substrate 8 Carry in face.Substrate delivery section 12 to after being delivered to and carrying electronic unit on the substrate 8 of above-mentioned assigned position, by substrate 8 to entering Conveyed at the device of the next operation of row.Additionally, as the conveying mechanism of substrate delivery section 12, it is possible to use various structures.Example Such as, it is possible to use by the conveying mechanism of the conveyer belt mode of conveying mechanism integration, in the conveying mechanism of this mode, by edge The guide rail of the conveying direction configuration of substrate 8 and the endless belt combination rotated along above-mentioned guide rail, above-mentioned annular is being mounted in by substrate 8 Conveyed in the state of taking.

Fig. 6 is the schematic diagram of the schematic configuration for representing electronic component mounting apparatus.Fig. 7 is the outline for representing front side receptacle The schematic diagram of structure.Fig. 8 is the schematic diagram of the schematic configuration for representing rear side receptacle.Such as Fig. 6 institutes of electronic component mounting apparatus 10 Show, in front side arrangement components feed unit 14f, in rear side arrangement components feed unit 14r.The part feed unit 14f of front side There is electronic part feeder respectively with the part feed unit 14r of rear side, they keep multiple to the electricity carried on substrate 8 Subassembly, as shown in fig. 6, can be supplied to boarded head 15, i.e. can be kept with by boarded head 15（Absorption is grasped） State to holding position supply electronic unit.Part feed unit 14f, 14r of present embodiment supply with main body and The lead-type electronic-part of the lead linked with main body.

The part feed unit 14f of front side has 2 bowl formula feeder assemblys 90.Bowl formula feeder assembly 90 has Multiple assembly supply devices as bowl formula feeder, from each assembly supply device to holding position（Absorption position, grasps position Put）Supply electronic unit.Supplied by each assembly supply device to the electronic unit of holding position, by boarded head 15 to substrate 8 Install.For bowl formula feeder assembly 90, described below.

2 bowl formula feeder assemblys 90 of part feed unit 14f are arranged on the receptacle 44 of front side.As shown in fig. 7, Front side receptacle 44 has supporting plate 44a.Supporting plate 44a is fixed on the assigned position inside main body 11a by bolt etc..Support Plate 44a is supported to 2 bowl formula feeder assemblys 90.The end of the side of substrate delivery section 12 of supporting plate 44a is configured with fixed Position axle 44b.Locating shaft 44b support bowl formula feeders assembly 90, positions to bowl formula feeder assembly 90.In addition, On the end with the opposition side of the side of substrate delivery section 12 of supporting plate 44a, 2 recess 44c are formed with.Recess 44c also makes respectively The part insertion of bowl formula feeder assembly 90, positions to bowl formula feeder assembly 90.

The part feed unit 14r of rear side has multiple electronic part feeders（Hereinafter referred to as " part supply is filled Put "）100.Electronic part feeder 100 is radial direction feeder, to holding position（Absorption position, grasping position）Supply electronics Part.Supplied by each assembly supply device 100 to the electronic unit of holding position, installed to substrate 8 by boarded head 15.

Assembly supply device 100 is constituted using the lead of multiple radial lead type electronic units is pasted on retainer belt Electronic unit retainer belt, radial lead type electronic unit is supplied to boarded head 15.Assembly supply device 100 is to maintain band supply Device, it keeps electronic unit retainer belt, the electronic unit retainer belt to being kept to convey, the radial lead type that will be kept Electronic unit is moved to the holding area that can be kept to electronic unit using the suction nozzle of boarded head 15（Absorption position, grab Hold position, holding position）.Assembly supply device 100 is drawn by will be moved to the radial lead type electronic unit of holding area Line is cut off and separates, and rule are may remain in such that it is able to turn into the radial lead type electronic unit by the retainer belt anchor leg Positioning puts the state at place, it is possible to use the suction nozzle of boarded head 15 keeps to the radial lead type electronic unit（Adsorb, grab Hold）.Described below for assembly supply device 100.Additionally, multiple assembly supply devices 100 can be supplied respectively to different product The electronic unit planted, it is also possible to supply various electronic units.

Multiple electronic part feeders 100 are arranged on rear side receptacle 46.Rear side receptacle 46 is to multiple electronics The mechanism that assembly supply device 100 is supported, as shown in figure 8, having：1st fixed plate 46a and the 2nd fixed plate 46b, locking Axle 46c, drive cylinder 46d and location tags 46e.1st fixed plate 46a is the plate-shaped member extended in ZX planes, along X side To the hole for being formed with shape in upright arrangement.Hole can be the hole for making the raised insertion formed on electronic part feeder 100.1st consolidates Fixed board 46a passes through to make the protrusion inserting hole formed on electronic part feeder 100, so as to electronic part feeder 100 are positioned.2nd fixed plate 46b is disposed on face on the downside of vertical, i.e. support electronic part feeder 100 Plate-shaped member on face.2nd fixed plate 46b forms concavo-convex on the end face of the side away from substrate delivery section 12.2nd fixed plate During 46b is by making the projection insertion of the formation on electronic part feeder 100 concavo-convex, so as to electronic part feeder 100 are positioned.Locking shaft 46c configuration compared with the 2nd fixed plate 46b further from the side of substrate delivery section 12.Locking shaft 46c is clamped by by the grip unit 112 of electronic part feeder 100, and electronic part feeder 100 is propped up Support, positioning.Drive cylinder 46d can be the piston to vertical upside protrusion, by the electricity to being arranged on correspondence position The assigned position of subassembly feedway 100 is pressed, so as to convey electricity to the holding position of electronic part feeder 100 Subassembly.Location tags 46e can be by eye observation and recognize rear side receptacle 46 in receptacle position guiding mark Know.Operating personnel set electronic part feeder 100 by being confirmed to location tags 46e to the position of regulation, from And electronic part feeder 100 can be set on desired position.

Fig. 9 is the schematic diagram of the schematic configuration of the other examples of the part feed unit for representing rear side.Part feed unit 14 can also be on the basis of multiple following electronic part feeders 100 be installed, with following electronic part feeders 100a, wherein, the electronic part feeder 100 is installed by by multiple radial lead type electronic units（Radial component）It is fixed The electronic unit retainer belt formed in retainer belt main body（Radial component retainer belt）, in holding position（2nd holding position） The lead cut-out of the lead-type electronic-part that the electronic unit retainer belt is kept, and the absorption having on boarded head can be utilized Suction nozzle or grasping suction nozzle, the lead-type electronic-part for being pointed to the holding position are kept, the electronic part feeder 100a is installed and is fixed on the electronic unit retainer belt formed in retainer belt main body by by multiple mounting type electronic units（Chip Part retainer belt）, in holding position（1st holding position）The mounting type electronic unit that the electronic unit retainer belt is kept from Retainer belt main body is peeled off, and using the absorption suction nozzle or grasping suction nozzle that have on boarded head, is pointed to the holding position Mounting type electronic unit is kept.In part feed unit 14, it is also possible to as other electronic part feeders 100a And rod-type feeder or pellet type feeder are set on rear side receptacle 46.Multiple assembly supply devices 100 shown in Fig. 9, 100a is maintained at supporting table（Receptacle）On 102.Supporting table 102 has and the above-mentioned identical structure of rear side receptacle 46.Separately Outward, supporting table 102 can also carry other devices in addition to assembly supply device 100,100a（For example, measurement apparatus or photograph Camera etc.）.

In part feed unit 14, the multiple assembly supply devices 100,100a in supporting table 102 are held in, by carrying out The species of the electronic unit of carrying, the mechanism for keeping electronic unit or the different various assembly supply devices 100 of feed mechanism, 100a is constituted.In addition, part feed unit 14 can also have the assembly supply device 100,100a of multiple identical types.Separately Outward, preferred components feed unit 14 has the structure that can be dismantled relative to apparatus main body.

Electronic part feeder 100a using on retainer belt bonding carry out substrate carrying chip-type electronic component and The electronic unit retainer belt of composition, electronic unit is supplied to boarded head 15.Additionally, electronic unit retainer belt is formed on retainer belt Multiple storage rooms, the stored electrons part in the storage room.Electronic part feeder 100a is following retainer belt feeders, It is kept to electronic unit retainer belt, and the electronic unit retainer belt that will be kept is conveyed, and being moved to storage room can With using the holding area of the suction electronic unit of boarded head 15.Additionally, holding area is moved to by making storage room, can With the state exposed in assigned position as the electronic unit being housed in the storage room, it is possible to use the suction nozzle of boarded head 15 is inhaled It is attached, grasp the electronic unit.Electronic part feeder 100a is not limited to retainer belt feeder, can be using supply chip The various chip part feeders of type electronic unit.As chip part feeder, for example, can use rod-type feeder, holding Band feeder, in bulk（bulk）Feeder.

Electronic unit of the utilization suction nozzle of boarded head 15 to the holding on part feed unit 14f（Bowl formula feeder unit institute The lead-type electronic-part of holding）Or the electronic unit kept on part feed unit 14r（Electronic part feeder The 100 radial lead type electronic units for being kept（Lead-type electronic-part, insert type electronic unit））Kept（Absorption or Person grasps）, the electronic unit that will be kept installed to being moved on the substrate 8 of assigned position using substrate delivery section 12. In addition, boarded head 15 will be supplied in the case where part feed unit 14r has electronic part feeder 100a in electronic unit To the chip-type electronic component kept on device 100a（Mounting type electronic unit）Carried on substrate 8（Install）.Additionally, for The structure of boarded head 15 is described below.Additionally, chip-type electronic component（Mounting type electronic unit）It is do not have to be inserted in base The patchhole formed on plate（Through hole）Lead without lead electronic unit.As mounting type electronic unit, illustrate as described above SOP, QFP etc..When chip-type electronic component on substrate to installing, without lead is inserted in the hole.

XY travel mechanisms 16 be make boarded head 15 along the X-direction and Y direction in Fig. 1, Fig. 2, i.e. with substrate 8 The travel mechanism moved on the parallel face in surface, with X-axis drive division 22 and Y-axis drive division 24.X-axis drive division 22 and boarded head 15 link, and boarded head 15 is moved along X-direction.Y-axis drive division 24 links via X-axis drive division 22 with boarded head 15, passes through X-axis drive division 22 is set to be moved along Y direction, so that boarded head 15 is moved along Y direction.XY travel mechanisms 16 are by making carrying First 15 along XY direction of principal axis move, such that it is able to make boarded head 15 to the position relative with substrate 8, or with part feed unit 14f, 14r relative position movement.In addition, XY travel mechanisms 16 are moved by making boarded head 15, so as to boarded head 15 and base Relative position between plate 8 is adjusted.Thus, it is possible to make the electronic unit that boarded head 15 is kept appointing to the surface of substrate 8 The movement of meaning position, electronic unit can be carried to the optional position on the surface of substrate 8.That is, XY travel mechanisms 16 are to make boarded head 15 in horizontal plane（X/Y plane）Upper movement, will be located at the electronics in the electronic part feeder of part feed unit 14f, 14r Assigned position from part to substrate 8（Loading position, installation site）The supply unit of conveying.Additionally, as X-axis drive division 22, The various mechanisms that boarded head 15 can be made to be moved to prescribed direction.As Y-axis drive division 24, it is possible to use drive X-axis The various mechanisms that portion 22 moves to prescribed direction.As the mechanism for making object be moved to prescribed direction, for example, can use line Property motor, rack pinion, the conveying mechanism using ball-screw, the conveying mechanism using conveyer belt etc..

VCS units 17, change suction nozzle maintaining body 18 and component storage portion 19, configure in the xy plane with boarded head The position that 15 movable area overlaps, and position in z-direction compared with boarded head 15 closer to the position on the downside of vertical Put place.In the present embodiment, VCS units 17, replacing suction nozzle maintaining body 18 and component storage portion 19, in substrate delivery section It is adjacent between 12 and part feed unit 14r.

VCS units（Unit status test section, state detecting section）17 is pattern recognition device, with the suction to boarded head 15 The camera shot near mouth and the lighting unit being illuminated to shooting area.VCS units 17 pairs are by boarded head 15 The hold mode of the shape of the electronic unit of suction and the electronic unit kept by suction nozzle is identified.More specifically Say, if making boarded head 15 be moved to the position relative with VCS units 17, VCS units 17 are from vertical downside to carrying First 15 suction nozzle is shot, and is parsed by the image for photographing, so as to the shape to the electronic unit by suction The hold mode of shape and the electronic unit kept by suction nozzle is identified.The information that VCS units 17 will be obtained is to control device 20 Send.

Change the mechanism that suction nozzle maintaining body 18 is to maintain various suction nozzles.Suction nozzle maintaining body 18 is changed to make carrying The state of first 15 dismounting and change suction nozzle, keeps various suction nozzles.Herein, the replacing suction nozzle maintaining body 18 of present embodiment keeps Have：Absorption suction nozzle, it is kept electronic unit by being attracted；And grasping suction nozzle, it is kept electricity by being grasped Subassembly.Boarded head 15, using the suction nozzle that suction nozzle maintaining body 18 is installed is changed, is supplied by change to the suction nozzle installed Driven to air pressure, such that it is able in the proper condition（Attract or grasp）The electronic unit to be kept is protected Hold.

Component storage portion 19 is that storage is kept using suction nozzle by boarded head 15 and is fitted without electronics on the substrate 8 The casing of part.That is, in electronic component mounting apparatus 10, given up as the electronic unit that will be fitted without on the substrate 8 The discard bin abandoned.Electronic component mounting apparatus 10 have what is do not installed to substrate 8 in the electronic unit kept from boarded head 15 In the case of electronic unit, boarded head 15 is set to be moved to the position relative with component storage portion 19, by the electronics that will be kept Part discharges, so as to electronic unit is put into component storage portion 19.

Control device 20 is controlled to each several part of electronic component mounting apparatus 10.Control device 20 is various control units Aggregate.Operating portion 40 is the input equipment of operating personnel's input operation, with keyboard 40a, mouse 40b and touch panel 42a.The various inputs that operating portion 40 will be detected send to control device 20.Display part 42 is to show various letters to operating personnel The picture of breath, with touch panel 42a and picture monitor 42b.Display part 42 is based on the image letter from the input of control device 20 Number, show various images on touch panel 42a and picture monitor 42b.

Additionally, the electronic component mounting apparatus 10 of present embodiment are provided with 1 boarded head, but it is also possible to supplied with part Unit 14f, 14r are corresponded to and are set 2 boarded heads respectively.In the case, 2 X-axis drive divisions are set, by making 2 carryings Head is moved along XY directions respectively, such that it is able to make 2 boarded heads independently mobile.Electronic component mounting apparatus 10 are by with 2 Boarded head, such that it is able to alternately carry electronic unit to 1 substrate 8.It is as noted above, replace by using 2 boarded heads Ground carries electronic unit, such that it is able to during a boarded head carries electronic unit to substrate 8, make another boarded head The electronic unit being pointed in assembly supply device is kept.Thus, it is possible to further shorten not carry electronics to substrate 8 The time of part, can efficiently carry electronic unit.It is also preferable to electronic component mounting apparatus 10 abreast configure 2 Substrate delivery section 12.If electronic component mounting apparatus 10 make 2 substrates alternately to the ministry of electronics industry using 2 substrate delivery sections 12 Part loading position is moved, and is alternately carried out component mounting using above-mentioned 2 boarded heads 15, then more efficiently can be taken to substrate Carry electronic unit.

Below, using Figure 10 and Figure 11, the structure to boarded head 15 is illustrated.Figure 10 is to represent that electronic unit installs dress The schematic diagram of the schematic configuration of the boarded head put.Figure 11 is showing for the schematic configuration of the boarded head for representing electronic component mounting apparatus It is intended to.Additionally, in Fig. 10, while showing various control units and the part supply being controlled to electronic component mounting apparatus 10 1 assembly supply device 100 of unit 14r.Boarded head 15 as shown in Figures 10 and 11, with holder main body 30, shoots dress Put（Substrate state test section）36th, height sensor（Substrate state test section）37 and laser identifying device（Unit status is examined Survey portion, state detecting section）38.

Electronic component mounting apparatus 10 as shown in Figure 10, are supplied with control unit 60, boarded head control unit 62 and part Control unit 64.Control unit 60, boarded head control unit 62 and part supply control part 64 are a parts for above-mentioned control device 20. In addition, electronic component mounting apparatus 10 are connected with power supply, control unit 60, boarded head control unit 62, part supply control part are used 64 and various circuits, the electric power that will be supplied from power supply is supplied to each several part.For control unit 60, boarded head control unit 62 and Part supply control part 64, describes below.

Electronic part feeder 100 makes lead be maintained at electronic unit retainer belt（Radial component retainer belt）On electronics The main body of part 80 is exposed upward.Additionally, as electronic unit 80, exemplifying aluminium electrolutic capacitor.Additionally, as the ministry of electronics industry Part 80, in addition to aluminium electrolutic capacitor, can also use with leaded various electronic units.Electronic part feeder 100 pull out and move it by by electronic unit retainer belt, so that the electronic unit kept in electronic unit retainer belt 80 to holding area（Binding domain, grip areas）It is mobile.In the present embodiment, the Y direction of assembly supply device 100 Near front end, as the guarantor that the suction nozzle by boarded head 15 is kept to the electronic unit 80 being held in electronic unit retainer belt Hold region.For the structure of electronic part feeder 100, described below.In addition, with electronic part feeder 100a's Situation is in the same manner, it is stipulated that position turns into enter the electronic unit 80 being held in electronic unit retainer belt by the suction nozzle of boarded head 15 The holding area that row keeps.

There is holder main body 30 the boarded head supporter 31 being supported to each several part, multiple suction nozzles 32 and suction nozzle to drive Dynamic portion 34.In the holder main body 30 of present embodiment, 6 suction nozzles 32 are configured to a row as shown in figure 11.6 suction nozzles 32 Arranged along the direction parallel with X-axis.Additionally, the suction nozzle 32 shown in Figure 11 is each equipped with the suction nozzle for adsorbing and keeping electronic unit.

Boarded head supporter 31 is the support member linked with X-axis drive division 22, to suction nozzle 32 and suction nozzle drive division 34 It is supported.Additionally, boarded head supporter 31 is also supported to laser identifying device 38.

Suction nozzle 32 is the adsorbing mechanism for adsorbing, keeping electronic unit 80.Suction nozzle 32 has opening 33 in front end, by from this Opening 33 attracts air, so as in front end absorption, keep electronic unit 80.Additionally, suction nozzle 32 has axle 32a, axle 32a and shape Link into the leading section for having opening 33 and adsorb electronic unit 80.Axle 32a is the bar-like member being supported to leading section, along Z Direction of principal axis extends configuration.Axle 32a is internally configured with the air hose for connecting the attracting mechanism of opening 33 and suction nozzle drive division 34 （Pipe arrangement）.

Suction nozzle drive division 34 makes suction nozzle 32 be moved along Z-direction, is carried out using the electronic unit 80 of opening 33 pairs of suction nozzle 32 Absorption.Herein, Z axis are the axles orthogonal with X/Y plane.Additionally, Z axis turn into the direction with the surface normal of substrate.In addition, inhaling Mouth drive division 34 makes suction nozzle 32 be rotated along θ directions when electronic unit is installed etc..So-called θ directions, be with centered on Z axis The parallel direction of round circumferencial direction, wherein, Z axis are to make the parallel axle in the direction that suction nozzle 32 is moved with Z axis drive division.Additionally, θ Direction turns into the rotation direction of suction nozzle 32.

In suction nozzle drive division 34, used as the mechanism for making suction nozzle 32 be moved along Z-direction, for example existing has Z-direction It is the mechanism of the linear motor of driving direction.Suction nozzle drive division 34 makes the axle 32a of suction nozzle 32 along Z by using linear motor Direction of principal axis is moved, so that the opening 33 of the leading section of suction nozzle 32 is moved along Z-direction.In addition, in suction nozzle drive division 34, making It is the mechanism for making suction nozzle 32 be rotated along θ directions, for example, exists and be made up of the transmission key element for entering joining line by motor and with axle 32a Mechanism.The driving force that suction nozzle drive division 34 will be exported from motor is transmitted using key element is driven to axle 32a, makes axle 32a along θ side To rotation, so that the leading section Ye Yanθ directions of suction nozzle 32 rotate.

In suction nozzle drive division 34, the mechanism adsorbed as the electronic unit 80 of opening 33 pairs using suction nozzle 32 inhales Draw mechanism, for example, there is the mechanism with components described below：Air hose, it links with the opening 33 of suction nozzle 32；Pump, itself and the air Pipe is connected；And magnetic valve, the opening and closing of its pipeline to air hose switches over.Suction nozzle drive division 34 is using pump to air hose Whether air is attracted, and is switched over by the opening and closing to magnetic valve, so as to being switched over from the attraction air of opening 33.Inhale Mouth drive division 34 attracts air by opening magnetic valve from opening 33, so that opening 33 is adsorbed（Keep）Electronic unit 80, leads to Closing magnetic valve is crossed, opening 33 is not attracted air, so as to the electronic unit 80 adsorbed on opening 33 be discharged, i.e. turn into Opening 33 is not utilized to adsorb the state of electronic unit 80（The state not kept）.

In addition, the boarded head 15 of present embodiment is when the main body to electronic unit keeps, body upper surface is nothing Method utilizes suction nozzle（Absorption suction nozzle）In the case of the shape of 33 absorption, grasping suction nozzle described later is used.Grasping suction nozzle by with suction Attached suction nozzle carries out attraction release to air in the same manner, so that movable plate is opened and closed relative to stator, it is possible thereby to be grabbed from top Hold, discharge the main body of electronic unit.In addition, boarded head 15 moves suction nozzle 32 and performs replacing by using suction nozzle drive division 34 Action, such that it is able to change the suction nozzle driven by suction nozzle drive division 34.

Filming apparatus 36 are fixed on the boarded head supporter 31 of holder main body 30, pair area relative with boarded head 15 Domain, such as substrate 8 are equipped with substrate 8 of electronic unit 80 etc. and are shot.There is filming apparatus 36 camera and illumination to fill Put, while being illuminated to the visual field using lighting device, image is obtained using camera.Thus, it is possible to shoot and carry The various images of the image, such as substrate 8 or part feed unit 14 of the relative position of head main body 30.For example, filming apparatus 36 BOC to being formed as reference mark on the surface of substrate 8 is marked（Hereinafter referred to as BOC）Or through hole（Patchhole）Image Shot.Herein, in the case where the reference mark in addition to BOC marks is used, the image to the reference mark is carried out Shoot.

Height sensor 37 is fixed on the boarded head supporter 31 of holder main body 30, to boarded head 15 and relative area Domain, such as substrate 8 are equipped with the distance between substrate 8 of electronic unit 80 and measure.Can be with as height sensor 37 Using laser sensor, the laser sensor has：Light-emitting component, its irradiation laser；And photo detector, it is to relative At position reflect and return laser carry out light, the laser sensor according to the time after being sent from laser to light, Pair measured with the distance between relative part.In addition, height sensor 37 by using determine when self-position with And substrate position, pair processed with the distance between relative part, so as to relative part, the specifically ministry of electronics industry The height of part is detected.In addition it is also possible to be based on being carried out with the measurement result of the distance between electronic unit by control unit 60 The treatment of the height of detection electronics.

Laser identifying device 38 has light source 38a and photo detector 38b.Laser identifying device 38 is built on bracket 50. As shown in Figure 10, downside, substrate 8 and the side of assembly supply device 100 with boarded head supporter 31 link bracket 50.Laser is known Other device 38 is to irradiate laser by the electronic unit 80 adsorbed by the suction nozzle 32 of holder main body 30, so as to electronic unit The device that 80 state is detected.Herein, as the state of electronic unit 80, refer to electronic unit 80 shape and Using suction nozzle 32 whether with correct posture absorption electronic unit 80 etc..Light source 38a is the light-emitting component for exporting laser.Light unit Position in the Z-direction of part 38b is configured on the position relative with light source 38a, i.e. height identical position.For using sharp Light identifying device 38 is described to the identifying processing of shape below.

Below, the control function to the apparatus structure of electronic component mounting apparatus 10 is illustrated.Electronic unit installs dress Put 10 as shown in Figure 10, there is control unit 60, boarded head control unit 62 and part supply control part as control device 20 64.Various control units are made up of the part with operation processing function and store function such as CPU, ROM and RAM respectively.In addition, In present embodiment, multiple control units are set for convenience of description, but it is also possible to set 1 control unit.In addition, by electronics In the case that the control function of apparatus for mounting component 10 is realized by 1 control unit, can be realized by 1 arithmetic unit, it is also possible to Realized by multiple arithmetic units.

Control unit 60 is connected with each several part of electronic component mounting apparatus 10, based on the operation signal being input into, in electronics The information detected in each several part of apparatus for mounting component 10, performs stored program, and the action to each several part is controlled. Control unit 60 is for example to the conveying of substrate 8 action, the drive actions of the boarded head 15 realized using XY travel mechanisms 16, using swashing SHAPE DETECTION action that light identifying device 38 is realized etc. is controlled.In addition, control unit 60 is as noted above to boarded head control Portion 62 sends various instructions, and the control action to boarded head control unit 62 is controlled.Control unit 60 is also to boarded head control unit 62 and the control action of part supply control part 64 be controlled.

Various sensors and control of the boarded head control unit 62 with suction nozzle drive division 34, configuration on boarded head supporter 31 Portion processed 60 is connected, and suction nozzle drive division 34 is controlled, and the action to suction nozzle 32 is controlled.Boarded head control unit 62 is based on From the operation instruction and various sensors of the supply of control unit 60（Such as range sensor）Testing result, to 32 pairs of electricity of suction nozzle The absorption of subassembly（Keep）/ release movement, the rotational action of each suction nozzle 32, the shift action of Z-direction are controlled.

The supply action of the electronic unit 80 that part supply control part 64 is carried out to part feed unit 14f, 14r is controlled System.Part supply control part 64 can be respectively provided with assembly supply device 100, bowl formula feeder unit 400, it is also possible to profit All of assembly supply device 100, bowl formula feeder unit 400 are controlled with 1 part supply control part 64.For example, The pull-out action of the electronic unit retainer belt that part supply control part 64 is carried out to assembly supply device 100（Shift action）、 The cutoff action of lead and the holding action to radial direction lead-type electronic-part are controlled.In addition, part supply control part The part supply action that the 64 pairs of bowl formula feeder units 400 are carried out is controlled.In addition, part supply control part 64 is in part In the case that feed unit 14f has assembly supply device 100a, the electronic unit carried out to assembly supply device 100a is protected Hold the pull-out action of band（Shift action）It is controlled.The instruction that part supply control part 64 is based on control unit 60 performs various moving Make.Part supply control part 64 is acted by the pull-out to electronic unit retainer belt or electronic unit retainer belt and is controlled, So as to the movement to electronic unit retainer belt or electronic unit retainer belt is controlled.

Below, using Figure 12 to Figure 24, assembly supply device 100 is illustrated.The institute as described above of assembly supply device 100 Show, be the radial direction feeder that radial lead type electronic unit is supplied to holding position.First, using Figure 12 and Figure 13, to electricity Subassembly retainer belt is illustrated.Figure 12 is a schematic diagram for the schematic configuration of example for representing electronic unit retainer belt.Figure 13 is the schematic diagram of other schematic configurations example for representing electronic unit retainer belt.

Electronic unit retainer belt shown in Figure 12（Radial component retainer belt）70 have：Retainer belt main body 72；And it is multiple Electronic unit（Radial lead type electronic unit, radial lead part）80, it is maintained in retainer belt main body 72.Retainer belt main body 72 by the way that by the 1st retainer belt 74 and compared with the 1st retainer belt 74, the 2nd retainer belt 76 of narrower width is fitted and formed.In addition, protecting Hold the hole 78 being formed with using fixed intervals along bearing of trend with main body 72 as inlet ports.That is, retainer belt main body 72 is along extension side Multiple holes 78 are formed with to shape in upright arrangement.

Electronic unit 80 has：Electronic component body（Hereinafter referred to as " main body "）82；And 2 leads 84, it is along master The radial direction configuration of body 82.The lead 84 of electronic unit 80 is clamped between the 1st retainer belt 74 and the 2nd retainer belt 76 and consolidates It is fixed.Thus, and electronic unit 80 is fixed by the way that lead 84 is clamped between the 1st retainer belt 74 and the 2nd retainer belt 76 so that solid It is scheduled at the assigned position of retainer belt main body 72.In addition, for multiple electronic units 80, hole 78 is configured between 2 leads 84, So as to the formation for being separately fixed at retainer belt main body 72 has on the position in hole 78.That is, electronic unit 80 enters with the identical of hole 78 Configured at the position identical position on the bearing of trend with retainer belt to the interval of spacing P.Additionally, electronic unit 80 It is wanted to be shaped as that there is the lead being clamped between the 1st retainer belt 74 of retainer belt main body 72 and the 2nd retainer belt 76, lead And the shape of main body, species are not specially limited.

Below, the electronic unit retainer belt 70a shown in Figure 13 has：Retainer belt main body 72；And multiple electronic units（Footpath To lead-type electronic-part）80, it is maintained in retainer belt main body 72.Additionally, electronic unit retainer belt 70a only electronic units 80 And relative position relation between hole 78 is different, other structures are identical with electronic unit retainer belt 70.Electronic unit retainer belt 70a 2 leads 84 of electronic unit 80 are configured between the hole 78 and hole 78 of retainer belt main body 72.That is, electronic unit 80 is configured For interval is identical with the feeding spacing P in hole 78, and its position on the bearing of trend of retainer belt has been disposed offset from configuration space Half position.That is, electronic unit 80 is configured on the position that offset by half amount of separation relative to hole 78.

As shown in Figure 12 and Figure 13, there is hole 78 and the electronic unit on the bearing of trend of retainer belt in electronic unit retainer belt The different species of relative position relation between 80.

Below, Figure 14 is the stravismus of the schematic configuration of the electronic part feeder of the part feed unit for representing rear side Figure.Figure 15 is the oblique view that the electronic part feeder shown in Figure 14 is observed from the direction different from Figure 14.Figure 16 is to represent The explanatory diagram of the schematic configuration of the electronic part feeder of part feed unit.As shown in Figure 14 to Figure 16, electronic unit is supplied To device（Assembly supply device）100 have：Framework 110, it is kept to other each several parts, and electronic unit is kept to bring into Row guiding；Grip unit 112, it links with rear side receptacle 46；Feeder unit 114, it is carried out to electronic unit retainer belt Conveying；Cutting unit 116, the lead cut-out that it will remain in the electronic unit in electronic unit retainer belt；And air pressure Adjustment portion 118, the air pressure of the drive division of its drive division and cutting unit 116 to feeder unit 114 is adjusted, right The driving of each several part is controlled.

Framework 110 is longitudinally elongated hollow box body, and interior retaining clip holds unit 112, feeder unit 114, cut-out list Unit 116 and air pressure adjustment portion 118.Framework 110 is provided with guiding groove 120, guide portion 122, discharge unit 126, grasping part 128 and lug boss 129.Guiding groove 120 has the shape along its length of the elongate surface on the upside of the vertical of framework 110 Into 2 straight lines a side end link shape.That is, guiding groove 120 is formed as from a side end of framework 110 to opposite side End extends about, and is turned back near end side, and extends to the U-shaped of a side end.Guiding groove 120 is to electronics The groove that part retainer belt is guided, from a side end of U-shaped（The end of supply side）Supply electronic unit retainer belt.Draw Guide groove 120 makes supplied electronic unit retainer belt be moved along U-shaped, from a side end of U-shaped（The end of discharge side Portion）Discharge.In addition, guiding groove 120 with retainer belt main body 72 be located at framework 110 inside and electronic unit to framework 110 The state that outside is exposed, guides to electronic unit retainer belt.

Guide portion 122 links with the end of the supply side of guiding groove 120, will maintain the electronics in the state of electronic unit Part retainer belt is guided to guiding groove 120.Discharge unit 126 links with the end of the discharge side of guiding groove 120, will be in framework 110 The interior movement and part after electronic unit is supplied to boarded head 15 is discharged from electronic unit retainer belt.Grasping part 128 be Electronic part feeder 100 convey when etc. by operating personnel grasp part.Lug boss 129 is to above-mentioned rear side receptacle The projection inserted in the hole of 46 the 1st fixed plate 46a.

Below, on the basis of Figure 14 to Figure 16, grip unit is illustrated using Figure 17.Herein, Figure 17 is table Show the explanatory diagram of the schematic configuration of the grip unit of electronic part feeder.Grip unit 112 is connected with rear side receptacle 46 The mechanism of knot.Grip unit 112 has linking part 132, driving section 134, elastic portion 136 and bar 138.

Linking part 132 is the part contacted with rear side receptacle 46 when linking with rear side receptacle 46, to framework 110 outside Expose.Additionally, linking part 132 is configured having on the face of face opposition side of guiding groove 120 in the formation with framework 110.Linking part 132 On end on the downside of vertical, bite 133 is provided with.Bite 133 connects with the locking shaft 46c of rear side receptacle 46 Knot.The bite 133 of driving section 134 and linking part 132, elastic portion 136, bar 138 link, and will be applied from bar 138, elastic portion 136 Plus power transmitted to linking part 132.One side end of elastic portion 136 is fixed in framework 110, and end side is fixed on transmission In portion 134.Elastic portion 136 is the parts such as spring, driving section 134 is applied by it to the side stretching being fixed in framework 110 Power.Thus, driving section 134 turns into the state that the part linked with elastic portion 136 is stretched to prescribed direction.The one of bar 138 Side end exposes to the outside of framework 110, and end side links with driving section 134.The fixing axle 139 of bar 138 is fixed on frame On body 110.Thus, if operating personnel operate to bar 138 to the side end exposed outside framework 110, with fixation Axle 139 is axle, moves the end for linking side with driving section 134.Thus, move driving section 134, acted on to linking part 132 The power of regulation, acts bite 133.Grip unit 112 be said structure, the operation by operating personnel to bar 138 so that In the state for linking bite 133 and the locking shaft 46c of rear side receptacle 46 and being fixed on rear side receptacle 46 and sting Switched between the state that conjunction portion 133 does not link and is released with locking shaft 46c.

Below, on the basis of Figure 14 to Figure 16, using Figure 18 to Figure 21, feeder unit is illustrated.Herein, Figure 18 is the explanatory diagram of the schematic configuration of the feeder unit for representing electronic part feeder.Figure 19 is to represent feeder unit Front support portion schematic configuration explanatory diagram.Figure 20 is the outline knot of the retainer belt feeding claw unit for representing feeder unit The explanatory diagram of structure.Figure 21 is the explanatory diagram for illustrating the action of feeder unit.Feeder unit 114 is that electronic unit is protected Hold band to be conveyed, i.e. make to keep the mechanism of Tape movement along the electronic unit that guiding groove 120 is directed.Feeder unit 114 has There are supporting part 142, drive division 144, front support portion 146 and retainer belt feeding claw unit 148.In addition, in present embodiment In, front support portion 146 and retainer belt feeding claw unit 148 turn between retainer belt feeding claw unit 148 and framework 110 The position adjusting mechanism that relative position is adjusted.

Supporting part 142 is integrally fixed at the part in framework 110, and drive division 144 is supported.Drive division 144 has solid Determine portion 144a and movable part 144b.Drive division 144 is to make exposing from fixed part 144a for movable part 144b using air pressure The flexible cylinder in part.Drive division 144 makes the front end of movable part 144b on the bearing of trend of the line part of guiding groove 120, At least accordingly moved back and forth with feeding spacing in the distance range of regulation.That is, drive division 144 makes the front end of movable part 144b At least with the feeding spacing with retainer belt（The spacing P in hole 78）Corresponding distance is moved back and forth.Front support portion 146 is fixed on The front end of the movable part 144b of drive division 144.Front support portion 146 moves back and forth integratedly reciprocal shifting with movable part 144b's It is dynamic.In addition, as shown in figure 19, front support portion 146 is the face on the upside of vertical, is connected with retainer belt feeding claw unit 148 At the part of knot, with this 4 screw holes of screw hole 149a, 149b, 149c, 149d.This 4 screw hole 149a, 149b, 4 different positions of position that 149c, 149d are formed in retainer belt direction of feed.Herein, the screw in front support portion 146 The distance between hole 149a and screw hole 149b are the distance of the half of the spacing P in the hole 78 of above-mentioned retainer belt main body 72.That is, spiral shell Nail 149a and screw hole 149b are formed on the position of half amount of separation of the configuration space that offset by hole 78.In addition, preceding On the supporting part 146 of end, the distance between screw hole 149c and screw hole 149d are the spacing P in the hole 78 of above-mentioned retainer belt main body 72 Half distance.That is, screw hole 149c and screw hole 149d are formed in the half amount of separation of the configuration space that offset by hole 78 Position on.

Retainer belt feeding claw unit 148 is fixed in front support portion 146.Retainer belt feeding claw unit 148 has to be installed Platform 150, feeding claw 152, pin 154 and spring 156.Erecting bed 150 is that feeding claw 152, pin 154, spring 156 are supported Pedestal.It is the plate shape after the bending of L-shaped, vertical side that erecting bed 150 has the section orthogonal with retainer belt direction of feed Expose from framework 110 to a part for upside.It is provided with what can be grasped by operating personnel in the part exposed of erecting bed 150 Grasping part 158.Operating personnel are grasped and are operated to grasping part 158 as needed, such that it is able to make retainer belt feeding claw list Unit 148 moves to retainer belt direction of feed.Erecting bed 150 is the part being connected with front support portion 146, using 2 fixed spiral shells Nail 159 is fixed in front support portion 146.Herein, on erecting bed 150, between making 2 holes of the insertion of fixing screws 159 Every with the interval phase between the interval between screw hole 149a and screw hole 149c and screw hole 149b and screw hole 149d Together.That is, on diverse location of the front support portion 146 in retainer belt direction of feed, with it is multigroup with to retainer belt feeding claw list The fixing screws of the insertion of erecting bed 150 of unit 148（Screw）The combination of 159 configuration spacing identical screw hole.Accordingly, for Erecting bed 150, switches over, by the screw hole for inserting fixing screws 159 such that it is able to make erecting bed 150 and front support The half of the relative offset amount of separation between portion 146.

Feeding claw 152 is the part of the convex portion 152a that there is the side end in bar-like member to protrude.Feeding claw 152 is configured With electronic unit retainer belt（Hereinafter referred to as " retainer belt "）On the relative position in the hole of 70 retainer belt main body 72, convex portion 152a's is shaped as, in the direction of feed downstream of retainer belt direction of feed（The front side of direction of feed）Face 152b turn into and enter To the face that direction is orthogonal, in the direction of feed upstream side of retainer belt direction of feed（The rear side of direction of feed）Face 152c turn into phase For the face inclined face orthogonal with direction of feed, the narrowed width of direction of feed is made with close to retainer belt 70.Feeding claw 152 in the case of the position Chu You hole 78 relative with convex portion 152a, as shown in figure 20, are inserted into hole 78 as convex portion 152a State.Pin 154 to the side end for not forming convex portion 152a of feeding claw 152, can be revolved along the direction parallel with paper The mode for turning is supported.One side end of spring 156 is fixed on the projecting surface 150a of erecting bed 150, and end side is solid It is scheduled in feeding claw 152.Spring 156 will enter in the case where the convex portion 152a of feeding claw 152 is relative with the part outside hole 78 Pressed to retainer belt side to pawl 152.

Below, using Figure 21, the retainer belt feed motion to feeder unit 114 is illustrated.Additionally, shown in Figure 21 Example（Step S1~S4）In, the hole that will be formed in retainer belt main body 72, with positioned at the downstream of retainer belt direction of feed Kong Xianxiang frameworks 110 are supplied, and are first set to 78,78a, 78b, 78c successively from the order of the discharge of framework 110.In step S1 In, the convex portion 152a of feeding claw 152 is inserted into the hole 78a of retainer belt main body 72.Feeder unit 114 is as shown in step S1 In the state of convex portion 152a is inserted into the 78a of hole, drive division 144 is driven, retainer belt feeding claw unit 148 is brought into along holding Amount corresponding with 1 pitch of holes of retainer belt main body 72 is moved to direction.

If feeder unit 114 is in the state of step S1, by retainer belt feeding claw unit 148 along retainer belt feeding side To conveying, then using the face orthogonal with direction of feed of convex portion 152a, hole 78a is pushed to retainer belt direction of feed, such as step Shown in S2, retainer belt feeding claw unit 148 and retainer belt main body 72 are moved along retainer belt direction of feed.Feeder unit 114 Moved along retainer belt direction of feed by making retainer belt main body 72, so that the electronic unit of retainer belt is moved to holding position.

If making retainer belt feeding claw unit 148 along the mobile end of retainer belt direction of feed（Step S2）, then feeder Unit 114 makes the electronic unit of the front end kept in retainer belt main body 72 standby in holding position.Now, positioned at holding position Put（Holding area）Electronic unit as shown in the above, electronic component body is clamped, and is cut off lead using cutter.So Afterwards, after the treatment that electronic component mounting apparatus side performs regulation, driving instruction is sent.For example, in the absorption using boarded head After suction or utilization grasp the electronic unit of the above-mentioned holding position that suction nozzle grasping retainer belt is kept, to electronic unit Feedway sends clamping and releases order, and electronic part feeder is discharged the clamping to electronic unit.Then, by making After suction nozzle rises and make the electronic unit rising kept on suction nozzle, driving instruction is sent to feeder unit 114.Sending drive After dynamic instruction, feeder unit 114 is driven drive division 144, retainer belt feeding claw unit 148 is fed along with retainer belt Move amount corresponding with 1 pitch of holes of retainer belt main body 72 in direction in opposite direction.If feeder unit 114 is in step S2 In the state of, retainer belt feeding claw unit 148 conveyed to the side opposite with retainer belt direction of feed, then convex portion 152a inclines Oblique face contacts with hole 78a, and convex portion 152a is along the direction movement inclined towards the extraction from the 78a of hole.Thus, feeder unit 114 as shown in step S3, convex portion 152a is departed from from the 78a of hole（Step S3）, retainer belt do not move, retainer belt feeding claw unit 148 to a side shifting opposite with retainer belt direction of feed.

Then, in feeder unit 114 since the state shown in step S2, make retainer belt feeding claw unit 148 along with The opposite direction of retainer belt direction of feed is moved after amount corresponding with 1 pitch of holes of retainer belt main body 72, such as step S4 institutes Show, be located at the state in 1 hole 78b of the upstream side of amount of separation compared with the 78a of hole as convex portion 152a insertions.Now, due to Feeding claw 152 is pressed by spring 156 to the direction of hole 78b, so reliably making convex portion 152a be inserted in the 78b of hole.Then, drive Dynamic portion 144 is driven along retainer belt direction of feed immediately, and the next electronic unit that will be kept in retainer belt main body 72 is to guarantor Hold position conveying.

Feeder unit 114 is as noted above, by using drive division 144 make retainer belt feeding claw unit 148 with guarantor Hold the corresponding amount of 1 pitch of holes with main body 72 to be moved back and forth along direction of feed, such that it is able to make retainer belt suitable along direction of feed 1 amount of separation of secondary movement.

Below, on the basis of Figure 14 to Figure 16, using Figure 22 to Figure 24, cutting unit is illustrated.Figure 22 is table Show the explanatory diagram of the schematic configuration of the cutting unit of electronic part feeder.Figure 23 is to represent cutting for electronic part feeder The explanatory diagram of the schematic configuration of disconnected unit.Figure 24 is the explanation of the schematic configuration of the cutting unit for representing electronic part feeder Figure.The lead cut-out of the electronic unit that cutting unit 116 is kept electronic unit retainer belt.In addition, cutting unit 116 is clamped Electronic unit after keeping lead to be cut off, until electronic unit is by suction（Keep）Untill.Cutting unit 116 has Supporting part 162, drive division 164, driving section 166, cutting portion 168 and cover 169.

Supporting part 162 is integrally fixed at the part in framework 110, and drive division 164 and driving section 166 are supported.In addition, Supporting part 162 is supported via driving section 166 to cutting portion 168.Drive division 164 has fixed part 164a and movable part 164b.Drive division 164 is to make the flexible cylinder in the part exposed from fixed part 164a of movable part 164b using air pressure.Drive Dynamic portion 164 makes the front end of movable part 164b on the bearing of trend of the line part of guiding groove 120, past in the distance range of regulation It is multiple mobile.Driving section 166 is the transmission that will be transmitted to cutting portion 168 by the power for moving back and forth and producing of movable part 164b Mechanism.Be transformed to the moving back and forth to retainer belt direction of feed of movable part 164b and retainer belt direction of feed by driving section 166 The motion in orthogonal direction, makes cutting portion 168 be moved along the direction orthogonal with retainer belt direction of feed.Driving section 166 make across The leading section 166a configured by region and leading section 166b of retainer belt, to each other close direction or away from each other Direction, the direction movement i.e. shown in arrow 170.The driving section 166 of present embodiment, on the movable part 164b edges of drive division 164 In the case of stretching out direction movement, move leading section 166a and leading section 166b directions close to each other.Driving section 166 exists In the case that the movable part 164b of drive division 164 is moved to shrinkage direction, make leading section 166a and leading section 166b remote to each other From direction movement.

Cutting portion 168 is configured in holding area, and the main body of the electronic unit to being configured in holding area keeps, so Afterwards, the lead of electronic unit is cut off between main body and retainer belt main body, then, maintenance keeps to electronic unit State.Cutting portion 168 has the 1st blade 168a and the 2nd blade 168b.Cutting portion 168 is configured makes the 1st blade 168a and 2 blade 168b as to be mutually facing.In addition, retainer belt configuration keeps between the 1st blade 168a and the 2nd blade 168b The lead of kept electronic unit is taken by by the position of the 1st blade 168a and the 2nd blade 168b clampings.1st blade As shown in figure 24, the leading section 166a with driving section 166 links 168a, if leading section 166a is to the 2nd blade 168b side shiftings, Then to the 2nd blade 168b side shiftings together with the 166a of leading section.2nd blade 168b is as shown in figure 24, the front end with driving section 166 Portion 166b links, if leading section 166b is to the 1st blade 168a side shiftings, to the 1st blade 168a together with the 166b of leading section Side shifting.In addition, the 1st blade 168a links via spring and leading section 166a, pressed from leading section 166a to the 2nd blade 168b sides Pressure.

Cover 169 is integrally fixed at the part in framework 110.Cover 169 is configured around the 1st blade 168a, the 1st blade 168a The face contacted with the 2nd blade 168b turns into opening.In addition, cover 169 is connected via spring with leading section 166a, by leading section 166a To with the 2nd blade 168b away from side press.Thus, leading section 166a is in situation about not pressed to the 2nd blade 168b sides Under, the power in the direction away from the 2nd blade 168b can be applied to the 1st blade 168a.

Cutting unit 116 has said structure, and the 1st blade of the drawer at movable side of cutting portion 168 is made by using drive division 164 2nd blade 168b of 168a and affixed side is approached, and the main body of electronic unit is supported from side, and further by making to cut 1st blade 168a of the drawer at movable side in disconnected portion 168 and the 2nd blade 168b of affixed side are approached and contacted, such that it is able to configuration is existed Lead cut-out between the 1st blade 168a and the 2nd blade 168b of affixed side of drawer at movable side.In addition, cutting unit 116 will draw After line cut-out, by the state for maintaining the 1st blade 168a and the 2nd blade 168b to contact, such that it is able to from side to from retainer belt The main body of the electronic unit of main body cut-out is supported.I.e., it is possible to lead be cut off and clamped the electricity for from retainer belt main body separate Subassembly.Additionally, cutting unit 116 can also make the mechanism of cut-out electronic unit lead and to the electronic unit after cut-out（Electricity The main body of subassembly）Clamped（Support）Mechanism formed with single mechanism.

Herein, the off-position to the lead of the cut-out of cutting unit 116 is illustrated.With the insertion of existing substrate In the erecting device of the special boarded head of lead-type electronic-part, in the lead front close with the retainer belt of anchor leg Cut off, by lead insertion substrate very long.Its reason is that existing erecting device has lead in carrying rostral Cutting portion and lead grasping part, will be cut off below after being grasped to the root of lead using lead grasping part（Pre-cut It is disconnected）, so the lead after cut-out is elongated.In addition, its reason is, existing erecting device to the insertion that inserts in the hole due to drawing During line, insert by the guiding of guiding pin, even if so lead is more long, will not also hinder to substrate insertion.In addition, its reason exists In existing erecting device cuts off lead in substrate back to utilize（Formal cut-out）Length and the lead for bending for needed for Bending device performs subsequent treatment, and, it is necessary to lead is protected when for the pre-cutting that lead is cut off from above-mentioned part retainer belt Stay length more long.

On the other hand, cutting unit 116 causes that the shearing length of the lead of radial lead type electronic unit turns into following rule Measured length, i.e. the specific length become with substrate thickness identical length or to substrate back side protrude lead will not Failure welding is produced, and length is corresponding with substrate thickness.Specific length is, for example, the length roughly the same with the patchhole of substrate. More specifically, it is that the length of patchhole relative to substrate grows the length that 3mm is less than or equal to more than or equal to 0mm. It is as noted above, it is not necessary to pre-cutting is carried out to part using boarded head as shown in the prior art, but be configured to be supplied using part To device it is shorter from the beginning be cut to specific length, such that it is able to obtain following effects.

Electronic component mounting apparatus 10 by by cutting unit 116 by lead it is shorter cut off, can utilize suction nozzle pair When the main body of the electronic unit on the holding position of assembly supply device 100 is kept, the stabilization at lead interval is improved Property, the part that lead can be inserted in the hole can be increased, can efficiently and accurately be installed very much.

In addition, in existing erecting device, if relative to being pre-charged with or being coated in the solder that inserts in the hole, inserted Enter lead more long, then solder almost all is extruded to lead front sometimes, and in reflow soldering, the solder of fusing cannot In rising to the relatively areolar between patchhole and lead so that failure welding.On the other hand, in electronic component mounting apparatus 10 In, because lead is cut off shorter by cutting unit 116, so during the solder of fusing can rise to above-mentioned gap, can carry out With the having no space optimal welding full of solder.And now, substrate is coated on by the way that mounting type electronic unit is also mounted in On the solder of upper surface, so as to also produce following effects, i.e. can simultaneously carry out wire type by a reflow soldering operation The carrying of electronic unit and mounting type electronic unit.In other words, if relative to being pre-charged with or be coated in what is inserted in the hole Solder inserts long lead, then solder almost all is extruded to lead front, the weldering melted in reflow soldering sometimes Material cannot be risen at substrate, i.e. solder cannot reach substrate, failure welding.On the other hand, in the electronic unit of said structure In erecting device, by by lead it is shorter be cut to above-mentioned specific length, if so that because of the lead to the insertion that inserts in the hole So that turning into the state of fusing from a part of solder of patchhole extrusion, then the back side of aforesaid substrate can be risen to, with substrate The electrode at the back side is welded.In addition, in patchhole（Substrate aperture）Inside there is also electrode in the case of, can make on solder Rise in the gap between the electrode inside lead and substrate and welded.So, can mechanically and electrically be welded.

In addition, by by the length of regulation be set to substrate thickness identical length, even if so as to installing footpath on substrate To lead-type electronic-part, it is also possible to suppress lead from substrate（The back side of substrate）The situation of protrusion.In addition, being grown by by regulation Degree is set to make the lead protruded to substrate back side as that will not cause the length of failure welding, even if so as to lead be cut off It is shorter, it is also possible to which that lead is fixed on inserting in the hole for substrate well by reflow treatment.

Air pressure adjustment portion 118 pairs is as the cylinder of the drive division 144 of feeder unit 114 and as cutting unit The air pressure of the cylinder of 116 drive division 164 is adjusted, and the driving to each several part is controlled.Specifically, air pressure Power adjustment portion 118 is controlled to the flexible of the movable part 144b of drive division 144, i.e. position, and the position to feeding claw 152 is carried out Control.In addition, air pressure adjustment portion 118 is controlled to the flexible of the movable part 164b of drive division 164, i.e. position, to cutting The position of the 1st blade 168a and the 2nd blade 168b in disconnected portion 168 is controlled.Additionally, air pressure adjustment portion 118 is based on portion The control of part supply control part 64, the air pressure to each several part is controlled.

Assembly supply device 100 has said structure.Assembly supply device 100 passes through to be configured to, along retainer belt feeding side To the position that multiple erecting beds 150 by retainer belt feeding claw unit 148 are arranged in front support portion 146 is set, can cut Retainer belt feeding claw unit 148 is changed relative to the position that front support portion 146 is configured, so that part need not be changed just can be with Tackle the different various electronic unit retainer belts of relative position between the hole of retainer belt main body and electronic unit.That is, part is supplied To device 100 by the relative position between the hole of the retainer belt main body based on loaded electronic unit retainer belt and electronic unit Put, the position to being installed on the forward end supporting part 146 of erecting bed 150 by retainer belt feeding claw unit 148 switches over, so that In the case of any electronic unit retainer belt, electronic unit can moved to holding position.

Specifically, feeder unit 114 is by changing the forward end of erecting bed 150 of retainer belt feeding claw unit 148 The position that supporting part 146 is installed, most extends in turning into the scope for moving back and forth such that it is able to the movable part 144b to drive division 144 Changed the position of the convex portion 152a of the feeding claw 152 in the position of state.Thus, it is possible to be in feeder unit 114 The movable part 144b for making drive division 144 is the position of the state most extended in the scope for moving back and forth（Feeding end position, holding Position）When, making the position being located in the hole of retainer belt main body turns into various positions.Thus, feeder unit 114 even for The electronic unit electronic unit retainer belt different relative to the allocation position of hole site, it is also possible to turn into reciprocal in movable part 144b During the state most extended in mobile scope, by electronic unit configuration in holding position.

Additionally, it is preferred that in assembly supply device 100, by moving back and forth for the movable part 144b of feeder unit 114 Distance, is set between the hole than retainer belt main body distance and shorter than 2 times of spacing.Thus, assembly supply device 100 will can enter Convex portion 152a to pawl 152 reliably inserts the hole of next spacing, be able to will be protected by once moving back and forth for feeding claw 152 Hold with 1 amount of spacing of conveying.In addition, being preferably the spacing in the hole of retainer belt in object conveyor for assembly supply device 100 In the case of there are multiple species, the distance for moving back and forth of the movable part 144b of feeder unit 114 is set to pitch of holes most Hole long is shorter compared with 2 times of the most short retainer belt spacing of pitch of holes compared to more long.Thus, assembly supply device 100 is being protected The spacing of band is held for that in the case of any kind, the convex portion 152a of feeding claw 152 can be reliably inserted into next spacing Hole, can once moving back and forth by feeding claw, by retainer belt convey 1 amount of spacing.That is, assembly supply device 100 The distance for moving back and forth or the replacing for carrying out part need not be changed, it is possible to for the retainer belt of various spacing, 1 is conveyed respectively The amount of spacing.

Herein, the feeder unit 114 of above-mentioned implementation method, can be in 2 position selections relative to front support portion 146 and the position of retainer belt feeding claw unit 148 is installed, but quantity is not limited to this.Feeder unit 114 is by increasing phase The selectable position of the position of retainer belt feeding claw unit 148 is installed for front support portion 146, can be tackled more Electronic unit retainer belt.In addition, feeder unit 114 it can also be provided that, can linearly adjust relative to front support Portion 146 and the position of retainer belt feeding claw unit 148 is installed.For example it can also be provided that, by by front support portion 146 or Screw hole in retainer belt feeding claw unit 148 on any one, is set to the long hole shape extended along retainer belt direction of feed, from And can set the relative position in the retainer belt direction of feed between front support portion 146 and retainer belt feeding claw unit 148 It is set to various positions.In this case, it is preferable to the holding between front support portion 146 and retainer belt feeding claw unit 148 is brought into To the relative position on direction, can be adjusted in the range of the 1 of retainer belt pitch of holes amount.Thus, feeder unit 114 can arbitrarily adjust relative position, it is also possible to carry out the micro-adjustment of relative position.

In addition, the feeder unit 114 of above-mentioned implementation method is configured to, by front support portion 146 and retainer belt feeding claw Unit 148 is relative between front end supporting part 146 and retainer belt feeding claw unit 148 by changing as position adjusting mechanism Position, such that it is able to change the state after retainer belt conveying terminates, i.e. movable part 144b moves back and forth the shape most extended in scope The position of the convex portion 152a of feeding claw 152 during state（Can adjust relative between framework 110 and retainer belt feeding claw unit 148 Position）, but it is not limited to this.Feeder unit can be possible to adjust relative between framework and retainer belt feeding claw unit The various mechanisms of position, use as position adjusting mechanism.For example, assembly supply device can also be configured to, by that can adjust The relative position in retainer belt direction of feed between whole framework and feeder unit, terminates such that it is able to change retainer belt conveying State afterwards, i.e. the position of movable part 144b convex portion 152a of feeding claw 152 in the state most extended in moving back and forth scope Put.That is, set location adjustment mechanism on the linking part that feeder unit can also be between feeder unit and framework.

Below, the various modifications example to the electronic part feeder as radial direction feeder is illustrated.Figure 25 is table Show the oblique view of the schematic configuration of the other examples of cutting unit.Figure 26 is to represent the cut-out observed from other directions shown in Figure 25 The oblique view of the schematic configuration of unit.Figure 27 is the oblique view for representing the relation between the cutting unit shown in Figure 25 and framework. Figure 28 is the oblique view of the schematic configuration of the other examples for representing cutting unit.Figure 29 is for the cut-out list shown in explanatory diagram 25 The explanatory diagram of the action of unit.Figure 30 is the explanatory diagram of the action for the cutting unit shown in explanatory diagram 25.Additionally, Figure 25 extremely schemes The basic structure of the cutting unit 116a shown in 30 is identical with cutting unit 116.Below, the feature to cutting unit 116a is clicked through Row explanation.

The lead cut-out of the electronic unit that cutting unit 116a is kept electronic unit retainer belt.In addition, cutting unit 116a clampings are kept switched off the electronic unit after lead, until electronic unit is by suction nozzle 32（Absorption suction nozzle or grasping suction nozzle） Absorption is grasped（Keep）.Cutting unit 116a have supporting part 162, drive division 164, driving section 172, cutting portion 174 with And cover.

Driving section 172 is the biography that will be transmitted to cutting portion 174 by the power for moving back and forth and producing of movable part 164b Motivation structure.Be transformed to the moving back and forth to retainer belt direction of feed of movable part 164b and retainer belt feeding side by driving section 172 To the motion in orthogonal direction, cutting portion 174 is set to be moved along the direction orthogonal with retainer belt direction of feed.Driving section 172 by every The fixture 175 configured by region and movable piece 176 for retainer belt are constituted.Driving section 172 make cutting portion 174 with can The 1st unit 174a that moving part 176 links, to the 2nd unit 174b linked with fixture 175 with cutting portion 174 close to or Away from direction movement.That is, present embodiment driving section 172 as shown in figure 29, drive division 164 movable part 164b to drawing In the case that the direction stretched is moved, movable piece 176 is set to be moved to close to the direction of fixture 175.Driving section 172 is in drive division In the case that 164 movable part 164b is moved to the direction shunk, movable piece 176 is set to be moved to the direction away from fixture 175. As noted above, cutting unit 116a is configured to, and only makes a movement in 2 units of cutting portion 174.

Cutting portion 174 is configured in holding area, the lead of the electronic unit that will be configured in holding area in main body and Cut off and keep between retainer belt main body.Cutting portion 174 keeps to both the main body and lead of electronic unit 80, then Lead is cut off, the state kept to main body and lead is continued to after lead is cut off.Cutting portion 174 has the 1st Unit 174a and the 2nd unit 174b.There is 1st unit 174a the 1st sword 178a, the 1st main body maintaining part 179a and the 1st lead to protect Hold portion 180a.1st sword 178a and the 2nd sword 178b turns into shut-off mechanism 178, the 1st main body maintaining part 179a and the 2nd main body maintaining part 179b turns into the lead maintaining part 180a of main body maintaining body the 179, the 1st and the 2nd lead maintaining part 180b and turns into lead maintaining body 180.As shown in figure 30, sequentially disposal subject maintaining body 179, lead keeps machine to cutting portion 174 since vertical upside Structure 180 and shut-off mechanism 178.

The each several part of the 1st unit 174a and each several part of the 2nd unit 174b are configured on it as to be mutually facing.In addition, Retainer belt is configured between the 1st unit 174a and the 2nd unit 174b, and the lead of the electronic unit kept in retainer belt is cut off Pass through at the position that mechanism 178 and lead maintaining body 180 are clamped, the main body of electronic unit is clamped by main body maintaining body 179.

1st unit 174a of cutting portion 174 is supported on movable piece 176, together with movable piece 176 to Unit the 2nd 174b close to, away from direction（The direction of arrow in Figure 30）It is mobile.If the 1st unit 174a of cutting portion 174 to Unit the 2nd 174b it is close direction movement, then the main body of electronic unit 80 is kept as main body maintaining body 179, lead keep machine The state that structure 180 is kept to the lead of electronic unit 80.Then, in cutting portion 174, if the 1st unit 174a enters one Walk and moved to the direction close with the 2nd unit 174b, then the 1st sword 178a and the 2nd sword 178b of shut-off mechanism 178 intersect, will Lead cuts off.Additionally, in fig. 30, it appears that as the 1st sword 178a and the 2nd sword 178b overlap, but due to the 1st sword 178a and the The position of paper left and right directions of the 2 sword 178b on paper fore-and-aft direction is different（Inclined relative to conveying direction）, therefore it is actual On be not in contact with.

1 drive division 164 as driving source is made holding electronic unit 80 by cutting unit 116a by driving section 172 Clamping device（Main body maintaining body 179, lead maintaining body 180）Shut-off mechanism 178 with cut-out lead 84 is acted in linkage. Thus, cutting unit 116a can perform the holding and the cut-out of lead to electronic unit 80 by simple structure.At this On point, cutting unit 116 is also identical.

In addition, cutting unit 116a keeps by using main body maintaining body 179 to the main body 82 of electronic unit 80, Such that it is able to after lead 84 is cut off, suitably be kept to electronic unit 80.Thus, it is possible to suitably keep lead Electronic unit 80 after 84 cut-outs, it is possible to use suction nozzle 32 easily keeps to electronic unit 80.At this point, cut-out Unit 116 is also identical.

In addition, cutting unit 116a to electronic unit 80 using clamping device by before lead 84 is cut off, being carried out Keep, especially, the main body 82 to electronic unit 80 keeps, such that it is able to electronic unit 80 is being held in into settling position In the state of upper, lead 84 is cut off.Thus, it is possible to be appropriately cut off lead 84.In addition, passing through cutting unit 116a by lead Electronic unit 80 is kept using clamping device before 84 cut-outs, such that it is able to suppress to cut off the electronic unit after lead 84 The situation for being come off from holding position or being dropped.

Cutting unit 116a by the basis of being kept to main body 82, being kept to lead 84, such that it is able to In cut-out, the position of limitation lead 84, more suitably can cut off lead 84.In addition, by using lead maintaining body 180 pairs of leads of main body side 84 keep, such that it is able to reduce the deformation of the lead 84 of the main body side produced during cut-out.

Cutting unit 116a by using the side of driving section 172 as fixture 175, such that it is able to simplify the machine of device Structure.Furthermore it is possible to making the holding position of the electronic unit kept by cutting unit 116a turns into stable position, can simplify and take The operation of carrier head 15.It is preferred that cutting unit 116a has both main body maintaining body 179 and lead maintaining body 180, but Can only have wherein any one.

Herein, cutting unit 116a as shown in figure 27, to being formed vertical as length on framework 110a Bolt 182,185 is inserted in the elongated hole 181,184 in direction and be fixed.Thus, cutting unit 116a can be to vertical Position be adjusted.Thus, it is possible to pair relative with the electronic unit that the retainer belt moved by feeder unit is kept The position of vertical is adjusted.Therefore, cutting unit 116a can be relative to the position of retainer belt, the lead to cutting off lead The position in vertical direction, i.e. off-position corresponding with radial lead type electronic unit is adjusted.Thus, cutting unit 116a The length of the lead after cut-out can be adjusted.Additionally, in the present embodiment, pair with radial lead type electronic unit pair The mechanism that the off-position answered is adjusted, use adjustment direction for the elongated hole of length direction and for fixing phase for elongated hole The combination of the bolt of position, but position adjusting mechanism is not limited to this.In electronic part feeder, as long as can adjust The mechanism of the position of the Z-direction of whole cutting unit 116a, more specifically, can adjust shut-off mechanism relative to holding area The mechanism of the position of the Z-direction of the electronic unit retainer belt in domain.

In addition, cutting unit 116a has to the bar 188 exposed on the outside of framework 110a.Bar 188 is straight with driving section 172 Line motion parts link.Thus, cutting unit 116a is moved by making bar 188 to the direction of arrow, such that it is able to utilize cutting portion 174 cutoff actions for performing electronic unit.That is, moved to the direction of arrow by making bar 188, driven such that it is able to performing and utilizing Portion 164 make driving section 172 move along a straight line direction movement action identical act.Thus, for example cutting unit is being performed In the case of the position adjustment of 116a, even if the unfavorable control device 20 of electronic component mounting apparatus 10 drives drive division 164 It is dynamic, it is also possible to cut off the lead of electronic unit.Even if in addition, not supplying the shape of air pressure or electric power to drive division 164 Under state, it is also possible to cut off the lead of electronic unit.

Additionally, electronic part feeder 100 can also be provided for the behaviour for driving drive division 164 on framework 110a Make portion.Thus, in electronic part feeder 100, even if not operated using control device 20, it is also possible to perform by cutting The cutoff action of the electronic unit lead that disconnected unit 116a is carried out.Additionally, being driven in this case it is desirable to be supplied to drive division 164 Power（Air pressure or electric power）.

Figure 31 A are the explanatory diagrams of the schematic configuration of the maintaining body for representing cutting unit.Figure 31 B represent cutting unit The explanatory diagram of the schematic configuration of the other examples of maintaining body.2nd main body maintaining part 179b such as Figure 31 A institutes of cutting unit 116a Show, be that there are 2 blocks in the hole 190 for inserting the bolt being fixed on the fixture 175 of driving section 172.Protected in the 2nd main body Hold in portion 179b, the face parallel with the line for connecting 2 holes 190 is made up of 4 different faces of the distance at a distance of hole 190.1st The distance between face 191a and hole 190 are arrow 192a.The distance between 2nd face 191b and hole 190 are arrow 192b.3rd face The distance between 191c and hole 190 are arrow 192c.The distance between 4th face 191d and hole 190 are arrow 192d.Arrow 192a, arrow 192b, arrow 192c and arrow 192d length are different.For cutting unit 116a, by the 2nd main body maintaining part 179b is fixed on when on fixture 175, by the direction for changing the 2nd main body maintaining part 179b（Reversion, left and right reversion up and down）, from And the face relative with the 1st main body maintaining part 179a can be switched to the 1st face 191a, the 2nd face 191b, the 3rd face 191c or 4 face 191d.Herein, because the position of the bolt of fixing hole 190 is fixed, so by switching and the 1st main body maintaining part 179a relative face, thus it is possible to vary the face relative with the 1st main body maintaining part 179a of the 2nd main body maintaining part 179b and the 1st main body The distance between maintaining part 179a.

Thus, cutting unit 116a can by the cutoff action of lead when the 2nd main body maintaining part 179b and the 1st main body protect Hold the distance between portion 179a and be changed to 4 kinds, can be according to the kind of the electronic unit supplied by electronic part feeder 100 Class, appropriate adjustment the distance between the 2nd main body maintaining part 179b and the 1st main body maintaining part 179a.

The 2nd main body maintaining part 195 shown in Figure 31 B is octagonal prism shape, and the 1st main body maintaining part 179a is 1 Flat face.2nd main body maintaining part 195 forms the hole 196 for inserting bolt.Hole 196 is by the conveying side with retainer belt To orthogonal direction, i.e. cutting unit move direction as length direction elongated hole.2nd main body maintaining part 195 passes through device to hole Relative position between 196 and bolt is adjusted, such that it is able to the 2nd main body maintaining part in the direction of action to cutting portion 195 are adjusted relative to the position of bolt.It is as noted above, cutting unit by using the 2nd main body maintaining part 195 so that Can be relative with the 1st main body maintaining part 179a to the 2nd main body maintaining part 195 between the distance of the length direction in hole 196 The distance between face and the 1st main body maintaining part 179a are adjusted.Thus, cutting unit can tackle more electronic units The width of main body.For example, cutting unit can grasp 20 kinds of lead-type electronic-parts while lead is cut off so that can be with The species of the lead-type electronic-part supplied to holding position in the state of cutting off after lead is 20 kinds.

Figure 32 is the explanatory diagram of the schematic configuration of the other examples of the feeder unit for representing electronic part feeder.Figure 33 is the oblique view for representing the schematic configuration that the feeder unit shown in Figure 32 is observed from other directions.Figure 34 is to represent Figure 32 institutes The front view of the schematic configuration of the feeder unit for showing.Figure 35 is that the schematic configuration for representing feeder unit shown in Figure 32 is bowed View.Figure 36 is the front view of the schematic configuration of other states for representing the feeder unit shown in Figure 32.Figure 37 is to represent figure The top view of the schematic configuration of other states of the feeder unit shown in 32.Additionally, the feeder list shown in Figure 32 to Figure 37 Unit 200, the shape most extended in scope is moved back and forth except that can change the state i.e. movable part 144b after retainer belt conveying terminates During state, outside the structure of the position of the convex portion 152a of feeding claw 152, substantially with the identical structure of feeder unit 114.

Feeder unit 200 has supporting part 202, drive division 204, the 1st front support portion 206, retainer belt feeding claw list First 208, the 2nd front support portion 209, Return-ing direction retainer belt feeding claw unit 210 and link gear 211.Drive division 204 has Have and the identical structure of drive division 144.In addition, the 1st front support portion 206 of present embodiment and retainer belt feeding claw unit The function of 208 position adjustments without retainer belt direction of feed.In addition, retainer belt feeding claw unit 208 does not have grasping part. The other structures of the 1st front support portion 206 and retainer belt feeding claw unit 208 and front support portion 146 and retainer belt feeding claw Unit 148 is identical.

Supporting part 202 is to drive division 204, the 1st front support portion 206, retainer belt feeding claw unit 208, Return-ing direction The mechanism that retainer belt feeding claw unit 210 and link gear 211 are directly or indirectly supported, is fixed in framework 110. Supporting part 202 has the screw 232 of lug boss 230,2 of support member 222,2 and 2 screws 236.

Support member 222 is the relative plate-shaped member in the face most wide with the area of the elongated box shape of framework 110, with drive Dynamic portion 204, the 1st front support portion 206, retainer belt feeding claw unit 208 a face it is relative.Support member 222 and drive division 204 fixed part links, and fixed part is supported.In addition, support member 222 is fixed on framework 110 via lug boss 230 On.

Lug boss 230 configures the face in the face opposition side relative with the grade of retainer belt feeding claw unit 208 of support member 222 On.Lug boss 230 to the grade of retainer belt feeding claw unit 208 away from direction protrude.Lug boss 230 is in support member 222 In retainer belt direction of feed, to configure 2 on the position that predetermined distance is separate.

2 screws 232 respectively with a side end of lug boss 230（With the end of the contact side of support member 222）Screw togather.Separately Outward, screw 232 is inserted into the elongated hole 222a formed in support member 222 respectively.The elongated hole 222a formed in support member 222 It is the hole extended along retainer belt direction of feed.Screw 232 is set to be protected along retainer belt direction of feed additionally, elongated hole 222a has Hold the shape moved in the range of an amount for pitch of holes of band.

The end side of 2 screws 236 respectively with lug boss 230 is screwed togather.In addition, screw 236 is inserted into framework respectively In the elongated hole 212 formed on 110.The elongated hole 212 formed in framework 110 is the hole extended along retainer belt direction of feed.Additionally, long Hole 212 has allows screw 236 to be moved in the range of a pitch of holes equivalent to retainer belt along retainer belt direction of feed Shape.

In addition, in feeder unit 200, the screw 232 screwed togather with lug boss 230 inserts the elongated hole of support member 222 In 222a.The elongated hole 222a's formed in the lug boss 230 of feeder unit 200, screw 232, support member 222 is combined into Position adjusting mechanism.It is by tightening screw 232 that lug boss 230 and support member 222 is tight relative to feeder unit 200 Gu, it is fixed such that it is able to the relative position by feeder unit 200 and framework 110 in retainer belt direction of feed.In addition, Relative to feeder unit 200, by as the state after screw 232 is unclamped, such that it is able to make elongated hole 222a and screw 232 Relative movement.Thus, it is possible to make to be formed with the support member 222 of elongated hole 222a, relative to the lug boss for inserting screw 232 230 relatively move in retainer belt direction of feed.For feeder unit 200, by the way that support member 222 and lug boss can be made 230 relative movements, can be such that feeder unit 200 is moved along retainer belt direction of feed relative to framework 110 such that it is able to be formed State.Accordingly, for feeder unit 200, by unclamping screw 232, feeder unit 200 and framework 110 can be adjusted Relative position in retainer belt direction of feed, by tightening screw 232, can protect feeder unit 200 and framework 110 Hold and be fixed with the relative position in direction of feed.

In addition, for feeder unit 200, the screw 236 screwed togather with lug boss 230 inserts the elongated hole 212 of framework 110 In.The elongated hole 212 that is formed in the lug boss 230 of feeder unit 200, screw 236, framework 110 is combined into position adjustment Mechanism.For feeder unit 200, lug boss 230 and framework 110 are fastened by tightening screw 236, can be by feeder The relative position of unit 200 and framework 110 in retainer belt direction of feed is fixed.In addition, for feeder unit 200, By forming the state after screw 236 is unclamped, can relatively move elongated hole 212 and screw 236.Thus, it is possible to make to be formed There is the framework 110 of elongated hole 212, relatively moved in retainer belt direction of feed relative to the lug boss 230 for inserting screw 236. For feeder unit 200, relatively moved by the way that framework 110 and lug boss 230 can be made, can be formed can make feeder list Unit 200 is relative to the state that framework 110 is moved along retainer belt direction of feed.Accordingly, for feeder unit 200, by unclamping Screw 236, relative position that can be to feeder unit 200 and framework 110 in retainer belt direction of feed is adjusted, and passes through Screw 236 is tightened, relative position that can be to feeder unit 200 and framework 110 in retainer belt direction of feed is fixed.

Can make the entirety of feeder unit 200 and framework 110 along retainer belt direction of feed because feeder unit 200 is formed The structure of relative movement, so part replacement etc. need not be carried out, it is possible to simply to the retainer belt direction of feed of feeding claw Position is adjusted.In addition, for feeder unit 200, by only unclamping screw 232 from the outside of framework 110, so that it may so that Feeder unit 200 is moved relative to framework 110.Thus, it is possible to more simply carry out in the retainer belt direction of feed of feeding claw Position adjustment.Herein, operating personnel make feeder unit 200 and framework 110 be moved along retainer belt direction of feed is relative When dynamic, by grasping support member 222, support member 222 is set to be moved along retainer belt direction of feed relative to framework 110, so that Can be relatively moved.In addition, operating personnel can also grasp lug boss 230 and be relatively moved.In addition, operating personnel When release screw 236 makes feeder unit 200 and framework 110 be relatively moved along retainer belt direction of feed, by grasping pine Screw 236 after opening, makes screw 236 be moved relative to elongated hole 212, so as to feeder unit 200 and the edge of framework 110 can also be made Retainer belt direction of feed is relatively moved.In this case, it is preferable to make screw 236 form the shape for being easy to grasping.

In addition, for feeder unit 200, being carried out using the mechanism for forming screw 232 and elongated hole 222a combinations In the case that relative position is moved, preferably as the state for being fixed framework 110 and lug boss 230 using screw 236.In addition, For feeder unit 200, the mechanism that screw 236 and elongated hole 212 are combined is made the situation of relative position movement utilizing Under, preferably as the state for being fixed support member 222 and lug boss 230 using screw 232.

In addition, in feeder unit 200, being set as position adjusting mechanism and combining screw 232 and elongated hole 222a Mechanism and the two mechanisms of mechanism for combining screw 236 and elongated hole 212, can be using them to supply Relative position between device unit 200 and framework 110 in retainer belt direction of feed is adjusted, but is not limited to this. In feeder unit 200, as position adjusting mechanism, it is also possible to only set and be fixed lug boss 230 and support member 222 Part at the screw 232 that sets and the mechanisms that combine of elongated hole 222a.In addition, in feeder unit 200, as position Adjustment mechanism, it is also possible to only set part, i.e. screw 236 and the elongated hole 212 for fixing lug boss 230 and framework 110 combine and Into mechanism.

In addition, for feeder unit 200, making the 1st front support portion 206 be brought into along holding by using drive division 204 Moved back and forth to direction, so that retainer belt feeding claw unit 208 is in the position shown in Figure 34 and Figure 35 and Figure 36 and Figure 37 institutes Moved back and forth between the position for showing.Thus, moved back and forth by making retainer belt feeding claw unit 208, such that it is able to feeder Retainer belt in the same manner, is conveyed 1 amount of spacing by unit 114 every time along retainer belt direction of feed.

Herein, the feeder unit 200 of present embodiment is as noted above, also with the 2nd front support portion 209, returns Return direction retainer belt feeding claw unit 210 and link gear 211.Below, it is right using Figure 32 to Figure 37 and Figure 38 to Figure 43 2nd front support portion 209, Return-ing direction retainer belt feeding claw unit 210, link gear 211 are illustrated.Figure 38 is to represent figure The explanatory diagram of the schematic configuration of the feeder unit shown in 32.Figure 39 is other states for representing the feeder unit shown in Figure 32 Schematic configuration explanatory diagram.Figure 40 is the explanation of the schematic configuration of the link gear for representing the feeder unit shown in Figure 32 Figure.Figure 41 is the explanatory diagram of the schematic configuration of the other examples for representing framework.Figure 42 is for the feeder shown in explanatory diagram 32 The explanatory diagram of the action of unit.Figure 43 is the explanatory diagram of the action for the feeder unit shown in explanatory diagram 32.In Figure 41, Framework 280 is shown in order to illustrate feeder unit 200.

As shown in Figure 38 and Figure 39, the 2nd front support portion 209 is most wide with the area of the elongated box shape of framework 110 The relative plate-shaped member in face, with drive division 204, the 1st front support portion 206, retainer belt feeding claw unit 208 another face Relatively.That is, the 2nd front support portion 209 and support member 222 are configured across drive division 204, the 1st front support portion 206 and guarantor Hold on the position with feeding claw unit 208.2nd front support portion 209 is fixed on support via linking part 226, link gear 211 On part 222.2nd front support portion 209 is the machine being supported to Return-ing direction retainer belt feeding claw unit 210 described later Structure, is linked using linking part 226 with link gear 211.A part on the upside of the vertical in the 2nd front support portion 209 is from frame Body 110 exposes.That is, the part on the upside of the vertical in the 2nd front support portion 209, from the formation guiding groove 120 of framework 110 The outside towards framework 110 expose.In a part on the upside of the vertical in the 2nd front support portion 209, grasping part is set 228.In addition, the front support portion 209 of support member 222 and the 2nd with the state that can be moved along retainer belt direction of feed to before the 1st End supporting part 206 is supported.

Linking part 226 is made up of bolt and nut etc., and the 2nd front support portion 209 is fixed on link gear 211. Grasping part 228 is as noted above, is arranged at the part on the upside of the vertical in the 2nd front support portion 209.Grasping part 228 It can be the part grasped by operating personnel.Grasping part 228 is formed as being easy to make operating personnel by the edge of the 2nd front support portion 209 The shape of the direction movement parallel with retainer belt direction of feed.Operating personnel by make the 2nd front support portion 209 along with retainer belt The parallel direction movement of direction of feed, such that it is able to make retainer belt feeding claw unit 208 and Return-ing direction retainer belt feeding claw list Unit 210, moves along the direction parallel with retainer belt direction of feed.

Return-ing direction retainer belt feeding claw unit 210 is and the essentially identical configuration of retainer belt feeding claw unit 208.Return The direction and the surface normal of supporting part 202 of direction retainer belt feeding claw unit 210, are disposed substantially away from retainer belt feeding claw unit On 208 position and the position relative with retainer belt feeding claw unit 208.Return-ing direction retainer belt feeding claw unit 210 is fixed In the 2nd front support portion 209, along rectilinear movement direction together with the 2nd front support portion 209（The movable part of drive division 204 is moved Dynamic direction）It is mobile.In addition, Return-ing direction retainer belt feeding claw unit 210 makes the direction of the feeding claw on rectilinear movement direction It is opposite with retainer belt feeding claw unit 208.In addition, Return-ing direction retainer belt feeding claw unit 210 make the convex portion of feeding claw to The opposite side protrusion in the side of supporting part 202.

Link gear 211 is that the power in the 1st front support portion 206 to the 2nd front support portion will be transferred to from drive division 204 The mechanism of 209 transmission.Link gear 211 is as shown in figure 40, with the 1st slide mechanism 242, the skate machine of driving section 244 and the 2nd Structure 246.1st slide mechanism 242 has fixed part 242a and movable part 242b.Fixed part 242a is fixed on supporting part 202.Can Dynamic portion 242b is with can be along rectilinear movement direction（The direction of the movable part movement of drive division 204）Mobile state is supported on fixed part On 242a.Movable part 242b is fixed in the 1st front support portion 206, along rectilinear movement side together with the 1st front support portion 206 To movement.

Driving section 244 is the driver that the power that will transmit to come from the 1st slide mechanism 242 is transmitted to the 2nd slide mechanism 246 Structure.Driving section 244 has the gear being fixed on via pin on supporting part.

2nd slide mechanism 246 has fixed part 246a and movable part 246b.Fixed part 246a is fixed on supporting part 202. Movable part 246b with can along rectilinear movement direction（The direction of the movable part movement of drive division 204）Mobile state is supported on fixation On portion 246a.Movable part 246b is fixed in the 2nd front support portion 209, along rectilinear movement together with the 2nd front support portion 209 Move in direction.

Link gear 211 has said structure, and used as driving section 244, gear is embedded in the movable of the 1st slide mechanism 242 In the gear grooved formed on portion 242b and the gear grooved formed on the movable part 246b of the 2nd slide mechanism 246.That is, link Mechanism 211 is linked the slide mechanism 242 of driving section 244 and the 1st using pinion and rack, will be driven using pinion and rack The slide mechanism 246 of portion 244 and the 2nd links.In addition, as shown in figure 40, for link gear 211, driving section 244 and the 1st is slided The position of the link of motivation structure 242 and the position for linking the slide mechanism 246 of driving section 244 and the 2nd, as relative with gear Position.Thus, in feeder unit 200, if gear rotation, the 1st slide mechanism 242 and the edge of the 2nd slide mechanism 246 The direction movement opposite to each other of rectilinear movement direction.

Herein, the framework 280 to fixed supply device unit 200 is illustrated.As shown in figure 41, framework 280 formed with The identical guiding groove 282 of above-mentioned framework 110.Guiding groove 282 is shaped as, by along elongated on the upside of the vertical of framework 280 One side end of 2 line parts 283,285 that the length direction on surface is formed links at reflex part 284.That is, guiding groove 282 Be formed as following U-shaped, i.e. line part 283 is extended about from a side end of framework 280 to end side, another Turned back at reflex part 284 near side end, line part 285 extends to a side end.Guiding groove 282 is that electronic unit is kept The groove that band is guided, from a side end of U-shaped（The end of supply side）Supply electronic unit retainer belt.Guiding groove 282 Supplied electronic unit retainer belt is set to be moved along U-shaped, from a side end of U-shaped（The end of discharge side）Discharge. In addition, the inside of framework 280 is located to retainer belt main body for guiding groove 282 and electronic unit is exposed to state outside framework 280 Electronic unit retainer belt guide.The reflex part 284 of framework 280 configures guiding in the outer circumferential side of the conveyor zones of retainer belt Portion 286a, guide portion 286b is configured with the inner circumferential side of the conveyor zones of retainer belt.Guide portion 286a, 286b is respectively formed as edge The periphery of the conveyor zones turned back and the curve form of inner circumferential bending.Framework 280 at reflex part 284 by setting guide portion 286a, 286b and can utilize the reflex part 284 retainer belt is moved along appropriate direction.

Below, using Figure 42 and Figure 43, the feed motion to the electronic unit retainer belt of feeder unit 200 is said It is bright.As shown in figure 42, for feeder unit 200, retainer belt feeding claw unit 208 is fixed in the 1st front support portion 206, Return-ing direction retainer belt feeding claw unit 210 is fixed in the 2nd front support portion 209.

Retainer belt feeding claw unit 208 has feeding claw 152.Feeding claw 152 and the above-mentioned phase of retainer belt feeding claw unit 148 It is the part of the convex portion 152a that there is the side end in bar-like member to protrude with ground.Feeding claw 152 configure with electronic unit On the relative position in the hole of the retainer belt main body of retainer belt 70, convex portion 152a's is shaped as, the feeding in retainer belt direction of feed Direction downstream（The front side of direction of feed）Face 152b turn into the face orthogonal with direction of feed, entering in retainer belt direction of feed Give direction upstream side（The rear side of direction of feed）Face 152c turn into relative to the face inclined face orthogonal with direction of feed, with Close to retainer belt, the narrowed width in direction of feed.Situation of the feeding claw 152 in the position Shang You hole 78 relative with convex portion 152a Under, the state for being inserted in the hole as convex portion 152a as shown in figure 42.Herein, retainer belt feeding claw unit 208 configure with position On the relative position of retainer belt 70 in the line part 283 of guiding groove 282, convex portion 152a is configured in the side of reflex part 284.Keep Will be positioned at the retainer belt 70 in the line part 283 of guiding groove 282 to the holding area for adsorbing electronic unit with feeding claw unit 208 PP is conveyed.

Return-ing direction retainer belt feeding claw unit 210 has feeding claw 252.Feeding claw 252 and above-mentioned retainer belt feeding claw Unit 208 is the part of the convex portion 252a that there is the side end in bar-like member to protrude in the same manner.Feeding claw 252 is configured On the position relative with the hole of the retainer belt main body of retainer belt 70, convex portion 252a's is shaped as, entering in retainer belt direction of feed Give direction downstream（The front side of direction of feed）Face 252b turn into the face orthogonal with direction of feed, in retainer belt direction of feed Direction of feed upstream side（The rear side of direction of feed）Face 252c turn into relative to the face inclined face orthogonal with direction of feed, with Close to retainer belt, the narrowed width in direction of feed.Feelings of the feeding claw 252 in the position Shang You hole 78 relative with convex portion 252a Under condition, the state for being inserted in the hole as convex portion 252a as shown in figure 42.Herein, Return-ing direction retainer belt feeding claw unit 210 Configuration with the relative position of retainer belt 70 being located in the line part 285 of guiding groove 282, convex portion 252a configure with reflex part The opposite side in 284 sides.That is, the feeding claw 252 of Return-ing direction retainer belt feeding claw unit 210 is configured to, in rectilinear movement side The direction opposite with the feeding claw 152 of retainer belt feeding claw unit 208 upwards.Return-ing direction retainer belt feeding claw unit 210 will By the retainer belt 70 after the holding area PP for adsorbing electronic unit, conveyed to the discharge unit of the line part 285 of guiding groove 282.

Below, using Figure 43, the retainer belt feed motion to feeder unit 200 is illustrated.In step s 6, feed The convex portion 152a of pawl 152 is inserted in the hole 78 of the retainer belt main body of retainer belt 70, and the convex portion of feeding claw 252 is to retainer belt main body Hole in insert.Herein, the convex portion of feeding claw 152 is inserted into retainer belt direction of feed compared with holding area PP positioned at upper Trip side（Before holding area PP）Retainer belt 70 hole in.The convex portion of feeding claw 252 is inserted into retainer belt direction of feed On compared with holding area PP be located at downstream（After holding area PP）And the retainer belt turned back at reflex part 284 Kong Zhong.Feeder unit 200 is inserted in the hole in the convex portion for as shown in step s beta, making feeding claw 152, makes the convex portion of feeding claw 252 In the state of inserting in the hole, drive drive division 204, retainer belt feeding claw unit 208, Return-ing direction retainer belt feeding claw unit 210 move amount corresponding with 1 pitch of holes of retainer belt main body along retainer belt direction of feed.

If feeder unit 200 is in the state of step S6, retainer belt feeding claw unit 208, Return-ing direction is kept Band feeding claw unit 210 is conveyed along retainer belt direction of feed, then using feeding claw 152 convex portion the face orthogonal with direction of feed And the face orthogonal with direction of feed of the convex portion of feeding claw 252, hole is pushed to retainer belt direction of feed, such as step S7 institutes Show, retainer belt feeding claw unit 208 and retainer belt is moved to retainer belt direction of feed.Herein, retainer belt feeding claw list Unit 208 and Return-ing direction retainer belt feeding claw unit 210, are moved in the opposite directions to each other using link gear 211.As described above Shown, Return-ing direction retainer belt feeding claw unit 210 is moved by the edge direction opposite with retainer belt feeding claw unit 208, from And can be guiding groove 282, Xiang Congyin along retainer belt direction of feed with the retainer belt in the hole of insertion feeding claw 152,252 Portion is led to be conveyed towards the direction of discharge unit.

If retainer belt feeding claw unit 208, Return-ing direction retainer belt feeding claw unit 210 are along retainer belt direction of feed Mobile end（Step S7）, then feeder unit 200 electronic unit of the front end that retainer belt main body kept is in holding position Put and standby.Now, positioned at holding position（Holding area）The electronic unit of PP, electronic component body is clamped and by cutting portion Lead is cut off.Then, the treatment for being specified in electronic component mounting apparatus side, for example by retainer belt kept positioned at guarantor Hold after the electronic unit of position supplies to boarded head, send driving instruction, drive drive division 204, make retainer belt feeding claw list Unit 208, Return-ing direction retainer belt feeding claw unit 210 is along the direction opposite with retainer belt direction of feed, movement and retainer belt master The corresponding amount of 1 pitch of holes of body 72.If feeder unit 200 is in the state of step S7, by retainer belt feeding claw unit 208th, Return-ing direction retainer belt feeding claw unit 210 is conveyed to the side opposite with retainer belt direction of feed, then feeding claw 152, The inclined plane of 252 convex portion is contacted with hole, the convex portion of feeding claw 152,252 is moved along the direction for being tilted towards being extracted from hole It is dynamic.Thus, feeder unit 200 makes the convex portion of feeding claw 152,252 depart from from hole as shown in step S8（Step S8）, protect Band is held not move, retainer belt feeding claw unit 208, Return-ing direction retainer belt feeding claw unit 210 to retainer belt direction of feed Opposite side shifting.

Then, in feeder unit 200 since the state shown in step S7, make retainer belt feeding claw unit 208, return Direction retainer belt feeding claw unit 210 is along the direction opposite with retainer belt direction of feed, mobile 1 hole with retainer belt main body 72 After the corresponding amount of spacing, as shown in step S9, the convex portion insertion as feeding claw 152,252 is compared with the hole inserted in step S7 State in 1 hole of amount of separation of upstream side.Then, drive division 204 drives to retainer belt direction of feed immediately, will protect The next electronic unit with being kept in main body 72 is held to be conveyed to holding position.

Feeder unit 200 is as noted above, makes retainer belt feeding claw unit 208 to keep by using drive division 204 The corresponding amount of 1 pitch of holes with main body 72 along direction of feed move back and forth, such that it is able to make retainer belt along direction of feed sequentially Mobile 1 amount of spacing.

In addition, feeder unit 200 is by setting Return-ing direction retainer belt feeding claw unit 210, using link gear 211, Return-ing direction retainer belt feeding claw unit 210 is linked with retainer belt feeding claw unit 208 and is driven, such that it is able to To be conveyed along direction of feed by the retainer belt after holding area PP.It is as noted above, due to can be by by holding area PP Retainer belt afterwards is conveyed along direction of feed, it is possible to which in the upstream and downstream of holding area PP, this both sides makes holding Tape movement. Thus, it is possible to suppress the situation of retainer belt bending or the position skew of retainer belt in holding area PP.In addition, present embodiment Feeder unit 200, feed retainer belt feeding claw unit 208 and Return-ing direction retainer belt by using link gear 211 Pawl unit 210 is moved in linkage, such that it is able to move 2 feeding claws using 1 drive mechanism.In addition, by moving in linkage It is dynamic, the distance between 2 feeding claws can be maintained to fix, can suitably convey retainer belt.

Herein, preferably electronic part feeder 100 is as described above shown in each implementation method, in retainer belt direction of feed On, the downstream of the allocation position of feeding claw 152 and the configuration of the upstream side compared with reflex part guarantor in feeder unit 200 Hold region（Holding position）PP.That is, preferably in electronic part feeder 100, electronic unit 80 will be kept using suction nozzle 32 Holding area PP, configure in the feeding claw 152 and the folding of guiding groove 282 that electronic unit retainer belt 70 is conveyed to holding area Between the portion of returning between clamped position.Thus, it is possible to suppress to be bent by the electronic unit retainer belt 70 of holding area PP or The situation of deformation, can make the position of the position of electronic unit retainer belt 70 at holding area PP and electronic unit 80 steady It is fixed.

Figure 44 is the explanatory diagram of the schematic configuration of the other examples for representing assembly supply device.Figure 45 is by the part of Figure 44 The explanatory diagram amplified and represent.Electronic part feeder 310 has the plate-shaped member 312 linked with feeder unit, in frame Opening 314 is formed on body.Plate-shaped member 312 is moved together with the fixed part of feeder unit along conveying direction.Opening 314 is in plate At the position overlapped with the end of plate-shaped member 312 in the movable range of shape part 312, formed along many of vertical extension Individual side 314a, 314b, 314c, 314d.Herein, side 314a, 314b, 314c, 314d is formed in and the hole of various retainer belts On interval and electronic unit position corresponding relative to the configuration in hole.Interval and electronics of the user for the hole of retainer belt Part relative to the combination of the configuration in hole, make plate-shaped member 312 while position and with while 314a, 314b, 314c, 314d bar The consistent side alignment of part, such that it is able to be conveyed electronic unit to holding area from feeder unit.Additionally, in present embodiment In, identically with above-mentioned implementation method, the interval in the hole of retainer belt and electronic unit are combined as 4 kinds relative to the configuration in hole Situation, the shape of opening 314 is changed but as long as corresponding with combination.

Figure 46 is the explanatory diagram of the schematic configuration of the other examples for representing assembly supply device.Figure 47 is by the part of Figure 46 The explanatory diagram amplified and represent.Electronic part feeder 320 shown in Figure 46 and Figure 47 is configured with retainer belt row in discharge unit Go out guide portion 322.Retainer belt discharges the angle that guide portion 322 is formed with the semicircular cylinder on the face relative with discharge unit and vertical Direction for 60 degree is configured.In addition, retainer belt discharge guide portion 322 configures tabular on the face relative with guide portion 122 Part.Electronic part feeder 320 discharges guide portion 322 by configuring retainer belt, such that it is able to make to be discharged from discharge unit 126 Retainer belt along semicircular cylinder portion change direction, to vertical downside suitably guide.Thus, it is possible to by guiding groove And the discharge angle of the electronic unit retainer belt from discharge unit discharge is limited.Retainer belt discharge guide portion 322 is by will be with The relative face of discharge unit is set to cylinder, such that it is able to reduce the load applied to electronic unit retainer belt, can suitably make electricity Subassembly retainer belt changes direction.In addition, retainer belt discharge guide portion 322 by by the angle of inclination of cylindrical portion be set to relative to 60 degree of vertical, such that it is able to reduce the load applied to electronic unit retainer belt, can keep suitably electronic unit Band changes direction.Additionally, retainer belt discharge guide portion 322 is by using Figure 46,47 structure, such that it is able to the swimmingly side of change To, electronic unit retainer belt can be discharged to desired position, but be not limited to the structure.

Figure 48 is the explanatory diagram of the schematic configuration of the other examples for representing assembly supply device.Figure 49 is by the part of Figure 48 The explanatory diagram amplified and represent.Electronic part feeder 320 shown in Figure 48 and Figure 49, portion is provided with guide portion 122 Part placing box 324.Part placing box 324 sets lock section 326, and lock section 326 links with guide portion 122, is supported on guide portion 122 On.324 pairs of electronic unit retainer belts supplied to electronic part feeder 320 of part placing box are housed.Additionally, electronics During part retainer belt can also be placed on part placing box 324 together with the chest of the electronic unit retainer belt is housed.The ministry of electronics industry Part feedway 320 can shorten position and the guide portion of stored electrons part retainer belt by set parts placing box 324 The distance between 122.Thus, it is possible to right during reducing from the position of stored electrons part retainer belt to guide portion 122 conveying The load that electronic unit retainer belt applies.Thus, it is possible to suitably convey electronic unit guarantor using electronic part feeder 320 Hold band.It is additionally possible to suppress the situation that electronic unit retainer belt is broken because of deadweight or elongates hole.

Below, part feed unit 14f is illustrated.Herein, part feed unit 14f has 2 bowl formula supplies Device assembly 90.2 bowl formula feeder assemblys 90 are configured side by side, substantially identical structure.Below, to 1 bowl formula Feeder assembly 90 is illustrated.

Figure 50 is to represent a bowl oblique view for the schematic configuration of formula feeder assembly.Figure 51 is to represent the bowl formula shown in Figure 50 The oblique view of the schematic configuration of feeder assembly.Bowl formula feeder assembly 90 as shown in Figure 50 and Figure 51, with 2 bowl formulas Feeder unit 400 and supporting mechanism 401.In the present embodiment, bowl formula feeder unit 400 and bowl formula feeder are combined Body 90 is controlled by control unit to action.Bowl formula feeder unit 400 and bowl formula feeder assembly 90 can be by electronics The control device 20 that apparatus for mounting component 10 has used as control unit, or bowl formula feeder unit 400 and Bowl formula feeder assembly 90 has control unit.

Supporting mechanism 401 is the mechanism being supported to 2 bowl formula feeder units 400.Supporting mechanism 401 has support Plate 491, support stick 492 and linking part 493.Supporting plate 491 is plate-shaped member, sets and fix 2 bowl formula feeder units 400.The front end of the supply part side of supporting plate 491 links with the locating shaft 44b of front side receptacle 44 and recess 44c.Support Rod 492 links via the side away from front side receptacle 44 of linking part 493 and supporting plate 491.The vertical of support stick 492 The end of downside, is supported on the setting face for setting electronic component mounting apparatus 10（Ground）On.Supporting mechanism 401 is received using front side The supporting plate 491 that container 44 and support stick 492 pairs are provided with 2 bowl formula feeder units 400 is supported.Supporting mechanism 401 By the way that in front side receptacle 44 and away from the support stick 492 of front side receptacle 44, this 2 positions are propped up supporting plate 491 Support, bends such that it is able to suppress supporting plate 491.Thus, it is possible to suppress bowl vibration of formula feeder unit 400 as supporting plate 491 vibration and absorbed situation, suitably can be driven to bowl formula feeder unit 400.

1 bowl formula feeder unit 400 that bowl formula feeder assembly 90 has is configured to, collecting bowl described later and its The collecting bowl of his bowl formula feeder unit 400 lines up 2 row along vertical, and relative to holding position（The front end of guide rail 422, Absorption position）The skew before and after.That is, bowl formula feeder assembly 90 in the Y direction, 2 bowl formula feeder units 400 it is aftermentioned Bowl is housed to configure on front and back position.Also, in X-direction（The conveying in the direction, substrate orthogonal with guide rail bearing of trend described later Direction）On, the collecting bowl and the bowl formula feeder unit 400 of the 2nd row that the 1st bowl formula feeder unit 400 for arranging has are had Some at least a portion for housing the configuring area between bowl overlap.That is, bowl formula feeder assembly 90 in the X direction, 2 bowls The position of the aftermentioned collecting bowl of formula feeder unit 400 configures with overlapping.In addition, bowl formula feeder assembly 90 is in the Y direction, 2 aftermentioned collecting bowl configurations of bowl formula feeder unit 400 are on front and back position.Thus, bowl formula feeder assembly 90 can be with Efficiently configure bowl formula feeder unit 400.Specifically, the narrowed width of X-direction can be made, can be installed in electronic unit The part of device 10 can be supplied to configure more assembly supply devices in region.

In the present embodiment, what the bowl formula feeder unit 400 of the 1st row had houses the bowl formula confession of bowl and the 2nd row To device unit 400（It is disposed substantially away from the position of holding position compared with the bowl formula feeder unit 400 of the 1st row）Had Bowl is housed, in the direction orthogonal with the bearing of trend of guide rail（The conveying direction of X-direction, substrate）On, configuration is less than collecting bowl 2 times of external diameter of region in.So, the narrowed width of X-direction can reliably be made, can be in electronic component mounting apparatus 10 Part can be supplied to configure more assembly supply devices in region.

Below, using Figure 52 to Figure 67 B, the bowl formula supply to the bowl formula feeder assembly 90 of part feed unit 14f Device unit 400 is illustrated.Bowl formula feeder is used as the ministry of electronics industry by the bowl formula feeder unit 400 shown in Figure 52 to Figure 67 B Part feedway.First, using Figure 52 to Figure 54, the overall structure to bowl formula feeder unit 400 is illustrated.Figure 52 is table Show the side view of the other examples of part feed unit.Figure 53 is the top view of the other examples for representing part feed unit.Figure 54 is to represent the side view that the state after housing bowl is dismantled from the part feed unit shown in Figure 52.

Bowl formula feeder unit 400 has electronic part feeder（Bowl formula feeder）402nd, 404,406, drive device 408 and fixed part 410.That is, bowl formula feeder unit 400 be have 3 electronic part feeders 402,404,406 and can With in 3 mechanisms of position supply part.In addition, 1 drive device 408 of bowl formula feeder unit 400 turns into electronic unit The drive division of feedway 402,404,406.In addition, in bowl formula feeder unit 400, fixed part 410 is supplied electronic unit It is supported to device 402,404,406 and drive device 408.Fixed part 410 has the frame shape extended along vertical Supporting part 442 and supporting part 444, in top and bottom to electronic part feeder 402,404,406 and drive device 408 are supported.In addition, untill supporting part 442 and supporting part 444 extend to the rotary shaft of drive device described later 408, driving The shape that dynamic device 408 can be rotated with the object part of electronic part feeder 402,404,406 as rotating shaft center Under state, drive device 408 is supported.

Electronic part feeder 402 has collecting bowl 420a, guide rail 422a, supporting mechanism 424a and linking part 436a.Electronic part feeder 404 has collecting bowl 420b, guide rail 422b, supporting mechanism 424b and linking part 436b.Electricity Subassembly feedway 406 has collecting bowl 420c, guide rail 422c, supporting mechanism 424c and linking part 436c.Electronic unit It is laminated on the position of location overlap of the feedway 402,404,406 in the horizontal direction for housing bowl 420a, 420b, 420c and is matched somebody with somebody Put, from vertical top sequentially housing being arranged in order for bowl 420a, 420b, 420c.In addition, electronic part feeder 402nd, configuration is at grade side by side for supporting mechanism 424a, 424b, the 424c in 404,406.I.e., a plurality of guide rail 422a, The respective holding position configuration of 422b, 422c is at grade.

The only allocation position of electronic part feeder 402,404,406 is different and because of the different relation of the allocation position And the shape of guide rail 422a, 422b, 422c is different, substantially identical structure.Below, for electronic part feeder 402, 404th, 406 common ground for housing bowl 420a, 420b, 420c, is illustrated with housing bowl 420.In the same manner, for guide rail The common ground of 422a, 422b, 422c, is illustrated with guide rail 422.For the common ground of supporting mechanism 424a, 424b, 424c, Illustrated with supporting mechanism 424.For the common ground of linking part 436a, 436b, 436c, illustrated with linking part 436.

It is the container for being placed with multiple electronic units to house bowl 420.Guide rail 422 turns into the electricity that will be put into and house in bowl 420 The guide member that subassembly is guided to absorption position.Supporting mechanism 424 is the ministry of electronics industry to being guided by guide rail 422 in absorption position The mechanism that part is supported.Linking part 436 links with the portion that shakes that applies for housing bowl 420 and drive device 408, from drive device 408 vibrate to the transmission of bowl 420 is housed.Additionally, in the present embodiment, in electronic part feeder 402,404,406, even Knot 436 and drive device 408 turn into vibration section.Below, each several part is described in detail.

Using Figure 55 and Figure 56, illustrated to housing bowl 420.Figure 55 is to represent the part feed unit shown in Figure 53 The explanatory diagram for housing the relation between bowl and the supporting part of vibration section of electronic part feeder.Figure 56 is represented shown in Figure 55 Collecting bowl schematic configuration explanatory diagram.House bowl 420 as noted above, be the container for being placed with multiple electronic units.Receive Hold the main body 450 as container of bowl 420, be bottom surface be circular, outer rim extend to the direction with plane perpendicular, upper surface open Box shape.Bowl 420 is housed on the bottom surface of main body 450, with the lug boss 451 extended to vertical downside, to convex Rise and be inserted with secure component 452 for being fastened with linking part 436 in portion 451.Secure component 452 is screw（Mounting screw）, Can with can relative to lug boss 451 rotate state and with not from lug boss 451 depart from construction be supported.Linking part 436 are provided with the fastener hole fastened by secure component 452（Screw hole）454.Bowl 420 is housed by making secure component 452 It is fastened in fastener hole 454, so as to be fixed on linking part 436.

It is as noted above, house bowl 420 and linking part is fixed on dismountable state using secure component 452 by using Construction on 436, such that it is able to from electronic part feeder 402,404,406 and bowl formula feeder unit 400, easily Dismantled to housing bowl 420 on ground.Thus, it is possible to easily change house bowl 420.

Also, a side end of guide rail 422 links with bowl 420 is housed, and end side links with supporting mechanism 424.Lead Rail 422 is formed with the guiding groove guided to electronic unit, the electronic unit taken out of from collecting bowl 420 is moved along guiding groove It is dynamic, and guide to the part linked with supporting mechanism 424.In addition, as described later, the part that guide rail 422 links with collecting bowl 420 It is fixed on the vibration section of drive device 408, is vibrated together with bowl 420 is housed.In addition, guide rail 422 links with supporting mechanism 424 A side end, with can along guide rail 422 bearing of trend slide（Can slide in one direction）State supported.

2 bowl formula feeder units 400 shown in Figure 50, Figure 51, are respectively provided with towards the multiple of vertical configuration and house Bowl 420a, 420b, 420c.By the respective holding position with multiple guide rail 422a, 422b, 422c（Absorption position）Nearest one The individual bowl formula feeder unit 400 as the 1st row, a bowl formula as the 2nd row in contrast away from holding position is supplied To device unit 400.Now, the bowl formula feeder unit 400 of the 2nd row has multiple guide rail 422a, 422b, 422c, the 1st The side of multiple guide rail 422a, 422b, 422c that the bowl formula feeder unit 400 of row has, matches somebody with somebody side by side along vertical Put.Also, as shown in figure 53, their front end is along the direction exhibition orthogonal with the bearing of trend of multiple guide rail 422a, 422b, 422c Open, and the respective holding position of multiple guide rail 422a, 422b, 422c, i.e. supporting mechanism 424a, 424b, 424c are matched somebody with somebody side by side Put at grade.

Below, using Figure 57 A to Figure 58 B, supporting mechanism 424 is illustrated.Figure 57 A are to represent the part shown in Figure 53 The oblique view of the schematic configuration of the supporting mechanism of the electronic part feeder of feed unit.Figure 57 B are represented shown in Figure 57 A The front view of the schematic configuration of supporting mechanism.Figure 58 A are the oblique views of other states for representing the supporting mechanism shown in Figure 57 A. Figure 58 B are the front views of the schematic configuration for representing the supporting mechanism shown in Figure 58 A.Figure 57 A and Figure 57 B are supporting mechanisms 424 The state that position adjustment is closed with bracket 470, Figure 58 A and Figure 58 B is that the position adjustment bracket 470 of supporting mechanism 424 is opened State.In addition, in Figure 57 B and Figure 58 B, in order to show the relative position of each part, virtually being shown in the upside of bracket 470 Guiding groove 464.

Supporting mechanism 424 has pedestal 460, rail supporting portion 462, guiding groove 464 and absorption position adjustment unit 468.Pedestal 460 is integrally fixed at the part on bowl fixed part of formula feeder unit 400.Rail supporting portion 462 is with rotatable State be supported on wheel portion on pedestal 460, guide rail 422 is supported from vertical downside.Rail supporting portion 462 with Accordingly rotated parallel to the movement on the direction of the bearing of trend of guide rail 422.Thus, guide rail 422 is with can be relative to branch Support mechanism 424 is supported in the state that the direction parallel with bearing of trend is moved.Guiding groove 464 is formed in the guide rail of pedestal 460 The end of 422 bearing of trend.Guiding groove 464 links with the groove of guide rail 422, the electronic unit that receiving is guided by guide rail 422. That is, guiding groove 464 receives by the electronic unit of guide rail 422.

Absorption position adjustment unit 468 is the machine being adjusted to the absorption position of the electronic unit in supporting mechanism 424 Structure, with position adjustment bracket 470, rotary shaft 472, fixed part 474 and screw 476.Position adjustment bracket 470 is to match somebody with somebody Put by the part on the position of the obturation of guiding groove 464, raised 480 are formed in the end of the side of guide rail 422.Position adjustment bracket 470 is inaccessible by guiding groove 464 by using raised 480, so as to be supported to the electronic unit by guiding groove 464, so that It will not be to the downstream side shifting of the electronic unit moving direction compared with raised 480.Thus, position adjustment bracket 470 can It is maintained on the assigned position of guiding groove 464 with by electronic unit.Rotary shaft 472 is stretched out along the bearing of trend of guiding groove 464 Axle, be fixed on fixed part 474 with rotatable state.Rotary shaft 472 is supported to position adjustment bracket 470, makes Position adjustment bracket 470 turn into can along guiding groove 464 bearing of trend move state and can be with along guiding groove 464 The axle that stretches out of bearing of trend centered on the state that rotates.Fixed part 474 is fixed on pedestal 460.

Screw 476 is that, to part fixed on fixed part 474, screw 476 is adjusted in position by position adjustment bracket 470 Inserted in the elongated hole 482 formed on whole use bracket 470.Elongated hole 482 is using the bearing of trend of guiding groove 464 as length direction Hole.In absorption position adjustment unit 468, position adjustment bracket 470 is fixed on fixed part 474 by using screw 476 On, so as to be fixed to position adjustment bracket 470, turning into position adjustment bracket 470 can be relative to fixed part 474 Along centered on the bearing of trend state for moving of guiding groove 464 and the axle that can be stretched out by the bearing of trend along guiding groove 464 turns Dynamic state.

Absorption position adjustment unit 468 has said structure, as shown in Figure 57 A and Figure 57 B, will by using screw 476 Position adjustment bracket 470 is fixed on fixed part 474, such that it is able in the assigned position of supporting mechanism 424 to electronic unit It is supported.In addition, absorption position adjustment unit 468 is as shown in Figure 58 A and Figure 58 B, used from position adjustment by by screw 476 Unloaded on bracket 470, such that it is able to open the end 490 in the electronic unit moving direction downstream of guiding groove 464.Thus, may be used To be fed to the electronic unit of guide rail 422 and guiding groove 464, from the front end of guiding groove 464（Under electronic unit moving direction Swim the end of side）Discharge.It is as noted above, by forming the mechanism that electronic unit can be discharged from the front end of guiding groove 464, Bowl 420 is housed in replacing and in the case of the supplied electronic unit of change, can simply vent and remain in guide rail 422 and draw Electronic unit in guide groove 464.

Electronic part feeder 402,404,406 turns into following constructions by making position adjustment bracket 470, i.e. into It is the state that can be moved along the bearing of trend of guiding groove 464 relative to fixed part 474, and is fixed using screw 476, so that Position that can be easily to the position adjustment bracket 470 on the bearing of trend of guiding groove 464 is adjusted.Thus, it is possible to Species with electronic unit is corresponding, and the position to supporting electronic unit is changed.I.e., it is possible to the adsorption potential with electronic unit Put position that is corresponding and adjusting raised 480.Thus, though the electronic unit for being supplied be variety classes in the case of, Electronic unit can be supported in appropriate absorption position.

In addition, electronic part feeder 402,404,406 turns into said structure by making collecting bowl 420, and make support Mechanism 424 turns into said structure, houses bowl 420 so as to be easily changed, and can easily discharge the electronics remained when changing Part.Thus, it is possible to easily change the species of the electronic unit supplied by electronic part feeder 402,404,406.

Below, using Figure 52 to Figure 54 and Figure 59 to Figure 64, drive device 408 is illustrated.Figure 59 is to represent figure The top view of the schematic configuration of the drive device of the electronic part feeder of the part feed unit shown in 53.Figure 60 is to represent The oblique view of the schematic configuration of the drive device shown in Figure 59.Figure 61 is to amplify the schematic configuration of the drive device shown in Figure 59 And the amplification plan view for representing.Figure 62 is the side view of the schematic configuration for representing the drive device shown in Figure 59.Figure 63 is to represent The side cutaway view of the schematic configuration of the drive device shown in Figure 59.Figure 64 is for the dynamic of the drive device shown in explanatory diagram 59 The explanatory diagram of work.

Drive device 408 as shown in Figure 59 to Figure 62, with motor 430, axle 432, line slideway 433, install block Portion 434, rail supporting portion 502, cardinal extremity guide rail（Arm）504th, fixed part 506 and rotation section 508.

Motor 430 is the driving source of drive device 408 as shown in Figure 59 to Figure 63, with motor body 550, partially Heart axle 552, bearing 554 and line slideway 556.Motor 430 rotates axle 550a by by motor body 550, so that Rotate eccentric shaft 552.Motor 430 rotates line slideway 556 via eccentric shaft 552 and the transmission revolving force of bearing 554.

Axle 432 as shown in Figure 59 to Figure 63, using the bearing 562,564 being fixed on fixed part, with rotatable state Supported.In addition, bearing 562,564 is propped up using the packing ring 566 linked with axle 432 with the state not moved to vertical Support.

One side end of line slideway 433 is nearby supported on the outer end of line slideway 556 with rotatable state, separately It is fixed near one side end in installation stopper portions 434.In addition, line slideway 433 is propped up with the state that can be rotated around axle 432 Support.Herein, in line slideway 433 and line slideway 556, line slideway 433 turns into rail unit, 556 one-tenth of line slideway It is sliding unit.Thus, line slideway 433 is linked with the transportable state of coupling position and line slideway 556.That is, straight line The change in location that guide rail 433 links with line slideway 556.Using this structure, rotated by making line slideway 556, so that directly Line guide rail 433 is rotated centered on axle 432.

The state that stopper portions 434 are installed can be rotated around axle 432 is supported, and is linked with line slideway 433.Stopper portions are installed 434 and line slideway 433 linked using connecting member 570.It is along the bearing of trend with line slideway 433 to install stopper portions 434 The elongated plate-shaped member that orthogonal horizontal direction is stretched out, end links with rail supporting portion 502.In addition, installing stopper portions 434 The upper surface of the plate-shaped member linked with line slideway 433 links with linking part 436.In addition, install stopper portions 434 with each company The position that knot 436 links, the elongated plate-shaped member identical part that configuration links with line slideway 433, upper surface and company Knot 436 links.Install stopper portions 434 also as shown in Figure 52 to Figure 53, set along vertical extend rod portion, the rod portion and The end of elongated plate-shaped member links.Thus, stopper portions 434 and the elongated plate-shaped member linked with linking part 436 are installed With axle 432 for rotary shaft is integratedly rotated.

Rail supporting portion 502 links with the end for installing stopper portions 434.Cardinal extremity guide rail（Arm）504 side end with Rail supporting portion 502 links, and end side links with guide rail 422.Cardinal extremity guide rail 504 utilizes rail supporting portion 502, will install The rotational motion of stopper portions 434 is transformed to move along a straight line and is transmitted.In addition, cardinal extremity guide rail 504 and the electronics for housing bowl 420 The supply unit of part links, and the electronic unit direction guiding rail 422 for coming will be supplied from collecting bowl 420 and is guided.Fixed part 506 is fixed on drive On the part do not moved i.e. pedestal of dynamic device 408 etc..Rotation section 508 is supported on fixed part 506 with rotatable state.Turn And with the fixing end 520 being supported on fixed part 506 using rotatable state and as cardinal extremity guide rail 504 lead in dynamic portion 508 The movable end 522 of the linking part of rail 422.For rotation section 508, between movable end 522 and cardinal extremity guide rail 504 and guide rail 422 Linking part links, and the moving area to the linking part between cardinal extremity guide rail 504 and guide rail 422 is limited.

Drive device 408 has said structure, and as shown in Figure 64, motor 430 is driving source, is passed to line slideway 433 Pass driving force and rotate.In addition, the state for installing stopper portions 434 can be rotated around axle 432 is fixed, by making line slideway 433 rotations, so as to be rotated centered on the rotary shaft of axle 432.The rotation direction guiding rail supporting part 502 for installing stopper portions 434 is transmitted. The driving force for installing the rotation direction of stopper portions 434 is transformed to rail supporting portion 502 driving force of rectilinear direction, leads cardinal extremity Rail（Arm）504 move back and forth along the direction parallel with the bearing of trend of guide rail.Now, cardinal extremity guide rail 504 and guide rail are arranged on Rotation section 508 on linking part between 422, centered on fixing end 520, makes the company between cardinal extremity guide rail 504 and guide rail 422 Knot is that movable end 522 is rotated.The formation as noted above of drive device 408, by making installation stopper portions 434 and cardinal extremity guide rail 504 vibrations, so that being arranged on the collecting bowl 420 installed in stopper portions 434 via linking part 436 and connecting with cardinal extremity guide rail 504 The guide rail 422 of knot vibrates.Bowl formula feeder unit 400 vibrates collecting bowl 420 by using drive device 408, so that putting Enter to house the electronic unit in bowl 420 to be moved in collecting bowl 420, direction guiding rail 422 is supplied.In addition, bowl formula feeder unit 400 Guide rail 422 is vibrated by using drive device 408, so as to the electronic unit that will be guided in guide rail 422 is to supporting mechanism 424 Supply.

Bowl formula feeder unit 400 is by the collecting bowl by assembly supply device 402,404,406 as noted above along lead Vertical direction stacking, such that it is able to effectively utilize the region of horizontal direction, can configure multiple parts supply dresses with save space Put.Thus, bowl formula feeder unit 400 can supply multiple electronic units to absorption position.In addition, bowl formula feeder unit 400 are laminated the collecting bowl of assembly supply device 402,404,406 along vertical by as noted above, such that it is able to prop up Support mechanism 424 is closely configured with horizontal direction.Thus, it is possible to close to the absorption position of electronic unit, part suction can be reduced The displacement of boarded head when attached.In addition, bowl formula feeder unit 400 is by using 1 drive device 408 as 3 parts The drive division of feedway 402,404,406 is used, and such that it is able to reduce driving source, can make simplified.In addition, logical Cross the rotary shaft of assembly supply device 402,404,406 is supported using fixed part 410, such that it is able to make each several part stabilization Ground vibration.In addition, in the bowl formula feeder unit 400 of above-mentioned implementation method, assembly supply device is set to 3, but not This is defined in, the quantity of assembly supply device is not limited.

In addition, in the present embodiment, used as the drive division of bowl formula feeder unit 400, having used makes collecting bowl 420 shake Dynamic drive mechanism, but it is not limited to this.Constitute the electronic part feeder of bowl formula feeder unit 400（Bowl formula supply Device）As long as can be trembled and the supply electronic unit 80 of direction guiding rail 422 by making collecting bowl 420.For example, as drive division, The drive division that can also swing collecting bowl 420.

Figure 65 is the oblique view that a part for electronic part feeder is amplified and represented.Bowl formula feeder unit 400 Assembly supply device 402,404,406, as shown in Figure 65, whether there is with the end to collecting bowl 420 side in guide rail 422 Initiating terminal sidepiece part detection sensor 580a, 580b, 580c that electronic unit is detected.Initiating terminal sidepiece part detection sensor 580a, 580b, 580c are detected to the end of collecting bowl 420 side in guide rail 422 with the presence or absence of electronic unit.As rise Top sidepiece part detection sensor 580a, 580b, 580c, it is possible to use laser sensor.Bowl formula feeder unit 400 is by profit Whether the end of collecting bowl 420 side in guide rail 422 is deposited with initiating terminal sidepiece part detection sensor 580a, 580b, 580c Detected in electronic unit, be in the state of filling and examine such that it is able to whether be rested on guide rail 422 to electronic unit Survey.For example, detecting the state of electronic unit in certain hour in initiating terminal sidepiece part detection sensor 580a, 580b, 580c In the case of inside persistently detecting, bowl formula feeder unit 400 turns into because electronic unit is stopped at assigned position cannot The state that the front of direction guiding rail 422 is advanced, it is possible to be judged to fill state.

Figure 66 is the oblique view that a part for electronic part feeder is amplified and represented.Bowl formula feeder unit 400 Assembly supply device 402,404,406 as shown in Figure 66, with the front end of guide rail 422（Absorption position, holding position） Holding position sidepiece part detection sensor 582a, 582b, the 582c for whetheing there is that electronic unit detected.Holding position sidepiece part inspection Sensor 582a, 582b, 582c are surveyed to being that whether there is electronic unit at holding position in the front of corresponding guide rail 422 Detected.Holding position sidepiece part detection sensor 582a is the optical profile type sensing with illuminating part 584a and light accepting part 586a Device.Both illuminating part 584a and light accepting part 586a are configured across on the position of holding position.Holding position sidepiece part detection Sensor 582a is detected in mensuration region in the case where the measure light exported from illuminating part 584a is by light accepting part 586a light （It is in the present embodiment holding position）There is no electronic unit.Holding position sidepiece part detection sensor 582a is from illuminating part In the case that the measure light of 584a outputs is not by light accepting part 586a light, detect in mensuration region（In the present embodiment It is holding position）There is electronic unit.In the same manner, holding position sidepiece part detection sensor 582b is also with illuminating part 584b With the optical sensor of light accepting part 586b, holding position sidepiece part detection sensor 582c is also with illuminating part 584c and receives The optical sensor of light portion 586c.Holding position sidepiece part detection sensor 582a, 582b, 582c utilize identical structure pair Electronic unit is whether there is to be detected.Bowl formula feeder unit 400 using holding position sidepiece part detection sensor 582a, 582b, 582c is driven based on testing result to being detected holding position whether there is electronic unit to bowl formula feeder unit 400. Bowl formula feeder unit 400 is for example being judged to holding position using holding position sidepiece part detection sensor 582a, 582b, 582c In the case of putting no electronic unit, drive device 408 is driven, conveys electronic unit.

In addition, electronic component mounting apparatus 10 can also be performed to bowl formula feeder in the suction nozzle 32 using boarded head 15 In the case of the action that the electronic unit of the holding position of unit 400 is kept, passed being detected using holding position sidepiece part In the case that sensor 582a, 582b, 582c detect the situation that there is electronic unit at holding position, perform to holding position The holding that is kept of electronic unit act, using holding position sidepiece part detection sensor 582a, 582b, 582c detections Go out at holding position not having standby in the case of the situation of electronic unit.Thus, electronic component mounting apparatus 10 more can may be used Electronic unit is kept by ground, can suppress to perform the situation of holding action in the case of there is no electronic unit at holding position. Thus, electronic component mounting apparatus can more efficiently perform the holding action of electronic unit.

Figure 67 A are the oblique views that a part for electronic part feeder is amplified and represented.Figure 67 B are from other directions The oblique view of a part for electronic part feeder shown in expression Figure 67 A.Additionally, in Figure 67 A, Figure 67 B, showing a bowl formula The assembly supply device 402 of feeder unit 400, but assembly supply device 404,406 also has identical structure.Part is supplied Device 402 has air supplying part 590, and it is located in the electronic unit for housing bowl 420 and will house the base that bowl 420 and guide rail 422 are connected When holding the end of the side of guide rail 422 of guide rail 504, to vertical upside（The direction of arrow 591）Injection air.Air supplying part 590 The air in the direction of arrow 591 is sprayed by the end of the side of guide rail 422 to cardinal extremity guide rail 504, so that positioned at the electricity of the position Subassembly is returned and houses bowl 420.

Cardinal extremity guide rail 504 is configured with guide portion 592 on the linking part between bowl 420 is housed.Guide portion 592 will from House in the electronic unit that bowl 420 convey to cardinal extremity guide rail 504 is not that the electronic unit of suitable direction is guided to collecting bowl 420. That is, guide portion 592 causes the electronic unit conveyed with inappropriate direction in the electronic unit conveyed to cardinal extremity guide rail 504, Cardinal extremity guide rail 504 will not be entered.Specifically, guide portion 592 is contacted in the lead of the electronic unit of unsuitable direction Plate-shaped member is configured at position, the electronic unit that lead is come in contact is guided to bowl 420 is housed.

In addition, cardinal extremity guide rail 504 is provided with the portion of dropping on the upside of the vertical in the region of the injection air of air supplying part 590 594.The portion 594 that drops is configured in the outside of cardinal extremity guide rail 504（Away from the side for housing bowl 420）, it is provided with towards vertical The rake for housing bowl 420 is moved closer on the upside of direction.The portion 594 that drops utilizes rake, will spray sky by air supplying part 590 Gas and by the electronic unit that is lifted of vertical upside, guided to the side of bowl 420 is housed.Thus, it is possible to suppress electronic unit to The outside for housing bowl 420 flies out.

As shown in Figure 67 A and Figure 67 B, assembly supply device 402 makes to be moved towards guide rail 422 by setting air supplying part 590 Electronic unit return house bowl 420, such that it is able to by electronic unit, suitably direction guiding rail 422 is guided.For example, part supply dress Put 402 regularly to be blown by using air supplying part 590, such that it is able to regularly return the electronic unit for being located at object's position Reclaim and hold bowl 420.Thus, it is possible to will obliquely be conveyed relative to guide rail 422 and not move into the electricity of guide rail 422 in subject area Subassembly is excluded.In addition, assembly supply device 402 can also utilize air supplying part 590, the court that could not will be excluded by guide portion 592 Excluded to inappropriate electronic unit.Additionally, in the present embodiment, as on the cardinal extremity guide rail 504 for making the initiating terminal of guide rail 422 Electronic unit return house bowl 420 mechanism, be provided with air supplying part 590, but be not limited to this.For example, it is also possible to replace Air supplying part 590 and use mechanical mechanism.

Below, the action to each several part of electronic component mounting apparatus is illustrated.Additionally, the electronic unit of the description below Each several part action, can be controlled by the action by control device 20 to each several part and performed.

Using Figure 68 to Figure 74, the shape recognition action to the electronic unit of electronic component mounting apparatus is illustrated.Figure 68 is for illustrating the explanatory diagram that the shape recognition of the electronic unit of electronic component mounting apparatus is acted.Figure 69 is for illustrating electricity The explanatory diagram of the shape recognition action of the electronic unit of subassembly erecting device.Figure 70 is for illustrating electronic component mounting apparatus Electronic unit shape recognition action explanatory diagram.Figure 71 is the shape for illustrating the electronic unit of electronic component mounting apparatus The explanatory diagram of shape identification maneuver.Figure 72 is for illustrating saying for the shape recognition action of the electronic unit of electronic component mounting apparatus Bright figure.Figure 73 is a schematic diagram for example of the testing result for representing identification maneuver.Figure 74 is the detection for representing identification maneuver One schematic diagram of example of result.

Electronic component mounting apparatus 10 are as noted above, and the shape of electronic unit is surveyed using laser identifying device 38 Amount.Laser identifying device 38 as shown in Figure 68, is configured with the state of electronic unit 80 between light source 38a and photo detector 38b Under, laser is exported from light source 38a, the laser for reaching is detected using photo detector 38b, so as to configuring in light source 38a and light The shape of the part between element 38b is detected.In addition, laser identifying device 38 is in the electronic unit to being adsorbed by suction nozzle 32 After the shape in 80 direction is detected, suction nozzle 32 is moved or is rotated using suction nozzle drive division 34, make electronic unit 80 Mobile or rotation, carries out SHAPE DETECTION again.As noted above, laser identifying device 38 is rotated by making electronic unit 80, from And it is as shown in Figure 66 so as to the direction and photo detector 38b of the irradiation laser of electronic unit 80 relative to electronic unit 80 Angle change.

Electronic component mounting apparatus 10 are as shown in Figure 74, used as step S11, the height with the Z-direction of electronic unit 80 It is corresponding, be configured between light source 38a and photo detector 38b in the state of electronic unit 80, by laser identifying device 38 from Light source 38a irradiates laser to certain area.Then, in electronic component mounting apparatus 10, as step S12, the ministry of electronics industry is started The rotation of part 80（The rotation in θ directions）.

Then, electronic component mounting apparatus 10 are after the rotary speed that electronic unit 80 rotates reaches certain speed, as Step S13, starting with laser identifying device 38 carries out the shape measure of regulation direction of electronic unit 80.Now, laser is known Other device 38 is configured with the state of electronic unit 80 between light source 38a and photo detector 38b, from light source 38a to certain area Laser is irradiated in domain, and carries out light to laser using photo detector 38b.Herein, do not had by the laser that electronic unit 80 is intercepted Reach photo detector 38b or intensity decreases.Thus, laser identifying device 38 can be according to swashing by photo detector 38b light The distribution of light, the shape to the electronic unit 80 in the section of the angle for being determined is detected.In the present embodiment, laser The end of the 38 pairs of laser by photo detector 38b light of identifying device detects, to the electronic unit 80 in the direction most Outer shape is detected.In electronic component mounting apparatus 10, as step S14, while electronic unit 80 is rotated, The SHAPE DETECTION of electronic unit 80 is repeated using the method for step S13, so as to the shape for rotating a circle to electronic unit 80 Shape is detected.Thus, it is possible to be detected to the shape in whole directions of electronic unit 80.Laser identifying device 38 is as described above Shown, the shape in the direction to rotating a circle is detected, as shown in Figure 71, the testing result of all directions shape is superimposed, from And can exactly detect the 3D shape of electronic unit 80（The shape of outermost part）.

Herein, as noted above, the electronic component mounting apparatus 10 of present embodiment will be used as radial lead type electronics The electronic unit 80 of part is carried on substrate 8.Electronic component mounting apparatus 10 are in the shape to the electronic unit 80 shown in Figure 72 In the case that shape is detected, the shape difference detected as the height of the Z-direction for measuring is different.That is, electronics The laser identifying device 38 of apparatus for mounting component 10, performs at online A in the case of perform detection, at online B as shown in Figure 72 It is detected in the case of perform detection in the case of detection, at online C in the case of perform detection, at online D to be shaped as Different shape.

For example, if laser identifying device 38 carries out shape measure at the line A shown in Figure 72, as shown in Figure 73, can To detect the shape of the main body 82 of electronic unit 80.In addition, if laser identifying device 38 is carried out at the line B shown in Figure 72 Shape measure, then as shown in Figure 74, can detect the shape of the lead 84 of electronic unit 80.Further, since laser identification dress The shape for putting 38 pairs of outermost parts of the measurement height of electronic unit detects, as electronic unit shape, inspection Measure the outermost part with electronic unit（Outermost lead 84）Related shape.In addition, if laser identifying device 38 Shape measure is carried out at the line C shown in Figure 72, then can detect the shape of the lower surface position of main body 82, if in Figure 72 Shape measure is carried out at shown line D, then can detect the shape of the lower surface position of lead 84.Electronic component mounting apparatus The height of the Z-direction of 10 suction nozzles 32 that electronic unit 80 is adsorbed with by adjustment, such that it is able to make laser identifying device 38 pairs The position that the shape of electronic unit 80 is measured turns into various positions.

Figure 75 is the explanatory diagram for illustrating the identification maneuver of the shape of the electronic unit of electronic component mounting apparatus.Separately Outward, in electronic component mounting apparatus 10, as the electronic unit of radial lead type electronic unit, sometimes using shown in Figure 75 Electronic unit 80a.Electronic unit 80a forms otch 89 in a part of main body 82a.Electronic unit 80a's forms otch 89 part turns into the shape different from other electronic units.In addition, electronic unit 80a can be according to the position for being formed with otch 89 Put and judge direction.

Herein, the control unit 60 of the electronic component mounting apparatus 10 of present embodiment, presets by operating personnel Carry the position of the electronic unit that electronic unit, the i.e. suction nozzle of object is adsorbed（Position in the Z-direction of electronic unit） In the case of, detected using the electronic unit shape of 38 pairs of positions set by operating personnel of laser identifying device.As above Shown in stating, electronic component mounting apparatus 10 are by the way that based on the position set by operating personnel, the shape to electronic unit is surveyed Amount, as measurement position, electronic unit can be more precisely performed such that it is able to using the character shape part of electronic unit The detection of the direction of category identification and electronic unit.

Additionally, carry out the shape recognition of electronic unit using laser identifying device 38 for electronic component mounting apparatus 10 Situation is illustrated, but is not limited to this.In electronic component mounting apparatus 10, as state detecting section, it is also possible to make The camera of three-dimensional measurement is carried out with the electronic unit shape to being supported in framework 11（The VCS units 17 of present embodiment）. In addition it is also possible to use the camera for carrying out three-dimensional measurement known in addition to VCS to electronic unit shape.By using The camera of three-dimensional measurement is carried out to electronic unit shape, interval to the lead leading section of the electronic unit of measure object, is drawn Curved shape, article body shape of line etc. are measured, such that it is able to perform identical treatment.

Figure 76 is a flow chart for example of the action for representing electronic component mounting apparatus.Using Figure 76, to the ministry of electronics industry The outline of the disposed of in its entirety action of part erecting device 10 is illustrated.Additionally, the treatment shown in Figure 76 is by by control device 20 control each several parts actions and perform.In electronic component mounting apparatus 10, as step S52, production routine is read in.It is raw Stages of labor sequence is generated by special production routine generating means, or is given birth to by control device 20 based on the various data being input into Into.

After electronic component mounting apparatus 10 read in production routine in step S52, as step S54, to the state of device Detected.Specifically, to part feed unit 14f, 14r structure, the species of the electronic unit having been filled with, it is ready for Species of suction nozzle etc. is detected.Electronic component mounting apparatus 10 are detected and prepared in step S54 to the state of device After end, as step S56, substrate is moved into.Electronic component mounting apparatus 10 move into substrate in step S56, electric to installing After the position placement substrate of subassembly, as step S58, electronic unit is installed to substrate.Electronic component mounting apparatus 10 exist After the installation of electronic unit terminates in step S58, substrate is taken out of as step S60.Electronic component mounting apparatus 10 are in step After substrate is taken out of in S60, as step S62, whether production is terminated to judge.Electronic component mounting apparatus 10 are in step It is judged to that production is not in S62（It is no）In the case of, into step S56, perform the treatment of step S56 to step S60. That is, the treatment for installing electronic unit to substrate based on production routine is performed.Electronic component mounting apparatus 10 judge in step S62 For production terminates（It is）In the case of, terminate present treatment.

Electronic component mounting apparatus 10 by as described above, reading production routine and after carrying out various settings, to substrate Electronic unit is installed, the substrate of electronic unit is installed such that it is able to produce.In addition, in electronic component mounting apparatus 10, Used as electronic unit, the lead-type electronic-part of the lead that will be connected with main body and with the main body is installed to substrate, specifically Say, by by lead on substrate formed hole（Patchhole）Middle insertion, such that it is able to the electronic unit is installed to substrate.

Figure 77 is an explanatory diagram for example for representing operation screen.Figure 78 is the explanation for the part for representing operation screen Figure.Figure 79 A are an explanatory diagrams for example for representing part feed angle degree.Figure 79 B are an examples for representing part feed angle degree The explanatory diagram of son.Figure 80 is an explanatory diagram for example for representing operation screen.Figure 81 is an example for representing operation screen Explanatory diagram.Figure 82 is the explanatory diagram for the part for representing operation screen.Figure 83 A to Figure 83 D are to represent electronic unit respectively The explanatory diagram for example for locating.

Below, using Figure 77 to Figure 83 D, the various information of the electronic unit to will be installed to electronic component mounting apparatus 10 One example of the treatment for being logged in is illustrated.Electronic component mounting apparatus 10 are based on the letter of the electronic unit after logging in Breath, the various values to the installation process based on production routine are determined, and based on the value after determination, perform the peace of electronic unit Dress.Additionally, the various information of electronic unit can be logged in as a part for production routine, it is also possible to as multiple production journey The information of the shared electronic unit monomer of sequence and log in.

Electronic component mounting apparatus 10 are in display part 42（Touch panel 42a or picture monitor 42b）Upper display Figure 77 Shown operation screen 602.Operation screen 602 shows to various cuits.Operating personnel are by by operation screen Various operations are carried out in the state of 602 displays, such that it is able to be input into the information of electronic unit.Additionally, in Figure 77, show by The picture that the information of electronic unit is input into as parts data, but electronic component mounting apparatus 10 can also input substrate number According to, carry data, adsorpting data, view data.

Operation screen 602 shown in Figure 77 shows the cuit 604 of the component categories for being input into electronic unit and uses In the cuit 606 of input package shape.In addition, operation screen 602 is included：Input is horizontal, long, high comprising electronic unit The project of degree, wire length in interior appearance and size；Selection uses laser in centering mode（Laser identifying device 38）Still Use image（VCS units 17）Project；Input package size（The size of electronic component body）Project etc..Also, in behaviour Make also to be shown in picture 602：Label for showing the detail items of encapsulation shape, centering, additional information, extension, inspection etc.. In addition, in the operation screen 602 of present embodiment, as the detail items of encapsulation shape, being supplied to holding position comprising representing The part of the angle of the electronic unit given provides cuit 608, the cuit of retainer belt species and the expression electricity of angle The cuit of the pitch information of the configuration spacing of subassembly.

Herein, cuit 604 is the project for being input into the species of logged in electronic unit, if options Mesh, then as shown in Figure 78, show the list 610 of options in drop-down menu.In list 610, except various electronic units Species outside, also show the options of insertion part and miscellaneous part.Operating personnel are directed at desired choosing by making cursor 612 Item is selected, operation is determined, such that it is able to be input into information in the cuit 604 to component categories.

In cuit 608, as the part of the angle for representing the electronic unit supplied to the holding position being input into There is provided angle, can select 0 °, 90 °, 180 °, 270 ° or other.For example, being electronics in subject electronic part as shown in Figure 79 A In the case of part 614, the state after electronic unit 614 is rotated by 90 ° every time is respectively 0 °, 90 °, 180 °, 270 ° of attitude.Behaviour Which kind of attitude makees attitude when personnel are supplied based on electronic unit 614 to the holding position of electronic part feeder turns into, and To the input angle of cuit 608.Additionally, the reference position of the angle of electronic unit 614 can be set by operating personnel.

In addition, in electronic component mounting apparatus 10, as shown in Figure 79 B, electronic unit 616 is with relative to retainer belt sometimes The state of 618 inclination predetermined angulars is kept.Herein, electronic unit 616 is thin film capacitor.Operating personnel are in such as ministry of electronics industry Attitude shown in part 616 do not meet 0 °, 90 °, 180 °, in the case of any one in 270 °, the input electronic unit in " other " 616 angle.Herein, it is preferred as suction nozzle 32 in boarded head 15 in the case where being kept to electronic unit 616 Implemented the grasping suction nozzle for keeping using being clamped to electronic unit 616.Electronic component mounting apparatus 10 are inhaled using grasping In the case that mouth keeps to electronic unit 616, provided by the part based on input in " other " to cuit 608 Angle, the angle to suction nozzle is adjusted, and the contact surface such that it is able to make grasping suction nozzle turns into right with the inclination of electronic unit 616 The angle answered, it is possible to reduce keep the generation of mistake.

In electronic component mounting apparatus 10, if in display part 42（Touch panel 42a or picture monitor 42b）On In the state of operation screen 602 shown in display Figure 77, the label of additional information is selected by operating portion 40, then in operation screen Operation screen 620 shown in 602 local display Figure 80.In operation screen 620, comprising the cuit for carrying intrusion 622 and absorption intrusion cuit 624.In addition, operation screen 620 also shows following selection projects：Whether test run is carried out Row, whether confirm part release using sensor, whether carry out the correction of part absorption position, whether perform automatic teaching, be No execution unit is skipped.In addition, going back the discarded project of display unit, it is used to be input into the case that part is discarded（Judge It is in cannot be in the case of the state of installing component）Electronic unit processing method.

Cuit 622 is the project for being set in electronic unit is pressed into from upper surface of base plate size during carrying. " 0 " is to make the distance between electronic unit and substrate as 0 value in design load.In electronic component mounting apparatus 10, if Numerical value becomes big to forward direction, then electronic unit is moved to the state compared with substrate to the press-in of vertical downside.By setting Intrusion, can suppress due to the influence of the flatness etc. of substrate, and be carried in the state of part does not reach substrate, There is the situation for carrying skew or part is slided on solder when carrying.Additionally, in order to by electronic unit more reliably to base Plate is installed, and preferably initial value is set on the occasion of being for example set to 0.5mm.

Cuit 624 is intrusion when part keeps.That is, for being set in the holding position of electronic part feeder Put project of the place by the distance between the suction nozzle and electronic unit in the case of suction nozzle holding electronic unit.During " 0 " is design load Make the distance between maintaining part of electronic unit and suction nozzle for 0 value.In electronic component mounting apparatus 10, if numerical value is to just Xiang Bian great, then make suction nozzle be moved to the state compared with electronic unit to the press-in of vertical downside.By setting intrusion, from And can suppress due to part dimension（Highly）The influence of fluctuation etc. so that suction nozzle cannot reach electronic unit, it is impossible to part The situation adsorbed or grasped, or the electronic unit that chip form occurs such as holds up at the phenomenon.Additionally, in order to more reliably Electronic unit is kept using suction nozzle, preferably initial value is set on the occasion of being for example set to 0.2mm.

In addition, the cuit of the display unit of operation screen 620 layer.The cuit of component layer is in same carrying layer Each part the project that is set of relative importance value.By setting the project, in situation about being produced with optimization order Under, the relative importance value of the carrying order of the electronic unit can be set.

In addition, the cuit of the display clamping suction nozzle data of operation screen 620.Herein, so-called clamping suction nozzle, is grasping And keep the grasping suction nozzle of electronic unit.Pressing position is the position pressed electronic unit in grasping.Horizontal direction Gap is the project in the gap between press surface and part with the affixed side arm of negative input grasping suction nozzle.Suction nozzle during absorption The project in suction nozzle direction when direction is the absorption for being input into during with 0 degree of supply part.Absorption height fine adjusting function value is for being input into Grasping during grasping is highly（Absorption height）Deviant project.

In electronic component mounting apparatus 10, if in display part 42（Touch panel 42a or picture monitor 42b）On In the state of operation screen 602 shown in display Figure 77, selected by the label of 40 pairs of extensions of operating portion, then in operation picture Operation screen 630 shown in the local display Figure 81 in face 602.In operation screen 630, show to being held by laser identifying device 38 The project that the various conditions of the state detection process of capable electronic unit are set.Included in operation screen 630；Setting is inhaled The cuit 634 of the cuit, the cuit of laser elevation 632 and component shape of mouth translational speed.Herein, θ Speed（During measurement）It is the project of the θ axle accelerations for being input into suction nozzle when laser is recognized, θ speed（Outside measurement）It is that input is swashing Rotation after light centering, for example for obtaining carrying the project of the θ axle accelerations of the suction nozzle in the case of the rotation etc. of angle.

Cuit 632 is the project of distance of the input from suction nozzle front end during measurement to coplanar laser illumination.Cuit 634 is the project of the shape of the electronic unit for being input into measure object, as shown in Figure 82, the profit from the list 636 of display options Specified with cursor 638, so that the information of input block shape.By the shape of input block in cuit 634, tool Say the body shape of electronic unit, may thereby determine that is carried out using laser identifying device 38 to the shape of electronic unit body In the case of identification, the characteristic point of the electronic unit is determine whether.For example, be have input without unfilled corner in cuit 634 In the case of, 4 summits are detected.In the case of the electronic unit 640,641 shown in Figure 83 A, respectively to 1 to 4 this 4 Detected the position on individual summit.Thus, it is possible to be detected to position skew, angle skew.In addition, to cuit In the case of having have input unfilled corner in 634,5 to 8 summits are detected.In the situation of the electronic unit 642 shown in Figure 83 B Under, the position to 1 to 6 this 6 summits is detected.In the case of the electronic unit 643 shown in Figure 83 B, to 1 to 8 this 8 Detected the position on summit.Thus, it is possible to be detected to position skew, angle skew.It is input into cuit 634 In the case of PLCC, 8 summits are detected.In the case of the electronic unit 644 shown in Figure 83 C, to 1 to 8 this 8 Detected the position on summit.In addition, in the case of PLCC, 4 points can be used from 8 summits for detecting, align Skew, angle skew is put to be detected.In addition, in the case of have input flexibility in cuit 634, to making XY directions 8 points that component width turns into the vicinity of minimum are detected.It is right in the case of the electronic unit 646,647 shown in Figure 83 D Detected the position of 1 to 8 this 8 points.In the case of the electronic unit 643 shown in Figure 83 D, to 1 to 8 this 8 summits Detected position.Thus, it is possible to be detected to position skew, angle skew.

Electronic component mounting apparatus 10 can be shown to operation screen 602,620,630 etc. with as noted above, be obtained The various information associated with electronic unit.Electronic component mounting apparatus 10 by based on it is acquired associated with electronic unit it is each The information of kind, carries out the installation process of electronic unit, such that it is able to suitably carry electronic unit to substrate.In addition, the ministry of electronics industry Part erecting device 10 is by the suitable no lead of setting without lead electronic unit（Mounting type electronic unit）And with oriented substrate The lead-type electronic-part of the lead of insertion（Insert type electronic unit）Various cuits, such that it is able to perform and each electricity The corresponding treatment of subassembly.For example, in electronic component mounting apparatus 10, as component categories, can be input into and be expressed as inserting Enter the insertion part of type electronic unit.Thus, electronic component mounting apparatus 10 detect by component categories, can be to being Mounting type electronic unit or insert type electronic unit are detected, i.e. to when mounted whether by hole from lead to substrate（Insert Enter hole）Middle insertion（Insertion or carrying）Detected.

Using Figure 84 and Figure 85, the identification maneuver to the shape of electronic unit is illustrated.Figure 84 and Figure 85 are respectively tables Show a flow chart for example of the action of electronic component mounting apparatus.Treatment shown in Figure 84 and Figure 85 is by by control unit 60 control each several parts actions and perform.

Treatment shown in Figure 84 is the treatment set to the position for measuring electronic unit shape.Herein, control unit 60 can carry out the treatment shown in Figure 84 when the shape every time to electronic unit is measured, it is also possible to be carried in opposite substrate When the carrying action of electronic unit is set, performed for whole electronic units, when actual electro part carrying is processed, The result for performing and determining in advance can also be based on（The setting result of measurement position）Carry out shape measure.

Used as step S112, whether control unit 60 pairs has measurement position to be set for judging.Herein, so-called measurement position Setting, refers to the electronic unit for object, information, the above-mentioned behaviour of the position measured to shape set by operating personnel Make the input value of the laser elevation in picture.Control unit 60 is judged to there is setting in step S112（It is）In the case of, as Step S114, the setting measurement position based on setting, i.e. the measurement position set by operating personnel is set as the electronic unit Measurement position, terminate present treatment.In addition, control unit 60 is judged to without setting in step S112（It is no）In the case of, as Step S116, measurement position is set as by reference position, terminates present treatment.Herein, so-called reference position, refers to according to electronics The classification of part, i.e. capacitor or IC chip etc. and set reference measurement site.

Electronic component mounting apparatus 10, can be set by operating personnel with as noted above to measurement position, can be by The position of operating personnel's arbitrarily setting is used as measurement position.In addition, electronic component mounting apparatus 10 can be to 1 electronic unit Measurement position setting is multiple.For example, in the case of radial lead type electronic unit, can be to main body and this 2 positions of lead Shape measure.In addition, electronic component mounting apparatus 10 are in the case where measurement position is set, being obtained based on setting should The information of the shape of the measurement position of electronic unit.Additionally, as the information of shape, it is possible to use recognize dress using laser Put 38 measure after result, it is also possible to using by operating personnel be input into the electronic unit shape data.

Below, the treatment shown in Figure 85 is the treatment before electronic unit is installed, and is the survey of electronic unit shape specifically Amount treatment and the determination processing based on measurement result.Additionally, control unit 60 is directed to the whole electronic unit execution figures to be kept 85 treatment.Used as step S120, control unit 60 obtains the data of the electronic unit of keeping object.Herein, it is so-called to keep right As（Absorption object, grasping object）Electronic unit data, refer to for by the electronic unit on substrate carry needed for Various information.The data of the electronic unit of keeping object are to maintain position, the electronics of the assembly supply device 100 of the electronic unit The absorption of the shape data, electronic unit of part is highly（Keep height）, by laser identifying device 38 electronic unit is surveyed Information of the measurement position of amount etc..

After obtaining data in the step s 120, used as step S122, control unit 60 determines measurement position.That is, control unit 60 Based on the data obtained in step S120, it is determined that the Z axis side of the position detected to the shape of electronic unit, i.e. electronic unit Upward position.Additionally, control unit 60 can also carry out the place of step S120 and step S122 before the absorption of electronic unit Reason.

In the case of measurement position and utilization suction electronic unit are determined in step S122, as step S124, control unit 60 is adjusted to the Z axis position of electronic unit.That is, control unit 60 is moved by making suction nozzle along Z-direction, So that the measurement position of the electronic unit determined in step S122 is moved to the measured zone of laser identifying device 38.Control unit After 60 are adjusted in the step S124 to the Z axis position of electronic unit, used as step S126, the shape to electronic unit is carried out Measurement.That is, using laser identifying device 38, the shape to the measurement position of electronic unit is detected control unit 60.

After control unit 60 is detected in the step S126 to the shape of the measurement position of electronic unit, as step Whether S128, terminate to judge to measurement.That is, the shape measure of measurement position of the control unit 60 to determining in step S122 Whether terminate to be judged.Control unit 60 is judged to that measurement is not in step S128（It is no）In the case of, into step S124, carries out the treatment of step S124 and step S126 again, and the shape of the measurement position being not over to measurement is measured. Control unit 60 by the position adjustment and shape measure that electronic unit is repeated as noted above, so as to set measurement The shape of position is detected.

Control unit 60 is judged to that measurement terminates in step S128（It is）In the case of, as step S130, measurement is tied Fruit and reference data are compared.Herein, reference data is the absorption object of acquirement in step S120（Keeping object）Electricity The data of subassembly shape.Control unit 60 is compared by by measurement result and reference data, so as to the electronics for being adsorbed Whether part is the shape consistent with reference data, and whether the direction of electronic unit is consistent with the direction of reference data etc. is sentenced It is fixed.

After being compared in step s 130, used as step S132, whether control unit 60 is suitably judged part.Tool Say, whether control unit 60 is in step S132 to having adsorbed electronic unit with installable state and judging body.Control unit 60 are judged to that part is inappropriate in step S132（It is no）In the case of, as step S134, the ministry of electronics industry that suction nozzle is adsorbed Part is discarded, and terminates present treatment.Control unit 60 makes boarded head and suction nozzle be moved to the position relative with component storage portion 19, passes through The electronic unit that the suction nozzle is kept is put into component storage portion 19, so as to electronic unit be discarded.Additionally, control unit 60 is again Perform by same loading position from same kind of electronic unit to substrate（Installation site）The treatment of installation.

Control unit 60 is judged to that part is appropriate in step S132（It is）In the case of, as step S136, to part Direction（Direction on the direction of rotation of suction nozzle）Whether suitably judged.That is, to the electronic unit that is adsorbed whether with benchmark Direction identical judged.Additionally, as step S136, the control unit 60 of present embodiment whether electronic unit is inverted into Row judges.Control unit 60 is judged to that direction is inappropriate in step S136, i.e., electronic unit is the state after reversion（It is no）Feelings Under condition, after inverting electronic unit in step S138, into step S140.

In the case that control unit 60 is judged to be in step S136 or in the case of performing the treatment of step S138, As step S140, based on holding position, to the loading position of electronic unit（Installation site）It is finely adjusted.For example, based on electricity The testing result of the shape of subassembly, the position that electronic unit to suction detects, based on holding position relative to The skew of reference position, the relative position of suction nozzle and substrate during to installing is adjusted.Control unit 60 is performing step S140 Treatment after, terminate present treatment.In addition, control unit 60 is the step of Figure 85 is carried out after the treatment of S140, to the electronics for being judged Part is based on the result of step S140 and electronic unit is carried on substrate.

Electronic component mounting apparatus 10 are entered by use laser identifying device 38 as noted above to the shape of electronic unit Row detection, based on as a result, carry out various treatment, such that it is able to more suitably to carrying electronic unit on substrate.

Electronic component mounting apparatus 10 discard electronic unit in S134 the step of the flow chart shown in Figure 85, but also may be used In the case of being judged to that the lead format of electronic unit is unsuitable, to perform the treatment being modified to lead format.That is, Electronic unit can not be discarded in step S134, but the lead of electronic unit is corrected（Processing）It is the shape that can be inserted into Shape, and to loading position（Installation site）Install.In electronic component mounting apparatus 10, it is possible to use electronic part feeder The mechanism for clamping electronic unit of 100 cutting unit, the lead to electronic unit is modified, it is also possible to using in addition The correction mechanism of setting is modified to the lead of electronic unit.It is as noted above, it is processed as the shape to lead Machining cell, it is possible to use the mechanism that is clamped to the main body or lead of electronic unit, the correction mechanism for setting in addition etc. Various units.

Figure 86 is a flow chart for example of the action for representing electronic component mounting apparatus.Below, using Figure 86, to electricity The state of the lead of subassembly（Shape）Identification maneuver illustrate.Additionally, the treatment shown in Figure 86 is part upper with use State the electronic unit identifying processing identical treatment of laser identifying device 38.In electronic component mounting apparatus 10, as step S150, is adjusted to Z axis position, the shape of lead is moved to measurement position.Electronic component mounting apparatus 10 are in step After electronic unit is moved to and is located in S150, as step S152, electronic unit is set to rotate and perform measurement.Additionally, The treatment of step S152 is identical with the treatment of above-mentioned Figure 70.After electronic component mounting apparatus 10 perform measurement in step S152, As step S154, the outermost shape of lead is detected based on measurement result.That is, in measurement position pair and outside The related shape of lead is detected.

After electronic component mounting apparatus 10 are detected in the step S154 to the outermost shape of lead, as step S156, makes the direction of electronic unit rotate to the direction for having set, and is measured with set direction, i.e. with fixed 1 Towards measuring, as step S158, the radical of lead is detected based on measurement result, terminate present treatment.

Herein, Figure 87 A are an explanatory diagrams for example for representing electronic unit.Figure 87 B are the measurement knots for representing lead One explanatory diagram of example of fruit.Figure 88 A are an explanatory diagrams for example for representing electronic unit.Figure 88 B represent lead One explanatory diagram of example of measurement result.In electronic component mounting apparatus 10, for example, carrying out the ministry of electronics industry shown in Figure 87 A In the case that the lead format of part 670 is measured, in step S156, surveyed with the direction to paper fore-and-aft direction irradiation laser Amount.If entering the shape measure of line lead with the direction shown in Figure 87 A, the picture shown in Figure 87 B is detected as measurement result Waveform 673 shown in face 672.Waveform 673 exports reduction at the position that there is lead.Electronic unit 670 has 5 leads. Therefore, waveform 673 goes out the trough that output is reduced in 5 location detections.

Below, in electronic component mounting apparatus 10, surveyed in the lead format for carrying out the electronic unit 671 shown in Figure 88 A In the case of amount, measured with the direction to paper fore-and-aft direction irradiation laser in step S156.If with shown in Figure 88 A Direction enter the shape measure of line lead, detect the waveform 675 shown in the picture 674 shown in Figure 88 B as measurement result.Ripple Shape 675 is exported in the position that there is lead and reduced.Electronic unit 671 has 3 leads.Therefore, waveform 675 is at 3 positions Detect the trough that output is reduced.

It is as noted above, in electronic component mounting apparatus 10, electronic unit is fixed with the direction for specifying, carry out shape Measurement, parses by its result, such that it is able in addition to the outermost shape of electronic unit, also detect to specify Towards the radical of the lead for detecting（The radical of pin）.Electronic component mounting apparatus 10 by carrying out the treatment of Figure 86 so that can So that in addition to the outer shape of electronic unit, the radical also to lead is detected.

Using Figure 89 and Figure 90, illustrate to measure the electronic unit after shape whether be appropriate judgement an example.That is, One example of the treatment performed in the step of to Figure 85 S130, S132 is illustrated.Figure 89 is to represent that electronic unit installs dress One flow chart of example of the action put.Figure 90 is the explanatory diagram for representing the relation between lead and patchhole.Electronic unit Erecting device 10 obtains the outermost shape of the lead of electronic unit as step S160.Additionally, the outermost shape of lead can Detected with the treatment using above-mentioned Figure 86.After electronic component mounting apparatus 10 obtain shape in step S160, as step Rapid S162, to whether consistent with electronic unit to be mounted judging.The characteristic point of the outermost shape of lead is namely be based on, Whether it is that the electronic unit of mounting object judges to the electronic unit of the positive holding of suction nozzle.In addition it is also possible to perform step During the judgement of S162, shape, shape of main body in addition to the outermost shape of lead etc. is compared.

Electronic component mounting apparatus 10 are judged to consistent with electronic unit in step S162（It is）In the case of, into step Rapid S166, be judged to it is inconsistent（It is no）In the case of, into step S169.Electronic component mounting apparatus 10 are in step S162 In the case of being judged to be, as step S166, whether the interval of outermost shape is included in permissible range and is judged. Specifically, the outermost shape of the lead that electronic component mounting apparatus 10 will be detected and the substrate patchhole of insertion lead enter Row compares, and whether the interval to the outermost shape of lead judges in the permissible range at the interval of patchhole.

Below, illustrate to insert electricity respectively in 4 patchholes 682 of the apex to the quadrangle being configured at shown in Figure 90 Permissible range in the case of the lead 684 of subassembly 680.Additionally, in Figure 90, paper above-below direction turns into Y-direction, paper Left and right directions turns into X-direction.Herein, the diameter of patchhole 682 turns into dP, and the diameter of lead 684 turns into dL.In addition, will set The lead 684 of evaluation farthest away from the distance of X-direction that is connected of position be dA, by the lead 684 of design load most Away from the distance of Y-direction that is connected of position be dB.

In the case of the example shown in Figure 90, in design load, it is respectively configured as, makes the center of patchhole 682 and draw The center superposition of line 684.In the case, the higher limit of permissible range turn into by patchhole 682 farthest away from position be connected The distance of knot.That is, the higher limit of X-direction for patchhole 682 X-direction on farthest away from point distance, i.e. dC.Y side To higher limit for patchhole 682 Y-direction on farthest away from point distance, i.e. dD.In addition, the lower limit of permissible range into Be by the case of the closest position inscribe with patchhole 682, lead 684 farthest away from position be connected and Into distance.The lower limit of X-direction for lead 684a X-direction on farthest away from point distance, i.e. dE.The lower limit of Y-direction Be worth in the Y-direction for lead 684b farthest away from point distance, i.e. dF.Additionally, the permissible range shown in Figure 90（Higher limit, Lower limit）It is an example, permissible range can be various settings.For example, it is also possible to will allow for range set be, as long as draw The interval that at least a portion of line is contacted with patchhole.By expanding permissible range, it is possible to reduce discarded electronic unit, By reducing permissible range, the generation of setup error can be suppressed.

During electronic component mounting apparatus 10 are judged to that the interval of outermost shape is included in permissible range in step S166 （It is）In the case of, as step S168, judge that electronic unit, as appropriate, terminates present treatment.Electronic component mounting apparatus 10 exist It is judged to that the interval of outermost shape is not included in permissible range in step S166（It is no）In the case of, sentence in step S162 Be set to it is no in the case of, as step S169, judge electronic unit as inappropriate, terminate present treatment.

Electronic component mounting apparatus 10 detect to the shape of lead, are based on the result judgement electronic unit for detecting It is no appropriate, specifically, to that whether can judge to the insertion that inserts in the hole, such that it is able to by electronic unit more reliably to Substrate is installed.I.e., it is possible to the lead of electronic unit is more reliably inserted to patchhole.Especially, in such as radial direction feeder institute Show, in the case of being configured to supply lead cut-out to holding position using electronic part feeder, because lead is easy Deformation, so easily producing the situation that kept electronic unit cannot be installed.Because electronic component mounting apparatus 10 can be right The state of lead is judged, it is possible to which the electronic unit that suppressing use cannot install carries out the feelings of installation action to substrate Condition, can suppress the situation that electronic unit is stayed on substrate being not inserted into.Thus, can also suppress to make other electronic units Into the situation of baneful influence.Additionally, in the case where the treatment of Figure 89 is performed, being detected in the lead format to electronic unit Figure 86 treatment in, the treatment of step S156, S158 can not also be performed.

Figure 91 is a flow chart for example of the action for representing electronic component mounting apparatus.In Figure 89, it is also possible to After whether the outermost shape based on electronic unit is suitably judged electronic unit, further carry out based on lead radical Judge.In electronic component mounting apparatus 10, as step S160, the outermost shape of the lead of electronic unit is obtained.Electronics After apparatus for mounting component 10 obtains shape in the step S160, as step S162, to whether with electronic unit to be mounted Cause is judged.

Electronic component mounting apparatus 10 are judged to consistent with electronic unit in step S162（It is）In the case of, into step Rapid S163, be judged to it is inconsistent（It is no）In the case of, into step S169.Electronic component mounting apparatus 10 are in step S162 In the case of being judged to be, as step S163, the lead radical of obtaining parts.Additionally, lead radical can also be with outermost Shape is obtained together.In addition, outermost shape, lead radical can also in advance be measured before present treatment.

In the case that electronic component mounting apparatus 10 obtain lead radical in step S163, as step S164, to being It is no consistent with electronic unit to be mounted to be judged.That is, to lead radical whether the lead root with electronic unit to be mounted Number is identical to be judged.Electronic component mounting apparatus 10 are judged to consistent with electronic unit in step S164（It is）Situation Under, into step S166, be judged to it is inconsistent（It is no）In the case of, into step S169.

In the case that electronic component mounting apparatus 10 are judged to be in step S164, as step S166, to outermost Whether the interval of shape is judged in being included in permissible range.Electronic component mounting apparatus 10 are judged to most in step S166 The interval of outer shape is included in permissible range（It is）In the case of, as step S168, electronic unit is judged as appropriate, knot Beam present treatment.Electronic component mounting apparatus 10 are judged to that the interval of outermost shape is not comprised in allowing model in step S166 In enclosing（It is no）In the case of, be judged in step S162, S164 it is no in the case of, as step S169, judge electronic unit It is inappropriate, end present treatment.

Electronic component mounting apparatus 10 are detected and are compared by the radical of the lead to electronic unit, can be with The difference only different electronic unit of lead radical.Thus, detected and to the shape of lead in the outermost shape to lead In the case of being judged, it is also possible to recognize the different electronic unit of lead radical.

Electronic component mounting apparatus 10 are used by the device that the shape as the lead to electronic unit is detected Laser identifying device 38, such that it is able to be detected to lead format with simple treatment.Additionally, in the above-described embodiment, In order to can in a short time be processed, be judged, outermost shape is detected as the shape of lead（Outermost lead Interval）, but it is also possible to detect at the lead interval to other shapes, the diameter of such as lead and in addition to outermost.Separately Outward, electronic component mounting apparatus 10 by using laser identifying device 38, and can use the installation in mounting type electronic unit The middle structure for using, is appropriately performed insert type electronic unit（Lead-type electronic-part）Installation.In addition, in electronic unit peace In assembling device 10, as the device that the lead format to electronic unit is detected, it is also possible to use other devices, such as have The VCS units 17 of camera.Additionally, in the case where VCS units 17 are used, due to from the downside of electronic unit to electronic unit Shape measure, so compared to using can be measured to electronic unit from side, i.e. can be to the position of Z-direction The situation of the laser identifying device 38 measured with the electronic unit of light source 38a, photo detector 38b identicals position is put, is had May process becomes numerous and diverse, precision reduction.

Below, using Figure 92 and Figure 93, the carrying of pair determination electronic unit is sequentially（Erection sequence）Determination action carry out Explanation.The order of the electronic unit comprising insertion in carrying order.Figure 92 is the action for illustrating electronic component mounting apparatus Explanatory diagram.

The electronic component mounting apparatus 10 of present embodiment, have the list shown in Figure 92 as the data of production routine 302.List 302 is the carrying point with substrate（Comprising the point inserted to substrate）The corresponding information and insertion part for carrying layer refers to Fixed information.Herein, so-called carrying layer, the information of the priority used during the carrying order for referring to determination electronic unit, with 1 Numerical value to 7 is set.Herein, for carrying layer, numerical value is smaller to be more judged to carry front, and numerical value is more big more sentences It is set to carrying back.Additionally, it is the value for being considered various information by operating personnel and being set to carry layer.So-called insertion part refers to It is fixed, be represent to carry the electronic unit that is carried on point whether be insertion part project.Additionally, in Figure 92, with "Yes" table Show the carrying point for being appointed as insertion part.Herein, so-called insertion part is primarily referred to as radial lead type electronic unit etc. will draw Line is to the electronic unit for being formed in insertion in the hole on substrate.Additionally, it is also the letter set by operating personnel that insertion part is specified Breath.Therefore, it is judged to the carrying point of insertion part by operating personnel for not relying on the species of electronic unit, will can inserts Enter part specify be set to "Yes".

Electronic component mounting apparatus 10 generate carrying order list 304 using the information of list 302.Herein, carrying In order list 304, the carrying point on the upside of list turns into the carrying point for first carrying electronic unit, and the carrying point on the downside of list turns into The carrying point of electronic unit is carried afterwards.That is, in carrying order list 304, carry electronic unit order sequentially from Top beginning order is represented.Herein, the interior layer of carrying order list 304 is specified by controlling based on carrying layer and insertion part The information of the layer that portion processed 60 determines.Control unit 60 is since the less carrying point of numerical value of interior layer sequentially to carrying electronic unit Carrying point be determined.

Figure 93 is a flow chart for example of the action for representing electronic component mounting apparatus.Treatment shown in Figure 93 is base In an example of the treatment of the generation carrying order of list 302 list 304.Treatment shown in Figure 93 is controlled by by control unit 60 The action of each several part processed and perform.Used as step S200, control unit 60 reads production routine.Device of the control unit 60 from outside Production routine is read, or production routine is read from the storage part of electronic component mounting apparatus 10.Control unit 60 is in step s 200 After reading production routine, as step S202, the information for carrying point n is obtained.Specifically, the carrying layer of carrying point n is obtained The information that information and insertion part are specified.

After control unit 60 obtains the information for carrying point n in step S202, as step S204, to whether carrying point n= Whether the information that insertion part, the i.e. insertion part of carrying point n are specified is that "Yes" is judged.Control unit 60 is in step S204 It is judged to not be to carry point n=insertion parts（It is no）In the case of, as step S206, it is set to interior layer=carrying layer.That is, control The numerical value for carrying layer is set to interior layer by portion processed 60 in the case where the information that the insertion part for carrying point n is specified is not for "Yes" Numerical value.Control unit 60 after the treatment for carrying out step S206, into step S210.Control unit 60 is judged in step S204 Carry point n=insertion parts（It is）In the case of, as step S208, it is set to interior layer=carrying layer+7.That is, control unit 60 In the case where the information that the insertion part for carrying point n is specified is for "Yes", the numerical value obtained after the numerical value for carrying layer is added with 7 It is set to the numerical value of interior layer.Control unit 60 after the treatment for carrying out step S208, into step S210.

Control unit 60 as step S210, is to carrying data after the treatment for carrying out step S206 or step S208 No end, i.e., whether calculate interior layer and judged for all carrying point.Control unit 60 is judged to do not have in step S210 There is end（It is no）In the case of, as step S212, will carry after point n is set to n+1 and enter step S202.That is, by interior layer The carrying point of detection object carries out above-mentioned treatment as next carrying point.

Control unit 60 is judged to terminate in step S210（It is）, i.e. to all carry point interior layers carried out setting In the case of, as step S214, carrying order is determined.That is, control unit 60 is based on set interior layer and various bars Part, it is determined that to the order for carrying point carrying electronic unit.After being determined to carrying order, generation carrying is sequentially for control unit 60 List, terminates present treatment.

As noted above, whether electronic component mounting apparatus 10 can be by operating personnel to being that insertion part is entered by setting The project of row setting, to being set as that the interior layer of carrying point of insertion part carries out certain add operation, such that it is able to make to insert Carried on substrate with entering part back.In addition, whether operating personnel are only by being that insertion part judges, so that it may So that the carrying back of the electronic unit of object.Thus, when the setting of layer is carried, it is not necessary to consider for carrying layer Layer and set electronic unit carrying layer.Thus, it is possible to reduce determine to carry the burden that the operation of layer is caused to operating personnel.

Using Figure 94, the action to the assembly supply device of electronic component mounting apparatus is illustrated.Figure 94 is to represent electricity One flow chart of example of the action of subassembly erecting device.Treatment shown in Figure 94 is by by part supply control part 64 Based on the treatment of control unit 60, the action to each several part of assembly supply device is controlled and performs.Additionally, shown in Figure 94 Treatment be to be configured without starting in the state of electronic unit in holding area.As step S260, part supply control Portion 64 makes 1 amount of spacing of holding Tape movement.That is, part supply control part 64 carries out 1 by making the feeding claw of feeder unit It is secondary to move back and forth or moved along direction of feed, so that keeping 1 amount of spacing of Tape movement.Thus, make in retainer belt main body The electronic unit of holding is moved to holding area.

After part supply control part 64 makes electronic unit be moved to holding area in step S260, as step S262, Will be moved to the lead cut-out of the electronic unit in holding area.That is, part supply control part 64 utilizes cutting unit, by lead The partial cut between article body and retainer belt main body.Part supply control part 64 cuts lead in step S262 Have no progeny, as step S264, maintain clamp position.That is, part supply control part 64 after using cutting unit, lead is cut off, The state of the tooth clamp leads after maintaining by cutting off.

After part supply control part 64 maintains clamp position in the step S264, as step S266, to suction nozzle 32 whether Keep（Absorption is grasped）Electronic unit is judged.Part supply control part 64 is judged to do not have on suction nozzle in step S266 Keep electronic unit（It is no）In the case of, into step S264.Part supply control part 64 is being judged to keep electronics on suction nozzle Before part, the clamp position of electronic unit is maintained.

Part supply control part 64 is judged to keep electronic unit on suction nozzle in step S266（It is）In the case of, as Step S268, discharges electronic unit, that is, release clamp position.Thus, the electronic unit for cutting off lead and from retainer belt separate, profit With suction nozzle to the loading position for specifying（Installation site）It is mobile, and carried on substrate.

After part supply control part 64 discharges electronic unit in step S268, as step S270, to the presence or absence of guarantor Band feeding request is held to be judged.Herein, so-called retainer belt feeding request is to instigate retainer belt to move 1 amount of spacing, is made The request that next electronic unit is moved to holding area.Part supply control part 64 is judged to there is request in step S270 （It is）In the case of, into step S260, above-mentioned treatment is performed again.

Part supply control part 64 is judged to without request in step S270（It is no）In the case of, it is right as step S272 Whether treatment terminates to be judged.Part supply control part 64 is judged to that treatment is not in step S272（It is no）Situation Under, into step S270.In addition, part supply control part 64 is judged to that treatment terminates in step S272（It is）In the case of, Terminate present treatment.

Part supply control part 64 makes electronic unit be moved to holding area as noted above, and lead is cut off and pressed from both sides Hold, after making suction electronic unit, clamped by releasing, such that it is able to make suction nozzle adsorb radial lead with moveable state Type electronic unit.

Figure 95 is a flow chart for example of the action for representing electronic component mounting apparatus.Additionally, the place shown in Figure 95 Reason action is from moving into after substrate to the action carried on substrate electronic unit is completed.In addition, the treatment shown in Figure 95 Action is to be controlled by the action by control unit 60 to each several part and performed.

Used as step S302, control unit 60 moves into substrate.Specifically, control unit 60 will be carried using substrate delivery section 12 The object substrate of electronic unit is conveyed to assigned position.After control unit 60 moves into substrate in step s 302, as step S304, Carry out holding movement.Herein, it is so-called to keep movement（Absorption movement）, it is to instigate holder main body 30 to be moved to suction nozzle 32 and position The treatment action of the relative position of electronic unit 80 in the holding area of part feed unit 14.

After control unit 60 carries out absorption movement in step s 304, as step S306, decline suction nozzle 32.That is, control Portion 60 makes suction nozzle 32 be moved to downwards can keep（Absorption, grasping）The position of electronic unit 80.Control unit 60 is in step After declining suction nozzle 32 in S306, as step S308, part is kept using suction nozzle 32, as step S310, make suction Mouth 32 rises.After control unit 60 makes suction nozzle rise to assigned position in step S310, specifically, move electronic unit 80 To the measurement position of laser identifying device 38, used as step S312, the shape of the electronic unit to being adsorbed by suction nozzle 32 is carried out Detection.After control unit 60 is detected in the step S312 to the shape of electronic unit, as step S314, suction nozzle is set to increase. Additionally, the component shape to step S312 as noted above of control unit 60 is detected, it is judged to that kept electronic unit is In the case of can not carrying, electronic unit is discarded, electronic unit is adsorbed again.Control unit 60 rises to predetermined bits making suction nozzle Postpone, as step S316, carry out carrying movement, i.e. enter to exercise the electronic unit adsorbed from suction nozzle 32 to the carrying with substrate 8 Position（Installation site）The treatment action of relative position movement, as step S318, declines suction nozzle 32, as step S320, carries out component mounting（Part is installed）, i.e. discharged from suction nozzle 32 the treatment action of electronic unit 80, as step Rapid S322, rises suction nozzle 32.That is, control unit 60 performs the treatment action of step S312 to step S320, performs above-mentioned installation Treatment.

In the case that control unit 60 rises suction nozzle in step S322, as step S324, the carrying to whole parts Whether complete, whether the i.e. pre- installation process for orienting the electronic unit carried on substrate 8 has completed to be judged.Control unit 60 It is judged to that the carrying of whole parts has not been completed in step S324（It is no）, i.e. be scheduled for carry electronic unit it is also residual In the case of staying, into step S304, perform and next electronic unit is acted to the treatment carried on substrate 8.Institute as described above Show, control unit 60 is repeated above-mentioned treatment action, untill completing to the whole parts of carrying on substrate.Control unit 60 is in step It is judged to that the carrying of whole parts has been completed in rapid S324（It is）In the case of, terminate present treatment.

Below, using Figure 96, illustrate suction nozzle in assembly supply device 100 keep electronic unit adsorb before and The action of assembly supply device 100 and boarded head 15 afterwards.Figure 96 is of the action for representing electronic component mounting apparatus The flow chart of example.Treatment shown in Figure 96 is to be controlled by the action by control unit 60 to each several part and performed.

Used as step S340, control unit 60 carries out the XY absorption movements of boarded head 15, and starts to make assembly supply device 100 pairs of electronic units are clamped.That is, as step S340, control unit 60 makes boarded head 15 be moved along XY directions, makes suction nozzle 32 Moved to holding area.In addition, electronic unit is configured in holding area of the control unit 60 to assembly supply device 100, and then, will Lead cuts off, as clamp position.

Control unit 60 carries out the treatment of step S340, as step S342, in the holding position mobile end of boarded head 15 In the case of, i.e. after the suction nozzle 32 of boarded head 15 is made to holding area movement, as step S344, to the clamping stand-by period It is compared with the elapsed time, used as step S346, whether to have passed through the stand-by period, i.e. whether the elapsed time is more than or equal to The clamping stand-by period is judged.

Control unit 60 is judged to not by the stand-by period in step S346（It is no）, i.e. the elapsed time less than clamping wait In the case of time, into step S344.Control unit 60 is repeated the treatment of step S344, S346, until through wait when Between untill.

Control unit 60 is judged to have passed through the stand-by period in step S346（It is）In the case of, as step S348, enter The absorption of row Z axis declines.That is, control unit 60 makes suction nozzle that the electronics that can be pointed in holding area is moved to Z-direction downside The position that part is adsorbed.After control unit 60 carries out Z axis absorption decline in step S348, part is carried out in step S350 Absorption, i.e. adsorbed to electronic unit using suction nozzle, as step S352, stand-by period and existing Z axis is released by clamping The stand-by period is compared during decline.Herein, so-called clamping releases the stand-by period, refers to by just by assembly supply device 100 The clamp position of the electronic unit of clamping releases required process time.The stand-by period is boarded head when existing Z axis decline The suction nozzle standby time at the position of absorption electronic unit.Additionally, when existing Z axis decline the stand-by period be set in advance Value, be electronic unit adsorption treatment needed for time.

After control unit 60 is compared in step S352, as step S354, to whether clamp the releasing stand-by period compared with Greatly, whether it is that the clamping of stand-by period ＜ releases the stand-by period and judged when existing Z axis decline.Control unit 60 is in step It is judged to that clamping releases the stand-by period in S354 larger（It is）, when i.e. existing Z axis decline the clamping of stand-by period ＜ release and wait In the case of time, as step S356, with clamp release the stand-by period carry out it is standby, into step S360.In addition, control unit 60 are judged to that the clamping releasing stand-by period is little in step S354（It is no）, i.e. existing Z axis decline when Deng whne Shi Jian≤clamping Release the stand-by period in the case of, as step S358, when being declined with existing Z axis the stand-by period carry out it is standby, into step S360。

Control unit 60, as step S360, carries out the Z axis absorption of boarded head after the treatment for carrying out step S356, S358 Rise and the supply of assembly supply device is acted, terminate present treatment.

Electronic component mounting apparatus 10 are acted by performing treatment shown in Figure 95 and Figure 96, such that it is able to being taken on substrate Carry electronic unit.

Below, using Figure 97 to Figure 98 B, illustrate to be pointed to the holding position of electronic part feeder 100 by suction nozzle Electronic unit kept in the case for the treatment of an example.Figure 97 is the one of the action for representing electronic component mounting apparatus The flow chart of individual example.Figure 98 A are the explanatory diagrams for illustrating the action of electronic component mounting apparatus.Figure 98 B are for illustrating The explanatory diagram of the action of electronic component mounting apparatus.Treatment shown in Figure 97 can be by the control by electronic component mounting apparatus 10 Device processed 20 is controlled and performs to each several part.

In electronic component mounting apparatus 10, used as step S402, the holding for performing electronic unit by suction nozzle is acted.That is, Electronic component mounting apparatus 10 are performed and kept by suction nozzle（Absorption, grasping）Positioned at the electricity of the holding area of electronic part feeder The action of subassembly.After electronic component mounting apparatus 10 perform holding action in step S402, as step S404, to electronics The hold mode of part is detected.Specifically, using laser identifying device 38 or VCS units 17, whether suction nozzle is kept Electronic unit is detected.

After electronic component mounting apparatus 10 are detected to hold mode in step s 404, as step S406, to inhaling Whether mouth keeps electronic unit to be judged.Electronic component mounting apparatus 10 are judged to keep electronic unit in step S406 （It is）In the case of, terminate present treatment.Electronic component mounting apparatus 10 are judged to not keep electronic unit in step S406 （It is no）In the case of, used as step S408, the state to the holding position of electronic part feeder is detected.For example, electric Subassembly erecting device 10 is detected by height sensor 37 to the height of holding position, to whether there is on holding position Electronic unit is detected.In addition it is also possible to be shot by filming apparatus 36 and detected to whetheing there is electronic unit.

After electronic component mounting apparatus 10 are detected in the step S408 to the state of holding position, in step S410 To judging with the presence or absence of electronic unit on holding position.Electronic component mounting apparatus 10 are judged to deposit in step S410 In electronic unit（It is）In the case of, into step S416, it is being judged to no electronic unit（It is no）In the case of, into step S412.Herein, electronic component mounting apparatus 10 are based on the height of the holding position obtained using height sensor 37, to whetheing there is Electronic unit is detected.For example, as shown in Figure 98 A, in the case of there is electronic unit 80 in holding area, holding area Height uprise, as shown in Figure 98 B, in the case of there is no electronic unit 80 in holding area, the height step-down of holding area （Position as retainer belt）.Thus, electronic component mounting apparatus 10 are sentenced in the case where the height of holding area is higher than threshold value It is set to and there is electronic unit, in the case of lower than threshold value, is judged to without electronic unit.

Electronic component mounting apparatus 10 be judged in step S410 it is no in the case of, it is dynamic to feeding as step S412 Make whether number of times is judged more than or equal to threshold number.Herein, so-called feed motion, refers to electronic part feeder 100 actions that are corresponding with the configuration space of electronic unit and being conveyed to retainer belt.The feed motion number of times of step S412 It is the number of times that feed motion is carried out in the state of it cannot adsorb electronic unit.Electronic component mounting apparatus 10 are in step S412 It is judged to that feed motion number of times is more than or equal to threshold number（It is）In the case of, into step S416, it is being judged to that feeding is dynamic It is not greater than or equal to threshold number as number of times（It is no）In the case of, into step S414.

Electronic component mounting apparatus 10 be judged in step S412 it is no in the case of, as step S414, perform holding Band feed motion, into step S402.Electronic component mounting apparatus 10 are judged to yes in step S410 or step S412 In the case of, as step S416 error process, terminate present treatment.Herein, electronic component mounting apparatus 10 are in step In the case of being judged to be in S410, as error handle, notify this case that the excess electron part of holding position.The ministry of electronics industry In the case that part erecting device 10 is judged to be in step S412, as error handle, even if notifying in electronic unit supply The feed motion of certain number of times has been carried out in device 100 cannot also confirm part this case.

It is as noted above, in the case that electronic component mounting apparatus 10 do not have excess electron part on holding position, lead to Cross and retainer belt is conveyed, the holding action of electronic unit is performed again, even if being configured without so as to exist on retainer belt The part of electronic unit, also need not stop device, can proceed the installation of electronic unit.In addition, electronic unit is installed Even if electronic unit of the device 10 after cut-out lead in electronic part feeder 100 be not by suction nozzle holding from holding position In the case of putting movement, when there is no excess electron part on holding position, by proceeding installation action, can be with more efficient Ground is installed by electronic unit.

Figure 99 is an explanatory diagram for example for representing suction nozzle.Figure 100 is the holding action for the suction nozzle of explanatory diagram 99 Explanatory diagram.Figure 99 and Figure 100 are to represent grasping suction nozzle（Clamping suction nozzle）A figure for example.Shown in Figure 99 and Figure 100 Suction nozzle 690 has fixed arm 692 and moveable arm 694.In suction nozzle 690, the fulcrum 695 of moveable arm 694 is with rotatable state It is fixed in the main body of suction nozzle 690, moveable arm 694 can make the part relative with fixed arm 692 from connecing with fulcrum 695 as axle The direction of nearly fixed arm 692 to away from direction move.In moveable arm 694, across fulcrum 695, relative to suction nozzle 690 Main part and with fixed arm 692 close to or away from part opposition side, link drive division 696.Drive division 696 is using drive The driving source of dynamic suction nozzle（Air pressure）And move.Moveable arm 694 by the movement of drive division 696 so that with fixed arm 692 Relative part from close to the direction of fixed arm 692 to away from direction movement.

Suction nozzle 690 exists in the state of electronic unit 80 between fixed arm 692 and moveable arm 694, by making fixed arm The distance between 692 and moveable arm 694 are shortened, such that it is able to grasping electronic unit 80 as shown in Figure 100.

Grasping suction nozzle is not limited to suction nozzle 690, can be variously-shaped.Figure 101 A to Figure 101 D are respectively to represent suction nozzle An explanatory diagram for example.The suction nozzle shown in suction nozzle 690b, Figure 101 C shown in suction nozzle 690a, Figure 101 B shown in Figure 101 A Suction nozzle 690d shown in 690c and Figure 101 D, is respectively the interval between fixed arm and moveable arm and the different suction of movable range Mouth.Therefore, for suction nozzle 690a to suction nozzle 690d, the shape of the electronic unit that can be grasped is different.

Electronic component mounting apparatus 10 correspondingly select to keep the ministry of electronics industry by the species with the electronic unit to be kept The species of the suction nozzle of part, such that it is able to suitably keep electronic unit.Specifically, by corresponding with the electronic unit to be kept Ground selection is to use absorption suction nozzle or using grasping suction nozzle, and to being cut using which suction nozzle in the suction nozzle of various species Change, such that it is able to install a greater variety of electronic units using 1 electronic component mounting apparatus.

Below, using Figure 102, the example that electronic component mounting apparatus install the treatment during electronic unit is entered Row explanation.Figure 102 is a flow chart for example of the action for representing electronic component mounting apparatus.In electronic component mounting apparatus In 10, used as step S450, the electronic unit to being kept by each suction nozzle of boarded head is determined.That is, to next by suction nozzle The species of the electronic unit of holding is determined.

After electronic component mounting apparatus 10 determine electronic unit in step S450, as step S452, to whether there is The replacing of suction nozzle is judged.If electronic component mounting apparatus 10 are judged to no suction nozzle replacing in step S452（It is no）, Then enter step S456.If electronic component mounting apparatus 10 are determined that the replacing of suction nozzle in step S452（It is）, then As step S454, the replacing of suction nozzle is performed.Specifically, electronic component mounting apparatus 10 make boarded head 15 be protected to suction nozzle is changed Hold mechanism 18 to move, the suction nozzle that boarded head is kept is moved to suction nozzle maintaining body 18 is changed, will remain in replacing suction nozzle and protect Hold in mechanism 18 and installed on boarded head at the suction nozzle to be used next time.Electronic component mounting apparatus 10 are utilized and change suction nozzle The suction nozzle that maintaining body 18 will be arranged on boarded head, is the kind for grasping suction nozzle or changing absorption suction nozzle from absorption suction nozzle replacing Class changes the species for grasping suction nozzle.Electronic component mounting apparatus 10 after the treatment for carrying out step S454, or in step Be judged in S452 it is no in the case of, as step S456, perform the holding action of electronic unit, i.e. carry using being arranged on Suction nozzle on first 15, performs the holding action of the electronic unit determined in step S450, terminates present treatment.

Electronic component mounting apparatus 10 as shown in Figure 102, by the species with electronic unit correspondingly and to boarded head institute The suction nozzle of installation is changed, such that it is able to be kept to electronic unit using more appropriate suction nozzle.Further, since can be right Suction nozzle is changed, it is possible to using 1 electronic component mounting apparatus 10 to lead-type electronic-part, mounting type electronic unit Both is suitably kept.Furthermore it is possible to be kept to a greater variety of electronic units.Electronic component mounting apparatus 10 Due to being that lead-type electronic-part, the main part of both mounting type electronic units, the i.e. part without lead are carried out Keep, it is possible to two kinds of electronic units are kept using general suction nozzle.Thus, even if being not provided with protecting lead The Special sucker held, it is also possible to kept to lead-type electronic-part.Further, since the effect above can be obtained, so excellent Select and the main body of lead-type electronic-part is kept, but it is also possible to which the suction nozzle kept to lead is set.

Below, using Figure 103 and Figure 104, to being processed from execution preparation（The setting of production routine, the preparation of each several part, portion Adjustment of part feedway etc.）Illustrated until an example for starting the treatment untill production.Figure 103 is to represent the ministry of electronics industry One flow chart of example of the action of part erecting device.Figure 104 is for illustrating saying for the action of electronic component mounting apparatus Bright figure.Additionally, the treatment of Figure 103 can be performed as temporarily the treatment to starting again at is stopped from production.

In electronic component mounting apparatus 10, as step S460, preparation treatment is performed, as step S462, using electricity The cutting unit of subassembly feedway 100 cuts off the lead of electronic unit, clamps electronic unit.Additionally, step S462 Process and performed as the part treatment of the preparation treatment of step S460.In addition, electronic component mounting apparatus 10 are by the ministry of electronics industry After part clamping, do not kept using boarded head.

Electronic component mounting apparatus 10 after the treatment for performing step S462, as step S464, output information.Specifically Say, the picture 698 shown in Figure 104 is shown as message.In picture 698, display " maintains clamp position" this message with And "Yes" button 699a, "No" button 699b.

Electronic component mounting apparatus 10 show message in step S464, and some in button 699a, 699b is carried out After selecting and determining, as step S466, to whether maintaining clamp position to judge.If electronic component mounting apparatus 10 exist It is judged to not maintain clamp position in step S466（It is no）, that is, have selected button 699b, then as step S467, release clamping shape State, discharges electronic unit, terminates present treatment.In the case, operating personnel reclaim from holding area to electronic unit.This Outward, in the present embodiment, to whether maintaining clamp position to inquire, but it is also possible on the contrary to whether releasing clamp position Inquired.In the case, the corresponding function of "Yes" and "No" is opposite.

If electronic component mounting apparatus 10 are judged to maintain clamp position in step S466（It is）, that is, have selected button 699a, then as step S468, maintain clamp position, as step S469, after production starts, uses the ministry of electronics industry of clamping Part, terminates present treatment.

Electronic component mounting apparatus 10 mesh such as are being adjusted as shown in Figure 103 for the off-position to electronic unit And when being prepared treatment, by the way that the electronic unit of lead will have been cut off after production starts, supplied as the electronic unit 1st electronic unit of device is used, and can mitigate the burden of operating personnel.Specifically, recovery electronic unit can be saved Time, furthermore it is possible to reduce the electronic unit after recovery is inserted to substrate time with hand.

Below, using Figure 105, an example of the treatment that electronic component mounting apparatus 10 are performed when electronic unit is installed Son is illustrated.Figure 105 is a flow chart for example of the action for representing electronic component mounting apparatus.

Used as step S470, the position to installing electronic unit is determined electronic component mounting apparatus 10, used as step S472, the height to installation site is detected.Additionally, the height of the substrate for installation site, can be by height sensor 37 are detected.After electronic component mounting apparatus 10 are detected in step S472 to height, as step S474, to height Whether threshold value is less than or equal to（A reference value）（Boarded head and whether more long than threshold value (a reference value) the distance between locate）Enter Row judges.That is, electronic component mounting apparatus 10 pairs whether do not carried whatever on the position of the installation electronic unit of substrate into Row judges.

Electronic component mounting apparatus 10 are judged to that height is not less than or equal to threshold value in step S474（It is no）, i.e. height In the case of higher than threshold value, it is judged to be equipped with some parts in installation site, error handle is carried out as step S476, ties Beam present treatment.Electronic component mounting apparatus 10 are judged to height less than or equal to threshold value in step S474（It is）In the case of, It is judged in installation site, without any part is carried, as step S478, perform the installation process of electronic unit, terminates this Treatment.

As shown in Figure 105, the substrate height to the position of carrying electronic unit is detected electronic component mounting apparatus 10, In the case where substrate height is higher, by error process, such that it is able to suppress to there is it on the loading position of substrate In the case of the barriers such as his part, the situation of the action that execution is installed to electronic unit.Thus, it is possible to suppress to make base While plate or electronic unit are damaged, electronic unit is installed.Additionally, in Figure 105, in order to treatment can be made to become simple, and The height of substrate is detected using height sensor 37, but it is also possible to using filming apparatus 36 to the installation site on substrate State detected.

Below, using Figure 106, the electronic unit to electronic component mounting apparatus 10 installs one of the treatment action after terminating Individual example is illustrated.Figure 106 is a flow chart for example of the action for representing electronic component mounting apparatus.

In electronic component mounting apparatus 10, as step S480, judge whether the carrying of whole parts terminates, i.e. be It is no to be installed to substrate to all electronic units that substrate is installed based on production routine.Electronic component mounting apparatus 10 exist It is judged to that the carrying of whole parts is not in step S480（It is no）, i.e. exist without carrying electronic unit in the case of, Into step S480.

Electronic component mounting apparatus 10 are judged to that the carrying of whole parts is in step S480（It is）Situation Under, used as step S482, the state to the electronic unit of loading position is detected.Herein, the electronic unit of loading position State can for example be detected by following manner, i.e. the height of each position of substrate is entered using height sensor 37 Row detection, or obtain substrate surface image using filming apparatus 36.

After electronic component mounting apparatus 10 are detected in the step S482 to the state of electronic unit, as step S484, to judging with the presence or absence of the loading position without electronic unit.Electronic component mounting apparatus 10 are passed using height In the case of the testing result of sensor 37, position highly lower than design load is detected existing（The height of such as substrate）Take When carrying position, it is judged to no electronic unit.In addition, electronic component mounting apparatus 10 are using the figure obtained by filming apparatus 36 In the case of as being judged, can be matched and inconsistent situation with the component shape stored as parts data Under, it is judged to no electronic unit.Electronic component mounting apparatus 10 are determined that no electronic unit in step S484 Loading position（It is）In the case of, used as step S486, generation represents the error message of missing part, into step S488.This Outward, electronic component mounting apparatus 10 for all loading positions to judging with the presence or absence of electronic unit, for being judged to not have There are all loading positions of electronic unit, generation represents the error message of missing part.Electronic component mounting apparatus 10 are in step In S484, it is judged in the absence of the loading position without electronic unit（It is no）, i.e., all it is equipped with electronics on all loading positions In the case of part, into step S488.

Electronic component mounting apparatus 10 be judged in step S484 it is no in the case of, or the treatment for performing step S486 In the case of, used as step S488, the loading position to there occurs skew with the presence or absence of electronic unit position judges.Electronics Apparatus for mounting component 10 is occurred in the case of using the testing result of height sensor 37 there is the height compared with design load The position of change（The arrangement of electronic unit）In the case of the loading position detected at the position of skew, it is judged to electronic unit Position skew.In addition, electronic component mounting apparatus 10 are in situation about being judged using the image obtained by filming apparatus 36 Under, can be matched with the component shape stored as parts data, in the situation that component shape is consistent but position is inconsistent Under, it is judged to the position skew of electronic unit.Electronic component mounting apparatus 10 are determined that electronic unit in step S488 Position skew loading position（It is）In the case of, used as step S490, generation represents the error message of position skew, enters Step S492.Additionally, electronic component mounting apparatus 10 are directed to all loading positions, whether the position of electronic unit is offset is carried out Judge, for all loading positions that the position of electronic unit offsets are judged to, generation represents the error message of position skew.Electricity Subassembly erecting device 10 is judged to the loading position offset in the absence of the position of electronic unit in step S488（It is no）, i.e., In the case that the electronic unit of all loading positions is all carried in position, into step S492.

Electronic component mounting apparatus 10 be judged in step S488 it is no in the case of, or the place for performing step S490 In the case of reason, as step S492, to judging with the presence or absence of error detection.That is, to the presence or absence of step S486, step The error message generated in S490 is judged.Electronic component mounting apparatus 10 are determined that the inspection of mistake in step S492 Survey（It is）In the case of, used as step S494, output error message terminates present treatment.That is, electronic component mounting apparatus 10 are exported The error message generated in step S486, step S490.Additionally, as the output intent of error message, it is possible to use various Method.Electronic component mounting apparatus 10 for example can show error message on display part 42.Electronic component mounting apparatus 10 exist It is judged to do not have vicious detection in step S492（It is no）In the case of, terminate present treatment.

As shown in Figure 106, electronic component mounting apparatus 10 after carrying terminates, by whether having carried electronic unit and having entered Row detection, whereby it was confirmed that whether being suitably equipped with electronic unit to substrate.In addition, by by electronic component mounting apparatus 10 are confirmed, it is possible to reduce the man-hour for visually confirming, and can reduce the possibility of the substrate as defective work of production.Separately Outward, by the output error message based on testing result, such that it is able to notify that missing part, position skew etc. are taken to operating personnel Carry bad generation.In addition, the species by notifying the bad produced position of carrying, electronic unit as error message, Can be eliminated before the treatment of next operation is performed and carry bad.Thus, it is possible to improve production efficiency.

Additionally, in Figure 106, using determine object as all boarded parts, but being not limited to this.Electronic unit is installed Device 10 can also only using specific electronic unit as determine object.For example, can be only using lead-type electronic-part as right As, it is also possible to only using radial lead type electronic unit as determine object.Furthermore it is possible to only particular kind of electronic unit is made It is determine object, it is also possible to only using the electronic unit of specific loading position as determine object.

Below, using Figure 107, an example for the treatment of action during to the carrying of electronic unit is illustrated.Figure 107 is Represent a flow chart for example of the action of electronic component mounting apparatus.Electronic component mounting apparatus 10 are every time using carrying When the suction nozzle of head adsorb the action of electronic unit, the treatment of Figure 107 is performed.Additionally, the treatment of Figure 107 is substantially to make Treatment both lead-type electronic-part and mounting type electronic unit are installed to substrate for electronic unit in the case of.In electricity In subassembly erecting device 10, used as step S910, the electronic unit to keeping is determined, as step S912, to keeping Whether the part of object is that lead-type electronic-part is judged.

Electronic component mounting apparatus 10 are judged to lead-type electronic-part in step S912（It is）In the case of, as step Rapid S914, is kept using suction nozzle to the lead-type electronic-part of electronic part feeder.That is, electronic component mounting apparatus 10 utilize suction nozzle to the holding position to electronic part feeder 100,402,404,406 etc.（2nd holding position）Supply Lead-type electronic-part is kept.Electronic component mounting apparatus 10 are in step S914 using suction nozzle to lead-type electronic-part After being kept, as step S916, by the lead of lead-type electronic-part to the insertion that inserts in the hole, and installed to substrate.

Electronic component mounting apparatus 10 are judged to it is not lead-type electronic-part in step S912（It is no）In the case of, make It is step S917, the mounting type electronic unit of electronic part feeder is kept using suction nozzle.That is, electronic unit is installed Device 10 is using suction nozzle to the holding position to electronic part feeder 100a etc.（1st holding position）The mounting type electricity of supply Subassembly is kept.Electronic component mounting apparatus 10 are kept using suction nozzle in step S917 to mounting type electronic unit Afterwards, as step S918, mounting type electronic unit is installed to substrate.That is, electronic component mounting apparatus 10 are not by mounting type electricity Subassembly is inserted to inserting in the hole and installed to substrate.

Electronic component mounting apparatus 10 are performing the treatment of step S916 or step S918, electronic unit are being pacified After dress, used as step S919, whether the installation to all electronic units terminates to judge.Electronic component mounting apparatus 10 are in step It is judged to that installation is not in rapid S919（It is no）In the case of, into step S910, the electronic unit to next installation enters Row determines, to the electronic unit above-mentioned treatment of execution after the determination.If electronic component mounting apparatus 10 are sentenced in step S919 It is set to installation to terminate（It is）, then present treatment is terminated.

Electronic component mounting apparatus 10 are as shown in Figure 107, it is possible to use 1 boarded head is by mounting type electronic unit and lead Type electronic unit is installed to substrate.In addition, electronic component mounting apparatus 10 can utilize same suction nozzle, to the mounting type ministry of electronics industry Both part and lead-type electronic-part are carried.Herein, electronic component mounting apparatus 10 are by the wire type ministry of electronics industry The main body of part is kept（Absorption is grasped）, it is defeated such that it is able to be carried out using same suction nozzle with mounting type electronic unit Send, install.In addition, electronic component mounting apparatus 10 are by being that mounting type electronic unit or lead-type electronic-part are sentenced It is fixed, respectively to being inserted lead to inserting in the hole or being not inserted into switching over, even if so as to utilize identical boarded head Or in the case that identical suction nozzle is installed, it is also possible to installed to substrate with the condition being adapted with each electronic unit.Thus, Suction nozzle need not be changed can just install to mounting type electronic unit and lead-type electronic-part.Further, since can Mix carrying not made a distinction to mounting type electronic unit and lead-type electronic-part, it is possible to make the limit of carrying order System becomes less, can further improve installation effectiveness.

Herein, by being used as lead-type electronic-part, use as noted above is by electronics for electronic component mounting apparatus 10 The radial lead type electronic unit of the supply of assembly supply device 100, such that it is able to more suitably obtain the effect above.Electronic unit Erecting device 10 draws by using suction nozzle to the radial direction after lead is cut into specific length in electronic part feeder 100 Line style electronic unit is kept, and more specifically, suction nozzle holding, conveying is carried out to main body, by lead to the insertion that inserts in the hole, So as to be installed to substrate.As noted above, electronic component mounting apparatus 10 are kept due to the main body to electronic unit, so Wire length can be shortened.In addition, electronic component mounting apparatus 10 are conveyed due to being configured to using retainer belt main body, and Lead is cut off before being kept, it is possible to by the lead of radial lead type electronic unit in order to conveyed and by In the state of after the part removal that retainer belt keeps, installed to substrate.Thus, it is possible to shorten drawing for radial lead type electronic unit Line and to substrate install, can make electronic unit stabilization in the state of to substrate install.Specifically, due to footpath can be shortened To the lead of lead-type electronic-part to substrate install, it is possible to reduce when substrate is installed lead contacted with patchhole and The vibration applied to substrate.Thus, even if being entered to radial direction lead-type electronic-part and mounting type electronic unit with identical operation Row is installed, it is also possible to is reduced and is installed the influence for causing to mutual, even if in identical operation, i.e. is carried using identical Head or identical suction nozzle are continuously installed, it is also possible to suitably two kinds of electronic units are installed.

Herein, the electronic component mounting apparatus 10 of above-mentioned implementation method are configured to, used as part feed unit 14f, tool Have using the bowl formula feeder device 90 of bowl formula feeder, as part feed unit 14r, the ministry of electronics industry with radial direction feeder Part feedway 100, but it is not limited to this.Electronic component mounting apparatus 10 can make part feed unit as various groups Close.For example, it is also possible to the electronic part feeder of bowl formula feeder is set on front side, two part feed units of rear side, The electronic part feeder of radial direction feeder can also be set on front side, two part feed units of rear side.In addition, as above Shown in stating, as part feed unit, it is also possible to comprising the electronics that mounting type electronic unit is supplied using electronic unit retainer belt Assembly supply device（Chip part feeder）100a.Alternatively, it is also possible to by a part feed unit in front side, rear side Electronic part feeder, is all set to electronic part feeder（Chip part feeder）100a.I.e., it is also possible to set For the part feed unit supply lead-type electronic-part in front side, rear side（To the electronic unit that substrate is inserted）, it is another Individual supply is without lead electronic unit（To the electronic unit that substrate is carried）.In addition, in electronic component mounting apparatus, as electronics Apparatus for mounting component, it is also possible to use so-called pellet type feeder.In addition, in electronic component mounting apparatus, as the ministry of electronics industry Part feedway, it is also possible to which, using axial feeder, the axial feeder is in the axialmode electronic unit that will be kept on retainer belt As noted above being cut to of lead expose and be bent in the state of "U" font to substrate lower section is shorter, to holding position Supplied.In the case, electronic component mounting apparatus are utilizing axialmode of the suction nozzle to the holding position of axial feeder After electronic component body is kept, whether lead interval is well differentiated, the good axialmode ministry of electronics industry will be judged to Part is to patchhole（Substrate aperture）Middle insertion.What electronic component mounting apparatus 10 were either supplied by which electronic part feeder Electronic unit, can carry or insert to substrate by being adsorbed to electronic unit or being grasped.Additionally, in supply In the electronic part feeder of lead-type electronic-part, the direction on the upside of the vertical of lead is configured at main body, i.e. draw Line is configured at the direction on the downside of the vertical of main body, by lead-type electronic-part to the holding position for implementing to keep using suction nozzle Supply.Herein, electronic component mounting apparatus 10 preferably as shown in the embodiment, will be supplied with the part of bowl formula feeder Unit, other kinds of electronic part feeder, such as above-mentioned radial direction feeder, above-mentioned axial feeder, mounting type electronics The part feed units such as part retainer belt feeder, rod-type feeder, pellet type feeder, configure via substrate delivery section 12 And relative position, i.e. front side and rear side.Thus, it is possible to suppress bowl vibration of formula feeder supplies list to other kinds of part The situation that unit impacts, it is possible to make the electronics supplied in holding position for other kinds of electronic part feeder The suction nozzle holding effect stabilization of part.

Additionally, in the present embodiment, using part feed unit as part feed unit 14f, 14r the two and carry out Explanation, but quantity do not limit.Alternatively, it is also possible to 2 part feed units 14f, 14r are considered as into 1 part feed unit, Part feed unit 14f, 14r are respectively seen as the 1st part supply unit, the 2nd part supply unit.For example, can be considered as be configured to, 1 part feed unit has bowl formula feeder as shown in above-mentioned implementation method（Part feed unit 14f, the supply of the 1st part Portion）With radial direction feeder（Part feed unit 14r, the 2nd part supply unit）.In the case, the 1st part supply unit and the 2nd Part supply unit, configuration is across substrate allocation position on relative position.Alternatively, it is also possible to be considered as in 1 part supply There is the 1st part supply unit, the 2nd part supply unit on unit 14f.For example, it is as noted above, can be considered as and be configured to, 1 portion Part feed unit 14f has radial direction feeder（1st part supply unit）With chip part feeder（2nd part supply unit）.Such as Shown in above-mentioned, electronic component mounting apparatus 10 can not rely on combination, and use with various electronic part feeders Structure.

Herein, it is the electronic unit that electronic part feeder 100 is supplied as radial direction feeder, existing can be with profit The various radial lead type electronic units of lead are kept with retainer belt.Electronic part feeder 100 can supply such as aluminium electricity Electrolysis condenser, inductor, ceramic capacitor, thin film capacitor etc..In addition, being electronic part feeder as bowl formula feeder 402nd, 404,406 electronic unit for being supplied, the various lead-type electronic-parts that there are package parts.Electronic part feeder 402nd, 404,406 such as solid-state relay, DIP types electronic unit, SIP types electronic unit, connector, transformer can be supplied Deng.

In addition, for the boarded head 15 of present embodiment, in order to a greater variety of electricity can be installed using 1 boarded head Subassembly and in the case that there are multiple suction nozzles, it is possible to use said suction nozzle apparatus for automatic change（It is in the present embodiment logical The boarded head replacing action crossed the combination for changing suction nozzle maintaining body and holder main body and realize）, will be each in production is installed Suction nozzle replacing is various suction nozzles, grasping suction nozzle.Electronic component mounting apparatus 10 according to mounting type electronic unit and wire type Whether whether the corresponding size of electronic unit, weight, article body upper surface have adsorbable plane and can be with grasping part The component conditions such as part main body, for each part, specify the grasping part of the suction nozzle or suitable shape with appropriate absorption aperture The grasping suction nozzle of part, and store in production routine.Electronic component mounting apparatus 10 are based on the ministry of electronics industry stored in production routine Corresponding relation between part and suction nozzle, the suction nozzle to being installed on boarded head is switched over, or to keeping the electricity in boarded head The suction nozzle of subassembly is determined.

As a result, electronic component mounting apparatus 10 for example in substrate installation the electronic unit that will be kept by suction nozzle from carrying In the case that type electronic unit is changed to lead-type electronic-part, produce using identical with the suction nozzle of mounting type electronic unit is kept Suction nozzle situation about being kept to lead-type electronic-part, and lead-type electronic-part is protected using different suction nozzles Situation about holding.Electronic component mounting apparatus 10 in preparatory process or in production, are carried in the case of said suction nozzle difference Electronic unit when changing, using said suction nozzle apparatus for automatic change, automatically change suction nozzle.That is, persistently carry out following Action：When the electronic unit installed to substrate aborning is such as mounting type electronic unit, selection is mutually fitted with the electronic unit The suction nozzle answered（Absorption suction nozzle or grasping suction nozzle）, suction nozzle is moved to positioned at the electronic unit supply dress for supplying the electronic unit Mounting type electronic unit on the holding position put, is kept to electronic unit and is moved to the assigned position of substrate, is made Electronic unit carries out carrying out carrying action while decrease speed is controlled.The electricity of electronic component mounting apparatus 10 in specified quantity The installation of subassembly terminates, identical to suction nozzle to go back when next electronic unit that should be installed is changed into lead-type electronic-part It is that difference is differentiated.Electronic component mounting apparatus 10 in the case of suction nozzle identical is judged to, due to suction nozzle need not be changed, So using identical suction nozzle as the lead-type electronic-part suction nozzle.In addition, electronic component mounting apparatus 10 are being judged to In the case of suction nozzle difference, in the case of the suction nozzle that presence can be used in other suction nozzles installed on boarded head, this is inhaled Mouth as the lead-type electronic-part suction nozzle, in the case of there is no utilizable suction nozzle in other suction nozzles, by upper Suction nozzle apparatus for automatic change is stated, the lead-type electronic-part suction nozzle is automatically replaced by.Electronic component mounting apparatus 10 are at this After calibration gets the suction nozzle of lead-type electronic-part ready, boarded head is moved, the suction nozzle is supplied to lead-type electronic-part and fill The holding position movement put.Electronic component mounting apparatus 10 utilize the electronic part feeder for supplying lead-type electronic-part, To have by built-in shearing device（Cutting unit）From electronic unit band（Electronic unit retainer belt）It is cut in advance shorter The lead-type electronic-part of the lead of specific length, is arranged on holding position.Electronic component mounting apparatus 10 are by using upper State suction nozzle lead-type electronic-part is adsorbed or grasped, so as to be kept, by using detection unit（Laser identification dress Put 38）Lead interval is differentiated, and position skew is differentiated, so that opposite substrate is moved and to patchhole（Base Plate hole）The electronic unit of insertion is screened, to insert in the hole insertion when position offset correction is carried out to lead, and carry out The switching control that decrease speed when making insertion is corresponding with the shearing length of lead and gradually slows down, while being installed.

In addition, boarded head 15 is in the case of with multiple suction nozzles, as long as at least can be to wire type electronics with one Part（Insert type electronic unit）The suction nozzle for kept, carrying, the structure of suction nozzle can use various structures.For example, Boarded head 15 can also make the suction nozzle of a part be the suction nozzle kept to lead-type electronic-part, make remaining suction nozzle be right The suction nozzle that mounting type electronic unit is kept.In the case, electronic component mounting apparatus are electric to mounting type using suction nozzle In the case that subassembly is kept, the mounting type electronic unit is carried out the installation control of substrate carrying, to lead In the case that type electronic unit is kept, enter to be about to the lead-type electronic-part to patchhole（Substrate aperture）The installation of middle insertion Control.In addition, whole suction nozzles can also be set to the suction nozzle kept to lead-type electronic-part by boarded head 15.In addition, Electronic component mounting apparatus 10 are based on production routine, and the absorption suction nozzle of the electronic unit of object is carried to absorption（Or grabbed The grasping suction nozzle held）When being determined, according to the species of electronic unit, the suction nozzle to keeping installing the electronic unit is carried out really It is fixed.Electronic component mounting apparatus 10 are as noted above, multiple suction nozzles that preparation can be installed on a boarded head, by basis Instruction based on production routine, aborning acts suction nozzle apparatus for automatic change, and the suction nozzle that will be arranged on boarded head is removable The electronic unit for being replaced by with unloading and producing next time（The electronic unit of installation）Corresponding suction nozzle, so as to be kept on substrate Insertion lead-type electronic-part, and substrate carrying is carried out by mounting type electronic unit, such that it is able to carry out substrate successively Install.

Below, using Figure 108 and Figure 109, to the electronic component mounting system using above-mentioned electronic component mounting apparatus（Peace Dress system）An example illustrate.Figure 108 is the schematic diagram of the schematic configuration for representing electronic component mounting system.Figure 108 Shown electronic component mounting system（Hereinafter also referred to " installation system "）1 have patterning device 2, reflow treatment device 4, Conveying device 6,7 and electronic component mounting apparatus 10.In installation system 1, with patterning device 2, conveying device 6, electricity Subassembly erecting device 10, conveying device 7, the order of reflow treatment device 4, configure, with conveying substrate to each several part.

Patterning device 2 is to form solder pattern on the surface of substrate, to the dress of the filling solder that inserts in the hole of substrate Put.Reflux 4 is heated to set point of temperature by by substrate, the solder of substrate is melted temporarily, so as to by with solder contact Substrate and electronic unit are bonded.That is, reflux 4 utilizes the solder of pattern, the pattern of the solder that will be formed on the surface of substrate The mounting type electronic unit and substrate bonding of upper installation, lead is inserted into the lead-type electronic-part that inserts in the hole and lead is inserted Enter hole, be bonded using the solder of the filling that inserts in the hole.

Conveying device 6,7 is the device of conveying substrate.Conveying device 6 will be processed and removed in patterning device 2 The substrate for going out, moves into electronic component mounting apparatus 10.Conveying device 7 will be processed and taken out of in electronic component mounting apparatus 10 Substrate, moved into reflow treatment device 4.

Electronic component mounting apparatus 10 are as noted above, and electronic unit is installed to substrate.Herein, electronic unit installs dress 10 are put as electronic unit, lead-type electronic-part can be installed.In addition, electronic component mounting apparatus 10 are used as electronic unit, Both lead-type electronic-part and mounting type electronic unit can also be installed.Installation system 1 is said structure.

Figure 109 is a flow chart for example of the action for representing electronic component mounting system.In installation system 1, make It is step S960, to printing solder on substrate.That is, in installation system 1, as step S960, existed using patterning device The surface of substrate forms the pattern of solder, to the filling solder that inserts in the hole.In installation system 1, to substrate in step S960 After upper printing solder, substrate is moved into electronic component mounting apparatus 10 using conveying device 6, as step S962, using electricity Subassembly erecting device 10 installs lead-type electronic-part and mounting type electronic unit to substrate.In installation system 1, in step After installing electronic unit to substrate in rapid S962, the substrate that will be provided with electronic unit using conveying device 7 is filled to reflow treatment Put 4 to move into, as step S964, perform reflow treatment, terminate present treatment.

It is as noted above in installation system 1, by using electronic component mounting apparatus 10 to lead-type electronic-part with And mounting type electronic unit is installed, such that it is able to utilize 1 reflow treatment, by lead-type electronic-part and mounting type electricity Both subassemblies are fixed on substrate.Thus, in installation system 1, the structure of manufacturing line can be simplified.

In addition, being carried out to lead-type electronic-part and mounting type electronic unit by using electronic component mounting apparatus 10 Install, thus it is as noted above, can be installed in the state of the lead for shortening radial lead type electronic unit.Thus, It is right even if being installed to lead-type electronic-part and mounting type electronic unit in identical operation in installation system 1 Lead-type electronic-part and mounting type electronic unit perform backflow simultaneously, it is also possible to electronic unit suitably is bonded in into substrate On.Thus, it is possible to improve the production efficiency of substrate.

In addition, in electronic component mounting system 1, be pre-charged with or solder-coating by inserting in the hole, so that through The lead after insertion is temporarily fixed at by solder is inserted in the hole, therefore, it can not use current execution, for fixed component And the part for part being bent in substrate back side bends operation, therefore can shorten lead, thus, it is possible in existing substrate In the Special mounting device of insertion, the wire kink device of substrate back side setting is omitted in.Furthermore it is possible to will be in existing electricity Subassembly erecting device（Chip attachment machine）Middle supporting pin utilize, supporting substrate, configures in arbitrary position, using carrying Head carries out substrate carrying and to the insertion that inserts in the hole.

Additionally, for allow installation system 1 shown in Figure 108, Figure 109 obtain the effect above with preferred structure The installation system of electronic component mounting apparatus is not limited to this.For example installation system can also be configured to, with many electronics Apparatus for mounting component 10.In addition, in installation system, it is also possible to which electronic component mounting apparatus 10 are electric as wire type is only installed The erecting device of subassembly is used.In addition, electronic component mounting apparatus 10 can be suitably to install lead-type electronic-part Device, but it is also possible to which the device for being used as temporarily only installing mounting type electronic unit is used.

Claims

1. a kind of electronic component mounting method, in the method, is entered using the holder main body with suction nozzle to electronic unit While row keeps, the holder main body is transferred, electronic unit is installed on substrate,

Characterized in that, having following step：

Mounting type electronic unit supplying step, in this step, mounting type electronic unit is supplied to the 1st holding position；

Radial lead type electronic unit supplying step, in this step, conveys, the electronic unit to electronic unit retainer belt Retainer belt possess main body and the lead linked with the radial direction of the main body multiple radial lead type electronic units, with And to the retainer belt main body that the multiple radial lead type electronic unit is kept, the electronic unit retainer belt is kept The radial lead type electronic unit lead cut-out, radial lead type electronic unit is supplied to the 2nd holding position；

Mounting type electronic unit installation steps, in this step, by using the suction nozzle to supplying to the 1st holding position The mounting type electronic unit put is transferred while holding, is carried on the loading position of the substrate, so as to by institute Mounting type electronic unit is stated to be installed on the substrate；And

Radial lead type electronic unit installation steps, in this step, protect by using the suction nozzle to supplying to the described 2nd The main body for holding the radial lead type electronic unit of position is transferred while holding, by the lead to the base The insertion that inserts in the hole of plate, so as to the radial lead type electronic unit be installed on the substrate,

The electronic component mounting method also has substrate state detecting step, in this step, after carrying the electronic unit The state of the substrate detected, based on the state of the substrate for detecting, to whether by the radial lead type Electronic unit and mounting type electronic unit configuration are judged in installation site.

2. electronic component mounting method according to claim 1, it is characterised in that also have：

Detecting step, in this step, the state of the radial lead type electronic unit to being kept by the suction nozzle is examined Survey；And

Determination step, in this step, based on the radial direction that the suction nozzle detected in the detecting step is kept The state of lead-type electronic-part, the state to the lead of the electronic unit judges,

In the radial lead type electronic unit installation steps, judge in the determination step described in the electronic unit In the case that the state of lead meets condition, by loading position from the electronic unit to the substrate described in insert in the hole it is slotting Enter.

3. electronic component mounting method according to claim 2, it is characterised in that

Also there is recycling step, in this step, the state of the lead of the electronic unit is judged in the determination step In the case of being unsatisfactory for condition, the electronic unit is conveyed to recovering mechanism.

4. the electronic component mounting method according to Claims 2 or 3, it is characterised in that

In the detecting step, by the laser measurement of laser sensor, to the radial lead type electronic unit of measure object Shape measure.

5. electronic component mounting method according to any one of claim 1 to 3, it is characterised in that

In the radial lead type electronic unit supplying step, the radial direction that the electronic unit retainer belt is kept is drawn The lead of line style electronic unit is cut to specific length shortlyer, is supplied to the 2nd holding position.

6. a kind of electronic component mounting apparatus, the boarded head that its utilization is moved in the horizontal plane, will be located at the electronics of holding position Part is transferred and installed on the loading position of substrate,

Characterized in that, having：

Substrate carrying mechanism, it conveys the substrate to the region for carrying the electronic unit；

Radial lead type electronic part feeder, it loads electronic unit retainer belt, and the electronic unit retainer belt possesses Multiple radial lead type electronic units and holding of main body and the lead linked with the radial direction of the main body are the multiple The retainer belt main body of radial lead type electronic unit, the radial lead type electronic part feeder keeps the electronic unit The lead of the radial lead type electronic unit that band is kept cuts off, by radial lead type electronic unit from the retainer belt master Body is separated, and is supplied to holding area；

Mounting type electronic part feeder, its to by the substrate carry and on the substrate install mounting type Electronic unit is supplied；

Holder main body, it has the radial lead type ministry of electronics industry to being supplied from the radial lead type electronic part feeder The suction that the main body of part and the mounting type electronic unit from mounting type electronic part feeder supply are kept successively Mouth, the suction nozzle is driven up and down and rotation driving suction nozzle drive division and the suction nozzle and the suction nozzle are driven The boarded head supporter that portion is supported；And

Control unit, it is to the holder main body, the radial lead type electronic part feeder and the mounting type electricity The action of subassembly feedway is controlled,

The control unit inserts the radial lead type electronic unit kept from the suction nozzle to the substrate, will be by described The mounting type electronic unit that suction nozzle keeps is carried on the substrate,

The electronic component mounting apparatus also have substrate state test section, and it is to carrying the substrate after the electronic unit State detected,

The control unit is based on the state of the substrate detected by the substrate state test section, to the radial lead type Electronic unit and whether the mounting type electronic unit is configured is judged in installation site.

7. electronic component mounting apparatus according to claim 6, it is characterised in that

Also there is unit status test section, the state of its radial lead type electronic unit kept to the suction nozzle is carried out Detection,

The control unit is in the radial lead kept based on the suction nozzle detected by the unit status test section The state of type electronic unit, in the case of judging that the state of the lead of the electronic unit meets condition, by the electronic unit Inserted to the substrate.

8. electronic component mounting apparatus according to claim 7, it is characterised in that

The control unit judge the electronic unit the lead state be unsatisfactory for condition in the case of, by the electronic unit Conveyed to recovering mechanism.

9. electronic component mounting apparatus according to claim 6 or 7, it is characterised in that

The control unit is based on the interval of the patchhole at the interval and the substrate of the lead of the electronic unit, to described Whether the state of the lead of electronic unit meets condition is judged.

10. electronic component mounting apparatus according to claim 7 or 8, it is characterised in that

The unit status test section is laser sensor, and it is configured in the lower section of the boarded head supporter, along horizontal irradiation Laser and the shape of the electronic unit of measure object is measured.

11. electronic component mounting apparatus according to any one of claim 6 to 8, it is characterised in that

Grasping suction nozzle of the suction nozzle comprising the grasping electronic unit.

12. electronic component mounting apparatus according to any one of claim 6 to 8, it is characterised in that

Absorption suction nozzle of the suction nozzle comprising the absorption electronic unit.

13. a kind of electronic component mounting systems, it is characterised in that have：

Patterning device, its to substrate the filling solder that inserts in the hole, and to printing solder on the surface of the substrate Pattern；

The described electronic component mounting apparatus of any one of claim 6 to 8, it is filled to using the patterning device The insertion radial lead type electronic unit that inserts in the hole after solder, is being printed with the table of the pattern of the solder On face, the mounting type electronic unit is installed；And

Reflow treatment device, it using the electronic component mounting apparatus to installing the radial lead type electronic unit and institute State the substrate after mounting type electronic unit to be flowed back, by the radial lead type electronic unit and mounting type electricity Subassembly is welded on the substrate.