JPS61229399A - Automatic electronic component mounting apparatus - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to an improvement in a mounting mechanism of an apparatus for automatically mounting electronic components having linearly arranged lead terminals, such as hybrid ICs, on a printed circuit board at high density.

(Prior Art and its Problems) Various devices have been developed and put into practical use for automatically mounting electronic components on printed circuit boards. However, these devices are designed for parts that are standardized in shape and whose dimensional accuracy is within a range suitable for automatic mounting, so they cannot be used reliably for parts with large dimensional variations, such as hybrid ICs. It has been considered extremely difficult to mount them on a substrate with high density.

As shown in Fig. 2, the hybrid IC has a large number of lead terminals 2 arranged in a line, and the main body parts l and -a that constitute the electronic circuit are usually molded with a moisture-proofing agent or the like. . For this reason, even though the lead terminal itself has been standardized to a certain degree and the positional accuracy between the terminals and terminals has been ensured, the positional relationship between the external shape of the main body and the lead terminal, for example, the value of Even if the ICs are of the same type, there is considerable dimensional variation.
Since the positional relationship between the gripping mechanism and the IC lead is not guaranteed, it is difficult to insert the IC lead into the board as it is. In order to avoid this, the positional relationship between this gripping mechanism and the lead can be guaranteed by gripping the lead itself with some kind of mechanism. Since a certain amount of space is required for the opening and closing operations of the two gripping mechanisms, there is a problem in mounting ICs on the board at a high density.

(Purpose) The present invention solves these conventional problems, and... Even in the case of electronic components such as hybrid ICs, where the relative positional accuracy between the two main bodies and the lead terminals cannot be ensured, it is possible to Moreover, it is an object of the present invention to provide a means for enabling high-density mounting on a printed circuit board.

(Example) The basic idea of the present invention for achieving the above object will be explained using FIGS. 3 to 6. FIG. 3 shows a hybrid ICI in which lead terminals are linearly arranged as an example of an electronic component.

The basic concept for automatically inserting the lead terminal 2 into the insertion hole 4 of the printed circuit board 3 will be shown.

(a) in FIG. 3 shows an iC in the parts supply cassette 6.
The format of this cassette itself is not directly related to the principle of the present invention. The lead terminal 2 is clamped by a positioning clamper 35.For example, if the cross section of the lead is circular, the structure of the clamper can be as shown in Fig. 4, but other methods are also possible. The purpose of this is to accurately position and fix the lead terminals.For the ICI thus clamped, as shown in FIG. 3(c).

The contact sensor 32 is brought into contact with the main body of the IC. For example, as shown in FIG. 5, the contact sensor includes a contactor 32 for measuring one end face of the IC body, that is, a reference position
-a, and a contactor 32-b for detecting pressure on the IC body as necessary. This makes it possible to know the relative positional relationship between the position of the lead terminal on the reference side and the external position of the main body on the measuring contact side. Although measurement of such relative positional relationships is also possible using a thermal TV camera or other non-contact means, using a contact means as shown in Fig. 5 is difficult when actually holding the IC with a chuck mechanism. It has the advantage of being able to directly measure the same position. After measuring the relationship between the IC lead position and the body position on the reference side as described above, the third
As shown in Figure 3(d), grip the ICI with the chuck mechanism 45, and insert the lead 2 into the insertion hole 4 of the board 3 as shown in Figure 3(e).
and then as shown in Figure 6, lead terminal 2.
The required number of leads 2-b are clinched to fix the ICI to the board 3.

The basic principle of the present invention has been described above, and its contents will be further explained in detail with reference to Examples. FIG. 7 shows an example of the configuration of an automatic insertion device for hybrid ICs, etc. based on the principles of the present invention. In FIG. 7, 10 is a belt conveyor that transfers the target printed circuit board, and as shown by the white arrow, the board is supplied from 10-a to the insertion device, and after the insertion work is completed, the next step is carried out by 10-a. Send to process. 2
0 is the IC supply unit, which is loaded with various ICs. 6-a.

6-b etc. are mounted, it moves in the vertical direction as shown by the arrow, and stops at a position where the required IC can be supplied. At this time, the nine-component extrusion unit 21 separates only one predetermined IC from the cassette. The separated IC is supplied to a component positioning recognition section 30 in which a component lead clamper 35 and a position measurement sensor 32 are arranged.
By the method described in tyl and (c), the relative positional relationship of the main body with respect to the lead is measured. Next, 40 is a parts transport section.

Movement base 42 in the direction of arrow y'. Combined with this θ
Mechanism for rotation in the direction and movement in the 2′′ direction 43. It is composed of a chuck mechanism 45 and the like arranged at its tip.

The chuck mechanism has a main finger 46-a for positioning (not shown) and a sub-finger 46-b for generating gripping force (not shown) as shown in FIG. 2(d). In accordance with the recognized result, the main figure 1X is moved relative to the moving mechanism to grip the ICI. Thereafter, the two-component transport unit 40 moves the IC onto the insertion hole of the board 3 positioned by the xy moving mechanism 50, and rotates the IC around the θ axis as necessary.

Lower the 2' shaft and insert the lead part of the ICI into the insertion hole 4. When the lead is inserted into the hole, the clinch mechanism 60 is activated, and as shown in FIG.
The IC is fixed to the board by clinching the glue 2-b. The xy moving mechanism 50 is compatible with such an insertion operation, and after receiving the board from the belt conveyor 10-a in advance, fixes the board using the positioning hole 5 of the board, and
Move the board to the required position for insertion. After completing the process or multiple IC insertions, the fixation of the board is released and the board is delivered to the belt conveyor 10-b. As described above, in the conveying section 40, the chuck mechanism 45 performs a correction movement with respect to the moving mechanism 43 corresponding to the relative position of the IC lead and the main body, so that a constant sequence is performed from the supply of nine components to the completion of insertion. It is possible to respond by action.

FIG. 7 shows an example of the arrangement of component insertion holes on the printed circuit board 3. Arrays 4-A and 4-B are perpendicular to each other, but in both cases, the lead on the reference side of the component must be inserted into the insertion hole 4-a or 4-a' on the reference side. . In order to easily do this, a moving mechanism 43 in the component transport section 40 is used.

The structure of the chuck mechanism 45 may be as shown in FIG. That is, at the stage when the position of the component gripped by the chuck mechanism 45 has been corrected based on the information obtained by the two-component positioning recognition unit 30, the lead terminal 2-a on the reference side
The position is the rotation axis of the moving mechanism 43.

That is, it may be made to coincide with the axis of the θ-axis.

In such a state, the entire chuck mechanism 45 is moved by the moving mechanism 43.
or the fingers 46 of the chuck mechanism
This can be easily realized by moving -a and 46-b independently. As a result, as shown in FIG. 7, the reference side lead 2-
By positioning a with respect to the reference side insertion hole 4-a or 4-a', parts can be inserted, and control is also extremely simple.

As explained above, the basic idea of the present invention is that in an electronic component insertion device having a plurality of leads, each stage of two-positioning, two-position detection, insertion operation, and clinch operation is performed not at the center position of the component, but at the nine-part insertion device. This is done consistently based on the lead at one end of the 9 parts, regardless of the dimensions of the parts, the number and pitch of the leads, or the direction in which the parts are inserted on the board.
The purpose is to realize general-purpose operation. Based on this basic concept, the mechanical part of the device, the detection device part,
It is clear that the control circuit portion etc. can be realized in various forms using conventional techniques.

(Effects) As explained above, the electronic component automatic mounting device according to the present invention can mount electronic components such as hybrid ICs, which have large variations in external shape, on a board at high density, and can reduce the work of inserting two components. It is extremely effective in improving efficiency.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram of a chuck mechanism suitable for position correction according to an embodiment of the present invention, FIGS. ) to (e) are explanatory diagrams showing the principle of the present invention, Figures 4.5.6 are block diagrams showing embodiments corresponding to each element in Figure 3, and Figure 7 is an electronic diagram of the embodiment of the present invention. FIG. 2 is a configuration diagram of an automatic component mounting device. FIG. 8 is a diagram showing the arrangement of component insertion holes on the board. 1: Electronic component, 2: Main body, 3: Lead terminal. 10: Belt conveyor, 20: IC supply section, 30: Component positioning recognition section, 40: Component conveyance section, 43: Movement mechanism. 45: chuck mechanism, 46: finger section, 50: xy movement mechanism, 60: clinch mechanism. Figure 1 Figure 2

Claims (1)

[Claims] In an electronic component automatic mounting device that automatically mounts an electronic component composed of a main body part and a lead terminal part onto a printed circuit board by gripping it with a chuck part, detecting the relative position of the main body part and the lead terminal part of the electronic component; The correcting means for the relative positional deviation with respect to the printed circuit board based on the relative position detection is based on a lead at one end of the component, and the lead is aligned with the central axis of the moving mechanism of the chuck mechanism. An electronic component automatic mounting device featuring: