JPH0322720B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an apparatus for transferring and mounting electronic components onto a printed circuit board.

Configuration of conventional example and its problems Printed circuit board 1 positioned as shown in Figure 1
Conventionally, when mounting the electronic component 2 on the electronic component 2, the position of the electronic component was regulated by applying force to the lead 3 of the electronic component 2 with regulating claws 4a, 4b, 4c, and 4d, as shown in FIG. .

At this time, the center 6 of the electronic component 2 is aligned with the center 5 of the mounting head that holds the electronic component 2 due to the mechanical looseness of the adjustment claws 4a, 4b, 4c, and 4d and the external dimensions of the electronic component 2. This made it difficult to implement high-density mounting of electronic components.

Furthermore, the accuracy of the external dimensions of the leads 3 of the electronic component 2 is poor, and accurate positioning has been difficult with the conventional method of regulating the position by biasing the lead with a regulating claw.

Further, the electronic component pattern 7 of the printed circuit board 1 has poor dimensional accuracy from the reference hole 8 for regulating the printed circuit board, and it is difficult to accurately position the electronic component 2 when mounting the electronic component 2 thereon.

Purpose of the Invention The present invention addresses the drawbacks of conventional electronic components, such as misalignment of the electronic component pattern on the printed circuit board and misalignment of the electronic components held in the mounting head, which makes it difficult to accurately position and mount electronic components on the printed circuit board. An object of the present invention is to provide an electronic component mounting apparatus that eliminates problems and mounts electronic components accurately and with high density.

Structure of the Invention The present invention provides a first method for recognizing an electronic component held in a mounting head and obtaining data regarding the position of the electronic component with respect to the mounting head and the rotation angle in a horizontal plane.
a second recognition unit held in the apparatus head that recognizes the pattern of the mounted component on the positioned printed circuit board and obtains data regarding its position and rotation angle in a horizontal plane; and the mounting head. and a drive unit that relatively moves and rotates the printed circuit board, and is configured to drive the drive unit based on data obtained by the first and second recognition units, and is configured to drive the drive unit based on data obtained by the first and second recognition units, This makes it possible to mount electronic components accurately and with high density without being affected by the dimensional accuracy of the components, mechanical looseness of the regulating jig, or misalignment of the electronic component pattern on the printed circuit board.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 3 is a plan view of the entire apparatus in the embodiment of FIG. 1, and FIG. 4 is a front view of the same, and the outline will be explained in the order of steps. Reference numeral 9 denotes a transport device that transports, positions and holds the printed circuit board 1. 1
0 is a component supply section, which supplies electronic components 2 housed in a tray 11 to a mounting head 12.

FIG. 5 shows a process in which the device head 12 mounts the electronic component 2 on the printed circuit board 1. Fifth
As shown in FIG. 5A, the mounting head 12 holds the electronic component 2 housed in the tray 11, and moves to above the component recognition device 13 as shown in FIG. 5B. At this time, since the relative positional relationship between the mounting head 12 and the component mounting device 13 is known in advance, by recognizing the electronic component 2, the direction of the electronic component 2 and the center of the electronic component 2 and the center of the mounting head 12 can be determined. It is possible to obtain data such as the position error of Next, as shown in FIG. 5c, the pattern recognition device 14 fixed to the mounting head 12 recognizes the pattern 7 of the electronic component on the printed circuit board 1, thereby determining the exact position and direction of the pattern 7 of the electronic component. The second data can be obtained. As shown in FIG. 5d, the mounting head 12 moves in the direction to correct the positional and directional deviation based on the data 1 and 2.
The electronic component 2 is rotated and mounted on the printed circuit board 1 so that there is no misalignment between the electronic component 2 and the pattern 7 of the electronic component. The printed circuit board 1 with the electronic components 2 mounted thereon is transported to the next process by the transport device 9.

Next, details of the apparatus will be explained in order of steps.

FIG. 6 shows the process of supplying the electronic component 2 to the mounting head 12. Trays 11 containing electronic components 2 are stacked in a component supply section 10. Slide shaft 16 by swing lever 15
A pusher 17 moving horizontally along the tray pushes out the lowermost tray 11 and supplies the electronic component 2 to the mounting head 12.

FIG. 7a is a plan view of an apparatus for mounting the electronic component 2 on the printed circuit board 1, and FIG. 7b is a side view. This device transports and transports the printed circuit board 1.
A slide shaft 18 and a drive shaft 19 movable in a direction parallel to the transport device 9 for positioning and holding, and a slide shaft 20 movable in a direction perpendicular to the transport device 9
It has an xy table 22 composed of a drive unit 21 and a drive unit 21, and can be moved arbitrarily in a horizontal plane. The mounting head 12 attached to the xy table 22 is rotatable around a vertical axis and movable in the vertical direction by a drive unit 23, takes out the electronic component 2 from the tray 11, holds it, and places it on the printed circuit board 1. Implement. Furthermore, a pattern recognition device 14 is attached to the head portion.

FIG. 8a is a sectional view of the drive section 23 of the mounting head 12, and FIG. 8b is a front view. In FIG. 8a, the mounting head 12 is driven in the vertical direction by a piston 25 driven by an actuator 24 swinging a lever 26 that swings about a single point. In FIG. 8b, a pulley 28 fixed to a motor 27 drives a pulley 29 via a belt 29. In FIG. A speed reducer 30 is fixed coaxially with the pulley 29, and the speed reducer 31 drives a gear 32.
The gear 32 is a gear 33 fixed to the mounting head 12.
They are looking shy. As described above, the mounting head 12 becomes rotatable around the vertical axis. Further, the mounting head 12 is hollow, and by vacuum suctioning the upper end, the electronic component 2 is suctioned and held at the lower end.

FIG. 9 shows that the component recognition device 13 is connected to the mounting head 1.
2 shows the process of recognizing the position of the electronic component 2 held by the electronic component 2 and the rotation angle in the horizontal plane. The component recognition device 13 recognizes the position of the lead 3 within the fields of view 34 and 35, thereby determining the deviation between the center 5 of the mounting head 2 and the center 6 of the electronic component 2 and the rotation angle of the reference lines in the horizontal plane. Find 36. FIG. 10 is a diagram showing the inside of the field of view 34 in detail, and 37a, b, and c are the leads of the electronic component 2. The component recognition device 13 detects the tips 38a and 38 of the lead 37b located second from the corner.
b, and calculate the position of its center point 39b,
Let the center 6 of the electronic component 2 be the first reference point. Similarly, the second reference point is recognized and calculated in the field of view 35, and the average value of the coordinates with the first reference point is determined as the center 6 of the electronic component 2. At the same time, the rotation angle 36 of the entire centerline of the electronic component 2 in the horizontal plane can be determined. Furthermore, the first
Center point 39 of leads 37a and 37c in Figure 0
a and 39b are calculated in the same way, and the pitch between them is determined. If the value is outside the specified range, it is determined that the lead is defective, and the mounting head 12 discards the defective electronic component and installs a new electronic component 2. Hold and repeat these steps.

FIG. 11 shows a process in which the pattern recognition device 14 recognizes the position of the electronic component pattern 7 on the printed circuit board 1 and the rotation angle in the horizontal plane. The printed circuit board 1 has IC marks 40a and 40b formed at the same time as the electronic component pattern 7, and the pattern recognition device 14 recognizes the positions of these marks and determines the center point of the electronic component pattern using the two center points. shall be. Also IC mark 40a, 40b
From the position, the rotation angle of the center line of the electronic component pattern 7 in the horizontal plane is determined.

Based on the position and rotation angle data No. 1 of the electronic component 2 and the position and rotation angle data No. 2 of the electronic component pattern 7 obtained as described above, the electronic component 2
The mounting head 12 moves and rotates so that the electronic component pattern 7 is not misaligned, and the electronic component 2 is mounted on the printed circuit board 1 with high precision and high density.

FIG. 12 is a plan view of the entire device in the second embodiment, and FIG. 13 is a front view of the entire device. Reference numeral 9 denotes a transport device that transports, positions and holds the printed circuit board. Reference numeral 41 denotes a component supply unit, which supplies the taped electronic components 2 to the mounting head 1.
Supply to 2. 13 is an electronic component recognition device, 14 is an electronic component pattern recognition device, and 22 is an xy table.

In this embodiment, the equipment and steps other than the parts supply section 41 are the same as in the first embodiment, so only the differences will be explained.

Figure 14 shows taped electronic components, Figure 15
The figure is a detailed view of the parts supply section.

In FIG. 14, 2 is an electronic component, 42 is a tape mount, and 43 is an adhesive tape, and the electronic component 2 is attached to the mount 42 with the adhesive tape 43. In Fig. 15, 44 is a mount reel, 45
4 is an adhesive tape take-up reel, 46 is a parts cassette, and 47 is a ratchet. The mount 42 is wound up on a mount reel 44, and the leading end is supplied to a parts cassette 46. The adhesive tape 43 passes through the parts cassette 46 and is attached to the motor 4.
8 and is wound onto a take-up reel 45 driven by 8. The mounting paper 42 in the parts cassette 46 is fed one pitch at a time by a ratchet 47 to supply the electronic components 2 to the mounting head 12.

Effects of the Invention As described above, the present invention recognizes the pattern compatibility between the electronic component and the printed circuit board, corrects the position, and mounts the electronic component on the printed circuit board, making it possible to mount electronic components with high precision and high mounting density. There is.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of electronic component mounting, FIG. 2 is a process diagram of conventional electronic component regulation, FIG. 3 is a plan view of a mounting apparatus according to the first embodiment of the present invention, and FIG. 4 is a front view of the same. Figures 5a, b, c, and d are process diagrams of electronic component mounting, Figure 6 is a perspective view of the electronic component supply section, Figures 7a and b are plan views and front views of the xy table, and Figure 8
Figures a and b are cross-sectional views and front views of the mounting head;
10 is a detailed diagram of electronic component recognition. FIG. 11 is a process diagram of component pattern recognition. FIG. 13 is a front view of the same, FIG. 14 is a perspective view of taped electronic components, and FIG. 15 is a perspective view of the component supply section. 1...Printed circuit board, 2...Electronic components, 3...
Lead, 7...Electronic component pattern, 9...Transport device, 10...Component supply section, 12...Mounting head,
13...Electronic component recognition device, 14...Electronic component pattern recognition device, 22...xy table, 41...
...Parts supply department.

Claims (1)

[Scope of Claims] 1. In an apparatus for sucking electronic components supplied from a component supply unit by a mounting head and mounting them on a positioned printed circuit board, the electronic components held by the mounting head are recognized and the electronic components are mounted. a first recognition unit that obtains data regarding the position of the electronic component with respect to the head and the rotation angle in the horizontal plane; and a first recognition unit that recognizes the pattern of the mounted component on the positioned printed circuit board and acquires data regarding the position and rotation angle in the horizontal plane. a second recognition unit held in the device head, and a drive unit that relatively moves and rotates the mounting head and the printed circuit board; An electronic component mounting apparatus with recognition configured to drive the drive unit based on data obtained by the recognition.