JPS61229400A - Automatic electronic component mounting apparatus - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to an improvement in a mounting mechanism of an apparatus for automatically mounting electronic components having linearly arranged lead terminals, such as hybrid ICs, on a printed circuit board at high density.

(Prior Art and its Problems) Various devices have been developed and put into practical use for automatically mounting electronic components on printed circuit boards. However, these devices are designed for parts that are standardized in shape and whose dimensional accuracy is within a range suitable for automatic mounting, so they cannot be used reliably for parts with large dimensional variations, such as hybrid ICs. It has been considered extremely difficult to mount them on a substrate with high density.

As shown in FIG. 2, a hybrid IC has a large number of linearly arranged lead terminals 2, and a main body part 1-a constituting an electronic circuit is usually molded to be moisture-proof. For this reason, even though the lead terminals themselves have been standardized to a certain degree and the positional accuracy between the leads is ensured, the positional relationship between the external shape of the 9 main body and the lead terminals, for example l in Fig.
The IO value is.

Even ICs of the same type have considerable dimensional variation. Therefore, even if the body 9 can be gripped by some mechanism, the positional relationship between the gripping mechanism and the ICIJ-card is not guaranteed, and it is difficult to insert the main body into the board as it is. In order to avoid this, there is a method in which the lead itself is gripped by some mechanism to ensure the positional relationship between the gripping mechanism and the lead. However, this method requires a certain amount of space for the opening and closing operations of the nine gripping mechanisms at the stage of mounting the ICs on the board, which poses a problem in mounting the ICs on the board at a high density.

(Purpose) The present invention solves these conventional problems, and even in the case of electronic components such as hybrid ICs where the relative positional accuracy between the external shape of the main body and the lead terminals cannot be ensured, it is possible to
Moreover, it is an object of the present invention to provide a means for enabling high-density mounting on a printed circuit board.

(Example) The basic idea of the present invention for achieving the above object will be explained using FIGS. 3 to 6. FIG. 3 shows a hybrid ICI in which lead terminals are linearly arranged as an example of an electronic component.

The basic concept for automatically inserting the lead terminal 2 into the insertion hole 4 of the printed circuit board 3 will be shown.

(a) in FIG. 3 shows an IC in the parts supply cassette 6.
Although the cassette is shown in a state where it is stored, the format of this cassette itself is not directly related to the principle of the present invention. Next, one IC is separated from this cassette, and the lead terminal 2 of the ICI is clamped with a positioning clamper 35 as shown in FIG. 3(b). As for the structure of the clamper, for example, if the cross section of the lead is circular, a structure as shown in FIG. 4 can be considered, but other methods are also possible. In any .

However, the purpose of the clamper is to accurately position and secure the lead terminals. I clamped like this
For CI, as shown in FIG. 3(c).

The contact sensor 32 is brought into contact with the main body of the IC. For example, as shown in FIG. 4, the contact sensor includes a contactor 32 for measuring one end surface of the IC body, that is, a reference position
-a, and a contactor 32-b for detecting pressure on the IC body as necessary. This makes it possible to know the relative positional relationship between the position of the lead terminal on the reference side and the external position of the main body on the measuring contact side. Although measurement of such relative positional relationships is also possible using a thermal TV camera or other non-contact means, using a contact means as shown in Fig. 5 is difficult when actually holding the IC with a chuck mechanism. It has the advantage of being able to directly measure the same position.

After measuring the relationship between the IC lead position and the main body position on the reference side as described above.

Based on this positional relationship information, grip the ICI with the chuck mechanism 45 as shown in FIG. 3(d), insert the lead 2 into the insertion hole 4 of the board 3 as shown in FIG. 3(e), and then 6th
As shown in the figure, the required number of leads 2-b of the lead terminals 2 are clinched to fix the ICI to the board 3.

The basic principle of the present invention has been described above, and its contents will be further explained in detail with reference to Examples. FIG. 7 shows an example of the configuration of an automatic insertion device for hybrid ICs, etc. based on the principle of the present invention. In FIG. 7, 10 is a belt conveyor that transfers the target printed circuit board, and as shown by the white arrow, the board is supplied from 10-a to the insertion device, and after the insertion work is completed, it is conveyed by 2 and 10-b. Send to the next process. 2
0 is an IC supply unit, and is a cassette (cassette) 6-a loaded with various ICs.

6-b etc. are mounted, it moves in the vertical direction as shown by the arrow, and stops at a position where the required IC can be supplied. At this time, the one-component extrusion section 21 separates only one predetermined IC from the cassette. The separated IC is supplied to a component positioning recognition section 30 in which a component lead clamper 35 and a position measurement sensor 32 are arranged.
By the methods described in b) and (c), the relative positional relationship of the main body with respect to the lead is measured. Next, 40 is a parts transport section.

Movement base 42 in the direction of arrow y'. Combined with this θ
Rotation in the direction, movement mechanism 43 in the 7' direction. It is composed of a chuck mechanism 45 and the like arranged at its tip.

The chuck mechanism has a main finger 46-a for positioning (not shown) and a sub-finger 46-b for generating gripping force (not shown) as shown in FIG. 2(d). The main finger is moved relative to the moving mechanism 43 in accordance with the recognized result to grip the ICI. Thereafter, the 9-component transport unit 40 moves the IC onto the insertion hole of the board 3 positioned by the xy moving machine 4, and rotates the θ axis as necessary.

Lower the 2' shaft and insert the lead part of the ICI into the insertion hole 4. When the lead is inserted into the hole, the clinch mechanism 60 is activated to clinch a portion of the adhesive 2-b as shown in FIG. 6, thereby fixing the IC to the board.

The xy moving mechanism 50 supports such an insertion operation.

After the board is received from the belt conveyor 10-a in advance, the board is fixed using the positioning hole 5 of the board, and the board is moved to the position required for insertion.

After completing one or more IC insertions, the fixation of the board is released and the board is delivered to the conveyor 10-b.

As described above, in the transport section 40, the chuck mechanism 4
5 performs a correction movement with respect to the moving mechanism 43 corresponding to the relative position of the IC lead and the main body.

It is possible to respond with a constant sequential operation from component supply to completion of insertion.

Next, the component positioning recognition section 3o in the present invention will be explained in more detail with reference to the embodiment shown in FIG.

In Figure 1, 35-a is the fixed side of the clamper,
-b is a movable side and can move in the direction of arrow C.

Further, 36 is a lead button which moves in the direction of arrow p. As described above, the clamper 35 of FIG. 1 is structurally different from the clamper shown in FIG. 4, but has the same function, and is more suitable for clamping leads having a rectangular cross section. Further, 37 is a passage sensor composed of, for example, a photo sensor, which detects passage of the component main body to be supplied to the clamper. Furthermore, contact type sensors 32-a and 32-b detect the position of the end face of the component when they move in the directions of Sl and St, respectively, and come into contact with the nine component bodies. In many cases.

Only the reference side 32-a is sufficient for detecting the position of the end face of the component. On the other hand, since 32-b has an alternative function to the reed button 36, the reed button 36 may be deleted depending on the nine conditions. By the way, the setting position of the contact sensor 32 is the first
In the case of the figure, the entire clamper is moved in the direction indicated by the white arrow.

If a structure is adopted in which the edge detection sensor is lowered from above,
It is also possible to eliminate the need to move the clamper 36.

On the other hand, the operation of the positioning recognition unit shown in FIG. 1 is as shown in FIG. First, the interval between the clampers 350 is set to such a size that the lead of the component passes through and the nine component bodies do not fall, and component 1 is pushed out in the direction of arrow B by a pusher (not shown) as shown in (a). When the reference side end faces of the nine parts are confirmed by the passing sensor 37, the bushing stops its operation and retreats.

Next, as shown in (b), the lead bushing 36 moves forward.

Move the reference side lead to a predetermined reference position and stop. In this state, the clamper 35 closes to a sealed state, thereby clamping the component at an accurate position with respect to the lead. Further, as shown in (c), the contact sensors 32-a and 32-b move to a position where they come into contact with the component body. The contact sensor has a sensor that detects its moving position.
By examining the detection signal, it is possible to know the relative position of the end face of the component body with respect to the lead. By utilizing this relative position signal.

As shown in Figure 3, the correction operation explained in Figure 7 becomes possible and the nine components can be reliably mounted on the board.In this case, the finger positions are corrected in advance using the relative position detection signal to grip the components. Or if it is possible to correct the finger position after gripping the part. Rather than a contact type sensor.

As shown in FIG. 9, the relative position can also be detected by using an optical non-contact upper sensor 33.

The method of detecting the end surface position of the nine component bodies after clamping the component based on the lead position has been described above, but conversely, a method of detecting the lead position itself is also highly effective in some cases. For example, when a part is set on the clamper as shown in Fig. 10(a), after releasing the clamper to the extent that the part can be moved, the finger 4 is set as shown in Fig. 10(b).
6. Grip the part so that it is in the reference position. At this time, if there is a dispersion error between the lead and the end face of the component, the two components are moved in the horizontal direction of the drawing by the error amount and are gripped, and the lead is also moved by the same amount. Therefore, if a lead button having a position sensor, that is, a contact sensor 36 having the same function as the contact sensor 32 shown in FIG. You can know the relative position of Alternatively, as shown in FIG. 10(c), with a similar reed button 36 fixed at the reference position, the finger 4
If the tool 6 is moved in the direction of the arrow while gripping the component and stopped at the position where the lead and the bushing contact, it is clear that a state in which the amount of error has been corrected has already been obtained. Note that the fixing position of the bushing in this example is preferably changed depending on the shape of the part. Further, the embodiment shown in FIG. 10 uses a contact type sensor.

It goes without saying that optical or other non-contact sensors can also be used.

As mentioned above, the main purpose of the present invention is to
etc., in an automatic insertion device for parts that have large variations in the position of lead terminals and the main body onto a board.

Once the separated and supplied parts are in place.

By interposing a component positioning recognition section that simultaneously detects the relative positional relationship between the two component bodies and the lead terminal, the automatic insertion operation can be performed reliably and the operating speed of the entire device can be improved. Note that the concept of the present invention can also be applied to the case where component position correction with respect to the board at the time of insertion is performed by a method other than the embodiments shown in FIG. 3 or FIG. 7.

(Effects) As explained above, the electronic component automatic mounting device according to the present invention is capable of mounting electronic components such as hybrid ICs with large variations in external shape on a board at high density, and can insert 9 components. It is extremely effective in improving work efficiency (
・.

[Brief explanation of the drawing]

FIG. 1 is a block diagram of a component positioning recognition unit according to an embodiment of the present invention, FIGS. ) is an explanatory diagram showing the principle of the present invention, Figures 4, 5, and 6 are configuration diagrams showing an embodiment corresponding to each element in Figure 3, and Figure 7 is an electronic component automatic mounting device according to an embodiment of the present invention. Fig. 8 is an explanatory diagram of the operation of Fig. 1, and Figs. 9 and 10 are explanatory diagrams of the operation of another component positioning recognition unit according to the present invention. 1: Electronic component, 2: Main body, 3: Lead terminal. 10: Belt conveyor, 20: IC supply section, 30: Component positioning recognition section, 32: Contact type sensor, 35: Clamber, 36: Lead pusher, 37: Passing sensor, 40: Component transport section, 45: Chuck Mechanism, 50: xy movement mechanism,
60: Clinch mechanism.

Claims (1)

[Claims] In an electronic component automatic mounting device that grips an electronic component consisting of a main body part and lead terminals with a chuck part and mounts it on a printed circuit board, surfaces facing each other are flat and a row of lead terminals of the electronic component can pass through. , the lead terminal array of the electronic component separately supplied from the component supply section is clamped in a predetermined position and orientation using a clamper having a gap that prevents the electronic component main body from falling, and the electronic component main body and the lead terminal are separated from each other. An electronic component automatic mounting device characterized by comprising a component positioning recognition unit that detects the relative position of the electronic component.