JPH0964069A - Apparatus and method for mounting chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting a chip capable of accurately mounting the chip at a high speed on the electrodes of the edges of a plurality of sizes of a display panel. SOLUTION: A display panel 1 is held at a holder 28. A roughly rotating motor 32 for largely rotating the holder 28 at the axial line as a center at a high speed, a belt 34 and a large pulley are provided. A motor 42 for horizontally oscillating an oscillating member 31 is provided. The member 31 is integral with the holder 28. When the motor 42 is driven, the holder 28 is accurately rotated at an infinitesimal angle. The panel 1 is mounted at the holder 28, and chips are bonded to the edges of the three sides, and the correction of the θ direction of the electrodes of the panel 1 and the other leads of the chip is conducted by precisely rotating the holder 28 by driving the motor 42. When the panel 1 is rotated at 90 deg. to alter the direction, the holder 28 is rotated at a high speed by the motor 32.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip mounting apparatus and a chip mounting method for bonding a chip onto an electrode at an edge of a substrate such as a circuit board or a display panel.

[0002]

2. Description of the Related Art A display panel used as a display for electronic equipment is assembled by bonding two transparent plates and bonding the outer leads of a chip, which is the driver, onto electrodes provided on the edges of the transparent plates. The electrodes of the display panel and the outer leads of the chip are formed with an extremely fine and narrow pitch, and therefore high bonding accuracy is required. Further, a display panel is generally one in which a large number of chips are bonded to the edges of its three sides, and therefore a high bonding speed is also required.

[0003]

As described above, the bonding of the chip to the display panel requires high precision and high speed, but the technology for satisfying these two requirements has not been established yet. The reality was that the productivity of panel assembly did not rise.

Therefore, it is an object of the present invention to provide a chip mounting apparatus and mounting method capable of bonding a chip onto electrodes on edges of a plurality of sides of a display panel with high accuracy and high speed.

[0005]

To this end, the present invention provides a chip mounting apparatus having a table portion for positioning a substrate and a mounting portion for mounting a chip on the edge portion of the substrate positioned on the table portion. In the table, the table section includes a linear movement table section that linearly moves the substrate in the horizontal direction, and a rotary table section that horizontally rotates the substrate on the linear movement table section. However, by holding a holding part for holding the substrate, a rough rotating means for rotating the holding part at a large angle about its axis, and a swinging member integrated with the rough rotating means in a horizontal direction. It comprises a precision rotating means for rotating the holding portion by a minute angle.

Further, the substrate is positioned on the holding portion, and the chip held by the mounting head is positioned in the vicinity of the electrode formed on the edge of one side of the substrate, and the chip is observed by a camera in this state to Detecting relative displacement in the X, Y, and θ directions, and correcting the displacement in the X and Y directions by driving the X table and the Y table on which the substrate is placed. , A step of correcting the positional deviation in the θ direction by rocking a rocking member integrated with the rough rotation means, and a plurality of chips are mounted on the edge of one side of the substrate by repeating the above-mentioned steps. Then, the substrate is rotated 90 ° or 1 by rough rotation means.
After a horizontal rotation of 80 ° to change its orientation, a chip mounting method was constituted by a step of mounting a chip on the edge portion of the other side of the substrate by the same procedure as the above steps.

[0007]

In the above structure, when the positional correction of the substrate and the chip in the rotational direction is performed, the precision rotation means is driven to rotate the substrate with a fine angle precision. Also, the bonding of the chip to one side of the substrate is completed, and 90 ° or 18
When horizontally rotating at a large angle of 0 ° and shifting to the bonding of the chip to the other side, the rough rotating means is driven to rotate the substrate at a large angle at a high speed.

[0008]

Embodiments of the present invention will now be described with reference to the drawings. 1 is a perspective view of a chip mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of the table portion, FIG. 3 is a plan view of the table portion, FIG. 4 is a sectional view of the table portion, and FIG. Is a block diagram of the drive system, and FIGS. 6, 7, and 8 are flowcharts of the same operation.

In FIG. 1, reference numeral 1 is a display panel, and outer leads of a chip are bonded on electrodes 2 formed on the edges of three sides thereof with a narrow pitch, as will be described later. A base 3 has a table portion 4 installed at the center of the upper surface thereof, and the display panel 1 is placed on the table portion 4. As shown in FIG. 2, the display panel 1 is assembled by laminating two transparent plates 1a and 1b, and an anisotropic conductive tape (hereinafter,
ACF) 9 is attached. The ACF 9 is for bonding the outer lead of the chip to the electrode 2, and a description of the method of attaching the same is omitted.

In FIG. 1, a column 5 is erected on one side of the upper surface of the base 3, and a horizontal moving shaft 6 is provided on the column 5.
Has been erected. A first arm 7 and a second arm 8 are held on the moving shaft portion 6 so as to be movable in the longitudinal direction. The first arm 7 and the second arm 8 are means for transporting the display panel 1, and the first arm 7 is the display panel 1.
Are loaded onto the table unit 4. Further, the second arm 8 carries out the display panel 1 on which the chip bonding is completed from the table portion 4 toward the next step.

A gate-shaped frame 1 is provided on the other side of the upper surface of the base 3.
1 is erected. A mounting head portion 12 is attached to the center of the upper portion of the frame 11. Mounting head part 12
The head has a plurality of heads 13 mounted on its lower surface. Each head 13 has a nozzle 13a. A tray type chip supply unit 14 is installed behind the mounting head unit 12. The mounting head unit 12 is rotated by pitch about the vertical axis to position any one of the heads 13 on the tip of the chip supply unit 14, and the chip 10 provided in the chip supply unit 14 is mounted on the nozzle 13a. The lower end of the display panel 1 is vacuum-adsorbed, picked up, and transferred and mounted on the electrode 2 of the display panel 1.

Next, referring to FIGS. 2 to 4, the table portion 4
The structure of will be described in detail. 20 is an X table, and X
It is driven by the motor 21. A Y table 22 is mounted on the X table 20, and is driven by a Y motor 23. When the X table 20 is driven, the display panel 1 is linearly moved horizontally in the X direction, and when the Y table 22 is driven, Y is moved.
Drive linearly in the direction. That is, the X table 20 and the Y table 22 are a linear movement table unit.

A base plate 24 is provided on the Y table 22. A base plate 25 having an L-shaped cross section is provided on the base plate 24.
Is provided. As shown in FIG. 4, a tube body 26 is erected on the upper surface of the tip portion of the base plate 25. A rotary shaft 27 is arranged inside the tubular body 26, and a holding portion 28 is provided at an upper end portion of the rotary shaft 27. The hole 29 formed in the center of the holding portion 28 passes through the center of the rotary shaft 27 and communicates with the pipe 30 arranged below the base plate 25.
The pipe 30 is connected to a suction system (not shown). Therefore, when the suction system operates, the display panel 1 placed on the holding unit 28 is vacuum-adsorbed and fixed to the holding unit 28.

In FIGS. 2 and 4, a plate-shaped swing member 31 is rotatably mounted on the upper portion of the tube body 26 via a bearing 26a. A motor 32 for rough rotation is attached to the center of the lower surface of the rocking member 31. The rotation of the motor 32 for rough rotation is performed by the small pulley 33, the belt 34,
It is decelerated and transmitted to the large pulley 35. The large pulley 35 is attached to the rotary shaft 27, and therefore, when the motor 32 for rough rotation is driven, the display panel 1 on the holding portion 28 rotates horizontally. The motor 32 for rough rotation rotates the display panel 1 at a large angle of 90 ° or 180 ° at a high speed. That is, the motor 32 for rough rotation and the small pulley 3
3, the belt 34, and the large pulley 35 constitute rough rotation means. In FIG. 4, reference numeral 36 denotes an encoder mounted on the rotary shaft 33a of the rough rotation motor 32 for rough rotation, and 37
Is a detector that detects the rotation amount of the motor 32 for rough rotation.

2 to 4, a case 40 is provided on the base plate 25. An X-direction feed screw 41 is housed in the case 40. The feed screw 41 is driven by a motor 42 to rotate. A nut 43 is screwed onto the feed screw 41. A slider 44 is coupled to the upper portion of the nut 43. An engaging body 45 provided on the lower surface of the tip end of the swinging member 31 is engaged with the slider 44. The upper end of the engagement body 45 is rotatably connected to the swing member 31 via a bearing 45a. Therefore, when the motor 43 drives and the feed screw 41 rotates, the nut 43 slides along the feed screw 41. Then, the engagement body 45 is pulled by the slider 44 and moves in the X direction, whereby the swinging member 31 horizontally rotates about the rotation shaft 27 in the arrow N direction (FIG. 3). Then, the rotating shaft 27 and the holding unit 28 horizontally rotate about their axes.

Here, by making the length of the swinging member 31 in the Y direction, that is, the distance between the rotary shaft 27 and the feed screw 41 longer, as compared with the amount of movement of the nut 43 along the feed screw 41, The rotary shaft 27 and the holding portion 28 can be precisely rotated by a minute angle. That is, the swinging member 31, the feed screw 41, the motor 42, the nut 43, and the like are precision rotating means for rotating the holding portion 28 with a minute angle precision.
In FIG. 4, the rough rotation means such as the rough rotation motor 32 is held on the lower surface of the swing member 31, and
When the rocking member 31 rocks due to the driving of the motor 3, the rough rotation motor 32 rocks integrally with the rocking member 31.

Next, with reference to FIG. 4, a mechanism for causing the holding portion 28 to move up and down will be described. Rails 51 are provided on the base plate 24. A wedge-shaped moving element 52 is provided on the rail 51, and a slider 53 mounted on the lower surface of the wedge-shaped moving element 52 is fitted to the rail 51. A wedge-shaped block 54 is provided on the lower surface of the base plate 25, and a rail 56 mounted on the upper surface of the mover 52 is fitted to a slider 55 mounted on the lower surface thereof. A rod 58 of a cylinder 57 is connected to the mover 52. A vertical rail 59 is provided on the side of the base plate 25,
A slider 60 is fitted on the rail 59. 38 is a pedestal to which the slider 60 is fixed. The rail 59 and the slider 60 guide the vertical movement of the base plate 25. Therefore, when the rod 58 of the cylinder 57 projects, the mover 52 advances to the left and the base plate 25 is pushed up. When the rod 58 of the cylinder 57 moves backward to the right, the base plate 2
5 descends. As a result, the elements such as the holding portion 28 provided on the base plate 25 move up and down.

In FIG. 1, a gate-shaped lower support 61 is provided on the upper surface of the base 3. As shown in FIG. 4, the lower support 61 is a transparent plate 1 to which the chip 10 is bonded.
The edge of a is supported from below. A lens barrel 62 is provided immediately below the lower receiver 61. A camera 63 is provided at the end of the lens barrel 62. When the head 13 transfers the chip 10 onto the edge of the display panel 1, the camera 63 observes the outer lead 10a of the chip 10 and the electrode 2 of the display panel 1 through the transparent portion 61a of the lower receiver 61, Relative positional deviations in the X, Y, and θ directions are detected. In FIG. 4, the ACF 9 attached on the electrode 2 of the display panel 1 is omitted.

In FIG. 5, each of the above-mentioned parts is a drive circuit 7.
Connected to 0. The drive circuit 70 includes a CPU and RO
It is connected to a control unit 71 having elements such as M and RAM. The camera 63 is also connected to the control unit 71 via the image recognition circuit 72.

The mounting device of this chip has the above-mentioned structure. Next, the entire operation will be described with reference to the flow charts of FIGS. First, the display panel 1 is held by the holding portion 28 with the first side of the display panel 1 facing the mounting head portion 12 side (step 1). Next, the first side is moved above the lower support 61 and then lowered to land the edge portion of the display panel 1 on the lower support 61 as shown in FIG. 4 (step 2). Next, the head 13 temporarily positions the chip 10 picked up and held from the chip supply unit 14 at the chip mounting position on the first side (step 3).

Next, the camera 10 observes the chip 10 and the chip mounting position, and detects the relative positional deviation between the outer lead 10a of the chip 10 and the electrode 2 of the display panel 1 in the XYθ directions (steps 4 and 5). Next, in step 6, the X motor 21 and the Y motor 23 are driven to move the display panel 1 in the X direction and the Y direction to correct the positional deviation between the X direction and the Y direction, and to drive the motor 42. By oscillating the oscillating member 31, the positional deviation in the θ direction is corrected. The correction in the θ direction is precisely performed by driving the above-described precision rotating means.

Next, the head 13 is lowered and the chip 10 is
Is mounted on the display panel 1 (step 7). in this case,
By correcting the positional deviations in the X direction, the Y direction, and the θ direction as described above, the outer lead 10a is accurately aligned with the electrode 2. A thermocompression bonding element (not shown) is pressed against the aligned outer leads 10a, and the outer leads 10a are bonded to the electrodes 2. Thereafter, the chips 10 are sequentially mounted on the first side by repeating the same procedure as steps 3 to 7 (step 8).

When the mounting of the chip 10 on the first side of the display panel 1 is completed as described above, the display panel 1 is lifted and separated from the lower support 61, and then the motor 32 for rough rotation is driven. Then, the display panel 1 is horizontally rotated by 90 ° to position the second side above the lower support 61 (step 9). Next, in step 10, the display panel 1 is lowered to land on the lower support 61, and the chip 10 is mounted on the display panel 1 in the same procedure as in steps 3 to 8 (step 11).

Thereafter, by repeating the same operations as described above in steps 12 to 15, the chips 10 are mounted on the three sides of the display panel 1. When all loading is finished,
The display panel 1 is transferred to the second arm 8 and the display panel 1 is carried out to the next step.

[0025]

According to the present invention, the outer lead of the chip and the electrode of the substrate can be corrected in the θ direction with high precision by driving the precision rotation means. Further, by driving the rough rotation means, the substrate can be rotated at a large angle and at a high speed to change its direction, and the side on which the chip is mounted can be quickly directed to the mounting head side. Therefore, according to the present invention, mounting of a chip with high accuracy and high speed can be realized.

[Brief description of drawings]

FIG. 1 is a perspective view of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a table portion of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a plan view of a table portion of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 4 is a sectional view of a table portion of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 5 is a block diagram of a drive system of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 6 is a flowchart of the operation of the chip mounting apparatus according to the embodiment of the present invention.

FIG. 7 is a flowchart of the operation of the chip mounting apparatus according to the embodiment of the present invention.

FIG. 8 is a flowchart of the operation of the chip mounting apparatus according to the embodiment of the present invention.

[Explanation of symbols]

 1 display panel 2 electrode 4 table part 10 chip 10a outer lead 12 mounting head part 14 chip supply part 20 X table 22 Y table 28 holding part 31 rocking member 32 motor for rough rotation 41 feed screw 42 motor 43 nut

Claims (3)

[Claims] 1. A chip mounting apparatus comprising: a table portion for positioning a substrate; and a mounting portion for mounting a chip on an edge of the substrate positioned on the table portion, wherein the table portion is the substrate. A linear movement table section for linearly moving the substrate in a horizontal direction, and a rotary table section for horizontally rotating the substrate on the linear movement table section, wherein the rotary table section holds the substrate. When,
Rough rotation means for rotating the holding portion at a large angle about its axis, and precision rotation means for rotating the holding portion by a small angle by horizontally swinging a swinging member integrated with the rough rotation means. A chip mounting device comprising: 2. The chip mounting apparatus according to claim 1, wherein the rough rotation means is held by the swing member and swings integrally with the swing member. 3. A substrate is positioned on a holding portion, and a chip held by a mounting head is positioned in the vicinity of an electrode formed on the edge of one side of the substrate, and the chip is observed by a camera in that state. The step of detecting the relative positional deviations in the X direction, the Y direction, and the θ direction, and the positional deviations in the X direction and the Y direction are corrected by driving the X table and the Y table on which the substrate is placed. At the same time, the step of correcting the positional deviation in the θ direction by swinging the swinging member integrated with the rough rotation means, and the above steps are repeated to mount a plurality of chips on the edge of one side of the substrate. After that, the substrate is horizontally rotated by 90 ° or 180 ° by the rough rotation means to change its orientation, and then a chip is mounted on the edge portion of the other side of the substrate by the same procedure as each of the above steps. To include Characteristic chip mounting method.