JPH07326897A - Electronic part mounting system capable of changing posture of electronic part - Google Patents

Abstract

PURPOSE:To shorten the cycle time of a device to mount an electronic part on a printed board by detecting through an image the holding posture of the electronic part by means of a part holding head and correcting a posture error. CONSTITUTION:A part holding head is held, at an interval of an intermittent angle of revolution, revolvable around the vertical axis, to a head holding body intermittently revolving around the vertical axis. A posture detecting device 140 and a head revolving device 142 are, respectively, set up at a posture detecting position C, which is a stop position between a part receiving position A and a part mounting position G, and a posture change position E. The head revolving device is revolved as the part holding head is revolved to an angle determined according to posture detecting information of an electronic part to correct a holding posture error. The cycle time of the mounting device is shortened by simultaneously performing, at each stop position, the holding and mounting of the electronic part by the part holding head, posture detection at the electronic part by the posture detection device, and the correction of the posture error by the head revolving device.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting system for mounting an electronic component on a base material such as a printed circuit board, and more particularly, it is equipped with a plurality of component holding heads and held by each component holding head. The present invention relates to an electronic component mounting system having a function of changing a rotation posture of an electronic component around an axis of a component holding head.

[0002]

2. Description of the Related Art A plurality of component holding heads are attached to a head holder that rotates intermittently around a vertical axis by a constant angle at angular intervals equal to the constant angle. There is already known an electronic component mounting system that receives an electronic component at a component receiving position that is and mounts the electronic component on a base material such as a printed circuit board at another component mounting position that is a stop position. According to such a system, electronic components can be sequentially mounted on the base material by a plurality of component holding heads that move in one direction along one circumference with the intermittent rotation of the head holder, and the cycle time can be reduced. It can be shortened and the efficiency of component mounting work can be improved.

Further, changing the rotational posture of an electronic component held by a component holding head about the axis of the component holding head in an electronic component mounting system is disclosed in Japanese Patent Laid-Open No. 58-21.
It is already known from Japanese Patent No. 3496. In the electronic component mounting system described in this publication, a suction head, which is a component holding head, is attached to a head holder in a state in which it can rotate around the axis of a suction tube that sucks and holds electronic components. The rotation posture of the electronic component sucked by the suction pipe around the suction pipe axis is detected by the imaging device, and the head rotation device rotates the suction head by a predetermined angle based on the detection result, thereby changing the rotation posture of the electronic component. It is supposed to be done. According to such a system, the electronic component can be mounted on a base material such as a printed circuit board after correcting the error in the holding posture of the electronic component by the suction head, so that the mounting accuracy of the electronic component can be improved.

[0004]

However, in the electronic component mounting system described in the above publication, the component holding head receives the electronic component, the posture detection and posture change of the received electronic component, and Since the mounting is performed at the same position, the cycle time for mounting one electronic component becomes long, and there is a problem that the efficiency of component mounting work can be suppressed to a low level. The present invention has been made to solve the problem.

[0005]

SUMMARY OF THE INVENTION And, the gist of the present invention is to provide a head holder which is intermittently rotated by a constant angle around a vertical axis and is rotated at the same angular interval as the intermittent rotation angle and around the vertical axis. A plurality of component holding heads are attached as much as possible, each component holding head receives the electronic component from the component supply device at the lower end at the component receiving position which is one of the stop positions of the plurality of component holding heads,
In an electronic component mounting system that mounts electronic components on a substrate such as a printed circuit board that is positioned by a substrate positioning device at a component mounting position that is another stop position, the movement of the component holding head from the component receiving position to the component mounting position An attitude detection device that detects the rotational attitude of the electronic component held by the component holding head around the axis of the component holding head by imaging is provided at one of the plurality of stop positions existing in the path, and the stop position is set. At the posture detection position, and while the component holding head that has passed the posture detection position moves to the component mounting position, rotate the component holding head by an angle determined based on the posture information of the electronic component obtained by the posture detection device. The present invention is characterized in that a head rotating device is provided.

[0006]

In the electronic component mounting system configured as described above, the plurality of component holding heads are sequentially moved to the component receiving position, the posture detection position and the component mounting position with the intermittent rotation of the head holder. Then, at the component receiving position, the component holding head receives the component from the component supply device, and at the posture detection position, the posture detecting device detects the posture of the electronic component held by the component holding head by imaging, and based on the detection result. The head rotating device rotates the component holding head to the component mounting position to change the attitude of the electronic component, and the electronic component whose attitude has been changed is mounted on the base material at the component mounting position.

[0007]

In the electronic component mounting system according to the present invention, the holding posture of the electronic component is detected by the posture detecting device as described above, and the component holding head is detected by the head rotating device based on the information obtained as a result. It is rotated to correct the posture error and then mounted on a substrate such as a printed circuit board. Moreover, since the component holding head receives the electronic component, the posture detecting device detects the posture of the electronic component, the head rotating device changes the posture of the electronic component, and the component holding head mounts the electronic component on the base material in parallel. The cycle time for mounting one electronic component is shortened, and the efficiency of component mounting work is improved.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1 shows the appearance of an electronic component mounting system that is an embodiment of the present invention. The electronic component mounting system includes a main body frame 10, a component supply device 12, and a board loading device 1.
4, a substrate unloading device 16, a substrate positioning device 18, a mounting device 20, and the like. The component supply device 12 is configured such that a large number of component supply units 32 are arranged adjacent to each other in the moving direction of the moving base 30 on a moving base 30 movably supported by the main body frame 10 along a straight line. Each component supply unit 32 holds one type of taping electronic component, and is moved to a position directly facing the mounting device 20 by the movement of the moving table 30 to supply one electronic component at a time. However, since it is well known, detailed description will be omitted.

The printed circuit board on which the electronic parts are mounted is carried in by the board carry-in device 14 and is mounted in the board positioning device 18 by a loading device (not shown). In this embodiment, the printed circuit board is the base material,
The substrate positioning device 18 is a base material positioning device.

The substrate positioning device 18 is provided with a substrate support base 36, which is mounted on an XY table movable in the X-axis direction parallel to the moving direction of the moving base 30 and in the Y-axis direction perpendicular thereto. It is installed and supports the printed circuit board at an accurate position and positions it at an arbitrary position on the XY plane. Then, the mounting device 20 sequentially mounts the electronic components received from the component supply device 12 on the positioned printed circuit board, and the printed circuit board on which all the components have been mounted is removed by an unloading device (not shown), and the substrate unloading device 16 Be carried out by. These operations are controlled by the controller 22. The control device 22 is mainly composed of a computer, and controls each device based on a program stored in a memory of the computer and information provided from the outside by a magnetic disk, a magnetic tape, or the like. An operation panel 40 attached to the control device 22 and a display 4 for displaying operation instructions of the operation panel 40, input data, operation status of each device, and the like.
2 and a monitor television 44 for an operator to monitor the posture of the electronic component held by a suction head (described later) as a component holding head. These substrate loading devices 1
4, the substrate unloading device 16, the substrate positioning device 18, the control device 22, the operation panel 40, the display 42, the monitor TV 44 and the like are well known, so a detailed description thereof will be omitted, and the mounting device 20 will be described below. To do.

As is apparent from FIG. 2, the mounting device 20 includes a rotary shaft 50 rotatably held by the main body frame 10 about a vertical axis. This rotating shaft 5
A rotary plate 52 is fixed to the upper end portion of 0.
Twelve cam followers 54 are attached to the outer periphery of the cam follower at equal angular intervals, and these cam followers 54 are adapted to engage with a cam 56 that rotates around a horizontal axis. As a result, the rotating plate 52 and the rotating shaft 50 are intermittently rotated by 30 degrees each time the cam 56 makes one rotation.

A head holder 58 is provided at the lower end of the rotary shaft 50.
Are fixed, and 12 sets of suction head units 60 are attached to the head holder 58 at equal angular intervals. All of these suction head units 60 have the structure shown in FIGS. As is apparent from FIG. 3, two rods 62, which are paired with each other, are attached to the outer peripheral portion of the head holding body 58 in a vertical posture and axially movable, and both ends thereof are connected to the connecting member 63. And 64 are connected to each other. Upper connecting member 63
A cam follower 65 is attached to the cam follower 65, and the cam follower 65 is engaged with the cam 66 shown in FIG. The cam 66 is fixed to the body frame 10,
Since the outer peripheral surface is provided with the annular cam groove 67 formed to be inclined with respect to the horizontal plane, the rod 62 is moved up and down as the head holding body 58 rotates.

The lower connecting member 64 has a shaft member 68.
The arm 69 is attached rotatably about a vertical axis by the arm 69. As is clear from FIG. 4, the suction head 70 as a component holding head is attached to the arm 69.
Individually installed. The suction head 7 of this arm 69
Two positioning bushes 72 are attached to the end opposite to the side to which 0 is attached. The two suction heads 70 and the positioning bushes 72 are provided on each one arc centered on the rotation center line of the arm 69, and each center line and the arm 6 are provided.
It is arranged so that the angles formed by the straight lines connecting the rotation center lines of 9 are equal to each other. Further, as is apparent from FIG. 5, a positioning pin 74 is slidably fitted in the connecting member 64 in the vertical direction and is urged downward by a spring 76. A taper hole is formed at the upper end of the positioning bush 72, and a taper is formed at the lower end of the positioning pin 74. These are engaged with each other by the biasing force of the spring 76, whereby the arm 69 rotates. Of the two suction heads 70, which is suitable for the intended electronic component, is selectively fixed to the operating position. The engagement between the positioning pin 74 and the positioning bush 72 is released when the operating member 78 fixed to the positioning pin 74 is lifted against the urging force of the spring 76 by an operating device (not shown), and the state thereof is released. The arm 69 is rotated by an arm rotating device (not shown), and another suction head 70 is fixed to the working position.

As shown most clearly in FIG. 5, each suction head 70 has a head main body formed by fixing transparent plates 82 and 84 made of glass or synthetic resin to both ends of a tubular member 80 made of metal. It is equipped with 86. This head body 86
A substantially airtight space is formed in the inside of the space, a vertical through hole communicating with this space is formed in the lower transparent plate 84, and an adsorption pipe 88 is press-fit into this through hole.
The head main body 86 is fitted into the outer cylinder 90 so as not to be rotatable relative to each other and slidably in the axial direction.
It is held at the lower end position where it abuts on the stopper 94 by 2. The outer cylinder 90 is rotatably and axially slidably fitted into a through hole formed in the arm 69 in the vertical direction, and is always in a rising end position where a flange 98 abuts the arm 69 by a spring 96. Hold and also the outer cylinder 90
At the upper end of the inner peripheral friction surface 100 having a cylindrical surface centered on the center line of the suction head 70, that is, the center line of the suction pipe 88.
The driven rotary body 102 having the above is fixed by screwing, and the driven rotary body 102 and the spring 96 are covered with a cover 104.

The arm 69 is provided with a suction head 70, specifically an outer cylinder 90 and a brake device 110 for preventing the head body 86 from rotating. Brake device 1
10 is a friction member 112, a lever 114, a spring 11
It has 6 mag. Lever 114 has pin 1 on arm 69
An intermediate portion is rotatably attached by 17, a friction member 112 is fixed to one end portion, and a spring 116 is mounted between the other end portion and the arm 69.
The friction member 112 is fitted in a through hole formed in the arm 69, and its tip end is pressed against the outer peripheral surface of the outer cylinder 90 by the urging force of the spring 116 to prevent the suction head 70 from rotating.

The suction pipe 88 is formed in the head holder 58 and the rotary shaft 50 through a space formed in the head main body 86, passages 118 and 120 formed in the arm 69 and the shaft member 68. Passages 122 and 1
24, and is further connected to a vacuum device (not shown) at a port 128 via a joint 126. A switching valve 130 is provided at the connection between the passages 120 and 122.
Is provided and is switched by a valve operating device (not shown) so that the adsorption pipe 88 can be selectively communicated with the vacuum device and the atmosphere.

Each suction head 70 is stopped at positions 12 of A to L shown in FIG. 6 with the intermittent rotation of the head holder 58. Then, at position A, the electronic component is received from the component supply device 12, and at position G it is mounted on the printed circuit board. The position A is the component receiving position and the position G is the component mounting position. Further, a posture detection device 140 and a head rotation device 142 are provided at positions C and E, respectively, and the position C is the posture detection position,
The position E is the posture change position. Further, at the position D, when the electronic component detected at the position C is different from the expected one, the switching valve 130 is switched to release the wrong electronic component from the suction head 70. The switching valve 130 and the means for switching the switching valve 130 when the electronic component is different from the planned one constitute the component releasing means.

As is apparent from FIG. 7, the posture detecting device 140 has an auxiliary frame 144 fixed to the main body frame 10.
Illuminator 146, prism device 148 and image pickup device 150 as a light guide device assembled to
Is equipped with. The projector 146 is fixed to the auxiliary frame 144 by the bracket 152, and is positioned right above the suction head 70 stopped at the posture detection position C. The light projector 146 has a function of converting electric energy into light, and the light projected from the light projector 146 passes through the suction head 70 vertically downwards in parallel with the center line of the suction head 70, and then the two of the prism devices 148. The prism 154 changes its direction by 90 degrees, and becomes vertically upward light, which enters the imaging device 150. The image pickup device 150 is provided with a lens 156, and converts the projection image of the electronic component W formed on the solid-state image pickup device (not shown) by the lens 156 into a binarized signal. The imaging device 150 is attached to the auxiliary frame 144 vertically downward by the bracket 160, and the height of the bracket 160 is adjusted by the adjusting screw 162, so that the focal length can be adjusted. Note that 164 is a power unit of the imaging device 150.

As shown in FIG. 8, the head rotating device 142 has a guide bush 1 fixed to the auxiliary frame 170.
A drive rotating body 174 is held by 72 so as to be rotatable and slidable in the axial direction. The drive rotor 174 includes a gear 176, and the gear 176 is connected to the servo motor 182 shown in FIG. 9 via a gear 178 and a timing belt 180. Therefore, the drive rotor 17
4 is rotated by the servo motor 182 at an arbitrary angle.

The drive rotor 174 is a hollow shaft-shaped member as shown in FIG. 10, but has a wide annular groove 184 formed on the outer peripheral surface of the lower end thereof, and a rubber friction ring 186 is formed in this. Is fitted. A plurality of through holes are formed in the bottom wall of the annular groove 184 so as to penetrate therethrough in the radial direction, and one ball 188 is movably accommodated in each through hole. A rod-shaped expansion member 192 having a tapered portion 190 at the lower end is slidably inserted into the drive rotor 174, and the pin 19 fixed to the expansion member 192 is inserted.
4 and the elongated hole 196 formed in the driving rotator 174 prevent the expansion member 192 and the driving rotator 174 from rotating relative to each other and define the relative movement limits of the two in the axial direction.

A stopper ring 200 is fixed to the upper end of the drive rotor 174, and the stopper ring 200 abuts the upper end surface of the guide bush 172 to define the lower end position of the drive rotor 174. In addition, the expansion member 19
A nut 202 is fixed near the upper end of 2, and a spring 203 is attached between the nut 202 and the upper end surface of the drive rotor 174 to attach the expansion member 192 upward with respect to the drive rotor 174. I am energetic. Expansion member 19
A taper portion 204 is formed at the upper end of 2, and an elevating member 206 is engaged with this via a bearing 208. An engaging member 210 is also attached to the elevating member 206, which engages the nut 202 to expand the expansion member 19.
2 is moved up and down together with the lifting member 206.

As is apparent from FIG. 8, the elevating member 206 is held by an auxiliary frame 170 via two rods 212 and a guide block 214 so as to be able to ascend and descend, and a connecting rod 216 is used for elevating and lowering drive not shown. It is connected to the cam device. The lifting member 20
6, the rod 212, the guide block 214, and the connecting rod 216 are shown rotated by a certain angle around the axis of the driving rotor 174 in FIG. 8 for easy understanding.

The head rotating device 142 is provided at a position where the drive rotor 174 is concentric with the suction head 70 with the suction head 70 stopped at the position E.
6 is lowered, first, the elevating member 206 and the driving rotator 174 are lowered integrally, and the lower end portion of the driving rotator 174, that is, the portion where the friction ring 186 is mounted is shown in FIG. Driven rotating body 102
Fit in. Then, after the stopper ring 200 comes into contact with the upper end surface of the guide bush 172 and the descent of the drive rotor 174 is stopped, the expansion member 192 is opposed to the drive rotor 174 against the biasing force of the spring 203. And the ball 188 is pushed outward in the radial direction by the wedge action of the tapered portion 190, and the friction ring 186
Are partially bulged to frictionally engage the inner peripheral friction surface 100 of the driven rotary body 102. That is, the expansion member 192 having the tapered portion 190 and the ball 188 form the friction ring 1.
It constitutes the expansion mechanism of 86.

As is apparent from FIG. 8, the auxiliary frame 1
A release lever 220 of a brake release device 218 that releases the brake device 110 is attached to 70. One arm of the release lever 220 is connected to the cam device by the connecting rod 222, and the acting member 224 is attached to the other arm. The connecting rod 222 is adapted to be moved up and down in relation to the connecting rod 216 by a cam device, so that the driving rotor 1 is rotated.
74 descends and the friction ring 186 moves the driven rotating body 102.
After being pressed against the inner peripheral friction surface 100 of the
4 acts on the lever 114 to release the brake device 110, and after the suction head 70 is rotated by a predetermined angle, the brake device 110 is released before the drive rotor 174 is separated from the driven rotor 102. It is designed to return to the working state.

Next, the operation of the entire electronic component mounting system will be described. While the suction head 70 stopped at the position A (component receiving position) in FIG. 6 is receiving the component from the component supply device 12, the suction head 70 stopped at the position C (posture detection position) sucks the electronic component W. The rotation posture of the head 70 around the axis is detected, and at the position E (posture change position), the suction head 70 is rotated by the head rotating device 142 to change the rotation posture of the electronic component W around the suction head axis. Further, at position G (mounting position), the electronic component W is mounted on the printed board. The operation at each of these positions is performed in parallel with respect to the different suction heads 70, but the operation at each position will be described in detail below, focusing on one suction head 70.

When the suction head 70 is stopped at the position A, a selected one of the many component supply units 32 of the component supply device 12 is positioned directly below the suction head 70, and the component supply unit 32 is located. The cover tape is peeled off from the electronic component holding tape held in the state where the electronic component W can be taken out. Therefore, if a head pressing device (not shown in FIG. 5) abuts against the driven rotating body 102 and pushes it down against the urging force of the spring 96, the head main body 86 and the suction tube 88 also descend accordingly. The lower end surface of the suction tube 88 contacts the upper surface of the electronic component W. The driven rotary body 102 and the outer cylinder 90 are still pushed down thereafter, but the head main body 86 and the suction tube 88 are allowed to remain stopped by the compression of the spring 92. In this state, since the suction pipe 88 is communicated with the vacuum device, the electronic component W is sucked by the suction pipe 88, the action of the head depressing device is released, and the suction head 70 moves up, the electronic component W is accompanied by it. Then, the mounting device 20 finishes receiving the electronic component W from the component supply device 12.

When the suction head 70 that has received the electronic component W is stopped at the position C in this way, the suction head 70
7 is a projector 146 and a prism device 148 as shown in FIG.
Located between and. Therefore, the projected image of the electronic component W is formed on the surface of the solid-state image pickup element of the image pickup device 150 by the light projected from the projector 146. The imaging device 150 converts this projection image into a binarized signal and outputs it to the control device 22. The control device 22 compares the binarized signal with the binarized signal indicating the position of the regular electronic component W stored in advance in the memory of the control device 22 itself, and compares the posture of the electronic component W with respect to the regular position. Calculate the error Δθ.

After the suction head 70 stops at the position E after the posture is detected as described above, the suction head 70 is stopped.
Will be located directly below the drive rotor 174 of the head rotating device 142 as shown in FIG. Therefore, when the elevating member 206 is lowered by the cam device, the lower end portion of the driving rotator 174 fits inside the driven rotator 102 shown in FIG. When the elevating member 206 is further lowered from this state, the expansion member 192 is relatively lowered with respect to the driven rotary body 102 in FIG. 10, and the friction ring 186 is expanded via the ball 188 to cover the friction ring 186. It is pressed against the inner circumferential friction surface 100 of the driving rotary body 102. Subsequently, the brake release device 218 is activated to operate the brake device 11
Since 0 is released, the suction head 70 becomes rotatable, and the servo motor 182 is operated in that state to rotate the suction head 70. Servo motor 182
Is rotated by an angle corresponding to the attitude error Δθ obtained by the control device 22 as described above, and the suction head 70 and the electronic component W held by the suction head 70 are accordingly rotated.
Can be rotated by an angle necessary to cancel the attitude error Δθ. After that, the brake device 110 is activated again, and the elevating member 206 is raised to drive the rotating body 174.
Is separated from the driven rotary body 102, and the attitude change of the electronic component W is completed.

After the attitude error is removed as described above,
When the suction head 70 stops at the position G, the printed circuit board positioning device 18 positions the printed circuit board at a predetermined position. Therefore, if the suction head 70 is pressed down by a head pressing device (not shown),
The electronic component W held by the suction tube 88 is pressed to a predetermined position on the printed board and fixed by adhesion or the like.
In this state, the switching valve 130 is switched so that the suction pipe 88 communicates with the atmosphere, so that the electronic component W is released from the suction head 70. Then, when the suction head 70 moves up, the electronic component W is mounted on the printed circuit board. Complete.

As is clear from the above description, in this electronic component mounting system, the suction head 70 receives the electronic component W, detects the posture, changes the posture, and mounts it on the printed circuit board in parallel at a plurality of positions. Because
The cycle time is shortened and the efficiency of electronic component mounting work is improved. Further, since the posture detection device 140 and the head rotation device 142 need only be provided for each of the 24 suction heads 70, the structure of the device is simplified, and the manufacturing cost can be reduced. Further, since the head rotating device 142 is separated from the head holder 58 and provided at a fixed position, the moment of inertia of the head holder 58 is reduced, and vibration and noise due to intermittent rotation of the head holder 58 are reduced. 5
8 can be rotated at high speed.

Further, two suction heads 70 are attached to each arm 69 provided at 12 positions of the head holder 58, and the suction heads 70 suitable for the shape and size of the target electronic component W are selected. It is a highly versatile device. Furthermore, since the image formed on the surface of the solid-state image pickup element of the image pickup device 150 is the projected image of the electronic component W,
The attitude of the electronic component W can be accurately detected without being affected by the surface roughness and color of the electronic component W unlike the image of the electronic component W due to the reflected light.

In the embodiment described in detail above, the component holding head is the suction head 70 for sucking electronic components by vacuum, and the periphery of the suction tube 88 of the head body 86 is formed of a transparent body. Although there is an advantage that a projection image can be obtained over the entire circumference of the electronic component W, the component holding head is not limited to this, and holds the electronic component W in a state in which the attitude of the electronic component W can be detected. Any holding head can be used.

In the above embodiment, only the attitude error of the electronic component is corrected at the attitude change position for easy understanding, but it is different from the attitude in which the electronic component is received from the component supply device. When it is necessary to mount the electronic component on the printed circuit board in the posture, it is possible to rotate the electronic component by an angle required for the position at this position. In this case, the function of rotating the printed circuit board by the substrate positioning device 18 can be obtained. It is possible to mount the electronic component in any posture without holding it. Further, in the above-described embodiment, only the error of the rotational posture of the electronic component is detected at the posture detection position. However, the center line of the electronic component W and the reference line of the component holding head (for example, the center of the suction head 70). By detecting the deviation from the line) and operating the board positioning device 18 based on the deviation, it is possible to improve not only the mounting posture of the electronic component but also the absolute mounting position accuracy. In addition, although not exemplarily illustrated, it goes without saying that the present invention can be implemented in various modified and improved modes based on the knowledge of those skilled in the art.

[Brief description of drawings]

FIG. 1 is a perspective view schematically showing an entire electronic component mounting system according to an embodiment of the present invention.

FIG. 2 is a front sectional view showing a main part of a mounting device of the electronic component mounting system shown in FIG.

3 is a sectional view taken along line III-III in FIG.

4 is a sectional view taken along line IV-IV in FIG.

5 is a sectional view taken along line VV in FIG.

6 is an explanatory diagram showing a relative positional relationship between the main part of the mounting device shown in FIG. 2 and a posture detecting device and a head rotating device attached thereto, and is a cross-sectional view taken along line VI-VI in FIGS. 7 and 8.

FIG. 7 is a front view of the posture detection device shown in FIG.

8 is a front view of the brake releasing device and the head rotating device shown in FIG.

9 is a bottom view of the brake releasing device and the head rotating device shown in FIG.

10 is a sectional view taken along line XX in FIG.

[Explanation of symbols]

 10 Main Body Frame 12 Component Supply Device 14 Substrate Loading Device 16 Substrate Unloading Device 18 Substrate Positioning Device 20 Mounting Device 22 Control Device 52 Rotating Plate 58 Head Holding Body 70 Suction Head 82, 84 Transparent Plate 86 Head Main Body 88 Suction Tube 90 Outer Cylinder 100 Inner Friction Surface 102 Driven Rotating Body 110 Brake Device 140 Attitude Detection Device 142 Head Rotating Device 146 Projector 148 Prism Device 150 Imaging Device 174 Drive Rotating Body 176, 178 Gear 180 Timing Belt 182 Servo Motor 186 Friction Ring 188 Ball 192 Expansion Member 218 Brake release device

Claims (1)

[Claims] 1. A plurality of component holding heads are attached to a head holder that rotates intermittently around a vertical axis by a constant angle so as to be rotatable around the vertical axis at the same angular intervals as the intermittent rotation angle. In the component receiving position, which is one of the stop positions of the component holding head, each component holding head receives the electronic component from the component supply device at the lower end and is positioned by the base material positioning device in the component mounting position which is another stop position. In an electronic component mounting system for mounting an electronic component on a base material such as a printed circuit board, the electronic component mounting system is mounted on one of a plurality of stop positions existing in a movement path of the component holding head from the component receiving position to the component mounting position The rotational posture of the electronic component held by the component holding head around the axis of the component holding head is detected by imaging. An electronic device obtained by the attitude detection device is provided with the attitude detection device, and the stop position is set as the attitude detection position, and the component holding head that has passed the attitude detection position moves to the component mounting position. An electronic component mounting system capable of changing the posture of an electronic component, comprising a head rotating device that rotates an angle determined based on the posture information of the component.