CN112908894A - Component laminating method and system and laminating equipment - Google Patents
Component laminating method and system and laminating equipment Download PDFInfo
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- CN112908894A CN112908894A CN202110074582.8A CN202110074582A CN112908894A CN 112908894 A CN112908894 A CN 112908894A CN 202110074582 A CN202110074582 A CN 202110074582A CN 112908894 A CN112908894 A CN 112908894A
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- 238000010030 laminating Methods 0.000 title claims abstract description 136
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 238000001514 detection method Methods 0.000 claims abstract description 17
- 230000007246 mechanism Effects 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 13
- 238000004364 calculation method Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 abstract description 18
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000006872 improvement Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
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- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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Abstract
The invention provides a component laminating method, a component laminating system and laminating equipment, wherein the component laminating method comprises the following steps: step 1: controlling the pasting head to suck the component; step 2: controlling the pasting head to move towards the pasting table, and controlling the detection camera to take a snapshot of the moving pasting head and the component to obtain a component deviation angle and a component center point XY deviation distance; and step 3: controlling the pasting head to move above the pasting table, and controlling the pasting table to rotate according to the obtained deviation angle of the component, so as to perform angle compensation on the pasting position of the component; controlling the bonding table to move in XY directions according to the XY deviation distance of the center point of the component, so as to compensate the bonding position of the component in XY directions; then, the bonding head bonds the component to the substrate on the bonding stage. The invention has the beneficial effects that: the invention solves the industrial difficulty that the bonding equipment (particularly the swing arm die bonder) can not align the components (such as wafers) at the bonding end.
Description
Technical Field
The invention relates to the technical field of chip/component bonding, in particular to a component bonding method, a component bonding system and bonding equipment.
Background
Along with the progress of science and technology, the sizes of chips and components are smaller and smaller, and the requirements on the bonding precision of the chips and the components are higher and higher, while the traditional bonding equipment (for example, a swing arm die bonder) can only carry out initial positioning at a material taking end and a bonding end by using machine vision, and a certain probability exists in the material taking and swing arm process to cause the position deviation of a wafer and a suction nozzle, so that the integral yield cannot achieve an ideal effect.
As shown in figure 1, in the swing arm die bonder in the market at present, cameras are basically placed on a wafer ring and a die bonding table, initial positioning is carried out before the swing arm moves through machine vision, then a positioning wafer is moved to the position of a suction nozzle through motion of an XY motion platform, and the swing arm rotates to a bonding position of the die bonding table after the swing arm takes materials and the die bonding table moves through the vision positioning and the XY motion platform for bonding.
The disadvantages are as follows: the method has the advantages that the crystal taking is not correct with a certain probability in the material taking process, and the wafer is deviated with a certain probability in the swing arm process, so that the attachment is not correct, and the yield is not ideal.
Disclosure of Invention
The invention provides a component laminating method, which comprises the following steps:
step 1: controlling the laminating head to move above the component supply table to enable the laminating head to absorb the components;
step 2: controlling the bonding head to move towards the bonding table, controlling the detection camera to capture pictures of the moving bonding head and the component, and obtaining a component deviation angle and a component center point XY deviation distance after algorithm processing;
and step 3: controlling the pasting head to move above the pasting table, and controlling the pasting table to rotate according to the obtained deviation angle of the component, so as to perform angle compensation on the pasting position of the component; controlling the bonding table to move in XY directions according to the XY deviation distance of the center point of the component, so as to compensate the bonding position of the component in XY directions; then, the bonding head bonds the component to the substrate on the bonding stage.
As a further improvement of the present invention, the component mounting method further includes a scanning calculation step, where the scanning calculation step: controlling the laminating table to move to the position below the laser range finder, scanning the substrate on the laminating table through the laser range finder, and calculating the relative height deviation value of each point of the substrate after obtaining scanning data;
in the step 3, the bonding stage is controlled to move to a position below the bonding position camera, and during bonding, the obtained relative height deviation value of each point of the substrate is compensated to the Z-axis motion coordinate of the bonding head when the bonding head moves to the corresponding point of the substrate (the corresponding point of the substrate refers to the XY coordinate of the point on the substrate), so that the Z-axis descending height of the bonding head at each time is equal to the actual height of the bonding point.
The invention also discloses a component laminating system, which comprises:
a material taking module: the device is used for controlling the pasting head to move above the component supply table so that the pasting head absorbs the components;
a position calculation module: the device is used for controlling the pasting head to move towards the pasting table, controlling the detection camera to shoot photos of the pasting head and the component in motion, and obtaining a component deviation angle and a component center point XY deviation distance after algorithm processing;
compensation and laminating module: the device is used for controlling the pasting head to move above the pasting table and controlling the pasting table to rotate according to the obtained deviation angle of the component, so that the angle compensation is carried out on the pasting position of the component; controlling the bonding table to move in XY directions according to the XY deviation distance of the center point of the component, so as to compensate the bonding position of the component in XY directions; then, the bonding head is controlled to bond the component to the substrate on the bonding stage.
As a further improvement of the invention, the component bonding system further comprises a scanning calculation module, wherein the scanning calculation module is used for controlling the bonding table to move to the position below the laser range finder, scanning the substrate on the bonding table through the laser range finder, and calculating the relative height deviation value of each point of the substrate after scanning data is obtained;
in the compensation and bonding module, the bonding platform is controlled to move to the position below the bonding position camera, and during bonding, the obtained relative height deviation value of each point of the substrate is compensated to the Z-axis motion coordinate of the bonding head when the bonding head moves to the corresponding point of the substrate each time (the corresponding point of the substrate refers to the XY coordinate of the point on the substrate), so that the descending height of the Z axis of the bonding head at each time is equal to the actual height of the bonding point.
The invention also discloses laminating equipment which comprises a component supply table, a laminating table, a detection camera, a laminating head and a laminating head driving mechanism for driving the laminating head to move, wherein the laminating head is provided with a suction nozzle, the component supply table is used for placing components, the laminating table is used for placing a substrate, and the laminating head driving mechanism is used for driving the laminating head to convey the components on the component supply table to the substrate of the laminating table for laminating; the detection camera is used for capturing photos of the components in the process that the bonding head conveys the components, and obtaining component deviation angles and component center points XY deviation distances after algorithm processing; the laminating equipment also comprises a laminating table driving mechanism for driving the laminating table to move, and the laminating table driving mechanism drives the laminating table to rotate according to the obtained deviation angle of the component, so that the angle compensation is carried out on the laminating position of the component; and driving the laminating table to move in XY directions by the laminating table driving mechanism according to the XY deviation distance of the central point of the component, so as to compensate the laminating position of the component in XY directions.
As a further improvement of the present invention, the bonding table driving mechanism includes a rotating motor and a first XY moving platform, the rotating motor is used for driving the bonding table to rotate, and the first XY moving platform is used for driving the bonding table to move in XY directions; the laminating equipment further comprises a laminating position camera, and the laminating position camera is located above the laminating table.
As a further improvement of the present invention, the bonding head driving mechanism includes a swing arm, and the bonding head is mounted on the swing arm and is moved between the component supply stage and the bonding stage by movement of the swing arm.
As a further improvement of the invention, the laminating device further comprises a material taking position camera, wherein the material taking position camera is positioned above the component supply table; the laminating equipment further comprises a second XY motion platform, and the second XY motion platform is used for driving the component supply table to move in XY directions.
As a further improvement of the present invention, the bonding apparatus further includes a laser range finder, the bonding stage driving mechanism is configured to drive the bonding stage to perform position switching between the laser range finder and the bonding stage camera (mainly used for walking the bonding stage, that is, to drive the bonding stage to move to the laser range finder to detect whether the substrate is flat or not, and to drive the bonding stage to move to the bonding stage camera position for chip bonding), the laser range finder is configured to scan the substrate on the bonding stage, to calculate a relative height deviation value of each point of the substrate after obtaining scan data, the bonding head driving mechanism drives the bonding head to convey a component onto the substrate of the bonding stage for bonding, and during bonding, the obtained relative height deviation value of each point of the substrate is compensated to a Z-axis motion coordinate of the bonding head each time the bonding head moves to a corresponding point of the substrate (the corresponding point of the substrate refers to an XY coordinate of the point on the substrate), so that the Z-axis descending height of the attaching head is equal to the actual height of the attaching point each time.
As a further improvement of the present invention, the bonding apparatus is a die bonder, the component is a wafer, the component supply stage is a wafer ring, and the bonding stage is a die bonding stage.
The invention has the beneficial effects that: the invention can capture the moving bonding head and the components by the detection camera, not only can not influence the efficiency to the maximum extent, but also can improve the yield, and solves the industrial difficulty that the bonding equipment (especially a swing arm die bonder) can not swing the components (such as wafers) at the bonding end.
Drawings
FIG. 1 is a schematic diagram of a die bonding method of a swing arm die bonder in the background art;
FIG. 2 is a functional block diagram of the laminating apparatus of the present invention;
FIG. 3 is a functional block diagram of an embodiment of the present invention;
fig. 4 is a schematic block diagram of another embodiment of the present invention.
Detailed Description
As shown in fig. 2, the present invention discloses a bonding apparatus, and the device of the present invention includes an existing chip and a device.
The laminating equipment comprises a component supply table, a laminating table, a detection camera, a laminating head and a laminating head driving mechanism for driving the laminating head to move, wherein the laminating head is provided with a suction nozzle, the component supply table is used for placing components, the laminating table is used for placing a substrate (such as a PCB), and the laminating head driving mechanism is used for driving the laminating head to convey the components on the component supply table to the substrate of the laminating table for laminating; the detection camera is used for capturing photos of the components in the process that the bonding head conveys the components, and obtaining component deviation angles and component center points XY deviation distances after algorithm processing; the laminating equipment also comprises a laminating table driving mechanism for driving the laminating table to move, and the laminating table driving mechanism drives the laminating table to rotate according to the obtained deviation angle of the component, so that the angle compensation is carried out on the laminating position of the component; and driving the laminating table to move in XY directions by the laminating table driving mechanism according to the XY deviation distance of the central point of the component, so as to compensate the laminating position of the component in XY directions.
The laminating platform driving mechanism comprises a rotating motor and a first XY moving platform, the rotating motor is used for driving the laminating platform to rotate, and the first XY moving platform is used for driving the laminating platform to move in XY directions.
The laminating equipment further comprises a laminating position camera, and the laminating position camera is located above the laminating table.
The laminating head driving mechanism comprises a swing arm, the laminating head is installed on the swing arm, the laminating head moves between the component supply table and the laminating table through the movement of the swing arm, and meanwhile the swing arm can also move in a Z axis, namely, the swing arm can move vertically, so that the laminating action is completed.
This laminating equipment still gets the material level camera including, get the material level camera and be located component supply platform top.
The laminating equipment further comprises a second XY motion platform, and the second XY motion platform is used for driving the component supply table to move in XY directions.
As shown in fig. 3, the bonding apparatus is a die bonder, the component is a wafer, the component supply table is a wafer ring, and the bonding table is a die bonding table.
At the swing arm die bonder of the current mainstream, a swing arm rotates to a bonding position after a die bonding platform moves through visual positioning and an XY motion platform after materials are taken out, and then descends to a bonding height through a Z axis to fix a wafer in place. Because the flatness of the die bonding plate cannot reach the required range, the die bonding points at different positions are inconsistent in height, and the height of each point cannot be detected, the height of each point cannot be adjusted by the Z shaft of the swing arm, and the Z shaft can only descend at the same height for die bonding at each time, so that the stress of the wafer at each die bonding point is inconsistent, and the wafer is crushed, and the yield is influenced. In order to solve the above problem, as another embodiment of the present invention, as shown in fig. 4, the bonding apparatus further includes a laser range finder, the bonding stage driving mechanism is configured to drive the bonding stage to perform position switching between the laser range finder and the bonding stage camera (mainly used for moving the bonding stage, that is, driving the bonding stage to move to the laser range finder to detect whether the substrate is flat or not, and driving the bonding stage to move to the bonding stage camera position for chip bonding), the laser range finder is configured to scan the substrate on the bonding stage, obtain scan data, and then calculate a relative height deviation value of each point of the substrate, the bonding head driving mechanism drives the bonding head to convey a component onto the substrate of the bonding stage for bonding, and during bonding, the obtained relative height deviation value of each point of the substrate is compensated to the bonding head each time the bonding head moves to a corresponding point of the substrate (the corresponding point of the substrate refers to an XY coordinate of the point on the substrate) And the Z-axis motion coordinate is adopted, so that the Z-axis descending height of each attaching head is equal to the actual height of the attaching point.
The laser rangefinder is preferably a dual laser rangefinder.
The invention compensates the relative height deviation value of each point of the substrate to the Z-axis motion coordinate when the swing arm moves to the corresponding point every time, thereby ensuring that the Z-axis descending height is exactly equal to the actual height of the die bonding point every time, avoiding the phenomena of over-height and over-low to crush the wafer and improving the yield.
The invention also discloses a component laminating method, which comprises the following steps:
step 1: and controlling the laminating head to move above the component supply table to enable the laminating head to absorb the components.
Step 2: and controlling the bonding head to move towards the bonding table, controlling the detection camera to shoot a photo of the moving bonding head and the component, and obtaining a component deviation angle and a component center point XY deviation distance after algorithm processing.
And step 3: controlling the pasting head to move above the pasting table, and controlling the pasting table to rotate according to the obtained deviation angle of the component, so as to perform angle compensation on the pasting position of the component; controlling the bonding table to move in XY directions according to the XY deviation distance of the center point of the component, so as to compensate the bonding position of the component in XY directions; then, the bonding head bonds the component to the substrate on the bonding stage.
The component attaching method further comprises a scanning calculation step, wherein the scanning calculation step comprises the following steps: controlling the laminating table to move to the position below the laser range finder, scanning the substrate on the laminating table through the laser range finder, and calculating the relative height deviation value of each point of the substrate after obtaining scanning data; in the step 3, the bonding stage is controlled to move to a position below the bonding position camera, and during bonding, the obtained relative height deviation value of each point of the substrate is compensated to the Z-axis motion coordinate of the bonding head when the bonding head moves to the corresponding point of the substrate (the corresponding point of the substrate refers to the XY coordinate of the point on the substrate), so that the Z-axis descending height of the bonding head at each time is equal to the actual height of the bonding point.
To sum up, aiming at the problems in the background art, the invention adds a detection camera (the detection camera is an industrial camera) for detecting the deviation data of the wafer in the swing arm process in the swing arm interval, and adds a rotating motor to the die bonding table to correct the deviation, specifically: and adding a detection camera for upward detection in the swing arm interval, using a fly-shooting technology to capture a wafer photo in the swing arm rotation process, and obtaining a wafer deviation angle and a wafer center point XY deviation distance after algorithm processing. And a rotating motor is additionally arranged on the die bonding platform, so that the die bonding platform can rotate by an angle, the angle compensation can be carried out on the wafer bonding position according to the obtained deviation angle, and the XY direction compensation can be carried out by utilizing the first XY motion platform according to the obtained XY deviation distance of the wafer center point.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A component attaching method is characterized by comprising the following steps:
step 1: controlling the laminating head to move above the component supply table to enable the laminating head to absorb the components;
step 2: controlling the bonding head to move towards the bonding table, controlling the detection camera to capture pictures of the moving bonding head and the component, and obtaining a component deviation angle and a component center point XY deviation distance after algorithm processing;
and step 3: controlling the pasting head to move above the pasting table, and controlling the pasting table to rotate according to the obtained deviation angle of the component, so as to perform angle compensation on the pasting position of the component; controlling the bonding table to move in XY directions according to the XY deviation distance of the center point of the component, so as to compensate the bonding position of the component in XY directions; then, the bonding head bonds the component to the substrate on the bonding stage.
2. A component mounting method as claimed in claim 1, further comprising a scanning calculation step of: controlling the laminating table to move to the position below the laser range finder, scanning the substrate on the laminating table through the laser range finder, and calculating the relative height deviation value of each point of the substrate after obtaining scanning data;
in the step 3, the bonding stage is controlled to move to the position below the bonding position camera, and during bonding, the obtained relative height deviation value of each point of the substrate is compensated to the Z-axis motion coordinate of the bonding head when the bonding head moves to the corresponding point of the substrate each time, so that the Z-axis descending height of the bonding head each time is equal to the actual height of the bonding point.
3. A component mounting system, comprising:
a material taking module: the device is used for controlling the pasting head to move above the component supply table so that the pasting head absorbs the components;
a position calculation module: the device is used for controlling the pasting head to move towards the pasting table, controlling the detection camera to shoot photos of the pasting head and the component in motion, and obtaining a component deviation angle and a component center point XY deviation distance after algorithm processing;
compensation and laminating module: the device is used for controlling the pasting head to move above the pasting table and controlling the pasting table to rotate according to the obtained deviation angle of the component, so that the angle compensation is carried out on the pasting position of the component; controlling the bonding table to move in XY directions according to the XY deviation distance of the center point of the component, so as to compensate the bonding position of the component in XY directions; then, the bonding head is controlled to bond the component to the substrate on the bonding stage.
4. A component bonding system as claimed in claim 3, further comprising a scanning calculation module, wherein the scanning calculation module is configured to control the bonding stage to move below the laser range finder, scan the substrate on the bonding stage through the laser range finder, and calculate a relative height deviation value of each point of the substrate after obtaining scan data;
in the compensation and bonding module, the bonding platform is controlled to move to the position below the bonding position camera, and during bonding, the obtained relative height deviation value of each point of the substrate is compensated to the Z-axis motion coordinate of the bonding head when the bonding head moves to the corresponding point of the substrate every time, so that the descending height of the Z axis of the bonding head every time is equal to the actual height of the bonding point.
5. The utility model provides a laminating equipment which characterized in that: the device comprises a component supply table, a laminating table, a detection camera, a laminating head and a laminating head driving mechanism for driving the laminating head to move, wherein the laminating head is provided with a suction nozzle, the component supply table is used for placing components, the laminating table is used for placing a substrate, and the laminating head driving mechanism is used for driving the laminating head to convey the components on the component supply table to the substrate of the laminating table for laminating; the detection camera is used for capturing photos of the components in the process that the bonding head conveys the components, and obtaining component deviation angles and component center points XY deviation distances after algorithm processing; the laminating equipment also comprises a laminating table driving mechanism for driving the laminating table to move, and the laminating table driving mechanism drives the laminating table to rotate according to the obtained deviation angle of the component, so that the angle compensation is carried out on the laminating position of the component; and driving the laminating table to move in XY directions by the laminating table driving mechanism according to the XY deviation distance of the central point of the component, so as to compensate the laminating position of the component in XY directions.
6. The laminating device of claim 5, wherein: the bonding table driving mechanism comprises a rotating motor and a first XY moving platform, the rotating motor is used for driving the bonding table to rotate, and the first XY moving platform is used for driving the bonding table to move in XY directions; the laminating equipment further comprises a laminating position camera, and the laminating position camera is located above the laminating table.
7. The laminating device of claim 5, wherein: the laminating head driving mechanism comprises a swing arm, the laminating head is installed on the swing arm, and the laminating head moves between the component supply table and the laminating table through the movement of the swing arm.
8. The laminating device of claim 5, wherein: the laminating equipment further comprises a material taking position camera, wherein the material taking position camera is positioned above the component supply table; the laminating equipment further comprises a second XY motion platform, and the second XY motion platform is used for driving the component supply table to move in XY directions.
9. The laminating device of claim 5, wherein: this laminating equipment still includes laser range finder, laminating platform actuating mechanism is used for the drive the laminating platform is in laser side apart from the appearance with carry out the position switch between the camera of laminating position, laser range finder is used for right the base plate of laminating bench scans, calculates the relative height deviation value of each point of base plate after obtaining the scanning data, the first actuating mechanism drive of laminating the laminating head with components and parts transport extremely laminate on the base plate of laminating platform, in the laminating, compensate the Z axle motion coordinate of laminating head at every turn to the relative height deviation value of each point of base plate that will obtain when laminating the head moves the corresponding point of base plate to make the Z axle height of laminating head at every turn equal the actual height of laminating point.
10. The laminating device of any one of claims 5 to 9, wherein: the laminating equipment is a die bonder, the component is a wafer, the component supply platform is a wafer ring, and the laminating platform is a die bonding platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110074582.8A CN112908894A (en) | 2021-01-20 | 2021-01-20 | Component laminating method and system and laminating equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110074582.8A CN112908894A (en) | 2021-01-20 | 2021-01-20 | Component laminating method and system and laminating equipment |
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| CN112908894A true CN112908894A (en) | 2021-06-04 |
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| CN202110074582.8A Pending CN112908894A (en) | 2021-01-20 | 2021-01-20 | Component laminating method and system and laminating equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113837950A (en) * | 2021-09-30 | 2021-12-24 | 深圳市卓兴半导体科技有限公司 | Crystal fillet degree correction method, system and storage medium |
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2021
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| JP2002185193A (en) * | 2000-12-11 | 2002-06-28 | Yamaha Motor Co Ltd | Mounting method of electronic component, and surface- mounting machine |
| CN104848784A (en) * | 2014-02-19 | 2015-08-19 | 江苏腾世机电有限公司 | Position offset correction method and system of chip mounter suction nozzle units |
| JP2015201599A (en) * | 2014-04-10 | 2015-11-12 | 信越半導体株式会社 | Eccentricity evaluation method, and method of manufacturing epitaxial wafer |
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Application publication date: 20210604 |