JPS59117225A - Face down bonding device - Google Patents

Abstract

PURPOSE:To obtain a face down bonding device enabled to attain enhancement of efficiency of work, and suitable for automation by a method wherein a mark to be used as the reference is arranged on an image or a picture recognized visually, and the respective pictures of a connecting matter and a matter to be connected are overlapped on the referential mark thereof to perform positioning. CONSTITUTION:The electronic lines 14 of two longtudinal lines and two lateral lines are drawn respectively in parallel mutually on the picture of a monitor television 10, and a mark consisting of a square frame is provided at the center of the picture. The square frame thereof is settled at the position of the tip image of a supporting tool to be used as the referential mark 15. Positioning at the positioning mechanism thereof can be attained only by transferring a substrate pattern 12 and a chip pattern 13 to the referential mark 15, and overlapping both the patterns. Accordingly, action to move the supporting tool at positioning time is unnecessitated, and positioning work can be completed at once. Therefore, workability is enhanced, and automation can be attained because the operation of the device is simple.

Description

[Detailed description of the invention] The present invention relates to a face-down bonder.

As shown in Fig. 1, one of the structures for connecting the electrodes of a chip (circuit element) and an external lead in a semiconductor device is to raise the electrode of the tip 1 to form a bump electrode 2. So-called face-down bonding is known in which the electrode 2 is connected directly to the wiring layer 4 of the wiring board 3 by overlapping it.A face-down bonder is used for this bonding.

In this face-down bonder, it is necessary to align the substrate pattern and the chip pattern.

In this case, as the positioning mechanism, there is a method using an optical system using a half mirror (not shown), and a method using an optical system using a half mirror (not shown),
There is a method that uses image processing using two industrial television cameras (ITV), as shown in al and (bl).

That is, when the substrate 3 is placed on the table 5, the trap,
The chip 1 is placed on a transparent Galanu plate 6 with its bump electrode portion pressed downward, the pattern of the substrate 3 is copied by the first ITV 7, the pattern of the step 1 is copied by the second ITV 8, and by image processing, As shown in FIG. 2(b), both patterns 12 and 13 are visually recognized on the monitor television 10.

Then, after positioning (overlapping) the chip pattern 13 or the substrate pattern 12 at the position of the drop point 11 of the support tool 9 that holds the chip l at the lower end by vacuum suction, the support tool 9 overlaps the tip 1 on the substrate 3. Each connection section is connected using heat. At this time, the upper surface of the chip 1 is held by suction by the support tool 9. Further, alignment is performed by moving or rotating the support tool 9, the transparent glass plate 6, and the table 5 in the XY directions.

By the way, conventionally, in this positioning procedure, the supporting tool 9 is first moved to face the transparent glass plate 6 as shown in FIG. Project it in the center of the screen of 10. Thereafter, the movement of the table 5 is controlled so that the support tool tip image 11 and the substrate pattern 12 projected on the monitor television 10 by the first TV 7 are superimposed and aligned.

Next, after moving the support tool 9 as shown in FIG. to align.

In this way, conventionally, a method has been used in which the reference pattern is sequentially changed to perform alignment. However, with this method, alignment is performed less than once (twice) in one process, which poses a serious obstacle to improving work efficiency and automating the process.

Therefore, an object of the present invention is to provide a 7-eighth downponder having a structure that can improve work efficiency and is also suitable for automation.

In order to achieve such an object, the present invention has a structure in which a reference mark is arranged on a visually recognized image or screen, and each connected object and connected object image is aligned with this reference mark. The present invention, which is a bonder having an alignment mechanism, will be explained below with reference to Examples.

FIG. 4 shows an alignment mechanism for a 7-eighth down bonder according to one embodiment of the present invention. As shown in the figure, two parallel electronic lines 14 and two horizontal lines 14 are drawn on the screen of a monitor television 10, and a mark consisting of a rectangular frame is provided at the center of the screen.

In this alignment mechanism, this square frame mark is set at the position of the support tool tip image and serves as the reference mark 15.
Alignment can be performed simply by moving the substrate pattern 12 and chip pattern 13 to the reference mark 15 and overlapping both patterns.

According to such an embodiment, the operation (operation) of moving the support tool during alignment is unnecessary, and the operation can be performed in one time.
The alignment work can be completed. Therefore, work efficiency is improved, and since the operation is simple, automation is also possible.

Note that the present invention is not limited to the above embodiments. for example,
The eyepiece micro may be used as a reference mark. Further, the reference mark may have other shapes. Furthermore, it goes without saying that the connecting object and the connected object may be other than substrates and chips.

As described above, according to the present invention, opposing objects only need to be aligned once, and work efficiency can be improved.

It also makes automation easier.

[Brief explanation of drawings]

Figure 1 is a front view showing the face-down structure, Figure 2 (a
), (b) are schematic diagrams showing the alignment mechanism in a conventional face-down bonder, and FIGS. 3(a) and (bl are,
FIG. 4 is a schematic diagram showing a conventional alignment method. FIG. 4 is a schematic diagram showing a face-down bonder alignment method according to an embodiment of the present invention. 1... Chip, 2... Bump electrode, 3... Substrate,
4... Wiring layer, 5... Table, 6... Transparent glass, 7... First ITV (1), 8... Second
ITV (2), 9...Support tool, 10...
・Monitor TV, 11...Support tool tip image, 13・
...Chip pattern, 12...Substrate turn, 14
...Electronic line, 15...Reference mark.

Claims (1)

[Claims] Face-down method that simultaneously recognizes the patterns of the connecting object and the connected object that face each other, aligns the connecting object and the connected object, then superimposes both patterns, and then connects the connecting object and the connected object. In the bonder, a reference mark is installed in a screen where both the patterns can be recognized at the same time, and the bonding object and the object to be connected are aligned by aligning both patterns with the reference mark. Down bonder.