WO2020157923A1

WO2020157923A1 - Component conveyance device

Info

Publication number: WO2020157923A1
Application number: PCT/JP2019/003422
Authority: WO
Inventors: 実可子大野; 義史大参
Original assignee: 株式会社Ｆｕｊｉ
Priority date: 2019-01-31
Filing date: 2019-01-31
Publication date: 2020-08-06
Also published as: JPWO2020157923A1; JP7145981B2

Abstract

A component conveyance device comprising: a case in which a conveyance path for conveying a plurality of components in a line is formed; a magnet that is provided so as to be able to move along the conveyance path, and uses magnetic force to convey the components on the conveyance path; and a magnetic force reduction mechanism that is provided in a prescribed region of the conveyance path, between the case and the magnet moving along said prescribed region, and reduces the effect of the magnetic force on said prescribed region.

Description

Parts transfer device

The present invention relates to a component transfer device for transferring a plurality of parts in a line in a transfer path.

The component transfer device includes a case in which a transfer path for transferring a plurality of parts in a row is formed, and a magnet movably arranged along the transfer path. Some are transported on the transport path. The following patent documents describe an example of such a component transfer device.

International Publication No. 2018/0047276

An object of the present invention is to appropriately convey a component in a component conveyance device that conveys a component on a conveyance path by magnetic force.

In order to solve the above problems, the present specification discloses a case in which a transport path for transporting a plurality of components in a continuous state is formed, and the component is disposed movably along the transport path, and magnetically drives the components. Arranged between the magnet that conveys along the conveyance path and the magnet that moves along the predetermined area in a predetermined area of the conveyance path, and the case to reduce the influence of the magnetic force on the predetermined area. Disclosed is a component transfer device including a magnetic force reduction mechanism.

According to the present disclosure, the influence of magnetic force on a predetermined area of the transport path is reduced. Therefore, for example, the component transporting device may transport the component not only by magnetic force but also by other means, for example, the weight of the component, suction or ejection of air, vibration, etc., in a predetermined region of the transport path. .. In such a case, by lowering the magnetic force in the predetermined region, the transportation of the component by other means is secured. This makes it possible to appropriately convey the component in the component conveying device that conveys the component on the conveying path by the magnetic force.

It is a perspective view which shows an electronic component mounting apparatus. It is a perspective view which shows a mounting head. It is a perspective view showing a mounting head and a bulk feeder attached to the mounting head. It is a bottom view which shows a mounting head from a viewpoint from a lower part. It is a figure which shows a bulk feeder from the viewpoint from a side. It is a figure showing a bulk feeder from a viewpoint from the upper part. It is sectional drawing in the AA line shown in FIG. It is sectional drawing in the BB line shown in FIG. It is sectional drawing in the CC line shown in FIG. It is a block diagram which shows a control apparatus.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings as a mode for carrying out the present invention.

FIG. 1 shows an electronic component mounting device 10. The electronic component mounting apparatus 10 has one system base 12 and two mounting machines 16 arranged side by side on the system base 12. In the following description, the direction in which the mounting machines 16 are lined up is referred to as the X-axis direction, and the horizontal direction perpendicular to the direction is referred to as the Y-axis direction. The direction is called the Z-axis direction.

Each mounting machine 16 mainly includes a mounting machine body 20, a transport device 22, a mounting head moving device (hereinafter, may be abbreviated as “moving device”) 23, a supply device 24, and a mounting head 26. The mounting machine body 20 includes a frame 30 and a beam 32 mounted on the frame 30.

The transfer device 22 includes two

conveyor devices

40 and 42. The two

conveyor devices

40, 42 are arranged in the frame 30 so as to be parallel to each other and extend in the X-axis direction. Each of the two

conveyor devices

40 and 42 conveys the circuit board supported by each of the

conveyor devices

40 and 42 by an electromagnetic motor (see FIG. 10) 46 in the X-axis direction. The circuit board is fixedly held by a board holding device (see FIG. 10) 48 at a predetermined position.

The moving device 23 is an XY robot type moving device. The moving device 23 includes an electromagnetic motor (see FIG. 10) 52 that slides the slider 50 in the X-axis direction and an electromagnetic motor (see FIG. 10) 54 that slides the slider 50 in the Y-axis direction. The mounting head 26 is attached to the slider 50, and the mounting head 26 is moved to an arbitrary position on the frame 30 by the operation of the two

electromagnetic motors

52 and 54.

The supply device 24 is a feeder type supply device and has a plurality of tape feeders 70. The tape feeder 70 accommodates the taped parts in a wound state. The tape component is a taped electronic component. Then, the tape feeder 70 feeds the tape-formed component by the feeding device (see FIG. 10) 76. As a result, the feeder type supply device 24 supplies the electronic component at the supply position by feeding the tape-formed component.

The mounting head 26 mounts electronic components on the circuit board held by the transfer device 22. The mounting head 26 includes twelve mounting units 82, as shown in FIGS. Then, each of the twelve mounting units 82 holds a suction nozzle 80 for sucking an electronic component at the tip thereof. Incidentally, FIG. 2 is a perspective view showing the mounting head 26 removed from the slider 50. FIG. 3 is a perspective view showing the mounting head 26 with the cover removed. FIG. 4 is a bottom view of the mounting head 26 as seen from the bottom of the mounting head 26.

Each suction nozzle 80 communicates with a positive/negative pressure supply device (see FIG. 10) 84 via a negative pressure air and positive pressure air passage. Then, each suction nozzle 80 sucks and holds the electronic component with a negative pressure, and releases the held electronic component by supplying a slight positive pressure. Further, the mounting unit 82, which is generally in the shape of a shaft, is held on the outer peripheral portion of the unit holder 86 in a state where the axial direction is vertical at an equal angular pitch. As shown in FIG. 4, the suction nozzles 80 held at the tip of the mounting unit 82 extend downward from the lower surface of the unit holder 86 at 12 equally spaced positions. As a result, the 12 suction nozzles 80 are arranged on one circumference.

The unit holder 86 is rotatably supported by the head body 88 of the mounting head 28 about its own vertical axis, and is rotated at an arbitrary angle by the holder rotating device 90. Thereby, the plurality of suction nozzles 80 arranged on one circumference rotate at an arbitrary angle with the center of the one circumference as an axis.

A roller 92 that functions as a cam follower is provided at the upper end of each mounting unit 82. Each roller 92 is engaged with a cam surface of a cam (not shown) fixed to the head main body 88, and the height of the cam surface changes in the circumferential direction. Further, each mounting unit 82 is held by a unit holder 86 so as to be vertically movable. As a result, the mounting unit 82 moves in the vertical direction as the unit holder 86 rotates.

Specifically, of the plurality of stop positions of the mounting unit 82, the mounting unit 82 located at the mounting station (the station located at the frontmost position), which is the farthest position from the head body 88, moves to the lowest position. .. That is, when the mounting head 28 is moved onto the circuit board, the distance between the suction nozzle 80 of the mounting unit 82 located at that station and the circuit board becomes the shortest. Then, the electronic component is mounted on the circuit board by the suction nozzle 80 of the mounting station.

Further, five mounting units are provided centering on the mounting unit 82 located directly opposite to the mounting station with the axis of the unit holder 86 interposed therebetween, that is, the imaging station which is the closest stop position to the head body 88. 82 moves to the uppermost position.

As shown in FIG. 2, the lower end of the head main body 88 extends downward from the lower end of the suction nozzle 80 of each mounting unit 82 located at the uppermost position, and is bent toward the suction nozzle 80. A parts camera 96 is arranged in the bent portion. Then, the electronic camera held by the suction nozzle 80 of the mounting unit 82 located at the imaging station is imaged by the parts camera 96. Further, a mark camera (see FIG. 10) 98 is provided on the lower surface of the bent portion of the head body 88 in a state of facing downward. Then, as the mounting head 26 is moved by the moving device 23, the mark camera 98 images an arbitrary position on the frame 30.

Here, the positional relationship between the stations will be described with reference to FIG. When one of the twelve mounting units 82a to 82l is located at the mounting station, that is, when the mounting unit 82a is moved to the lowest position, the five mounting units 82e to 82i are placed. Is moving to the top. Then, the mounting unit 82g is located at the imaging station, and the electronic camera held by the suction nozzle 80 of the mounting unit 82g is imaged by the parts camera 96. When the unit holder 86 rotates in the forward direction, the unit holder 86 rotates clockwise in FIG.

Further, among the five mounting units 82e to 82i, the station in which the mounting unit 82e on the most upstream side in the rotation direction of the unit holder 86 is located is the electronic component from the bulk feeder 100 (see FIG. 5) described in detail later. It is used as an adsorption station for adsorbing. The electronic component supplied from the tape feeder 70 is sucked by the suction nozzle 80a of the mounting unit 82a located at the mounting station.

The mounting head 26 also includes a unit rotation device 102 that simultaneously rotates each mounting unit 82 about each axis. As shown in FIG. 3, the unit rotation device 102 includes a plurality of gears 103 provided at the upper ends of the plurality of mounting units 82 and one gear (not shown) that meshes with the plurality of gears 103. There is. The rotation of the one gear causes the plurality of gears 103 to rotate, so that the respective mounting units 82 simultaneously rotate about their respective axes. Thereby, the holding posture of the electronic component sucked and held by each mounting unit 82 can be changed. Further, the mounting head 26 includes a unit elevating device 104 for individually elevating and lowering the mounting units located at the mounting station and the suction station.

The bulk feeder 100 that supplies electronic components to the mounting unit 82 located at the suction station is attached to the head body 88 of the mounting head 26. Therefore, the bulk feeder 100 is moved by the moving device 23 together with the mounting head 26 to an arbitrary position on the frame 30. As shown in FIGS. 5 and 6, the bulk feeder 100 has a housing 110 and an arm member 112 fixed to the lower end of the housing 110. 5 is a perspective view from the side of the bulk feeder 100, and FIG. 6 is a perspective view from the viewpoint of the bulk feeder 100 from above.

The arm member 112 is divided into a first arm portion 114, a second arm portion 116, and a third arm portion 118. The first arm portion 114 is orthogonal to the second arm portion 116 and the third arm portion 118 in the same plane, and the second arm portion 116 and the third arm portion 118 extend in opposite directions. The arm member 112 is fixed to the lower surface of the housing 110 at the second arm portion 116. The arm member 112 is bolted to the head body 88 at the third arm portion 118.

Further, the housing 110 is composed of a first case member 120 and a second case member 122. The first case member 120 and the second case member 122 are in the form of flat plates having a plate thickness, and are erected in a state where their surfaces are aligned with each other. As shown in FIG. 7, the first case member 120 is provided with a recess 128 that opens to a surface 126 opposite to the mating surface 124 that is fitted to the second case member 122. The turntable 130 is disposed inside the recess 128. The lower half of the recess 128 has a semicircular shape according to the shape of the turntable 130, and the upper half of the recess 128 has a generally rectangular shape. The recess 128 opens at the upper edge of the second case member 122. FIG. 7 is a sectional view taken along the line AA in FIG.

The turntable 130 has a disk shape, and is held in the recess 128 of the first case member 120 so as to be rotatable about its central axis. A rotary drive device 132 is provided on the rotary disc 130, and the rotary disc 130 is controllably rotated by driving an electromagnetic motor (see FIG. 10) 134 of the rotary drive device 132. When the turntable 130 rotates in the forward direction, the turntable 130 shown in FIG. 5 rotates counterclockwise.

Further, as shown in FIGS. 8 and 9, a permanent magnet 140 is embedded in the facing surface 138 of the turntable 130 that faces the bottom surface 136 of the recess 128. 8 is a sectional view taken along the line BB in FIG. 5, and FIG. 9 is a sectional view taken along the line CC in FIG. Further, as shown in FIG. 5, eight permanent magnets 140 are embedded at a position near the outer edge of the rotary disk 130, and the eight permanent magnets 140 are arranged in eight equal positions.

Further, as shown in FIGS. 8 and 9, a groove 142 is formed in the mating surface 124 of the first case member 120. As shown in FIG. 5, the groove 142 is divided into an annular groove portion 144 and a downward groove portion 146. The annular groove 144 has a partial annular shape centered on the rotation axis of the rotary disk 130. The downward groove portion 146 is continuous from the end of the annular groove portion 144 and extends generally downward.

The annular groove 144 is formed at a position along the turning trajectory of the permanent magnet 140 accompanying the rotation of the turntable 130. The annular groove portion 144 extends from the lowermost end of the turning locus of the permanent magnet 140 in the direction of rotation of the turntable 130 in the forward rotation, and passes through the uppermost end of the turning locus of the permanent magnet 140 to reach the front end (the arm member 112). End of the side). On the other hand, the downward groove portion 146 is continuous from the foremost end extending downward of the annular groove portion 144 and extends downward. Then, it curves toward the front (direction toward the arm member 112) and opens in the front side surface of the first case member 120 in a substantially horizontal state. Therefore, as shown in FIGS. 8 and 9, the groove 142 includes a permanent magnet 140 embedded in the turntable 130 in a part of the groove 142 that is continuous with the annular groove 144 of the downward groove 146. opposite.

Further, the electronic component 150 is housed inside the groove 142. As shown in FIGS. 8 and 9, the depth of the groove 142 is slightly deeper than the height of the electronic component 150, and the width of the groove 142 is slightly larger than the width of the electronic component 150. Then, the electronic component 150 is housed inside the groove 142 in a posture in which the width direction thereof is the width direction of the groove 142.

Therefore, as shown in FIG. 8, a magnetic field passing through the groove 142 is formed by the permanent magnet 140, and the magnetic force of the permanent magnet 140 acts on the electronic component 150 housed in the groove 142. The first case member 120 is made of aluminum, and the turntable 130 is made of resin. Therefore, the magnetic force passes through the first case member 120 and the turntable 130, which are non-magnetic materials, and the influence on the electronic component 150 housed in the groove 142 is secured. However, as shown in FIGS. 5 and 9, a shield plate 152 is disposed between the lower groove portion 146 of the groove 142 and the permanent magnet 140, and the shield plate 152 is made of iron, specifically, , SPCC (cold rolled steel sheet). Therefore, the influence of the magnetic force on the electronic component 150 housed in the groove 142 is reduced or blocked at the position where the shield plate 152 is provided.

Specifically, as shown in FIG. 9, a recess 154 is formed in the bottom surface 136 of the first case member 120 facing the turntable 130, and the depth of the recess 154 is the thickness of the shield plate 152. It is slightly smaller than the size. The shield plate 152 is fitted into the recess 154. Therefore, the surface of the shield plate 152 opposite to the surface fitted into the recess 154 faces the permanent magnet 140 in a state of protruding from the bottom surface 136 of the first case member 120 toward the turntable 130. .. However, the shielding plate 152 and the permanent magnet 140 are separated from each other and are not in contact with each other. With such a structure, a magnetic field is formed along the shield plate 152, which is a magnetic body, and does not reach the groove 142. Therefore, the influence of the magnetic force on the electronic component 150 housed in the groove 142 is reduced or blocked at the position where the shield plate 152 is provided.

As shown in FIG. 5, the location of the shielding plate 152 is a portion extending downward of the groove 142, that is, a position facing the downward groove portion 146 and facing the turntable 130. The position. Therefore, the downward groove 146 is curved toward the arm member 112 side, and the shielding plate 152 is not arranged at a position away from the turntable 130. With such a structure, when the electronic component 150 is accommodated in the downward groove portion 146 and faces the turntable 130 in which the permanent magnet 140 is embedded, the electronic component 150 is accommodated in the downward groove portion 146. The influence of magnetic force is reduced or cut off.

Further, as shown in FIG. 7, the second case member 122 is aligned with the first case member 120 on the mating surface 155, and a recess 156 that opens to the mating surface 155 is formed. More specifically, the recess 156 is formed so as to cover the groove 142 formed in the mating surface 124 of the first case member 120. However, as shown in FIG. 5, the recess 156 is generally semi-circular in shape, and extends from the rotation axis of the turntable 130 and part of the annular groove 144, specifically, from the lowermost end of the annular groove 144. It is formed so as to extend rearward and cover the portion reaching the uppermost end. Then, the first case member 120 and the second case member 122 are fitted to each other at the mating surfaces 124 and 155, and the opening of the recess 156 is closed by the mating surface 124 of the first case member 120. As a result, the recess 156 of the second case member 122 and the mating surface 124 of the first case member 120 partition the storage portion 157.

The portion of the annular groove 144 covered by the recess 156 is open inside the recess 156, that is, in the storage 157. The annular groove 144 is formed along the turning trajectory of the permanent magnet 140, as described above. Therefore, the electronic component 150 housed in the housing 157 is housed inside the annular groove 144 by the magnetic force of the permanent magnet 140. Then, by the rotation drive device 132 being driven, the rotary disk 130 is rotated in the positive direction, so that the electronic component 150 housed in the annular groove 144 is moved in the rotational direction of the rotary disk 130.

However, the part of the annular groove 144 that is not covered by the recess 156 is closed by the mating surface 155 of the second case member 122. That is, the portion of the annular groove 144 that is not covered by the recess 156 has a tunnel shape with a rectangular cross section. Therefore, when the electronic component 150 housed inside the annular groove portion 144 reaches the tunnel-shaped annular groove portion 144 with the rotation of the turntable 130, the electronic component 150 protruding from the annular groove portion 144. Is blocked by the side wall 158 of the recess 156 from entering the tunnel-shaped annular groove 144.

Specifically, the side wall 158 of the semicircular recess 156 is erected at a right angle to the mating surface 124 where the groove 142 is formed, and the upper end of the side wall 158 is the uppermost end of the annular groove 144. It is located in the vicinity. The annular groove portion 144 located upstream of the side wall 158 is open to the storage portion 157, and the annular groove portion 144 located downstream of the side wall 158 has a tunnel shape. Therefore, the electronic component protruding from the annular groove portion 144 contacts the side wall 158 near the uppermost end of the annular groove portion 144, and is prevented from being delivered from the storage portion 157. As a result, only the electronic components properly housed in the annular groove 144 are delivered from the housing 157.

Further, as shown in FIG. 6, the arm member 112 is formed with a groove 166 which is open to the upper surface and is continuous with the downward groove portion 146 which is opened to the front side surface of the first case member 120. .. The inner size of the groove 166 is substantially the same as the inner size of the groove 142, and the electronic component 150 is also housed in the groove 166. In addition, the groove 166 is curved toward the first arm portion 114 and extends to the end surface of the first arm portion 114. A pin 162 is provided upright inside the opening of the groove 166 to the end face, and the pin 162 stops the electronic component sent out in the groove 166. That is, the position where the pin 162 is erected is the supply position of the electronic component of the bulk feeder 100.

The arm member 112 is further formed with an air groove 168 which opens to the upper surface and which is continuous with the groove 166 immediately before the pin 162 is formed. The inner dimension of the air groove 168 is smaller than the inner dimension of the groove 166, so that the electronic component 150 cannot be accommodated in the air groove 168. An air suction device (see FIG. 10) 170 is connected to the air groove 168, and the air suction device 170 sucks air from the air groove 168. As a result, air is sucked toward the position where the pin 162 is erected inside the groove 166, that is, toward the supply position, and the electronic component 150 is conveyed toward the supply position inside the groove 166.

The upper surface of the arm member 112 is covered with a cover (not shown), and the groove 166 and the air groove 168 are tunnel-shaped. Further, a cutout portion (not shown) is formed at a position where the pin 162 of the groove 166 is provided upright, that is, at a position where the supply position of the electronic component is covered, and the electronic component is cut through the cutout portion. Is supplied.

A storage portion 157 in which electronic components are stored, that is, a recess 156 formed in the second case member 122 is opened on the upper surface and the lower surface of the second case member 122, and a shutter 186 is provided in each opening. , 188 are provided. The

shutters

186 and 188 can be opened and closed by sliding. Accordingly, by opening the shutter 186, the electronic components are replenished in the storage portion 157, and by opening the shutter 188, the electronic components stored in the storage portion 157 can be discharged to the outside of the bulk feeder 100. It is possible.

In the bulk feeder 100 having the above-described structure, the electronic components are stored in the storage portion 157 in a disjointed state, and the plurality of electronic components in the dissociated state are aligned in a line and are connected to the supply position. Sent out. Specifically, the electronic components housed in the housing 157 are housed inside the annular groove 144 by the magnetic force of the permanent magnet 140. Then, the rotary drive device 132 is driven to rotate the turntable 130 in the positive direction, whereby the permanent magnet 140 is also rotated in the positive direction, and the electronic components housed in the annular groove portion 144 have the magnetic force of the permanent magnet 140. Are conveyed in the rotating direction of the turntable 130. At this time, inside the annular groove 144, a plurality of electronic components are aligned in a row and are in a continuous state.

When the electronic component housed inside the annular groove portion 144 reaches the tunnel-shaped annular groove portion 144 with the rotation of the turntable 130, the electronic component protruding from the annular groove portion 144 becomes It abuts the side wall 158. As a result, the electronic component contacting the side wall 158 falls below the storage portion 157. Then, only the electronic components properly accommodated in the annular groove portion 144 further move in the annular groove portion 144 as the turntable 130 rotates.

Further, as the turntable 130 rotates, the electronic components are transported from the inside of the annular groove 144 to the inside of the downward groove 146. As described above, in the downward groove portion 146, the shielding plate 152 is disposed between the first case member 120 in which the downward groove portion 146 is formed and the turntable 130 in which the permanent magnet 140 is embedded. The influence of magnetic force is reduced or cut off. Therefore, the electronic component 150 is not transported by the magnetic force of the permanent magnet 140 in the downward groove 146. However, since the downward groove portion 146 extends downward, the electronic component 150 falls downward due to its own weight inside the downward groove portion 146.

Also, the lower end of the downward groove 146 from which the electronic component 150 falls is curved forward. Therefore, the closer the electronic component 150 is to the lower end of the downward groove 146, the lower the drop speed of the electronic component 150 due to its own weight. However, as described above, the air groove 168 is connected to the groove 166 communicating with the lower end portion of the downward groove portion 146, and the air is sucked from the groove 166 via the air groove 168. Therefore, in the downward groove portion 146, the electronic component 150 that has dropped due to its own weight is conveyed toward the groove 166 by suction of air. That is, the conveyance of the electronic component 150 is secured by the suction of air on the downstream side of the downward groove portion 146. Then, the electronic component 150 is conveyed toward the air groove 168 by suction of air in the groove 166, so that the electronic component 150 is finally erected at the opening of the groove 166 to the end surface of the first arm portion 114. Abut on the pin 162. As a result, in the bulk feeder 100, the plurality of electronic components housed in a disjointed state are delivered to the supply position in a state where they are aligned in one row.

In the bulk feeder 100, the shield plate 152 is disposed in the downward groove portion 146 between the first case member 120 in which the downward groove portion 146 is formed and the turntable 130 in which the permanent magnet 140 is embedded. By reducing or blocking the influence of (1), proper transportation of the electronic component 150 is ensured. Specifically, in the conventional bulk feeder, the shield plate 152 is not provided in the downward groove portion 146 between the first case member 120 and the turntable 130. For this reason, the magnetic force of the permanent magnet 140 acts on the electronic component 150 also in the downward groove portion 146. Then, in the downward groove portion 146, when the electronic component 150 falls due to its own weight, a magnetic force acts on the falling electronic component 150, which prevents the electronic component 150 from falling due to its own weight. Therefore, in the conventional bulk feeder, the dropping speed of the electronic component 150 is reduced, and even if the air is sucked in the groove 166, the electronic component 150 may stay at the lower end of the downward groove 146. On the other hand, in the bulk feeder 100, the shield plate 152 is disposed between the first case member 120 and the turntable 130 in the downward groove portion 146, and the influence of the magnetic force on the downward groove portion 146 is reduced or blocked. As a result, proper transportation of the electronic component 150 is ensured.

Further, the bulk feeder 100 is fixed to the mounting head 26, and the suction nozzle 80e located at the suction station of the plurality of suction nozzles 80 is located above the tip of the groove 166 that is the supply position of the bulk feeder 100. To do. As a result, the suction nozzle 80e located at the suction station is moved downward by the unit elevating device 104, and the electronic component 150 conveyed to the supply position of the bulk feeder 100 is suction-held by the suction nozzle 80e.

Further, the mounting machine 16 includes a control device 190 as shown in FIG. The control device 190 includes a controller 192, a plurality of drive circuits 194, and an image processing device 196. The plurality of drive circuits 194 include the

electromagnetic motors

46, 52, 54, 134, the substrate holding device 48, the feeding device 76, the positive/negative pressure supply device 84, the holder rotating device 90, the unit rotating device 102, the unit elevating device 104, and the air. It is connected to the suction device 170. The controller 192 includes a CPU, a ROM, a RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 194. As a result, the operations of the transport device 22, the moving device 23, etc. are controlled by the controller 192. The controller 192 is also connected to the image processing device 196. The image processing device 196 processes the image data obtained by the parts camera 96 and the mark camera 98, and the controller 192 acquires various information from the image data.

With the above-described configuration, the mounting machine 16 performs mounting work for mounting electronic components on the circuit board. Specifically, according to a command from the controller 192, the circuit board is conveyed to the work position by the

conveyor devices

40 and 42, and is held by the board holding device 48 at that position. Next, the mounting head 26 is moved above the circuit board by the operation of the moving device 23, and the mark camera 98 images the circuit board. Then, based on the imaged data obtained by the image pickup, the controller 192 calculates a holding position error of the circuit board by the

conveyor devices

40 and 42.

Further, in the bulk feeder 100, the electronic component 150 is conveyed toward the supply position according to the procedure described above, and is conveyed to the supply position of the bulk feeder 100 by the suction nozzle 80 located at the suction station of the mounting head 26. The electronic component 150 is held. When the electronic component 150 is held by the suction nozzle 80, the unit holder 86 rotates, and the suction nozzle that does not hold the electronic component 150 moves to the suction station. Therefore, the suction nozzle that has newly moved to the suction station holds the electronic component from the supply position of the bulk feeder 100. As described above, in the mounting head 26, each time the electronic component is held by the suction nozzle 80 from the bulk feeder 100, the unit holder 86 is sequentially rotated, and the suction nozzle located at the suction station removes the electronic component from the bulk feeder 100. It is held in sequence. Further, when the suction nozzle 80 holding the electronic component moves to the imaging station as the unit holder 86 rotates, the electronic camera held by the suction nozzle 80 is imaged by the parts camera 96 in the imaging station. It Then, the controller 192 calculates an error in the holding position of the electronic component by the suction nozzle 80 based on the imaged data obtained by the image pickup. Since the bulk feeder 100 is fixed to the mounting head 26, the parts can be held from the bulk feeder 100 even when the mounting head 26 is moving, so that the cycle time can be shortened. It is possible.

Further, when the mounting head 26 holds the required number of electronic components from the bulk feeder 100, the mounting head 26 moves above the circuit board, and the mounting unit 82 located at the mounting station descends due to the operation of the unit elevating device 104. As a result, the electronic component 150 held by the suction nozzle 80 of the mounting unit 82 is mounted on the circuit board. It should be noted that the mounting work of the electronic component on the circuit board is executed in consideration of the previously calculated error in the holding position of the electronic component and the error in the holding position of the circuit board.

In the above embodiment, the bulk feeder 100 is an example of the component transfer device and the component supply device. The first case member 120 is an example of a case. The permanent magnet 140 is an example of a magnet. The groove 142 is an example of a transport path. The downward groove portion 146 is an example of a descending region. The shield plate 152 is an example of a magnetic force reduction mechanism and a shield plate. The air suction device 170 is an example of an air suction device.

Further, the present invention is not limited to the above-mentioned embodiments, but can be carried out in various modes with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, although iron is used as the material of the shielding plate 152 in the above-described embodiment, various magnetic materials such as participating chromium and cobalt can be used. Further, the material is not limited to the magnetic material, and a non-magnetic material may be adopted as the material of the shield plate 152. However, when a non-magnetic material is used as the material of the shield plate 152, it is necessary to increase the thickness dimension of the shield plate 152 to some extent.

Further, in the above embodiment, the magnetic force affecting the downward groove portion 146 is reduced or blocked by the shield plate 152, but even if the magnetic force affecting the downward groove portion 146 is reduced or blocked by various mechanisms. Good. Specifically, for example, a mechanism may be adopted in which the distance between the path of the permanent magnet 140 and the groove 142 is different between the annular groove portion 144 and the downward groove portion 146. That is, the distance between the path of the permanent magnet 140 and the downward groove 146 may be longer than the distance between the path of the permanent magnet 140 and the annular groove 144. Alternatively, a magnet whose strength of magnetic force can be changed may be employed, and the magnetic force of the magnet may be increased in the path corresponding to the annular groove 144 and the magnetic force of the magnet may be decreased in the path corresponding to the downward groove 146. With this configuration, the same effect as when the shielding plate 152 is provided can be obtained.

In addition, in the above-described embodiment, the shield plate 152 is arranged corresponding to the downward groove 146 where the electronic component falls by its own weight, but the shield plate 152 can be arranged in various areas. Specifically, for example, when there is a region in the groove 142 where electronic components are conveyed by suction or ejection of air, the shielding plate 152 may be arranged corresponding to the region. By disposing the shielding plate 152 in this manner, the transfer of electronic components by suction or ejection of air is not blocked by the magnetic force, so that proper transfer of electronic components by suction or ejection of air is ensured.

Further, in the above-described embodiment, the electronic component is conveyed by the suction of air on the downstream side of the downward groove portion 146. However, by various methods such as jetting of air, vibration, and inclination of the conveyance route of the electronic component, Electronic components may be transported.

Also, the objects conveyed using the above method are not limited to electronic parts, and the present invention can be applied to the conveyance of various objects. Furthermore, in the above embodiment, the present invention is applied to the bulk feeder 100 that conveys electronic components to the supply position, but it may be applied to a component feeder such as a ball feeder or a stick feeder. Further, the present invention is not limited to the component supply device, and the present invention may be applied to a device that simply conveys a component, a device that conveys a component for a purpose different from the component supply, and the like.

100: Bulk feeder (parts transfer device) (parts supply device) 120: First case member (case) 140: Permanent magnet (magnet) 142: Groove (transfer route) 146: Downward groove part (falling area) 152: Shielding plate (Magnetic force reduction mechanism) 170: Air suction device

Claims

A case in which a conveyance path for conveying a plurality of parts in a row is formed,
A magnet that is arranged so as to be movable along the transport path and that transports the component in the transport path by magnetic force;
In a predetermined area of the transfer path, a magnetic force reduction mechanism that is disposed between a magnet that moves along the predetermined area and the case and that reduces the influence of the magnetic force on the predetermined area. apparatus.
The parts conveying device according to claim 1, wherein the predetermined area is an area where parts are conveyed by means other than magnetic force.
The transport path includes a descending region that is a region extending downward,
The component transfer device according to claim 1, wherein the predetermined region is the descending region.
The magnetic force reduction mechanism,
In a predetermined area of the transport path, a shield plate is provided between a magnet that moves along the predetermined area and the case, and the shield plate prevents an influence of a magnetic force on the predetermined area. The component transfer device according to claim 1, wherein the component transfer device is lowered.
The magnet is arranged so as to be movable along the transport path to the predetermined area,
5. An air suction device, which is disposed on the downstream side of the predetermined region and which conveys the component downstream from the predetermined region by sucking air from the conveyance path. The component transfer device according to one.
The transfer path is configured to transfer a component to a predetermined position,
The component transfer device according to any one of claims 1 to 5, which functions as a component supply device that supplies a component that has been transferred to the predetermined position.