JP3537516B2 - Electronic component automatic mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic electronic component mounting operation for mounting an electronic component on a printed circuit board when the operation related to the mounting of the electronic component is abnormal. Related to a mounting device.

[0002]

2. Description of the Related Art An electronic component mounting apparatus of this kind is disclosed in
Japanese Patent Application Laid-Open No. 5-3693 discloses that if an operation of sucking an electronic component to a suction nozzle, which is an operation related to mounting of an electronic component, is performed, and if there is a suction error, the same component is sucked again. By performing the operation, the components are mounted without lowering the operation rate.

[0003]

However, the above-mentioned prior art is very effective during the operation for production. However, when it is desired to find out a malfunctioning part of the apparatus at the time of maintenance of the apparatus, or when an abnormal state is detected. If the above-mentioned so-called recovery operation is automatically performed when it is desired to confirm whether the apparatus operates normally after the cause is eliminated, there is a disadvantage that the malfunctioning part is difficult to recognize.

Accordingly, an object of the present invention is to make it possible to easily find a malfunctioning part of the apparatus at the time of maintenance or the like.

[0005]

SUMMARY OF THE INVENTION Accordingly, the present invention provides an operation for mounting an electronic component on a printed circuit board when the operation related to the mounting of the electronic component on the printed circuit board is abnormal. In the electronic component automatic mounting apparatus to be performed, setting means for selecting and setting a stop mode for immediately stopping the operation without re-execution even if an abnormality occurs or a re-execution mode for re-execution, and setting of the setting means When the stop mode is set, control means is provided for controlling the operation to stop when an abnormality occurs.

The present invention also relates to an automatic electronic component mounting apparatus which performs an operation of mounting an electronic component on the board by re-executing the operation when an abnormality occurs in the operation related to mounting the electronic component on the printed board. A plurality of detecting means for detecting the various abnormalities; and a detecting means selected from among the abnormalities detected by the plurality of detecting means is not determined to be abnormal, and abnormalities detected by other detecting means are determined to be abnormal. Judging means, setting means for selecting and setting a stop mode for immediately stopping the operation without re-execution even if an abnormality occurs or a re-execution mode for re-execution, and setting the stop mode by setting the setting means In the case where the control is performed, control means is provided for controlling the operation to stop for all the abnormalities determined by the determining means to be abnormal.

[0007]

According to the first aspect of the present invention, when the stop mode is set by the setting means, the control means controls to stop the operation when an abnormality occurs. According to the configuration of the second aspect, when the stop mode is set by the setting of the setting means, the control means controls to stop the operation for all the abnormalities judged by the judging means to be abnormal.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to the drawings. 2 and 3, reference numeral 1 denotes a Y table that moves in the Y direction by rotation of a Y-axis motor 2, and 3 denotes a movement in the X direction on the Y table 1 by rotation of an X-axis motor 4. As a result, the printed circuit board 6 on which the chip-shaped electronic components 5 (hereinafter, referred to as chip components or components) are mounted is fixedly mounted on fixing means (not shown).

Reference numeral 7 denotes a supply table on which a number of component supply devices 8 for supplying the chip components 5 are provided. Reference numeral 9 denotes a supply stand drive motor. The supply stand 7 is guided by a linear guide 12 through a nut 11 fixed to the supply stand 7 by screwing the ball screw 10 by rotating the ball screw 10. Move in the direction. Reference numeral 13 denotes a rotary table which rotates intermittently. At the outer edge of the table 13, mounting heads 15 having a plurality of suction nozzles 14 are arranged at equal intervals in accordance with an intermittent pitch.

Reference numeral I denotes a suction station at which the suction nozzle 14 stops the mounting head 15 for sucking and picking up the component 5 from the supply device 8 due to the intermittent rotation of the rotary table 13. 5 is adsorbed. Reference numeral II denotes a component presence / absence detection station for detecting the presence / absence of suction of the component 5 by the suction nozzle 14. The presence / absence of the component 5 is detected by a component presence / absence detection sensor 24. The configuration of the sensor 24 is as shown in FIG. It comprises a light projector 25 for emitting a light beam in the horizontal direction and a light receiver 26 for receiving the light beam. The light beam of the projector 25 is the component 5
The light projector 25 is provided at a position where the light beam is blocked by the light source.
Is detected.

Reference numeral 16 denotes a component recognizing device for recognizing a positional shift of the component 5 adsorbed by the suction nozzle 14 by recognizing the lower surface of the component 5 with a camera in a predetermined visual field range and recognizing and processing the image screen. -Provided in section III.
The position where the mounting head 15 next to the recognition station III stops is the angle correction station IV, and the recognition device 1
The head rotation device 17 rotates the mounting head 15 in the θ direction by an angle amount in which the angle amount for correcting the angular position shift of the chip component 5 based on the recognition result of 6 is added to the predetermined angle amount. The θ direction is a direction that rotates around the axis of the nozzle 14 that extends in the up-down direction.

The next stop position after the angle correction station IV is the mounting station V. The component 5 to be sucked by the suction nozzle 14 of the station V is mounted on the substrate 6 by lowering the mounting head 15. The position where the mounting head 15 stops next to the mounting station V is the nozzle selection station VII, and the nozzle 15 is rotated by the nozzle selection device 19 to select an arbitrary nozzle 14 out of the plurality of nozzles 14. .

Next, the position where the mounting head 15 stops is the nozzle access station VIII.
The nozzle 14 is housed and protruded using (see FIGS. 6 and 7). Next, the position where the mounting head 15 stops is the nozzle height selection station IX.
1, the height position of the nozzle 14 is selected (see FIG. 8).

Numeral 30 denotes an elevating rod which moves up and down, engages with a swing lever 31 of the component feeder 8 and swings the component storage tape (not shown) in which the chip components 5 are sealed at a predetermined interval. The chip component 5 is supplied to the component suction position of the suction nozzle 14 by intermittent feeding. A tape reel 32 winds the component storage tape (not shown). The mounting head 15 will be described with reference to FIG.

Reference numeral 39 denotes a mounting plate fixed to a lower portion of the shaft 22 which moves up and down through the rotary table 13, and a rotating body 40 is mounted via a bearing 40A so as to be rotatable in the θ direction. 6 suction nozzles 14
Are provided at equal rotation angles in the θ direction through the rotators 40 so as to be vertically movable. The six suction nozzles 14 are of various types so as to be able to suction various components 5 having different diameters. An engagement body 38 is attached to the upper part of each nozzle 14, and an engagement piece 42 with which a pressing spring 41 is engaged is formed on the engagement body 38, and the nozzle 14 is constantly urged downward. . The pressing spring 41 is wound around the guide rod 60, and the engaging piece 42 is provided with a through hole through which the guide rod 60 passes. At the upper part of the rotating body 40, levers 44 are provided corresponding to the respective nozzles 14 so as to be able to swing around the support shaft 43, and a locking claw 45 is formed at the lower part of the lever 44. A spring 46 biases the lever 44 so that the claw 45 rotates inward.

An upper engaging claw 47 engageable with the locking claw 45 is formed at an upper end of the engaging body 38, and a lower engaging claw 48 formed at a lower end of the engaging body 38 is Regulation surface 40B
To regulate the lower limit of the lowermost position of the suction nozzle 14 (H level in the flowchart of FIG. 11).
Engaging with the locking claw 45 restricts the suction nozzle 14 to its upper limit position, which is the “storage position”.

FIG. 8 in which the upper engaging claw 47 is engaged with the locking claw 45
The position of the suction nozzle 14 on the left side of FIG. 5 is one step higher than the position on the right side in FIG. 5 in which the lower engagement claw 48 is regulated by the regulation surface 40B of the rotating body 40. This is the position when suction is performed. This height position of the suction nozzle 14 is hereinafter referred to as “intermediate height position” (L level in the flowchart of FIG. 11).

When the lower suction claw 48 is regulated by the regulation surface 40B of the rotating body 40 and the suction nozzle 14 on the right side in FIG. The suction nozzle 14 is in contact with the lower side surface 50 of the locking claw 45, and can be moved upward when a force is applied from below. The head rotating device 17 and the nozzle selecting device 1 for rotating the rotating body 40 are provided at the upper end of the rotating body 40.
9 are provided on the rotary shaft of the rotary body 40 at equal angular intervals of 60 degrees in accordance with the position where the suction nozzle 14 is provided. Are formed in three directions. That is, the suction nozzles 14 are provided at 60-degree intervals along the extension of the direction in which the grooves 52 are provided.

Next, a mechanism for protruding and storing the suction nozzle 14 at the nozzle access station VIII will be described with reference to FIGS. Reference numeral 54 denotes a nozzle release lever which rotates around a support shaft 55, and is provided at the upper end of the lever 44 which is rotated and selected by the nozzle selection device 19 and is engaged with the suction nozzle 14 at a position where the component 5 is sucked next. It is provided at a position where it can be engaged. One end of the lever 54 is pivotally supported by a rod 57, and a spring 58 is hung on one end of the lever 54 with a mounting plate 59 to rotate the lever 54 counterclockwise in FIG. Are urging them to do so.
A lever (not shown) is pivotally supported at the other end of the rod 57, and the rod 57 moves up and down by rotation of a cam (not shown).

The suction nozzle 14 protruding from the mounting head 15 descending to the nozzle abutment table 20 attached to the mounting plate 59 comes into contact with the nozzle abutment table 20, and further descends, whereby the suction nozzle 14 is all housed. The height of the abutment table 20 is such that the suction nozzle 14 projecting to the lowermost position is
Is set so that it does not hit when moving to and from the nozzle access station VIII.

Next, the nozzle height selection station will be described. The height of the nozzle abutment table 21 provided at the station VIII is also set so as not to contact the suction nozzle 14 at the lowermost position, similarly to the nozzle abutment table 20. In the station VIII, the mounting head 15 can be switched between lowering and not lowering by a clutch mechanism (not shown). When the mounting head 15 lowers, the nozzle 14 comes into contact with the abutment table 21 and is pushed in. The position is changed to the intermediate height position as shown in FIG.

Next, detection of the height position of the suction nozzle 14 in the nozzle height selection station IX will be described. As shown in FIG. 8, the nozzle height selection station IX is provided with a nozzle height detection sensor 64 constituted by a light projector 62 and a light receiver 63 for detecting the nozzle height. The height of the optical axis of the sensor 64 is
When the suction nozzle 14 used for suction is in the lowermost position, the light is blocked by the nozzle 14 when the nozzle 5 is in the raised position, and when the nozzle 14 is at the intermediate position, light is transmitted and received by the light receiver 63. It has been made. Accordingly, when the suction nozzle 14 used for suction should be at the lowermost position, the CPU 70 sets the mounting head 15 to the nozzle height selection station I.
If the sensor 64 is shielded from light when stopped at X, it is determined that the suction nozzle 14 is at the lowermost position, and the light receiving device 63
, It is determined that the nozzle 14 is not protruding. If the suction nozzle 14 is to be at the intermediate position, the mounting head 15 is moved to the nozzle height selection station IX.
If the sensor 64 passes through and is received by the light receiver 63 after reaching and descending, it is determined that the sensor 64 has protruded to the intermediate position, and the light is blocked by the light receiver 63 and is not received by the light receiver 63. If so, it is determined that it has failed to reach the intermediate position and is still at the lowermost position.

Next, the control block will be described with reference to FIG. Numeral 70 denotes a CPU as a setting means, a judgment means, and a control means.
An operation related to component mounting is controlled based on an output signal via the sensor interface 73 as shown in FIG. The CPU 70 controls a solenoid 79 for driving a motor and a clutch mechanism of the nozzle height selection station IX through an interface 73 and a drive circuit 74 as shown in FIG. The solenoid 79 is energized to prevent the clutch mechanism from lowering the head 15, so that the suction nozzle 14 remains at the lowermost position.

A counter CTa is provided for each nozzle 14 in the RAM 72, and counts the number of suction abnormalities detected by the component presence / absence detection sensor 24. The RAM 72 also stores a set value for the counter CTa (the number of continuous suction abnormalities in FIG. 16). A counter CTb is further provided in the RAM 72 for each nozzle 14, and counts the number of times nozzle up / down switching (switching of the nozzle height position) determined by the CPU 70 based on the output of the nozzle height detection sensor 64 is abnormal. I do. The set value of the number of times the nozzle up / down switching abnormality has occurred continuously (the number of continuous up / down switching abnormality in FIG. 16) is also stored in the RAM 72.

The RAM 72 stores NC data as shown in FIG. In the NC data of FIG. 13, the step numbers indicate the order in which the components 5 are mounted on the board 6, and the X coordinate data indicated by “X”, the Y coordinate data indicated by “Y”, and the “θ” indicated for each step number. The indicated θ angle data and the reel number which is the number of the position on the supply table 7 on which the component supply device 8 to which the component 5 is to be supplied are mounted are stored. In addition, the type of the nozzle 14 to be used for suction is specified in data for each component type.
The nozzle type is determined from the data of the component type supplied by the component supply device 8, and data on whether the nozzle should be at the lowermost position or the intermediate position is stored in the RAM 72 for each nozzle type.

The presence of "E" in the "C" column of the NC data indicates that component mounting on the board 6 has been completed at that step number. The interface 73 further includes an operation unit 75, a tower light 76, a touch panel switch 77,
A CRT 78 and the like are connected. The touch panel switch 77 is attached on the screen of the CRT 78, and various switches can be arbitrarily formed on the screen.

The operation of the above configuration will be described below. First, the normal operation as the re-execution mode will be described. In the normal operation, the operation unit 75 is displayed with an automatic operation screen (not shown) displayed on the CRT 78.
Automatic operation is started by pressing an operation start key (not shown).

Before the operation, the screen of the CRT 78 is changed from the state shown in FIG. 14 to the screen shown in FIG. 16 by pressing the operation parameter switch section, and the automatic nozzle skip operation condition setting column is set as shown in FIG. If the setting has already been made, the setting value is stored without calling the screen. Further, the switch of the test operation data is pressed from FIG. 14 to call up the screen of FIG. The device abnormal unconditional stop in FIG. 15 is designated (corresponding to the use in the flowchart of FIG. 1), that is, the stop mode is set. When the switch is pressed, it is displayed on the display 81 that no designation is made, and by pressing the switch of “setting”,
The fact that no designation is made is stored and set in the RAM 72. That is, the re-execution mode is set by the CPU 70 as setting means. Further, it is assumed that the detection of abnormality by the various sensors in FIG. 15 is detected, and the recognition communication is also normal communication.

When the operation is started in such a setting state, since the normal operation is performed in the flowchart of FIG. 1, the unconditional stop of the device abnormality in the test operation data is set to "not specified". Various recovery operations are performed to maintain the operation rate. The execution of various recovery operations includes, for example, execution of an operation based on the flowchart of continuous suction abnormality management and nozzle skip operation determination in FIG. 11 and execution of an up / down switching continuous abnormality management and nozzle skip operation determination operation in FIG. .

First, for each step number of the mounting data shown in FIG. 13 stored in the RAM 72, the nozzle 14 of the type which should pick up the component type indicated by the reel number is selected by the nozzle selection device 19 in the nozzle selection station VII. Bit 5
1 is selected by being fitted into the fitted groove 52 of the head 15 and rotated. Next, when the head 15 moves to and stops at the nozzle in / out station VIII due to the intermittent rotation of the rotary table 13, the mounting head 15 descends, and the nozzle 14 used so far comes into contact with the contact table 20. Further, when the head 15 is lowered, all the nozzles 14 are set to the storage positions.

Next, the lever 54 swings and engages with the lever 44 corresponding to the selected nozzle 14, and is rotated clockwise in FIG. 6 around the support shaft 43 as shown in FIG. The engagement with the engagement body 38 is released. Next, with the lever 44 maintaining the state of FIG. 6, the head 15 moves up to the position shown in FIG. 7, and the nozzle 14 projects to the lowermost position.

Next, in a state where the lever 54 is disengaged from the lever 44 and the locking claw 45 is engaged with the upper side surface 49 and held down, the head 15 is selected by the rotation of the rotary table 13. Station IX is reached. In the station IX, according to the data indicating the height corresponding to the nozzle type stored in the RAM 72, when the lowermost position is designated, the solenoid 79 is excited and the head 15 is not lowered without being lowered. When the intermediate position is designated, the head 1 is not energized without energizing the solenoid 79.
5 is lowered by driving a cam (not shown),
4 is further lowered to abut the abutment table 21 and push the nozzle 14 to the intermediate position shown in FIG.

In the station IX, it is detected whether or not the nozzle has been switched to the specified height position by the nozzle height detection sensor 64, and as shown in the flowchart of FIG.
Is initialized, but if the operation is not performed normally, suction mounting with the head is prohibited, and the step number scheduled to be mounted by suction with the head 15 is registered in the recovery step in the RAM 72, and a retry is performed. Turn to execution processing, counter C
Tb is incremented by one (increment). This recovery is performed by the head 15 located at this time before the selection station VII.
The value of the counter CTb is not initialized, but is kept at one step forward without being initialized. Next, when the nozzle 14 is used again, if it is abnormal, the counter CTb Adds the number of abnormalities,
An abnormality is determined. Alternatively, the recovery may be performed by the nozzle 14 after the nozzle 14 makes one rotation with the rotation of the rotary table 13. Further, when the up / down switching is not performed normally, it is determined whether the counter CTb value matches the set value (for example, 3). If the counter CTb value matches, the corresponding nozzle 14 of the head 15 is subsequently executed as a nozzle skip process. Avoid being used. Then, the fact that the nozzle skip has been activated is displayed on the CRT 78 as device information (information on the state of the electronic component automatic mounting device).

Next, when the up / down switching is normally performed,
When the head 15 stops at the suction station I due to the rotation of the rotary table 13, the component supply device 8 of the reel number of the step number assigned to the head 15
The supply table 7 is moved by the rotation of the ball screw 10 so as to stop at the component removal position of the suction nozzle 14, and the chip component 5 is removed.

Next, the head 1 holding the chip component 5
Reference numeral 5 denotes a component presence / absence detection station II, and the presence / absence of suction of the component 5 (chip presence / absence detection) is detected by the component presence / absence detection sensor 2
4. That is, when the light beam is emitted from the light projector 25 toward the component 5 and the component 5 is normally sucked, the light beam is blocked by the component 5 and the component 5 is normally sucked without being received by the light receiver 26. Is detected. If the suction state is normal (including detection that the component 5 is not suctioned while standing on a surface other than the surface to be suctioned), the counter CTa is initialized.

If the suction state is abnormal, such as the absence of the component 5, the mounting by the nozzle 14 is prohibited and the operation is registered in the recovery step of re-executing the suction and mounting operation of the component 5 of this step number. This recovery operation is assigned to the head 15 of the station before the selected station VII as described above. In the case of a suction abnormality, the counter CTa is further incremented by one, and the counter C
A determination is made as to whether the value of Ta matches the set value. If the values match, a nozzle skip process similar to that described above is performed, and the fact that nozzle skip has been activated due to continuous suction abnormality is displayed on the CRT.

Next, if there is no abnormality, the chip component 5
Reaches the recognition station III, and the position shift of the component 5 is recognized by the recognition device 16. When an abnormality is also detected in the recognition station III, an operation similar to the operation of the flowchart shown in FIG. 11 in the station II is performed. At the next intermittent rotation, the chip component 5 reaches the angle correction station IV, and the chip component 5 should be mounted taking into account the correction based on the recognition result.
The head 15 is rotated by the head rotation device 17 so as to be at the mounting angle position.

Next, the head 1 is moved to the next mounting station V.
When the XY table 3 moves, the XY table 3 moves the printed board 6 to a position to be mounted in consideration of the correction based on the recognition result described above, and the chip component 5 is mounted at a predetermined position on the printed board 6 by lowering the mounting head 15. You. In this way, even when an abnormality occurs, the recovery operation of the suction and mounting of the component 5, that is, the re-execution operation is performed, and the nozzle 14 or the head 15 generates a predetermined number of abnormalities and
Even when the head 4 or the head 15 is abnormal and is determined not to be used and skip processing is performed and is not used thereafter, the automatic operation of component mounting using the other nozzles 14 and the head 15 is continued.

Next, a test operation at the time of maintenance or the like will be described. First, the operator changes the screen of the CRT 78 to the data editing screen shown in FIG. 14 by operating the touch panel switch 77, and presses the switch section which is displayed as test operation data and the area around it is displayed in a double frame. As a result, a screen of test operation data is displayed, and a screen for setting whether or not to detect various sensors and for specifying unconditional stop of the apparatus is displayed.

Next, when the normal operation has been performed so far, the apparatus abnormal unconditional stop is not designated, so that the switch section 80 displayed as "specify" is pressed to display the screen. When "specify" is displayed in the section 81 and the switch section "set" is pressed in this state, the designation in the RAM 72, that is, the stop mode is stored and set by the CPU 70 as setting means. . The screen is as shown in FIG. That is, all kinds of abnormality detection are performed in the same manner as in the automatic operation.

When the start key (not shown) of the operation section 75 is pressed in such a manner, the components are sucked and mounted. If no abnormality is detected by various sensors, the operation is performed in the same manner as the normal operation described above. Done. Even in this case, the setting state shown in FIG.
2 is stored. Next, for example, a component presence / absence detection stage
If there is a component suction abnormality (no chip or chip standing) in the application II, the operation of the electronic component automatic mounting apparatus is abnormally stopped by the CPU 70 as a control means as shown in FIG. That is, the rotary table 13
, The movement of the supply table 7 and the movement of the XY table 3 are all stopped, and the component mounting operation is stopped. At this time, the tower light 76 is turned on to notify the stop. Or CR
At T78, the fact that there is an abnormality due to a suction error and the head number nozzle number thereof may be displayed.

As a result, the operator can immediately know the type of the abnormality at the abnormal location and can see the state on the apparatus. Further, when a nozzle up / down switching abnormality is detected at the nozzle height selection station IX, the operation is similarly stopped abnormally, and the operator can confirm the state. In this way,
As soon as various abnormalities occur, the device can be stopped and its state can be checked, and it is easy to immediately check at which point the necessary treatment should be performed and whether the treatment has been performed reliably.

If the detection of chip absence, the detection of chip standing, the recognition communication, the detection of substrate transfer abnormality, and the detection of substrate positioning abnormality are not detected on the screen of FIG. The test operation can be performed without picking up the components and placing the substrate 6 on the XY table 3. At this time, the operation can be confirmed without sucking the components 5, such as abnormal nozzle up / down switching. If there is an abnormality, the state can be confirmed by stopping the abnormality. Detection of other defects such as the inability to rotate the head 15 can also be performed without suction of the component 5. In the case of recognition communication, when the component 5 is recognized by the component recognition device, the recognition is abnormal if the component 5 is not present. It is to be communicated and determined to be normal.

Next, when normal operation is performed, detection of various abnormalities is detected, normal communication is set, and unconditional stop of the apparatus is set to be not specified.
The normal operation can be performed without setting a new value while the set value of the number of abnormalities shown in FIG. Further, even in the test operation, the apparatus is set without specifying the device abnormal stop condition, that is, set in the re-execution mode, and without detecting the chip absence detection and the like, the operation is performed without sucking the component 5. It is also possible to confirm the operation.

[0045]

As described above, according to the present invention, the stop mode can be set so that even if an abnormality occurs, the operation is stopped without re-executing the operation that could not be performed due to the abnormality. By setting the re-execution mode during normal production operation, the operation can be re-executed even if an abnormality occurs, and the operation rate can be maintained.

In addition, even if a plurality of types of abnormalities occur, it is possible to selectively prevent the abnormality from being determined. Therefore, even if the electronic components are not actually sucked or the like and the production is not performed, the abnormality is detected by stopping the operation. The malfunctioning part can be found more easily.

[Brief description of the drawings]

FIG. 1 is a diagram showing a flowchart.

FIG. 2 is a plan view showing an electronic component automatic mounting apparatus.

FIG. 3 is a side view showing the electronic component automatic mounting apparatus.

FIG. 4 is a side view showing a component presence / absence detection sensor.

FIG. 5 is a partially broken side view showing the mounting head.

FIG. 6 is a side view showing the mounting head at the nozzle entrance station.

FIG. 7 is a side view showing the mounting head at the nozzle entrance station.

FIG. 8 is a side view showing the mounting head in a nozzle height selection station.

FIG. 9 is a perspective view showing a bit.

FIG. 10 is a diagram illustrating a control block of the electronic component automatic mounting apparatus.

FIG. 11 is a diagram showing a flowchart.

FIG. 12 is a diagram showing a flowchart.

FIG. 13 is a diagram showing NC data.

FIG. 14 is a diagram showing a data editing screen.

FIG. 15 is a diagram showing a screen of test operation data.

FIG. 16 is a diagram showing a screen for operating parameters.

[Explanation of symbols]

5 Chip-shaped electronic components 6 Printed circuit board 24 Parts presence / absence detection sensor (detection means) 64 Nozzle height detection sensor (detection means) 70 CPU (setting means, judgment means, control means)

Claims (2)

(57) [Claims] In an electronic component automatic mounting apparatus that performs an operation of mounting an electronic component on the board by re-executing the operation when an error occurs in an operation related to mounting the electronic component on a printed circuit board, A setting means for selecting and setting a stop mode for immediately stopping the operation without re-executing even if the error occurs, or a re-execution mode for re-executing. An electronic component automatic mounting apparatus characterized by comprising control means for controlling operation to stop when an abnormality occurs. 2. An electronic component automatic mounting apparatus that performs an operation of mounting an electronic component on the board by re-executing the operation when an abnormality occurs in an operation related to mounting of the electronic component on the printed board. A plurality of detecting means for detecting an abnormality of the detecting means, and a judging means for not judging the detection of the detecting means selected from among the abnormalities detected by the plurality of detecting means as abnormal, and judging that the abnormalities detected by the other detecting means are abnormal. A setting means for selecting and setting a stop mode for immediately stopping the operation without re-execution even if an abnormality occurs or a re-execution mode for re-execution, and a stop mode set by the setting of the setting means. In this case, the electronic component automatic mounting apparatus is provided with control means for controlling the operation to be stopped for all the abnormalities judged by the judging means to be abnormal.