JPH033397A - Apparatus for and method of mounting electronic component - Google Patents

Abstract

PURPOSE:To simultaneously also mount an electronic component provided at a supplying unit except a tape unit to a board by providing an electronic component placing device in addition to the tape unit on a table, and providing a transfer unit for transferring the component from the supplying unit to a placing unit at the side of a table moving unit. CONSTITUTION:A motor 74 is driven, a table 70 is moved to the right side of a table moving unit 62, and a right side placing unit 80 is disposed directly under a cylinder 88. A sub transfer head 50 is moved in XY directions to take up an electronic component P of a tray 3, the rod 88a of the cylinder 88 is telescoped to place the components one by one on placing parts 89 while pitch feeding a belt 81. When the components P are placed on the belts 81, the table 70 is moved to the center of the unit 62, a desired table unit 71 and the unit 80 are stopped at takeup position (a) while reciprocating the table 70 in a lateral direction N2, the component P is taken up by a transfer head 64, fed and placed on a board 66.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to an electronic component mounting device and a mounting method, and relates to a mounting device and a mounting method for electronic components. Electronic components are transferred and mounted on a board.

(Prior art) As an electronic component mounting device, a table provided on a table board is moved back and forth, and electronic components of tape units arranged in parallel on this table are mounted on a rotary head (3
) A rotary head type mounting device is known in which the table is picked up by a table moving device and transferred and mounted on a board positioned in a positioning section (for example, in Japanese Patent Application Laid-open No. 6
0-28298, Japanese Patent Application Laid-open No. 62140499).

The tape unit peels off the cover tape while extracting the tape containing electronic components from the supply reel.
The electronic components stored in the pockets of the tape are picked up by a transfer head and transferred and mounted on the board.

However, while it is easy to encapsulate relatively small electronic components such as IC chips, capacitor chips, and resistor chips with this type of tape, it is difficult to encapsulate relatively large electronic components with leads such as QFP and SOP. These electronic components are housed in trays, tube feeders, etc. because they are difficult to install. Therefore, conventionally, relatively small electronic components encapsulated in tape were mounted on a board using the above-mentioned rotary head type mounting device, and relatively large electronic components such as QFP and SOP were mounted on a board using the above-mentioned rotary head mounting device. Public notice,
They were separately mounted on a board using a single-head mounting device as shown in Japanese Patent Application Laid-Open No. 62-42597.

(Problem to be Solved by the Invention) As mentioned above, in the conventional means, two types of mounting equipment, a rotary head type and a single head type, had to be prepared and used properly depending on the size and type of electronic components. Therefore, the operation and management of the device is troublesome, and the equipment cost increases accordingly.

Therefore, the present invention provides a rotary head mounting device that can simultaneously mount not only electronic components mounted on a tape unit but also electronic components mounted on other supply bodies such as a tray or tube feeder on a board. The purpose is to

(Means for Solving the Problems) For this purpose, the present invention provides a table provided on a table substrate with an electronic component mounting device in addition to a tape unit, and also provides an electronic component mounting device on the side of the table substrate. A transfer device is provided with a sub-transfer head that picks up electronic components from a component supply body and transfers them to the above-mentioned placement device.

(Function) According to the above configuration, electronic components from an electronic component supply body such as a tray or a tube feeder are transferred to a mounting device on a table by a sub-transfer head. Next, this table is moved back and forth on the table board, and the transferred electronic components are picked up by the transfer head of the rotary head.
Transfer and mount it on the board.

(Example 1) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a plan view of a rotary head type mounting apparatus, in which reference numeral 61 is a mounting apparatus main body, and a table substrate 62 is provided behind it.

The main body 61 includes a rotary head 63 that index-rotates in the N1 direction. 64 is rotary head 6
3 is a transfer head arranged in parallel along the circumferential direction, and picks up the electronic components on the table board 62 and transfers and mounts them on the board 66 positioned in the positioning section 65.

A conveyor 67 carries the substrate 66 into the positioning section 65 and carries it out from there.

A table 70 is placed on the table substrate 62,
On this table 70, a large number of tape units 71 are arranged in parallel. 72 is a feed screw, and a nut 73 driven by a motor 74 is attached to the end of the feed screw.

A nut 78 that is screwed onto the feed screw 72 is attached to the lower surface of the table 70. When the feed screw 72 is rotated by the motor 74, the table 70 reciprocates in the lateral force direction N2 along the feed screw 72. The desired tape unit 71 is moved and stopped at the pick-up position a, and the electronic components mounted on this tape unit 71 are transferred to the transfer head 64.
is ticked up and transferred and mounted on the board 66. This tape unit 71 is equipped with relatively small electronic components such as an IC chip, a capacitor chip, and a resistor chip. 80 is an electronic component mounting device provided on the side of the table 70. Next, referring to FIG.
The details will be explained below.

This mounting device 80 places an endless belt 81 on a sprocket 8.
The belt 81 has electronic component placement parts 89 arranged side by side in a pocket-like manner. 83 is pitch feeding means for the belt 81, and includes a ratchet wheel 84. Drive lever 85° feed claw 86. It consists of a biasing spring 87 and the like.

88 is a cylinder provided above the lever 85, and when the rod 88a protrudes and retracts to press the lever 85, the ratchet wheel 84 rotates in pitch, and the belt 81 moves from the rear of the table base plate 62 to the front part. It is pitch-fed in the direction of arrow N3. A plurality of these mounting devices 80 (four in this embodiment) are arranged in parallel, and electronic components of different types are placed thereon by a transfer device 30 (described later). 71a
is a supply reel installed in the tape unit 71, and P is an electronic component.

Note that the tape unit 71 is shown in a simplified manner for convenience of illustration. Reference numeral 30 denotes a transfer device for supplying electronic components to the mounting device 80, which is provided on the side of the table substrate 62. Details thereof will be explained next with reference to FIGS. 2 to 4. .

In Figures 2 and 3, 1 is a box-shaped magazine;
A plurality of trays 3 serving as electronic component supply bodies mounted on a base material 2 are stored in a stacked manner. This tray 3 houses a relatively large electronic component having leads, such as a QFP. 10.11 is a lower frame and an upper frame, and the magazine 1 is attached to this frame 10.11.
It is located within 11. Ml is a motor mounted on the upper frame 11, 13 is driven by this motor M1,
It is a timing belt that rotates along timing pulleys 14, 15, 16. The timing pulleys 15 and 16 are located on both sides of the upper frame 11, and feed screws 17 and 18 driven by the timing pulleys 17 and 16 are vertically provided along both side walls of the frame 11. A feed nut 19.20 is screwed onto the feed screw 17.18.
20 is integrally provided with brackets 21 and 22.

Two shafts 23 and 24 are installed horizontally on the upper surface of the magazine 1, and both ends of the shafts are connected to the brackets 21 and 22.
is supported by Therefore, when the motor M1 rotates forward and backward, the feed screw 17.18 rotates, and the feed nut 19.
The magazine 1 is raised and lowered by the movement of the magazine 20 along the feeders 17 and 18. That is, the motor ML feeder 17.1B, the nut 19.20, etc. constitute a lifting device for the magazine 1.

Reference numeral 30.31 denotes an arm portion extending forward of the frame 11, and the base material 2 with the tray 3 attached thereto is pulled out by a pull-out device (to be described later) into a plate-shaped support member 7 provided between the arm portions 30.31. pulled upwards.

32 is a cover plate whose rack is passed to the arm part 30.31;
3 is a sub-transfer head. As shown in FIG. 3, the base end of the sub-transfer head 33 is attached to a slider 34, and this slider 34 slides in the X direction on a rail 35 installed inside the cover plate 32. It is attached freely.

FIG. 4 shows the drive system of the sub-transfer head 33 provided below the support member 7, and 37 and 38 are sliders attached to both ends of the rail 350. The mover 37.38 is mounted so as to be slidable in the Y direction along a guide rod 39.40 disposed inside the arm portion 30.31. MX is the X direction drive motor, 4
2 is the X-axis drum, MY is the Y-direction drive motor, 43 is Y
Each of the drums 42 and 43 is wound with an X-direction wire 44 and a Y-direction wire 45, respectively. The X-direction wire 44 is tuned to a bearing 46 provided on the slider 34, slider 37, 38, etc., and when the motor MX rotates forward and backward, the slider on which the sub-transfer head 33 is attached 34 slides along the rail 35 in the X direction. Further, the Y direction wire 45 is connected to a bearing 49 provided at a corner of the frame 47, 48, etc.
When the motor MY rotates forward and backward, the slider 37.38 moves in the Y direction along the rod 39.40, and the sub-transfer head connected to the slider 37.38 moves in the Y direction along the rod 39.40. 33 also moves in the same direction.

That is, motors MX, MY, slider 34, rail 35
, slider 37.38, rod 39.40, winding drum 42
．． 43, wires 44, 45, bearings 46, 49, etc. constitute the xy direction substrate of the sub transfer head 33.

In FIGS. 2 and 3, 50 is the front wall 2 of the base material 2.
This is an engaging/disengaging element that engages and disengages from a. This locking/detachment element 50 is attached to the bin 5
An extender 53, which is rotatably supported by the cylinder 1 and extends downward from the extender 53, is attached to a rod 54a of the cylinder 54. Moreover, the locking/detachable element 50 is made of a spring material 55.
Direction of separation from the front wall 2a (clockwise in Fig. 3)
is energized by The cylinder 54 operates and the rod 54
When a protrudes, the locking element 50 rotates counterclockwise against the spring force of the spring member 55 and engages with the front wall 2a. Further, when the cylinder 54 stops operating, the locking element 50 is moved by the spring material 5.
It rotates upward by the spring force of 5 and separates from the front wall 2a. That is, the cylinder 54, the spring material 55, and the like constitute a locking/unhooking device for the locking/unhooking element 50.

In FIG. 3, reference numeral 56 indicates a belt which is located below the support member 7 and is tied to a pulley 57; M2 is a drive motor;
8 is a moving element attached to the belt 56. The cylinder 54 is attached to this mover 58, and by driving the motor M2, the locking/detachable element 50 moves in the Y direction, pulling the base material 2 on which the tray 3 is attached. That is, belt 56, pulley 57, mover 58, motor M
2 and the like constitute a loading/unloading device that pulls out the tray 3 stored in the magazine 1 toward the table board 62 and stores it in the magazine 1.

This device has the above-mentioned configuration, and the overall operation will be explained next.

First, the table 70 is moved to the right side of the table substrate 62 by driving the motor 74, and the mounting device 80 at the right end is positioned directly below the cylinder 88. Next, sub transfer head 5
0 in the XY force direction to pick up the electronic components P on the tray 3, and while pushing and retracting the rod 88a of the cylinder 88 and pitch-feeding the belt 81, one electronic component P is placed on each mounting section 89. Place them one by one. There are four mounting devices 80, so by loading and unloading each tray 3 from the magazine l and sequentially moving each mounting device 80 directly below the cylinder 88, a desired electronic component can be placed on the mounting section of each belt 81. Place it on 89. After electronic components P are placed on each belt 81 in this way, the table 70 is moved to the center of the table board 62, and the table 70 is moved in the lateral direction N2.
While moving the tape unit 71 and mounting device 80 back and forth, the desired tape unit 71 and mounting device 80 are stopped at the tick-up position a, the electronic component P is ticked up by the transfer head 64, and the electronic component P is ticked up and placed on the board 66.
Transfer and load to.

When the mounting on the substrate 66 is completed, the rotation of the rotary head 63 is stopped, the substrate 66 is carried out by the conveyor 67, and the next substrate 66 is carried into the positioning section 65. While replacing the board 66 in this way,
The table 70 is moved to the front of the transfer device 30. Then, as described above, electronic components P are replenished on the mounting portions 89 of each belt 81, and when the replenishment is completed, the table 70 is returned to the center of the table board 62, and the board 66 is
Resume the work of mounting electronic components P on the.

When the type of electronic component P mounted on the board 66 changes,
When the electronic component P in the tray 3 is out of stock, the tray 3 is replaced as follows. That is, first, the engaging/detachable element 5
0 tows the base material 2 and moves to the magazine 1 side, stores the tray 3 that has been used until then into the magazine 1 together with the base material 2 to which it is attached, and the locking/detachment element 50 rotates upward. and separates from the front wall 2a.

Next, the magazine 1 is moved up and down by driving the motor M1, and the tray 3 containing the desired electronic components P is opposed to the locking element 50. Then, the cylinder 54 is actuated, the locking element 50 engages with the front wall 2a of the base material 2, and then the motor M
2 is driven, the base material 2 is pulled by the locking element 50 and pulled out onto the support material 7. Thereafter, the electronic components P on the tray 3 are transferred to the mounting device 80 by the sub-transfer head 33 in the same manner. It will be transferred to.

(Embodiment 2) In FIG. 5, 90 is a transfer device, which is constructed by placing a cylinder 92 on XY child tables 1a and 91b, and mounting a motor M on a rod 92a of the cylinder 92. MX, M
Y is a table driving motor. 94 is a rotating arm attached to the rotating shaft of the motor M, 95 is a sub-transfer head attached to the tip thereof, and 3 is a tray.

This device uses the arm 94 to pick up the electronic component P on the tray 3, and by rotating the arm 94,
This electronic component P is transferred to the mounting device 80. in this case,
By driving the XY child tables 1a and 91b and moving the sub transfer head 95 in the XY force direction, a desired electronic component P on the tray 3 is ticked up.

(Embodiment 3) In FIG. 6, 96 is a tube feeder, which is equipped with an electronic component P@ such as an SOP having leads in two directions. The electronic component P sent out from the tube feeder 96 falls onto a pedestal 97, and the pedestal 97 is moved below the transfer head 95 by means not shown (see the chain line). Therefore, this electronic component P is picked up by the sub-transfer head 95 and transferred to a pedestal-shaped mounting device 98 provided on the table 70.

(Effects of the Invention) As explained above, the present invention provides a rotary head type electronic component mounting apparatus in which an electronic component mounting device is provided in addition to a tape unit on a table provided on a table substrate, and A transfer device equipped with a sub-transfer head that picks up electronic components from the electronic component supply unit and transfers them to the above-mentioned placement device is provided on the side of the table board. In addition to electronic components such as QFPs and SOPs installed in other electronic component supply bodies such as trays and tube feeders, electronic components such as QFPs and SOPs can be transferred and mounted on the board at the same time.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, in which Fig. 1 is a plan view of an electronic component mounting apparatus, Fig. 2 is a perspective view of a table board, Fig. 3 is a partial side view, and Fig. 4 is a sub-board. A perspective view of the drive mechanism of the transfer head, and FIGS. 5 and 6 are partial perspective views of other embodiments. 3.96...Electronic component supply body 30.90...Transfer device 61...Mounting device main body 62...Table board 63...Rotary head 64...Transfer head 65...Positioning Part 66... Substrate 70... Table 71... Tape unit 80.98... Placing device 81... Endless belt 3 Pitch feeding means/placing part

Claims (3)

[Claims] (1) Equipped with a mounting device main body equipped with a rotary head and a table moving device provided behind the mounting device main body, the table provided in the table moving device is moved back and forth, and the mounting device can be mounted side by side on this table. In the electronic component mounting apparatus, the electronic components are taken up from the tape unit by the transfer head equipped on the rotary head, and transferred and mounted on the board positioned in the positioning section. An electronic component transfer device that is provided with a placement device and has a sub-transfer head on the side of the table moving device that takes up electronic components from an electronic component supply body and transfers them to the placement device. An electronic component mounting device characterized by being provided with. (2) The above-mentioned mounting device comprises an endless belt on which electronic component mounting sections are arranged side by side, and a pitch feeding means for pitch-feeding the endless belt from the rear to the front of the table moving device; Claim 1, characterized in that the sub-transfer head transfers the electronic components of the electronic component supply body to the mounting section while pitch-feeding the endless belt. Mounting equipment for electronic components. (3) The table provided in the table moving device is moved back and forth, and the electronic components of the tape units arranged side by side on this table are taken up by the transfer head equipped with the rotary head and positioned in the positioning section. In a method for mounting electronic components by transferring and mounting them on a board, when replacing the board, the table is moved to the side of the table moving device, and the sub-transfer head of the transfer device provided on the side is moved. A method for mounting an electronic component, characterized in that the electronic component is taken up from the electronic component supply body and transferred to an electronic component mounting device provided on the table.