JPH0197000A - Ic mounting system - Google Patents

Abstract

PURPOSE:To enable the accurate positioning of IC and the easy mounting on a substrate without damage, by providing a judging means to judge whether the IC is accurately positioned or not, and mounting the IC in accordance with both the detection results of a detecting means to detect deviations of a substrate pattern, and the judgement results of the judging means. CONSTITUTION:When a substrate 7 which is loaded on a conveyer 6 and carried is subjected to positioning, a robot 3 starts to operate, and an IC is attracted from an IC tray 5 by an IC mounting hand 1 installed on the robot 3. After positioning is performed in the manner in which the external shape of the IC is pinched by the IC mounting hand 1 with nails of four directions. Then the IC is dropped in an IC positioning jig 4, and subjected to the positioning in lead interval. When the IC 33 is correctly dropped in, the IC 33 becomes horizontal and the heights of the leads in the four directions become equal. Therefore four proximity sensors 22 previously adjusted detect all leads, and judge that positioning is accurately done. Thereby enabling accurate and reliable mounting of IC on the substrate without damage.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC mounting system for mounting an IC (integrated circuit) onto a printed wiring board, and in particular to a flat pack IC.
This invention relates to an IC mounting system for mounting.

[Prior Art] Conventionally, this type of IC mounting system consists of a means for sucking an IC from a tray or tape, a means for positioning the IC, and a means for transporting the IC and mounting the IC on a substrate. However, the IC positioning means is
As the number of IC lead pins increases, the lead spacing, substrate pattern spacing, width, etc. become smaller, which requires highly accurate positioning means. In general, the external dimension granularity of 80-pin and 100-pin ICs has an error of approximately ±0.4 balls, the lead pitch accuracy is ±0.15 + nl11, and the lead width accuracy is ±0.
Since the error is about 0.1111111, the positioning means based on the lead spacing allows for more accurate positioning than the positioning means based on the outer shape.

For an IC with about 80 pins, as shown in FIGS. 5 and 6, a flat pack IC 63 is attached to the IC positioning jig 61.
High precision positioning is achieved by inserting the positioning pins 62 between the leads 64 of the IC.

[Problems to be solved by the invention] However, in the conventional IC mounting system described above,
Since positioning means is used based on the IC lead spacing, when dropping the IC into the jig as shown in Figure 6, the IC
Even if the IC does not fit into the jig accurately due to bending of the leads, etc., and even if the IC is not positioned, it cannot be determined, and the operation of the TA means of the robot or the like cannot be stopped. For this reason, IC leads may be mounted on the board with bent parts without being positioned properly, or the IC or I
C. There was a drawback that the positioning jig could be destroyed.

[Means for Solving the Problems] The present invention solves the above problems and provides an IC mounting system that can accurately position an IC and easily mount the IC on a substrate without damaging the IC. The purpose is to

In order to achieve the above object, an IC mounting system according to the present invention includes: a first positioning means for sucking an IC and positioning the IC based on its external shape; and a second positioning means for positioning the IC according to the lead spacing of the IC. , a determining means for determining the quality of positioning of the IC by the second positioning means, a detecting means for detecting a deviation of a pattern of a board on which the IC is mounted, a determination result of the determining means and a detection result of the supplementary detecting means. There is a mounting means for mounting the IC on the base based on the above.

In a preferred embodiment, the second positioning means
The positioning jig is equipped with a groove for accommodating the IC, and a pin provided in the groove and inserted between the leads of the IC, and the determining means includes:
It consists of a plurality of sensors that each detect a plurality of leads of an IC housed in the Moeki positioning jig. Moreover, the detection means is based on an image sensor.

[Examples] Hereinafter, examples of the present invention will be described with reference to the drawings.
Explain.

FIG. 1 is a diagram showing the configuration of an IC mounting system according to a first embodiment of the present invention.

In the figure, the IC mounting system according to this embodiment is
The IC is positioned by adsorption of C and the external shape of the IC.
An IC mounting hand 1 for mounting C on the board 7, a CCD (charge coupled device) camera 2 for detecting the position of the pattern on the board 7, and an IC mounting hand 1.
and a robot 3 equipped with a CCD camera 2 to control the IC mounting operation, an IC positioning jig 4, and an IC tray 5 located within the area of the IC mounting hand 1 and carrying a plurality of ICs.
and a conveyor 6 that conveys the substrate 7 into the operating area of the ICI δ mounting hand 2 and the CCD camera 2.

FIG. 2 is a perspective view showing the external configuration of the IC positioning jig 4;
FIG. 3 is a sectional view of FIG. 2.

The IC positioning jig 4 positions the ICs according to the sorting interval of the ICs, and has grooves 4 for accommodating the ICs.
◎ Also, the IC positioning jig 4 has a proximity sensor 22 for determining whether or not the IC is accurately positioned. . The height of the proximity sensor 22 attached upward from the bottom of the IC positioning jig 4 can be adjusted freely, and the height of the proximity sensor 22 can be adjusted to match the height when the IC 33 is correctly accommodated. That is, the sensitivity is adjusted in advance. However, all four proximity sensors 22 are adjusted to the same state, and the determination of whether the positioning is good or bad is performed by calculating the logical sum of the outputs of the four proximity sensors 22.

Next, the operation of this embodiment will be explained.

When the substrate 7 that has been carried on the conveyor 6 is positioned, the robot 3 starts moving and the I
The IC is picked up from the ICl-ray 5 by the C mounting hand 1. Next, use the IC mounting hand 1 to position the IC by holding the outer shape of the IC between the claws in four directions, and then place the IC in the rc
It is dropped into the positioning jig 4 and positioned at the interval between the leads.

Here, when the IC 33 is correctly dropped as shown in Fig. 3, the IC 33 becomes horizontal and the height of the lead is the same in all four directions, so all four proximity sensors 22 adjusted in advance detect the lead. It is determined that the positioning has been performed accurately.

On the other hand, for example, a lead of an IC 33 caught on the pin 4b of the IC positioning jig 4 will not fall to the bottom of the groove 4a of the jig, and the proximity sensor 22 in that direction will not detect the lead, so the logical sum is established. Therefore, it is determined that the position has not been determined.

In this way, the IC positioning jig 4 determines whether the positioning is good or not. If the positioning is performed accurately, the IC mounting hand 1 picks up the IC again, and if the positioning fails, the operation is interrupted and the positioning continues. Perform the removal work of the failed IC. When positioning is performed and the IC is attracted by the IC mounting hand 1, the position of the pattern on the substrate 7 is detected by the CCD camera 2. Based on this detection result, the robot 3 controls the IC mounting hand using, for example, a pattern recognition means that recognizes the deviation of the pattern on the substrate, that is, corrects the deviation of the pattern and mounts the IC onto the substrate 7.

FIG. 4 is a diagram showing the configuration of an IC mounting system according to a second embodiment of the present invention, in which the same components as those in FIG. 1 are designated by the same reference numerals.

In this embodiment, two IC positioning jigs 4 are provided, and two types of ICs can be positioned. Further, an IC of about 20 pins is sucked by the parts feeder 47 and mounted onto the board 7 by positioning only by the outer shape. In this way, by increasing the number of IC positioning jigs 4 and combining them with the parts feeder 47, three kinds of ICs can be mounted at one time. As the number of IC persimmons increases and the number of positioning jigs increases, the reliability of detecting positioning defects using the proximity sensor 22 increases compared to conventional systems.
It has the advantage of being available at

[Effects of the Invention] As explained above, according to the present invention, a determination means is provided for determining whether or not an IC has been accurately positioned, and a detection result of a detection means for detecting a deviation of a pattern on a substrate is determined. By mounting the IC based on the judgment result of the library judgment means, it is possible to accurately and reliably mount the IC on the board without mounting a poorly positioned IC or damaging the positioning jig and IC used as the positioning means. Can be implemented.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the configuration of an IC mounting system according to the first embodiment of the present invention, FIG. 2 is a perspective view showing the external configuration of the IC positioning jig J (FIG. 3 is a sectional view of FIG. 2, FIG. 4 is a diagram showing the configuration of an IC mounting system according to the second embodiment of the present invention, FIG. 5 is a perspective view showing the configuration of a conventional IC positioning jig, and FIG. 6 is a diagram showing the configuration of a conventional IC positioning jig. It is a diagram showing the state. 1: IC mounted hand 2: CCD camera 3: Robot 4.61: IC positioning jig 5: ICl-ray 6: Conhair 7 two boards 22: Proximity sensor 33: TC47: Baht feeder

Claims (4)

[Claims] (1) a first positioning means that adsorbs an IC and positions the IC based on its external shape; a second positioning means that positions the IC based on the lead interval of the IC; and a positioning means for positioning the IC by the second positioning means. A determining means for determining pass/fail, a detecting means for detecting a deviation in the pattern of a board on which an IC is mounted, and a mounting means for mounting the IC on the base based on the determination result of the determining means and the detection result of the detecting means. An IC mounting system comprising: (2) The second positioning means is a positioning jig comprising a groove for accommodating an IC, and a pin provided in the groove and inserted between the leads of the IC. The IC mounting system described. (3) The IC mounting system according to claim 2, wherein the determining means includes a plurality of sensors that respectively detect a plurality of leads of an IC accommodated in the positioning jig. (4) The IC mounting system according to claim 1, wherein the detection means is an image sensor.