JPS6249417A - Positioning device - Google Patents

Abstract

PURPOSE:To execute positioning with a high accuracy without bending a leas by scanning the lead of a flat pack IC by non-contact, and calculating a position shift quantity of the IC. CONSTITUTION:A vision sensor 1 scans a lead part of one side of a flat pack IC 6, and a sensor means 2 discriminates the lead part and a background part and outputs a binary-coding signal. A lead bend deciding/lead center calculating means 3 calculates a position of each lead, based on the binary-coding signal, sets an average value as a center value of the lead part, and subsequently, calculates a difference between this center value and the position of each lead, and when this value is smaller than a prescribed value with respect to all the leads, it is decided that there is no lead bend. Next, the flat pack IC is moved by a three-spindle control position correcting means 5, and with respect to other three sides, as well, the same processing is executed. Subsequently, in a position shift quantity calculating means 4, a center value of the whole flat pack IC is calculated from center values of the lead parts of four sides, which are calculated, a difference from the prescribed value is set as a shift quantity, and a shift quantity of an angle is also calculated. Next, the three-spindle control position correcting means 5 corrects the calculated shift quantity portion by using a three-spindle control table, and executes positioning of the flat pack IC.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an alignment device, particularly for flat pack ICs.
The present invention relates to an alignment device that detects a positional shift of an IC and corrects the position when it is mounted on a board.

[Conventional technology]

Conventionally, this type of alignment has been carried out by pressing the outer shape of the flat IC against a mechanical reference surface to correct the position.

[Problem that the invention seeks to solve]

The above-mentioned conventional alignment device corrects the position by pressing the outer shape of the flat pack IC against a mechanical reference surface, and therefore has the drawback that lead bending is likely to occur. Furthermore, since the external shape of the lead is used as a standard, there is a drawback that the positioning accuracy is not higher than the accuracy of the lead external shape. Another drawback was that lead bending could not be detected.

The present invention provides a positioning device that corrects the position without bending the lead and performs highly accurate positioning.

[Failure to solve the problem]

The alignment device of the present invention includes a visual sensor that scans the lead portion of a flat pack IC in a non-contact manner, and a sensor unit that outputs a sense signal depending on whether or not the visual sensor is responsive.
Means for counting the number of leads of the flat A'-tsuku IC based on the sense signal, calculating the center of each lead, determining lead bending, and calculating the center of the lead part, zJ? It is characterized by having means for calculating the amount of deviation in the vertical and horizontal directions and the amount of angular deviation of the Tsuku IC in the horizontal plane, and means for correcting the position of the three-axis control based on the amount of deviation. be.

〔Example〕

Next, an embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, visual sensor 1 is a flat mother.

The sensor means 2 scans the lead part on one side of the IC 6, identifies the lead part and the background part, and outputs a binary signal. The lead portion determination and lead center calculation means 3 calculates the position of each lead based on the binary signal, and uses the average value of the positions of each lead as the center value of the lead portion on that side. Next, the difference between this center value and the position of each lead is calculated, and when this value is smaller than the specified value for all the leads, it is determined that the lead portion on that side is absent.

Next, the flat hack IC is
, and perform the same process as above for the other three sides.

Next, the positional deviation amount calculation means 4 calculates the flat and elbow IC from the center values of the lead portions on the four sides calculated as described above.
Calculate the overall center value, take the difference from the specified value as the amount of deviation,
The amount of angular deviation is also calculated.

Next, the three-axis control position correction means 5 corrects the amount of deviation calculated as described above using the three-axis control table, and aligns the flat grip IC.

〔Effect of the invention〕

As explained above, the present invention scans the leads of a flat pack IC in a non-contact manner and calculates the amount of positional deviation of the IC, thereby making it possible to correct the position without bending the leads.
At the same time, the lead portion can also be detected, and since the position of the flat 9-touch IC is calculated from the position information of all leads, it is possible to achieve highly accurate positioning that is less affected by local deformation of the leads. There is.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing one embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Visual sensor, 2... Sensor means, 3... Lead portion judgment, lead center calculation means, 4... Position deviation amount calculation means, 5... 3-axis control position correction means, 6 ...
Flood Pack IC0 Figure 1

Claims (1)

[Claims] (1) A visual sensor that non-contact scans the lead portion of a flat pack IC, a sensor means that outputs a sense signal depending on whether or not the visual sensor is sensitive, and a number of leads of the flat pack IC based on the sense signal. calculation means for determining lead bending and calculating the center of each lead by counting the center of each lead; a positional deviation calculation means for calculating the vertical and horizontal deviations and angular deviations in the horizontal plane of the flat pack IC based on calculations; and a position correction means for correcting the position of the three-axis control based on the deviations. An alignment device comprising: