JPS63168099A - Electronic parts mounter - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an electronic component mounting apparatus for automatically mounting electronic components such as semiconductor devices, such as flat package ICs, on a substrate.

(Prior Art) Conventionally, as shown in FIG. 5, an electronic component 1 having lead rows 3 on each side of a main body portion 2 of the electronic component 1 protruding approximately horizontally is mounted on a substrate (not shown). An automatic mounting device is used for mounting at a predetermined location.

As such a mounting device, for example, the electronic component 1 is sucked and placed at a predetermined location on the board using rF! Shi to judge? A suction head section with a lowering/rotation function, a head mounting section with a biased X-Y table that mounts this suction head section and moves the suction head in the X-Y direction on the substrate, and a head mounting section on the front surface of the head mounting section. II the placed board! A device is known in which the main parts are composed of a device mount section, etc., which is made up of a substrate mounting table, a control section for controlling each of the above-mentioned mechanisms, and an operation section.

The electronic component 1 is mounted on the board-1- by this mounting device, and in the next step, the lead array 3 of the electronic component 1 and the lead pattern on the board are soldered.

In such a mounting device, electronic components housed in a chip tray are vacuum-chucked in advance using the suction terminals of the suction head section, and then moved to a predetermined mounting position on the board by an X-Y15 movement mechanism of the head mounting section. Transport and align the horizontal plane.

Then, the rotation mechanism of the suction head aligns the position of the electronic component 1 in the rotational direction, and the suction terminal is lowered to remove the electronic component 1.
MI! to a predetermined position on the board. do.

At this time, a series of rotation corrections is performed using angle information from a rotation angle detection mechanism such as a rotary encoder provided on the rotation axis of the suction head and information on each electronic component that has been input in advance to the storage mechanism of the mounting device CPU. Rotation correction was performed using a rotation angle correction mechanism based on the mounting position information.

(Problems to be Solved by the Invention) However, in the above-mentioned mounting apparatus, since the head mounting portion is structured to rotate, the rotation axis may be misaligned due to mechanical errors in each moving mechanism during movement. If such a deviation occurs, even if the rotation angle is corrected based on the position information of the electronic component that has been input into the storage mechanism in advance when actually correcting the rotation of the electronic component, mechanical errors will occur. J. Due to misalignment, there was a problem in that accurate alignment was not possible.

The present invention was made in order to solve the above-mentioned problems, and an object of the present invention is to provide an electronic component mounting apparatus that can perform highly accurate mounting.

[Structure of the Invention] (Means for Solving the Problems) The electronic component mounting apparatus of the present invention is an apparatus for mounting electronic components at a predetermined position on a substrate. a holding mechanism; a rotation drive mechanism that rotates the electronic component holding mechanism so that the position of the electronic component in the rotational direction is aligned with a predetermined mounting position on the board; and moving the electronic component holding mechanism in a three-dimensional direction. a three-dimensional drive mechanism for detecting rotational displacement of the electronic component holding mechanism; a rotational displacement detection V1 for detecting rotational displacement of the electronic component holding mechanism; and a deviation between the origin position of the electronic component holding mechanism in a predetermined rotational direction and the rotation axis. the rotational drive mechanism and three-dimensional drive so that the electronic component is mounted at a predetermined position on the board based on information from the rotational displacement detection mechanism and the origin displacement detection mechanism; The present invention is characterized in that it is equipped with a drive correction control mechanism that performs drive correction control of the top of the machine.

(Function) Information on the amount of deviation of the rotation axis is obtained in advance using the origin position detection unit provided on the rotation axis of the electronic component holder, and the drive control signal is corrected based on this information. Highly accurate positioning can be achieved even if mechanical misalignment of the rotation axis occurs.

(Example) An example of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing a mounting apparatus according to an embodiment of the present invention.
1ull! A mount head section 24 is mounted on an XY table 23 driven by a cumulative machine Wi21 and a Y-axis drive mechanism 22.

A Z-axis table 26 connected to a Z-axis drive mechanism 25 is attached to the mount head section 211, and a rotary drive section 2 is attached to the side surface of the Z-axis table 26 downward.
7. A suction head 28, a coupler 29, a slender cylindrical suction shaft 30, and a suction terminal 31 for suctioning and gripping electronic components are integrally attached. the X-Y axis table 23;
The Z-axis table 26 and the rotation drive unit 27 allow the suction terminal 31 to move in three-dimensional directions and rotational directions.

On the other hand, the board 32 is placed in front of the X-Y table 23 by arf'
! A device mount section 36 is disposed, which includes a stand 33, an operation panel 34, an electrical equipment section 35 containing control signals, and the like.

The structure of the mount head section 24 will be explained with reference to FIG. 2.

A worm wheel 41a is attached coaxially to the slender cylindrical suction tool shaft 30, which serves as the rotation axis of the electronic component 1 equipped with the suction terminal 31 at the lower end. worm f1
m41 is configured.

The electronic component 1 adsorbed to the adsorption terminal 31 is aligned in the rotational direction by the angle correction yiA motor side 42 connected to the worm 41b of the arm mechanism 41, and further
- The Z table 49 aligns the suction tool shaft 30 in the X-Y direction.

Further, a rotation angle detection mechanism 43 such as a rotary encoder is disposed on the suction tool shaft 30, and is configured to input information on the angular displacement of the suction tool shaft 30 in the current state to the memory 10147 in the mounting device WCPU 46. ing.

An origin position detection mechanism 51 is installed between the suction tool shaft 30 and the rotation angle detection 11 and 43, and detects a predetermined position in the rotational direction of the rotation axis, that is, the suction tool shaft 30, for example, the origin position. The NA+JJ controller 1444 performs angle correction drive based on the position information of each electronic component that has been input in advance to the memory n side 47 of the rotation angle detector 43, the origin position detector 51, and the mounting device C)'U 46. 11
[42 and control the X-Y-Z drive a-drawing 43.

An example of the configuration of the origin position detection mechanism 51 is shown in Part 3 and 1.

The origin position detection mechanism 51 includes an origin detection wheel 52 arranged on the suction tool shaft 30 and this origin detection wheel 52.
A cylindrical reflector 53 vertically installed above and this reflector 53
The position information signal of the reflector 53 detected by the object detector 54 is input to the storage device 47 of the mounting apparatus CPU 46.

The object detector 54 detects the reflector 53 and the suction tool shaft 30.
By detecting the amount of deviation from the rotation axis of the suction tool axis 30,
The distance between the axis of rotation of the reflector 53 and the reflector 53 can be determined. For example, as shown in FIG. If the angle of the rotation axis is taken as the X axis, and the amount of deviation between the reflector 53 and the rotation axis is taken as the Y axis, these relationships can be expressed as a sine wave. Therefore, from this information, it is possible to determine the deviation star of the rotation axis from the origin.

The operation of the mounting apparatus having such a configuration will be described below.

After holding the electronic component 1 housed in the chip tray 45 in advance by suction with the suction terminal 31, information from the rotation angle detection nM43 and the origin detection mechanism 51 and the mounting device CPU are collected in advance.
The X-Y table 23 is moved rgA based on the electronic component position information input in the memory 47 of the board 32 to transport the electronic component 1 on the board 32 to a predetermined position where the electronic component 1 is to be mounted. Positioning is performed in the Y direction, and the suction tool shaft 29 is rotated by the angle correction drive mechanism 42 under control such as li'i1 to perform positioning in the rotational direction of the electronic component 1.
The shaft taple 26 is driven to lower the suction terminal 31 and the electronic component 1 is mounted at a predetermined position on the board 32.

By the way, in such a mounting device, since the suction terminal 31 is structured to rotate, the rotation axis may shift due to mechanical error during rotation.In such a case, the origin may be mismatched due to the rotation axis shift. Invite the memory machine in advance
Since accurate alignment is impossible with only the position information of each electronic component input to Wi47, origin position detection 1
11 rA 51 detects the deviation cliff of this rotation axis and determines the deviation in advance.

In other words, the storage mechanism l17 includes a reflector 53 provided on the origin detection wheel 52 and an object detector 5.
Since the correlation between the rotation angle of the rotation axis obtained in step 4 and the amount of deviation of the reflector 53 (Fig. 4) is input in advance as misaligned star information, the drive control signal is corrected based on this misaligned star information. and output it.

In this way, an arbitrary position in the rotational direction of the rotational axis is set as a reference, for example, the origin, information on the amount of deviation of the rotational axis and the rotation angle of the rotational axis is obtained from this origin in advance, and the drive control signal is corrected based on this information. This allows accurate positioning even if the rotational axis shifts due to mechanical errors in the drive system.

In the embodiment described above, a means for detecting a reflector on a rotary plate coaxially with the rotary shaft using an object detector was used as a means for detecting the origin of the rotary shaft, but the present invention is not limited to this. For example, a rotary encoder having a function of detecting absolute angular displacement may be used.

[Effects of the Invention] As explained above, according to the mounting apparatus of the present invention, accurate positioning is always possible even if a shift occurs in the rotation axis of the electronic component holding section.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing the external appearance of a mounting apparatus according to an embodiment of the present invention, FIG. 2 is a diagram showing the configuration of the suction head section of FIG. 1, and FIG. 3 is a diagram showing the configuration of an example of the origin position detection mechanism. FIG. 4 is a diagram showing the correlation between the rotation angle of the rotating shaft and the amount of deviation of the rotating shaft, and FIG. 5 is a plan view without showing electronic components. 1......Electronic components 23...X-Y table 24...
...Mount head section 26...Z-axis/Σ-pull 27...Rotation drive (μ structure 2
8...Suction head 30...Suction tool shaft 31...Suction terminal 32...Substrate,' 11...Rotary drive machine Taku・'12...
......Angle correction drive mechanism 43...
- Rotation angle detection mechanism 44... Drive control mechanism 116... Mounting device CPU 17...
......Pi mechanism 119......X-Y-Z drive! lJ mechanism 51
......Origin position detection mechanism 52...
... Wheel for origin detection 53 ... ... Reflector 54 ... ... Object detector Applicant Toshiba Corporation Representative Patent attorney Satoshi Suyama - Figure 1, Figure 3 Figure 4 Figure 5

Claims (2)

[Claims] (1) In an apparatus for mounting electronic components at a predetermined position on a board, an electronic component holding mechanism that holds the electronic component at the tip and a rotational direction position of the electronic component are aligned to a predetermined mounting position on the board. a rotational drive mechanism that rotates the electronic component holding mechanism, a three-dimensional drive mechanism that moves the electronic component holding mechanism in a three-dimensional direction, and a rotational displacement detection mechanism that detects rotational displacement of the electronic component holding mechanism. , an origin displacement detection mechanism that detects a deviation amount between a predetermined origin position of the electronic component holding mechanism in the rotational direction and the rotation axis; An electronic component mounting apparatus comprising: a drive correction control mechanism that performs drive correction control of the rotational drive mechanism and the three-dimensional drive mechanism so that the electronic component is mounted at a predetermined position on the substrate. (2) The origin displacement detection mechanism is composed of a rotary plate mounted coaxially with the rotation axis of the electronic component holding mechanism, a convex portion provided on the rotary plate, and an object detection mechanism that detects the convex portion. An electronic component mounting apparatus according to claim 1, characterized in that: