JPH08228098A - Apparatus and method for mounting electronic part - Google Patents

Abstract

PURPOSE: To mount electronic part of a wide variety of shapes in place with accuracy by adjusting the point of application of an electronic part to be positioned based on stored information on point-of-application positions. CONSTITUTION: At a station P2 a chip part 2 sucked to a suction nozzle 1 is moved down by a distance h1 under the control of a nozzle and lug drive control unit 14. Then it is temporarily clamped between lugs 3a, 3b that open or close in an interlocked manner, and is positioned in the center relative to the suction nozzle 1. The distance h1 is stored in a table TBL as amount-of- descent information. Similarly, the designations of a plurality of chip parts Nn and amount-of-descent information (information on point-of-application positions) hn corresponding thereto, are stored in the table TBL. This makes it possible to position a wide variety of chip parts against the suction nozzle 1 only by inputting the type Nn of a chip part to be positioned into the nozzle and lug drive control unit 14. Thus the clamp position can be adjusted according to chip part types.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method, and is applicable, for example, to mounting a chip component on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, a chip component has been mounted on a printed circuit board as follows. That is, first, in the chip component supply unit, the suction nozzle 1 as an electronic component gripping device descends to vacuum-suck the chip component 2 (see FIG. 5).
(A)) After that, it rises and is transferred to the chip part positioning part. Next, in this chip part positioning unit, the two sets of claws 3 that oppose the chip part 2 as a positioning device are arranged.
a and 3b (one set of claws is not shown) are closed from two directions (FIG. 5 (B)), and the chip part 2 is clamped to position the suction nozzle 1 at the center. Then, the claws 3a and 3b are opened (FIG. 5C). After being positioned in the center in this way, the chip component 2 is transferred to the chip component mount portion with the suction nozzle 1 sucking it. In the chip part mounting part, the suction nozzle 1
When it comes into contact with a predetermined position of the printed circuit board 4 (FIG. 5 (D)), the suction nozzle 1 is lifted after releasing the suction of the suction nozzle 1, and as a result, the chip part 2 is mounted on the printed circuit board 4. It is set to the state (FIG. 5 (E)).

In this way, the printed circuit board 4 on which the chip part 2 is mounted (may be temporarily fixed) is then soldered by the dip method or the reflow method so that the chip part 2 is soldered. Has been done.

[0004]

By the way, as a chip component, electrodes 5a and 5b are provided in a cap shape at both ends of the chip component body so that it can be soldered by a dip method or a reflow method. Figure 6
(A)), the electrode 7a, 7b provided from the end face to a part of the mount surface 8 (FIG. 6 (B)), and the electrodes 9a, 9b provided as lead terminals having an L-shaped cross section. There are 10 (FIG. 6C) and the like.

Among them, the one having the lead terminals 9a and 9b is resistant to thermal stress, and has come to be widely used for chip parts which are required to meet such requirements.

When the chip part 10 having such lead terminals 9a and 9b is to be positioned at the center of the suction nozzle 1 by holding the claws 3a and 3b as described above, as shown in FIG. 7 (A). It is conceivable to sandwich the tip portions of the lead terminals 9a and 9b so that the claws 3a and 3b come into contact with each other.

However, according to this method, the lead terminals 9a and 9b are largely deformed and pinched by the pinching force, so that the desired positioning accuracy (actually, about 0.1 mm) can be satisfied. It may not be possible to position it.

Therefore, as shown in FIG. 7B, the claws 3a and 3b sandwich the portions of the lead terminals 9a and 9b extending in parallel to the side surfaces of the chip component 10, and the chip component 10 with respect to the suction nozzle 1. It is conceivable to position the in the center.

However, the chip component 10 having the lead terminals 9a and 9b, the surface having the size at all times, and the lead terminal 9
There are various shapes such as the positions where a and 9b are exposed, and the shape.
Even if an attempt is made to sandwich the claws 3a and 3b, the sandwiching positions may differ depending on the parts, and sufficient positioning accuracy may not be obtained.

In order to solve this problem, it is conceivable to change the shapes of the claws 3a, 3b according to the type of chip parts, but this is the case in a device that automatically mounts a large number of types of chip parts. It is practically impossible to prepare the nails 3a and 3b having different shapes for each type.

The present invention has been made in consideration of the above points, and it is an object of the present invention to propose an electronic component mounting apparatus having a simple structure capable of accurately mounting electronic components of various shapes at predetermined positions. It is a thing.

[0012]

In order to solve such a problem, in the present invention, an electronic component is placed on a substrate by a positioning device that moves an electronic component gripped by an electronic component gripping device to a predetermined position and positions it. In a mounting device for electronic components to be mounted on, a storage device is provided for storing a plurality of pieces of position information hi of an action point when the positioning device positions an electronic component for each of a plurality of different types of electronic components Ni, and the electronic device is stored in the storage device. Position information h of the applied point
Based on i, the operating point of the electronic component to be positioned is adjusted by the adjusting device.

If the positional relationship between the electronic component gripping device and the positioning device is fixed, the action point at the time of positioning becomes unstable depending on the type of electronic component, and sufficient positioning accuracy cannot be obtained.

Therefore, in order to position the action point at a position where sufficient positioning accuracy can be obtained, the relative positional relationship between the electronic component gripping device and the positioning device can be changed according to the type of electronic component. did.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described in detail below with reference to the drawings.

As shown in FIG. 3, the mounting device for the chip parts is provided with a plurality of suction nozzles equiangularly spaced and a mounting head portion 11 which rotates clockwise, for example. A plurality of mount head parts 11 (for example,
6) work stations P1, P2 ... P6.

A chip component supply unit 12 is provided in the vicinity of the station P1, and the suction nozzle 1 (FIG. 5) descends in this station P1 to vacuum-adsorb the chip component 2.

The station P2 is a station for positioning the chip part 2 at the center with respect to the suction nozzle 1. A claw driving mechanism 13 is provided near the station P2 as shown in FIG.
3 interlocks the pair of claws 3a and 3b (FIG. 5) according to the control signal S1 from the nozzle / nail drive control unit 14,
The chip part 2 is clamped and then controlled so as to move away from the chip part 2.

The nozzle / jaw drive controller 14 also sends a control signal S2 to the nozzle drive mechanism 15 to cause the suction nozzle 1 to move.
Is controlled to descend to a position where the sucked chip component 2 is clamped and to be lifted after the clamping operation is completed.

Here, the nozzle / claw drive controller 14 is shown in FIG.
As shown in FIG. 2, the descending amount information h1 to hn for descending the suction nozzle 1 when the chip part 2 arrives is stored in the form of a table TBL for each type N1 to Nn of the chip part 2, and stored in the station P2. Chip parts supplied 2
The descending amount information hi corresponding to the type Ni (i = 1 to n) is taken out, and the control signal S2 corresponding to this descending amount information hi is given to the nozzle drive mechanism 15.

For example, a chip component with lead terminals (see FIG. 6)
When (C)) is supplied to the station P2, the nozzle / pawl drive control unit 14 takes out the descending amount information according to the chip component, and the suction nozzle 1 according to the descending amount information.
When the chip parts are clamped by the claws 3a and 3b, the clamping position (point of action) is set to the lead terminal portion parallel to the side surface of the chip component as shown in FIG. 7B.

That is, when the claws 3a and 3b are clamped,
The descending amount information h1 to obtain sufficient positioning accuracy
hn is stored in the table TBL in advance.

The next station P3 is a station for confirming the presence or absence of the chip component 2 adsorbed by the adsorption nozzle 1 and the adsorption posture. As shown in FIG. 4, the station P3 is provided with a light emitting section 16 for emitting parallel light rays L and a light receiving section 17 having light receiving elements arranged in parallel in the nozzle axis direction so as to face each other with a predetermined distance therebetween. The suction nozzle 1 is lowered between the light emitting portion 16 and the light receiving portion 17 of the set to interpose the chip component 2, and the height of the chip component 2 is detected to confirm the presence or absence of suction. For example, when the chip part 2 is obliquely adsorbed as shown by the chain double-dashed line in FIG. 4, the detected height is different from the original height of the chip part 2, and the chip part 2 is adsorbed in an abnormal posture. Can be detected.

In order to execute such a checking operation, a control section (not shown) for controlling the operation of the station P3 is provided with a table for storing height information for each chip part.

The station P4 is a station for mounting the chip component 2 on a printed circuit board, and the printed circuit board is mounted on the station P4, for example, XY.
A table 18 is provided. In the station P4, the suction nozzle 1 is lowered, and when it comes into contact with the printed circuit board, the suction is finished and the chip component 2 is mounted at a predetermined position on the printed circuit board.

Stations P5 and P6 are a station for ejecting the chip components that have been adsorbed in an abnormal posture, and a station for performing air blow to prevent clogging of the adsorption nozzle 1, respectively.

In the above construction, the chip component 2 sucked by the suction nozzle 1 is
Under the control of the nozzle / pawl drive control unit 14, the descending amount information hi
Only the claw 3a that is lowered and is operated to close and open.
It is once sandwiched by 3b and positioned centrally with respect to the suction nozzle 1.

At this time, a plurality of chip parts Nn and the corresponding descending amount information (positional information of the action point) hn as the descending amount information hi are stored in the table TBL (FIG. 2), so that positioning is attempted. Chip part type N
Various chip parts can be positioned with respect to the suction nozzle 1 only by inputting n into the nozzle / jaw drive controller 14.

Therefore, according to the above configuration, the holding position can be adjusted according to the type of the chip component, and sufficient positioning accuracy can be obtained for various chip components.

In the above embodiment, the amount of lowering of the suction nozzle 1 for the positioning station P2 is changed according to the type of the chip component 2, but the lowering amount of the suction nozzle 1 is made constant and the claw 3a is provided. The positions of 3b (height for clamping operation) may be changed according to the type of the chip component 2, and even in this case, the same effect as described above can be obtained.

In the above embodiment, the table for storing the amount of lowering of the positioning station P2 and the table for storing the height of the chip component 2 in the suction confirmation station P3 are separately provided. Since the descending amount of the suction nozzle 1 is related to the height of the chip component 2, one table may be used for both stations P2 and P3, and the structure can be simplified accordingly. .

Further, although the chip component mounting apparatus has been shown in the above-described embodiments, the present invention is not limited to this, and can be widely applied to electronic component mounting apparatuses as necessary.

[0033]

As described above, according to the present invention, the sandwiching (action point) position information of a plurality of types of electronic components and corresponding electronic components is stored in advance, and positioning is performed according to the type of the electronic components. Since the position of the electronic component that the device contacts is changed, various electronic components can be handled,
Moreover, it is possible to easily obtain an electronic component mounting apparatus that can achieve sufficient positioning accuracy for various electronic components.

[Brief description of drawings]

FIG. 1 is a block diagram including a partial perspective view showing an embodiment of an electronic component mounting apparatus according to the present invention.

FIG. 2 is a table showing a table that stores information about the amount of lowering of a suction nozzle according to the type of chip component.

FIG. 3 is a schematic diagram showing a mounting device for a chip component.

FIG. 4 is a schematic diagram used to explain a suction confirmation station for a chip component.

FIG. 5 is a schematic diagram showing a method of mounting a chip component.

FIG. 6 is a schematic diagram for explaining a defect of a conventional device.

FIG. 7 is a schematic diagram used to explain a defect of a conventional device.

[Explanation of symbols]

1 ... Suction nozzle, 2 ... Chip parts, 3a, 3b ...
Claws, 4 ... Printed circuit board, 13 ... Claw drive mechanism, 14 ...
... Nozzle / nail drive control unit, 15 ... Nozzle drive mechanism.

Claims (2)

[Claims] 1. An electronic component gripping device for gripping an electronic component, and a positioning device for moving the electronic component gripped by the electronic component gripping device to a predetermined position to position the electronic component on a substrate. A mounting device for electronic components to be mounted on a storage device, wherein the positioning device stores a plurality of pieces of position information of a point of action when the electronic device positions the electronic component for each of the plurality of different types of electronic components. An electronic device mounting apparatus, comprising: an adjusting device that adjusts the operating point of the electronic component to be positioned based on the positional information of the operating point. 2. An electronic component gripping device grips an electronic component, and the electronic component gripped by the electronic component gripping device is moved to a predetermined position and positioned by a positioning device, and then the electronic component is mounted. In a method of mounting an electronic component mounted on a board, the positioning device stores a plurality of pieces of position information of a point of action when the electronic device positions the electronic component in a predetermined storage device for each of the plurality of different types of the electronic component, and performs positioning. A method for mounting an electronic component, comprising: reading position information of an action point of the electronic component to be attempted from the storage device, and positioning the electronic component based on the read position information.