JP5710238B2 - Electronic component mounting equipment - Google Patents

Electronic component mounting equipment Download PDF

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JP5710238B2
JP5710238B2 JP2010285688A JP2010285688A JP5710238B2 JP 5710238 B2 JP5710238 B2 JP 5710238B2 JP 2010285688 A JP2010285688 A JP 2010285688A JP 2010285688 A JP2010285688 A JP 2010285688A JP 5710238 B2 JP5710238 B2 JP 5710238B2
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head
nozzle
electronic component
component
rotating
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JP2012134348A (en
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昌裕 谷崎
昌裕 谷崎
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Hanwha Techwin Co Ltd
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Samsung Techwin Co Ltd
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Priority to JP2010285688A priority Critical patent/JP5710238B2/en
Priority to KR1020110023822A priority patent/KR101665391B1/en
Priority to US13/334,137 priority patent/US8769809B2/en
Priority to CN201110448747.XA priority patent/CN102573441B/en
Publication of JP2012134348A publication Critical patent/JP2012134348A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • B23P21/004—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed
    • D—TEXTILES; PAPER
    • D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
    • D01H—SPINNING OR TWISTING
    • D01H3/00—Spinning or twisting machines in which the product is wound-up intermittently, e.g. mules
    • D01H3/02—Details
    • D01H3/16—Spindle-driving arrangements
    • D01H3/20—Spindle-driving arrangements during drawing-out or backing-off
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Textile Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Description

本発明は、互いに連動する回転軸を有する電子部品実装装置に関する。   The present invention relates to an electronic component mounting apparatus having rotating shafts interlocking with each other.

従来、ロータリ式（回転式）ヘッドを有する電子部品実装装置において、ロータリーヘッドの動作時間短縮を目的として複数軸を同期制御したものがある。特許文献１には、ロータリーヘッドの回転軸モーターとは別に、各ノズルユニットにそれぞれ回転軸モーターを配置し、これらを同期作動させることで、動作時間を短縮したものが開示される。また、特許文献２には、ロータリーヘッドの回転軸モーターとノズルを昇降させるレバー駆動部とを同期させることで、同じく動作時間を短縮したものが開示される。   2. Description of the Related Art Conventionally, in an electronic component mounting apparatus having a rotary (rotary) head, a plurality of axes are synchronously controlled for the purpose of shortening the operation time of the rotary head. Japanese Patent Application Laid-Open No. 2004-228561 discloses a configuration in which a rotating shaft motor is arranged in each nozzle unit separately from the rotating shaft motor of the rotary head, and the operation time is shortened by operating them synchronously. Further, Patent Document 2 discloses a device in which the operation time is similarly shortened by synchronizing the rotary shaft motor of the rotary head and the lever driving unit for moving the nozzle up and down.

特開平０６−７７６９３号公報Japanese Patent Laid-Open No. 06-77793 特開２００８−２２７２４９号公報JP 2008-227249 A

ところで、ロータリーヘッドが、ノズルを備えた複数のスピンドルと、これら各スピンドルを自転させる第一モーターと、各スピンドルと平行かつ別軸の回転軸線を有すると共に各スピンドルと連動してこれらを前記回転軸線回りに公転させるヘッド本体と、ヘッド本体を回転させる第二モーターとを有し、ヘッド本体の回転で各スピンドルを公転させながら自転させる機構の場合に、各スピンドル及びヘッド本体の回転を適宜同期させて撮像検査の前後に渡るようにロータリーヘッドを間欠作動させると、撮像検査後に各スピンドルの機構的誤差による狂いが生じることがあり、電子部品の装着位置精度を低下させるという課題がある。   By the way, the rotary head has a plurality of spindles provided with nozzles, a first motor for rotating each of the spindles, a rotation axis parallel to each spindle and a separate axis, and in conjunction with each spindle, the rotation axis is In the case of a mechanism that has a head body that revolves around and a second motor that rotates the head body, and rotates each spindle while revolving with the rotation of the head body, the rotation of each spindle and the head body is appropriately synchronized. When the rotary head is intermittently operated before and after the imaging inspection, there is a problem that a deviation due to a mechanical error of each spindle may occur after the imaging inspection, and there is a problem that the mounting position accuracy of the electronic component is lowered.

そこで本発明は、互いに連動する回転軸を有する電子部品実装装置において、各軸の同期方法の工夫により、電子部品の装着位置精度の向上を図ることを目的とする。   Accordingly, an object of the present invention is to improve the mounting position accuracy of an electronic component by devising a method for synchronizing each axis in an electronic component mounting apparatus having rotating shafts interlocking with each other.

上記課題の解決手段として、請求項１に記載した発明は、電子部品を保持、移送して所定箇所に装着するヘッドを備えた電子部品実装装置において、前記ヘッドが、前記電子部品を保持するノズルを備えた複数のスピンドルと、前記各スピンドルを自転させる第一駆動手段と、前記各スピンドルの自転と連動して前記各スピンドルをヘッド中心軸線回りに公転させるヘッド本体と、前記ヘッド本体を前記ヘッド中心軸線回りに回転させる第二駆動手段とを有し、前記ヘッドが、前記各ノズルを部品装着位置での電子部品の向きに合わせて自転させつつ、これら各ノズルで部品保持位置にて電子部品を順次保持し、その後に電子部品を部品装着位置に移送して所定箇所への装着を行い、前記ヘッドが、前記各ノズルの内の部品保持位置上にあるものを部品装着位置での電子部品の向きに合わせるべく、前記各ノズルを逆方向に自転させた状態で、前記部品保持位置上のノズルで電子部品を保持し、その後に前記各ノズルを正方向に前記逆方向の自転量だけ正方向に自転させ、さらにその後に前記各ノズルを自転させることなくヘッド本体と同一回転速度で前記ヘッド中心軸線回りに回転させる手順を行いつつ、前記手順を繰り返すことで前記各ノズルに電子部品を順次保持した後、電子部品を部品装着位置に移送して、前記各ノズルを逆方向に自転する前の状態に戻した状態で電子部品の所定箇所への装着を行うことを特徴とする。
請求項２に記載した発明は、前記ヘッドが、電子部品の装着位置精度優先の動作と電子部品の認識視野活用優先の動作とを選択的に切り替えて、前記各ノズルを自転させることを特徴とする。
請求項３に記載した発明は、電子部品を保持、移送して所定箇所に装着するロータリ式ヘッドにおいて、前記電子部品を保持するノズルを備えた複数のスピンドルと、前記各スピンドルを自転させる第一駆動手段と、前記各スピンドルの自転と連動して前記各スピンドルをヘッド中心軸線回りに公転させるヘッド本体と、前記ヘッド本体を前記ヘッド中心軸線回りに回転させる第二駆動手段とを有し、前記各ノズルを部品装着位置での電子部品の向きに合わせて自転させつつ、これら各ノズルで部品保持位置にて電子部品を順次保持し、その後に電子部品を部品装着位置に移送して所定箇所への装着を行い、前記ヘッドが、前記各ノズルの内の部品保持位置上にあるものを部品装着位置での電子部品の向きに合わせるべく、前記各ノズルを逆方向に自転させた状態で、前記部品保持位置上のノズルで電子部品を保持し、その後に前記各ノズルを正方向に前記逆方向の自転量だけ正方向に自転させ、さらにその後に前記各ノズルを自転させることなくヘッド本体と同一回転速度で前記ヘッド中心軸線回りに回転させる手順を行いつつ、前記手順を繰り返すことで前記各ノズルに電子部品を順次保持した後、電子部品を部品装着位置に移送して、前記各ノズルを逆方向に自転する前の状態に戻した状態で電子部品の所定箇所への装着を行うことを特徴とする。
請求項４に記載した発明は、電子部品を保持、移送して所定箇所に装着するヘッドを備えた装置における電子部品実装方法において、前記ヘッドが、前記電子部品を保持するノズルを備えた複数のスピンドルと、前記各スピンドルを自転させる第一駆動手段と、前記各スピンドルの自転と連動して前記各スピンドルをヘッド中心軸線回りに公転させるヘッド本体と、前記ヘッド本体を前記ヘッド中心軸線回りに回転させる第二駆動手段とを有し、前記ヘッドが、前記各ノズルを部品装着位置での電子部品の向きに合わせて自転させつつ、これら各ノズルで部品保持位置にて電子部品を順次保持し、その後に電子部品を部品装着位置に移送して所定箇所への装着を行い、前記ヘッドが、前記各ノズルの内の部品保持位置上にあるものを部品装着位置での電子部品の向きに合わせるべく、前記各ノズルを逆方向に自転させた状態で、前記部品保持位置上のノズルで電子部品を保持し、その後に前記各ノズルを正方向に前記逆方向の自転量だけ正方向に自転させ、さらにその後に前記各ノズルを自転させることなくヘッド本体と同一回転速度で前記ヘッド中心軸線回りに回転させる手順を行いつつ、前記手順を繰り返すことで前記各ノズルに電子部品を順次保持した後、電子部品を部品装着位置に移送して、前記各ノズルを逆方向に自転する前の状態に戻した状態で電子部品の所定箇所への装着を行うことを特徴とする。
請求項５に記載した発明は、電子部品を保持、移送して所定箇所に装着するロータリ式ヘッドの駆動方法において、前記電子部品を保持するノズルを備えた複数のスピンドルと、前記各スピンドルを自転させる第一駆動手段と、前記各スピンドルの自転と連動して前記各スピンドルをヘッド中心軸線回りに公転させるヘッド本体と、前記ヘッド本体を前記ヘッド中心軸線回りに回転させる第二駆動手段とを有し、前記各ノズルを部品装着位置での電子部品の向きに合わせて自転させつつ、これら各ノズルで部品保持位置にて電子部品を順次保持し、その後に電子部品を部品装着位置に移送して所定箇所への装着を行い、前記ヘッドが、前記各ノズルの内の部品保持位置上にあるものを部品装着位置での電子部品の向きに合わせるべく、前記各ノズルを逆方向に自転させた状態で、前記部品保持位置上のノズルで電子部品を保持し、その後に前記各ノズルを正方向に前記逆方向の自転量だけ正方向に自転させ、さらにその後に前記各ノズルを自転させることなくヘッド本体と同一回転速度で前記ヘッド中心軸線回りに回転させる手順を行いつつ、前記手順を繰り返すことで前記各ノズルに電子部品を順次保持した後、電子部品を部品装着位置に移送して、前記各ノズルを逆方向に自転する前の状態に戻した状態で電子部品の所定箇所への装着を行うことを特徴とする。 As a means for solving the above problems, the invention described in claim 1 is an electronic component mounting apparatus including a head for holding and transporting an electronic component and mounting the electronic component at a predetermined location, wherein the head holds the electronic component. A plurality of spindles, first drive means for rotating the spindles , a head body for revolving the spindles about a head central axis in conjunction with the rotation of the spindles , and the head bodies for the heads. Second driving means for rotating around a central axis , and the head rotates each nozzle in accordance with the direction of the electronic component at the component mounting position, and the electronic component at the component holding position at each nozzle. sequentially holding, followed have rows mounted to a predetermined position by transferring the electronic component to the component mounting position on the head, is on the component holding position of said each nozzle In order to match the direction of the electronic component at the component mounting position, the electronic component is held by the nozzle on the component holding position while rotating each nozzle in the reverse direction, and then each nozzle is moved in the forward direction. The above procedure is repeated while performing the procedure of rotating in the forward direction by the amount of rotation in the reverse direction and then rotating the nozzles around the head central axis at the same rotational speed as the head body without rotating each nozzle. After sequentially holding the electronic components in the nozzles, the electronic components are transferred to the component mounting position, and the electronic components are mounted at predetermined positions in a state where the nozzles are returned to the state before rotating in the reverse direction. and wherein the line Ukoto.
The invention described in claim 2 is characterized in that the head rotates each nozzle selectively by selectively switching between an operation with priority on mounting position accuracy of the electronic component and an operation with priority on utilization of the recognition visual field of the electronic component. To do.
According to a third aspect of the present invention, there is provided a rotary head for holding and transporting an electronic component and mounting the electronic component at a predetermined position, a plurality of spindles each having a nozzle for holding the electronic component, and a first rotating each spindle. Driving means; a head body that revolves each spindle around a head center axis in conjunction with rotation of each spindle ; and second drive means that rotates the head body around the head center axis. While rotating each nozzle according to the orientation of the electronic component at the component mounting position, the electronic components are sequentially held at the component holding position by these nozzles, and then the electronic component is transferred to the component mounting position to a predetermined location. there row mounting of the head, to match what is on the component holding position among the respective nozzles to the electronic components of the orientation at the component mounting position, reverse the respective nozzle The electronic component is held by the nozzle on the component holding position in a state of rotating in the direction, and then each nozzle is rotated in the forward direction in the forward direction by the amount of rotation in the reverse direction, and then each nozzle is further rotated. The electronic components are sequentially held in the nozzles by repeating the procedure while performing the procedure of rotating around the head central axis at the same rotational speed as the head body without rotating the head, and then the electronic components are placed at the component mounting positions. transfer to, and wherein the row Ukoto the attachment to a predetermined position of the electronic component in a state of returning to the state before rotating the respective nozzles in the opposite direction.
According to a fourth aspect of the present invention, there is provided an electronic component mounting method in an apparatus including a head that holds and transports an electronic component and mounts the electronic component at a predetermined position. The head includes a plurality of nozzles that hold the electronic component. A spindle, first driving means for rotating each spindle , a head body for revolving each spindle about a head center axis in conjunction with rotation of each spindle , and rotating the head body about the head center axis A second driving means for causing the head to rotate in accordance with the orientation of the electronic component at the component mounting position, while sequentially holding the electronic components at the component holding position with these nozzles, then have rows mounted to a predetermined position by transferring the electronic component to the component mounting position, the head, the component mounting what is on the component holding position of said each nozzle The electronic components are held by the nozzles on the component holding position in a state where the nozzles are rotated in the reverse direction in order to match the direction of the electronic components at the position, and then the nozzles are moved in the reverse direction in the forward direction. The nozzles are rotated in the positive direction by the amount of rotation of the nozzles, and then the nozzles are rotated by rotating the nozzles around the head central axis at the same rotational speed as the head body without rotating the nozzles. after successively holding the electronic component, and transferring the electronic component to the component mounting position, the line Ukoto mounting of the to a predetermined position of the electronic component in a state of returning to the state before rotating each nozzle in the opposite direction Features.
According to a fifth aspect of the present invention, there is provided a rotary head driving method for holding and transporting an electronic component and mounting the electronic component at a predetermined position, and a plurality of spindles each having a nozzle for holding the electronic component, and the spindles rotating. First driving means for rotating the head main body for revolving the spindle around the head central axis in conjunction with rotation of the spindle , and second driving means for rotating the head main body about the head central axis. Then, while rotating each nozzle according to the orientation of the electronic component at the component mounting position, the electronic components are sequentially held at the component holding position by these nozzles, and then the electronic component is transferred to the component mounting position. there line mounting to a predetermined position, the head, to match what is on the component holding position among the respective nozzles to the electronic components of the orientation at the component mounting position, each In a state where the slip is rotated in the reverse direction, the electronic component is held by the nozzle on the component holding position, and then each nozzle is rotated in the forward direction in the forward direction by the amount of rotation in the reverse direction. While performing the procedure of rotating the nozzles around the head central axis at the same rotational speed as the head body without rotating the nozzles, the electronic components are sequentially held in the nozzles by repeating the procedure, and then the electronic components are and transferred to a mounting position, wherein characterized the row Ukoto the attachment to a predetermined position of the electronic component in a state of returning to the state before the rotation of the nozzle in the opposite direction.

本発明によれば、各駆動手段を同期作動させて各ノズルとヘッド本体とを適宜連動させることで、例えば各ノズルに保持した電子部品の撮像検査後に各スピンドルを自転させることなく部品装着位置にて電子部品の装着を行うことができるため、前記撮像検査後に各スピンドルの機構的誤差等による狂いが生じることがなく、電子部品の装着位置精度を向上させることができる。又は、前記撮像検査時の撮像視野を有効活用するべく各スピンドルを自転させることで、効率的な画像取り込みを行うことができる。   According to the present invention, the respective driving means are operated in synchronization and the respective nozzles and the head main body are appropriately interlocked, so that, for example, after the imaging inspection of the electronic components held in the respective nozzles, the respective spindles are moved to the component mounting positions without rotating. Since the electronic components can be mounted, there is no error due to a mechanical error of each spindle after the imaging inspection, and the mounting position accuracy of the electronic components can be improved. Alternatively, efficient image capture can be performed by rotating each spindle to effectively use the imaging field of view during the imaging inspection.

本発明の実施形態における電子部品実装装置の斜視図である。It is a perspective view of the electronic component mounting apparatus in embodiment of this invention. 上記電子部品実装装置のノズルヘッドの軸線に沿う断面図である。It is sectional drawing which follows the axis line of the nozzle head of the said electronic component mounting apparatus. 上記電子部品実装装置のノズルヘッドの軸線に直交する断面図であり、（ａ）はＴ軸モーターのみが駆動した場合を、（ｂ）はＲ軸モーターのみが駆動した場合を、（ｃ）は各モーターが同期駆動した場合をそれぞれ示す。It is sectional drawing orthogonal to the axis line of the nozzle head of the said electronic component mounting apparatus, (a) shows the case where only a T-axis motor drives, (b) shows the case where only an R-axis motor drives, (c) shows The case where each motor is driven synchronously is shown. 図３に相当する断面図であり、（ａ），（ｂ）は各モーターが同期駆動しつつ各ノズルが電子部品を吸着する様を順に示し、（ｃ）は各ノズルが電子部品を吸着し終えた後にＴ軸モーターのみが駆動して各ノズル及び電子部品を自転させる様を示す。FIG. 4 is a cross-sectional view corresponding to FIG. 3, in which (a) and (b) sequentially show that each nozzle sucks an electronic component while each motor is synchronously driven, and (c) shows each nozzle sucking an electronic component. After finishing, only the T-axis motor is driven to rotate each nozzle and electronic component. 図３に相当する断面図であり、（ａ）は一ノズルが電子部品を吸着する前にＴ軸モーターのみが逆転駆動して各ノズルを自転させる様を、（ｂ）は一ノズルが電子部品を吸着した後にＴ軸モーターのみが正転駆動して各ノズルを自転させる様を、（ｃ）は（ａ），（ｂ）の手順を繰り返して各ノズルが電子部品を吸着し終えた後に各モーターが同期駆動して各ノズルを公転させる様をそれぞれ示す。FIG. 4 is a cross-sectional view corresponding to FIG. 3, where (a) shows a state in which only the T-axis motor is driven in reverse rotation to rotate each nozzle before the one nozzle picks up the electronic component, and (b) shows one nozzle that is an electronic component. (C) repeats the steps (a) and (b), and after each nozzle has picked up the electronic component, each of the T-axis motors rotates in the forward direction. The motor is driven synchronously to revolve each nozzle. 電子部品を吸着したノズルヘッドをカメラ側から見た視野の説明図である。It is explanatory drawing of the visual field which looked at the nozzle head which adsorb | sucked the electronic component from the camera side.

以下、本発明の実施形態について図面を参照して説明する。
図１に示すように、電子部品実装装置１の装置本体１ａは、基台２の幅方向（Ｘ方向）の両側部に奥行き方向（Ｙ方向）に延びるＹテーブル３を備えている。各Ｙテーブル３には、その上部に設けたテーブル台４にサーボモーター５によって回転するボールネジ６が設けられている。 Embodiments of the present invention will be described below with reference to the drawings.
As shown in FIG. 1, the apparatus main body 1 a of the electronic component mounting apparatus 1 includes Y tables 3 that extend in the depth direction (Y direction) on both sides in the width direction (X direction) of the base 2. Each Y table 3 is provided with a ball screw 6 that is rotated by a servo motor 5 on a table base 4 provided on the Y table 3.

各Ｙテーブル３のうち、図１左側のＹテーブル３のサーボモーター５は手前側に、図１右側のＹテーブル３のサーボモーター５は奥側にそれぞれ設けられている。各Ｙテーブル３のボールネジ６には、Ｘ方向に延びるＸテーブル７の両側部がそれぞれ螺合されている。   In each Y table 3, the servo motor 5 of the Y table 3 on the left side of FIG. 1 is provided on the front side, and the servo motor 5 of the Y table 3 on the right side of FIG. Both side portions of the X table 7 extending in the X direction are screwed to the ball screws 6 of each Y table 3.

Ｘテーブル７は、そのテーブル本体８が各Ｙテーブル３のボールネジ６に螺合し、各Ｙテーブル３のボールネジ６の回転によりＹ方向に沿って移動する。Ｘテーブル７には、図１右側に設けたサーボモーター９によって駆動するボールネジ１０が設けられている。ボールネジ１０には、ジョイントブロック１１が螺合しており、このジョイントブロック１１には、負圧により電子部品を吸着し、正圧で解放する八本のノズル１８を備えたノズルヘッド２０が支持されている。   The table body 8 of the X table 7 is screwed into the ball screw 6 of each Y table 3 and moves along the Y direction by the rotation of the ball screw 6 of each Y table 3. The X table 7 is provided with a ball screw 10 driven by a servo motor 9 provided on the right side of FIG. A joint block 11 is screwed onto the ball screw 10, and a nozzle head 20 having eight nozzles 18 that adsorb electronic components by negative pressure and release them by positive pressure is supported on the joint block 11. ing.

各Ｙテーブル３には、Ｙ方向に沿って開口部１３が形成され、各開口部１３に掛け渡すようにして、基台２の前側（手前側）にてＸ方向に延びる基板搬送装置１４が設けられている。基板搬送装置１４は一対のレール１５を備え、これら各レール１５上を、電子部品が実装される基板１６がＸ方向に沿って搬送される。そして、基板搬送装置１４上の部品装着位置に配置された基板１６に、各ノズル１８が吸着した電子部品が装着される。   Each Y table 3 is formed with an opening 13 along the Y direction, and a substrate transport device 14 extending in the X direction on the front side (front side) of the base 2 so as to span the opening 13. Is provided. The board transport device 14 includes a pair of rails 15, and a board 16 on which electronic components are mounted is transported along the X direction on each rail 15. Then, the electronic component attracted by each nozzle 18 is mounted on the substrate 16 disposed at the component mounting position on the substrate transport device 14.

基台２の上部の前側には、図１左側から順に、廃棄部品を投入する電子部品廃棄箱１７、複数のノズル１８を収容するノズルステーション１９、及びノズルヘッド２０を下方から照明した状態で撮影するカメラ２１が配置されている。カメラ２１は、ノズルヘッド２０を下方から撮影し、各ノズル１８に吸着された電子部品の配置等や不良品か否かの検査を行う。   On the front side of the upper part of the base 2, in order from the left side of FIG. 1, the electronic component disposal box 17, the nozzle station 19 that accommodates the plurality of nozzles 18, and the nozzle head 20 are photographed from below. A camera 21 is disposed. The camera 21 photographs the nozzle head 20 from below and inspects the arrangement of the electronic components sucked by the nozzles 18 and whether the product is defective.

カメラ２１の図１右側には、装置本体１ａに対して基板１６に実装する電子部品を供給する復数（図１では一対のみ示す）のテープフィーダー２２を有する。各テープフィーダー２２はＸ方向に沿って配列され、自身が保持するテープリールから繰り出したキャリアテープ上の電子部品（何れも不図示）をノズルヘッド２０による部品吸着位置に配置する。   On the right side of the camera 21 in FIG. 1, there is a repetitive tape feeder 22 (only one pair is shown in FIG. 1) for supplying electronic components to be mounted on the substrate 16 to the apparatus main body 1 a. Each of the tape feeders 22 is arranged along the X direction, and an electronic component (none of which is not shown) on the carrier tape fed out from a tape reel held by the tape feeder 22 is arranged at a component suction position by the nozzle head 20.

この電子部品が、ノズルヘッド２０の各ノズル１８により吸着され、基板搬送装置１４上の基板１６への部品装着位置に搬送され実装される。
図２を併せて参照し、ノズルヘッド２０は、Ｔ軸モーター３１の作動により各ノズル１８をＺ方向に沿うノズル中心軸線Ｃ１回りに回転（自転）させると共に、Ｒ軸モーター３２の作動により各ノズル１８をＺ方向に沿うヘッド中心軸線Ｃ２回りに回転（公転）させる。このノズルヘッド２０と各テーブル３，７との協働により、各ノズル１８の何れかが前記部品吸着位置又は部品装着位置の上方に配置されると共に、このノズル１８が前記軸線Ｃ１中心又は軸線Ｃ２中心で各々任意の回転角度に位置決めされる。 This electronic component is adsorbed by each nozzle 18 of the nozzle head 20 and is conveyed and mounted at a component mounting position on the substrate 16 on the substrate conveying device 14.
Referring also to FIG. 2, the nozzle head 20 rotates (spins) each nozzle 18 around the nozzle center axis C <b> 1 along the Z direction by the operation of the T-axis motor 31, and each nozzle by the operation of the R-axis motor 32. 18 is rotated (revolved) around the head central axis C2 along the Z direction. As a result of the cooperation between the nozzle head 20 and the tables 3 and 7, one of the nozzles 18 is disposed above the component suction position or component mounting position, and the nozzle 18 is centered on the axis C1 or the axis C2. Each is positioned at an arbitrary rotation angle at the center.

ノズルヘッド２０は、各ノズル１８の何れかを部品吸着位置の上方に配置し、このノズル１８を昇降部材３３の作動により下降させて電子部品を吸着する。その後、ノズルヘッド２０は、電子部品を吸着したノズル１８を昇降部材３３の作動により上昇させ、このノズル１８及び電子部品を部品装着位置の上方に配置する。さらにその後、ノズルヘッド２０は、電子部品を吸着したノズル１８を昇降部材３３の作動により下降させて、基板１６上に電子部品を装着する。   The nozzle head 20 arranges any one of the nozzles 18 above the component suction position, and lowers the nozzle 18 by the operation of the elevating member 33 to suck the electronic component. Thereafter, the nozzle head 20 raises the nozzle 18 that has attracted the electronic component by the operation of the elevating member 33, and arranges the nozzle 18 and the electronic component above the component mounting position. Thereafter, the nozzle head 20 lowers the nozzle 18 that has attracted the electronic component by the operation of the elevating member 33, and mounts the electronic component on the substrate 16.

装置本体１ａにおける例えば基台２の前部下側の図１左側には、各テーブル３，７及びノズルヘッド２０を含む電子部品実装装置１全体の作動を制御するコントローラー２４が配置されている。また、基台２の前部下側の図１右側には、複数のテープフィーダー２２を搭載した不図示の部品供給台車を収容する台車収容部２５が凹設される。   For example, a controller 24 that controls the operation of the entire electronic component mounting apparatus 1 including the tables 3 and 7 and the nozzle head 20 is disposed on the left side of FIG. Further, on the right side in FIG. 1 below the front portion of the base 2, a carriage housing portion 25 for housing a component supply carriage (not shown) on which a plurality of tape feeders 22 are mounted is provided in a recessed manner.

図２に示すノズルヘッド２０は、Ｚ方向に沿う円筒状の外形を有するもので、ジョイントブロック１１に前記軸線Ｃ２回りに回転可能に支持される円筒状のヘッド本体３４と、軸線Ｃ２回りの周方向で等間隔に配置される複数のノズル１８とを有する。ヘッド本体３４の下部外周には、Ｚ方向に沿う棒状のスピンドル３６が複数配置され、これら各スピンドル３６の下端部に各ノズル１８がそれぞれ設けられる。ヘッド本体３４の下部外周には、これと一体回転可能な中空状のバレル体３５が設けられ、このバレル体３５の上下壁に各スピンドル３６の上下が前記軸線Ｃ１回りで回転可能かつ軸線Ｃ１に沿って昇降可能に支持される。   The nozzle head 20 shown in FIG. 2 has a cylindrical outer shape along the Z direction. The nozzle head 20 has a cylindrical head body 34 rotatably supported around the axis C2 by the joint block 11, and a circumference around the axis C2. And a plurality of nozzles 18 arranged at equal intervals in the direction. A plurality of rod-shaped spindles 36 extending in the Z direction are arranged on the outer periphery of the lower portion of the head body 34, and each nozzle 18 is provided at the lower end of each spindle 36. A hollow barrel body 35 that can rotate integrally therewith is provided on the outer periphery of the lower portion of the head body 34, and the upper and lower sides of each spindle 36 can be rotated around the axis C 1 on the upper and lower walls of the barrel body 35. It is supported so that it can move up and down.

また、ノズルヘッド２０は、ヘッド本体３４内を同軸に貫通する駆動軸３７と、駆動軸３７の上端部に同軸かつ一体回転可能に設けられる入力ギヤ３８と、駆動軸３７の下端部に同軸かつ一体回転可能に設けられる出力ギヤ３９と、ジョイントブロック１１の上方にＺ方向に沿う駆動中心軸線ＣＴ，ＣＲを有して配置されるＴ軸モーター３１及びＲ軸モーター３２とを有する。   The nozzle head 20 includes a drive shaft 37 that passes coaxially through the head body 34, an input gear 38 that is coaxially and integrally rotatable with the upper end of the drive shaft 37, and coaxial with the lower end of the drive shaft 37. An output gear 39 provided so as to be integrally rotatable, and a T-axis motor 31 and an R-axis motor 32 disposed above the joint block 11 with drive center axes CT and CR along the Z direction.

各モーター３１，３２は、それぞれの駆動軸３１ａ，３２ａを下方に突出させる。Ｔ軸モーター３１の駆動軸３１ａの外周にはピニオンギヤ３１ｃが同軸かつ一体回転可能に設けられ、このピニオンギヤ３１ｃが比較的大径の入力ギヤ３８に噛み合う。これらピニオンギヤ３１ｃ及び入力ギヤ３８からなる第一減速ギヤ対を介して、Ｔ軸モーター３１の駆動力が駆動軸３７に伝達され、かつ出力ギヤ３９及び後述の各ノズル駆動ギヤ４１からなる第二減速ギヤ対を介して、前記駆動力が各スピンドル３６（Ｔ軸）に伝達される。   The motors 31 and 32 project the drive shafts 31a and 32a downward. A pinion gear 31c is coaxially and integrally rotatable on the outer periphery of the drive shaft 31a of the T-axis motor 31, and the pinion gear 31c meshes with the input gear 38 having a relatively large diameter. The driving force of the T-axis motor 31 is transmitted to the drive shaft 37 via the first reduction gear pair including the pinion gear 31c and the input gear 38, and the second reduction gear including the output gear 39 and each nozzle drive gear 41 described later. The driving force is transmitted to each spindle 36 (T axis) via the gear pair.

また、Ｒ軸モーター３２の駆動軸３２ａの下方にはこれと同軸の中継軸３２ｂが配置され、この中継軸３２ｂと駆動軸３２ａとが一体回転可能に係合する。中継軸３２ｂの外周にはピニオンギヤ３２ｃが同軸かつ一体回転可能に設けられ、このピニオンギヤ３２ｃがヘッド本体３４の上端部外周に同軸かつ一体回転可能に設けられた比較的大径のヘッド駆動ギヤ４２に噛み合う。これらピニオンギヤ３２ｃ及びヘッド駆動ギヤ４２からなる第三減速ギヤ対を介して、Ｒ軸モーター３２の駆動力がヘッド本体３４（Ｒ軸）に伝達される。なお、図中符号３２ｄは駆動軸３２ａと中継軸３２ｂとの接続部分を支持する複列の玉軸受けを示す。   Further, a relay shaft 32b coaxial with the drive shaft 32a of the R-axis motor 32 is disposed, and the relay shaft 32b and the drive shaft 32a are engaged with each other so as to be integrally rotatable. A pinion gear 32c is provided coaxially and integrally on the outer periphery of the relay shaft 32b. The pinion gear 32c is connected to a relatively large-diameter head drive gear 42 provided coaxially and integrally rotatable on the outer periphery of the upper end of the head body 34. Engage. The driving force of the R-axis motor 32 is transmitted to the head body 34 (R-axis) via the third reduction gear pair including the pinion gear 32c and the head driving gear 42. In addition, the code | symbol 32d in the figure shows the double row ball bearing which supports the connection part of the drive shaft 32a and the relay shaft 32b.

各スピンドル３６の下部には、それぞれ前記ノズル駆動ギヤ４１が同軸かつ一体回転可能に設けられ、これら各ノズル駆動ギヤ４１が前記出力ギヤ３９に噛み合う。これにより、Ｒ軸モーター３２が停止してＴ軸モーター３１のみが駆動すると、各スピンドル３６及び各ノズル１８が軸線Ｃ２中心で回転（公転）することなく軸線Ｃ１中心で回転（自転）する（図３（ａ）参照）。   The nozzle drive gears 41 are coaxially and integrally rotatable at the lower part of each spindle 36, and each of these nozzle drive gears 41 meshes with the output gear 39. As a result, when the R-axis motor 32 stops and only the T-axis motor 31 is driven, each spindle 36 and each nozzle 18 rotate (revolve) around the axis C1 without rotating (revolving) around the axis C2 (see FIG. 3 (a)).

一方、Ｔ軸モーター３１が停止してＲ軸モーター３２のみが駆動すると、ヘッド本体３４及びバレル体３５が軸線Ｃ２中心で回転すると共に各スピンドル３６及び各ノズル１８も軸線Ｃ２中心で回転（公転）し、かつ各ノズル駆動ギヤ４１が出力ギヤ３９の外周を転動することで各スピンドル３６及び各ノズル１８がそれぞれの軸線Ｃ１中心で回転（自転）する（図３（ｂ）参照）。   On the other hand, when the T-axis motor 31 is stopped and only the R-axis motor 32 is driven, the head main body 34 and the barrel body 35 rotate about the axis C2, and the spindles 36 and the nozzles 18 also rotate (revolve) about the axis C2. In addition, as each nozzle drive gear 41 rolls on the outer periphery of the output gear 39, each spindle 36 and each nozzle 18 rotate (spin) about their respective axes C1 (see FIG. 3B).

また、ヘッド本体３４（ヘッド駆動ギヤ４２）と駆動軸３７（入力ギヤ３８）とが同一回転速度となるように各モーター３１，３２が同期駆動すると、各ノズル駆動ギヤ４１が出力ギヤ３９の外周を転動することなく（すなわち各スピンドル３６及び各ノズル１８が自転することなく）、各スピンドル３６及び各ノズル１８がヘッド本体３４及びバレル体３５と同一回転速度で公転する（図３（ｃ）参照）。   When the motors 31 and 32 are synchronously driven so that the head main body 34 (head drive gear 42) and the drive shaft 37 (input gear 38) have the same rotational speed, the nozzle drive gears 41 are connected to the outer periphery of the output gear 39. Without rotating (that is, without rotating each spindle 36 and each nozzle 18), each spindle 36 and each nozzle 18 revolves at the same rotational speed as the head body 34 and barrel body 35 (FIG. 3C). reference).

バレル体３５の上壁には、各スピンドル３６の上部がそれぞれノズル上ラジアル玉軸受け４３を介して支持され、バレル体３５の下壁には、各スピンドル３６の下部がそれぞれノズル下ラジアル玉軸受け４４を介して支持される。
また、ヘッド本体３４の上端部内周には、駆動軸３７の上部がヘッド上ラジアル玉軸受け４５を介して支持され、ヘッド本体３４の下端部内周には、駆動軸３７の下部がヘッド下ラジアル玉軸受け４６を介して支持される。 The upper part of each spindle 36 is supported on the upper wall of the barrel body 35 via a nozzle upper radial ball bearing 43, and the lower part of each spindle 36 is supported on the lower wall of the barrel body 35, respectively. Supported through.
Further, an upper part of the drive shaft 37 is supported on the inner periphery of the upper end of the head body 34 via a head upper radial ball bearing 45, and a lower part of the drive shaft 37 is supported on the inner periphery of the lower end of the head body 34. It is supported via a bearing 46.

図４（ａ）は、各ノズル１８がヘッド本体３４に対する自転角度を同一にした状態で、各ノズル１８及びヘッド本体３４を同期させて回転（公転）させつつ、各ノズル１８で部品吸着位置Ａ１にて順次電子部品Ｅを吸着する例を示す。この例では、各ノズル１８に吸着された電子部品Ｅは、それぞれ自身を保持するノズル１８に対する向きが全て同一となる（図４（ｂ）参照）。   FIG. 4A shows a component suction position A1 at each nozzle 18 while rotating (revolving) the nozzle 18 and the head body 34 in synchronization with each nozzle 18 rotating at the same rotation angle with respect to the head body 34. The example which adsorb | sucks the electronic component E sequentially is shown. In this example, the electronic components E sucked by the nozzles 18 are all in the same direction with respect to the nozzles 18 that hold the electronic components E (see FIG. 4B).

各ノズル１８に電子部品Ｅを吸着したノズルヘッド２０は、その下方（電子部品Ｅ側）からカメラ２１により撮影され、各電子部品Ｅの配置等の検査が行われる。その後、部品装着位置Ａ２にて各ノズル１８に吸着した電子部品Ｅを基板１６に装着することとなるが、このとき、電子部品Ｅの装着時の向きが前記部品吸着時の向きと異なる場合には、カメラ２１による撮像検査後に各モーター３１，３２を差動させて各ノズル１８を自転させて電子部品Ｅの向きを合わせることとなる（図４（ｃ）参照）。   The nozzle head 20 that adsorbs the electronic component E to each nozzle 18 is photographed by the camera 21 from below (the electronic component E side), and inspections such as the arrangement of the electronic components E are performed. Thereafter, the electronic component E attracted to each nozzle 18 at the component mounting position A2 is mounted on the substrate 16. At this time, when the orientation at the time of mounting the electronic component E is different from the orientation at the time of the component suction. After the imaging inspection by the camera 21, the motors 31 and 32 are differentiated to rotate the nozzles 18 so as to align the direction of the electronic component E (see FIG. 4C).

しかし、カメラ２１の撮像検査後に各ノズル１８を自転させると、各ノズル１８の機構的誤差により電子部品Ｅの位置に狂いが生じることがある。なお、前記機構的誤差には、スピンドル３６の回転による振れ誤差や軸受け部分の振れ誤差等がある。   However, if the nozzles 18 are rotated after the imaging inspection of the camera 21, the position of the electronic component E may be distorted due to a mechanical error of the nozzles 18. The mechanical error includes a shake error due to the rotation of the spindle 36 and a shake error of the bearing portion.

そこで本実施形態では、電子部品Ｅの装着時の向きが前記部品吸着時の向きと異なる場合には、その電子部品Ｅの装着時の向きを考慮して、各ノズル１８を一旦逆方向に自転させ（図５（ａ）参照）、この状態で電子部品Ｅの吸着を行い、その後に各ノズル１８を正方向に自転させて、自転前の状態に戻している（図５（ｂ）参照）。   Therefore, in this embodiment, when the orientation when the electronic component E is mounted is different from the orientation when the electronic component E is sucked, each nozzle 18 is rotated in the reverse direction once in consideration of the orientation when the electronic component E is mounted. (See FIG. 5A), the electronic component E is sucked in this state, and then each nozzle 18 is rotated in the forward direction to return to the state before the rotation (see FIG. 5B). .

この手順を繰り返すことで、各ノズル１８に電子部品Ｅが装着時の向きで順次吸着され（図５（ｃ）参照）、その後にカメラ２１による撮像検査を行うことで、撮像検査後にノズル１８を自転させる必要がなくなり、ノズル１８の機構的誤差等による電子部品Ｅの装着位置精度の低下が防止される。これにより、ノズルヘッド２０各部の回転方向の相対的な位置変動を、部品撮像後から部品装着時まで最小限に抑えることが可能となる。   By repeating this procedure, the electronic component E is sequentially attracted to each nozzle 18 in the orientation at the time of mounting (see FIG. 5C), and then the imaging inspection by the camera 21 is performed, so that the nozzle 18 is moved after the imaging inspection. This eliminates the need for rotation, and prevents the mounting position accuracy of the electronic component E from being lowered due to a mechanical error of the nozzle 18 or the like. Thereby, it is possible to minimize relative positional fluctuations in the rotation direction of each part of the nozzle head 20 from the time of component imaging to the time of component mounting.

上記実施形態によれば、各駆動手段を同期作動させて各ノズル１８とヘッド本体３４とを適宜連動させることで、カメラ２１による撮像検査後に各スピンドル３６を自転させることなく部品装着位置にて電子部品Ｅの装着を行うことができるため、カメラ２１による撮像検査後に各スピンドル３６の機構的誤差等による狂いが生じることがなく、電子部品Ｅの装着位置精度を向上させることができる。   According to the above-described embodiment, the respective driving means are operated synchronously to appropriately interlock the nozzles 18 and the head main body 34, so that after the imaging inspection by the camera 21, each spindle 36 is rotated at the component mounting position without rotating. Since the component E can be mounted, there is no error due to a mechanical error of each spindle 36 after the imaging inspection by the camera 21, and the mounting position accuracy of the electronic component E can be improved.

ここで、図７を参照し、上記実施形態の如く電子部品Ｅの装着位置精度を優先して各ノズル１８を自転させるべく各駆動手段を同期作動させる場合、カメラ２１の撮像視野Ｂには無駄な部分が生じ易く、カメラ２１の撮像視野Ｂに対して一度に撮像できる部品サイズが小さくなる。   Here, referring to FIG. 7, when each driving means is operated synchronously to rotate each nozzle 18 with priority given to the mounting position accuracy of the electronic component E as in the above embodiment, the imaging field B of the camera 21 is useless. Therefore, the size of components that can be imaged at once with respect to the imaging field B of the camera 21 is reduced.

そこで、カメラ２１の限られた撮像視野Ｂを有効に活用するために、部品吸着向きが絶対方向で維持できるようにノズルヘッド２０を回転移動させる（Ｒ軸回転移動量に対し、電子部品Ｅの向きが撮像視野Ｂに整合するようにＴ軸回転移動量を調整して同期動作させる）ことで、例えば図７に示す平面視正方形状の電子部品Ｅの場合、最大√２倍の部品サイズを一度に取り込み可能となる。すなわち、カメラ２１の限られた撮像視野Ｂを有効活用して効率的な画像取り込みが可能となる。つまり、電子部品実装装置１は、ノズルヘッド２０における電子部品Ｅの装着位置精度を優先した動作と電子部品Ｅの認識視野の有効活用を優先した動作とを選択的に切り替え可能である。   Therefore, in order to effectively use the limited imaging field of view B of the camera 21, the nozzle head 20 is rotated so that the component suction direction can be maintained in the absolute direction (the amount of the electronic component E relative to the R-axis rotational movement amount). For example, in the case of the electronic component E having a square shape in a plan view shown in FIG. 7, the component size can be increased up to √2 times by adjusting the T-axis rotational movement amount so that the direction matches the imaging visual field B. It can be imported at once. That is, efficient image capture is possible by effectively utilizing the limited imaging field of view B of the camera 21. That is, the electronic component mounting apparatus 1 can selectively switch between an operation that prioritizes the mounting position accuracy of the electronic component E in the nozzle head 20 and an operation that prioritizes effective use of the recognition field of view of the electronic component E.

本発明によれば、カメラによる撮像検査後に各スピンドルの機構的誤差等による狂いが生じることがなく、電子部品の装着位置精度を向上させることができる。   According to the present invention, there is no error due to a mechanical error of each spindle after the imaging inspection by the camera, and the mounting position accuracy of the electronic component can be improved.

１ 電子部品実装装置（装置）
Ｅ 電子部品
１８ ノズル
２０ ノズルヘッド（ヘッド、ロータリ式ヘッド）
３１ Ｔ軸モーター（第一駆動手段）
３２ Ｒ軸モーター（第二駆動手段）
３４ ヘッド本体
３６ スピンドル
Ａ１ 部品吸着位置（部品保持位置）
Ａ２ 部品装着位置

1 Electronic component mounting device (device)
E Electronic component 18 Nozzle 20 Nozzle head (head, rotary head)
31 T-axis motor (first drive means)
32 R-axis motor (second drive means)
34 Head body 36 Spindle A1 Component adsorption position (component holding position)
A2 Component mounting position

Claims (5)

電子部品を保持、移送して所定箇所に装着するヘッドを備えた電子部品実装装置において、
前記ヘッドが、前記電子部品を保持するノズルを備えた複数のスピンドルと、前記各スピンドルを自転させる第一駆動手段と、前記各スピンドルの自転と連動して前記各スピンドルをヘッド中心軸線回りに公転させるヘッド本体と、前記ヘッド本体を前記ヘッド中心軸線回りに回転させる第二駆動手段とを有し、
前記ヘッドが、前記各ノズルを部品装着位置での電子部品の向きに合わせて自転させつつ、これら各ノズルで部品保持位置にて電子部品を順次保持し、その後に電子部品を部品装着位置に移送して所定箇所への装着を行い、
前記ヘッドが、前記各ノズルの内の部品保持位置上にあるものを部品装着位置での電子部品の向きに合わせるべく、前記各ノズルを逆方向に自転させた状態で、前記部品保持位置上のノズルで電子部品を保持し、その後に前記各ノズルを正方向に前記逆方向の自転量だけ正方向に自転させ、さらにその後に前記各ノズルを自転させることなくヘッド本体と同一回転速度で前記ヘッド中心軸線回りに回転させる手順を行いつつ、前記手順を繰り返すことで前記各ノズルに電子部品を順次保持した後、電子部品を部品装着位置に移送して、前記各ノズルを逆方向に自転する前の状態に戻した状態で電子部品の所定箇所への装着を行うことを特徴とする電子部品実装装置。 In an electronic component mounting apparatus equipped with a head for holding, transferring, and mounting an electronic component at a predetermined location,
The head includes a plurality of spindles having nozzles for holding the electronic components, first drive means for rotating the spindles , and revolving the spindles about the head central axis in conjunction with the rotation of the spindles. And a second drive means for rotating the head body around the head central axis ,
The head rotates each nozzle according to the orientation of the electronic component at the component mounting position, and sequentially holds the electronic component at the component holding position with each nozzle, and then transfers the electronic component to the component mounting position. There line the attachment to a predetermined location and,
The head is on the component holding position with the nozzles rotating in the reverse direction so that the head on the component holding position of each nozzle is aligned with the orientation of the electronic component at the component mounting position. An electronic component is held by a nozzle, and then each nozzle is rotated in the forward direction in the forward direction by the amount of rotation in the reverse direction, and then the head is rotated at the same rotational speed as the head body without rotating each nozzle. While carrying out the procedure of rotating around the central axis, the electronic components are sequentially held in the nozzles by repeating the procedure, and then the electronic components are transferred to the component mounting position and before the nozzles rotate in the reverse direction. electronic component mounting apparatus according to claim row Ukoto the attachment to a predetermined position in a state where the return to the state of the electronic component. 前記ヘッドが、電子部品の装着位置精度優先の動作と電子部品の認識視野活用優先の動作とを選択的に切り替えて、前記各ノズルを自転させることを特徴とする請求項１に記載の電子部品実装装置。 Said head is selectively switched and the operation of the recognition field utilization priority operation and the electronic component mounting position accuracy priority of the electronic components, electronic component according to claim 1, characterized in that for rotating each of said nozzles Mounting device. 電子部品を保持、移送して所定箇所に装着するロータリ式ヘッドにおいて、
前記電子部品を保持するノズルを備えた複数のスピンドルと、前記各スピンドルを自転させる第一駆動手段と、前記各スピンドルの自転と連動して前記各スピンドルをヘッド中心軸線回りに公転させるヘッド本体と、前記ヘッド本体を前記ヘッド中心軸線回りに回転させる第二駆動手段とを有し、
前記各ノズルを部品装着位置での電子部品の向きに合わせて自転させつつ、これら各ノズルで部品保持位置にて電子部品を順次保持し、その後に電子部品を部品装着位置に移送して所定箇所への装着を行い、
前記ヘッドが、前記各ノズルの内の部品保持位置上にあるものを部品装着位置での電子部品の向きに合わせるべく、前記各ノズルを逆方向に自転させた状態で、前記部品保持位置上のノズルで電子部品を保持し、その後に前記各ノズルを正方向に前記逆方向の自転量だけ正方向に自転させ、さらにその後に前記各ノズルを自転させることなくヘッド本体と同一回転速度で前記ヘッド中心軸線回りに回転させる手順を行いつつ、前記手順を繰り返すことで前記各ノズルに電子部品を順次保持した後、電子部品を部品装着位置に移送して、前記各ノズルを逆方向に自転する前の状態に戻した状態で電子部品の所定箇所への装着を行うことを特徴とするロータリ式ヘッド。 In a rotary head that holds, transports and mounts electronic components at a predetermined location,
A plurality of spindles having nozzles for holding the electronic components; first driving means for rotating the spindles ; and a head body for revolving the spindles about a head central axis in conjunction with the rotation of the spindles. And a second driving means for rotating the head body around the head central axis ,
While rotating each nozzle according to the orientation of the electronic component at the component mounting position, the electronic components are sequentially held at the component holding position by these nozzles, and then the electronic component is transferred to the component mounting position to be a predetermined location. There line the attachment to,
The head is on the component holding position with the nozzles rotating in the reverse direction so that the head on the component holding position of each nozzle is aligned with the orientation of the electronic component at the component mounting position. An electronic component is held by a nozzle, and then each nozzle is rotated in the forward direction in the forward direction by the amount of rotation in the reverse direction, and then the head is rotated at the same rotational speed as the head body without rotating each nozzle. While carrying out the procedure of rotating around the central axis, the electronic components are sequentially held in the nozzles by repeating the procedure, and then the electronic components are transferred to the component mounting position and before the nozzles rotate in the reverse direction. rotary head, characterized in row Ukoto the attachment to a predetermined position of the electronic component in a state of returning to the state. 電子部品を保持、移送して所定箇所に装着するヘッドを備えた装置における電子部品実装方法において、
前記ヘッドが、前記電子部品を保持するノズルを備えた複数のスピンドルと、前記各スピンドルを自転させる第一駆動手段と、前記各スピンドルの自転と連動して前記各スピンドルをヘッド中心軸線回りに公転させるヘッド本体と、前記ヘッド本体を前記ヘッド中心軸線回りに回転させる第二駆動手段とを有し、
前記ヘッドが、前記各ノズルを部品装着位置での電子部品の向きに合わせて自転させつつ、これら各ノズルで部品保持位置にて電子部品を順次保持し、その後に電子部品を部品装着位置に移送して所定箇所への装着を行い、
前記ヘッドが、前記各ノズルの内の部品保持位置上にあるものを部品装着位置での電子部品の向きに合わせるべく、前記各ノズルを逆方向に自転させた状態で、前記部品保持位置上のノズルで電子部品を保持し、その後に前記各ノズルを正方向に前記逆方向の自転量だけ正方向に自転させ、さらにその後に前記各ノズルを自転させることなくヘッド本体と同一回転速度で前記ヘッド中心軸線回りに回転させる手順を行いつつ、前記手順を繰り返すことで前記各ノズルに電子部品を順次保持した後、電子部品を部品装着位置に移送して、前記各ノズルを逆方向に自転する前の状態に戻した状態で電子部品の所定箇所への装着を行うことを特徴とする電子部品実装方法。 In an electronic component mounting method in an apparatus having a head for holding, transferring, and mounting an electronic component at a predetermined location,
The head includes a plurality of spindles having nozzles for holding the electronic components, first drive means for rotating the spindles , and revolving the spindles about the head central axis in conjunction with the rotation of the spindles. And a second drive means for rotating the head body around the head central axis ,
The head rotates each nozzle according to the orientation of the electronic component at the component mounting position, and sequentially holds the electronic component at the component holding position with each nozzle, and then transfers the electronic component to the component mounting position. There line the attachment to a predetermined location and,
The head is on the component holding position with the nozzles rotating in the reverse direction so that the head on the component holding position of each nozzle is aligned with the orientation of the electronic component at the component mounting position. An electronic component is held by a nozzle, and then each nozzle is rotated in the forward direction in the forward direction by the amount of rotation in the reverse direction, and then the head is rotated at the same rotational speed as the head body without rotating each nozzle. While carrying out the procedure of rotating around the central axis, the electronic components are sequentially held in the nozzles by repeating the procedure, and then the electronic components are transferred to the component mounting position and before the nozzles rotate in the reverse direction. electronic component mounting method comprising rows Ukoto the attachment to a predetermined position of the electronic component in a state of returning to the state. 電子部品を保持、移送して所定箇所に装着するロータリ式ヘッドの駆動方法において、
前記電子部品を保持するノズルを備えた複数のスピンドルと、前記各スピンドルを自転させる第一駆動手段と、前記各スピンドルの自転と連動して前記各スピンドルをヘッド中心軸線回りに公転させるヘッド本体と、前記ヘッド本体を前記ヘッド中心軸線回りに回転させる第二駆動手段とを有し、
前記各ノズルを部品装着位置での電子部品の向きに合わせて自転させつつ、これら各ノズルで部品保持位置にて電子部品を順次保持し、その後に電子部品を部品装着位置に移送して所定箇所への装着を行い、
前記ヘッドが、前記各ノズルの内の部品保持位置上にあるものを部品装着位置での電子部品の向きに合わせるべく、前記各ノズルを逆方向に自転させた状態で、前記部品保持位置上のノズルで電子部品を保持し、その後に前記各ノズルを正方向に前記逆方向の自転量だけ正方向に自転させ、さらにその後に前記各ノズルを自転させることなくヘッド本体と同一回転速度で前記ヘッド中心軸線回りに回転させる手順を行いつつ、前記手順を繰り返すことで前記各ノズルに電子部品を順次保持した後、電子部品を部品装着位置に移送して、前記各ノズルを逆方向に自転する前の状態に戻した状態で電子部品の所定箇所への装着を行うことを特徴とするヘッド駆動方法。 In a driving method of a rotary head that holds, transports and mounts electronic components at a predetermined location,
A plurality of spindles having nozzles for holding the electronic components; first driving means for rotating the spindles ; and a head body for revolving the spindles about a head central axis in conjunction with the rotation of the spindles. And a second driving means for rotating the head body around the head central axis ,
While rotating each nozzle according to the orientation of the electronic component at the component mounting position, the electronic components are sequentially held at the component holding position by these nozzles, and then the electronic component is transferred to the component mounting position to be a predetermined location. There line the attachment to,
The head is on the component holding position with the nozzles rotating in the reverse direction so that the head on the component holding position of each nozzle is aligned with the orientation of the electronic component at the component mounting position. An electronic component is held by a nozzle, and then each nozzle is rotated in the forward direction in the forward direction by the amount of rotation in the reverse direction, and then the head is rotated at the same rotational speed as the head body without rotating each nozzle. While carrying out the procedure of rotating around the central axis, the electronic components are sequentially held in the nozzles by repeating the procedure, and then the electronic components are transferred to the component mounting position and before the nozzles rotate in the reverse direction. head driving method comprising rows Ukoto the attachment to a predetermined position of the electronic component in a state of returning to the state.
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