JPS5346278A - Inspection method of semiconductor element connecting lead frames - Google Patents

Inspection method of semiconductor element connecting lead frames

Info

Publication number
JPS5346278A
JPS5346278A JP12138876A JP12138876A JPS5346278A JP S5346278 A JPS5346278 A JP S5346278A JP 12138876 A JP12138876 A JP 12138876A JP 12138876 A JP12138876 A JP 12138876A JP S5346278 A JPS5346278 A JP S5346278A
Authority
JP
Japan
Prior art keywords
semiconductor element
inspection method
lead frames
element connecting
connecting lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12138876A
Other languages
Japanese (ja)
Inventor
Masao Hino
Hiroshi Osabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12138876A priority Critical patent/JPS5346278A/en
Publication of JPS5346278A publication Critical patent/JPS5346278A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To accurately inspect the deformation, irregularities, etc. of leads by projecting a lead frame on a screen superposing a mask formed with slits in alignment to this lead image position and detecting the light quantities transmitting through the slits thereof.
COPYRIGHT: (C)1978,JPO&Japio
JP12138876A 1976-10-08 1976-10-08 Inspection method of semiconductor element connecting lead frames Pending JPS5346278A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12138876A JPS5346278A (en) 1976-10-08 1976-10-08 Inspection method of semiconductor element connecting lead frames

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12138876A JPS5346278A (en) 1976-10-08 1976-10-08 Inspection method of semiconductor element connecting lead frames

Publications (1)

Publication Number Publication Date
JPS5346278A true JPS5346278A (en) 1978-04-25

Family

ID=14809954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12138876A Pending JPS5346278A (en) 1976-10-08 1976-10-08 Inspection method of semiconductor element connecting lead frames

Country Status (1)

Country Link
JP (1) JPS5346278A (en)

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