CN103249295A

CN103249295A - Electronic part installation method, electronic part installation apparatus and electronic part installation system

Info

Publication number: CN103249295A
Application number: CN2013100500065A
Authority: CN
Inventors: 伊藤直也
Original assignee: Juki Corp
Current assignee: Juki Corp
Priority date: 2012-02-08
Filing date: 2013-02-08
Publication date: 2013-08-14
Anticipated expiration: 2033-02-08
Also published as: CN107148211B; CN107148211A; CN103249295B

Abstract

The invention discloses an electronic part installation method, an electronic part installation apparatus and an electronic part installation system, and the electronic components can be precisely installed in high efficiency. The load type electronic part supplies a first hold position, and transmits an electronic component hold belt; the electronic component hold belt has a plurality of radial lead type electronic components that has a main body and lead that is connected to the main body along radical direction, and has a hold belt main body that holds the plurality of radial lead type electronic components, and cut off the lead that holds the radial lead type electronic components, and supplies a second hold position, then transmit the load type electronic component of the first hold position through a nozzle, then load on the load position of a baseplate; the main body of the radial lead type electronic component are supplied and transmitted to the second hold position through a nozzle at the same time, the lead is inserted into a jack hole of the baseplate and installed thereon.

Description

Electronic component mounting method, electronic component mounting apparatus and electronic component mounting system

Technical field

The present invention relates to a kind ofly utilize suction nozzle to keep electronic unit and move, and with its electronic component mounting method, electronic component mounting apparatus and electronic component mounting system of installing on the substrate.

Background technology

Carry the electronic component mounting apparatus of electronic unit on the substrate, possess the boarded head with suction nozzle, utilize this suction nozzle to keep electronic unit and on substrate, carry.The suction nozzle of electronic component mounting apparatus by making boarded head moves along the direction with the surperficial quadrature of substrate, thereby the parts that are arranged in electronic part feeder are adsorbed, then, make boarded head along relatively mobile with the surperficial parallel direction of substrate, behind the loading position that arrives adsorbed parts, suction nozzle by making boarded head moves near substrate along the direction with the surperficial quadrature of substrate, thereby adsorbed electronic unit is carried on substrate.

As the electronic unit of installing to substrate, the mounting type electronic unit on being equipped on substrate, also there is the lead-type electronic-part of the lead-in wire that has main body and link with main body here.In the present invention, lead-type electronic-part is to insert in the hole that forms at substrate by going between to carry out mounted component.In addition, in the present invention, will be insert in the patchhole (substrate aperture) and not be equipped on electronic unit on the substrate, for example SOP, QFP etc. be as the mounting type electronic unit.As the electronic component mounting apparatus that lead-type electronic-part is installed on the substrate, the device that exists

patent documentation

1 and 2 for example to put down in writing.In patent documentation 1, put down in writing a kind of electronic components mounting machine, it has component assembling machine, this component assembling machine is used for installing following two kinds of electronic units, that is, by the mounting type electronic unit of absorption boarded head absorption and by the clamping of clamping boarded head to the lead-type electronic-part that carries out stickfast (clinch) after substrate inserts.Put down in writing a kind of electronic component mounting apparatus in patent documentation 2, it constitutes the boarded head that the mounting type electronic unit is installed and the insertion boarded head that lead-type electronic-part is installed integratedly.

Patent documentation 1: Japanese kokai publication hei 5-335782 communique

Patent documentation 2: Japanese kokai publication hei 9-83121 communique

Device by using

patent documentation

1 and 2 to put down in writing can carry lead-type electronic-part to substrate.Here, the device that

patent documentation

1 and 2 is put down in writing is to mix to carry special-purpose erecting device, it has the clamping boarded head of the special use that is respectively applied to insert axial lead type electronic unit and the absorption boarded head of the special use that is used for the mounting type electronic unit is carried to substrate integratedly, can the two is installed to substrate with mounting type electronic unit and lead-type electronic-part.Here, special-purpose erecting device is carried in the mixing that

patent documentation

1 and 2 is put down in writing, can't utilize above-mentioned absorption boarded head that lead-type electronic-part is inserted in patchhole (substrate aperture), in addition, can't utilize above-mentioned clamping boarded head that the mounting type electronic unit is carried to substrate.That is, they are devices that boarded head does not have interchangeability at the variety of components of mounting type electronic unit and lead-type electronic-part.Therefore, corresponding and the kind electronic unit that can carry is limited with the kind of boarded head on being installed in erecting device, and owing to have multiple boarded head, so become very expensive device.

Summary of the invention

The present invention In view of the foregoing proposes, its purpose is, provide a kind of can be efficiently and electronic component mounting method, electronic component mounting apparatus and the electronic component mounting system of radial lead type electronic unit and mounting type electronic unit be installed accurately.

The invention provides a kind of electronic component mounting method, electronic component mounting apparatus and electronic component mounting system, they have for the feedway of supplying with, and, not only can utilize a boarded head to keep the mounting type electronic unit and carry out substrate and carry, can also keep and insert to patchhole (substrate aperture) lead-type electronic-part, thereby have interchangeability, therefore, can install a greater variety of electronic units.

In order to solve above-mentioned problem, realize purpose, the invention provides a kind of electronic component mounting method, in the method, when the boarded head main body that utilization has a suction nozzle keeps electronic unit, described boarded head main body is transferred, electronic unit is installed on substrate, be it is characterized in that, have following step: mounting type electronic unit supplying step, in this step, the mounting type electronic unit is supplied with to the 1st holding position; Radial lead type electronic unit supplying step, in this step, the electronic unit retainer belt is carried, this electronic unit retainer belt has a plurality of radial lead type electronic units of the lead-in wire that possesses main body and link with the radial direction of described main body and the retainer belt main body that described a plurality of radial lead type electronic units are kept, the lead-in wire of the described radial lead type electronic unit that described electronic unit retainer belt is kept cuts off, and the radial lead type electronic unit is supplied with to the 2nd holding position; Mounting type electronic unit installation steps, in this step, by when utilizing described suction nozzle that the mounting type electronic unit that is supplied to described the 1st holding position is kept, transferring, on the loading position of described substrate, carry, thereby described mounting type electronic unit is installed on described substrate; And radial lead type electronic unit installation steps, in this step, by when the described main body of utilizing described suction nozzle to the radial lead type electronic unit that is supplied to described the 2nd holding position keeps, transferring, with the insert in the hole insertion of described lead-in wire to described substrate, thereby described radial lead type electronic unit is installed on described substrate.

Preferably also have: detect step, in this step, the state of the described radial lead type electronic unit that kept by described suction nozzle is detected; And determination step, in this step, the state of the described radial lead type electronic unit that keeps based on detected described suction nozzle in described detection step, state to the described lead-in wire of this electronic unit is judged, in described radial lead type electronic unit installation steps, under the situation that the state of the described lead-in wire of the described electronic unit of judgement satisfies condition in described determination step, with described the insert in the hole insertion of this electronic unit to the loading position of described substrate.

In addition, preferably also have recycling step, in this step, under the situation that the state of the described lead-in wire of this electronic unit of judgement does not satisfy condition in described determination step, this electronic unit is carried to recovering mechanism.

In addition, preferably in described detection step, by the laser measurement of laser sensor, the shape of the radial lead type electronic unit of determination object is measured.

In addition, preferably also has substrate state-detection step, in this step, the state that carries the described substrate behind the described electronic unit is detected, based on the state of detected described substrate, described radial lead type electronic unit and described mounting type electronic unit have been configured on the installation site whether and have judged.

In addition, preferably in described radial lead type electronic unit supplying step, the lead-in wire of the described radial lead type electronic unit that described electronic unit retainer belt is kept is cut to specific length shortly, to the supply of described the 2nd holding position.

In order to solve above-mentioned problem, realize purpose, the invention provides a kind of electronic component mounting apparatus, it utilizes at the mobile boarded head of horizontal plane, the electronic unit that will be positioned at the holding position is transferred and is installed on the loading position of substrate, it is characterized in that having: substrate carrying mechanism, it is carried described substrate to the zone of carrying described electronic unit; The radial lead type electronic part feeder, its electronic unit retainer belt of packing into, this electronic unit retainer belt has a plurality of radial lead type electronic units of the lead-in wire that possesses main body and link with the radial direction of described main body and the retainer belt main body that keeps described a plurality of radial lead type electronic units, this radial lead type electronic part feeder cuts off the lead-in wire of the described radial lead type electronic unit that described electronic unit retainer belt keeps, with the radial lead type electronic unit from described retainer belt body portion from, supply with to retaining zone; The mounting type electronic part feeder, it is supplied with the mounting type electronic unit of installing on the described substrate by carrying on described substrate; The boarded head main body, it has suction nozzle that the main body of the radial lead type electronic unit of supplying with from described radial lead type electronic part feeder and the mounting type electronic unit supplied with from described mounting type electronic part feeder are kept successively, described suction nozzle is driven up and down and rotates the suction nozzle drive division of driving and the boarded head supporter that described suction nozzle and described suction nozzle drive division are supported; And control part, its action to described boarded head main body, described radial lead type electronic part feeder and described mounting type electronic part feeder is controlled, described control part will be inserted to described substrate by the described radial lead type electronic unit that described suction nozzle keeps, and will be carried on described substrate by the described mounting type electronic unit that described suction nozzle keeps.

Preferably also has the unit status test section, its state to the described radial lead type electronic unit that described suction nozzle keeps detects, described control part is at the state based on the described radial lead type electronic unit that is kept by the detected described suction nozzle of described unit status test section, judge under the situation that the state of the described lead-in wire of this electronic unit satisfies condition, this electronic unit is inserted to described substrate.

In addition, preferred described control part is carried this electronic unit under the situation that the state of the described lead-in wire of judging this electronic unit does not satisfy condition to recovering mechanism.

In addition, preferred described control part is based on the interval of the patchhole of the interval of the described lead-in wire of described electronic unit and described substrate, whether the state of the described lead-in wire of described electronic unit satisfied condition judge.

In addition, preferred described unit status test section is laser sensor, and it is configured in the below of described boarded head supporter, along horizontal irradiating laser and the shape of the electronic unit of determination object is measured.

In addition, preferably also has substrate state-detection portion, it detects the state that carries the described substrate behind the described electronic unit, described control part is based on the state by the detected described substrate of described substrate state-detection portion, whether described radial lead type electronic unit and described mounting type electronic unit has been configured on the installation site judged.

In addition, preferred described suction nozzle comprises the suction nozzle that grasps that grasps described electronic unit.

In addition, preferred described suction nozzle comprises the absorption suction nozzle that adsorbs described electronic unit.

In order to solve above-mentioned problem, realize purpose, the invention provides a kind of electronic component mounting system, it is characterized in that having: pattern forms device, it is to the filling scolder that inserts in the hole of described substrate, and on the surface of described substrate the pattern of printing solder; The above-mentioned electronic component mounting apparatus that each is put down in writing, it is to the described described radial lead type electronic unit of insertion that inserts in the hole that utilizes after described pattern forms device filling scolder, on the described surface of the pattern that is printed with described scolder, described mounting type electronic unit is installed; And reflow treatment device, it refluxes to the described substrate that utilizes described electronic component mounting apparatus to install behind described radial lead type electronic unit and the described mounting type electronic unit, and described radial lead type electronic unit and described mounting type electronic unit are welded on described substrate.

The effect of invention

The present invention has following effect, that is, and and can be efficiently and radial lead type electronic unit and mounting type electronic unit be installed accurately.

Description of drawings

Fig. 1 is the schematic diagram of the schematic configuration of expression electronic component mounting apparatus.

Fig. 2 is the oblique view of schematic configuration of the framework of expression electronic component mounting apparatus.

Fig. 3 A is the front view of framework shown in Figure 2.

Fig. 3 B is the vertical view of framework shown in Figure 2.

Fig. 3 C is the right side view of framework shown in Figure 2.

Fig. 3 D is the left side view of framework shown in Figure 2.

Fig. 3 E is the rearview of framework shown in Figure 2.

Fig. 4 is the key diagram of schematic configuration of the cover of expression framework.

Fig. 5 is the key diagram of schematic configuration of the lockable mechanism of expression framework.

Fig. 6 is the schematic diagram of the schematic configuration of expression electronic component mounting apparatus.

Fig. 7 is the schematic diagram of the schematic configuration of expression front side receptacle.

Fig. 8 is the schematic diagram of the schematic configuration of expression rear side receptacle.

Fig. 9 is the schematic diagram of schematic configuration of other examples of the parts feed unit of expression rear side.

Figure 10 is the schematic diagram of schematic configuration of the boarded head of expression electronic component mounting apparatus.

Figure 11 is the schematic diagram of schematic configuration of the boarded head of expression electronic component mounting apparatus.

Figure 12 is the schematic diagram of schematic configuration of an example of expression electronic unit retainer belt.

Figure 13 is the schematic diagram of schematic configuration of other examples of expression electronic unit retainer belt.

Figure 14 is the oblique view of schematic configuration of electronic part feeder of the parts feed unit of expression rear side.

Figure 15 is the oblique view of observing electronic part feeder shown in Figure 14 from the direction different with Figure 14.

Figure 16 is the key diagram of schematic configuration of the electronic part feeder of expression parts feed unit.

Figure 17 is the key diagram of schematic configuration of the grip unit of expression electronic part feeder.

Figure 18 is the key diagram of schematic configuration of the feeder unit of expression electronic part feeder.

Figure 19 is the key diagram of schematic configuration of the front end support portion of expression feeder unit.

Figure 20 is the key diagram of schematic configuration of the retainer belt feeding pawl unit of expression feeder unit.

Figure 21 is the key diagram for the action of explanation feeder unit.

Figure 22 is the key diagram of schematic configuration of the cutting unit of expression electronic part feeder.

Figure 23 is the key diagram of schematic configuration of the cutting unit of expression electronic part feeder.

Figure 24 is the key diagram of schematic configuration of the cutting unit of expression electronic part feeder.

Figure 25 is the oblique view of schematic configuration of other examples of expression cutting unit.

Figure 26 is the schematic configuration of cutting unit shown in Figure 25 is observed in expression from other directions oblique view.

Figure 27 is expression cutting unit shown in Figure 25 and the oblique view of the relation between the framework.

Figure 28 is the oblique view of schematic configuration of other examples of expression cutting unit.

Figure 29 is the key diagram for the action of explanation cutting unit shown in Figure 25.

Figure 30 is the key diagram for the action of explanation cutting unit shown in Figure 25.

Figure 31 A is the key diagram of schematic configuration of the maintaining body of expression cutting unit.

Figure 31 B is the key diagram of schematic configuration of other examples of the maintaining body of expression cutting unit.

Figure 32 is the key diagram of schematic configuration of other examples of the feeder unit of expression electronic part feeder.

Figure 33 is the schematic configuration of feeder unit shown in Figure 32 is observed in expression from other directions oblique view.

Figure 34 is the front view of the schematic configuration of expression feeder unit shown in Figure 32.

Figure 35 is the vertical view of the schematic configuration of expression feeder unit shown in Figure 32.

Figure 36 is the front view of schematic configuration of other states of expression feeder unit shown in Figure 32.

Figure 37 is the vertical view of schematic configuration of other states of expression feeder unit shown in Figure 32.

Figure 38 is the key diagram of the schematic configuration of expression feeder unit shown in Figure 32.

Figure 39 is the key diagram of schematic configuration of other states of expression feeder unit shown in Figure 32.

Figure 40 is the key diagram of schematic configuration of the link gear of expression feeder unit shown in Figure 32.

Figure 41 is the key diagram of schematic configuration of other examples of expression framework.

Figure 42 is the key diagram for the action of explanation feeder unit shown in Figure 32.

Figure 43 is the key diagram for the action of explanation feeder unit shown in Figure 32.

Figure 44 is the key diagram of schematic configuration of other examples of expression assembly supply device.

Figure 45 is the key diagram that the part of Figure 44 is amplified expression.

Figure 46 is the key diagram of schematic configuration of other examples of expression assembly supply device.

Figure 47 is the key diagram that the part of Figure 46 is amplified expression.

Figure 48 is the key diagram of schematic configuration of other examples of expression assembly supply device.

Figure 49 is the key diagram that the part of Figure 48 is amplified expression.

Figure 50 is the oblique view of the schematic configuration of expression bowl formula feeder assembly.

Figure 51 is the oblique view of the schematic configuration of expression bowl formula feeder assembly shown in Figure 50.

Figure 52 is the end view of other examples of expression parts feed unit.

Figure 53 is the vertical view of other examples of expression parts feed unit.

Figure 54 is expression will be accommodated the state after bowl is dismantled from the parts feed unit shown in Figure 52 end view.

Figure 55 is the key diagram of the relation between the support portion of accommodating bowl and vibration section of electronic part feeder of the parts feed unit of expression shown in Figure 53.

Figure 56 is the key diagram of the schematic configuration of accommodating bowl shown in expression Figure 55.

Figure 57 A is the oblique view of schematic configuration of supporting mechanism of the electronic part feeder of the parts feed unit of expression shown in Figure 53.

Figure 57 B is the front view of the schematic configuration of the supporting mechanism shown in the presentation graphs 57A.

Figure 58 A is the oblique view of other states of the supporting mechanism shown in the presentation graphs 57A.

Figure 58 B is the front view of the schematic configuration of the supporting mechanism shown in the presentation graphs 58A.

Figure 59 is the vertical view of schematic configuration of the drive unit of the parts feed unit of expression shown in Figure 53.

Figure 60 is the oblique view of the schematic configuration of the drive unit shown in expression Figure 59.

Figure 61 is the amplification plan view that the schematic configuration of the drive unit shown in Figure 59 is amplified expression.

Figure 62 is the end view of the schematic configuration of the drive unit shown in expression Figure 59.

Figure 63 is the side cutaway view of the schematic configuration of the drive unit shown in expression Figure 59.

Figure 64 is the key diagram for the action of the drive unit shown in explanation Figure 59.

Figure 65 is the oblique view that the part of electronic part feeder is amplified expression.

Figure 66 is the oblique view that the part of electronic part feeder is amplified expression.

Figure 67 A is the oblique view that the part of electronic part feeder is amplified expression.

Figure 67 B is the oblique view from the part of the electronic part feeder shown in other direction indications Figure 67 A.

Figure 68 is the key diagram for the identification maneuver of the shape of the electronic unit of explanation electronic component mounting apparatus.

Figure 69 is the key diagram for the identification maneuver of the shape of the electronic unit of explanation electronic component mounting apparatus.

Figure 70 is the key diagram for the identification maneuver of the shape of the electronic unit of explanation electronic component mounting apparatus.

Figure 71 is the key diagram for the identification maneuver of the shape of the electronic unit of explanation electronic component mounting apparatus.

Figure 72 is the key diagram for the identification maneuver of the shape of the electronic unit of explanation electronic component mounting apparatus.

Figure 73 is the schematic diagram of an example of the testing result of expression identification maneuver.

Figure 74 is the schematic diagram of an example of the testing result of expression identification maneuver.

Figure 75 is the key diagram for the identification maneuver of the shape of the electronic unit of explanation electronic component mounting apparatus.

Figure 76 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Figure 77 is the key diagram of an example of expression operation screen.

Figure 78 is the key diagram of the part of expression operation screen.

Figure 79 A is the key diagram that the expression parts are supplied with an example of angle.

Figure 79 B is the key diagram that the expression parts are supplied with an example of angle.

Figure 80 is the key diagram of an example of expression operation screen.

Figure 81 is the key diagram of an example of expression operation screen.

Figure 82 is the key diagram of the part of expression operation screen.

Figure 83 A is the key diagram of an example that locates of expression electronic unit.

Figure 83 B is the key diagram of an example that locates of expression electronic unit.

Figure 83 C is the key diagram of an example that locates of expression electronic unit.

Figure 83 D is the key diagram of an example that locates of expression electronic unit.

Figure 84 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Figure 85 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Figure 86 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Figure 87 A is the key diagram of an example of expression electronic unit.

Figure 87 B is the key diagram of an example of the measurement result of expression lead-in wire.

Figure 88 A is the key diagram of an example of expression electronic unit.

Figure 88 B is the key diagram of an example of the measurement result of expression lead-in wire.

Figure 89 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Figure 90 is the key diagram of the relation between expression lead-in wire and the patchhole.

Figure 91 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Figure 92 is the key diagram for the action of explanation electronic component mounting apparatus.

Figure 93 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Figure 94 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Figure 95 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Figure 96 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Figure 97 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Figure 98 A is the key diagram for the action of explanation electronic component mounting apparatus.

Figure 98 B is the key diagram for the action of explanation electronic component mounting apparatus.

Figure 99 is the key diagram of an example of expression suction nozzle.

Figure 100 is the key diagram for the maintenance action of the suction nozzle of explanation Figure 99.

Figure 101 A is the key diagram of an example of expression suction nozzle.

Figure 101 B is the key diagram of an example of expression suction nozzle.

Figure 101 C is the key diagram of an example of expression suction nozzle.

Figure 101 D is the key diagram of an example of expression suction nozzle.

Figure 102 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Figure 103 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Figure 104 is the key diagram for the action of explanation electronic component mounting apparatus.

Figure 105 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Figure 106 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Figure 107 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Figure 108 is the schematic diagram of the schematic configuration of expression electronic component mounting system.

Figure 109 is the flow chart of an example of the action of expression electronic component mounting system.

The explanation of symbol

1 installation system, 2 patterns form device, 4 reflow treatment devices, 6,7 conveying devices, 8 substrates, 10 electronic component mounting apparatus, 11 frameworks, the 11a main body, 11b, 11f, the 11r cover, the 11c opening, 11d covers the support portion, the 11e lockable mechanism, 12 substrate delivery section, 14,14f, 14r parts feed unit, 15 boarded heads, 16XY travel mechanism, the 17VCS unit, 18 change suction nozzle maintaining body, 19 parts reservoir, 20 control device, 22X axle drive division, 24Y axle drive division, 30 boarded head main bodys, 31 boarded head supporters, 32 suction nozzles, 34 suction nozzle drive divisions, 38 laser recognition devices, 40 operating portions, 42 display parts, 44 front side receptacles, 46 rear side receptacles, 48,49 connectors, 60 control parts, 62 boarded head control parts, 64 parts supply control parts, 70 electronic unit retainer belts, 72 retainer belt main bodys, 80 electronic units, 82 main bodys (electronic unit main body), 84 lead-in wires, 90 bowls of formula feeder assemblys, 100,100a, 200,402,404,406 electronic part feeders, 102 brace tables, 110 frameworks, 112 grip unit, 114 feeder units, 116, the 116a cutting unit, 118 air pressure adjustment parts, 120 guiding grooves, 302 tabulations, 304 carry sequential list, 400 accommodate a bowl feeder unit, 408 drive units, 410 fixed parts, 420,420a, 420b, 420c accommodates bowl, 422,422a, 422b, the 422c guide rail, 424,424a, 424b, the 424c supporting mechanism, 426,426a, 426b, the 426c linking part, 580a, 580b, 580c initiating terminal side component detecting sensor, 582a, 582b, 582c holding position side component detecting sensor, 590 air supplying part

Embodiment

Below, with reference to accompanying drawing, the present invention is described in detail.In addition, the present invention and can't help followingly to limit be used to the mode that carries out an invention (hereinafter referred to as execution mode).In addition, in the inscape in following execution mode, comprise the key element in key element that those skilled in the art can expect easily, the identical in fact so-called equivalency range such as key element.In addition, disclosed inscape can appropriate combination in following execution mode.

Below, based on accompanying drawing, the execution mode of electronic component mounting apparatus involved in the present invention and electronic component mounting method is elaborated.In addition, the present invention is not limited by present embodiment.Fig. 1 is the schematic diagram of the schematic configuration of expression electronic component mounting apparatus.

Electronic component mounting apparatus 10 shown in Figure 1 is the devices that carry electronic unit on substrate 8.Electronic component mounting apparatus 10 has: framework 11, substrate delivery section 12, parts feed

unit

14f, 14r, boarded head 15, XY travel mechanism 16, VCS unit 17, replacing suction nozzle maintaining body 18, parts reservoir 19, control device 20, operating portion 40 and display part 42.In addition, XY travel mechanism 16 has X-axis drive division 22 and Y-axis drive division 24.Here, the electronic component mounting apparatus 10 of present embodiment as shown in Figure 1, centered by substrate delivery section 12 and have parts feed

unit

14f, 14r respectively in front side and rear side.In electronic component mounting apparatus 10, parts feed unit 14f is configured in the front side of electronic component mounting apparatus 10, and parts feed unit 14r is configured in the rear side of electronic component mounting apparatus 10.In addition, under the situation of not distinguishing 2 parts feed

unit

14f, 14r especially, be referred to as parts feed unit 14 below.

Fig. 2 is the oblique view of schematic configuration of the framework of expression electronic component mounting apparatus.Fig. 3 A is the front view of framework shown in Figure 2.Fig. 3 B is the vertical view of framework shown in Figure 2.Fig. 3 C is the right side view of framework shown in Figure 2.Fig. 3 D is the left side view of framework shown in Figure 2.Fig. 3 E is the rearview of framework shown in Figure 2.Fig. 4 is the key diagram of schematic configuration of the cover of expression framework.Fig. 5 is the key diagram of schematic configuration of the lockable mechanism of expression framework.In addition, in Fig. 3 A to Fig. 3 E, omit the diagram of parts feed

unit

14f, 14r, to be easier to illustrate framework 11 with understanding.

Framework 11 has main body 11a and cover 11bf, 11br shown in Fig. 3 A to Fig. 3 E.Main body 11a is the casing of accommodating the each several part that constitutes electronic component mounting apparatus 10.Main body 11a forms cover 11br, rear side receptacle 46 and connector 49 at front side configuration cover 11bf, operating portion 40, display part 42, front side receptacle 44 and connector 48 at rear side.Main body 11a forms 2 opening 11c respectively on 2 sides, they are used for substrate 8 is moved into and discharged in device.The operating portion 40 of present embodiment has keyboard 40a and mouse 40b.The display part 42 of present embodiment has touch panel 42a and picture monitor 42b.In addition, touch panel 42a also becomes the part of operating portion 40.Front side receptacle 44 and rear side receptacle 46 are respectively the parts that parts feed

unit

14f, 14r are supported.The detailed construction of front side receptacle 44 and rear side receptacle 46 is recorded and narrated in the back.Connector 48 is connected with the distribution of the each several part of parts feed unit 14f described later.In addition, connector 49 is connected with the distribution of the each several part of parts feed unit 14r described later.As distribution, have the distribution and the air fed pipeline that transmit electric signal here.

Below, 11bf, 11br describe to cover.In addition, only allocation position is different with the rear side this point in the front side for cover 11bf, 11br, and structure is identical.Below, under situation about not distinguishing especially, be called cover 11b and describe.Cover 11bf is the coaming plate that the part in the front side of main body 11a arranges, and is configured in the vertical upside.Cover 11br is the coaming plate that the part at the rear side of main body 11a arranges, and is configured in the vertical upside.Cover 11b has the shape of the part of the part at the front of main body covered 11a or the back side and upper surface, and section becomes L word shape.Cover 11b can open and close with respect to main body 11a as shown in Figure 4.By making cover 11b become open mode, can carry out operation to the each several part that is configured in main body 11a inside.Front end and the main body 11a of the upper surface of cover 11b link, and are that fulcrum rotates with the linking portion.In addition, cover 11b is supported by cover support portion 11d.Cover support portion 11d is the bar-like member that stretches, and a side end and main body 11a link, and end side links with cover 11b.Cover support portion 11d stretches accordingly with the switching of cover 11b.In addition, cover support portion 11d is provided with lockable mechanism 11e, and it will cover the flexible locking of support portion 11d.Lockable mechanism 11e makes cover support portion 11d become the state that can't stretch by becoming lockup state, by becoming released state, makes cover support portion 11d become the state that can stretch.If lockable mechanism 11e becomes lockup state, then cover 11b and be fixed on current location.Thus, the cover 11b that can suppress open mode closes because of deadweight.

Get back to Fig. 1, continue electronic component mounting apparatus 10 is described.Substrate 8 is so long as be used for to carry the parts of electronic unit and get final product, and its structure is restriction especially.The substrate 8 of present embodiment is plate-shaped member, and the surface is provided with Wiring pattern.On the surface that is arranged at the Wiring pattern on the substrate 8, adhere to the scolder of the attachment that engage as the Wiring pattern and the electronic unit that utilize backflow with plate-shaped member.In addition, on substrate 8, also be formed for inserting the through hole (patchhole, substrate aperture) of electronic unit.

Substrate delivery section 12 is conveying mechanisms that substrate 8 is carried along X-direction among the figure.Substrate delivery section 12 has: along the guide rail of X-direction extension; And conveying mechanism, it supports substrate 8, and substrate 8 is moved along guide rail.Substrate delivery section 12 so that the lift-launch object face of substrate 8 and boarded head 15 relative towards, utilize conveying mechanism that substrate 8 is moved along guide rail, thereby substrate 8 carried along X-direction.Substrate delivery section 12 will be supplied with the substrate 8 of coming by the equipment of supplying with to electronic component mounting apparatus 10, be delivered to the assigned position on the guide rail.Boarded head 15 carries electronic unit in the afore mentioned rules position to the surface of substrate 8.Substrate delivery section 12 is carried substrate 8 after carrying electronic unit to the substrate 8 that is delivered to the afore mentioned rules position to the device place that carries out next operation.In addition, as the conveying mechanism of substrate delivery section 12, can use various structures.For example, can use the conveying mechanism with the integrated conveyer belt mode of conveying mechanism, in the conveying mechanism of this mode, will be along the guide rail of the throughput direction of substrate 8 configuration with along the endless belt combination of above-mentioned guide rail rotation, in that being carried, under the state on the above-mentioned endless belt, carrying by substrate 8.

Fig. 6 is the schematic diagram of the schematic configuration of expression electronic component mounting apparatus.Fig. 7 is the schematic diagram of the schematic configuration of expression front side receptacle.Fig. 8 is the schematic diagram of the schematic configuration of expression rear side receptacle.Electronic component mounting apparatus 10 as shown in Figure 6, at front side arrangement components feed unit 14f, at rear side arrangement components feed unit 14r.The parts feed unit 14r of the parts feed unit 14f of front side and rear side has electronic part feeder respectively, their keep a plurality of electronic units that carry on the substrate 8, as shown in Figure 6, can supply with to boarded head 15, that is, can supply with electronic unit to the holding position with the state that is kept (adsorb or grasp) by boarded head 15.Parts feed unit 14f, the 14r of present embodiment all supplies with the lead-type electronic-part of the lead-in wire that has main body and link with main body.

The parts feed unit 14f of front side has 2 bowl formula feeder assemblys 90.Bowl formula feeder assembly 90 has a plurality of assembly supply devices as bowl formula feeders, from each assembly supply device to the holding position (absorption position grasps the position) supply with electronic unit.Be supplied to the electronic unit of holding position by each assembly supply device, install to substrate 8 by boarded head 15.For bowl formula feeder assembly 90, record and narrate in the back.

2 bowl formula feeder assemblys 90 of parts feed unit 14f are arranged on the front side receptacle 44.As shown in Figure 7, front side receptacle 44 has supporting bracket 44a.Supporting bracket 44a is fixed on the assigned position place of main body 11a inside by bolt etc.Supporting bracket 44a supports 2 bowl formula feeder assemblys 90.The end of substrate delivery section 12 sides of supporting bracket 44a disposes locating shaft 44b.Locating shaft 44b supports bowl formula feeder assembly 90, and bowl formula feeder assembly 90 is positioned.In addition, on the end of supporting bracket 44a and opposition sides substrate delivery section 12 sides, be formed with 2 recess 44c.Recess 44c also makes the part of bowl formula feeder assembly 90 insert respectively, and bowl formula feeder assembly 90 is positioned.

The parts feed unit 14r of rear side has a plurality of electronic part feeders (being designated hereinafter simply as " assembly supply device ") 100.Electronic part feeder 100 is feeders radially, and (absorption position, grasp the position) supplies with electronic unit to the holding position.Be supplied to the electronic unit of holding position by each assembly supply device 100, install to substrate 8 by boarded head 15.

Assembly supply device 100 uses the electronic unit retainer belt that constitutes at the lead-in wire of a plurality of radial lead type electronic units of retainer belt stickup, supplies with the radial lead type electronic units to boarded head 15.Assembly supply device 100 is retainer belt feeders, it keeps the electronic unit retainer belt, the electronic unit retainer belt that keeps is carried, the radial lead type electronic unit that keeps is moved to the retaining zone that the suction nozzle that can utilize boarded head 15 keeps electronic unit (absorption position, grasp position, holding position).The lead-in wire of the radial lead type electronic unit of assembly supply device 100 by will moving to retaining zone cuts off and separates, thereby can make the radial lead type electronic unit by this retainer belt anchor leg become the state that can remain on the assigned position place, can utilize the suction nozzle of boarded head 15 that this radial lead type electronic unit is kept (adsorb, grasp).Record and narrate in the back for assembly supply device 100.In addition, a plurality of assembly supply devices 100 can be supplied with the electronic unit of different cultivars respectively, also can supply with multiple electronic unit.

A plurality of electronic part feeders 100 are arranged on the rear side receptacle 46.Rear side receptacle 46 is mechanisms that a plurality of electronic part feeders 100 are supported, and as shown in Figure 8, has: the 1st fixed head 46a and the 2nd fixed head 46b, locking shaft 46c, driving cylinder 46d and location tags 46e.The 1st fixed head 46a is the plate-shaped member that extends on the ZX plane, is formed with the hole of shape in upright arrangement along directions X.The hole is the hole that can make the projection insertion that forms at electronic part feeder 100.The 1st fixed head 46a inserts in the hole by making the projection that forms at electronic part feeder 100, thereby electronic part feeder 100 is positioned.The 2nd fixed head 46b is the face that is configured in the vertical downside, be the plate-shaped member on the face of support electronic components feedway 100.The 2nd fixed head 46b forms concavo-convex at the end face away from a side of substrate delivery section 12.The 2nd fixed head 46b by make the projection that electronic part feeder 100 forms insert concavo-convex in, thereby electronic part feeder 100 is positioned.Locking shaft 46c is configured in a side of comparing with the 2nd fixed head 46b further from substrate delivery section 12.Locking shaft 46c passes through by grip unit 112 clampings of electronic part feeder 100, and electronic part feeder 100 is supported, locatees.Drive cylinder 46d and be the piston that can protrude to the vertical upside, by the assigned position that is arranged on the electronic part feeder 100 on the correspondence position is pressed, thereby to the holding position conveying electronic parts of electronic part feeder 100.Location tags 46e can observe the guiding sign of identifying the receptacle position in the rear side receptacle 46 by eyes.Operating personnel arrange electronic part feeder 100 by location tags 46e is confirmed to the position of regulation, thereby can electronic part feeder 100 be set in the position of expectation.

Fig. 9 is the schematic diagram of schematic configuration of other examples of the parts feed unit of expression rear side.Parts feed unit 14 also can be on the basis that a plurality of following electronic part feeders 100 are installed, has following electronic part feeder 100a, wherein, this electronic part feeder 100 is installed by a plurality of radial lead type electronic units (radial component) being fixed on the electronic unit retainer belt (radial component retainer belt) that forms in the retainer belt main body, (the 2nd holding position) cuts off the lead-in wire of the lead-type electronic-part of this electronic unit retainer belt maintenance in the holding position, and can utilize the absorption suction nozzle that has on the boarded head or grasp suction nozzle, the lead-type electronic-part that is positioned at this holding position is kept, this electronic part feeder 100a installs by a plurality of mounting type electronic units being fixed in the electronic unit retainer belt (chip part retainer belt) that forms in the retainer belt main body, peel off the mounting type electronic unit that this electronic unit retainer belt keeps (the 1st holding position) from the retainer belt main body in the holding position, utilize the absorption suction nozzle that has on the boarded head or grasp suction nozzle, the mounting type electronic unit that is positioned at this holding position is kept.In parts feed unit 14, also can be used as other electronic part feeders 100a and at rear side receptacle 46 rod-type feeder or pellet type feeder are set.A plurality of assembly supply devices 100,100a shown in Figure 9 remains on the brace table (receptacle) 102.Brace table 102 has the structure identical with above-mentioned rear side receptacle 46.In addition, brace table 102 can also carry other devices (for example, measurement mechanism or camera etc.) except assembly supply device 100,100a.

In parts feed unit 14, remain in a plurality of assembly supply devices 100,100a on the brace table 102, constituted by the kind of the electronic unit that carries, mechanism or different multiple assembly supply device 100, the 100a of feed mechanism of maintenance electronic unit.In addition, parts feed unit 14 also can have assembly supply device 100, the 100a of a plurality of identical type.In addition, have can be with respect to the structure of apparatus main body dismounting for preferred components feed unit 14.

Electronic part feeder 100a uses the bonding electronic unit retainer belt that carries out the chip-type electronic component of substrate lift-launch and constitute on retainer belt, supplies with electronic units to boarded head 15.In addition, the electronic unit retainer belt forms a plurality of apothecas, stored electrons parts in this apotheca at retainer belt.Electronic part feeder 100a is following retainer belt feeder, it keeps the electronic unit retainer belt, the electronic unit retainer belt that keeps is carried the retaining zone of the suction nozzle attract electrons parts that apotheca moved to utilize boarded head 15.In addition, move to retaining zone by making apotheca, can become the state that the electronic unit that is housed in this apotheca exposes at assigned position, can utilize boarded head 15 suction nozzle absorption, grasp this electronic unit.Electronic part feeder 100a is not limited to the retainer belt feeder, can adopt the various chip part feeders of supplying with chip-type electronic component.As the chip part feeder, for example can use rod-type feeder, retainer belt feeder, (bulk) in bulk feeder.

Boarded head 15 utilizes suction nozzle to keep (adsorb or grasp) to the electronic unit that keeps at parts feed unit 14f (lead-type electronic-part that bowl formula feeder unit keeps) or at the electronic unit (the radial lead type electronic unit that electronic part feeder 100 keeps (lead-type electronic-part, insert type electronic unit)) that parts feed unit 14r keeps, and the electronic unit that keeps is installed to utilizing substrate delivery section 12 to move on the substrate 8 of assigned position.In addition, boarded head 15 has under the situation of electronic part feeder 100a at parts feed unit 14r, will carry (installation) to substrate 8 at the chip-type electronic component (mounting type electronic unit) that electronic part feeder 100a keeps.In addition, record and narrate in the back for the structure of boarded head 15.In addition, chip-type electronic component (mounting type electronic unit) is the nothing lead-in wire electronic unit with the lead-in wire that is inserted in the patchhole (through hole) that forms on the substrate.As the mounting type electronic unit, as mentioned above illustration SOP, QFP etc.When chip-type electronic component is installed on the substrate, need not lead-in wire is inserted in the hole.

XY travel mechanism 16 makes boarded head 15 along the X-direction among Fig. 1, Fig. 2 and Y direction, namely in the travel mechanism mobile with the surperficial parallel face of substrate 8, has X-axis drive division 22 and Y-axis drive division 24.X-axis drive division 22 links with boarded head 15, and boarded head 15 is moved along X-direction.Y-axis drive division 24 links via X-axis drive division 22 and boarded head 15, moves along Y direction by making X-axis drive division 22, thereby boarded head 15 is moved along Y direction.XY travel mechanism 16 moves along the XY direction of principal axis by making boarded head 15, thereby can make boarded head 15 to the position relative with substrate 8, perhaps moves with parts feed unit 14f, position that 14r is relative.In addition, XY travel mechanism 16 moves by making boarded head 15, thereby the relative position between boarded head 15 and the substrate 8 is adjusted.Thus, the electronic unit that boarded head 15 is kept moves to the optional position on substrate 8 surfaces, electronic unit can be carried to the optional position on substrate 8 surfaces.Namely, XY travel mechanism 16 makes boarded head 15 mobile at horizontal plane (XY plane), will be arranged in the supply unit that the electronic unit of the electronic part feeder of parts feed unit 14f, 14r is carried to the assigned position (loading position, installation site) of substrate 8.In addition, as X-axis drive division 22, can use boarded head 15 to various mechanisms that prescribed direction moves.As Y-axis drive division 24, can use X-axis drive division 22 to various mechanisms that prescribed direction moves.As making object to the mechanism that prescribed direction moves, for example can use linear motor, rack pinion, use ball-screw conveying mechanism, utilize the conveying mechanism of conveyer belt etc.

VCS unit 17, replacing suction nozzle maintaining body 18 and parts reservoir 19 be configured in the position that overlaps with the movable area of boarded head 15 in the XY plane, and the position of more close vertical downside are compared in the position on the Z direction with boarded head 15.In the present embodiment, VCS unit 17, replacing suction nozzle maintaining body 18 and parts reservoir 19, disposed adjacent between substrate delivery section 12 and parts feed unit 14r.

VCS unit (unit status test section, state-detection portion) the 17th, pattern recognition device has near the camera of taking the suction nozzle to boarded head 15 and the lighting unit that shooting area is thrown light on.The hold mode of the electronic unit that 17 pairs of VCS unit keep by the shape of the electronic unit of the suction nozzle absorption of boarded head 15 and by suction nozzle is identified.More particularly, if make boarded head 15 move to the position relative with VCS unit 17, then VCS unit 17 is taken the suction nozzle of boarded head 15 from the vertical downside, by the image that photographs is resolved, thereby the hold mode of the electronic unit that keeps by the shape of the electronic unit of suction nozzle absorption and by suction nozzle is identified.VCS unit 17 sends the information that obtains to control device 20.

Changing suction nozzle maintaining body 18 is the mechanisms that keep multiple suction nozzle.Change suction nozzle maintaining body 18 can make the state of boarded head 15 dismounting and change suction nozzles, keep multiple suction nozzle.Here, the replacing suction nozzle maintaining body 18 of present embodiment maintains: the absorption suction nozzle, and it is by attracting to keep electronic unit; And grasping suction nozzle, it keeps electronic unit by grasping.Boarded head 15 utilize to be changed the suction nozzle that suction nozzle maintaining body 18 is installed by change, drives to the suction nozzle air supply pressure of installing, thereby can keep the electronic unit that will keep with suitable condition (attract or grasp).

Parts reservoir 19 is to store by boarded head 15 to utilize suction nozzle to keep and be not installed in the casing of the electronic unit on the substrate 8.That is, in electronic component mounting apparatus 10, become the discarded case that the electronic unit that is not installed on the substrate 8 is discarded.Electronic component mounting apparatus 10 exists in the electronic unit that is kept by boarded head 15 not under the situation of the electronic unit of installing to substrate 8, boarded head 15 is moved to the position relative with parts reservoir 19, discharge by the electronic unit that will keep, thereby electronic unit is put into parts reservoir 19.

The each several part of 20 pairs of electronic component mounting apparatus 10 of control device is controlled.Control device 20 is aggregates of various control parts.Operating portion 40 is input equipments of operating personnel's input operation, has keyboard 40a, mouse 40b and touch panel 42a.Operating portion 40 sends detected various inputs to control device 20.Display part 42 is the pictures that show various information to the operating personnel, has touch panel 42a and picture monitor 42b.Display part 42 shows various images based on the picture signal from control device 20 inputs at touch panel 42a and picture monitor 42b.

In addition, the electronic component mounting apparatus 10 of present embodiment is provided with 1 boarded head, but also can be corresponding and 2 boarded heads are set respectively with parts feed unit 14f, 14r.In the case, 2 X-axis drive divisions are set, move along the XY direction respectively by making 2 boarded heads, thereby can make 2 boarded heads independently mobile.Electronic component mounting apparatus 10 is by having 2 boarded heads, thereby can alternately carry electronic unit to 1 substrate 8.As noted above, alternately carry electronic unit by utilizing 2 boarded heads, thereby can a boarded head electronic unit is carried to substrate 8 during, another boarded head is kept the electronic unit that is arranged in assembly supply device.Thus, can further shorten not to the time that substrate 8 carries electronic unit, can carry electronic unit efficiently.In addition, also preferred electron apparatus for mounting component 10 disposes 2 substrate delivery section 12 abreast.If electronic component mounting apparatus 10 utilizes 2 substrate delivery section 12 that 2 substrates are alternately moved to the electro part carrying position, and utilize above-mentioned 2 boarded heads 15 alternately to carry out component mounting, then can carry electronic unit to substrate more efficiently.

Below, use Figure 10 and Figure 11, the structure of boarded head 15 is described.Figure 10 is the schematic diagram of schematic configuration of the boarded head of expression electronic component mounting apparatus.Figure 11 is the schematic diagram of schematic configuration of the boarded head of expression electronic component mounting apparatus.In addition, in Figure 10, various control parts that electronic component mounting apparatus 10 is controlled and 1 assembly supply device 100 of parts feed unit 14r are shown simultaneously.Boarded head 15 has boarded head main body 30, filming apparatus (substrate state-detection portion) 36, height sensor (substrate state-detection portion) 37 and laser recognition device (unit status test section, state-detection portion) 38 as Figure 10 and shown in Figure 11.

Electronic component mounting apparatus 10 has control part 60, boarded head control part 62 and parts supply control part 64 as shown in figure 10.Control part 60, boarded head control part 62 and parts supply control part 64 are parts of above-mentioned control device 20.In addition, electronic component mounting apparatus 10 is connected with power supply, uses control part 60, boarded head control part 62, parts supply control part 64 and various circuit, will supply with to each several part from the electric power that power supply is supplied with.For control part 60, boarded head control part 62 and parts supply control part 64, record and narrate in the back.

The main body that electronic part feeder 100 makes lead-in wire remain on the electronic unit 80 on the electronic unit retainer belt (radial component retainer belt) is exposed upward.In addition, as electronic unit 80, example illustrates aluminium electrolytic capacitor.In addition, as electronic unit 80, except aluminium electrolytic capacitor, can also use the various electronic units that have lead-in wire.Electronic part feeder 100 is by pulling out the electronic unit retainer belt and move it, thereby makes the electronic unit 80 that keeps in the electronic unit retainer belt mobile to retaining zone (binding domain, grip areas).In the present embodiment, near the front end of the Y direction of assembly supply device 100, become the retaining zone that the suction nozzle by boarded head 15 keeps the electronic unit 80 that remains in the electronic unit retainer belt.For the structure of electronic part feeder 100, record and narrate in the back.In addition, with the situation of electronic part feeder 100a in the same manner, assigned position becomes the retaining zone that the suction nozzle by boarded head 15 keeps the electronic unit 80 that remains in the electronic unit retainer belt.

Boarded head main body 30 has boarded head supporter 31, a plurality of suction nozzle 32 and the suction nozzle drive division 34 that each several part is supported.On the boarded head main body 30 of present embodiment, as shown in figure 11 6 suction nozzles 32 are configured to row.6 suction nozzles 32 are arranged along the direction parallel with X-axis.In addition, suction nozzle 32 shown in Figure 11 all disposes the suction nozzle that adsorbs and keep electronic unit.

Boarded head supporter 31 is the support components that link with X-axis drive division 22, and suction nozzle 32 and suction nozzle drive division 34 are supported.In addition, boarded head supporter 31 also supports laser recognition device 38.

Suction nozzle 32 is absorption, the adsorbing mechanism that keeps electronic unit 80.Suction nozzle 32 has opening 33 at front end, by attracting air from this opening 33, thereby in front end absorption, keep electronic unit 80.In addition, suction nozzle 32 has a 32a, and this 32a links with the leading section that is formed with opening 33 and attract electrons parts 80.Axle 32a is the bar-like member that leading section is supported, and extends configuration along Z-direction.The air hose (pipe arrangement) that axle 32a has the attraction mechanism with opening 33 and suction nozzle drive division 34 to be connected in internal configurations.

Suction nozzle drive division 34 makes suction nozzle 32 move along Z-direction, utilizes 33 pairs of electronic units 80 of opening of suction nozzle 32 to adsorb.Here, the Z axle be with the XY planar quadrature the axle.In addition, the Z axle becomes the direction with the surperficial quadrature of substrate.In addition, suction nozzle drive division 34 makes suction nozzle 32 rotate along the θ direction when electronic unit is installed etc.So-called θ direction is the direction parallel with the circumferencial direction of circle centered by the Z axle, and wherein, the Z axle is the parallel axle of direction that suction nozzle 32 is moved with Z axle drive division.In addition, the θ direction becomes the rotation direction of suction nozzle 32.

In suction nozzle drive division 34, as making suction nozzle 32 along the mechanism that Z-direction moves, for example exist to have the mechanism that Z-direction is the linear motor of driving direction.Suction nozzle drive division 34 makes the axle 32a of suction nozzle 32 move along Z-direction by utilizing linear motor, thereby the opening 33 of the leading section of suction nozzle 32 is moved along Z-direction.In addition, in suction nozzle drive division 34, as the mechanism that makes suction nozzle 32 along θ direction rotation, for example exist by with motor and the mechanism that constitutes with transmission key element that axle 32a links.Suction nozzle drive division 34 will utilize the transmission key element to transmit to axle 32a from the actuating force of motor output, make a 32a along the rotation of θ direction, thereby the leading section of suction nozzle 32 also rotate along the θ direction.

In suction nozzle drive division 34, the mechanism of adsorbing as 33 pairs of electronic units 80 of the opening that utilizes suction nozzle 32 namely attracts mechanism, for example has the mechanism with following parts: air hose, itself and opening 33 bindings of suction nozzle 32; Pump, it is connected with this air hose; And electromagnetically operated valve, its switching to the pipeline of air hose is switched.Suction nozzle drive division 34 utilizes pump that the air of air hose is attracted, switches by the switching to electromagnetically operated valve, thereby to whether attracting air to switch from opening 33.Suction nozzle drive division 34 is by opening electromagnetically operated valve, attract air from opening 33, thereby make opening 33 absorption (maintenance) electronic units 80, by closing electromagnetically operated valve, make opening 33 not attract air, thereby the electronic unit 80 that will be adsorbed on the opening 33 discharges, and, becomes the state (state that does not keep) that does not utilize opening 33 attract electrons parts 80 that is.

In addition, the boarded head 15 of present embodiment under the situation of main body upper surface for the shape that can't utilize suction nozzle (absorption suction nozzle) 33 absorption, uses the suction nozzle that grasps described later when the main body to electronic unit keeps.Grasp suction nozzle by in the same manner air being attracted to discharge with the absorption suction nozzle, thereby but moving plate is opened and closed with respect to stator, can grasp, discharge the main body of electronic unit thus from the top.In addition, boarded head 15 is carried out the replacing action by utilizing suction nozzle drive division 34 that suction nozzle 32 is moved, thereby can change the suction nozzle that is driven by suction nozzle drive division 34.

Filming apparatus 36 is fixed on the boarded head supporter 31 of boarded head main body 30, and zone, for example substrate 8 relative with boarded head 15 or the substrate 8 that has carried electronic unit 80 etc. are taken.Filming apparatus 36 has camera and lighting device, when utilizing lighting device to be thrown light in the visual field, utilizes camera to obtain image.Thus, can take the various images of image, for example substrate 8 or the parts feed unit 14 of the position relative with boarded head main body 30.What for example, 36 pairs of filming apparatus formed on substrate 8 surfaces takes as the BOC mark (being designated hereinafter simply as BOC) of reference mark or the image of through hole (patchhole).Here, under the situation of using the reference mark except the BOC mark, the image of this reference mark is taken.

Height sensor 37 is fixed on the boarded head supporter 31 of boarded head main body 30, and boarded head 15 and relative zone, for example substrate 8 or the distance of having carried between the substrate 8 of electronic unit 80 are measured.Can use laser sensor as height sensor 37, this laser sensor has: light-emitting component, its irradiating laser; And photo detector, it is subjected to light to the laser that returns in the reflection of relative position, this laser sensor according to after sending from laser to the time that is subjected to till the light, to relative part between distance measure.In addition, self-position and substrate position when height sensor 37 is measured by using, to relative part between distance handle, thereby to relative part, specifically detect for the height of electronic unit.In addition, also can by control part 60 based on and electronic unit between Determination of distance result carry out the processing of the height of detection electronics.

Laser recognition device 38 has light source 38a and photo detector 38b.Laser recognition device 38 is built on the carriage 50.Carriage 50 links with the downside of boarded head supporter 31, substrate 8 and assembly supply device 100 sides as shown in figure 10.Laser recognition device 38 is by to electronic unit 80 irradiating lasers by suction nozzle 32 absorption of boarded head main body 30, thus the device that the state of electronic unit 80 is detected.Here, as the state of electronic unit 80, refer to the shape of electronic unit 80 and utilize suction nozzle 32 whether with correct posture attract electrons parts 80 etc.Light source 38a is the light-emitting component of output laser.Position configuration on the Z-direction of photo detector 38b is in the position relative with light source 38a, namely on the highly identical position.Handle for the identification that utilizes 38 pairs of shapes of laser recognition device, record and narrate in the back.

Below, the control function of the apparatus structure of electronic component mounting apparatus 10 is described.Electronic component mounting apparatus 10 has control part 60, boarded head control part 62 and parts supply control part 64 as control device 20 as shown in figure 10.Various control parts are made of the parts that CPU, ROM and RAM etc. have operation processing function and a memory function respectively.In addition, in the present embodiment, a plurality of control parts are set for convenience of explanation, but 1 control part also can be set.In addition, under the situation that the control function with electronic component mounting apparatus 10 is realized by 1 control part, can be realized by 1 arithmetic unit, also can be realized by a plurality of arithmetic units.

Control part 60 is connected with the each several part of electronic component mounting apparatus 10, based on the operation signal of importing, in the each several part of electronic component mounting apparatus 10 detected information, carry out institute's program stored, the action of each several part is controlled.Control part 60 for example to the conveying of substrate 8 action, utilize the boarded head 15 that XY travel mechanism 16 realizes drive actions, utilize SHAPE DETECTION action that laser recognition device 38 realizes etc. to control.In addition, control part 60 is as noted above to the various indications of boarded head control part 62 transmissions, and the control action of boarded head control part 62 is controlled.Control part 60 is also controlled the control action of boarded head control part 62 and parts supply control part 64.

Boarded head control part 62 and suction nozzle drive division 34, the various transducers and the control part 60 that are configured on the boarded head supporter 31 are connected, and suction nozzle drive division 34 is controlled, and the action of suction nozzle 32 is controlled.Boarded head control part 62 is controlled absorption (the maintenance)/release movement of 32 pairs of electronic units of suction nozzle, the rotation action of each suction nozzle 32, the shift action of Z-direction based on the operation indication of supplying with from control part 60 and the testing result of various transducer (for example range sensor).

The supply action of the electronic unit 80 that 64 pairs of parts feed units of parts supply control part 14f, 14r carry out is controlled.Can on assembly supply device 100, bowl formula feeder unit 400, parts supply control part 64 be set respectively, also can utilize 64 pairs of all assembly supply devices 100 of 1 parts supply control part, bowl formula feeder unit 400 to control.For example, the cut-out action of pulling out action (shift action), lead-in wire of the electronic unit retainer belt that carries out of 64 pairs of assembly supply devices of parts the supply control part 100 and maintenance action of lead-type electronic-part radially controlled.In addition, the parts that carry out of 64 pairs of bowl formulas of parts supply control part feeder unit 400 are supplied with action and are controlled.In addition, parts supply control part 64 has under the situation of assembly supply device 100a at parts feed unit 14f, and the action (shift action) of pulling out of the electronic unit retainer belt that assembly supply device 100a is carried out is controlled.Parts supply control part 64 is carried out exercises based on the indication of control part 60.Parts supply control part 64 is controlled by the action of pulling out to electronic unit retainer belt or electronic unit retainer belt, thereby the movement of electronic unit retainer belt or electronic unit retainer belt is controlled.

Below, use Figure 12 to Figure 24, assembly supply device 100 is described.Assembly supply device 100 is as noted above, is the radially feeder that the radial lead type electronic unit is supplied with to the holding position.At first, use Figure 12 and Figure 13, the electronic unit retainer belt is described.Figure 12 is the schematic diagram of schematic configuration of an example of expression electronic unit retainer belt.Figure 13 is the schematic diagram of other schematic configuration examples of expression electronic unit retainer belt.

Electronic unit retainer belt shown in Figure 12 (radial component retainer belt) 70 has: retainer belt main body 72; And a plurality of electronic units (radial lead type electronic unit, radial lead parts) 80, it remains on the retainer belt main body 72.Retainer belt main body 72 is fitted by the 2nd retainer belt 76 that the 1st retainer belt 74 is narrower with compare width with the 1st retainer belt 74 and is formed.In addition, retainer belt main body 72 is formed with hole 78 as the feeding hole along bearing of trend with fixed intervals.That is, retainer belt main body 72 is formed with a plurality of holes 78 along bearing of trend with shape in upright arrangement.

Electronic unit 80 has: electronic unit main body (being designated hereinafter simply as " main body ") 82; And 2 lead-in wires 84, it is along the radial direction configuration of main body 82.The lead-in wire 84 of electronic unit 80 is clamped between the 1st retainer belt 74 and the 2nd retainer belt 76 and fixes.Thus, electronic unit 80 84 is clamped between the 1st retainer belt 74 and the 2nd retainer belt 76 and fixes by going between, thereby is fixed on the assigned position place of retainer belt main body 72.In addition, for a plurality of electronic units 80, configuration holes 78 between 2 lead-in wires 84, thus be separately fixed on the position of formation porose 78 of retainer belt main body 72.That is, electronic unit 80 is with the interval of the pitch of feed P identical with hole 78 and be configured in identical position, position on the bearing of trend with retainer belt.In addition, electronic unit 80 has the 1st retainer belt 74 that is clamped in retainer belt main body 72 and the lead-in wire between the 2nd retainer belt 76 as long as it is shaped as, and the shape of lead-in wire and main body, kind be restriction especially.

Below, electronic unit retainer belt 70a shown in Figure 13 has: retainer belt main body 72; And a plurality of electronic units (radial lead type electronic unit) 80, it remains on the retainer belt main body 72.In addition, electronic unit retainer belt 70a is the relative position relation difference between electronic unit 80 and the hole 78 only, and other structures are identical with electronic unit retainer belt 70.Electronic unit retainer belt 70a is configured in 2 lead-in wires 84 of electronic unit 80 between the hole 78 and hole 78 of retainer belt main body 72.That is, electronic unit 80 is configured to, and is at interval identical with the pitch of feed P in hole 78, and its position on the bearing of trend of retainer belt is positioned at half the position that has been offset configuration space.That is, electronic unit 80 is configured in respect to hole 78 and has been offset on the position of half amount of separation.

Electronic unit retainer belt such as Figure 12 and shown in Figure 13 exist hole 78 on the bearing of trend of retainer belt and the different kind of relative position relation between the electronic unit 80.

Below, Figure 14 is the oblique view of schematic configuration of electronic part feeder of the parts feed unit of expression rear side.Figure 15 is the oblique view of observing electronic part feeder shown in Figure 14 from the direction different with Figure 14.Figure 16 is the key diagram of schematic configuration of the electronic part feeder of expression parts feed unit.To shown in Figure 16, electronic part feeder (assembly supply device) 100 has as Figure 14: framework 110, and it keeps other each several parts, to the channeling conduct of electronic unit retainer belt; Grip unit 112, itself and rear side receptacle 46 link; Feeder unit 114, it is carried the electronic unit retainer belt; Cutting unit 116, its lead-in wire that will remain on the electronic unit in the electronic unit retainer belt cuts off; And air pressure adjustment part 118, its air pressure to the drive division of the drive division of feeder unit 114 and cutting unit 116 is adjusted, and the driving of each several part is controlled.

Framework 110 is vertical elongated hollow casings, inner grip unit 112, feeder unit 114, cutting unit 116 and the air pressure adjustment part 118 of keeping.Framework 110 is provided with guiding groove 120, guide portion 122, discharge portion 126, grasping part 128 and lug boss 129.Guiding groove 120 has the shape with the side end binding of 2 straight lines that form along its length of the elongate surface of the vertical upside of framework 110.That is, guiding groove 120 forms from a side end of framework 110 and extends near the end side, turns back near end side, and extends to the U word shape of a side end.Guiding groove 120 is the grooves to the channeling conduct of electronic unit retainer belt, supplies with the electronic unit retainer belt from a side end (end of supply side) of U word shape.Guiding groove 120 makes the electronic unit retainer belt of supplying with move along the U word shape, discharges from a side end (discharging the end of side) of U word shape.In addition, guiding groove 120 is with the inside that is positioned at framework 110 in retainer belt main body 72 and the state that electronic unit exposes to the outside of framework 110, to the channeling conduct of electronic unit retainer belt.

Guide portion 122 links with the end of the supply side of guiding groove 120, will maintain electronic unit retainer belt under the state of electronic unit to guiding groove 120 guiding.Discharge portion 126 links with the end of the discharge side of guiding groove 120, will move framework 110 in and the part of electronic unit after boarded head 15 supplies discharged from the electronic unit retainer belt.Grasping part 128 is the parts that grasped by operating personnel when electronic part feeder 100 is carried etc.Lug boss 129 is projectioies of inserting in the hole of the 1st fixed head 46a of above-mentioned rear side receptacle 46.

Below, on the basis of Figure 14 to Figure 16, use the grip unit of Figure 17 to describe.Here, Figure 17 is the key diagram of schematic configuration of the grip unit of expression electronic part feeder.Grip unit 112 is the mechanisms that link with rear side receptacle 46.Grip unit 112 has linking part 132, driving section 134, elastic portion 136 and bar 138.

Linking part 132 is the parts that contact with rear side receptacle 46 when linking with rear side receptacle 46, exposes outside to framework 110.In addition, linking part 132 is configured on the face with the face opposition side that is formed with guiding groove 120 of framework 110.Linking part 132 is provided with bite 133 on the end of vertical downside.Bite 133 links with the locking shaft 46c of rear side receptacle 46.Driving section 134 links with bite 133, elastic portion 136, the bar 138 of linking part 132, will transmit to linking part 132 from the power that bar 138, elastic portion 136 apply.One side end of elastic portion 136 is fixed on the framework 110, and end side is fixed on the driving section 134.Elastic portion 136 is parts such as spring, driving section 134 is applied the power that it is stretched to a layback that is fixed on the framework 110.Thus, driving section 134 becomes the state that the part that links with elastic portion 136 is stretched to prescribed direction.One side end of bar 138 exposes to the outside of framework 110, and end side and driving section 134 link.The fixed axis 139 of bar 138 is fixed on the framework 110.Thus, if operating personnel operate the side end that bar 138 exposes to framework 110 outsides, be axle with fixed axis 139 then, the end that links side with driving section 134 is moved.Thus, driving section 134 is moved, to the power of linking part 132 effect regulations, make bite 133 actions.Grip unit 112 is said structure, by the operation of operating personnel to bar 138, thus the locking shaft 46c that makes bite 133 and rear side receptacle 46 link and be fixed in state on the rear side receptacle 46 and bite 133 not and locking shaft 46c link and switch between the d/d state.

Below, on the basis of Figure 14 to Figure 16, use Figure 18 to Figure 21, feeder unit is described.Here, Figure 18 is the key diagram of schematic configuration of the feeder unit of expression electronic part feeder.Figure 19 is the key diagram of schematic configuration of the front end support portion of expression feeder unit.Figure 20 is the key diagram of schematic configuration of the retainer belt feeding pawl unit of expression feeder unit.Figure 21 is the key diagram for the action of explanation feeder unit.Feeder unit 114 is that the electronic unit retainer belt is carried, that is, and and the mechanism that the electronic unit retainer belt that is directed along guiding groove 120 is moved.Feeder unit 114 has support portion 142, drive division 144, front end support portion 146 and retainer belt feeding pawl unit 148.In addition, in the present embodiment, front end support portion 146 and retainer belt feeding pawl unit 148 become the position adjusting mechanism that the relative position between retainer belt feeding pawl unit 148 and the framework 110 is adjusted.

Support portion 142 is the parts that are fixed on the framework 110, and drive division 144 is supported.Drive division 144 has fixed part 144a and movable part 144b.Drive division 144 is to utilize air pressure to make the flexible cylinder of the part of exposing from fixed part 144a of movable part 144b.Drive division 144 makes the front end of movable part 144b on the bearing of trend of the line part of guiding groove 120, moves back and forth accordingly with pitch of feed at least in the distance range of regulation.That is, drive division 144 moves back and forth the front end of movable part 144b at least with the distance corresponding with the pitch of feed (the spacing P in hole 78) of retainer belt.Front end support portion 146 is fixed on the front end of the movable part 144b of drive division 144.Front end support portion 146 moves back and forth with moving back and forth integratedly of movable part 144b.In addition, as shown in figure 19, front end support portion 146 is the face of vertical upside, and the part place linking with retainer belt feeding pawl unit 148 has screw hole 149a, 149b, these 4 screw holes of 149c, 149d.These 4 screw hole 149a, 149b, 149c, 149d are formed on 4 the different positions of position on the retainer belt direction of feed.Here, the screw hole 149a of front end support portion 146 and the distance between the screw hole 149b are half the distance of spacing P in the hole 78 of above-mentioned retainer belt main body 72.That is, screw hole 149a and screw hole 149b are formed on the position of half amount of separation of the configuration space that has been offset hole 78.In addition, on front end support portion 146, the distance between screw hole 149c and the screw hole 149d is half the distance of spacing P in the hole 78 of above-mentioned retainer belt main body 72.That is, screw hole 149c and screw hole 149d are formed on the position of half amount of separation of the configuration space that has been offset hole 78.

Retainer belt feeding pawl unit 148 is fixed on the front end support portion 146.Retainer belt feeding pawl unit 148 has erecting bed 150, feeding pawl 152, pin 154 and spring 156.Erecting bed 150 is pedestals that feeding pawl 152, pin 154, spring 156 are supported.Erecting bed 150 has the plate shape after the bending that section with retainer belt direction of feed quadrature is L word shape, and the part of vertical upside is exposed from framework 110.Be provided with the grasping part 158 that can be grasped by operating personnel in the part of exposing of erecting bed 150.Operating personnel grasp and operate grasping part 158 as required, thereby retainer belt feeding pawl unit 148 is moved to the retainer belt direction of feed.Erecting bed 150 is the parts that are connected with front end support portion 146, utilizes 2 hold-down screws 159 to be fixed on the front end support portion 146., on erecting bed 150, make the interval in the hole of 2 hold-down screws, 159 insertions here, identical with interval and the interval between screw hole 149b and the screw hole 149d between screw hole 149a and the screw hole 149c.That is, front end support portion 146 has many groups and combination to the identical screw hole of the disposition interval of the hold-down screw (screw) 159 of erecting bed 150 insertions of retainer belt feeding pawl unit 148 on the diverse location on the retainer belt direction of feed.Thus, for erecting bed 150, by the screw hole that inserts hold-down screw 159 is switched, thereby can make half of relative position skew amount of separation between erecting bed 150 and the front end support portion 146.

Feeding pawl 152 is the parts with the protuberance 152a that protrudes at a side end of bar-like member.Feeding pawl 152 is configured on the position relative with the hole of the retainer belt main body 72 of electronic unit retainer belt (being designated hereinafter simply as " retainer belt ") 70, protuberance 152a is shaped as, face 152b in the direction of feed downstream (front side of direction of feed) of retainer belt direction of feed becomes the face with the direction of feed quadrature, the face 152c of the direction of feed upstream side (rear side of direction of feed) of retainer belt direction of feed become with respect to the face of the face tilt of direction of feed quadrature, along with the narrowed width that makes direction of feed near retainer belt 70.Feeding pawl 152 as shown in figure 20, becomes protuberance 152a and is inserted into state in the hole 78 under the situation of the position relative with protuberance 152a porose 78.Sell a side end that does not form protuberance 152a of 154 pairs of feeding pawls 152, supporting along the mode of the direction rotation parallel with paper.One side end of spring 156 is fixed on the projecting surface 150a of erecting bed 150, and end side is fixed on the feeding pawl 152.Spring 156 is pressed feeding pawl 152 under the protuberance 152a of feeding pawl 152 situation relative with the part outside the hole 78 to the retainer belt side.

Below, use Figure 21, the retainer belt feed motion of feeder unit 114 is described.In addition, (among the step S1～S4), with the hole that forms on the retainer belt main body 72, supply with the Kong Xianxiang framework 110 in the downstream that is positioned at the retainer belt direction of feed at example shown in Figure 21, and earlier from the order of the discharge of framework 110, be made as 78 successively, 78a, 78b, 78c.In step S1, the protuberance 152a of feeding pawl 152 is inserted among the hole 78a of retainer belt main body 72.Feeder unit 114 drives drive division 144 under protuberance 152a shown in step S1 is inserted into state among the 78a of hole, makes retainer belt feeding pawl unit 148 move 1 amount that pitch of holes is corresponding with retainer belt main body 72 along the retainer belt direction of feed.

If feeder unit 114 is under the state of step S1, retainer belt feeding pawl unit 148 is carried along the retainer belt direction of feed, then utilize protuberance 152a and the face direction of feed quadrature, hole 78a is pushed to the retainer belt direction of feed, shown in step S2, retainer belt feeding pawl unit 148 and retainer belt main body 72 all move along the retainer belt direction of feed.Feeder unit 114 moves along the retainer belt direction of feed by making retainer belt main body 72, thereby the electronic unit of retainer belt is moved to the holding position.

If make retainer belt feeding pawl unit 148 mobile ends along the retainer belt direction of feed (step S2), then feeder unit 114 makes the electronic unit of the front end that keeps in the retainer belt main body 72 be in the holding position and standby.At this moment, the electronic unit that is positioned at holding position (retaining zone) as described later shown in, the electronic unit main body is held, and utilizes the cutter cut-out that will go between.Then, after the processing that the electronic component mounting apparatus side puts rules into practice, send and drive instruction.For example, in the absorption suction nozzle absorption that utilizes boarded head or utilize grasp the electronic unit that suction nozzle grasps the above-mentioned holding position that retainer belt keeps after, send clamping to electronic part feeder and release order, make electronic part feeder release to the clamping of electronic unit.Then, by after suction nozzle being risen the electronic unit that keeps on the suction nozzle is raise, send to feeder unit 114 and to drive instruction.Send drive instruction after, feeder unit 114 drives drive division 144, makes retainer belt feeding pawl unit 148 move 1 amount that pitch of holes is corresponding with retainer belt main body 72 along the direction opposite with the retainer belt direction of feed.If feeder unit 114 is under the state of step S2, retainer belt feeding pawl unit 148 is carried to a side opposite with the retainer belt direction of feed, then the face of the inclination of protuberance 152a contacts with hole 78a, and protuberance 152a moves to the direction of extracting from the 78a of hole along the inclined plane.Thus, feeder unit 114 makes protuberance 152a break away from (step S3) from the 78a of hole shown in step S3, and retainer belt is not mobile, and retainer belt feeding pawl unit 148 is to a side shifting opposite with the retainer belt direction of feed.

Then, at feeder unit 114 from the state shown in the step S2, make retainer belt feeding pawl unit 148 along the direction opposite with the retainer belt direction of feed move with the corresponding amount of 1 pitch of holes of retainer belt main body 72 after, shown in step S4, become protuberance 152a and insert the state of comparing the hole 78b of the upstream side that is arranged in 1 amount of separation with hole 78a.At this moment, owing to feeding pawl 152 is pressed to the direction of hole 78b by spring 156, so protuberance 152a is inserted in the 78b of hole.Then, drive division 144 drives along the retainer belt direction of feed immediately, and the next electronic unit that keeps in the retainer belt main body 72 is carried to the holding position.

Feeder unit 114 is as noted above, by utilize drive division 144 make retainer belt feeding pawl unit 148 with the amount corresponding with 1 pitch of holes of retainer belt main body 72 along the direction of feed reciprocating motion, thereby can make retainer belt along direction of feed mobile 1 amount of separation in turn.

Below, on the basis of Figure 14 to Figure 16, use Figure 22 to Figure 24, cutting unit is described.Figure 22 is the key diagram of schematic configuration of the cutting unit of expression electronic part feeder.Figure 23 is the key diagram of schematic configuration of the cutting unit of expression electronic part feeder.Figure 24 is the key diagram of schematic configuration of the cutting unit of expression electronic part feeder.Cutting unit 116 cuts off the lead-in wire of the electronic unit that the electronic unit retainer belt keeps.In addition, the cutting unit 116 clampings electronic unit after being cut off that namely keeps going between is till electronic unit is by suction nozzle absorption (maintenance).Cutting unit 116 has support portion 162, drive division 164, driving section 166, cut-out portion 168 and covers 169.

Support portion 162 is the parts that are fixed on the framework 110, and drive division 164 and driving section 166 are supported.In addition, support portion 162 is supported via the 166 pairs of cut-out portions 168 in driving section.Drive division 164 has fixed part 164a and movable part 164b.Drive division 164 is to utilize air pressure to make the flexible cylinder of the part of exposing from fixed part 164a of movable part 164b.Drive division 164 makes the front end of movable part 164b on the bearing of trend of the line part of guiding groove 120, moves back and forth in the distance range of regulation.Driving section 166 is transmission mechanisms that the power that will produce by moving back and forth of movable part 164b transmits to cut-out portion 168.Driving section 166 with movable part 164b to the moving back and forth of retainer belt direction of feed, be transformed to the motion with the direction of retainer belt direction of feed quadrature, cut-out portion 168 is moved along the direction with retainer belt direction of feed quadrature.Driving section 166 make across retainer belt pass through zone the leading section 166a and the leading section 166b that dispose, towards each other the direction of Jie Jining or direction away from each other, be that the direction shown in the arrow 170 moves.The driving section 166 of present embodiment, along stretching out under the situation that direction moves, the direction that leading section 166a and leading section 166b are approached towards each other moves at the movable part 164b of drive division 164.Driving section 166 under the situation that the movable part 164b of drive division 164 moves to shrinkage direction, make leading section 166a and leading section 166b towards each other away from direction move.

Cut-out portion 168 is configured on the retaining zone, and the main body of the electronic unit that disposes on the retaining zone is kept, and then, the lead-in wire of electronic unit is cut off between main body and retainer belt main body, then, keeps the state that electronic unit is kept.Cut-out portion 168 has the 1st blade 168a and the 2nd blade 168b.Cut-out portion 168 is configured in and makes on the 1st blade 168a and the 2nd blade 168b position respect to one another.In addition, retainer belt is configured between the 1st blade 168a and the 2nd blade 168b, and the lead-in wire of the electronic unit that keeps on the retainer belt passes through by the position of the 1st blade 168a and the 2nd blade 168b clamping.The 1st blade 168a links with the leading section 166a of driving section 166 as shown in figure 24, if leading section 166a to the 2nd blade 168b side shifting, then with leading section 166a to the 2nd blade 168b side shifting.The 2nd blade 168b links with the leading section 166b of driving section 166 as shown in figure 24, if leading section 166b to the 1st blade 168a side shifting, then with leading section 166b to the 1st blade 168a side shifting.In addition, the 1st blade 168a links via spring and leading section 166a, is pressed to the 2nd blade 168b side by leading section 166a.

Cover 169 is the parts that are fixed on the framework 110.The cover 169 be configured in the 1st blade 168a around, the 1st blade 168a becomes opening with the face that the 2nd blade 168b contacts.In addition, cover 169 is connected with leading section 166a via spring, with leading section 166a to the 2nd blade 168b away from a side press.Thus, leading section 166a can apply power away from the direction of the 2nd blade 168b to the 1st blade 168a under the situation of pressing to the 2nd blade 168b side not.

Cutting unit 116 has said structure, by utilizing drive division 164 that the 1st blade 168a of movable side of cut-out portion 168 and the 2nd blade 168b of fixation side are approached, main body from the side to electronic unit supports, and further the 1st blade 168a of the movable side by making cut-out portion 168 and the 2nd blade 168b of fixation side contact, thereby the lead-in wire that is configured between the 2nd blade 168b of the 1st blade 168a of movable side and fixation side can be cut off.In addition, cutting unit 116 will go between cut off after, by keeping the 1st blade 168a and the 2nd blade 168b state of contact, thereby can be from the side main body of the electronic unit that cuts off from the retainer belt main body be supported.That is, lead-in wire can be cut off and clamping from the retainer belt body portion from electronic unit.In addition, cutting unit 116 also can make the mechanism that cuts off the electronic unit lead-in wire and the mechanism that the electronic unit (main body of electronic unit) after cutting off is carried out clamping (support) with independent mechanism's formation.

Here, the off-position of the lead-in wire that cutting unit 116 is cut off describes.In the erecting device of the special-purpose boarded head of lead-type electronic-part with existing substrate insertion usefulness, cut off in the lead-in wire front that the retainer belt with anchor leg approaches, very long lead-in wire is inserted in the substrate.Its reason is, existing erecting device has lead-in wire cut-out portion and lead-in wire grasping part in the boarded head side, cuts off (pre-cutting) below with it after the root that utilizes the lead-in wire grasping part to lead-in wire grasps, so the lead-in wire after cutting off is elongated.In addition, its reason is that existing erecting device is owing to when inserting lead-in wire to inserting in the hole, inserted by the directing pin guiding, so even lead-in wire is longer, also can hinder to substrate and insert.In addition, its reason is, existing erecting device is carried out subsequent treatment in order to utilize in the substrate back cut-out (formal cut off) that will go between for the lead-in wire bending device of Len req and bending, and when being used for cutting off the pre-cutting of lead-in wire from above-mentioned parts retainer belt, need lead-in wire to keep long length.

Relative therewith, cutting unit 116 makes the shearing length of lead-in wire of radial lead type electronic unit become following specific length, namely, this specific length makes the lead-in wire that becomes the length identical with substrate thickness or protrude to the substrate back side can not produce failure welding, and length is corresponding with substrate thickness.Specific length for example is the length roughly the same with the patchhole of substrate.More particularly, be that length with respect to the patchhole of substrate grows the length that is less than or equal to 3mm more than or equal to 0mm.As noted above, needn't utilize boarded head that parts are carried out pre-cutting as shown in the prior art, utilize assembly supply device to be cut to specific length from the beginning but constitute shortly, thereby can obtain following effect.

Electronic component mounting apparatus 10 cuts off by being gone between by cutting unit 116 shortly, can be when the main body of utilizing suction nozzle to the electronic unit on the holding position that is positioned at assembly supply device 100 keeps, improve lead-in wire stability at interval, can increase the parts that lead-in wire can be inserted in the hole, can very efficiently and accurately install.

In addition, in existing erecting device, if with respect to being pre-charged with or being coated in the scolder that inserts in the hole, insert long lead-in wire, then scolder is almost all extruded to the lead-in wire front sometimes, when reflow soldering, the scolder of fusing can't rise between patchhole and the lead-in wire than in the areolar, make failure welding.Relative therewith, in electronic component mounting apparatus 10, because cutting unit 116 will go between and cut off shortlyer, so the scolder of fusing can rise in the above-mentioned gap, can have no the best welding that ground, space is full of scolder.And be coated on the scolder of upper surface of base plate by the mounting type electronic unit is also carried, thereby also producing following effect this moment,, can carry out the lift-launch of lead-type electronic-part and mounting type electronic unit simultaneously by a reflow soldering operation that is.In other words, if insert long lead-in wire with respect to being pre-charged with or being coated in the scolder that inserts in the hole, then scolder is almost all extruded to the lead-in wire front, sometimes the scolder that melts when reflow soldering can't rise to the substrate place, that is, scolder can't arrive substrate, failure welding.Relative therewith, in the electronic component mounting apparatus of said structure, be cut to afore mentioned rules length by going between shortly, if thereby because become the state of fusing to the feasible a part of scolder extruded from patchhole of the lead-in wire of the insertion that inserts in the hole, then can rise to the back side of aforesaid substrate, weld with the electrode of substrate back.In addition, also exist under the situation of electrode in the inside of patchhole (substrate aperture), scolder is risen in lead-in wire and the gaps between electrodes of substrate inside weld.Like this, can machinery and electrically weld.

In addition, be made as the length identical with substrate thickness by the length with regulation, thereby even on substrate, the radial lead type electronic unit is installed, also can suppress the situation that lead-in wire protrudes from substrate (back side of substrate).In addition, make the lead-in wire that protrudes to the substrate back side become the length that can not cause failure welding by specific length is made as, thereby even will go between and cut off shortlyer, also can will go between by reflow treatment is fixed on inserting in the hole of substrate well.

118 pairs of air pressure adjustment parts are adjusted as the cylinder of the drive division 144 of feeder unit 114 with as the air pressure of the cylinder of the drive division 164 of cutting unit 116, and the driving of each several part is controlled.Specifically, the stretching of the movable part 144b of the 118 pairs of drive divisions 144 in air pressure adjustment part, be that the position is controlled, the position of feeding pawl 152 is controlled.In addition, the stretching of the movable part 164b of the 118 pairs of drive divisions 164 in air pressure adjustment part, be that the position is controlled, the 1st blade 168a of cut-out portion 168 and the position of the 2nd blade 168b are controlled.In addition, air pressure adjustment part 118 is controlled the air pressure of each several part based on the control of parts supply control part 64.

Assembly supply device 100 has said structure.Assembly supply device 100 is by constituting, along the retainer belt direction of feed a plurality of erecting beds 150 with retainer belt feeding pawl unit 148 are set and are installed in position on the front end support portion 146, can switch the position that retainer belt feeding pawl unit 148 arranges with respect to front end support portion 146, thereby need not to change the hole multiple electronic unit retainer belt different with the relative position between the electronic unit that parts just can be tackled the retainer belt main body.Namely, assembly supply device 100 is by based on the hole of the retainer belt main body of the electronic unit retainer belt of packing into and the relative position between the electronic unit, to the position of installing on the erecting bed 150 forward end support portions 146 of retainer belt feeding pawl unit 148 is switched, thereby under the situation of any electronic unit retainer belt, electronic unit is moved to the holding position.

Specifically, the position that feeder unit 114 is installed the erecting bed 150 forward end support portions 146 of retainer belt feeding pawl unit 148 by change, thus change the position that can become in the scope that moves back and forth the protuberance 152a of the feeding pawl 152 in the position of elongation state to the movable part 144b of drive division 144.Thus, can be in the movable part 144b that makes drive division 144 at feeder unit 114 is in the scope that moves back and forth during the position (feeding end position, holding position) of the state of elongation, makes the position that is positioned in the hole of retainer belt main body become all places.Thus, even feeder unit 114 for the electronic unit electronic unit retainer belt different with respect to the allocation position of hole site, also can be configured in the holding position with electronic unit when movable part 144b becomes the state that extends most in the scope that moves back and forth.

In addition, preferably in assembly supply device 100, with the distance that moves back and forth of the movable part 144b of feeder unit 114, it is long and than 2 times of weak points of spacing to be made as spacing than the hole of retainer belt main body.Thus, assembly supply device 100 can insert the protuberance 152a of feeding pawl 152 hole of next spacing reliably, can be by feeding pawl 152 once move back and forth the amount of retainer belt being carried 1 spacing.In addition, for assembly supply device 100, be that the spacing in the hole of retainer belt has under the situation of a plurality of kinds at object conveyor preferably, the distance that moves back and forth with the movable part 144b of feeder unit 114, be made as the length of comparing with the longest hole of pitch of holes, with 2 times of weak points of comparing of the shortest retainer belt spacing of pitch of holes.Thus, assembly supply device 100 is under the situation of any kind in the spacing of retainer belt, all the protuberance 152a of feeding pawl 152 can be inserted reliably the hole of next spacing, can retainer belt be carried the amount of 1 spacing by once the moving back and forth of feeding pawl.That is, assembly supply device 100 needn't change the distance that moves back and forth or the replacing of carrying out parts, just can carry the amount of 1 spacing respectively at the retainer belt of multiple spacing.

Here, the feeder unit 114 of above-mentioned execution mode can select with respect to front end support portion 146 and the position of installation retainer belt feeding pawl unit 148 at 2 positions, but quantity is not limited thereto.But feeder unit 114 is installed the chosen position of the position of retainer belt feeding pawl unit 148 by increasing with respect to front end support portion 146, can tackle a greater variety of electronic unit retainer belts.In addition, feeder unit 114 also can be set to, and can adjust linearly with respect to front end support portion 146 and position that retainer belt feeding pawl unit 148 is installed.For example also can be set to, by with the screw hole on any one in front end support portion 146 or the retainer belt feeding pawl unit 148, be made as the long hole shape of extending along the retainer belt direction of feed, thereby can make the relative position on the retainer belt direction of feed between front end support portion 146 and the retainer belt feeding pawl unit 148 be set to all places.In the case, the relative position on the retainer belt direction of feed between preferred front end support portion 146 and the retainer belt feeding pawl unit 148 can be adjusted in the scope of 1 pitch of holes amount of retainer belt.Thus, feeder unit 114 can be adjusted relative position arbitrarily, also can carry out the inching of relative position.

In addition, the feeder unit 114 of above-mentioned execution mode constitutes, with front end support portion 146 and retainer belt feeding pawl unit 148 as position adjusting mechanism, by the relative position between change front end support portion 146 and the retainer belt feeding pawl unit 148, thereby can change the state after retainer belt is carried end, namely, the position (can adjust the relative position between framework 110 and the retainer belt feeding pawl unit 148) of the protuberance 152a of feeding pawl 152 when movable part 144b moves back and forth the state that extends most in the scope, but be not limited thereto.Feeder unit can use as position adjusting mechanism adjusting the various mechanisms of the relative position between framework and the retainer belt feeding pawl unit.For example, assembly supply device also can constitute, by adjusting the relative position on the retainer belt direction of feed between framework and the feeder unit, thereby can change the state after retainer belt is carried end, that is movable part 144b position of the protuberance 152a of feeding pawl 152 during the state of elongation in the scope of moving back and forth.That is, feeder unit also can arrange position adjusting mechanism by the linking part between feeder unit and framework.

Below, to describing as the various variation of the electronic part feeder of feeder radially.Figure 25 is the oblique view of schematic configuration of other examples of expression cutting unit.Figure 26 is the schematic configuration of cutting unit shown in Figure 25 is observed in expression from other directions oblique view.Figure 27 is expression cutting unit shown in Figure 25 and the oblique view of the relation between the framework.Figure 28 is the oblique view of schematic configuration of other examples of expression cutting unit.Figure 29 is the key diagram for the action of explanation cutting unit shown in Figure 25.Figure 30 is the key diagram for the action of explanation cutting unit shown in Figure 25.In addition, Figure 25 is identical with cutting unit 116 to the basic structure of cutting unit 116a shown in Figure 30.Below, the characteristic point of cutting unit 116a is described.

Cutting unit 116a cuts off the lead-in wire of the electronic unit that the electronic unit retainer belt keeps.In addition, cutting unit 116a clamping namely keeps cutting off the electronic unit behind the lead-in wire, until electronic unit by suction nozzle 32(absorption suction nozzle or grasp suction nozzle) adsorb or grasp (maintenance).Cutting unit 116a has support portion 162, drive division 164, driving section 172, cut-out portion 174 and cover.

Driving section 172 is transmission mechanisms that the power that will produce by moving back and forth of movable part 164b transmits to cut-out portion 174.Driving section 172 with movable part 164b to the moving back and forth of retainer belt direction of feed, be transformed to the motion with the direction of retainer belt direction of feed quadrature, cut-out portion 174 is moved along the direction with retainer belt direction of feed quadrature.Driving section 172 is made of regional fixture 175 and the movable piece 176 that disposes that pass through across retainer belt.The 1st unit 174a that link with movable piece 176 that driving section 172 makes cut-out portion 174, to the 2nd unit 174b that links with fixture 175 with cut-out portion 174 approach or away from direction move.That is, the driving section 172 of present embodiment under the situation that the movable part 164b of drive division 164 moves to the direction that stretches, makes movable piece 176 move to the direction near fixture 175 as shown in figure 29.Driving section 172 makes movable piece 176 move to the direction away from fixture 175 under the situation that the movable part 164b of drive division 164 moves to the direction of shrinking.As noted above, cutting unit 116a constitutes, and only makes a movement in 2 unit of cut-out portion 174.

Cut-out portion 174 is configured on the retaining zone, will cut off between main body and retainer belt main body at the lead-in wire of the electronic unit that retaining zone disposes and keep.The two keeps the main body of 174 pairs of electronic units 80 of cut-out portion and lead-in wire, and the cut-out that will go between then continues to keep the state that main body and lead-in wire are kept after the cut-out that will go between.Cut-out portion 174 has the 1st unit 174a and the 2nd unit 174b.The 1st unit 174a has the 1st sword 178a, the 1st main body maintaining part 179a and the 1st lead-in wire maintaining part 180a.The 1st sword 178a and the 2nd sword 178b become shut-off mechanism 178, the 1 main body maintaining part 179a and the 2nd main body maintaining part 179b becomes main body maintaining body 179, the 1 lead-in wire maintaining part 180a and the 2nd lead-in wire maintaining part 180b becomes lead-in wire maintaining body 180.Cut-out portion 174 begins disposal subject maintaining body 179, lead-in wire maintaining body 180 and shut-off mechanism 178 in turn from the vertical upside as shown in figure 30.

The each several part of the each several part of the 1st unit 174a and the 2nd unit 174b is configured on the position respect to one another.In addition, retainer belt is configured between the 1st unit 174a and the 2nd unit 174b, and the lead-in wire of the electronic unit that keeps at retainer belt is cut off the main body of mechanism 178 and 180 clampings of lead-in wire maintaining body, electronic unit to be passed through by the position of main body maintaining body 179 clampings.

The 1st unit 174a of cut-out portion 174 is supported on the movable piece 176, with movable piece 176 to approach with the 2nd unit 174b, away from direction (direction of arrow among Figure 30) mobile.If the 1st unit 174a of cut-out portion 174 moves to the direction that approaches with the 2nd unit 174b, the main body that then becomes 179 pairs of electronic units 80 of the main body maintaining body state that the lead-in wire of 180 pairs of electronic units 80 of maintaining body keeps that keeps, goes between.Then, in cut-out portion 174, if the 1st unit 174a further moves to the direction that approaches with the 2nd unit 174b, then the 1st sword 178a of shut-off mechanism 178 and the 2nd sword 178b intersect, and cut-out will go between.In addition, in Figure 30, look to overlap as the 1st sword 178a and the 2nd sword 178b, but because the 1st sword 178a different with the position of the paper left and right directions of the 2nd sword 178b on the paper fore-and-aft direction (tilting with respect to throughput direction), therefore in fact not contact.

Cutting unit 116a as drive source, moves the fixture (main body maintaining body 179, lead-in wire maintaining body 180) that keeps electronic unit 80 and the shut-off mechanism 178 that cuts off lead-in wire 84 by driving section 172 1 drive division 164 in linkage.Thus, cutting unit 116a can carry out the maintenance of electronic unit 80 and the cut-out of lead-in wire by simple structure.In this, cutting unit 116 is also identical.

In addition, cutting unit 116a keeps by the main body 82 of utilizing 179 pairs of electronic units 80 of main body maintaining body, thereby can suitably electronic unit 80 be kept after 84 cut-outs that will go between.Thus, 84 the electronic units 80 after cutting off that can suitably keep going between can utilize suction nozzle 32 easily electronic unit 80 to be kept.In this, cutting unit 116 is also identical.

In addition, cutting unit 116a utilizes fixture that electronic unit 80 is kept by before 84 cut-outs that will go between, especially, main body 82 to electronic unit 80 keeps, thereby can be under the state that electronic unit 80 is remained on the settling position, and 84 cut-outs will go between.Thus, can suitably cut off lead-in wire 84.In addition, will go between by cutting

unit

116a and 84 to utilize fixture that electronic unit 80 is kept before cutting off, thereby can suppress to cut off the situation that the electronic unit behind the lead-in wire 84 comes off or drops from the holding position.

Cutting unit 116a is by on the basis that main body 82 is kept, and 84 keeps going between, thereby can more suitably lead-in wire 84 be cut off in the position that cuts off time limit making line 84.In addition, keep by the lead-in wire 84 that utilizes 180 pairs of main body sides of lead-in wire maintaining body, thus the distortion of the lead-in wire 84 of the main body side that produces can reduce to cut off the time.

Cutting unit 116a by with a side of driving section 172 as fixture 175, thereby mechanism that can simplification device.In addition, can make the holding position of the electronic unit that is kept by cutting unit 116a become stable position, can simplify the operation of boarded head 15.Preferred cutting unit 116a have main body maintaining body 179 and lead-in wire maintaining body 180 the two, but also can only have wherein any one.

Here, cutting unit 116a as shown in figure 27, to form at framework 110a with vertical as inserting bolt 182 in the slotted hole 181,184 of length direction, 185 and fix.Thus, cutting unit 116a can adjust the position of vertical.Thus, can be to the electronic unit that keeps with the retainer belt that moves by feeder unit the position of relative vertical adjust.Therefore, cutting unit 116a can be with respect to the position of retainer belt, and to cutting off the position of the vertical that goes between, that is, the off-position corresponding with the radial lead type electronic unit adjusted.Thus, cutting unit 116a can adjust the length of the lead-in wire after cutting off.In addition, in the present embodiment, the mechanism that the off-position corresponding with the radial lead type electronic unit adjusted adopt the combination of adjusting the slotted hole that direction is length direction and being used for the bolt of fixing position with respect to slotted hole, but position adjusting mechanism is not limited thereto.In electronic part feeder, so long as can adjust the mechanism of position of the Z-direction of cutting unit 116a, more particularly, the mechanism with respect to the position of the Z-direction of the electronic unit retainer belt of retaining zone that can adjust shut-off mechanism gets final product.

In addition, cutting unit 116a has the bar 188 that exposes to the outside of framework 110a.Bar 188 links with the olinear motion part of driving section 172.Thus, cutting unit 116a moves to the direction of arrow by making bar 188, thereby can utilize cut-out portion 174 to carry out the cut-out action of electronic units.That is, move to the direction of arrow by making bar 188, thereby can carry out the action identical with utilize drive division 164 that driving section 172 is moved along a straight line action that direction moves.Thus, for example under the situation about adjusting in the position of carrying out cutting unit 116a, even unfavorable control device 20 with electronic component mounting apparatus 10 drives drive division 164, also can be with the lead-in wire cut-out of electronic unit.In addition, even not under the state of drive division 164 air supply pressure or electric power, also the lead-in wire of electronic unit can be cut off.

In addition, electronic part feeder 100 also can be provided for making the operating portion of drive division 164 drivings at framework 110a.Thus, in electronic part feeder 100, even do not utilize control device 20 to operate, also can carry out the cut-out action of the electronic unit lead-in wire that is undertaken by cutting unit 116a.In addition, in the case, need supply with actuating force (air pressure or electric power) to drive division 164.

Figure 31 A is the key diagram of schematic configuration of the maintaining body of expression cutting unit.Figure 31 B is the key diagram of schematic configuration of other examples of the maintaining body of expression cutting unit.The 2nd main body maintaining part 179b of cutting unit 116a is to have 2 blocks that make the hole 190 of the bolt insertion on the fixture 175 that is fixed on driving section 172 shown in Figure 31 A.In the 2nd main body maintaining part 179b, with the face of the line parallel that 2 holes 190 are connected, constituted by 4 the different faces of distance at a distance of hole 190.Distance between the 1st 191a and the hole 190 is arrow 192a.Distance between the 2nd 191b and the hole 190 is arrow 192b.Distance between the 3rd 191c and the hole 190 is arrow 192c.Distance between the 4th 191d and the hole 190 is arrow 192d.Arrow 192a, arrow 192b, arrow 192c are all different with arrow 192d length.For cutting unit 116a, when being fixed in the 2nd main body maintaining part 179b on the fixture 175, by change the 2nd main body maintaining part 179b towards (counter-rotating, about counter-rotating) up and down, thereby the face relative with the 1st main body maintaining part 179a can be switched to the 1st 191a, the 2nd 191b, the 3rd 191c or the 4th 191d.Here, because the position of the bolt of fixing hole 190 is fixed, so by switching the face relative with the 1st main body maintaining part 179a, can change the face relative with the 1st main body maintaining part 179a of the 2nd main body maintaining part 179b and the distance between the 1st main body maintaining part 179a.

Thus, the 2nd main body maintaining part 179b when cutting unit 116a can move the cut-out of lead-in wire and the distance between the 1st main body maintaining part 179a change to 4 kinds, can suitably adjust the distance between the 2nd main body maintaining part 179b and the 1st main body maintaining part 179a according to the kind of the electronic unit of being supplied with by electronic part feeder 100.

The 2nd main body maintaining part 195 shown in Figure 31 B is octagonal prism shapes, and the 1st main body maintaining part 179a is 1 smooth face.The 2nd main body maintaining part 195 is formed for making the hole 196 of bolt insertion.Hole 196 be with the direction of the throughput direction quadrature of retainer belt, be that the direction that moves of cutting unit is as the slotted hole of length direction.The 2nd main body maintaining part 195 is by adjusting the relative position between hole 196 and the bolt, thereby can adjust with respect to the position of bolt the 2nd main body maintaining part 195 on the direction of action of cut-out portion.As noted above, cutting unit is by using the 2nd main body maintaining part 195, thereby can between the distance of the length direction in hole 196, the face relative with the 1st main body maintaining part 179a of the 2nd main body maintaining part 195 and the distance between the 1st main body maintaining part 179a be adjusted.Thus, cutting unit can be tackled the width of more electronic unit main body.For example, while cutting unit can grasp the cut-out that will go between of 20 kinds of lead-type electronic-parts, make that the kind of the lead-type electronic-part supplied with to the holding position under can the state after cutting off lead-in wire is 20 kinds.

Figure 32 is the key diagram of schematic configuration of other examples of the feeder unit of expression electronic part feeder.Figure 33 is the schematic configuration of feeder unit shown in Figure 32 is observed in expression from other directions oblique view.Figure 34 is the front view of the schematic configuration of expression feeder unit shown in Figure 32.Figure 35 is the vertical view of the schematic configuration of expression feeder unit shown in Figure 32.Figure 36 is the front view of schematic configuration of other states of expression feeder unit shown in Figure 32.Figure 37 is the vertical view of schematic configuration of other states of expression feeder unit shown in Figure 32.In addition, Figure 32 is to feeder unit 200 shown in Figure 37, except the state after can changing retainer belt and carry finishing is that movable part 144b is when moving back and forth in the scope state of elongation, outside the structure of the position of the protuberance 152a of feeding pawl 152, have the structure identical with feeder unit 114 basically.

Feeder unit 200 has support portion 202, drive division 204, the 1st front end support portion 206, the 208, the 2nd front end support portion 209, retainer belt feeding pawl unit, Return-ing direction retainer belt feeding pawl unit 210 and link gear 211.Drive division 204 has the structure identical with drive division 144.In addition, the 1st front end support portion 206 of present embodiment and retainer belt feeding pawl unit 208 do not have the function of the position adjustment of retainer belt direction of feed.In addition, retainer belt feeding pawl unit 208 does not have the grasping part.Other structures of the 1st front end support portion 206 and retainer belt feeding pawl unit 208 are identical with retainer belt feeding pawl unit 148 with front end support portion 146.

Support portion 202 is mechanisms that drive division 204, the 1st front end support portion 206, retainer belt feeding pawl unit 208, Return-ing direction retainer belt feeding pawl unit 210 and link gear 211 are supported directly or indirectly, is fixed on the framework 110.Support portion 202 has

support component

222,2

lug bosses

230,2

screws

232 and 2 screws 236.

Support component 222 is the plate-shaped member relative with the wideest face of the area of the elongated box shape of framework 110, and is relative with a face of drive division 204, the 1st front end support portion 206, retainer belt feeding pawl unit 208.Support component 222 links with the fixed part of drive division 204, and fixed part is supported.In addition, support component 222 is fixed on the framework 110 via lug boss 230.

Lug boss 230 is configured on the face of the face opposition side relative with retainer belt feeding pawl unit 208 grades of support component 222.Lug boss 230 to retainer belt feeding pawl unit 208 grades away from direction protrude.Lug boss 230 is on the retainer belt direction of feed of support component 222, with 2 of configurations on the position of predetermined distance separation.

2 screws 232 screw togather with the side end (with the end of support component 222 contact sides) of lug boss 230 respectively.In addition, screw 232 is inserted into respectively among the slotted hole 222a that forms on the support component 222.The slotted hole 222a that forms on the support component 222 is the hole of extending along the retainer belt direction of feed.In addition, slotted hole 222a has and makes the screw 232 can be along retainer belt direction of feed mobile shape in the scope of the amount of a pitch of holes of retainer belt.

2 screws 236 screw togather with the end side of lug boss 230 respectively.In addition, screw 236 is inserted into respectively in the slotted hole 212 that forms on the framework 110.The slotted hole 212 that forms on the framework 110 is the holes of extending along the retainer belt direction of feed.In addition, slotted hole 212 has and makes the screw 236 can be along retainer belt direction of feed mobile shape in the scope of a pitch of holes that is equivalent to retainer belt.

In addition, in feeder unit 200, the screw 232 that screws togather with lug boss 230 inserts among the slotted hole 222a of support component 222.The slotted hole 222a that forms on the lug boss 230 of feeder unit 200, screw 232, the support component 222 is combined into position adjusting mechanism.With respect to feeder unit 200, by tightening screw 232 that lug boss 230 and support component 222 is fastening, thus feeder unit 200 and framework 110 can be fixed by the relative position on the retainer belt direction of feed.In addition, with respect to feeder unit 200, by becoming the state after screw 232 unclamped, thereby slotted hole 222a and screw 232 are relatively moved.Thus, can make the support component 222 that is formed with slotted hole 222a, relatively move in the retainer belt direction of feed with respect to the lug boss 230 that has inserted screw 232.For feeder unit 200, relatively move by making support component 222 and lug boss 230, thereby can form the state that feeder unit 200 is moved along the retainer belt direction of feed with respect to framework 110.Thus, for feeder unit 200, by unclamping screw 232, can adjust feeder unit 200 and the relative position of framework 110 on the retainer belt direction of feed, by tightening screw 232, feeder unit 200 and framework 110 can be fixed by the relative position on the retainer belt direction of feed.

In addition, for feeder unit 200, the screw 236 that screws togather with lug boss 230 inserts in the slotted hole 212 of framework 110.The slotted hole 212 that forms on the lug boss 230 of feeder unit 200, screw 236, the framework 110 be combined into position adjusting mechanism.For feeder unit 200, by tightening screw 236 that lug boss 230 and framework 110 is fastening, feeder unit 200 and framework 110 can be fixed by the relative position on the retainer belt direction of feed.In addition, for feeder unit 200, by forming the state after screw 236 unclamped, slotted hole 212 and screw 236 are relatively moved.Thus, can make the framework 110 that is formed with slotted hole 212, relatively move in the retainer belt direction of feed with respect to the lug boss 230 that has inserted screw 236.For feeder unit 200, relatively move by making framework 110 and lug boss 230, can form the state that feeder unit 200 is moved along the retainer belt direction of feed with respect to framework 110.Thus, for feeder unit 200, by unclamping screw 236, can adjust by the relative position on the retainer belt direction of feed feeder unit 200 and framework 110, by tightening screw 236, can fix by the relative position on the retainer belt direction of feed feeder unit 200 and framework 110.

Can make the structure that feeder unit 200 is whole and framework 110 relatively moves along the retainer belt direction of feed because feeder unit 200 forms, so needn't carry out part replacement etc., just can be simply the position of the retainer belt direction of feed of feeding pawl be adjusted.In addition, for feeder unit 200, by only unclamping screw 232 from the outside of framework 110, feeder unit 200 is moved with respect to framework 110.Thus, can carry out the adjustment of the position on the retainer belt direction of feed of feeding pawl more simply.Here, operating personnel by grasping support component 222, make support component 222 move along the retainer belt direction of feed with respect to framework 110, thereby can relatively move when feeder unit 200 and framework 110 are relatively moved along the retainer belt direction of feed.In addition, operating personnel also can grasp lug boss 230 and relatively move.In addition, when operating personnel make feeder unit 200 and framework 110 relatively move along the retainer belt direction of feed unclamping screw 236, by grasping the screw 236 after unclamping, screw 236 is moved with respect to slotted hole 212, thereby feeder unit 200 and framework 110 are relatively moved along the retainer belt direction of feed.In the case, preferably make screw 236 form the shape that is easy to grasp.

In addition, for feeder unit 200, utilize the mechanism that screw 232 and slotted hole 222a combination are formed to carry out under the situation that relative position moves, preferably becoming the state that utilizes screw 236 that framework 110 and lug boss 230 is fixing.In addition, for feeder unit 200, utilize the mechanism that screw 236 and slotted hole 212 are combined to make under the situation that relative position moves, preferably becoming the state that utilizes screw 232 that support component 222 and lug boss 230 is fixing.

In addition, in feeder unit 200, these two mechanisms of mechanism that mechanism that screw 232 and slotted hole 222a are combined are set as position adjusting mechanism and screw 236 and slotted hole 212 are combined, can utilize them that the relative position on the retainer belt direction of feed between feeder unit 200 and the framework 110 is adjusted, but be not limited thereto.In feeder unit 200, as position adjusting mechanism, the mechanism that screw 232 that part place that lug boss 230 and support component 222 are fixed arranges and slotted hole 222a combine can only be set also.In addition, in feeder unit 200, as position adjusting mechanism, the part that lug boss 230 and framework 110 is fixing also can only be set, be the mechanism that screw 236 and slotted hole 212 combine.

In addition, for feeder unit 200, by utilizing drive division 204 that the 1st front end support portion 206 is moved back and forth along the retainer belt direction of feed, thereby retainer belt feeding pawl unit 208 is moved back and forth between Figure 34 and position shown in Figure 35 and Figure 36 and position shown in Figure 37.Thus, move back and forth by making retainer belt feeding pawl unit 208, thus can with feeder unit 114 in the same manner, with retainer belt along the each amount of carrying 1 spacing of retainer belt direction of feed.

Here, the feeder unit 200 of present embodiment is as noted above, also has the 2nd front end support portion 209, Return-ing direction retainer belt feeding pawl unit 210 and link gear 211.Below, use Figure 32 to Figure 37 and Figure 38 to Figure 43, the 2nd front end support portion 209, Return-ing direction retainer belt feeding pawl unit 210, link gear 211 are described.Figure 38 is the key diagram of the schematic configuration of expression feeder unit shown in Figure 32.Figure 39 is the key diagram of schematic configuration of other states of expression feeder unit shown in Figure 32.Figure 40 is the key diagram of schematic configuration of the link gear of expression feeder unit shown in Figure 32.Figure 41 is the key diagram of schematic configuration of other examples of expression framework.Figure 42 is the key diagram for the action of explanation feeder unit shown in Figure 32.Figure 43 is the key diagram for the action of explanation feeder unit shown in Figure 32.In Figure 41, framework 280 for being described, feeder unit 200 is shown.

As Figure 38 and shown in Figure 39, the 2nd front end support portion 209 is the plate-shaped member relative with the wideest face of the area of the elongated box shape of framework 110, and is relative with another face of drive division 204, the 1st front end support portion 206, retainer belt feeding pawl unit 208.That is, the 2nd front end support portion 209 and support component 222 are configured on the position of drive division 204, the 1st front end support portion 206 and retainer belt feeding pawl unit 208.The 2nd front end support portion 209 is fixed on the support component 222 via linking part 226, link gear 211.The 2nd front end support portion 209 is mechanisms that Return-ing direction retainer belt feeding pawl described later unit 210 is supported, and utilizes linking part 226 and link gear 211 to link.The part of the vertical upside of the 2nd front end support portion 209 is exposed from framework 110.That is, the part of the vertical upside of the 2nd front end support portion 209 is exposed from the outside towards framework 110 of the formation guiding groove 120 of framework 110.On the part of the vertical upside of the 2nd front end support portion 209, grasping part 228 is set.In addition, support component 222 and the 2nd front end support portion 209 are supporting the 1st front end support portion 206 along the state that the retainer belt direction of feed moves.

Linking part 226 is made of bolt and nut etc., and the 2nd front end support portion 209 is fixed on the link gear 211.Grasping part 228 is as noted above, is arranged on the part place of the vertical upside of the 2nd front end support portion 209.Grasping part 228 is the parts that can be grasped by operating personnel.Grasping part 228 forms the shape that is easy to make operating personnel that the 2nd front end support portion 209 is moved along the direction parallel with the retainer belt direction of feed.Operating personnel move along the direction parallel with the retainer belt direction of feed by making the 2nd front end support portion 209, thereby can make retainer belt feeding pawl unit 208 and Return-ing direction retainer belt feeding pawl unit 210, move along the direction parallel with the retainer belt direction of feed.

Return-ing direction retainer belt feeding pawl unit 210 is and retainer belt feeding pawl unit 208 essentially identical structures.Return-ing direction retainer belt feeding pawl unit 210 towards with the surperficial quadrature of support portion 202, be configured in away from the position of retainer belt feeding pawl unit 208 and the position relative with retainer belt feeding pawl unit 208.Return-ing direction retainer belt feeding pawl unit 210 is fixed on the 2nd front end support portion 209, and is mobile along straight line moving direction (direction that the movable part of drive division 204 moves) with the 2nd front end support portion 209.In addition, Return-ing direction retainer belt feeding pawl unit 210 make feeding pawl on the straight line moving direction towards opposite with retainer belt feeding pawl unit 208.In addition, Return-ing direction retainer belt feeding pawl unit 210 makes the protuberance of feeding pawl protrude to a side opposite with support portion 202 sides.

Link gear 211 is will be passed to the power of the 1st front end support portion 206 from drive division 204 to the mechanism of the 2nd front end support portion 209 transmission.Link gear 211 has the 1st slide mechanism 242, driving section 244 and the 2nd slide mechanism 246 as shown in figure 40.The 1st slide mechanism 242 has fixed part 242a and movable part 242b.Fixed part 242a is fixed on the support portion 202.Movable part 242b is being supported on the fixed part 242a along the mobile state of straight line moving direction (direction that the movable part of drive division 204 moves).Movable part 242b is fixed on the 1st front end support portion 206, moves along the straight line moving direction with the 1st front end support portion 206.

Driving section 244 is to transmit the transmission mechanism that next power transmits to the 2nd slide mechanism 246 from the 1st slide mechanism 242.Driving section 244 has via pin and is fixed on gear on the support portion.

The 2nd slide mechanism 246 has fixed part 246a and movable part 246b.Fixed part 246a is fixed on the support portion 202.Movable part 246b is being supported on the fixed part 246a along the mobile state of straight line moving direction (direction that the movable part of drive division 204 moves).Movable part 246b is fixed on the 2nd front end support portion 209, moves along the straight line moving direction with the 2nd front end support portion 209.

Link gear 211 has said structure, and as driving section 244, gear is embedded in gear grooved that the movable part 242b of the 1st slide mechanism 242 go up to form and in the gear grooved that the movable part 246b of the 2nd slide mechanism 246 forms.That is, link gear 211 utilizes pinion and rack that driving section 244 and the 1st slide mechanism 242 are linked, and utilizes pinion and rack that driving section 244 and the 2nd slide mechanism 246 are linked.In addition, as shown in figure 40, for link gear 211, the position that driving section 244 and the 1st slide mechanism 242 are linked and with the position that driving section 244 and the 2nd slide mechanism 246 link becomes the position relative with gear.Thus, in feeder unit 200, if gear rotation, then the 1st slide mechanism 242 and the 2nd slide mechanism 246 are opposite to movement towards each other along the straight line moving direction.

Here, the framework 280 to fixed supply device unit 200 describes.As shown in figure 41, framework 280 forms the guiding groove 282 identical with above-mentioned framework 110.Being shaped as of guiding groove 282,2 line parts 283 that will form along the length direction of the elongate surface of the vertical upside of framework 280, a side end of 285 link at reflex part 284 places.That is, guiding groove 282 forms following U word shape, that is, line part 283 extends near the end side from a side end of framework 280, turns back near reflex part 284 places end side, and line part 285 extends to a side end.Guiding groove 282 is the grooves to the channeling conduct of electronic unit retainer belt, supplies with the electronic unit retainer belt from a side end (end of supply side) of U word shape.Guiding groove 282 makes the electronic unit retainer belt of supplying with move along the U word shape, discharges from a side end (discharging the end of side) of U word shape.In addition, 282 pairs of retainer belt main bodys of guiding groove are positioned at the inside of framework 280 and the electronic unit retainer belt channeling conduct of the state that electronic unit is exposed to framework 280 outsides.The reflex part 284 of framework 280 is at the outer circumferential side of the conveyor zones of retainer belt configuration guide portion 286a, disposes guide portion 286b in interior all sides of the conveyor zones of retainer belt.Guide portion 286a, 286b form respectively along the curve form of the periphery of the conveyor zones of turning back and interior week bending.Framework 280 is by arranging guide portion 286a, 286b and can utilize reflex part 284 that retainer belt is moved along suitable direction at reflex part 284 places.

Below, use Figure 42 and Figure 43, the feed motion of the electronic unit retainer belt of feeder unit 200 is described.As shown in figure 42, for feeder unit 200, the fixing retainer belt feeding pawl unit 208 in the 1st front end support portion 206, the fixing Return-ing direction retainer belt feeding pawl unit 210 in the 2nd front end support portion 209.

Retainer belt feeding pawl unit 208 has feeding pawl 152.Feeding pawl 152 and above-mentioned retainer belt feeding pawl unit 148 are the parts with protuberance 152a that the side end at bar-like member protrudes in the same manner.Feeding pawl 152 is configured on the position relative with the hole of the retainer belt main body of electronic unit retainer belt 70, protuberance 152a is shaped as, the face 152b in the direction of feed downstream on the retainer belt direction of feed (front side of direction of feed) becomes the face with the direction of feed quadrature, the face 152c of the direction of feed upstream side on the retainer belt direction of feed (rear side of direction of feed) become with respect to the face of the face tilt of direction of feed quadrature, along with near retainer belt, the narrowed width on the direction of feed.Feeding pawl 152 becomes the state that protuberance 152a inserts in the hole as shown in figure 42 under porose 78 situation on the position relative with protuberance 152a.Here, retainer belt feeding pawl unit 208 is configured on the position relative with the retainer belt 70 of the line part 283 that is arranged in guiding groove 282, and protuberance 152a is configured in reflex part 284 sides.Retainer belt feeding pawl unit 208 will be arranged in the retainer belt 70 of the line part 283 of guiding groove 282 and carry to the retaining zone PP of attract electrons parts.

Return-ing direction retainer belt feeding pawl unit 210 has feeding pawl 252.Feeding pawl 252 and above-mentioned retainer belt feeding pawl unit 208 are the parts with protuberance 252a that the side end at bar-like member protrudes in the same manner.Feeding pawl 252 is configured on the position relative with the hole of the retainer belt main body of retainer belt 70, protuberance 252a is shaped as, the face 252b in the direction of feed downstream on the retainer belt direction of feed (front side of direction of feed) becomes the face with the direction of feed quadrature, the face 252c of the direction of feed upstream side on the retainer belt direction of feed (rear side of direction of feed) become with respect to the face of the face tilt of direction of feed quadrature, along with near retainer belt, the narrowed width on the direction of feed.Feeding pawl 252 becomes the state that protuberance 252a inserts in the hole as shown in figure 42 under porose 78 situation on the position relative with protuberance 252a.Here, on the relative position of the retainer belt of Return-ing direction retainer belt feeding pawl unit 210 configuration and the line part 285 that is arranged in guiding groove 282 70, protuberance 252a is configured in a side opposite with reflex part 284 sides.That is, the feeding pawl 252 of Return-ing direction retainer belt feeding pawl unit 210 is configured to, on the straight line moving direction opposite with the feeding pawl 152 of retainer belt feeding pawl unit 208 towards.Return-ing direction retainer belt feeding pawl unit 210 will be by the retainer belt 70 behind the retaining zone PP of attract electrons parts, carries to the discharge portion of the line part 285 of guiding groove 282.

Below, use Figure 43, the retainer belt feed motion of feeder unit 200 is described.In step S6, the protuberance 152a of feeding pawl 152 inserts in the hole 78 of the retainer belt main body of retainer belt 70, and the protuberance of feeding pawl 252 inserts in the hole of retainer belt main body.Here, the protuberance of feeding pawl 152 is inserted into the hole of comparing the retainer belt 70 that is arranged in upstream side (before retaining zone PP) on the retainer belt direction of feed with retaining zone PP.The protuberance of feeding pawl 252 is inserted into the hole of comparing the retainer belt that is arranged in downstream (after retaining zone PP) and turns back at reflex part 284 places on the retainer belt direction of feed with retaining zone PP.Feeder unit 200 is shown in step S6, the protuberance of feeding pawl 152 is inserted in the hole, make under the state that the protuberance of feeding pawl 252 inserts in the hole, drive division 204 is driven, and retainer belt feeding pawl unit 208, Return-ing direction retainer belt feeding pawl unit 210 move 1 amount that pitch of holes is corresponding with the retainer belt main body along the retainer belt direction of feed.

If feeder unit 200 is under the state of step S6, retainer belt feeding pawl unit 208, Return-ing direction retainer belt feeding pawl unit 210 are carried along the retainer belt direction of feed, then utilize protuberance and the face direction of feed quadrature of protuberance and the face direction of feed quadrature and the feeding pawl 252 of feeding pawl 152, the hole is pushed to the retainer belt direction of feed, shown in step S7, retainer belt feeding pawl unit 208 and retainer belt are all moved to the retainer belt direction of feed.Here, retainer belt feeding pawl unit 208 and Return-ing direction retainer belt feeding pawl unit 210, utilize link gear 211 towards each other opposite direction move.As noted above, Return-ing direction retainer belt feeding pawl unit 210, by moving along the direction opposite with retainer belt feeding pawl unit 208, thereby can the retainer belt in the hole of inserting feeding pawl 152,252 will be had, be guiding groove 282 along the retainer belt direction of feed, to carrying towards the direction of discharge portion from guide portion.

If retainer belt feeding pawl unit 208, Return-ing direction retainer belt feeding pawl unit 210 mobile ends along the retainer belt direction of feed (step S7), then feeder unit 200 makes the electronic unit of the front end that the retainer belt main body keeps be in the holding position and standby.At this moment, be positioned at the electronic unit of holding position (retaining zone) PP, the electronic unit main body is held and by the cut-out that will go between of cut-out portion.Then, carry out predetermined process in the electronic component mounting apparatus side, after the electronic unit that is positioned at the holding position that for example retainer belt is kept is supplied with to boarded head, send and drive instruction, drive division 204 is driven, make retainer belt feeding pawl unit 208, Return-ing direction retainer belt feeding pawl unit 210 along the direction opposite with the retainer belt direction of feed, move 1 amount that pitch of holes is corresponding with retainer belt main body 72.If feeder unit 200 is under the state of step S7, retainer belt feeding pawl unit 208, Return-ing direction retainer belt feeding pawl unit 210 are carried to a side opposite with the retainer belt direction of feed, then the inclined plane of feeding pawl 152,252 protuberance contacts with the hole, and feeding pawl 152,252 protuberance are moved along be tilted to the direction of extracting from the hole.Thus, feeder unit 200 is shown in step S8, make feeding pawl 152,252 protuberance break away from (step S8) from the hole, retainer belt is mobile, and retainer belt feeding pawl unit 208, Return-ing direction retainer belt feeding pawl unit 210 move to the opposition side with the retainer belt direction of feed.

Then, at feeder unit 200 from the state shown in the step S7, make retainer belt feeding pawl unit 208, Return-ing direction retainer belt feeding pawl unit 210 along the direction opposite with the retainer belt direction of feed, after mobile corresponding with 1 pitch of holes of retainer belt main body 72 amount, shown in step S9, become feeding pawl 152,252 protuberance inserts with the hole of inserting among the step S7 compares the state in the hole of 1 amount of separation that is arranged in upstream side.Then, drive division 204 drives to the retainer belt direction of feed immediately, and the next electronic unit that keeps in the retainer belt main body 72 is carried to the holding position.

Feeder unit 200 is as noted above, by utilize drive division 204 make retainer belt feeding pawl unit 208 with the amount of 1 pitch of holes correspondence of retainer belt main body 72 along the direction of feed reciprocating motion, thereby can make retainer belt along the direction of feed amount of mobile 1 spacing in turn.

In addition, feeder unit 200 is by arranging Return-ing direction retainer belt feeding pawl unit 210, utilize link gear 211, Return-ing direction retainer belt feeding pawl unit 210 is driven with 208 interlocks of retainer belt feeding pawl unit, thereby can will carry along direction of feed by the retainer belt behind the retaining zone PP.As noted above, owing to can will carry along direction of feed by the retainer belt behind the retaining zone PP, so can retainer belt be moved in these both sides of upstream and downstream of retaining zone PP.Thus, can be suppressed at the situation of the position skew of retainer belt bending among the retaining zone PP or retainer belt.In addition, the feeder unit 200 of present embodiment makes retainer belt feeding pawl unit 208 and Return-ing direction retainer belt feeding pawl unit 210 mobile in linkage by utilizing link gear 211, thereby can utilize 1 driving mechanism that 2 feeding pawls are moved.In addition, by mobile in linkage, the distance between 2 feeding pawls can be kept fixingly, can suitably carry retainer belt.

Here, preferred electron assembly supply device 100 is shown in the respective embodiments described above, on the retainer belt direction of feed, the downstream of the allocation position of feeding pawl 152 and the upstream side compared with reflex part configuration retaining zone (holding position) PP in feeder unit 200.Namely, preferably in electronic part feeder 100, will utilize suction nozzle 32 keep the retaining zone PP of electronic units 80, be configured between the position of clamping between the reflex part of feeding pawl 152 that electronic unit retainer belt 70 is carried to retaining zone and guiding groove 282.Thus, the situation of the crooked or distortion of electronic unit retainer belt 70 by retaining zone PP can be suppressed, the position of electronic unit retainer belt 70 at retaining zone PP place and the position stability of electronic unit 80 can be made.

Figure 44 is the key diagram of schematic configuration of other examples of expression assembly supply device.Figure 45 amplifies the part of Figure 44 and the key diagram of expression.Electronic part feeder 310 has the plate-shaped member 312 that links with feeder unit, forms opening 314 in framework.Plate-shaped member 312 moves along throughput direction with the fixed part of feeder unit.The position that the end with plate-shaped member 312 of opening 314 in the movable range of plate-shaped member 312 overlaps forms a plurality of limit 314a, 314b, 314c, the 314d that extend along vertical.Here, limit 314a, 314b, 314c, 314d are formed on the interval in the hole of various retainer belts and electronic unit with respect on the corresponding position of the configuration in hole.The user is at the combination with respect to the configuration in hole of the interval in the hole of retainer belt and electronic unit, make plate-shaped member 312 the limit the position and align with the limit of the term harmonization of limit 314a, 314b, 314c, 314d, thereby can electronic unit be carried to retaining zone by feeder unit.In addition, in the present embodiment, with above-mentioned execution mode in the same manner, the interval in the hole of retainer belt and electronic unit be with respect to the 4 kinds of situations that are combined as of the configuration in hole, but as long as corresponding with combination and change the shape of opening 314.

Figure 46 is the key diagram of schematic configuration of other examples of expression assembly supply device.Figure 47 amplifies the part of Figure 46 and the key diagram of expression.Figure 46 and electronic part feeder 320 shown in Figure 47 dispose retainer belt in discharge portion and discharge guide portion 322.Retainer belt discharge angle that guide portion 322 forms with the semicircular cylinder on the face relative with discharge portion and vertical be 60 spend towards being configured.In addition, retainer belt is discharged guide portion 322 and is disposed plate-shaped member at the face relative with guide portion 122.Electronic part feeder 320 is discharged guide portion 322 by the configuration retainer belt, thereby can make the retainer belt of discharging from discharge portion 126 change direction along semicircular cylinder portion, to the suitably channeling conduct of vertical downside.Thus, can the discharge angle of the electronic unit retainer belt of discharging by guiding groove and from discharge portion be limited.Retainer belt is discharged guide portion 322 by the face relative with discharge portion is made as cylinder, thereby can reduce load that the electronic unit retainer belt is applied, can suitably make the electronic unit retainer belt change direction.In addition, retainer belt is discharged guide portion 322 and is made as with respect to vertical 60 degree by the angle of inclination with cylindrical portion, thereby can reduce load that the electronic unit retainer belt is applied, can suitably make the electronic unit retainer belt change direction.In addition, retainer belt is discharged guide portion 322 by adopting Figure 46,47 structure, thereby can change direction swimmingly, can discharge the electronic unit retainer belt to the position of expectation, but be not limited to this structure.

Figure 48 is the key diagram of schematic configuration of other examples of expression assembly supply device.Figure 49 amplifies the part of Figure 48 and the key diagram of expression.Figure 48 and electronic part feeder 320 shown in Figure 49, guide portion 122 is provided with parts placing box 324.Parts placing box 324 arranges lock section 326, and lock section 326 links with guide portion 122, is supported on the guide portion 122.The electronic unit retainer belt that parts placing box 324 subtend electronic part feeders 320 are supplied with is accommodated.In addition, the electronic unit retainer belt also can be placed in the parts placing box 324 with the chest of accommodating this electronic unit retainer belt.Electronic part feeder 320 can shorten the position of stored electrons parts retainer belt and the distance between the guide portion 122 by parts placing box 324 is set.Thus, can reduce from the position of stored electrons parts retainer belt to guide portion 122 carry during load that the electronic unit retainer belt is applied.Thus, can utilize suitably conveying electronic parts retainer belt of electronic part feeder 320.In addition, the situation that can suppress that the electronic unit retainer belt ruptures because of deadweight or the hole is elongated.

Below, 14f describes to the parts feed unit.Here, parts feed unit 14f has 2 bowl formula feeder assemblys 90.2 bowl formula feeder assemblys 90 dispose side by side, are essentially identical structure.Below, 1 bowl formula feeder assembly 90 is described.

Figure 50 is the oblique view of the schematic configuration of expression bowl formula feeder assembly.Figure 51 is the oblique view of the schematic configuration of expression bowl formula feeder assembly shown in Figure 50.Bowl formula feeder assembly 90 has 2 bowl formula feeder units 400 and supporting mechanism 401 shown in Figure 50 and Figure 51.In the present embodiment, bowl formula feeder unit 400 and bowl formula feeder assembly 90 are controlled action by control part.The control device 20 that bowl formula feeder unit 400 and bowl formula feeder assembly 90 can have electronic component mounting apparatus 10 uses as control part, also can be that bowl formula feeder unit 400 and bowl formula feeder assembly 90 have control part.

Supporting mechanism 401 is mechanisms that 2 bowl formula feeder units 400 are supported.Supporting mechanism 401 has supporting bracket 491, support stick 492 and linking part 493.Supporting bracket 491 is plate-shaped members, arranges and fix 2 bowl formula feeder units 400.The front end of the supply part side of supporting bracket 491 and the locating shaft 44b of front side receptacle 44 and recess 44c link.Support stick 492 links via the side away from front side receptacle 44 of linking part 493 with supporting bracket 491.The end of the vertical downside of support stick 492 is supported on the face that arranges (ground) that electronic component mounting apparatus 10 is set.The supporting bracket 491 that supporting mechanism 401 utilizes

front side receptacle

44 and 492 pairs of support sticks to be provided with 2 bowl formula feeder units 400 supports.Supporting mechanism 401 is by supporting supporting bracket 491 at front side receptacle 44 with away from support stick 492 these 2 positions of front side receptacle 44, thereby can suppress supporting bracket 491 bendings.Thus, can suppress that bowl vibration of formula feeder unit 400 becomes the vibration of supporting bracket 491 and absorbed situation can suitably drive bowl formula feeder unit 400.

1 bowl formula feeder unit 400 that bowl formula feeder assembly 90 has is configured to, the bowl of accommodating described later is lined up 2 row with the bowl of accommodating of other bowls formula feeder unit 400 along vertical, and is offset along front and back with respect to holding position (front end of guide rail 422, absorption position).That is, bowl formula feeder assembly 90 is on Y-direction, and the aftermentioned of 2 bowl formula feeder units 400 is accommodated bowl and is configured on the front and back position.And, on directions X (with the direction of guide rail bearing of trend quadrature described later, the throughput direction of substrate), at least a portion of accommodating the configuring area between the bowl that the bowl formula feeder unit 400 of accommodating bowl and the 2nd row that the bowl formula feeder unit 400 of the 1st row has has overlaps.That is, bowl formula feeder assembly 90 is on directions X, and the position that the aftermentioned of 2 bowl formula feeder units 400 is accommodated bowl overlaps the ground configuration.In addition, bowl formula feeder assembly 90 is on Y-direction, and the aftermentioned of 2 bowl formula feeder units 400 is accommodated bowl and is configured on the front and back position.Thus, bowl formula feeder assembly 90 can dispose a bowl formula feeder unit 400 efficiently.Specifically, the narrowed width of directions X can be made, but more assembly supply device can be in the parts supply area of electronic component mounting apparatus 10, disposed.

In the present embodiment, the bowl formula feeder unit 400 of the 1st row has accommodates the bowl formula feeder unit 400(that bowl and the 2nd is listed as and compares the position that is configured in away from the holding position with the 1st bowl formula feeder unit 400 that is listed as) have accommodate bowl, with the direction (throughput direction of directions X, substrate) of the bearing of trend quadrature of guide rail on, be configured in 2 times the zone less than the external diameter of accommodating bowl.Like this, the narrowed width of directions X can be made reliably, but more assembly supply device can be in the parts supply area of electronic component mounting apparatus 10, disposed.

Below, use Figure 52 to Figure 67 B, the bowl formula feeder unit 400 of the bowl formula feeder assembly 90 of parts feed unit 14f is described.Bowl formula feeder unit 400 shown in Figure 52 to Figure 67 B is used as electronic part feeder with bowl formula feeder.At first, use Figure 52 to Figure 54, the overall structure of bowl formula feeder unit 400 is described.Figure 52 is the end view of other examples of expression parts feed unit.Figure 53 is the vertical view of other examples of expression parts feed unit.Figure 54 is the end view that the state behind the bowl is accommodated in expression dismounting from the parts feed unit shown in Figure 52.

Bowl formula feeder unit 400 has electronic part feeder (bowl formula feeder) 402,404,406, drive unit 408 and fixed part 410.That is, a bowl formula feeder unit 400 is to have 3 electronic part feeders 402,404,406 and can be in the mechanism of 3 position supply parts.In addition, 1 drive unit 408 of bowl formula feeder unit 400 becomes electronic part feeder 402,404,406 drive division.In addition, in bowl formula feeder unit 400,410 pairs of electronic part feeders 402 of fixed part, 404,406 and drive unit 408 support.Fixed part 410 has support portion 442 and the support portion 444 of the shaped as frame shape that extends along vertical, in top and bottom to electronic part feeder 402,404,406 and drive unit 408 support.In addition, support portion 442 and support portion 444 extend to till the rotating shaft of drive unit 408 described later, can be under the state that rotates of rotating shaft center with electronic part feeder 402,404,406 object part at drive unit 408, drive unit 408 is supported.

Electronic part feeder 402 has accommodates a bowl 420a, guide rail 422a, supporting mechanism 424a and linking part 436a.Electronic part feeder 404 has accommodates a bowl 420b, guide rail 422b, supporting mechanism 424b and linking part 436b.Electronic part feeder 406 has accommodates a bowl 420c, guide rail 422c, supporting mechanism 424c and linking part 436c.Electronic part feeder 402,404,406 laminated configuration on the position of the location overlap on the horizontal direction of accommodating a

bowl

420a, 420b, 420c, from vertical top in turn to accommodate the arranged in order of a

bowl

420a, 420b, 420c.In addition, supporting mechanism 424a, the 424b in the electronic part feeder 402,404,406,424c dispose at grade side by side.That is, the holding position configuration separately of

many guide rail

422a, 422b, 422c at grade.

Electronic part feeder 402,404,406 is allocation position difference and because of the different relation guide rail 422a of this allocation position, the shape difference of 422b, 422c only, is essentially same structure.Below, at electronic part feeder 402,404,406 the common ground of accommodating a

bowl

420a, 420b, 420c, describe to accommodate bowl 420.In the same manner, at the common ground of

guide rail

422a, 422b, 422c, describe with guide rail 422.At the common ground of supporting

mechanism

424a, 424b, 424c, describe with supporting mechanism 424.At the common ground of linking

part

436a, 436b, 436c, describe with linking part 436.

Accommodating bowl 420 is containers of putting into a plurality of electronic units.Guide rail 422 becomes accommodates bowl 420 electronic unit to the guide member of absorption position guiding with putting into.Supporting mechanism 424 is the mechanisms that the electronic unit by guide rail 422 guiding supported at absorption position.Linking part 436 with accommodate executing of bowl 420 and drive unit 408 portion of shaking and link, from drive unit 408 to accommodating bowl 420 transmitting vibrations.In addition, in the present embodiment, in electronic part feeder 402,404,406, linking part 436 and drive unit 408 become the vibration section.Below, each several part is elaborated.

Use Figure 55 and Figure 56, describe accommodating bowl 420.Figure 55 is the key diagram of the relation between the support portion of accommodating bowl and vibration section of electronic part feeder of the parts feed unit of expression shown in Figure 53.Figure 56 is the key diagram of the schematic configuration of accommodating bowl shown in expression Figure 55.It is as noted above to accommodate bowl 420, is the container of putting into a plurality of electronic units.Accommodating the main body 450 as container of bowl 420, is that the bottom surface is that circle, outer rim are to the direction extension vertical with the bottom surface, the box shape of upper surface open.Accommodate bowl 420 on the bottom surface of main body 450, have the lug boss 451 that extends to the vertical downside, be inserted with in the lug boss 451 for the secure component 452 fastening with linking part 436.Secure component 452 is screw (mounting screws), can be supporting with respect to the state of lug boss 451 rotations and with the structure that does not break away from from lug boss 451.Linking part 436 is provided with by secure component 452 and carries out fastening fastener hole (screw hole) 454.Accommodate bowl 420 by secure component 452 is fastened in the fastener hole 454, thereby be fixed on the linking part 436.

As noted above, accommodating bowl 420 utilizes secure component 452 to be fixed in structure on the linking part 436 with dismountable state by employing, thereby can from electronic part feeder 402,404,406 and bowl formula feeder unit 400 on, easily dismantle accommodating bowl 420.Thus, can easily change accommodate the bowl 420.

And, a side end of guide rail 422 with accommodate bowl 420 and link end side and supporting mechanism 424 bindings.Guide rail 422 is formed with the guiding groove to the electronic unit channeling conduct, makes from accommodating bowl 420 electronic units of taking out of to move along guiding groove, and guides to the part that links with supporting mechanism 424.In addition, as described later, guide rail 422 with accommodate partial fixings that bowl 420 links on the vibration section of drive unit 408, with accommodating bowl 420 vibrations.In addition, the side end that guide rail 422 and supporting mechanism 424 link, supported with the state of can slide along the bearing of trend of guide rail 422 (can slide along a direction).

2 bowl formula feeder units 400 shown in Figure 50, Figure 51 all have an a plurality of

bowl

420a, 420b, the 420c of accommodating towards the vertical configuration.Bowl formula feeder unit 400 as the 1st row that will be nearest with the holding position separately (absorption position) of a plurality of

guide rail

422a, 422b, 422c will be compared a bowl formula feeder unit 400 as the 2nd row away from the holding position with it.At this moment, bowl formula the feeder unit 400 a plurality of

guide rail

422a, 422b, the 422c that have of the 2nd row, a plurality of guide rail 422a that have at the 1st bowl formula feeder unit 400 that is listed as, the side of 422b, 422c dispose side by side along vertical.And, shown in Figure 53, the direction of the bearing of trend quadrature of their front end edge and a plurality of

guide rail

422a, 422b, 422c is launched, and the holding position separately of a plurality of

guide rail

422a, 422b, 422c, is that configuration is at grade side by side for supporting

mechanism

424a, 424b, 424c.

Below, use Figure 57 A to Figure 58 B, supporting mechanism 424 is described.Figure 57 A is the oblique view of schematic configuration of supporting mechanism of the electronic part feeder of the parts feed unit of expression shown in Figure 53.Figure 57 B is the front view of the schematic configuration of the supporting mechanism shown in the presentation graphs 57A.Figure 58 A is the oblique view of other states of the supporting mechanism shown in the presentation graphs 57A.Figure 58 B is the front view of the schematic configuration of the supporting mechanism shown in the presentation graphs 58A.Figure 57 A and Figure 57 B are the states that carriage 470 closures are used in the position adjustment of supporting mechanism 424, and Figure 58 A and Figure 58 B are the states that the position adjustment of supporting mechanism 424 is opened with carriage 470.In addition, in Figure 57 B and Figure 58 B, for the relative position of each parts is shown, at the virtual guiding groove 464 that illustrates of the upside of carriage 470.

Supporting mechanism 424 has pedestal 460, guide supporting portion 462, guiding groove 464 and absorption position adjustment unit 468.Pedestal 460 is the parts that are fixed on bowl fixed part of formula feeder unit 400.Guide supporting portion 462 is supported on wheel portion on the pedestal 460 with rotatable state, from the vertical downside guide rail 422 is supported.Guide supporting portion 462 and the movement on the direction of the bearing of trend that is parallel to guide rail 422 are rotated accordingly.Thus, guide rail 422 is with can be supported at the state that the direction parallel with bearing of trend moves with respect to supporting mechanism 424.Guiding groove 464 is formed on the end of bearing of trend of the guide rail 422 of pedestal 460.Guiding groove 464 links with the groove of guide rail 422, accepts the electronic unit by guide rail 422 guiding.That is, guiding groove 464 accepts to pass through the electronic unit of guide rail 422.

Absorption position adjustment unit 468 is mechanisms that the absorption position of the electronic unit in the supporting mechanism 424 is adjusted, and has position adjustment carriage 470, rotation axis 472, fixed part 474 and screw 476.The position adjustment is the locational parts that are configured in guiding groove 464 obturations with carriage 470, forms projection 480 in the end of guide rail 422 sides.The position adjustment passes through to utilize projection 480 with guiding groove 464 obturations with carriage 470, thereby the electronic unit by guiding groove 464 is supported, so that it can be to moving with the downstream of the projection 480 electronic unit moving directions of comparing.Thus, the position adjustment can remain on electronic unit on the assigned position of guiding groove 464 with carriage 470.Rotation axis 472 is axles that the bearing of trend along guiding groove 464 stretches out, and is fixed on the fixed part 474 with rotating state.472 pairs of position adjustment of rotation axis are supported with carriage 470, make the position adjustment become the state that can move along the bearing of trend of guiding groove 464 with carriage 470 and the axle that can stretch out by the bearing of trend along guiding groove 464 centered by the state that rotates.Fixed part 474 is fixed on the pedestal 460.

Screw 476 be with the position adjustment with carriage 470 fixing parts on the fixed part 474, screw 476 inserts in the slotted hole 482 that forms with carriage 470 in the position adjustment.Slotted hole 482 is with the bearing of trend of guiding groove 464 hole as length direction.In absorption position adjustment unit 468, by utilizing screw 476 that the position adjustment is fixed on the fixed part 474 with carriage 470, thereby the position adjustment is fixed with carriage 470, made the position adjustment become the state that rotates centered by the state that can move along the bearing of trend of guiding groove 464 with respect to fixed part 474 and the axle that can stretch out by the bearing of trend along guiding groove 464 with carriage 470.

Absorption position adjustment unit 468 has said structure, shown in Figure 57 A and Figure 57 B, by utilizing screw 476 the position adjustment is fixed on the fixed part 474 with carriage 470, thereby can electronic unit be supported at the assigned position of supporting mechanism 424.In addition, absorption position adjustment unit 468 by screw 476 is unloaded with carriage 470 from the position adjustment, thereby can be opened the end 490 in the electronic unit moving direction downstream of guiding groove 464 shown in Figure 58 A and Figure 58 B.Thus, can will be supplied to the electronic unit of guide rail 422 and guiding groove 464, discharge from the front end (end in electronic unit moving direction downstream) of guiding groove 464.As noted above, can be with electronic unit from the mechanism that the front end of guiding groove 464 is discharged by forming, accommodate in replacing under the situation of the electronic unit that bowl 420 and change supply with, can discharge the electronic unit that remains in guide rail 422 and the guiding groove 464 simply.

Electronic part feeder 402,404,406 is by making the position adjustment become following structure with carriage 470, namely, become the state of can be with respect to fixed part 474 and moving along the bearing of trend of guiding groove 464, and utilize screw 476 fixing, thereby can easily adjust with the position of carriage 470 the position adjustment on the bearing of trend of guiding groove 464.Thus, can be corresponding with the kind of electronic unit, the position of support electronic components is changed.That is, can be corresponding with the absorption position of electronic unit and adjust the position of projection 480.Thus, even be under different types of situation at the electronic unit of supplying with, also can electronic unit be supported at suitable absorption position.

In addition, electronic part feeder 402,404,406 is accommodated bowl and 420 is become said structure by making, and makes supporting mechanism 424 become said structure, accommodates bowl 420 thereby be easy to change, and can easily discharge electronic unit residual when changing.Thus, can easily change the kind of the electronic units of being supplied with by electronic part feeder 402,404,406.

Below, use Figure 52 to Figure 54 and Figure 59 to Figure 64, drive unit 408 is described.Figure 59 is the vertical view of schematic configuration of drive unit of the electronic part feeder of the parts feed unit of expression shown in Figure 53.Figure 60 is the oblique view of the schematic configuration of the drive unit shown in expression Figure 59.Figure 61 amplifies the schematic configuration of the drive unit shown in Figure 59 and the amplification plan view of expression.Figure 62 is the end view of the schematic configuration of the drive unit shown in expression Figure 59.Figure 63 is the side cutaway view of the schematic configuration of the drive unit shown in expression Figure 59.Figure 64 is the key diagram for the action of the drive unit shown in explanation Figure 59.

Drive unit 408 has motor 430, axle 432, line slideway 433, stopper portions 434, guide supporting portion 502, cardinal extremity guide rail (arm) 504, fixed part 506 and rotation section 508 is installed shown in Figure 59 to Figure 62.

Motor 430 is the drive source of drive unit 408 shown in Figure 59 to Figure 63, has motor body 550, eccentric shaft 552, bearing 554 and line slideway 556.Motor 430 rotates by made a 550a by motor body 550, thereby makes eccentric shaft 552 rotations.Motor 430 transmits revolving force via eccentric shaft 552 and bearing 554, makes line slideway 556 rotations.

Axle 432 utilizes the bearing 562,564 that is fixed on the fixed part shown in Figure 59 to Figure 63, supported with rotatable state.In addition, bearing 562,564 utilizes packing rings 566 that link with axle 432, and is supported with the state that does not move to vertical.

Be supported on the outer end of line slideway 556 with rotatable state near one side end of line slideway 433, be fixed near the end side and install on the stopper portions 434.In addition, line slideway 433 is with can be supported around the state of axle 432 rotation.Here, in line slideway 433 and line slideway 556, line slideway 433 becomes rail unit, and line slideway 556 becomes sliding unit.Thus, line slideway 433 links with the transportable state of coupling position and line slideway 556.That is the change in location of line slideway 433 and line slideway 556 bindings.Utilize this structure, rotate by making line slideway 556, thereby line slideway 433 rotates centered by axle 432.

Stopper portions 434 is installed with can be supported around the state that axle 432 rotates, links with line slideway 433.Stopper portions 434 and line slideway 433 are installed utilizes binding parts 570 to link.Stopper portions 434 is installed is along the elongated plate-shaped member that stretches out with the horizontal direction of the bearing of trend quadrature of line slideway 433, end and 502 bindings of guide supporting portion.Upper surface and linking part 436 bindings of the plate-shaped member of stopper portions 434 and line slideway 433 bindings are installed in addition.In addition, stopper portions 434 is installed in the position, the parts that configuration is identical with the elongated plate-shaped member that line slideway 433 links, upper surface and linking part 436 bindings that link with each linking part 436.Stopper portions 434 is installed also shown in Figure 52 to Figure 53, the excellent portion of extending along vertical is set, the end binding of this rod portion and elongated plate-shaped member.Thus, install stopper portions 434 and with elongated plate-shaped member that linking part 436 links be that rotating shaft rotates integratedly with axle 432.

Guide supporting portion 502 links with the end that stopper portions 434 is installed.One side end of cardinal extremity guide rail (arm) 504 and guide supporting portion 502 link, and end side and guide rail 422 link.Cardinal extremity guide rail 504 utilizes guide supporting portion 502, the rotational motion that stopper portions 434 is installed is transformed to rectilinear motion and transmits.In addition, cardinal extremity guide rail 504 links with the supply unit of the electronic unit of accommodating bowl 420, will be from accommodating bowl electronic unit that 420 supplies come to guide rail 422 guiding.The mobile part that fixed part 506 is fixed on drive unit 408 is on the pedestal etc.Rotation section 508 is supported on the fixed part 506 with rotating state.Rotation section 508 have with rotating state be supported on the fixed part 506 stiff end 520 and as the movable end 522 of the linking part of cardinal extremity guide rail 504 and guide rail 422.For rotation section 508, linking part between movable end 522 and cardinal extremity guide rail 504 and the guide rail 422 links, and the moving area of the linking part between cardinal extremity guide rail 504 and the guide rail 422 is limited.

Drive unit 408 has said structure, and shown in Figure 64, motor 430 is drive sources, rotates to line slideway 433 transmission of drive force.In addition, stopper portions 434 is installed being fixed around the state that axle 432 rotates, rotates by making line slideway 433, thereby centered by the rotating shaft of axle 432, rotate.Rotation 502 transmission to the guide rail support portion of stopper portions 434 are installed.The actuating force that the rotation direction of stopper portions 434 will be installed by guide supporting portion 502 is transformed to the actuating force of rectilinear direction, makes cardinal extremity guide rail (arm) 504 along the direction reciprocating motion parallel with the bearing of trend of guide rail.At this moment, be arranged on the rotation section 508 on the linking part between cardinal extremity guide rail 504 and the guide rail 422, centered by stiff end 520, making the linking part between cardinal extremity guide rail 504 and the guide rail 422 is that movable end 522 is rotated.Drive unit 408 formation as noted above are installed stopper portions 434 and 504 vibrations of cardinal extremity guide rail by making, and are installed in guide rail 422 vibrations of accommodating bowl 420 and linking with cardinal extremity guide rail 504 of installing on the stopper portions 434 thereby make via linking part 436.Bowl formula feeder unit 400 is accommodated bowl 420 vibrations by utilizing drive unit 408 to make, and puts into the electronic unit of accommodating bowl 420 in that to accommodate bowl 420 mobile, to guide rail 422 supplies thereby make.In addition, bowl formula feeder unit 400 makes guide rail 422 vibrations by utilizing drive unit 408, thereby the electronic unit that will guide in guide rail 422 is supplied with to supporting mechanism 424.

Bowl formula feeder unit 400 by as noted above with assembly supply device 402,404,406 to accommodate bowl stacked along vertical, thereby can effectively utilize the zone of horizontal direction, can save the space and dispose a plurality of assembly supply devices.Thus, bowl formula feeder unit 400 can be supplied with a plurality of electronic units to absorption position.In addition, bowl formula feeder unit 400 by as noted above with assembly supply device 402,404,406 to accommodate bowl stacked along vertical, thereby supporting mechanism 424 and horizontal direction closely can be disposed.Thus, can be near the absorption position of electronic unit, the displacement of the boarded head in the time of can reducing parts absorption.In addition, bowl formula feeder unit 400 is by using 1 drive unit 408 as 3 assembly supply devices 402,404,406 drive division, thereby can reduce drive source, can make simplified.In addition, support by utilizing 410 pairs of assembly supply devices 402 of fixed part, 404,406 rotating shaft, thereby each several part is stably vibrated.In addition, in the bowl formula feeder unit 400 of above-mentioned execution mode, assembly supply device is made as 3, but is not limited thereto, the quantity of assembly supply device does not limit.

In addition, in the present embodiment, as the drive division of bowl formula feeder unit 400, used to make the driving mechanism of accommodating bowl 420 vibrations, but be not limited thereto.Constitute the electronic part feeder (bowl formula feeder) of bowl formula feeder unit 400, as long as can accommodate that bowl 420 trembles and supply with electronic units 80 to guide rail 422 by making.For example, as drive division, also can use the drive division of accommodating bowl 420 swings.

Figure 65 amplifies the part of electronic part feeder and the oblique view of expression.The assembly supply device 402,404,406 of bowl formula feeder unit 400 shown in Figure 65, has the initiating terminal side component detecting sensor 580a, 580b, the 580c that have or not electronic unit to detect to the place, end of accommodating bowl 420 sides at guide rail 422.Whether initiating terminal side component detecting sensor 580a, 580b, 580c exist electronic unit to detect to the place, end of accommodating bowl 420 sides at guide rail 422.As initiating terminal side component detecting sensor 580a, 580b, 580c, can use laser sensor.Whether whether bowl formula feeder unit 400 exists electronic unit to detect by utilizing initiating terminal side component detecting sensor 580a, 580b, 580c to the place, end of accommodating bowl 420 sides at guide rail 422, thereby can rest on the guide rail 422 and be in the state of filling and detect electronic unit.For example, the state that detects electronic unit at initiating terminal side component detecting sensor 580a, 580b, 580c continues under the detected situation within a certain period of time, bowl formula feeder unit 400 becomes the state that can't advance to the place ahead of guide rail 422 owing to electronic unit stops at the assigned position place, so can be judged to be the state of filling.

Figure 66 amplifies the part of electronic part feeder and the oblique view of expression.The assembly supply device 402,404,406 of bowl formula feeder unit 400 has the holding position side component detecting sensor 582a, 582b, the 582c that have or not electronic unit to detect to the front end (absorption position, holding position) at guide rail 422 shown in Figure 66.Holding position side component detecting sensor 582a, 582b, 582c are whether the place, holding position exists electronic unit to detect to the front at corresponding guide rail 422.Holding position side component detecting sensor 582a is the optical sensor with illuminating part 584a and light accepting part 586a.Illuminating part 584a and light accepting part 586a are configured on the position of holding position the two.Holding position side component detecting sensor 582a is subjected to by light accepting part 586a under the situation of light at the mensuration light from illuminating part 584a output, and detecting in the mensuration zone (being the holding position in the present embodiment) does not have electronic unit.Holding position side component detecting sensor 582a is subjected under the situation of light by light accepting part 586a at the mensuration light from illuminating part 584a output, detects in the mensuration zone (being the holding position in the present embodiment) and has electronic unit.In the same manner, holding position side component detecting sensor 582b also is the optical sensor with illuminating part 584b and light accepting part 586b, and holding position side component detecting sensor 582c also is the optical sensor with illuminating part 584c and light accepting part 586c.Holding position side component detecting sensor 582a, 582b, 582c utilize identical structure to detect having or not electronic unit.Bowl formula feeder unit 400 utilizes holding position side component detecting sensor 582a, 582b, 582c to having or not electronic unit to detect in the holding position, based on testing result bowl formula feeder unit 400 is driven.Bowl formula feeder unit 400 for example utilize holding position side component detecting sensor 582a, 582b, 582c are judged to be the holding position does not have under the situation of electronic unit, drive unit 408 are driven, the conveying electronic parts.

In addition, the suction nozzle 32 that electronic component mounting apparatus 10 also can utilize boarded head 15, under the situation of the action that execution keeps the electronic unit of the holding position of bowl formula feeder unit 400, utilizing holding position side

component detecting sensor

582a, 582b, 582c detects at holding position place and exists under the situation of situation of electronic unit, execution is utilizing holding position side component detecting sensor 582a to the maintenance action that the electronic unit of holding position keeps, 582b, 582c detects at holding position place does not have standby under the situation of situation of electronic unit.Thus, electronic component mounting apparatus 10 can keep electronic unit more reliably, can be suppressed at holding position place and do not have under the situation of electronic unit to carry out the situation that keeps action.Thus, electronic component mounting apparatus can be carried out the maintenance action of electronic unit more efficiently.

Figure 67 A amplifies the part of electronic part feeder and the oblique view of expression.Figure 67 B is the oblique view from the part of the electronic part feeder shown in other direction indications Figure 67 A.In addition, in Figure 67 A, Figure 67 B, bowl assembly supply device of formula feeder unit 400 402 is shown, but assembly supply device 404,406 also has identical structure.Assembly supply device 402 has air supplying part 590, and it is positioned at when accommodating the end of guide rail 422 sides of the bowl 420 cardinal extremity guide rails 504 that are connected with guide rail 422 accommodating bowl 420 electronic unit, to vertical upside (direction of arrow 591) injection air.Air supplying part 590 is passed through to spray the air of arrow 591 directions to the end of guide rail 422 sides of cardinal extremity guide rail 504, accommodates bowl 420 thereby the electronic unit that is positioned at this position is returned.

Cardinal extremity guide rail 504 and accommodate the linking part of bowl between 420 and dispose guide portion 592.Guide portion 592 will from accommodate the electronic units that bowl 420 carries to cardinal extremity guide rail 504 be not suitable towards electronic unit to accommodating bowl 420 guiding.That is, guide portion 592 makes in the electronic unit of carrying to cardinal extremity guide rail 504 with inappropriate can not enter cardinal extremity guide rail 504 towards the electronic unit of carrying.Specifically, guide portion 592 unsuitable towards the lead-in wire institute position contacting place configuration plate-shaped member of electronic unit, the electronic unit that lead-in wire is come in contact is to accommodating bowl 420 guiding.

In addition, cardinal extremity guide rail 504 is provided with the portion of dropping 594 at the vertical upside in the zone of air supplying part 590 injection airs.The portion 594 that drops is configured in the outside of cardinal extremity guide rail 504 (away from accommodating a bowl side of 420), is provided with the rake of accommodating bowl 420 along with moving closer to towards the vertical upside.The portion 594 that drops utilizes rake, will be by air supplying part 590 injection airs by the electronic unit that lifts to the vertical upside, and bowl 420 is side directed to accommodating.Thus, can suppress electronic unit flies out to the outside of accommodating bowl 420.

Shown in Figure 67 A and Figure 67 B, assembly supply device 402 returns the electronic unit that moves towards guide rail 422 and accommodates bowl 420 by air supplying part 590 is set, thereby can be with electronic unit suitably to guide rail 422 guiding.For example, assembly supply device 402 is blown termly by utilizing air supplying part 590, accommodates bowl 420 thereby the electronic unit that is positioned at object's position is returned.Thus, can will carry and not move in subject area the electronic unit eliminating of guide rail 422 obliquely with respect to guide rail 422.In addition, assembly supply device 402 also can utilize air supplying part 590, will fail by getting rid of towards inappropriate electronic unit that guide portion 592 is got rid of.In addition, in the present embodiment, return the mechanism of accommodating bowl 420 as the electronic unit on the cardinal extremity guide rail 504 that makes guide rail 422 initiating terminals, be provided with air supplying part 590, but be not limited thereto.For example, also can replace air supplying part 590 and use mechanical mechanism.

Below, the action of the each several part of electronic component mounting apparatus is described.In addition, the action of the each several part of the electronic unit of following explanation all can be carried out by being controlled by the action of 20 pairs of each several parts of control device.

Use Figure 68 to Figure 74, the shape recognition action of the electronic unit of electronic component mounting apparatus is described.Figure 68 is the key diagram for the shape recognition action of the electronic unit of explanation electronic component mounting apparatus.Figure 69 is the key diagram for the shape recognition action of the electronic unit of explanation electronic component mounting apparatus.Figure 70 is the key diagram for the shape recognition action of the electronic unit of explanation electronic component mounting apparatus.Figure 71 is the key diagram for the shape recognition action of the electronic unit of explanation electronic component mounting apparatus.Figure 72 is the key diagram for the shape recognition action of the electronic unit of explanation electronic component mounting apparatus.Figure 73 is the schematic diagram of an example of the testing result of expression identification maneuver.Figure 74 is the schematic diagram of an example of the testing result of expression identification maneuver.

Electronic component mounting apparatus 10 is as noted above, uses the shape of 38 pairs of electronic units of laser recognition device to measure.Laser recognition device 38 is shown in Figure 68, between light source 38a and photo detector 38b, dispose under the state of electronic unit 80, from light source 38a output laser, utilize photo detector 38b to detect the laser that arrives, thereby the shape that is configured in the parts between light source 38a and the photo detector 38b is detected.In addition, laser recognition device 38 utilizes suction nozzle drive division 34 that suction nozzle 32 is moved or rotates after the shape by a direction of the electronic unit 80 of suction nozzle 32 absorption is detected, and makes electronic unit 80 move or rotate, and carries out SHAPE DETECTION again.As noted above, laser recognition device 38 is by making electronic unit 80 rotation, thereby shown in Figure 69, makes to change with respect to the angle of electronic unit 80 to the direction of electronic unit 80 irradiating lasers and photo detector 38b.

Electronic component mounting apparatus 10 is shown in Figure 70, as step S11, corresponding with the height of the Z-direction of electronic unit 80, between light source 38a and photo detector 38b, dispose under the state of electronic unit 80, by laser recognition device 38 from light source 38a to certain area illumination laser.Then, in electronic component mounting apparatus 10, as step S12, the rotation (rotation of θ direction) of beginning electronic unit 80.

Then, electronic component mounting apparatus 10 after the rotary speed of electronic unit 80 rotation reaches certain speed, as step S13, begin to utilize regulation that laser recognition device 38 carries out electronic unit 80 towards shape measure.At this moment, laser recognition device 38 disposes under the state of electronic unit 80 between light source 38a and photo detector 38b, to certain area illumination laser, and utilizes the laser of photo detector 38b to be subjected to light from light source 38a.Here, the laser of being tackled by electronic unit 80 does not arrive photo detector 38b or intensity reduction.Thus, laser recognition device 38 can be according to the distribution that is subjected to the laser of light by photo detector 38b, and the shape of the electronic unit 80 in the section of the angle measured is detected.In the present embodiment, 38 pairs of laser recognition devices are detected by the end of the laser of light by photo detector 38b, to this towards in the outermost shape of electronic unit 80 detect.In electronic component mounting apparatus 10, as step S14, when making electronic unit 80 rotations, utilize the method for step S13 to carry out the SHAPE DETECTION of electronic unit 80 repeatedly, thereby the shape that rotates a circle of electronic unit 80 is detected.Thus, can the shape of whole directions of electronic unit 80 be detected.Laser recognition device 38 is as noted above, and the shape of the direction that rotates a circle is detected, and shown in Figure 71, with the testing result stack of all directions shape, thereby can detect the 3D shape (shape of outermost part) of electronic unit 80 exactly.

Here, as noted above, the electronic component mounting apparatus 10 of present embodiment will carry on substrate 8 as the electronic unit 80 of radial lead type electronic unit.Electronic component mounting apparatus 10 is under the situation that the shape to the electronic unit 80 shown in Figure 72 detects, along with the different and detected shape difference of the height of the Z-direction of measuring.Namely, the laser recognition device 38 of electronic component mounting apparatus 10 is under the situation that online A place carry out to be detected shown in Figure 72, online B place carries out under the situation about detecting, online C place carries out under the situation about detecting, the detected difformity that is shaped as under the situation of online D place execution detection.

For example, if laser recognition device 38 carries out shape measure at the line A place shown in Figure 72, then shown in Figure 73, can detect the shape of the main body 82 of electronic unit 80.In addition, if laser recognition device 38 carries out shape measure at the line B place shown in Figure 72, then shown in Figure 74, can detect the shape of the lead-in wire 84 of electronic unit 80.In addition, because the shape of the outermost of the measuring height of 38 pairs of electronic units of laser recognition device part detects, so as the shape of electronic unit, detect the shape relevant with the outermost part (outermost lead-in wire 84) of electronic unit.In addition, if laser recognition device 38 carries out shape measure at the line C place shown in Figure 72, then can detect the shape of the lower surface position of main body 82, if carry out shape measure at the line D place shown in Figure 72, then can detect the shape of the lower surface position of lead-in wire 84.Electronic component mounting apparatus 10 is adsorbed with the height of Z-direction of the suction nozzle 32 of electronic unit 80 by adjustment, thereby the position that the shape of 38 pairs of electronic units 80 of laser recognition device is measured becomes all places.

Figure 75 is the key diagram for the identification maneuver of the shape of the electronic unit of explanation electronic component mounting apparatus.In addition, in electronic component mounting apparatus 10, as the electronic unit of radial lead type electronic unit, use the electronic unit 80a shown in Figure 75 sometimes.Electronic unit 80a forms otch 89 in the part of main body 82a.The formation of electronic unit 80a the part of otch 89 become the shape different with other electronic units.In addition, electronic unit 80a can according to the position that is formed with otch 89 judge towards.

Here, the control part 60 of the electronic component mounting apparatus 10 of present embodiment, preestablished the electronic unit that carries object by operating personnel, be under the situation of position (position on the Z-direction of electronic unit) of the adsorbed electronic unit of suction nozzle, utilizing the electronic unit shapes of the position that 38 pairs of laser recognition devices are set by operating personnel to detect.As noted above, the position of electronic component mounting apparatus 10 by setting based on operating personnel, shape to electronic unit is measured, thereby can be with the character shape of electronic unit part as the measuring position, can carry out more accurately the kind identification of electronic unit and electronic unit towards detection.

In addition, the situation of using laser recognition device 38 to carry out the shape recognition of electronic unit at electronic component mounting apparatus 10 is illustrated, but is not limited thereto.In electronic component mounting apparatus 10, as state-detection portion, also can use and carry out the camera (the VCS unit 17 of present embodiment) of three-dimensional measurement to being supported on electronic unit shape on the framework 11.In addition, also can use the known camera that the electronic unit shape is carried out three-dimensional measurement except VCS.By utilizing the camera that the electronic unit shape is carried out three-dimensional measurement, the curved shape of the interval of the lead-in wire leading section of the electronic unit of determination object, lead-in wire, article body shape etc. are measured, thereby can be carried out identical processing.

Figure 76 is the flow chart of an example of the action of expression electronic component mounting apparatus.Use Figure 76, the summary that the disposed of in its entirety of electronic component mounting apparatus 10 is moved describes.In addition, the processing shown in Figure 76 is by being carried out by the action of control device 20 control each several parts.In electronic component mounting apparatus 10, as step S52, read in production routine.Production routine is to be generated by the production routine generating apparatus of special use, or generated by control device 20 based on the various data of importing.

Electronic component mounting apparatus 10 reads in production routine in step S52 after, as step S54, the state that installs is detected.Specifically, kind of the kind of the structure of parts feed unit 14f, 14r, the electronic unit of having filled, the suction nozzle prepared etc. is detected.After electronic component mounting apparatus 10 detects the state of device in step S54 and prepares to finish, as step S56, substrate is moved into.Electronic component mounting apparatus 10 is moved into substrate in step S56, behind the position configuration substrate that electronic unit is installed, as step S58, electronic unit is installed to substrate.After the installation of electronic component mounting apparatus 10 electronic unit in step S58 finished, S60 took out of substrate as step.After electronic component mounting apparatus 10 is taken out of substrate in step S60, as step S62, whether finish to judge to producing.Electronic component mounting apparatus 10 is judged to be to produce in step S62 not to be had to finish to enter step S56 under the situation of (denying), and execution in step S56 is to the processing of step S60.That is, carry out the processing that electronic unit is installed to substrate based on production routine.Electronic component mounting apparatus 10 is judged to be in step S62 to be produced under the situation that finishes (being), finishes this processing.

Electronic component mounting apparatus 10, is installed electronic unit to substrate, thereby can be produced the substrate that electronic unit is installed after reading production routine and carrying out various settings by as mentioned above.In addition, in electronic component mounting apparatus 10, as electronic unit, to have main body installs to substrate with the lead-type electronic-part of the lead-in wire that is connected with this main body, specifically, by inserting in the hole (patchhole) that forms on the substrate that will go between, thereby this electronic unit can be installed to substrate.

Figure 77 is the key diagram of an example of expression operation screen.Figure 78 is the key diagram of the part of expression operation screen.Figure 79 A is the key diagram that the expression parts are supplied with an example of angle.Figure 79 B is the key diagram that the expression parts are supplied with an example of angle.Figure 80 is the key diagram of an example of expression operation screen.Figure 81 is the key diagram of an example of expression operation screen.Figure 82 is the key diagram of the part of expression operation screen.Figure 83 A to Figure 83 D is the key diagram of representing an example that locates of electronic unit respectively.

Below, using Figure 77 to Figure 83 D, an example of the processing that the various information of the electronic unit that will install to electronic component mounting apparatus 10 are logined describes.Electronic component mounting apparatus 10 is determined the various values of handling based on the installation of production routine based on the information of the electronic unit after logining, based on the value after determining, is carried out the installation of electronic unit.In addition, the various information of electronic unit can be used as the part of production routine and login, and also can be used as the information of the electronic unit monomer that a plurality of production routines share and login.

Electronic component mounting apparatus 10 is at display part 42(touch panel 42a or picture monitor 42b) show the operation screen 602 shown in Figure 77.602 pairs of various cuits of operation screen show.Operating personnel are by carrying out various operations under the state that is shown by operation screen 602, thereby can import the information of electronic unit.In addition, in Figure 77, show the picture that the information of electronic unit is imported as parts data, but electronic component mounting apparatus 10 also can the input substrate data, carry data, adsorpting data, view data.

Operation screen 602 shown in Figure 77 shows the cuit 604 of the component categories that is used for the input electronic unit and is used for the cuit 606 of input encapsulation shape.In addition, operation screen 602 comprises: input comprise the horizontal stroke, length of electronic unit, highly, wire length is in the project of interior overall dimension; In the centering mode, select to use laser (laser recognition device 38) also to be to use the project of image (VCS unit 17); The project of input package dimension (size of electronic unit main body) etc.And, in operation screen 602, also show: the label that is used for showing the detail items that encapsulates shape, centering, additional information, expansion, inspection etc.In addition, in the operation screen 602 of present embodiment, as the detail items of encapsulation shape, the parts that comprise the angle of the electronic unit that expression supplies with to the holding position provide the cuit of pitch information of the disposition interval of the cuit of the cuit 608 of angle, retainer belt kind and expression electronic unit.

Here, cuit 604 is the projects for the kind of importing the electronic unit of logining, if option then shown in Figure 78, shows the tabulation 610 of options in drop-down menu.In tabulation 610, except the kind of various electronic units, also show the options of insertion parts and miscellaneous part.Operating personnel determine operation by making the options of 612 pairs of quasiexpectations of cursor, thereby can be to input information in the cuit 604 of component categories.

In cuit 608, the parts of the angle of the electronic unit of supplying with to the holding position imported as expression provide angle, can select 0 °, 90 °, 180 °, 270 ° or other.For example, shown in Figure 79 A, be under the situation of electronic unit 614 at the object electronic unit, the state behind electronic unit 614 each half-twists is respectively 0 °, 90 °, 180 °, 270 ° attitude.Which kind of attitude is attitude when operating personnel supply with to the holding position of electronic part feeder based on electronic unit 614 become, and to cuit 608 input angles.In addition, the reference position of the angle of electronic unit 614 can be set by operating personnel.

In addition, in electronic component mounting apparatus 10, shown in Figure 79 B, electronic unit 616 is held with the state with respect to retainer belt 618 inclination predetermined angulars sometimes.Here, electronic unit 616 is film capacitor.Operating personnel under attitude shown in electronic unit 616 does not meet any situation in 0 °, 90 °, 180 °, 270 °, the angle of input electronic unit 616 in " other ".Here, under the situation that electronic unit 616 is kept, in boarded head 15, as suction nozzle 32 preferred use to electronic unit 616 carry out clamping and implement to keep grasp suction nozzle.Electronic component mounting apparatus 10 grasps under the situation that suction nozzle keeps electronic unit 616 in use, provide angle by the parts based on input in " other " of cuit 608, angle to suction nozzle is adjusted, thereby can make the contact-making surface that grasps suction nozzle become the angle corresponding with the inclination of electronic unit 616, can reduce the generation that keeps wrong.

In electronic component mounting apparatus 10, if at display part 42(touch panel 42a or picture monitor 42b) show under the state of the operation screen 602 shown in Figure 77, by the label of operating portion 40 selection additional informations, then at the operation screen 620 shown in local display Figure 80 of operation screen 602.In operation screen 620, comprise the cuit 622 of carrying the amount of being pressed into and the cuit 624 of adsorbing the amount of being pressed into.Whether whether in addition, operation screen 620 also shows following option: try out, utilize transducer to confirm that parts discharge, whether carry out the correction of parts absorption position, whether carry out automatic teaching, whether execution unit is skipped.In addition, go back the discarded project of display unit, it is used for input in the electronic unit processing method that (is judged to be under the situation that is in state that can't installing component) under the situation that parts are discarded.

Cuit 622 is be used to the project that is set in when carrying the size that electronic unit is pressed into from upper surface of base plate." 0 " is to make the distance between electronic unit and the substrate become 0 value in the design load.In electronic component mounting apparatus 10, if numerical value becomes big to forward, electronic unit is moved to compare the state that is pressed into to the vertical downside with substrate.By the setting amount of being pressed into, can suppress because the influence of the flatness of substrate etc., do not carry under the state of substrate and arrive at parts, skew or parts slide at scolder when carrying situation take place to carry.In addition, for electronic unit is installed to substrate more reliably, preferably initial value is made as on the occasion of, for example be made as 0.5mm.

The amount of being pressed into when cuit 624 keeps for parts.That is, be used for being set in the place, holding position of electronic part feeder by the suction nozzle under the situation of suction nozzle maintenance electronic unit and the project of the distance between the electronic unit." 0 " is that to make distance between the maintaining part of electronic unit and suction nozzle in the design load be 0 value.In electronic component mounting apparatus 10, if numerical value becomes big to forward, suction nozzle is moved to compare the state that is pressed into to the vertical downside with electronic unit.By the setting amount of being pressed into, thereby can suppress because the influence of part dimension (highly) fluctuation etc. makes suction nozzle can't arrive electronic unit, the situation that can't adsorb or grasp parts, the electronic unit that chip form perhaps takes place such as holds up at phenomenon.In addition, in order to utilize suction nozzle more reliably electronic unit is kept, preferably initial value is made as on the occasion of, for example be made as 0.2mm.

In addition, the cuit of operation screen 620 display unit layers.The cuit of component layer is the project that the same relative importance value that carries each parts in the layer is set.By setting this project, under the situation of producing with the optimization order, can set the relative importance value of the lift-launch order of this electronic unit.

In addition, operation screen 620 shows the cuit of clamping suction nozzle data.Here, so-called clamping suction nozzle is the suction nozzle that grasps that grasps and keep electronic unit.Pressing position is the position of when grasping electronic unit being pressed.The horizontal direction gap is to grasp the press surface of fixation side arm of suction nozzle and the project in the gap between the parts with negative input.The suction nozzle direction is the project of suction nozzle direction during with the absorption of 0 degree during supply part for input during absorption.Absorption height trim values is the project of the deviant that grasps height (absorption height) when grasping for input.

In electronic component mounting apparatus 10, if at display part 42(touch panel 42a or picture monitor 42b) show under the state of the operation screen 602 shown in Figure 77, label by 40 pairs of expansions of operating portion is selected, then at the operation screen 630 shown in local display Figure 81 of operation screen 602.In operation screen 630, show the project that the various conditions of the state detection process of the electronic unit carried out by laser recognition device 38 are set.In operation screen 630, comprise; Set cuit, the cuit 632 of laser elevation and the cuit 634 of component shape of suction nozzle translational speed.Here, θ speed (during measurement) is the project of θ axle acceleration of the suction nozzle in input laser when identification, and θ speed (outside the measurement) is that input is in the rotation after the laser centering, for example be used for obtaining carrying the project of the θ axle acceleration of the suction nozzle under the situation of rotation etc. of angle.

The suction nozzle front end that cuit 632 is inputs when measuring is to the project of the distance of coplanar laser illumination.Cuit 634 is projects of shape of the electronic unit of input determination object, shown in Figure 82, utilizes cursor 638 to specify from the tabulation 636 that shows options, thus the information of input block shape.By the shape of input block in cuit 634, the body shape of electronic unit specifically, thereby can determine under the situation that the shape of utilizing 38 pairs of electronic units of laser recognition device is identified, to take a decision as to whether the characteristic point of this electronic unit.For example, in cuit 634, import under the situation of no unfilled corner, 4 summits are being detected.Under the electronic unit 640 shown in Figure 83 A, 641 situation, respectively the position on 1 to 4 these 4 summits is detected.Thus, can the contraposition offset move, angular deflection detects.In addition, in cuit 634, import under the situation that unfilled corner is arranged, 5 to 8 summits are being detected.Under the situation of the electronic unit 642 shown in Figure 83 B, the position on 1 to 6 these 6 summits is detected.Under the situation of the electronic unit 643 shown in Figure 83 B, the position on 1 to 8 these 8 summits is detected.Thus, can the contraposition offset move, angular deflection detects.In cuit 634, import under the situation of PLCC, 8 summits are being detected.Under the situation of the electronic unit 644 shown in Figure 83 C, the position on 1 to 8 these 8 summits is detected.In addition, under the situation of PLCC, can use 4 points from detected 8 summits, the contraposition offset moves, angular deflection detects.In addition, in cuit 634, import under the flexible situation, the component width that makes the XY direction is become near minimum 8 points detect.Under the electronic unit 646 shown in Figure 83 D, 647 situation, the position of 1 to 8 these 8 points is detected.Under the situation of the electronic unit 643 shown in Figure 83 D, the position on 1 to 8 these 8 summits is detected.Thus, can the contraposition offset move, angular deflection detects.

Electronic component mounting apparatus 10 can be as noted above shows operation screen 602,620,630 etc., obtains the various information related with electronic unit.Electronic component mounting apparatus 10 carries out the installation of electronic unit and handles, thereby can suitably electronic unit be carried to substrate by based on the obtained various information related with electronic unit.In addition, electronic component mounting apparatus 10 is fit to there not be the nothing lead-in wire electronic unit (mounting type electronic unit) of lead-in wire and has to the various cuits of the lead-type electronic-part (insert type electronic unit) of the lead-in wire of substrate insertion by arranging, thereby can carry out the processing corresponding with each electronic unit.For example, in electronic component mounting apparatus 10, as component categories, can import the insertion parts that is expressed as the insert type electronic unit.Thus, electronic component mounting apparatus 10 is by detecting component categories, can namely, insert (insert still and carry) to the hole (patchhole) of substrate is middle to whether going between when mounted and detect being that mounting type electronic unit or insert type electronic unit detect.

Use Figure 84 and Figure 85, the identification maneuver of the shape of electronic unit is described.Figure 84 and Figure 85 are respectively the flow charts of an example of the action of expression electronic component mounting apparatus.Processing shown in Figure 84 and Figure 85 is by being carried out by the action of control part 60 control each several parts.

Processing shown in Figure 84 is the processing that the position of measuring the electronic unit shape is set.Here, control part 60 can carry out the processing shown in Figure 84 at every turn when the shape of electronic unit being measured, also can be when the lift-launch action of subtend substrate lift-launch electronic unit be set, carry out at whole electronic units, when the electro part carrying of reality is handled, also can carry out shape measure based on prior execution and definite result (the setting result of measuring position).

As step S112, whether 60 pairs of control parts have the measuring position to set is judged.Here, so-called measuring position is set, and refers to the electronic unit for object, the input value of the information of the position of being set by operating personnel that shape is measured, the laser elevation in the aforesaid operations picture.Control part 60 is judged to be in step S112 under the situation of setting (being), and as step S114, based on setting and the setting measurement position, that is, the measuring position that operating personnel are set is set at the measuring position of this electronic unit, finishes this processing.In addition, control part 60 is judged to be in step S112 not to be had under the situation of setting (denying), as step S116, the reference position is set at the measuring position, finishes this processing.Here, so-called reference position, refer to according to electronic unit classification, be the reference measurement position that capacitor or IC chip etc. are set.

Electronic component mounting apparatus 10 can as noted abovely be set the measuring position by operating personnel, and the position that operating personnel can be set arbitrarily is as the measuring position.In addition, electronic component mounting apparatus 10 can be set a plurality of to the measuring position of 1 electronic unit.For example, under the situation of radial lead type electronic unit, can measure the shape at main body and these 2 positions of lead-in wire.In addition, electronic component mounting apparatus 10 is obtained the information of shape at the place, this measuring position of this electronic unit based on setting under the situation of having set the measuring position.In addition, as the information of shape, can use the result who utilizes after laser recognition device 38 is measured, also can use the shape data by this electronic unit of operating personnel's input.

Below, the processing shown in Figure 85 is the processing before electronic unit is installed, and specifically, is that the measurement of electronic unit shape is handled and based on the determination processing of measurement result.In addition, control part 60 is carried out the processing of Figure 85 at whole electronic units that will keep.As step S120, control part 60 is obtained the data of the electronic unit that keeps object.Here, the so-called data that keep the electronic unit of object (adsorb object, grasp object) refer to for this electronic unit is carried required various information on substrate.The information of the measuring position that the data that keep the electronic unit of object are absorption height (keeping height) of shape data, the electronic unit of the position that keeps the assembly supply device 100 of this electronic unit, electronic unit, measured by 38 pairs of electronic units of laser recognition device etc.

Obtain data in step S120 after, as step S122, control part 60 is determined the measuring position.That is, control part 60 is based on the data that obtain among the step S120, determines position that the shape to electronic unit detects, is the position on the Z-direction of electronic unit.In addition, control part 60 also can carry out the processing of step S120 and step S122 before the absorption of electronic unit.

Determine the measuring position and utilize suction nozzle to adsorb under the situation of electronic unit in step S122, as step S124, the Z shaft position of 60 pairs of electronic units of control part is adjusted.That is, control part 60 moves along Z-direction by making suction nozzle, thereby move to the measured zone of laser recognition device 38 measuring position that makes among the step S122 electronic unit of determining.Control part 60 as step S126, is measured the shape of electronic unit after in step S124 the Z shaft position of electronic unit being adjusted.That is, control part 60 uses laser recognition device 38, and the shape that the measuring position of electronic unit is located detects.

After the shape that control part 60 is located the measuring position of electronic unit in step S126 detects, as step S128, whether finish to judge to measuring.That is whether the shape measure at the place, measuring position that, determines among 60 couples of step S122 of control part finishes to judge.Control part 60 is judged to be to measure in step S128 not to be had to finish to enter step S124 under the situation of (denying), carries out the processing of step S124 and step S126 again, and the shape of measuring the measuring position that does not have end is measured.Control part 60 is by position adjustment and the shape measure of carrying out electronic unit repeatedly as noted above, thereby the shape of the measuring position that sets is detected.

Control part 60 is judged to be in step S128 to be measured under the situation that finishes (being), as step S130, measurement result and reference data is compared.Here, reference data is the data of the electronic unit shape of the absorption object (maintenance object) obtained among the step S120.Whether control part 60 is by comparing measurement result and reference data, thereby be the shape consistent with reference data to adsorbed electronic unit, electronic unit towards whether with the judging towards consistent etc. of reference data.

After comparing in step S130, as step S132, whether 60 pairs of parts of control part are suitably judged.Specifically, control part 60 is judged whether having adsorbed electronic unit with installable state in step S132.Control part 60 is judged to be in step S132 under the situation of parts inappropriate (denying), and as step S134, the electronic unit that suction nozzle is adsorbed is discarded, finishes this processing.Control part 60 makes boarded head and suction nozzle move to the position relative with parts reservoir 19, puts into parts reservoir 19 by the electronic unit that this suction nozzle is kept, thereby electronic unit is discarded.In addition, control part 60 is carried out the processing that the electronic unit of same kind is installed to the same loading position (installation site) of substrate again.

Control part 60 is judged to be in step S132 under the situation of parts suitable (being), as step S136, whether the direction (direction on the direction of rotation of suction nozzle) of parts is suitably judged.That is, to adsorbed electronic unit whether with the judging towards identical of benchmark.In addition, as step S136, whether 60 pairs of electronic units of the control part of present embodiment reverse and judge.Control part 60 is judged to be direction in step S136 inappropriate, namely under the situation of state (deny) of electronic unit after for counter-rotating, electronic unit is reversed after, enter step S140.

Control part 60 is judged to be under the situation that is in step S136 or has carried out under the situation of processing of step S138, as step S140, based on the holding position, the loading position (installation site) of electronic unit is finely tuned.For example, based on the testing result of the shape of electronic unit, the position of suction nozzle being adsorbed electronic unit is detected, and based on the skew of holding position with respect to the reference position, the suction nozzle when installing and the relative position of substrate are adjusted.Control part 60 finishes this processing after the processing of execution in step S140.In addition, control part 60 after the processing of the step S140 that carries out Figure 85, to the electronic unit judged based on the result of step S140 and electronic unit is carried on substrate.

Electronic component mounting apparatus 10 detects by the shape of 38 pairs of electronic units of use laser recognition device as noted above, based on its result, carries out various processing, thereby can more suitably carry electronic unit on substrate.

Electronic component mounting apparatus 10 is discarded with electronic unit in the step S134 of the flow chart shown in Figure 85, but also can carry out the processing that lead format is revised under the unsuitable situation of the lead format that is judged to be electronic unit.That is, can be or not electronic unit is not discarded in step S134 yet, be insertable shape but the lead-in wire of electronic unit is proofreaied and correct (processing), and install to loading position (installation site).In electronic component mounting apparatus 10, can utilize the mechanism that is used for the clamping electronic unit of the cutting unit of electronic part feeder 100, lead-in wire to electronic unit is revised, and also can utilize the correction mechanism of other setting that the lead-in wire of electronic unit is revised.As noted above, as the machining cell processed of shape to lead-in wire, can use the mechanism that main body or lead-in wire to electronic unit carry out clamping, the various unit such as correction mechanism that arrange in addition.

Figure 86 is the flow chart of an example of the action of expression electronic component mounting apparatus.Below, use Figure 86, the identification maneuver of the state (shape) of the lead-in wire of electronic unit is described.In addition, the processing shown in Figure 86 is that part is handled identical processing with the electronic unit identification of using above-mentioned laser recognition device 38.In electronic component mounting apparatus 10, as step S150, the Z shaft position is adjusted, the shape of lead-in wire is moved to the measuring position.After electronic component mounting apparatus 10 moves to electronic unit in step S150 to locate, as step S152, make the electronic unit rotation and carry out and measure.In addition, the processing of step S152 is identical with the processing of above-mentioned Figure 70.After electronic component mounting apparatus 10 is carried out in step S152 and measured, as step S154, detect based on the outermost shape of measurement result to lead-in wire.That is, at the place, measuring position the shape relevant with the lead-in wire in the outside detected.

Electronic component mounting apparatus 10 in step S154 to the lead-in wire the outermost shape detect after, as step S156, make electronic unit towards the rotation to set towards, with set towards measuring, that is, with fixing 1 towards measuring, as step S158, detect based on the radical of measurement result to lead-in wire, finish this processing.

Here, Figure 87 A is the key diagram of an example of expression electronic unit.Figure 87 B is the key diagram of an example of the measurement result of expression lead-in wire.Figure 88 A is the key diagram of an example of expression electronic unit.Figure 88 B is the key diagram of an example of the measurement result of expression lead-in wire.In electronic component mounting apparatus 10, for example under the situation that the lead format of carrying out the electronic unit 670 shown in Figure 87 A is measured, in step S156, with to paper fore-and-aft direction irradiating laser towards measuring.If with shown in Figure 87 A towards the shape measure that goes between, detect the waveform 673 shown in the picture 672 shown in Figure 87 B as measurement result.Waveform 673 reduces in the position output that has lead-in wire.Electronic unit 670 has 5 lead-in wires.Therefore, waveform 673 goes out the trough that output reduces 5 location detection.

Below, in electronic component mounting apparatus 10, under the situation that the lead format of carrying out the electronic unit 671 shown in Figure 88 A is measured, in step S156 with to paper fore-and-aft direction irradiating laser towards measuring.If with shown in Figure 88 A towards the shape measure that goes between, detect the waveform 675 shown in the picture 674 shown in Figure 88 B as measurement result.Waveform 675 reduces in the position output that has lead-in wire.Electronic unit 671 has 3 lead-in wires.Therefore, waveform 675 detects the trough that output reduces at 3 positions.

As noted above, in electronic component mounting apparatus 10, with electronic unit with regulation towards fixing, carry out shape measure, by its result is resolved, thereby can be except the outermost shape of electronic unit, also detect to stipulate the radical (radical of pin) towards detected lead-in wire.Electronic component mounting apparatus 10 is by carrying out the processing of Figure 86, thereby can be except the outer shape of electronic unit, and also the radical to lead-in wire detects.

Use Figure 89 and Figure 90, illustrate that whether electronic unit after the measurement shape is an example of suitable judgement.That is, an example of the processing of carrying out among step S130, the S132 to Figure 85 describes.Figure 89 is the flow chart of an example of the action of expression electronic component mounting apparatus.Figure 90 is the key diagram of the relation between expression lead-in wire and the patchhole.Electronic component mounting apparatus 10 is obtained the outermost shape of the lead-in wire of electronic unit as step S160.In addition, the outermost shape of lead-in wire can utilize the processing of above-mentioned Figure 86 to detect.Electronic component mounting apparatus 10 is obtained shape in step S160 after, as step S162, to whether judging with the electronic unit that will install is consistent.That is, based on the characteristic point of outermost shape of lead-in wire, whether the electronic unit that suction nozzle is just being kept is that the electronic unit of mounting object is judged.In addition, also can when the judgement of execution in step S162, the shape except the outermost shape of lead-in wire, the shape of main body etc. be compared.

Electronic component mounting apparatus 10 is judged to be under the situation of consistent with electronic unit (being) in step S162, enters step S166, under the situation that is judged to be inconsistent (denying), enters step S169.Electronic component mounting apparatus 10 is judged to be in step S162 under the situation that is, as step S166, whether the interval of outermost shape is included in the permissible range judges.Specifically, electronic component mounting apparatus 10 compares the outermost shape of detected lead-in wire and the substrate patchhole that inserts lead-in wire, and whether the interval of the outermost shape of lead-in wire is judged in the permissible range at the interval of patchhole.

Below, the permissible range under the situation of the lead-in wire 684 that inserts electronic unit 680 in 4 patchholes 682 that are disposed at the place, tetragonal summit shown in Figure 90 respectively is described.In addition, in Figure 90, the paper above-below direction becomes Y-direction, and the paper left and right directions becomes directions X.Here, the diameter of patchhole 682 becomes dP, and the diameter of lead-in wire 684 becomes dL.In addition, with the lead-in wire 684 of design load away from the be connected distance of the directions X that forms of position be dA, with the lead-in wire 684 of design load away from the be connected distance of the Y-direction that forms of position be dB.

Under the situation of the example shown in Figure 90, in design load, be configured to respectively, the center of patchhole 682 and the center of lead-in wire 684 are overlapped.In the case, the higher limit of permissible range become with patchhole 682 away from the position distance that is connected and forms.That is, the higher limit of directions X be on the directions X of patchhole 682 away from point distance, be dC.The higher limit of Y-direction be on the Y-direction of patchhole 682 away from point distance, be dD.In addition, the lower limit of permissible range become with the situation of the nearest position inscribe of patchhole 682 under, lead-in wire 684 away from the position distance that is connected and forms.The lower limit of directions X on the directions X of lead-in wire 684a away from point distance, be dE.The lower limit of Y-direction on the Y-direction of lead-in wire 684b away from point distance, be dF.In addition, the permissible range shown in Figure 90 (higher limit, lower limit) is an example, and permissible range can be various settings.For example, also permissible range can be set at, so long as the interval that at least a portion of lead-in wire contacts with patchhole gets final product.By enlarging permissible range, can reduce discarded electronic unit, by dwindling permissible range, can suppress the generation of setup error.

Electronic component mounting apparatus 10 is judged to be the outermost shape in step S166 interval is included under the situation that in the permissible range (is), as step S168, judges that electronic unit is suitably, finishes this processing.Electronic component mounting apparatus 10 is judged to be the outermost shape in step S166 interval is not included under the situation of in the permissible range (denying), in step S162, be judged to be under the situation not, as step S169, judge that electronic unit is inappropriate, finish this processing.

Whether the shape of 10 pairs of lead-in wires of electronic component mounting apparatus detects, and judges based on detected result whether electronic unit is suitable, specifically, can insert to inserting in the hole and to judge, thereby electronic unit can be installed to substrate more reliably.That is, the lead-in wire of electronic unit can be inserted to patchhole more reliably.Especially, shown in radially feeder, constitute under the situation of utilizing electronic part feeder to go between to cut off and supplying with to the holding position, because the lead-in wire easy deformation, so be easy to generate the situation that the electronic unit that keeps can't be installed.Because electronic component mounting apparatus 10 can judge the state of lead-in wire, so can suppress to use the electronic unit that to install to carry out the situation of installation action to substrate, can suppress not have the electronic unit of insertion to stay situation on the substrate.Thus, can also suppress situation that other electronic units are made a very bad impression.In addition, under the situation of the processing of carrying out Figure 89, in the processing of Figure 86 that the lead format to electronic unit detects, the processing of step S156, S158 can not carried out yet.

Figure 91 is the flow chart of an example of the action of expression electronic component mounting apparatus.In Figure 89, also can after based on the outermost shape of electronic unit whether electronic unit suitably being judged, further carry out the judgement based on the lead-in wire radical.In electronic component mounting apparatus 10, as step S160, obtain the outermost shape of the lead-in wire of electronic unit.Electronic component mounting apparatus 10 is obtained shape in step S160 after, as step S162, to whether judging with the electronic unit that will install is consistent.

Electronic component mounting apparatus 10 is judged to be under the situation of consistent with electronic unit (being) in step S162, enters step S163, under the situation that is judged to be inconsistent (denying), enters step S169.Electronic component mounting apparatus 10 is judged to be in step S162 under the situation that is, as step S163, obtains the lead-in wire radical of parts.In addition, the lead-in wire radical also can be obtained with the outermost shape.In addition, outermost shape, lead-in wire radical also can be measured before this processing in advance.

Whether electronic component mounting apparatus 10 is obtained in step S163 under the situation of lead-in wire radical, as step S164, to judging with the electronic unit that will install is consistent.That is, judge whether the lead-in wire radical is identical with the lead-in wire radical of the electronic unit that will install.Electronic component mounting apparatus 10 is judged to be under the situation of consistent with electronic unit (being) in step S164, enters step S166, under the situation that is judged to be inconsistent (denying), enters step S169.

Electronic component mounting apparatus 10 is judged to be in step S164 under the situation that is, as step S166, whether the interval of outermost shape is included in the permissible range judges.Electronic component mounting apparatus 10 is judged to be the outermost shape in step S166 interval is included under the situation that in the permissible range (is), as step S168, judges that electronic unit is suitably, finishes this processing.Electronic component mounting apparatus 10 is judged to be the outermost shape in step S166 interval is not included under the situation of in the permissible range (denying), in step S162, S164, be judged to be under the situation not, as step S169, judge that electronic unit is inappropriate, finish this processing.

Electronic component mounting apparatus 10 detects and compares by the radical to the lead-in wire of electronic unit, can also distinguish the different electronic unit of radical that only goes between.Thus, under the situation about the shape of lead-in wire being judged in that the outermost shape that goes between is detected, also can identify the different electronic unit of lead-in wire radical.

Electronic component mounting apparatus 10 uses laser recognition device 38 by the device that detects as the shape to the lead-in wire of electronic unit, thereby can detect lead format with simple processing.In addition, in the above-described embodiment, in order to handle at short notice, to judge, detect outermost shape (outermost lead-in wire at interval) as the shape that goes between, but also can detect at interval other shapes, the diameter that for example goes between and the lead-in wire except outermost.In addition, electronic component mounting apparatus 10 can pass through to use laser recognition device 38, and uses the structure of using in the installation of mounting type electronic unit, suitably carries out the installation of insert type electronic unit (lead-type electronic-part).In addition, in electronic component mounting apparatus 10, as the device that the lead format to electronic unit detects, also can use other devices, for example have the VCS unit 17 of camera.In addition, under the situation of using VCS unit 17, owing to from the downside of electronic unit the shape of electronic unit is measured, so than the situation of using the laser recognition device 38 of can be from the side electronic unit being measured, namely can being measured the electronic unit of the position of Z-direction and light source 38a, position that photo detector 38b is identical, might handle becoming numerous and diverse, precision reduces.

Below, use Figure 92 and Figure 93, definite action of the lift-launch order (erection sequence) of determining electronic unit is described.The order that comprises the electronic unit of insertion in the lift-launch order.Figure 92 is the key diagram for the action of explanation electronic component mounting apparatus.

The electronic component mounting apparatus 10 of present embodiment is as the data of production routine and have the tabulation 302 shown in Figure 92.Tabulation 302 is information and insertion parts specified message of the lift-launch layer corresponding with the lift-launch point of substrate (comprising the point that inserts to substrate).Here, the so-called layer that carries, the information of the priority of using when referring to determine the lift-launch order of electronic unit is set with 1 to 7 numerical value.Here, for carrying layer, the more little lift-launch front that more is judged to be of numerical value, the more big lift-launch back that more is judged to be of numerical value.In addition, carrying layer is to consider various information and the value set by operating personnel.So-called insertion parts is specified, and is that expression goes up to carrying point whether the electronic unit that carries is the project of insertion parts.In addition, in Figure 92, represent to be appointed as the lift-launch point of insertion parts with "Yes".Here, so-called insertion parts mainly refers to the electronic unit that radial lead type electronic unit etc. will go between and insert in the hole that is formed on the substrate.In addition, the insertion parts appointment also is the information of being set by operating personnel.Therefore,, insertion parts can be specified and be made as "Yes" by the lift-launch point that operating personnel are judged to be insertion parts for the kind that does not rely on electronic unit.

Electronic component mounting apparatus 10 uses the information of tabulation 302, generates to carry sequential list 304.Here, in carrying sequential list 304, the lift-launch point of tabulation upside becomes the lift-launch point that carries electronic unit earlier, and the lift-launch point of tabulation downside becomes the lift-launch point that electronic unit is carried in the back.That is, in carrying sequential list 304, the order of carrying electronic unit is represented in proper order from the top beginning sequentially.Here, the interior layer that carries sequential list 304 be based on carry layer and insertion parts specify by control part 60 determine layer information.The control part 60 less lift-launch point beginning order of numerical value of layer is internally determined the lift-launch point that carries electronic unit.

Figure 93 is the flow chart of an example of the action of expression electronic component mounting apparatus.Processing shown in Figure 93 is based on the example that tabulation 302 generates the processing of carrying sequential list 304.Processing shown in Figure 93 is by being carried out by the action of control part 60 control each several parts.As step S200, control part 60 is read production routine.Control part 60 is read production routine from the device of outside, or reads production routine from the storage part of electronic component mounting apparatus 10.Control part 60 is read production routine in step S200 after, as step S202, obtain the information of carrying some n.Specifically, obtain information and the insertion parts specified message of the lift-launch layer that carries some n.

Control part 60 is obtained the information of carrying some n in step S202 after, as step S204, whether be that "Yes" is judged to the insertion parts specified message of whether carrying a n=insertion parts, namely carrying some n.Control part 60 is judged to be in step S204 and is not to carry under the situation of some n=insertion parts (denying), as step S206, is made as interior layer=lift-launch layer.That is, control part 60 is not under the situation of "Yes" in the insertion parts specified message of carrying some n, the numerical value that carries layer is made as the numerical value of interior layer.Control part 60 enters step S210 after the processing of carrying out step S206.Control part 60 is judged to be in step S204 under the situation of carrying some n=insertion parts (being), as step S208, is made as interior layer=lift-launch layer+7.That is, control part 60 is under the situation of "Yes" in the insertion parts specified message of carrying some n, will carry the numerical value that the numerical value that obtains after the numerical value of layer and 7 additions is made as interior layer.Control part 60 enters step S210 after the processing of carrying out step S208.

Whether control part 60 as step S210, finishes carrying data, namely whether has calculated interior layer at whole lift-launch points and judge after the processing of carrying out step S206 or step S208.Control part 60 is judged to be in step S210 not to be had to finish as step S212, will carry and enter step S202 after some n are made as n+1 under the situation of (denying).That is, the lift-launch point of the detected object of interior layer as the next point that carries, is carried out above-mentioned processing.

Control part 60 is judged to be end (being) in step S210, namely the interior layer to whole lift-launch points has carried out as step S214, lift-launch being determined in proper order under the situation of setting.That is, control part 60 is determined to carrying the order that point carries electronic unit based on the interior layer that sets and various condition.Control part 60 generates and carries sequential list after lift-launch is determined in proper order, finishes this processing.

As noted above, whether electronic component mounting apparatus 10 can by operating personnel to being the project that insertion parts is set by arranging, interior layer to the lift-launch point that is set at insertion parts carries out certain add operation, thereby insertion parts back ground is carried on substrate.In addition, operating personnel only by to whether being that insertion parts is judged, just can make the lift-launch back of the electronic unit of object.Thus, when carrying the setting of layer, do not need to consider to set for the layer that carries layer the lift-launch layer of electronic unit.Thus, can reduce the burden that definite operation of carrying layer causes to operating personnel.

Use Figure 94, the action of the assembly supply device of electronic component mounting apparatus is described.Figure 94 is the flow chart of an example of the action of expression electronic component mounting apparatus.Processing shown in Figure 94 is by by the processing of parts supply control part 64 based on control part 60, the action of the each several part of assembly supply device is controlled carried out.In addition, the processing shown in Figure 94 is not dispose under the state of electronic unit to begin in retaining zone.As step S260, parts supply control part 64 makes retainer belt move the amount of 1 spacing.That is, parts supply control part 64 is undertaken 1 time by the feeding pawl that makes feeder unit and moves back and forth or move along direction of feed, thereby makes retainer belt move the amount of 1 spacing.Thus, the electronic unit that keeps on the retainer belt main body is moved to retaining zone.

After parts supply control part 64 makes electronic unit move to retaining zone in step S260, as step S262, the lead-in wire that moves to the electronic unit in the retaining zone is cut off.That is, parts supply control part 64 utilizes cutting unit, and the part between article body and retainer belt main body of lead-in wire is cut off.Parts supply control part 64 as step S264, will be kept clamp position after will going between and cutting off in step S262.That is, parts supply control part 64 is kept the state of being held lead-in wire by the toothholder after cutting off after utilizing cutting unit to go between to cut off.

Parts supply control part 64 is kept clamp position in step S264 after, as step S266, whether keep (adsorb or grasp) electronic unit to judge to suction nozzle 32.Parts supply control part 64 is judged to be under the situation that does not keep electronic unit (denying) on the suction nozzle in step S266, enters step S264.Parts supply control part 64 was kept the clamp position of electronic unit before being judged to be suction nozzle maintenance electronic unit.

Parts supply control part 64 is judged to be suction nozzle and keeps under the situation of electronic unit (being) in step S266, as step S268, discharge electronic unit, namely removes clamp position.Thus, cut-out goes between and from the electronic unit that retainer belt separates, utilizes suction nozzle mobile to the loading position (installation site) of regulation, and carries on substrate.

Parts supply control part 64 discharges electronic unit in step S268 after, as step S270, to whether existing retainer belt feeding request to judge.Here, so-called retainer belt feeding request is to instigate retainer belt to move the amount of 1 spacing, the request that next electronic unit is moved to retaining zone.Parts supply control part 64 is judged to be under the situation of request (being) in step S270, enters step S260, carries out above-mentioned processing again.

Whether parts supply control part 64 is judged to be in step S270 under the situation of not having request (denying), as step S272, finish to judge to handling.Parts supply control part 64 is judged to be to handle in step S272 not to be had to finish to enter step S270 under the situation of (denying).In addition, parts supply control part 64 is judged to be in step S272 under the situation of processing end (being), finishes this processing.

Parts supply control part 64 moves to retaining zone at the electronic unit that makes as noted above, will go between to cut off and clamping, make suction nozzle attract electrons parts after, by removing clamping, thereby can make suction nozzle with state absorption radial lead type electronic unit movably.

Figure 95 is the flow chart of an example of the action of expression electronic component mounting apparatus.In addition, the processing shown in Figure 95 action is from moving into behind the substrate to the action of carrying to substrate till electronic unit is finished.In addition, the action of the processing shown in Figure 95 is to carry out by being controlled by the action of 60 pairs of each several parts of control part.

As step S302, control part 60 is moved into substrate.Specifically, control part 60 utilizes the object substrate that substrate delivery section 12 will be carried electronic unit to carry to assigned position.Control part 60 is moved into substrate in step S302 after, as step S304, keep mobile., so-called keeping mobile (absorption is mobile) here, is that the processing of instigating boarded head main body 30 to move to the relative position of the electronic unit 80 of suction nozzle 32 and the retaining zone that is arranged in parts feed unit 14 is moved.

Control part 60 adsorbs movement in step S304 after, as step S306, suction nozzle 32 is descended.That is control part 60 position that suction nozzle 32 moved to downwards can keep (adsorb, grasp) electronic unit 80.Control part 60 as step S308, utilizes 32 pairs of parts of suction nozzle to keep after suction nozzle 32 is descended, and as step S310, suction nozzle 32 is risen.After control part 60 makes suction nozzle rise to assigned position in step S310, specifically, make electronic unit 80 move to the measuring position of laser recognition device 38 after, as step S312, the shape by the electronic unit of suction nozzle 32 absorption is detected.Control part 60 as step S314, rises suction nozzle after in step S312 the shape of electronic unit being detected.In addition, control part 60 component shape to step S312 as noted above detect, and being judged to be the electronic unit that keeps is under the situation about can not carry, and electronic unit is discarded, again the attract electrons parts.Control part 60 as step S316, carries movement after making suction nozzle rise to assigned position, namely, the processing action that electronic unit by suction nozzle 32 absorption is moved to the position relative with the loading position (installation site) of substrate 8 as step S318, descends suction nozzle 32, as step S320, carry out component mounting (parts installation), that is, carry out discharging from suction nozzle 32 the processing action of electronic unit 80, as step S322, suction nozzle 32 is risen.That is, control part 60 execution in step S312 carry out above-mentioned installation and handle to the processing action of step S320.

Control part 60 makes in step S322 under the situation that suction nozzle rises, and as step S324, whether the lift-launch of whole parts is finished, is whether the installation of the electronic unit that carries on the pre-directed substrate 8 is handled to have finished and judged.(denying) also do not finished in control part 60 is judged to be whole parts in step S324 lift-launch, namely the predetermined electronic unit that carries also has under the residual situation, enters step S304, carries out the processing action that next electronic unit is carried on the substrate 8.As noted above, control part 60 carries out above-mentioned processing action repeatedly, until finish carry whole parts on the substrate till.Control part 60 is judged to be the lift-launch of whole parts and finishes under the situation of (being) in step S324, finish this processing.

Below, use Figure 96, illustrate that suction nozzle adsorbs before and assembly supply device 100 afterwards and the action of boarded head 15 electronic unit that keeps in the assembly supply device 100.Figure 96 is the flow chart of an example of the action of expression electronic component mounting apparatus.Processing shown in Figure 96 is to carry out by being controlled by the action of 60 pairs of each several parts of control part.

As step S340, control part 60 carries out the XY absorption of boarded head 15 and moves, and begins to make 100 pairs of electronic units of assembly supply device to carry out clamping.That is, as step S340, control part 60 makes boarded head 15 move along the XY direction, and suction nozzle 32 is moved to retaining zone.In addition, control part 60 disposes electronic unit in the retaining zone of assembly supply device 100, and then, the cut-out that will go between becomes clamp position.

Control part 60 carries out the processing of step S340, as step S342, under the situation of the holding position of boarded head 15 mobile end, that is, after the suction nozzle 32 that makes boarded head 15 moves to retaining zone, as step S344, clamping stand-by period and elapsed time are compared, as step S346, whether to having passed through the stand-by period, namely whether the elapsed time is judged more than or equal to the clamping stand-by period.

Control part 60 is not judged to be in step S346 and passes through the stand-by period (denying), is under the situation of elapsed time less than the clamping stand-by period, enters step S344.Control part 60 carries out the processing of step S344, S346 repeatedly, till the process stand-by period.

Control part 60 is judged to be in step S346 under the situation through stand-by period (being), as step S348, carries out the absorption of Z axle and descends.That is, control part 60 makes suction nozzle move to the position that can adsorb the electronic unit that is arranged in retaining zone to the Z-direction downside.Control part 60 carries out parts absorption carry out Z axle absorption decline in step S348 after in step S350, that is, utilize suction nozzle that electronic unit is adsorbed, and as step S352, the stand-by period compared when stand-by period and the decline of existing Z axle were removed in clamping.Here, the stand-by period is removed in so-called clamping, refers to just to remove the required processing time by the clamp position of the electronic unit of assembly supply device 100 clampings.The stand-by period was that the suction nozzle of boarded head is in the time of the position of attract electrons parts standby when existing Z axle descended.In addition, the stand-by period was predefined value when existing Z axle descended, and was the required time of adsorption treatment of electronic unit.

After control part 60 compared in step S352, as step S354, whether to whether more greatly, namely be existing Z axle descend time stand-by period＜clamping remove stand-by period judge in clamping if removing the stand-by period.Control part 60 in step S354, be judged to be clamping remove the stand-by period big (being), be that the time stand-by period＜clamping that descends of existing Z axle is removed under the situation of stand-by period, as step S356, remove the stand-by period with clamping and carry out standby, enter step S360.In addition, control part 60 is judged to be in step S354 that the stand-by period little (deny) is removed in clamping, under the situation of the time for the treatment of ≧ clamping releasing stand-by period that is existing Z axle when descending etc., as step S358, the stand-by period is carried out standby when descending with existing Z axle, enters step S360.

Control part 60 as step S360, carries out the Z axle absorption rising of boarded head and the supply action of assembly supply device after the processing of carrying out step S356, S358, finish this processing.

Electronic component mounting apparatus 10 moves by carrying out the processing shown in Figure 95 and Figure 96, thereby can carry electronic unit on substrate.

Below, use Figure 97 to Figure 98 B, an example of the processing under the situation about the electronic unit of the holding position that is positioned at electronic part feeder 100 being kept by suction nozzle is described.Figure 97 is the flow chart of an example of the action of expression electronic component mounting apparatus.Figure 98 A is the key diagram for the action of explanation electronic component mounting apparatus.Figure 98 B is the key diagram for the action of explanation electronic component mounting apparatus.Processing shown in Figure 97 can be carried out by being controlled by 20 pairs of each several parts of control device of electronic component mounting apparatus 10.

In electronic component mounting apparatus 10, as step S402, carried out the maintenance action of electronic unit by suction nozzle.That is, electronic component mounting apparatus 10 is carried out by suction nozzle and is kept (adsorb, grasp) to be positioned at the action of electronic unit of the retaining zone of electronic part feeder.After electronic component mounting apparatus 10 is carried out in step S402 and kept action, as step S404, the hold mode of electronic unit is detected.Specifically, utilize laser recognition device 38 or VCS unit 17, whether keep electronic unit to detect to suction nozzle.

Whether electronic component mounting apparatus 10 as step S406, keeps electronic unit to judge to suction nozzle after in step S404 hold mode being detected.Electronic component mounting apparatus 10 is judged to be in step S406 under the situation that keeps electronic unit (being), finishes this processing.Electronic component mounting apparatus 10 is judged to be in step S406 under the situation that does not keep electronic unit (denying), as step S408, the state of the holding position of electronic part feeder is detected.For example, electronic component mounting apparatus 10 is detected by the height of 37 pairs of holding positions of height sensor, to whether there is electronic unit on the holding position detects.In addition, also can be taken and to having or not electronic unit to detect by filming apparatus 36.

After electronic component mounting apparatus 10 detects the state of holding position in step S408, in step S410 on the holding position, whether existing electronic unit to judge.Electronic component mounting apparatus 10 is judged to be under the situation that has electronic unit (being) in step S410, enters step S416, being judged to be under the do not have electronic unit situation of (denying), enters step S412.Here, electronic component mounting apparatus 10 detects having or not electronic unit based on the height of the holding position that utilizes height sensor 37 to obtain.For example, shown in Figure 98 A, exist in retaining zone under the situation of electronic unit 80, the height of retaining zone uprises, and shown in Figure 98 B, does not have under the situation of electronic unit 80 the height step-down of retaining zone (becoming the position of retainer belt) in retaining zone.Thus, electronic component mounting apparatus 10 is judged to be and has electronic unit under the high situation of the aspect ratio threshold value of retaining zone, under the situation lower than threshold value, is judged to be no electronic unit.

Electronic component mounting apparatus 10 is judged to be in step S410 under the situation not, as step S412, whether the feed motion number of times is judged more than or equal to threshold number.Here, so-called feed motion refers to electronic part feeder 100 and action that retainer belt carried corresponding with the configuration space of electronic unit.The feed motion number of times of step S412 is the number of times that carries out feed motion under can't the state of attract electrons parts.Electronic component mounting apparatus 10 is judged to be in step S412 under the situation of feed motion number of times more than or equal to threshold number (being), enter step S416, be not greater than or equal under the situation of threshold number (denying) being judged to be the feed motion number of times, enter step S414.

Electronic component mounting apparatus 10 is judged to be in step S412 under the situation not, as step S414, carries out the retainer belt feed motion, enters step S402.Electronic component mounting apparatus 10 is judged to be under the situation that is in step S410 or step S412, as step S416 error process, finishes this processing.Here, electronic component mounting apparatus 10 is judged to be in step S410 under the situation that is, handles as mistake, and notice is in holding position this situation of excess electron parts.Electronic component mounting apparatus 10 is judged to be in step S412 under the situation that is, handles as mistake, also can't confirm this situation of parts even notice has been carried out the feed motion of certain number of times in electronic part feeder 100.

As noted above, electronic component mounting apparatus 10 does not have under the situation of excess electron parts in the holding position, by retainer belt is carried, carry out the maintenance action of electronic unit again, even thereby have the part do not dispose electronic unit at retainer belt, device is stopped, can proceeding the installation of electronic unit.In addition, even electronic component mounting apparatus 10 cuts off in electronic part feeder 100 that electronic unit behind the lead-in wire is not kept by suction nozzle under the situation about moving from the holding position, when not having the excess electron parts in the holding position, by proceeding installation action, electronic unit can be installed more efficiently.

Figure 99 is the key diagram of an example of expression suction nozzle.Figure 100 is the key diagram for the maintenance action of the suction nozzle of explanation Figure 99.Figure 99 and Figure 100 are the figure that expression grasps an example of suction nozzle (clamping suction nozzle).Suction nozzle 690 shown in Figure 99 and Figure 100 has fixed arm 692 and moveable arm 694.In suction nozzle 690, the fulcrum 695 of moveable arm 694 is fixed on rotating state on the main body of suction nozzle 690, and moveable arm 694 can be axle with fulcrum 695, make the part relative with fixed arm 692 near the direction of fixed arm 692 to away from direction move.In moveable arm 694, across fulcrum 695, approach with respect to the main part of suction nozzle 690 and with fixed arm 692 or away from the opposition side of part, link drive division 696.Drive division 696 utilizes the drive source (air pressure) that drives suction nozzle and moves.Moveable arm 694 is by the movement of drive division 696, thus make the part relative with fixed arm 692 near the direction of fixed arm 692 to away from direction move.

Suction nozzle 690 exists under the state of electronic unit 80 between fixed arm 692 and moveable arm 694, shortens by making the distance between fixed arm 692 and the moveable arm 694, thereby can grasp electronic unit 80 shown in Figure 100.

Grasping suction nozzle and be not limited to suction nozzle 690, can be different shape.Figure 101 A to Figure 101 D is respectively the key diagram of an example of expression suction nozzle.Suction nozzle 690b shown in suction nozzle 690a shown in Figure 101 A, Figure 101 B, the suction nozzle 690d shown in the suction nozzle 690c shown in Figure 101 C and Figure 101 D is respectively interval and the different suction nozzle of movable range between fixed arm and the moveable arm.Therefore, for suction nozzle 690a to suction nozzle 690d, the shape difference of the electronic unit that can grasp.

Electronic component mounting apparatus 10 is by correspondingly selecting to keep the kind of the suction nozzle of this electronic unit with the kind of the electronic unit that will keep, thereby can suitably keep electronic unit.Specifically, grasp suction nozzle by selecting to be to use the absorption suction nozzle also to be to use accordingly with the electronic unit that will keep, and in the suction nozzle of each kind to using which suction nozzle to switch, thereby can utilize 1 electronic component mounting apparatus that a greater variety of electronic units are installed.

Below, use Figure 102, to electronic component mounting apparatus install electronic unit during an example of processing describe.Figure 102 is the flow chart of an example of the action of expression electronic component mounting apparatus.In electronic component mounting apparatus 10, as step S450, the electronic unit that each suction nozzle by boarded head keeps is determined.That is, the next one is determined by the kind of the electronic unit of suction nozzle maintenance.

Electronic component mounting apparatus 10 is determined electronic unit in step S450 after, as step S452, to whether existing the replacing of suction nozzle to judge.Do not have suction nozzle replacing (denying) if electronic component mounting apparatus 10 is judged to be in step S452, then enter step S456.If electronic component mounting apparatus 10 is judged to be the replacing (being) that has suction nozzle in step S452, then as step S454, carry out the replacing of suction nozzle.Specifically, electronic component mounting apparatus 10 makes boarded head 15 move to changing suction nozzle maintaining body 18, the suction nozzle that boarded head is kept moves to changing suction nozzle maintaining body 18, installs to boarded head remaining on to change on the suction nozzle maintaining body 18 and at the suction nozzle that will use next time.Electronic component mounting apparatus 10 utilizes changes the suction nozzle that suction nozzle maintaining body 18 will be installed on the boarded head, is to grasp the kind of suction nozzle or change absorption suction nozzle or change the kind that grasps suction nozzle from the absorption suction nozzle replacing.Electronic component mounting apparatus 10 is after the processing of carrying out step S454, perhaps in step S452, be judged to be under the situation not, as step S456, carry out the maintenance action of electronic unit, namely, use is installed in the suction nozzle on the boarded head 15, carries out the maintenance action of the electronic unit of determining in step S450, finishes this processing.

Electronic component mounting apparatus 10 by correspondingly the suction nozzle that boarded head is installed being changed with the kind of electronic unit, thereby can utilize more suitable suction nozzle that electronic unit is kept shown in Figure 102.In addition, owing to can change suction nozzle, the two suitably keeps so can utilize 10 pairs of lead-type electronic-parts of 1 electronic component mounting apparatus, mounting type electronic unit.In addition, can keep a greater variety of electronic units.Electronic component mounting apparatus 10 is owing to all be that the two main part, the part that namely not have to go between of lead-type electronic-part, mounting type electronic unit kept, so can use general suction nozzle that two kinds of electronic units are kept.Thus, even the special-purpose suction nozzle that lead-in wire is kept is not set, also can keep lead-type electronic-part.In addition, owing to can obtain above-mentioned effect, thus preferably the main body of lead-type electronic-part is kept, but also the suction nozzle that lead-in wire is kept can be set.

Below, use Figure 103 and Figure 104, to describing from carrying out an example preparing to handle (adjustment of the setting of production routine, the preparation of each several part, assembly supply device etc.) processing till beginning to produce.Figure 103 is the flow chart of an example of the action of expression electronic component mounting apparatus.Figure 104 is the key diagram for the action of explanation electronic component mounting apparatus.In addition, the processing of Figure 103 can be used as and supspends the processing till begin again from production and carry out.

In electronic component mounting apparatus 10, as step S460, carry out and prepare to handle, as step S462, utilize the cutting unit of electronic part feeder 100 with the lead-in wire cut-out of electronic unit, clamping electronic unit.In addition, the section processes handled as the preparation of step S460 of the processing of step S462 and carrying out.In addition, electronic component mounting apparatus 10 does not utilize boarded head to keep after with the electronic unit clamping.

Electronic component mounting apparatus 10 is after the processing of execution in step S462, as step S464, output information.Specifically, the picture 698 shown in Figure 104 is shown as message.In picture 698, show " keeping clamp position? " this message and "Yes" button 699a, "No" button 699b.

Electronic component mounting apparatus 10 is display message in step S464, after some among button 699a, the 699b selected and determined, as step S466, judges whether keeping clamp position.Do not keep clamp position (denying) if electronic component mounting apparatus 10 is judged to be in step S466, namely selected button 699b, then as step S467, remove clamp position, discharge electronic unit, finish this processing.In the case, operating personnel reclaim electronic unit from retaining zone.In addition, in the present embodiment, inquire whether keeping clamp position, but also can be on the contrary inquire whether removing clamp position.In the case, the corresponding function of "Yes" and "No" is opposite.

Keep clamp position (being) if electronic component mounting apparatus 10 is judged to be in step S466, namely selected button 699a, then as step S468, keep clamp position, as step S469, after producing beginning, use the electronic unit of clamping, finish this processing.

Electronic component mounting apparatus 10 is shown in Figure 103, in order purpose such as the off-position of electronic unit to be adjusted and when preparing to handle, electronic unit by will cutting off lead-in wire is after producing beginning, the 1st electronic unit as this electronic part feeder uses, and can alleviate operating personnel's burden.Specifically, the time of reclaiming electronic unit can be saved, in addition, electronic unit after reclaiming with hand can be reduced to time of substrate insertion.

Below, using Figure 105, an example of the processing that electronic component mounting apparatus 10 is carried out when electronic unit is installed describes.Figure 105 is the flow chart of an example of the action of expression electronic component mounting apparatus.

Electronic component mounting apparatus 10 is as step S470, and the position that electronic unit is installed is determined, as step S472, the height of installation site detected.In addition, the height for the substrate of installation site can be detected by height sensor 37.Electronic component mounting apparatus 10 in step S472 to after highly detecting, as step S474, to highly whether be less than or equal to threshold value (fiducial value) (boarded head and locate between distance whether long than threshold value (fiducial value)) judge.That is, whether 10 pairs of electronic component mounting apparatus do not have lift-launch to judge on the position of the installation electronic unit of substrate whatever.

Electronic component mounting apparatus 10 in step S474, be judged to be highly be not less than or equal to threshold value (denying), be under the high situation of aspect ratio threshold value, be judged to be and carried some parts in the installation site, carry out mistake as step S476 and handle, finish this processing.Electronic component mounting apparatus 10 is judged to be under the situation that highly is less than or equal to threshold value (being) in step S474, is judged to be not carry any parts on the installation site, as step S478, carries out the installation of electronic unit and handles, and finishes this processing.

Electronic component mounting apparatus 10 is shown in Figure 105, substrate height to the position of carrying electronic unit detects, under the substrate height condition with higher, pass through error process, exist under the situation of barriers such as miscellaneous part thereby can be suppressed on the loading position of substrate, carry out the situation of the action that electronic unit is installed.Thus, can when suppressing to make substrate or electronic unit damage, electronic unit be installed.In addition, in Figure 105, to become simple in order making to handle, and to utilize the height of 37 pairs of substrates of height sensor to detect, but also can utilize the state of the installation site on 36 pairs of substrates of filming apparatus to detect.

Below, using Figure 106, an example the electronic unit of electronic component mounting apparatus 10 being installed the processing action after finishing describes.Figure 106 is the flow chart of an example of the action of expression electronic component mounting apparatus.

In electronic component mounting apparatus 10, as step S480, judge whether the lift-launch of whole parts finishes, that is, whether will install to substrate based on all electronic units that production routine is installed to substrate.Electronic component mounting apparatus 10 is judged to be whole parts in step S480 lift-launch does not have to finish (denying), namely exists under the situation of the electronic unit that does not have lift-launch, enters step S480.

Electronic component mounting apparatus 10 is judged to be whole parts in step S480 lift-launch finishes under the situation of (being), as step S482, the state of the electronic unit of loading position is detected.Here, the state of the electronic unit of loading position for example can detect by following manner, that is, utilize the height of each position of 37 pairs of substrates of height sensor to detect, or utilize filming apparatus 36 to obtain the substrate surface image.

After electronic component mounting apparatus 10 detects the state of electronic unit in step S482, as step S484, there is not the loading position of electronic unit to judge to whether existing.Electronic component mounting apparatus 10 is under the situation of the testing result of using height sensor 37, and when existence detected the loading position of the low position of aspect ratio design load (for example height of substrate), being judged to be did not have electronic unit.In addition, electronic component mounting apparatus 10 can be in that under the inconsistent situation, being judged to be have electronic unit with mating as the component shape of parts data storage under the situation of utilizing the image obtained by filming apparatus 36 to judge.Electronic component mounting apparatus 10 is judged to be under the situation that has the loading position (being) that does not have electronic unit in step S484, as step S486, generates the error message of expression disappearance parts, enters step S488.In addition, electronic component mounting apparatus 10 to whether existing electronic unit to judge, at being judged to be all loading positions that do not have electronic unit, generates the error message of expression disappearance parts at all loading positions.Electronic component mounting apparatus 10 is judged to be and does not have the loading position (denying) that does not have electronic unit in step S484, is namely all carrying under the situation of electronic unit on all loading positions, enters step S488.

Whether electronic component mounting apparatus 10 is judged to be in step S484 under the situation not, perhaps under the situation of the processing of execution in step S486, as step S488, to existing the loading position that skew has taken place in the electronic unit position to judge.Electronic component mounting apparatus 10 is under the situation of the testing result of using height sensor 37, under the situation that has the detected loading position in position of comparing position (layout of the electronic unit) skew that highly changes with design load, be judged to be the position skew of electronic unit.In addition, under the situation that the image that electronic component mounting apparatus 10 is obtained by filming apparatus 36 in utilization is judged, can mate with the component shape as parts data storage, in the component shape unanimity but under the inconsistent situation in position, be judged to be the position skew of electronic unit.Electronic component mounting apparatus 10 is judged to be under the situation of loading position (being) of the position skew that has electronic unit in step S488, as step S490, generates the error message of expression position skew, enters step S492.In addition, electronic component mounting apparatus 10 is at all loading positions, whether the position of electronic unit is offset judges that all loading positions at the position skew that is judged to be electronic unit generate the error message of expression position skew.Electronic component mounting apparatus 10 is judged to be the loading position (denying) of the position skew that does not have electronic unit in step S488, namely under the situation that the electronic unit of all loading positions all carries in position, enter step S492.

Whether electronic component mounting apparatus 10 is judged to be in step S488 under not the situation, perhaps carried out under the situation of processing of step S490, as step S492, to existing error detection to judge.That is, to whether existing the error message that generates among step S486, the step S490 to judge.Electronic component mounting apparatus 10 is judged to be in step S492 under the situation that has wrong detection (being), and as step S494, output error message finishes this processing.That is, electronic component mounting apparatus 10 is exported the error message that generates in step S486, step S490.In addition, as the output intent of error message, can make in all sorts of ways.Electronic component mounting apparatus 10 for example can show error message at display part 42.Electronic component mounting apparatus 10 is judged to be in step S492 under the situation that does not have wrong detection (denying), finishes this processing.

Shown in Figure 106, electronic component mounting apparatus 10 by detecting whether having carried electronic unit, thereby can confirm whether suitably carried electronic unit to substrate after carry finishing.In addition, by being confirmed by electronic component mounting apparatus 10, can reduce the man-hour of Visual Confirmation, and the substrate that can reduce production becomes the possibility of defective item.In addition, by based on testing result and output error message, thereby can notify disappearance parts, position skew etc. to carry bad generations to operating personnel.In addition, by notify the kind of carrying the bad position that produces, electronic unit as error message, it is bad to eliminate lift-launch before the processing of carrying out next operation.Thus, can enhance productivity.

In addition, in Figure 106, will judge object as all boarded parts, but be not limited thereto.Electronic component mounting apparatus 10 also can be only with specific electronic unit as judging object.For example, can be only with lead-type electronic-part as object, also can be only with the radial lead type electronic unit as judging object.In addition, can be only with the electronic unit of particular types as judging object, also can be only with the electronic unit of specific loading position as judging object.

Below, using Figure 107, an example of the processing action during to the lift-launch of electronic unit describes.Figure 107 is the flow chart of an example of the action of expression electronic component mounting apparatus.When electronic component mounting apparatus 10 carries out the action of attract electrons parts at the suction nozzle that utilizes boarded head at every turn, carry out the processing of Figure 107.In addition, the processing of Figure 107 be basically as electronic unit with the processing under the two situation of installing to substrate of lead-type electronic-part and mounting type electronic unit.In electronic component mounting apparatus 10, as step S910, the electronic unit that keeps is determined, as step S912, whether be that lead-type electronic-part is judged to the parts that keep object.

Electronic component mounting apparatus 10 is judged to be in step S912 under the situation of lead-type electronic-part (being), as step S914, utilizes suction nozzle that the lead-type electronic-part of electronic part feeder is kept.That is, electronic component mounting apparatus 10 lead-type electronic-part that utilizes the holding position (the 2nd holding position) of suction nozzle subtend electronic part feeder 100,402,404,406 etc. to supply with keeps.After electronic component mounting apparatus 10 utilizes suction nozzle that lead-type electronic-part is kept in step S914, as step S916, the lead-in wire of lead-type electronic-part to the insertion that inserts in the hole, and is installed to substrate.

Electronic component mounting apparatus 10 is judged to be in step S912 under the situation that is not lead-type electronic-part (denying), as step S917, utilizes suction nozzle that the mounting type electronic unit of electronic part feeder is kept.That is, the electronic component mounting apparatus 10 mounting type electronic unit that utilizes the holding position (the 1st holding position) of suction nozzle subtend electronic part feeder 100a etc. to supply with keeps.Electronic component mounting apparatus 10 as step S918, is installed the mounting type electronic unit after utilizing suction nozzle that the mounting type electronic unit is kept in step S917 to substrate.That is, electronic component mounting apparatus 10 does not insert the mounting type electronic unit and installs to substrate to inserting in the hole.

Electronic component mounting apparatus 10 in the processing of execution in step S916 or step S918, namely electronic unit is installed after, as step S919, whether the installation of all electronic units is finished to judge.Electronic component mounting apparatus 10 is judged to be to install in step S919 not to be had to finish to enter step S910 under the situation of (denying), the electronic unit that the next one is installed is determined the electronic unit after this is determined is carried out above-mentioned processing.Finish (being) if electronic component mounting apparatus 10 is judged to be to install in step S919, then finish this processing.

Electronic component mounting apparatus 10 can utilize 1 boarded head that mounting type electronic unit and lead-type electronic-part are installed to substrate shown in Figure 107.In addition, electronic component mounting apparatus 10 can utilize same suction nozzle, and the two carries to mounting type electronic unit and lead-type electronic-part.Here, electronic component mounting apparatus 10 keeps (adsorb or grasp) by the main body to lead-type electronic-part, thereby can utilize same suction nozzle to carry, install with the mounting type electronic unit.In addition, electronic component mounting apparatus 10 is by to being that mounting type electronic unit or lead-type electronic-part are judged, correspondingly insert or do not insert to inserting in the hole going between respectively and switch, even thereby under the situation of utilizing identical boarded head or identical suction nozzle to install, also can install to substrate with the condition that adapts with each electronic unit.Thus, needn't just change and to install mounting type electronic unit and lead-type electronic-part suction nozzle.In addition, do not mix lift-launch owing to can be not mounting type electronic unit and lead-type electronic-part being distinguished, so the restriction of lift-launch order is become still less, can further improve installation effectiveness.

Here, electronic component mounting apparatus 10 passes through as lead-type electronic-part, the radial lead type electronic unit that use as noted above is supplied with by electronic part feeder 100, thus can more suitably obtain above-mentioned effect.Electronic component mounting apparatus 10 keeps the radial lead type electronic unit after in electronic part feeder 100 lead-in wire being cut to specific length by utilizing suction nozzle, more particularly, main body is carried out suction nozzle keep, carry, will go between to the insertion that inserts in the hole, thereby install to substrate.As noted above, electronic component mounting apparatus 10 is owing to the main body to electronic unit keeps, so can shorten wire length.In addition, electronic component mounting apparatus 10 utilizes the retainer belt main body to carry owing to constituting, and the cut-out that before keeping, will go between, so under the state after the part that can be kept by retainer belt in order to carry in the lead-in wire of radial lead type electronic unit is removed, install to substrate.Thus, can shorten the lead-in wire of radial lead type electronic unit and install to substrate, can install to substrate making under the electronic unit stable status.Specifically, install to substrate owing to can shorten the lead-in wire of radial lead type electronic unit, so can reduce the vibration that when substrate is installed, goes between and contact with patchhole and substrate is applied.Thus, even with identical operation to radially lead-type electronic-part and mounting type electronic unit are installed, also can reduce the influence that each other installation is caused, even in identical operation, namely, utilize identical boarded head or identical suction nozzle to install continuously, also can suitably install two kinds of electronic units.

Here, the electronic component mounting apparatus 10 of above-mentioned execution mode constitutes, as parts feed unit 14f, has the bowl formula feeder device 90 that uses bowl formula feeder, as parts feed unit 14r, have the radially electronic part feeder 100 of feeder, but be not limited thereto.Electronic component mounting apparatus 10 can make the parts feed unit become various combinations.For example, also can be in the front side, two parts feed units of rear side arrange bowl electronic part feeder of formula feeder, also can be in the front side, two parts feed units of rear side arrange the radially electronic part feeder of feeder.In addition, as noted above, as the parts feed unit, also can comprise electronic part feeder (chip part feeder) 100a that utilizes the electronic unit retainer belt to supply with the mounting type electronic unit.In addition, also the electronic part feeder of a parts feed unit in front side, the rear side all can be set to electronic part feeder (chip part feeder) 100a.That is, also can be set to, the parts feed unit supply lead-type electronic-part (to the electronic unit of substrate insertion) in front side, the rear side, another is supplied with does not have lead-in wire electronic unit (to the electronic unit of substrate lift-launch).In addition, in electronic component mounting apparatus, as electronic component mounting apparatus, also can use so-called pellet type feeder.In addition, in electronic component mounting apparatus, as electronic part feeder, also can use axial feeder, this axial feeder is cut to that to expose below the substrate shortly and bend be under the state of " コ " font in that the lead-in wire of the axialmode electronic unit that retainer belt is kept is as noted above, supplies with to the holding position.In the case, electronic component mounting apparatus is after the axialmode electronic unit main body of utilizing suction nozzle to the holding position of axial feeder keeps, whether lead-in wire is well differentiated at interval, inserted in patchhole (substrate aperture) being judged to be good axialmode electronic unit.No matter electronic component mounting apparatus 10 is the electronic unit of being supplied with by which electronic part feeder, all can be by electronic unit being adsorbed or grasping and carry or insert to substrate.In addition, in supplying with the electronic part feeder of lead-type electronic-part, be disposed at main body lead-in wire the vertical upside towards, namely, lead-line configuration in the vertical downside of main body towards, lead-type electronic-part is supplied with to the holding position that utilizes suction nozzle to implement to keep.Here, electronic component mounting apparatus 10 is preferably shown in present embodiment, to have the parts feed unit of bowl formula feeder, the electronic part feeder of other kinds, for example parts feed units such as above-mentioned radially feeder, above-mentioned axial feeder, mounting type electronic unit retainer belt feeder, rod-type feeder, pellet type feeder are configured in the position relative via substrate delivery section 12, are front side and rear side.Thus, can suppress the situation that bowl vibration of formula feeder impacts the parts feed unit of other kinds, so can make the suction nozzle maintenance effect of the electronic unit of supplying with in the holding position at the electronic part feeder of other kinds stable.

In addition, in the present embodiment, the parts feed unit is illustrated as these two of parts feed

unit

14f, 14r, but quantity does not limit.In addition, also 2 parts feed

unit

14f, 14r can be considered as 1 parts feed unit, parts feed

unit

14f, 14r are considered as the 1st parts supply unit, the 2nd parts supply unit respectively.For example, can be considered as constituting, 1 parts feed unit has a bowl formula feeder (parts feed unit 14f, the 1st parts supply unit) and feeder (parts feed unit 14r, the 2nd parts supply unit) radially shown in above-mentioned execution mode.In the case, the 1st parts supply unit and the 2nd parts supply unit are configured in across the substrate allocation position and on the relative position.In addition, also can be considered as having the 1st parts supply unit, the 2nd parts supply unit at 1 parts feed unit 14f.For example, as noted above, can be considered as constituting, 1 parts feed unit 14f has radially feeder (the 1st parts supply unit) and chip part feeder (the 2nd parts supply unit).As noted above, electronic component mounting apparatus 10 can not rely on combination, has the structure of multiple electronic part feeder and adopt.

Here, be the electronic unit that electronic part feeder 100 is supplied with as feeder radially, existence can utilize retainer belt to keep the various radial lead type electronic units of lead-in wire.Electronic part feeder 100 can be supplied with for example aluminium electrolytic capacitor, inductor, ceramic capacitor, film capacitor etc.In addition, be the electronic unit that electronic part feeder 402,404,406 is supplied with as bowl formula feeder, there are the various lead-type electronic-parts of package parts.Electronic part feeder 402,404,406 can be supplied with for example solid-state relay, DIP type electronic unit, SIP type electronic unit, connector, transformer etc.

In addition, boarded head 15 for present embodiment, in order to utilize 1 boarded head a greater variety of electronic units are installed and are had under the situation of a plurality of suction nozzles, can use said suction nozzle apparatus for automatic change (changing action for the boarded head of realizing by the combination of changing suction nozzle maintaining body and boarded head main body in the present embodiment), each suction nozzle replacing is various suction nozzles, grasp suction nozzle in producing installing.Electronic component mounting apparatus 10 according to size, weight, the article body upper surface corresponding with mounting type electronic unit and lead-type electronic-part whether have adsorbable plane and whether can the holding part main body etc. the parts condition, at each parts, appointment have the suction nozzle in suitable absorption aperture or suitably shape holding part grasp suction nozzle, and be stored in the production routine.Electronic component mounting apparatus 10 switches the suction nozzle of installing at boarded head based on the corresponding relation between the electronic unit of storing in the production routine and the suction nozzle, or in boarded head the suction nozzle that keeps this electronic unit is determined.

Its result, the electronic unit that electronic component mounting apparatus 10 for example will be kept by suction nozzle in substrate is installed changes under the situation of lead-type electronic-part from the mounting type electronic unit, produce the situation of utilizing the suction nozzle identical with the suction nozzle that keeps the mounting type electronic unit that lead-type electronic-part is kept, and the situation of utilizing different suction nozzles that lead-type electronic-part is kept.Electronic component mounting apparatus 10 when preparatory process or in producing, when change takes place the electronic unit of lift-launch, utilizes the said suction nozzle apparatus for automatic change under the different situation of said suction nozzle, automatically change suction nozzle.Namely, continue to carry out following actions: when the electronic unit of installing to substrate is for mounting type electronic unit for example aborning, the suction nozzle that selection and this electronic unit adapt (adsorb suction nozzle or grasp suction nozzle), suction nozzle is moved to be positioned at the mounting type electronic unit on the holding position of the electronic part feeder of supplying with this electronic unit, electronic unit is kept and moves to the assigned position of substrate, make electronic unit carry out carrying action in the decrease speed control.Electronic component mounting apparatus 10 finishes in the installation of this electronic unit of specified quantity, when the electronic unit that the next one should be installed changes to lead-type electronic-part, the identical still difference of suction nozzle is differentiated.Electronic component mounting apparatus 10 is being judged to be under the identical situation of suction nozzle, owing to do not need to change suction nozzle, so the suction nozzle that identical suction nozzle is used as this lead-type electronic-part.In addition, electronic component mounting apparatus 10 is being judged to be under the different situation of suction nozzle, in other suction nozzles that boarded head is installed, exist under the situation of operable suction nozzle, the suction nozzle that this suction nozzle is used as this lead-type electronic-part, in other suction nozzles, do not have under the situation of utilizable suction nozzle, by the said suction nozzle apparatus for automatic change, automatically be replaced by this lead-type electronic-part suction nozzle.Electronic component mounting apparatus 10 moves boarded head after being ready to the suction nozzle that lead-type electronic-part uses like this, and this suction nozzle is moved to the holding position of lead-type electronic-part feedway.Electronic component mounting apparatus 10 utilizes the electronic part feeder of supplying with lead-type electronic-part, to have by built-in shearing device (cutting unit) and be cut to the lead-type electronic-part of the lead-in wire of short specific length in advance from electronic unit band (electronic unit retainer belt), be arranged on the holding position.Electronic component mounting apparatus 10 is by utilizing said suction nozzle lead-type electronic-part is adsorbed or grasping, thereby keep, by utilizing detecting unit (laser recognition device 38) lead-in wire is differentiated at interval, and the capable differentiation of contraposition offset shift-in, the electronic unit that thereby the subtend substrate moves and insert to patchhole (substrate aperture) screens, when inserting to inserting in the hole, lead-in wire is carried out the position offset correction, and make decrease speed when inserting corresponding with the shearing length of lead-in wire and the switching controls of deceleration is gradually installed simultaneously.

In addition, boarded head 15 has under the situation of a plurality of suction nozzles, as long as have a suction nozzle that can keep, carry lead-type electronic-part (insert type electronic unit) at least, the structure of suction nozzle can adopt various structures.For example, boarded head 15 also can make the suction nozzle of suction nozzle for lead-type electronic-part is kept of a part, makes the suction nozzle of remaining suction nozzle for the mounting type electronic unit is kept.In the case, electronic component mounting apparatus is under the situation of utilizing suction nozzle that the mounting type electronic unit is kept, carry out this mounting type electronic unit is carried out the installation control that substrate carries, under the situation that lead-type electronic-part is kept, carry out this lead-type electronic-part to the middle installation control of inserting of patchhole (substrate aperture).In addition, boarded head 15 also can be made as whole suction nozzles the suction nozzle that lead-type electronic-part is kept.In addition, electronic component mounting apparatus 10 is based on production routine, the absorption suction nozzle (perhaps grasp grasp suction nozzle) that absorption is carried the electronic unit of object when determining, according to the kind of electronic unit, is determined the suction nozzle that keeps this electronic unit of installation.Electronic component mounting apparatus 10 is as noted above, a plurality of suction nozzles that preparation can be installed at a boarded head, by the instruction of basis based on production routine, make the action of suction nozzle apparatus for automatic change aborning, the suction nozzle that is installed on the boarded head removably is replaced by the suction nozzle corresponding with the electronic unit of producing (electronic unit of installation) next time, thereby keep inserting lead-type electronic-part at substrate, and carry by the mounting type electronic unit being carried out substrate, install thereby can carry out substrate successively.

Below, use Figure 108 and Figure 109, an example of the electronic component mounting system (installation system) that uses above-mentioned electronic component mounting apparatus is described.Figure 108 is the schematic diagram of the schematic configuration of expression electronic component mounting system.Electronic component mounting system shown in Figure 108 (below be also referred to as " installation system ") 1 has pattern and forms device 2, reflow treatment device 4, conveying

device

6,7 and electronic component mounting apparatus 10.In installation system 1, the order with pattern formation device 2, conveying device 6, electronic component mounting apparatus 10, conveying device 7, reflow treatment device 4 is configured each several part, with conveying substrate.

It is to form the scolder pattern on the surface of substrate that pattern forms device 2, fills the device of scolder to inserting in the hole of substrate.Reflux 4 melts the scolder of substrate by substrate is heated to set point of temperature temporarily, thereby substrate and the electronic unit that will contact with scolder are bonding.Namely, reflux 4 utilizes the scolder of pattern, mounting type electronic unit and substrate bonding that the pattern of the scolder that will form on the surface of substrate is installed are inserted into lead-type electronic-part and the lead-in wire patchhole that inserts in the hole with lead-in wire, utilize the scolder of filling that inserts in the hole to carry out bonding.

Conveying device 6, the 7th, the device of conveying substrate.Conveying device 6 will form the substrate of handling and taking out of in the device 2 at pattern, move into to electronic component mounting apparatus 10.The substrate that conveying device 7 will be handled and take out of in electronic component mounting apparatus 10 is moved into to reflow treatment device 4.

Electronic component mounting apparatus 10 is as noted above, to substrate electronic unit is installed.Here, electronic component mounting apparatus 10 can be installed lead-type electronic-part as electronic unit.In addition, electronic component mounting apparatus 10 is as electronic unit, also can install lead-type electronic-part and mounting type electronic unit the two.Installation system 1 is said structure.

Figure 109 is the flow chart of an example of the action of expression electronic component mounting system.In installation system 1, as step S960, printing solder on the substrate.That is, in installation system 1, as step S960, utilize pattern to form device forms scolder on the surface of substrate pattern, to the filling scolder that inserts in the hole.In installation system 1, in step S960 on the substrate after the printing solder, utilize conveying device 6 that substrate is moved into to electronic component mounting apparatus 10, as step S962, utilize electronic component mounting apparatus 10 to substrate lead-type electronic-part and mounting type electronic unit to be installed.In installation system 1, behind substrate installation electronic unit, the substrate that utilizes conveying device 7 that electronic unit will be installed is moved into to reflow treatment device 4 in step S962, as step S964, carries out reflow treatment, finishes this processing.

In installation system 1, as noted above, by utilizing 10 pairs of lead-type electronic-parts of electronic component mounting apparatus and mounting type electronic unit to install, thereby can utilize reflow treatment 1 time, the two is fixed on substrate with lead-type electronic-part and mounting type electronic unit.Thus, in installation system 1, can simplify the structure of making line.

In addition, install by utilizing 10 pairs of lead-type electronic-parts of electronic component mounting apparatus and mounting type electronic unit, thus as noted above, can under the state of the lead-in wire that shortens the radial lead type electronic unit, install.Thus, in installation system 1, even in identical operation, lead-type electronic-part and mounting type electronic unit are installed, lead-type electronic-part and mounting type electronic unit are carried out backflow simultaneously, also can suitably electronic unit be bonded on the substrate.Thus, can improve the production efficiency of substrate.

In addition, in electronic component mounting system 1, by being pre-charged with or solder-coating to inserting in the hole, thereby the lead-in wire after will inserting via scolder is temporarily fixed at and inserts in the hole, therefore, can not use current execution, for fixed part in the parts bending operation of substrate back side with the parts bending, therefore can shorten lead-in wire, thus, can in the special-purpose erecting device that existing substrate inserts, be omitted in the lead-in wire bending device that the substrate back side arranges.In addition, supporting pin that utilize, supporting substrate can be configured in position arbitrarily in existing electronic component mounting apparatus (chip attachment machine), utilize boarded head to carry out that substrate carries and to the insertion that inserts in the hole.

In addition, be not limited thereto for the installation system that makes the installation system 1 shown in Figure 108, Figure 109 can obtain the electronic component mounting apparatus with preferred structure of above-mentioned effect.For example installation system also can constitute, and has many electronic component mounting apparatus 10.In addition, in installation system, also electronic component mounting apparatus 10 can be used as the erecting device that lead-type electronic-part only is installed.In addition, electronic component mounting apparatus 10 is devices that lead-type electronic-part can suitably be installed, and uses but also can be used as the device that the mounting type electronic unit temporarily only is installed.

Claims

1. electronic component mounting method in the method, when the boarded head main body that utilization has a suction nozzle keeps electronic unit, is transferred described boarded head main body, electronic unit installed on substrate,

It is characterized in that having following step:

Mounting type electronic unit supplying step in this step, is supplied with the mounting type electronic unit to the 1st holding position;

Radial lead type electronic unit supplying step, in this step, the electronic unit retainer belt is carried, this electronic unit retainer belt has a plurality of radial lead type electronic units of the lead-in wire that possesses main body and link with the radial direction of described main body and the retainer belt main body that described a plurality of radial lead type electronic units are kept, the lead-in wire of the described radial lead type electronic unit that described electronic unit retainer belt is kept cuts off, and the radial lead type electronic unit is supplied with to the 2nd holding position;

Mounting type electronic unit installation steps, in this step, by when utilizing described suction nozzle that the mounting type electronic unit that is supplied to described the 1st holding position is kept, transferring, on the loading position of described substrate, carry, thereby described mounting type electronic unit is installed on described substrate; And

Radial lead type electronic unit installation steps, in this step, by when the described main body of utilizing described suction nozzle to the radial lead type electronic unit that is supplied to described the 2nd holding position keeps, transferring, with the insert in the hole insertion of described lead-in wire to described substrate, thereby described radial lead type electronic unit is installed on described substrate.

2. electronic component mounting method according to claim 1 is characterized in that, also has:

Detect step, in this step, the state of the described radial lead type electronic unit that kept by described suction nozzle is detected; And

Determination step, in this step, the state of the described radial lead type electronic unit that keeps based on detected described suction nozzle in described detection step is judged the state of the described lead-in wire of this electronic unit,

In described radial lead type electronic unit installation steps, under the situation that the state of the described lead-in wire of the described electronic unit of judgement satisfies condition in described determination step, with described the insert in the hole insertion of this electronic unit to the loading position of described substrate.

3. electronic component mounting method according to claim 2 is characterized in that,

Also have recycling step, in this step, under the situation that the state of the described lead-in wire of this electronic unit of judgement does not satisfy condition in described determination step, this electronic unit is carried to recovering mechanism.

4. according to each described electronic component mounting method in the claim 1 to 3, it is characterized in that,

In described detection step, by the laser measurement of laser sensor, the shape of the radial lead type electronic unit of determination object is measured.

5. according to each described electronic component mounting method in the claim 1 to 3, it is characterized in that,

Also has substrate state-detection step, in this step, the state that carries the described substrate behind the described electronic unit is detected, based on the state of detected described substrate, described radial lead type electronic unit and described mounting type electronic unit have been configured on the installation site whether and have judged.

6. according to each described electronic component mounting method in the claim 1 to 3, it is characterized in that,

In described radial lead type electronic unit supplying step, the lead-in wire of the described radial lead type electronic unit that described electronic unit retainer belt is kept is cut to specific length shortly, to the supply of described the 2nd holding position.

7. electronic component mounting apparatus, it utilizes at the mobile boarded head of horizontal plane, and the electronic unit that will be positioned at the holding position is transferred and is installed on the loading position of substrate,

It is characterized in that having:

Substrate carrying mechanism, it is carried described substrate to the zone of carrying described electronic unit;

The radial lead type electronic part feeder, its electronic unit retainer belt of packing into, this electronic unit retainer belt has a plurality of radial lead type electronic units of the lead-in wire that possesses main body and link with the radial direction of described main body and the retainer belt main body that keeps described a plurality of radial lead type electronic units, this radial lead type electronic part feeder cuts off the lead-in wire of the described radial lead type electronic unit that described electronic unit retainer belt keeps, with the radial lead type electronic unit from described retainer belt body portion from, supply with to retaining zone;

The mounting type electronic part feeder, it is supplied with the mounting type electronic unit of installing on the described substrate by carrying on described substrate;

The boarded head main body, it has suction nozzle that the main body of the radial lead type electronic unit of supplying with from described radial lead type electronic part feeder and the mounting type electronic unit supplied with from described mounting type electronic part feeder are kept successively, described suction nozzle is driven up and down and rotates the suction nozzle drive division of driving and the boarded head supporter that described suction nozzle and described suction nozzle drive division are supported; And

Control part, its action to described boarded head main body, described radial lead type electronic part feeder and described mounting type electronic part feeder is controlled,

Described control part will be inserted to described substrate by the described radial lead type electronic unit that described suction nozzle keeps, and will be carried on described substrate by the described mounting type electronic unit that described suction nozzle keeps.

8. electronic component mounting apparatus according to claim 7 is characterized in that,

Also have the unit status test section, its state to the described radial lead type electronic unit that described suction nozzle keeps detects,

Described control part is at the state based on the described radial lead type electronic unit that is kept by the detected described suction nozzle of described unit status test section, judge under the situation that the state of the described lead-in wire of this electronic unit satisfies condition, this electronic unit is inserted to described substrate.

9. electronic component mounting apparatus according to claim 8 is characterized in that,

Described control part is carried this electronic unit under the situation that the state of the described lead-in wire of judging this electronic unit does not satisfy condition to recovering mechanism.

10. according to claim 7 or 8 described electronic component mounting apparatus, it is characterized in that,

Described control part is based on the interval of the patchhole of the interval of the described lead-in wire of described electronic unit and described substrate, whether the state of the described lead-in wire of described electronic unit satisfied condition judge.

11. according to Claim 8 or 9 described electronic component mounting apparatus, it is characterized in that,

Described unit status test section is laser sensor, and it is configured in the below of described boarded head supporter, along horizontal irradiating laser and the shape of the electronic unit of determination object is measured.

12. according to each described electronic component mounting apparatus in the claim 7 to 9, it is characterized in that,

Also have substrate state-detection portion, it detects the state that carries the described substrate behind the described electronic unit,

Described control part is based on the state by the detected described substrate of described substrate state-detection portion, whether described radial lead type electronic unit and described mounting type electronic unit has been configured on the installation site judged.

13. according to each described electronic component mounting apparatus in the claim 7 to 9, it is characterized in that,

Described suction nozzle comprises the suction nozzle that grasps that grasps described electronic unit.

14. according to each described electronic component mounting apparatus in the claim 7 to 9, it is characterized in that,

Described suction nozzle comprises the absorption suction nozzle that adsorbs described electronic unit.

15. an electronic component mounting system is characterized in that having:

Pattern forms device, and it is to the filling scolder that inserts in the hole of described substrate, and on the surface of described substrate the pattern of printing solder;

The electronic component mounting apparatus that each is put down in writing in the claim 7 to 9, it is to the described described radial lead type electronic unit of insertion that inserts in the hole that utilizes after described pattern forms device filling scolder, on the described surface of the pattern that is printed with described scolder, described mounting type electronic unit is installed; And

The reflow treatment device, it refluxes to the described substrate that utilizes described electronic component mounting apparatus to install behind described radial lead type electronic unit and the described mounting type electronic unit, and described radial lead type electronic unit and described mounting type electronic unit are welded on described substrate.