JPS574131A - Device for mounting of semiconductor chips - Google Patents

Device for mounting of semiconductor chips

Info

Publication number
JPS574131A
JPS574131A JP7721780A JP7721780A JPS574131A JP S574131 A JPS574131 A JP S574131A JP 7721780 A JP7721780 A JP 7721780A JP 7721780 A JP7721780 A JP 7721780A JP S574131 A JPS574131 A JP S574131A
Authority
JP
Japan
Prior art keywords
semiconductor chips
camera
tray
whereon
placing section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7721780A
Other languages
Japanese (ja)
Other versions
JPS6257098B2 (en
Inventor
Kimio Koike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Avionics Co Ltd
Original Assignee
Nippon Avionics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Avionics Co Ltd filed Critical Nippon Avionics Co Ltd
Priority to JP7721780A priority Critical patent/JPS574131A/en
Publication of JPS574131A publication Critical patent/JPS574131A/en
Publication of JPS6257098B2 publication Critical patent/JPS6257098B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

PURPOSE:To obtain the mounting device suitable for the production of multikind semiconductor chips in a small quantity by a method wherein a face-down bonding type mounting device is constituted with a transparent plate whereon a semiconductor chips will be placed, an X-Y positioning device, a TV camera, a monitoring device and the like. CONSTITUTION:A positioning and mounting structure 10 for semiconductor chips is provided on a frame 1 to be used for installation of various component parts and on which an X-Y positioning device 12, whereon a transparent tray 11 to be used for placing of a plurality of semiconductor chips is installed in hood form, is provided. Also, on the lower surface of the tray 11, the first TV camera 16 providing lenses 15 which are facing each other, an X, Y, theta positioning device 18, having a substrate placing section 17 at the upper end, and the like are provided. Further, on the upper surface of the placing section 17, the second TV camera 22 whereon lenses 21 are faced each other and vacuum attracting and carrying device 24, which will perform a reciprocatory movement between the tray 11 and the placing section 17 and also performs a vertical movement on the optical axis of the first and second cameras, are provided. Then, a monitor TV31, controllers 32 and 33, a synchronized signal distributor 53 and the like are installed for the purpose of controlling above-mentioned camera 22 and the device 24.
JP7721780A 1980-06-10 1980-06-10 Device for mounting of semiconductor chips Granted JPS574131A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7721780A JPS574131A (en) 1980-06-10 1980-06-10 Device for mounting of semiconductor chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7721780A JPS574131A (en) 1980-06-10 1980-06-10 Device for mounting of semiconductor chips

Publications (2)

Publication Number Publication Date
JPS574131A true JPS574131A (en) 1982-01-09
JPS6257098B2 JPS6257098B2 (en) 1987-11-30

Family

ID=13627670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7721780A Granted JPS574131A (en) 1980-06-10 1980-06-10 Device for mounting of semiconductor chips

Country Status (1)

Country Link
JP (1) JPS574131A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5972145A (en) * 1982-10-19 1984-04-24 Shinkawa Ltd Device and method for flip chip bonding
JPS59117225A (en) * 1982-12-24 1984-07-06 Hitachi Tokyo Electronics Co Ltd Face down bonding device
JPS601900A (en) * 1983-06-17 1985-01-08 松下電器産業株式会社 Device for mounting electronic part with recognition

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5972145A (en) * 1982-10-19 1984-04-24 Shinkawa Ltd Device and method for flip chip bonding
JPH0212024B2 (en) * 1982-10-19 1990-03-16 Shinkawa Kk
JPS59117225A (en) * 1982-12-24 1984-07-06 Hitachi Tokyo Electronics Co Ltd Face down bonding device
JPH0380346B2 (en) * 1982-12-24 1991-12-24 Hitachi Tokyo Erekutoronikusu Kk
JPS601900A (en) * 1983-06-17 1985-01-08 松下電器産業株式会社 Device for mounting electronic part with recognition
JPH0322720B2 (en) * 1983-06-17 1991-03-27 Matsushita Electric Ind Co Ltd

Also Published As

Publication number Publication date
JPS6257098B2 (en) 1987-11-30

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