JPS5346278A - Inspection method of semiconductor element connecting lead frames - Google Patents
Inspection method of semiconductor element connecting lead framesInfo
- Publication number
- JPS5346278A JPS5346278A JP12138876A JP12138876A JPS5346278A JP S5346278 A JPS5346278 A JP S5346278A JP 12138876 A JP12138876 A JP 12138876A JP 12138876 A JP12138876 A JP 12138876A JP S5346278 A JPS5346278 A JP S5346278A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- inspection method
- lead frames
- element connecting
- connecting lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE: To accurately inspect the deformation, irregularities, etc. of leads by projecting a lead frame on a screen superposing a mask formed with slits in alignment to this lead image position and detecting the light quantities transmitting through the slits thereof.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12138876A JPS5346278A (en) | 1976-10-08 | 1976-10-08 | Inspection method of semiconductor element connecting lead frames |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12138876A JPS5346278A (en) | 1976-10-08 | 1976-10-08 | Inspection method of semiconductor element connecting lead frames |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5346278A true JPS5346278A (en) | 1978-04-25 |
Family
ID=14809954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12138876A Pending JPS5346278A (en) | 1976-10-08 | 1976-10-08 | Inspection method of semiconductor element connecting lead frames |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5346278A (en) |
-
1976
- 1976-10-08 JP JP12138876A patent/JPS5346278A/en active Pending
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