JP2625786B2 - Electronic component mounting device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus, and more particularly to an apparatus for mounting an electronic component using a rotary head, and more particularly to a component held by a mount head. And a device for rotating a mount head for adjusting the angle of the mount head to the mounting direction.

[Summary of the Invention]

According to the present invention, in the positioning of the mounting direction of the electronic component in the rotary head type chip placer, after roughly correcting the mounting direction of the component by the rotation of the mount head holding the electronic component, the visual sensor is used to position the electronic component. The position is detected, thereby detecting the deviation between the component held by the mount head and the rotation angle in the mounting direction, and further rotating the mount head to correct the deviation. Is to be performed,
The electronic component can be mounted more accurately.

[Conventional technology]

For example, as disclosed in Japanese Patent Publication No. Sho 62-13838, a rotary head type chip placer has been conventionally used for automatic mounting of components. In such an apparatus, the position of the electronic component sucked by the suction nozzle for mounting the component is detected by, for example, a visual sensor. The chip placer detects the position of the component using a visual sensor, and then rotates the suction nozzle that holds the electronic component to set the mounting direction of the electronic component and to determine the deviation of the rotation direction of the component during suction. Correction is performed.

First, in setting the mounting direction, as shown in FIG.
Is sucked by the suction nozzle of the rotary head 4, the nozzle rotates and moves onto the circuit board 5, and the component is mounted at a predetermined position on the board. Here, the directions of the electronic components 1c, 1d, and 1e mounted on the circuit board 5 are as follows.
There are various orientations. On the other hand, the direction of the electronic component 1 held on the tape 2 of the component supply station 3 is one direction. Therefore, the suction nozzle of the rotary head 4 picks up the electronic component 1 and then moves the component 1 in a predetermined direction with respect to the circuit board 5 in accordance with pre-programmed data.
Must rotate to mount.

Next, the deviation of the angle of parts during suction is described.
The above-described correction of the mounting direction is performed on the assumption that the electronic component is sucked in the middle of the suction nozzle without tilt. However, the electronic component 1a is often held diagonally on the tape 2 as shown in FIG. As a result, the components sucked by the nozzles 7 of the rotary head 4 are shifted from the normal direction by Δθ as shown in FIG. Therefore, in order to mount the electronic component 1 on the circuit board 5 in a predetermined direction, it is necessary to correct the shift angle Δθ by rotating the rotary head having the nozzle 7.

Therefore, in the conventional chip placer, as described above, the inclination of the electronic component sucked by the suction nozzle is detected by the visual sensor, and the two types of rotation are corrected at the same time. Is mounted.

[Problems to be solved by the invention]

The apparatus shown in FIGS. 7 to 9 intermittently revolves the rotary head 4 for each station, and rotates the rotary head 4 at the station immediately before the mounting station. That is, the rotary head 4 supported by the rotating disk 10 and revolved intermittently by 45 degrees by the support shaft 11 is moved from the pick-up station.
When rotated 90 degrees to the detection station, a visual sensor 17 composed of a video camera disposed below detects the attitude of the electronic component held by the suction nozzle 7. Based on this detection, the rotary head 4 holding the suction nozzle 7 is rotated at the next θ rotation station.

The θ rotation must be performed during about 0.1 to 0.2 seconds when the suction nozzle 7 is stopped at the θ rotation station. That is, since the θ rotation must be completed within a short time, the suction nozzle 7 needs to be rapidly rotated. Accordingly, a large inertia occurs in the electronic component sucked by the suction nozzle 7, and the electronic component 1 may be shifted with respect to the suction nozzle 7 during this rotation. Therefore, in such a structure, although the mechanism for rotating the suction nozzle is simplified, the displacement of the component due to the inertia is not corrected, and the electronic component 1 mounted on the circuit board 5 may be displaced. There is.

Therefore, as shown in FIGS. 10 and 11, a mounting device provided with a pulse motor 18 for each rotary head 4 has been proposed. The output side of the pulse motor 18 is linked with the rotary head 4 by a timing belt 19. In such an apparatus, the suction nozzle 7 is rotated by a predetermined amount during a period from the position detection of the electronic component by the visual sensor 17 to the mounting of the electronic component. Therefore, since the rotation speed of the suction nozzle 7 is reduced, the inertia is reduced, the displacement of the electronic component 1 with respect to the suction nozzle 7 is reduced, and the mounting accuracy of the electronic component is improved. However, this apparatus requires as many pulse motors as the number of suction nozzles, which increases the cost of the apparatus. Further, a large number of pulse motors have to be controlled respectively, and there is a disadvantage that the control system becomes complicated.

SUMMARY OF THE INVENTION The present invention has been made in view of such a problem, and has been made in consideration of such a problem that an electronic component mounting accuracy is improved and a mechanism for correcting a position in a rotational direction of the component can be configured at a low cost. It is an object to provide a mounting device.

[Means for solving the problem]

The present invention includes a rotary mount head that performs a revolving motion and a rotation motion, and the mount head picks up and holds a predetermined electronic component at a pick-up station, and includes the electronic component held at the mount station. An apparatus configured to be mounted at a predetermined position by the mount head, a unit configured to rotate the mount head by a predetermined angle corresponding to a mounting direction of the electronic component picked up by the pick-up station; Means for detecting the attitude of the component held by the mount head later; means for rotating the mount head in the correction direction in order to correct the attitude of the component in conjunction with the detection of the means for detecting the attitude And the mount head mounts the electronic component. Releasing the electronic component and mounting the electronic component, and then rotating the mount head back to an initial state.The electronic component is mounted at a predetermined position by the mount head in a state where the posture is corrected. Along with
The present invention relates to a mounting device for an electronic component, wherein the mount head having released the electronic component is returned to an initial state by rotation.

[Action]

Therefore, according to the present invention, the electronic component is first rotated with respect to the mounting direction, and then the rotation direction is corrected in accordance with the detection of the posture detecting means, and thereafter, the electronic component is moved to a predetermined position. Will be mounted. Therefore, by reducing the amount of rotation of the mount head after the detection of the posture, the displacement of components due to rotation of the mount head after the detection of the posture is reduced, and the mounting accuracy is improved. After the components are mounted, the mount head further rotates and returns to the initial state.

〔Example〕

FIG. 4 shows a main part of an electronic component mounting apparatus according to an embodiment of the present invention. The mounting apparatus includes a component supply station 30, and a parts cassette 31 is provided in the supply station 30. Many are arranged adjacent to each other. A mounting device having a large number of mount heads 32 is provided in front of the component supply station 30. Each mount head 32 has a suction nozzle 33 at the lower end and is held by a rotating disk 34. The rotating disk 34 is adapted to be rotated about a main shaft 35. Each mount head 32 has a driven gear
The driven gears 40 are driven by drive gears 41, 42, and 43, respectively, as shown in FIGS. The drive gears 41 to 43 are supported by levers 44 to 46, respectively, and the actuators 47 to 49 rotate the levers 44 to 46 and drive gears.
The rotation of 41 to 43 is controlled. Further, a visual sensor 39 composed of a video camera is disposed at a lower end side of the mount head 32 located at a detection station shifted by 90 degrees from the suction station.

Next, a description will be given of a device for moving a circuit board disposed below a component mounting device including a plurality of mount heads 32. This moving device includes an XY table 50, and is provided with a pair of rods 51 in the X direction. Slidably supported by The XY table 50 has a bracket 52, on which a feed screw 53 is engaged. The feed screw 53 is driven by an X-axis direction feed motor 54. The support mechanism of the rod 51 is supported by the base 55, and the base 55 is supported by the rod 56 so as to be movable in the Y-axis direction. The base 55 is moved in the Y-axis direction by a Y-axis direction feed motor 57 via a feed screw (not shown). That is, the position of the XY table 50 is correctly regulated to predetermined positions in the X-axis direction and the Y-axis direction.

As shown in FIG. 2, the apparatus according to the present embodiment having such a configuration includes a θ for rotating the mount head 32 having the suction nozzle 33 before and after a detection station that detects a displacement by the visual sensor 39. A rotation station and a △ θ rotation station are provided. In these stations, the suction nozzle 33 is rotated by the driving force of the actuators 47 and 48 by the mount head 32. The operation of correcting the position of the electronic component by the rotation of the mount head 32 by the actuators 47 and 48 will be described.

At the original position shown in FIG. 2, that is, at the suction station, a suction nozzle 33 provided at the tip of the mount head 32 sucks a predetermined electronic component in the parts cassette 31 of the component supply station 30. And after this, spindle 35
Is rotated by 45 degrees and the mount head 32 reaches the θ rotation station, the suction nozzle 33 is rotated in accordance with data programmed in advance at this station so that the direction of the electronic component matches the mounting direction of the circuit board. This rotation is performed assuming a state where the components held on the tape in the parts cassette 31 are held at the center of the suction nozzle 33 without being shifted in the rotation direction. The movement of the mount head 32 at this time is achieved by the driving gear 41 driving the driven gear 40 by the driving force of the actuator 47 shown in FIG.

After this, when the mount head 32 is rotated 45 degrees by the spindle 35, the mount head located at the θ rotation station
32 leads to a displacement detection station. In this station, the visual sensor 39 detects the displacement of the component sucked by the suction nozzle 33 in the X-axis direction, the Y-axis direction, and the θ direction. That is, the displacement detection is performed after the electronic component is rotated in accordance with the mounting direction of the electronic component on the circuit board. When the main shaft 35 is further rotated by 45 degrees after such detection, the shift Δθ in the rotation direction of the electronic component with respect to the suction nozzle 33 detected by the position detection station is determined by this suction nozzle.
Correction is made by further rotating 33 by the mount head 32. This correction is achieved by driving the mount head 32 with the drive gear 42 driven by the actuator 48.

Thereafter, when the main shaft 35 is further rotated by 45 degrees, the mount head 32 that supports the circuit component whose rotation direction has been corrected is
Will lead to the mount station. The electronic component held by the suction nozzle at this position is mounted on the circuit board on the XY table 50 after adjusting the displacement of the component in the X-axis direction and the Y-axis direction by moving the table 50. Will be. This makes it possible to mount electronic components without shifting in the X-axis direction, the Y-axis direction, and the θ direction. Then, after mounting, the main shaft is further rotated by 45 degrees, and-(θ + △ θ)
It reaches the rotation station, in which position the mounting head 32 is driven by the actuator 49 via the drive gear 43.
By driving the driven gear 40 of the
Will be returned to the original initial state, and will be ready for component mounting in the next cycle.

As described above, according to the electronic component mounting apparatus according to the present embodiment, the mounting head 32
Is largely rotated, and the mount head 32 is not rotated too much at the △ θ rotation station. Therefore, there is a possibility that the electronic components held by the suction nozzle 33 may shift due to inertia only in the θ rotation station. However, even if the component is displaced in this station, the positional displacement of this component is detected by the visual sensor 39 in the position detection station, and the position is corrected in the △ θ rotation station, so that the accuracy of the final mounting position cannot be improved. Will have no effect. Therefore, the mounting accuracy of the components can be improved. That is, by reducing the amount of rotation of the suction nozzle 33 after the end of the position detection, the displacement of the component due to the rotation of the suction nozzle 33 in the △ θ rotation station is reduced, and the mounting accuracy is improved. Further, the rotation of the nozzle 33 is performed by the supply of power from the external actuators 47 and 48, so that the control system is simplified as compared with a system in which a pulse motor is provided for each nozzle 33.

〔The invention's effect〕

As described above, the present invention rotates the electronic component picked up at the pick-up station by rotating the mount head corresponding to the mounting direction, and detects the orientation of the component held by the mount head thereafter. The head is rotated in the correction direction so as to correct the posture of the component in conjunction with this detection. Therefore, the amount of rotation of the mount head after the detection of the posture is reduced, and the displacement of components due to inertia due to the rotation of the mount head is reduced, so that the mounting accuracy is improved. In addition, after the mount head releases the electronic components and mounts them, the mount head is rotated back to the initial state, so the rotation position of the mount head when mounting the electronic components at the pick-up station is Always constant,
This provides the advantage of easier control.

[Brief description of the drawings]

1 is a plan view of a rotary head device of a component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a schematic plan view showing the operation of the rotary head, FIG. 3 is a front view of the rotary head, and FIG. FIG. 5 is an external perspective view showing the overall configuration of the mounting apparatus. FIG. 5 is a plan view of a main part of the conventional mounting apparatus.
7 is an enlarged plan view showing the attitude of the electronic component, FIG. 7 is a plan view of a conventional rotary head, FIG. 8 is a schematic plan view showing the operation of the rotary head, FIG. 9 is a front view of the rotary head, FIG. The figure is a plan view of another conventional rotary head, and FIG.
The figure is the front view. In the reference numerals used in the drawings, 30: component supply station 32: mount head 33: suction nozzle 39: visual sensor (video camera) 40: driven gear 41 to 43: drive gear 47 to 49 Actuator 50... XY table.

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Yoshiyuki Yanagisawa, 6-7-35 Kita Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation (72) Inventor Shunsuke Matsui 6-35, Kita-Shinagawa, Shinagawa-ku, Tokyo No. Sony Corporation (56) References JP-A-1-122200 (JP, A) JP-A-63-296397 (JP, A)

Claims (1)

(57) [Claims] An electronic device, comprising: a rotary mount head that performs a revolving motion and a rotating motion; wherein the mount head picks up and holds a predetermined electronic component at a pick-up station, and holds the electronic component held at the mount station. Means for mounting the electronic component picked up at the pick-up station by a predetermined angle corresponding to a mounting direction of the electronic component picked up by the pick-up station; Means for detecting the orientation of the component held by the mount head after rotation, and rotating the mount head in a correction direction to correct the orientation of the component in conjunction with detection of the means for detecting the attitude. Means, said mount head being said electronic component Releasing the electronic component and mounting the electronic component, and then rotating the mount head back to the initial state. The electronic component is mounted at a predetermined position by the mount head in a state where the posture is corrected. Wherein the mount head having released the electronic component is returned to an initial state by rotation.