JPS6417162A - Packing check device for surface packing substrate - Google Patents

Abstract

PURPOSE:To ensure a accurate packing check despite of the warp of a substrate by projecting slit light rectangularly onto a substrate containing a parts to be checked over the entire length of the substrate surface. CONSTITUTION:A parts 5 to be checked is packed onto a substrate and this substrate is put on a measurement table which can freely move in the X-Y vertical direction and also can freely turn. While the projecting devices 30 and 31 are set above the measurement table to radiate the slit light of large width through a light source, i.e. a semiconductor laser. Then two cameras 20 and 21 containing image sensors are set so that the line connecting two cameras is set rectangular to the line connecting two devices 30 and 31. A piece of light cutting line P is formed on the upper surface of the parts 5 through the surface of a soldering junction part 10 with irradiation of the slit beams of both devices 30 and 31. The video signals of the line P photographed by cameras 20 and 21 undergo the picture processing for decision of the defects and the position errors of the parts 5 as well as the quality of the part 10.