JPH08191199A - Chip component mounting equipment - Google Patents

Abstract

PURPOSE: To reduce the transfer distance of a working head to a minimum and improve efficiency, while many kinds of components are stored in a component supply part. CONSTITUTION: A conveyer 12 as a board carrying path is installed on a base. A working head 13 for picking up a component is movably installed above the base. Component supply parts 16 are arranged on both sides of the conveyer 12. Chip components can be taken out from each of the component supply parts 16. Many kinds of components are previously stored in each of the component supply parts 16. Out of them, components to be mounted are taken out by the working head and mounted on a printed board.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an IC, a resistor,
The present invention relates to a chip component mounting device for mounting a small piece of electronic component (hereinafter, referred to as a chip component) such as a capacitor on a printed circuit board.

[0002]

2. Description of the Related Art As a mounting apparatus of this type, conventionally, a work station is formed on a board transfer path (conveyor) through which a printed board is transferred, and in this work station, a horizontal plane parallel to the board transfer path is set in the XY directions. It is known that a head supporting member that moves at a high speed is provided, and a working head that sucks a chip component supplied from a component supply unit and transfers the chip component to a predetermined position on a printed circuit board is known. In this type of mounting apparatus, the component supply unit usually has the feeder (for example, a tape feeder) holding various components classified by type in the X-axis direction (the direction of the substrate transport path) and the substrate transport path. It is installed on one side of the.

[0003]

By the way, in the mounting work of electronic parts by such a mounting device, suitable parts are mounted from various kinds of parts at various places widely distributed on the printed circuit board. It is necessary.
Further, when the type of printed circuit board changes, the type of parts to be mounted may change accordingly.

For this reason, a large number of types of components are held in advance in the component supply unit, the required chip components are picked up from the component supply unit by the working head, and the required chip components are provided at various locations on the printed circuit board. It is necessary to move against.

However, in the conventional apparatus in which the component supply section is installed only on one side of the substrate transport path, if a plurality of rows of feeders are arranged to equip various types of components as described above, the component supply section is arranged. Is considerably long in the feeder arrangement direction, so when, for example, picking up parts from the feeder on the end side and mounting them on the printed circuit board, the distance from the part picking position to the printed circuit board becomes large, and therefore the working head movement distance. Becomes longer and the time required for the movement increases, which causes a problem of lowering work efficiency.

In view of the above circumstances, the present invention makes it possible to shorten the moving distance of the work head as much as possible and improve the work efficiency while allowing a large number of kinds of parts to be held in the parts supply section. An object of the present invention is to provide a chip component mounting device that can be used.

[0007]

In order to achieve the above object, the present invention is directed to a board transfer path provided on a base, a component supply section located on the side of the board transfer path, and a base. A work head for picking up a component that is movably provided above, and picks up a chip component from the component supply section by the working head in a state where the printed circuit board is located at a predetermined position of the substrate transport path, In a chip component mounting device that mounts the chip component on a printed circuit board, the component supply units are arranged on both sides of the substrate transport path, and the chip component can be taken out from each component supply unit. is there.

With this structure, after the components to be mounted are picked up by the working head from the component supply units arranged on both sides of the board transport path, the working head moves to the component mounting position on the printed circuit board. Then, the parts are mounted.

In this case, since the above-mentioned component supply units for holding a large number of types of components by type are arranged on both sides of the substrate conveyance path, the component supply unit is arranged only on one side of the substrate conveyance path. Since each component supply unit is shorter than the conventional device, even if components are removed from the end side of the component supply unit, the work head movement distance from the component removal position to the component mounting location on the printed circuit board Becomes relatively small, and the time required for the movement becomes short.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings.

In the figure, this chip component mounting apparatus 10 is shown.
On the upper surface of the base 11 in FIG.

On the conveying path of the conveyor 12, there is formed a work station 14 in which the work head 13 of the chip component mounting apparatus 10 carries out a chip component mounting operation. On this conveyor 12, one side (first
The printed circuit board 15 is conveyed from the right side in the drawing, and the conveyance of the printed circuit board 15 by the conveyor 12 is temporarily stopped at a predetermined position in the work station 14. The printed circuit board is held at a predetermined position in the work station 14 during work.

The work station 14 has a rectangular shape, and the longitudinal direction thereof coincides with the X-axis direction which is the transfer direction of the conveyor 12. Then, the Y-axis direction of the work station 14 (direction orthogonal to the conveyor 12)
The component supply units 16 to be described later are arranged on both sides of the work station 14 along the long sides of the work station 14.

Fixed rails 1 serving as Y-axis direction support members are provided on both sides of the work station in the X-axis direction.
7 and a feeding device 18 are installed over the conveyor 12.

The feeding device 18 is composed of a ball screw device, and its screw shaft 21 is rotationally driven by a servomotor 19 via a toothed belt 20, whereby a head support member 22 described later is driven in the Y-axis direction. Like

Above the base 11, a head support member 22 is provided.
Is provided so as to be movable in the Y-axis direction, and the work head 13 is supported by the head support member 22 so as to be movable in the X-axis direction. In the present embodiment, the work heads 13 are respectively attached to the X
Two head support members 22 movably supported in the axial direction
Is equipped. The head support member 22 has the following structure.

That is, the head support member 22 has a frame 23 formed linearly, a guide rail 24 fixed on the frame 23, and a feeding device 25 installed in parallel with the guide rail 24. , The three work heads 13 are attached to the guide rail 24 via the mounting plate 26.
Is supported vertically.

The work heads 13 are moved up and down by a command signal from a CPU (not shown) to perform the required work at the time of picking up the required chip parts and at the time of placing on the printed circuit board.

A female screw portion 27 of a ball screw device, which is a feeding device 18, is provided on one end side of the head supporting member 22, and the female screw portion 27, which is installed parallel to the fixed rail 17, engages with the female screw portion 27. By rotating the screw 21 by the servo motor 19, the head supporting member 22 as a whole is fed in the Y-axis direction.

The three work heads 13 fixed to the mounting plate 26 of the head support member 22 are attached to the mounting plate 26.
Is supported by the guide rail 24, and the feed screw 25 arranged in parallel with the guide rail 24 is engaged with the female screw portion of the ball screw device fixed to the mounting plate 26. Feed screw 2 by
The rotation of 5 allows movement in the X-axis direction.

Therefore, these three working heads 13 are
Fixed rail 17 direction of head support member 22 (Y-axis direction)
And the movement in the guide rail 24 direction (X-axis direction) on the head support member 22 are possible, and the two-dimensional movement within the work area of the work station 14 is performed.

On the other hand, a multi-row feeder (tape feeder) arranged in the X-axis direction is arranged in the component supply section 16 installed on the base 11 on both sides of the work station, and each feeder is a reel. For example, a rectangular parallelepiped chip component is housed at equal intervals in the supply tape 29 wound around, and a ratchet type feed mechanism (not shown) for intermittently feeding the supply tape 29 to the feeding end of the supply tape 29. Is incorporated, and the protrusion provided on the working head 13 presses this feeding mechanism, whereby the work head 13 can pick up chip components. By storing various chip components in each feeder, the component supply unit 16 holds various types of chip components.

When the component supply parts 16 are installed on both sides of the work station 14 in this way, a large number of feeders for holding various types of parts so that they can be taken out are separately provided to both the component supply parts 16. By providing the components, the length of each component supply unit 16 in the X-axis direction becomes shorter as compared with the conventional case where the component supply unit including multiple rows of feeders is installed only on one side of the work station. Therefore, even when a component is taken out from the feeder on the terminal side of the component supply unit 16 in the X-axis direction and mounted on the printed circuit board 15, the movement distance of the working head 13 is shorter than that in the conventional case, and the movement of the work head 13 is reduced. The required time is shortened and the work efficiency is improved.

Moreover, as will be described later in detail, since the work heads 13 are respectively supported by the two head support members 22 and they are independently driven, work efficiency is further enhanced. To be

In the figure, 31 is a suction nozzle, which is connected to a vacuum pump (not shown). Further, 32 is a correction arm, and by closing these correction arms 32, the suction position of the chip component sucked by the suction nozzle 31 is corrected.

By the way, the two head support members 22 are
Both ends are supported by the fixed rails 17 and are movable independently in the Y-axis direction in a state of being arranged so as to extend in the X-axis direction in parallel with each other in a symmetrical posture.

The work head 13 supported by each head support member 22 is arranged outside the head support member 22 in the Y-axis direction, that is, on the side opposite to the side facing the space sandwiched by both head support members 22. There is.

These head supporting members 22 are individually driven by the two feeding devices 18. The ball screw device as the feeding device 18 is provided in the work station 14
Are arranged on both outer sides of the fixed rails 17 installed on both sides of, respectively.

In order to move the head support members 22 with high precision and perform positioning, it is necessary to reduce the distance a between the feed screw 21 and the fixed rail 17 as shown in FIG. This is because the bending moment due to the feed driving force applied to the head support member 22 is reduced, which is preferable. Further, the head supporting member 2 is opposed to the feed driving force.
In order to maintain the high positioning accuracy of the head support member 22, the slide bearing 33 of the head support member 22 with respect to the fixed rail 17 is used.
It is preferable to increase the distance b.

According to the arrangement of this embodiment, the feed screw 2
Even if the distance between the fixed rail 17 and the fixed rail 17 is narrowed and the distance between the slide bearings 33 is increased, the two head support members 22 are installed on the same set of fixed rails 17. The positioning accuracy of both head supporting members 22 can be maintained well, the distance between both head supporting members 22 can be reduced, and the working space of each head supporting member 22 can be expanded.

The head support member 2 of this embodiment
In the feeding device 18 of No. 2, since the screw shaft 21 and the drive motor 19 are interlocked with each other via the toothed belt 20, the Y-axis direction dimension of the work station 14 is set relative to the Y-axis direction dimension of the apparatus. Further, when the screw shaft 21 is arranged along the fixed rail 17, it is possible to avoid the restriction due to the outer shape of the servo motor 19 and to install the screw shaft 21 close to each other. It is possible to reduce the rigidity.

When the work head 13 is arranged outside the head support member 22 in the Y-axis direction as described above,
The work heads 13 of the head support members 22 can be serviced from the outside, and the serviceability can be improved. Further, it is necessary to teach the work when the chip component mounting apparatus is automatically operated, but the work position can be easily seen during the teaching work.

With respect to the movement of both head supporting members 22 in the Y-axis direction, the gap between both head supporting members 22 is detected by detecting the number of pulses generated by a detector provided in the servomotor 19 as described below. Is monitored every 20 msec to prevent collision and interference of both head support members 22.

Therefore, the work area of each head support member 22 in the work station 14 of the mounting apparatus 10 is as shown in FIG.
The part supplying section 16 disposed on the side is dedicated, and the part on the printed circuit board 15 stopped on the conveyor 12 overlaps as a common operation area of both head supporting members 22. It should be noted that in FIG. 5, A in the figure shows the work area of the work head 13 supported by the head support member 22 drawn as the front side in FIG. 1, and B in the figure shows the work area on the other side.

That is, the first head support member 22 picks up chip components from the supply tape 29 of the component supply unit 16 installed on the side of the first head support member and sets them on the entire area of the printed circuit board 15 as targets. The second head support member 22 is for setting chip components from the component supply unit 16 on the same side similarly for the entire area on the printed circuit board 15.

Then, the above-mentioned work by each head support member 22 is carried out simultaneously or in parallel with a certain time lag, so that the chip components can be mounted efficiently. In addition, it is not necessary to use a motor with a particularly large output to increase the moving speed of the work head in order to improve work efficiency, and the magnitude of the force generated in the device is kept relatively small. The need for increasing the rigidity of the feeding device, etc. is reduced.

Next, in order to move these two head support members 22 without colliding and interfering with each other, this embodiment is controlled by a CPU (not shown) and appropriately operated by a well-known technique. Programming is done.

In this embodiment, in particular, the following tasks are performed by the CPU so as to completely avoid the collision and interference of these two head support members 22.

The operation of this task will be described below with reference to the flowchart of FIG.

In this task, the following task is repeated every 20 msec by the timer in the CPU which starts its operation at the same time when the power of the mounting apparatus 10 is turned on.

Therefore, the tasks described below are functioning regardless of whether the operation of the chip component mounting apparatus is performed in the manual mode or the automatic mode, and the operation error of the apparatus or the automatic operation program Even if there is a mistake, the head support member is prevented from colliding and interfering.

First, the task is started based on the command signal of the timer as described above.

Step 1 The positions of both head supporting members 22 in the Y-axis direction (indicated as Y1, Y2 in FIG. 6) and their changes are detected to determine whether or not both head supporting members 22 are approaching. to decide. This is because the drive motor 19 of both head supporting members 22 is provided with a pulse generator, so that the difference in the number of pulses from the encoder portion thereof may be detected and the CPU may compare it with a predetermined amount. And if this determination is YES,
The process proceeds to step 2, and if NO, this task is ended.

Step 2 If it is judged that both head support members 22 are approaching,
The position where both head support members 22 can be smoothly decelerated and stopped is calculated.

Step 3 Next, the stop positions of both head supporting members 22 calculated in Step 2 are calculated.

Step 4 Then, the spacing obtained in Step 3 is compared with the preset minimum spacing between both head supporting members 22 (which is preferably set to be changeable), and both head supporting members 22 are compared. Predict the possibility of collision and interference. If YES (when there is a possibility of collision, etc.), proceed to step 5,
In the case of NO (when there is no possibility of collision etc.), this task is ended.

Step 5 If it is determined in step 4 that there is a possibility of collision or the like, both head supporting members 22 and each working head 13 on these head supporting members 22 (in this embodiment, the mounting plate 26 is used). It is also possible to substitute the above), and brake these to decelerate and stop them to avoid a collision or the like and end this task. In this case, an alarm may be issued by a buzzer or the like at the same time as this operation.

Next, another embodiment will be described with reference to FIG.

This embodiment is constructed in the same manner as the above-described embodiment, but since there is a difference only in the points described below, only this difference will be described, and other points will be described above. The same reference numerals as the corresponding portions of the embodiment of FIG.

That is, in this embodiment, the working head installed on the head supporting member 22 which is laid across the fixed rail 17 is on the opposite side to the above-described embodiment (the side facing the other head supporting member 22). ) And for this purpose the feed device 25 provided on the head support member 22 is likewise arranged on the side opposite to that of the previous embodiment.

By installing the work head 13 in such a direction with respect to the head support member 22, the stop distance between the work heads installed on both head support members can be reduced, and the other head This is to improve the work efficiency by expanding the work area where the work head can install the chip components without moving the support member.

[0052]

As described above, according to the present invention, the chip head is picked up from the component supply section by the working head and mounted on the printed circuit board in a state where the printed circuit board is located at a predetermined position of the substrate transfer path on the base. In this configuration, since the component supply units are arranged on both sides of the board transfer path and chip components can be taken out from each component supply unit, a large number of types of components can be taken out to the component supply unit. In comparison with the one in which the component supply section is arranged only on one side of the board transport path, the above-mentioned component supply sections are shortened, and the work head from the component take-out position to the component mounting location of the printed circuit board is The moving distance can be shortened and the time required for the moving can be shortened, whereby the work efficiency can be improved.

[Brief description of drawings]

FIG. 1 is a plan view of a chip component mounting apparatus according to an exemplary embodiment of the present invention with a cover removed.

FIG. 2 is a front view of the chip component mounting apparatus.

FIG. 3 is a side view of the chip component mounting device.

FIG. 4 is an explanatory diagram of a plan view of a drive system of a head support member.

FIG. 5 is an explanatory view of work areas of both head support members in the work station.

FIG. 6 is a flowchart of a task of avoiding a collision of a head support member of the chip component mounting apparatus.

FIG. 7 is a plan view showing another embodiment.

[Explanation of symbols]

 10 chip component mounting device 11 base 13 work head 14 work station 16 component supply unit

Claims (1)

[Claims] 1. A substrate transfer path provided on a base, a component supply unit located on a side of the substrate transfer path, and a work head for picking up a component movably provided above the base. And a chip component mounting device for picking up a chip component from the component supply unit by the working head and mounting the chip component on the printed circuit board in a state where the printed circuit board is located at a predetermined position of the substrate transport path. In the chip component mounting apparatus, the component supply units are arranged on both sides of the substrate transport path so that the chip components can be taken out from the component supply units.