JPH08228097A - Method and apparatus for mounting part - Google Patents

Abstract

PURPOSE: To prevent troubles due to the shift of the position of suction nozzle rotation center when mounting a part, by calculating the shift of part sucking position based on the cast shadow of the part detected by an optical detecting means while rotating the suction nozzle sucking the part and on the center of suction nozzle rotation. CONSTITUTION: A laser unit 31 is installed at the lower part of a head unit 5 and forms an optical detecting means. The laser unit 31 functions as a means for detecting the cast shadow of a nozzle for the detection of nozzle rotation center and so on, and further as a means for detecting the width of the cast shadow of a part 20. A main operation unit detects the center of the rotation of a suction nozzle 21 and stores it. This detection is based on data obtained by rotating the suction nozzle 21 and further detecting the cast shadow of the nozzle via the laser unit 31 in the stage of preparatory operation. The shift of part sucking position is determined based on the stored center of rotation and data obtained by rotating the suction nozzle 21 and further detecting the width of the cast shadow of the part 20 via the laser unit 31 after the part is sucked in a mounting process.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method and device for mounting a small-sized electronic component such as an electronic component such as an IC at a predetermined position on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, a component mounting head unit having a suction nozzle sucks electronic components from a component feeder such as a tape feeder and transfers the electronic components onto a positioned printed circuit board so that a predetermined position of the printed circuit board is obtained. A component mounting apparatus adapted to be mounted on a device is generally known. In this device, normally, the head unit is movable in the X-axis direction and the Y-axis direction, and the suction nozzle is movable and rotatable in the Z-axis direction to move and rotate in each direction. The driving means is provided, and the negative pressure supplying means for the driving means and the suction nozzle is controlled by the control section, so that the sucking and mounting operations of the components are automatically performed. In addition, after the component is picked up, the projected image of the component is detected by the optical detection means provided in the head unit, and based on this, whether or not the component is properly sucked is determined, and the deviation of the component suction position is detected. Is to be done.

Further, in this type of apparatus, as a preparatory work before the main work such as suction and mounting of the above-mentioned components, components to be mounted from a plurality of types of suction nozzles having different nozzle diameters and the like. The suction nozzle is selected according to the type of, and this suction nozzle is attached to the head unit,
When the type of component is changed, the suction nozzle is replaced accordingly. The attachment and replacement of the suction nozzle with respect to the head unit are performed manually or automatically between the nozzle replacement station and the head unit.

[0004]

In such an apparatus, if there is an assembly error or the like when the suction nozzle is attached to the head unit, conventionally there is no means for directly investigating this, so various troubles are caused. Could occur.

For example, if there is an error in the mounting position or angle of the suction nozzle with respect to the head unit, or an assembly error in the suction nozzle due to bending of the suction nozzle, etc., the position of the center of rotation of the suction nozzle shifts and adjustments are made accordingly. If not done, the processing such as the determination of the component suction state after the component suction in this work may not be performed correctly.

In view of the above-mentioned circumstances, the present invention clearly defines the center of rotation of the suction nozzle even when the position of the center of rotation of the suction nozzle is displaced due to an assembly error or the like when the suction nozzle is attached to the head unit. An object of the present invention is to provide a component mounting method and the same device that can be discriminated, can be adjusted accordingly, and can prevent a trouble caused by the displacement of the rotation center position of the suction nozzle.

[0007]

In order to achieve the above object, the component mounting method of the present invention is a head unit in which a suction nozzle selected from a plurality of types of suction nozzles is selected according to the type of the component to be mounted. In the component mounting method for performing the main work of adsorbing a component by the head unit and mounting the component at a predetermined position after performing the preparatory work for mounting on the head unit, the suction nozzle is attached after the suction nozzle is mounted on the head unit in the preparatory work. While rotating, the rotation center of the suction nozzle is detected based on the detection of projection of the suction nozzle by the optical detection means provided in the head unit, the rotation center of the suction nozzle is stored, and during the subsequent main work. Includes the projection of the component detected by the optical detection means while rotating the suction nozzle that sucks the component, and the rotation center of the suction nozzle. It is obtained so as to determine the displacement of the component suction position based.

According to the method of the present invention, when the suction nozzle is attached to the head unit in the preparatory step before this work, the center of the suction nozzle and the rotation center of the suction nozzle are deviated due to an assembly error or the like. However, the center of rotation is detected, and the component mounting position is accurately corrected based on the detected center.

Further, the component mounting apparatus of the present invention is provided with a head unit which is movable between the component supply side and the mounting side and to which a suction nozzle is attached, and the head unit suctions the component from the component supply side. Then, in the component mounting device that mounts this at a predetermined position on the mounting side,
Optical detection means for detecting projection of an article by a parallel light beam irradiation part and a light reception part provided in the head unit, rotation drive means for rotating the suction nozzle, and optical detection means for rotating the suction nozzle. The rotation center detection means for detecting the rotation center of the suction nozzle based on the data when the projection of the suction nozzle is detected by the storage means, the storage means for storing the rotation center of the suction nozzle, and the suction suction after the suction of the component by the suction nozzle. The projection of the component is detected by the optical detection means while rotating the nozzle, and the mounting position correction amount corresponding to the deviation of the component suction position is determined based on the detection data and the rotation center read from the storage means. It is provided with a correction means to be obtained.

According to this device, the above method is properly performed.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings. 1 and 2 show the overall structure of a component mounting apparatus according to an embodiment of the present invention. In these figures, a conveyor 2 for carrying a printed circuit board is arranged on a base 1, and the printed circuit board 3 is mounted on the conveyor 2 as described above.
It is transported over and stopped at a fixed position on the mounting work station.

On the side of the conveyor 2, a parts supply section 4 is provided.
Is arranged. The component supply unit 4 includes a plurality of rows of supply tapes 4a, and each supply tape 4a has an I
Small pieces of electronic components (chip components) 20, such as C, transistors, and capacitors, are housed and held at equal intervals and wound on a reel. A ratchet type feed mechanism is incorporated in the feeding end 4b of the supply tape 4a, and as the component 20 is picked up from the feeding end 4b by the head unit 5 described later, the supply tape 4a is intermittently fed out to perform the above-mentioned pickup work. It can be repeated.

A head unit 5 for mounting components is installed above the base 1, and the head unit 5 is mounted on the head unit 5.
Can move in the X-axis direction (direction of the conveyor 2) and in the Y-axis direction (direction orthogonal to the X-axis on the horizontal plane).

That is, the conveyor 2 is mounted on the base 1.
Two fixed rails 7 extending in the Y-axis direction across the same are arranged in parallel with each other at a predetermined interval, and a Y-axis feed mechanism is provided near one of the fixed rails 7 in the Y-direction.
Ball screw shaft 8 which is driven to rotate by a shaft servo motor 9
Is arranged. A support member 11 for supporting the head unit 5 is movably supported by the two fixed rails 7, and a nut portion 12 at an end of the support member 11 is screwed into the ball screw shaft 8, Ball screw shaft 8
The rotation of the support member 11 causes the support member 11 to move in the Y-axis direction. The Y-axis servo motor 9 is provided with Y-axis position detecting means 10 composed of an encoder.

The support member 11 is provided with a guide rail 13 extending in the X-axis direction, and as a feed mechanism in the X-axis direction, a ball screw shaft 14 disposed near the guide rail 13 and the ball screw. An X-axis servomotor 15 that rotationally drives the shaft 14 is provided. Then, the head unit 5 is movably supported by the guide rail 13, and the nut portion 17 provided on the head unit 5 is screwed onto the ball screw shaft 14 (see FIG. 3), and the ball screw shaft 14 The rotation of the head unit 5 moves the head unit 5 in the X-axis direction. X above
The axis servo motor 15 is provided with X-axis position detecting means 16.

The head unit 5 is provided with a suction nozzle 21 for sucking the component 20 so as to be vertically movable and rotatable. In this embodiment, as shown in detail in FIG. 3, the head unit 5 includes a mounting member 22 that is movably supported by the guide rails 13, a head 23 that is vertically movable on the mounting member 22, It has a suction nozzle 21 that can be moved up and down with respect to the head 23 and that can rotate about the R axis (nozzle central axis). Further, the mounting member 22 is provided with the nut portion 17 and is equipped with the head lifting servomotor 24, and the head 23 is equipped with the suction nozzle lifting servomotor 2.
6 and an R-axis servomotor 28 for rotating the suction nozzle. The head raising / lowering servo motor 24 and the suction nozzle raising / lowering servo motor 26 constitute a raising / lowering driving means for the suction nozzle 21, and an R-axis servo motor 28.
The rotary drive means is constituted by the above.

Position detecting means 25, 27 and 29 are provided on the servo motors 24, 26 and 28, respectively. Further, an interference position detecting means 30 (see FIG. 5) for detecting an interference position between the suction nozzle 21 and the component supply unit 4 is attached to the head unit 5.

At the lower end of the head unit 5, a laser unit 31 constituting an optical detecting means is attached. The laser unit 31 serves both as a means for detecting the projection of the nozzle for detecting the center of rotation of the nozzle, which will be described later, and a means for detecting the projection width of the component 20. The laser unit 31 sandwiches the suction nozzle 21 and faces each other. Laser generating part (parallel light irradiation part) 31a and detector (light receiving part)
31b (see FIG. 7, which will be described later), and the detector 31b is a CCD.

The head unit 5 on the base 1
A nozzle replacement station 34 is provided at an appropriate position within the movable range of the nozzle. As shown in FIG. 4, this nozzle exchange station 34 is provided with a nozzle clamp plate 35, and a plurality of types of suction nozzles 21 having different external characteristic amounts such as a nozzle diameter can be attached to and detached from the nozzle clamp plate 35. A nozzle holding unit 36 for holding, a nozzle discrimination sensor 37 for discriminating the presence or absence of nozzles, a lifting cylinder 38, and the like are provided. At the time of nozzle replacement, the head unit 5 moves to a position corresponding to the nozzle replacement station 34 so that the suction nozzle 21 can be replaced between them.

FIG. 5 shows an embodiment of the control system. In this figure, the Y-axis, X-axis, head raising / lowering of the head unit, nozzle raising / lowering, and R-axis servomotors 9 and 1 are shown.
5, 24, 26, 28 and the position detecting means 10, 16, 25, 27, 29 provided respectively, are electrically connected to the axis controller (driver) 41 of the main controller 40. The laser unit 31 is a laser unit calculator 32.
Is electrically connected to the laser unit arithmetic unit 32.
Via the input / output means 42 of the main controller 40
It is connected to the. Further, the interference position detecting means 30 is connected to the input / output means 42. Also, the main controller 4
0 is provided with a storage means 45.

FIG. 6 specifically shows the configuration of the main controller 40, particularly the configuration of the main calculation section 43.

The main arithmetic unit 43 performs various arithmetic processes necessary for sucking and mounting the component 20 as control for the main operation of the component mounting apparatus. Further, at the stage of the preparatory work, the main calculation unit 43 moves the suction nozzle 21 up and down as the nozzle element detection processing and the processing based on the nozzle element detection processing, and determines the nozzle height when the suction nozzle tip reaches the position corresponding to the laser unit 31. By detecting a certain reference nozzle height and storing it in the storage means 45, the reference nozzle height detecting means 51 is configured. Then, when the component suction state is determined by the determination unit 53 based on the detection of the projected image of the component by the laser unit 31 after the component suction during the main work, the height position of the suction nozzle is determined based on the reference nozzle height. The height setting means 52 is configured by setting the height.

Further, the main calculation section 43 rotates the suction nozzle 21 at the stage of the preparatory work while the laser unit 31 is being rotated.
The rotation center of the suction nozzle 21 is detected on the basis of the data when the projection of the suction nozzle 21 is detected and stored in the storage means 45 to configure the rotation center detection means 54, and at the time of this work. After the component suction, while rotating the suction nozzle 21, the deviation of the component suction position is obtained based on the data obtained by detecting the projected width of the component 20 by the laser unit 31 and the rotation center, and the mounting position correction amount corresponding thereto is obtained. The correction means 55 is configured by the calculation.

In the apparatus of this embodiment, after the suction nozzle 21 is attached to the head unit 5 in the preparatory stage, the function as the reference nozzle height detecting means 51 is fulfilled by the processing shown in FIG. The function as the rotation center detecting means 54 is fulfilled by the processing shown in FIG.

These processes will be described below with reference to FIGS. 8, 9 and 11 to 13.

In the processing of the reference nozzle height detecting means 51 shown in the flow chart of FIG. 7, after the suction nozzle 21 is attached to the head unit 5, the suction nozzle 21 is moved to the lowered position as shown in FIG. 8 (a). From a certain state, the suction nozzle 21 is moved up by operating the elevation drive means such as the nozzle elevation servomotor 26 for elevating the suction nozzle 21 in the Z-axis direction with respect to the head unit 5 (step S1). Then, the projection of the suction nozzle 21 is detected by the laser unit 31, and it is determined whether or not the projection of the suction nozzle 21 disappears (step S).
2). While the tip of the suction nozzle 21 is below the irradiation position of the laser beam (shown by the broken line in FIG. 8), the projection is detected, and the determination in step S2 is NO,
In this case, the suction nozzle 2 is returned by returning to step S1.
The rise of 1 continues.

The suction nozzle 21 is at the position shown in FIG.
That is, when the tip of the suction nozzle 21 rises to a position past the laser irradiation position of the laser unit 31, the laser light is not blocked by the suction nozzle 21 and the determination in step S2 becomes NO. At this time, the process proceeds to step S3, The Z-axis coordinate Zo at that time is stored in the storage means 45 as the reference nozzle height.

This reference nozzle height Zo is shown in FIG.
In the process of this work shown in the flowchart of FIG.
It is used for setting the recognition height in the process of raising the suction nozzle 21 to the recognition height in order to determine the component suction state based on the detection of the projection of the. That is,
Assuming that the height from the upper suction surface of the component 20 to a portion suitable for component recognition is H (see FIG. 9), the recognition height is [Zo-H] based on this height H and the reference nozzle height Zo. (However, the Z-axis coordinate is positive in the downward direction).

Further, in the processing of the rotation center detecting means 54 shown in the flowchart of FIG. 10, the elevating means is operated until the vicinity of the tip of the component 20 reaches the height position corresponding to the laser irradiation position of the laser unit 31. As a result, the suction nozzle 21 is moved in the Z-axis direction (elevation) (steps S5 and S6). Then, at the height position, the suction nozzle is rotated from 0 ° to 360 ° by operating the R-axis servomotor 28 serving as the rotation driving means, and during that time, the laser unit 3
Based on the detection of the projection of the suction nozzle 21 by 1, the center value of the suction nozzle 21 is measured, and this is temporarily stored in the register (step S7).

In this case, for example, when the suction nozzle 21 is attached to be inclined with respect to the R axis or the suction nozzle 21 is bent, the center O'of the suction nozzle 21 and the rotation center O coincide with each other as shown in FIG. If the suction nozzle 21 is rotated in this state without moving, the nozzle center O ′ moves as shown in FIG. 12, and the change of the nozzle center position according to the rotation angle changes as shown in FIG.
The waveform is as shown in FIG.

Therefore, in step S8, the suction nozzle 21
The values of the nozzle center position Nc detected during one rotation of the are compared, and then the minimum value Ncmin and the maximum value Ncm of the nozzle center position Nc are compared.
ax is extracted, and subsequently, in step S9, the rotation center position N
co is

[0032]

## EQU1 ## Nco = (Ncmin + Ncmax) / 2 is calculated.

FIG. 14 is a flow chart showing a series of processes from the picking up of components to the mounting after the above-described preparatory stage processing. It includes a process for correcting an error due to the variation in the position and the direction of the. The processing of this flowchart will be described with reference to FIGS.

In this process, first, step S11.
Then, a negative pressure for suction is applied to the suction nozzle 21 by a negative pressure generating means (not shown), and in step S12,
X, Y, θ by driving a predetermined servo motor
The movement of the axis is started. Then, in step S13, it is checked whether or not the central coordinates (X, Y, θ) of the suction nozzle 21 have reached the target position range for suction. When the target position range is reached, the head 23 descends (step S14) and the suction nozzle 21 descends (step S14).
15), the supply tape 4a of the component supply unit 4 at a predetermined lowered position
Then, the component 20 is sucked (step S16), the suction nozzle 21 is raised (step S17), and the head 23 is also raised (step S18).

In step S19, it is checked whether or not the suction nozzle 21 has risen to a position where it comes out of the interference area with the component supply section 4, and while it does not come out, steps S17 to S19.
Is repeated. Upon exiting the interference area, the head unit 5 is moved to the mounting position (step S2).
0), the suction nozzle 21 is raised to the component recognition height (step S21), that is, the suction nozzle 21 is raised to the height position where the component 20 corresponds to the laser unit 31, as shown in FIG. In this case, the reference nozzle height Z ₀ stored in the storage means 45 is read by the processing shown in the flowchart of FIG. 7 at the stage of the above-mentioned preparatory work, and based on this, the component recognition height is determined as described above. Is [Zo
-H], and the suction nozzle 21 is raised to this height position.

Then, in this state, the process of checking the component suction state and obtaining the mounting position correction amount (steps S22 to S28) are performed. In order to ensure the detection of the minimum projection width, which will be described later, it is preferable to preliminarily rotate the suction nozzle 21 by a fixed amount in the direction opposite to the rotation direction at the time of detection before step S22.

In step S22, the projection width W _S of the part at that time, its center position C _S, and the rotation angle θ _S are detected. Subsequently, in step S23, the projection width of the component is detected while the suction nozzle 21 is rotated in the predetermined direction. Then, when it is determined in step S24 that the image has been rotated by the constant rotation angle θ _e , in step S25 the minimum projection width value W
min, the center position C _m and the rotation angle θ _m at the minimum projection width are read. Then, it is determined based on the detection data whether or not the component suction is normal (step S26), and if not normal, the component is discarded (step S27), and if normal, X, Y, based on the detection data. The mounting position correction amounts X _C , Y _C , and θ _C in each direction of θ are calculated (step S28).

In step S26, the parts are
It is normally adsorbed as shown in (a), or
6 (b) and (c), it is determined whether or not it is adsorbed in an upright abnormal state. Specifically, it is checked whether or not the following equations are satisfied. If any one of them is satisfied, the abnormality is detected. Is determined. Note that α in the formula is a safety factor.

[0039]

## EQU00002 ## Wmin <length of short side of component × (1−α) Wmin> length of short side of component × (1 + α) θ _m = θ _S θ _m = θ _{e Further} , the correction amount X _C in step S28, Y _C , θ _C
Is calculated as follows.

That is, as is apparent from FIG. 17, assuming that the component 20 is mounted with the long side in the X-axis direction, among the component mounting position correction amounts X _C , Y _C , and θ _C. The correction amount in the Y and θ directions is Y _C and θ _C

[0041]

## EQU3 ## Y _C = C _m −Nco θ _C = θ _m . Nco is the rotation center position (position on the projection) of the suction nozzle 21, and the value calculated by the processing shown in the flowchart of FIG. 10 at the stage of the preparatory work and stored in the storage means 45 is read out. It is a thing.

In FIG. 17, O is the rotation center point of the suction nozzle, b and B are the component center points in the initial state and the minimum projection width state, and ΔaOb≡ΔAOB.

L _AB : Length of line segment AB _ab : Length of line segment ab L _AO : Length of line segment AO L _aO : Length of line segment aO Y _ab : On the Y axis of line segment ab Projection length of Y _aO : If the projection length of the line segment aO on the Y axis is

[0044]

[Number 4] _{Nco-C S = Y aO +} Y ab

[0045]

[ _Formula 5] Y _aO = L _aO · sin (θ _m + θ _S ).

[0046]

## _EQU6 ## Y _ab = L _ab .cos (θ _m + θ _S ). Then, L _aO = L _AO = X _C , L _ab = L _AB = Nco
Since −C _m , X _C is derived from the above equations as in the following equation.

[0047]

## EQU7 ## X _C = {(Nco-C _S )-(Nco-C _m ) ・ cos (θ _m
+ Θ _S )} / sin (θ _m + θ _S ) When the calculation in step S28 is completed, in step S29,
The head unit 5 is moved to the corrected component mounting position,
In step S30, the central coordinates G (X, Y,
It is checked whether or not θ) has reached the mounting position range on the printed circuit board 3. Then, when it falls within the mounting position range, the head 23 descends (step S31), and the suction nozzle 21 also descends (step S32). When the height of the suction nozzle 21 falls within the target position range (step S33), By cutting the negative pressure (step S34), the component 2
0 is mounted on the printed circuit board 3. Then, the suction nozzle 21 rises (step S35), and the head 23 also rises (step S36).

According to the apparatus of this embodiment as described above,
In the main component mounting operation shown in the flowchart of FIG. 14, the suction nozzle 21 provided in the head unit 5 sucks the component 20 and mounts it on the printed circuit board 3, and at the same time, the component 20 moves in the direction In contrast to the occurrence of an error due to the position variation, a correction amount corresponding to the error is obtained in the processing of steps S21 to S28, and the mounting position is corrected, so that the component 20 is mounted with high accuracy. This processing is performed during the movement to the mounting position after the suction, and a series of work from the suction to the mounting is efficiently performed.

Further, both the suction nozzle 21 and the head 23 holding the suction nozzle 21 are driven by servomotors 24 and 26 to move up and down, and descend during suction (steps S14 and S1).
5), ascending (steps S17, S18), descending at the time of mounting (steps S31, S32), ascending (step S34,
The speed of each operation of S35) is increased, and the work efficiency is further increased.

In the stage of the preparatory work, in the processing shown in the flowchart of FIG. 10 as the rotation center detecting means 54, the rotation center position N of the suction nozzle 21 is detected based on the detection of the projection of the suction nozzle 21 by the laser unit 31.
The co is obtained, and the rotation center position Nco obtained in the processing at the stage of this preparatory work is used in the processing for obtaining the component mounting position correction amount in the main work of mounting the components (step S28).

By doing so, the accuracy of correcting the component mounting position can be improved. That is, even if there is a deviation between the nozzle rotation center O and the nozzle center O ′ due to an inclination or bending of the suction nozzle 21 due to an assembly error, the rotation of the suction nozzle 21 is performed by the processing as the rotation center detection means 54 in the preparation stage. The center Nco is correctly calculated, and based on this,
By the processing as the correction means in the above step S28, the deviation of the component suction position from the nozzle rotation center O and the mounting position correction amounts Xc, Yc, and θc corresponding thereto are accurately detected.

[0052] The process shown in the flowchart of FIG. 7 at the stage of further preparatory work in this embodiment, reference nozzle height Z ₀ is determined, the step in the reference nozzle height Z ₀ is, the work of the component mounting It is used for setting the recognition height in the process of S21. By doing so, the processes of steps S22 to S28 are accurately performed. That is, to set the recognition height, the suction nozzle 2
Although it is possible to use a preset value according to the type of 1, etc., this alone may cause the laser irradiation position of the component to deviate from the proper position when the nozzle height varies due to assembly error or the like. There is. On the other hand, in the present embodiment, since the recognition height is set based on the reference nozzle height Zo detected in the preparation stage, there is variation in the reference nozzle height Zo due to an assembly error or the like. Also, the recognition height is accurately adjusted, the projection width is detected, and the determination based on the detection is performed (step S26) and the correction (step S2).
The processing such as 8) will be performed accurately.

[0053]

As described above, according to the mounting method and the apparatus of the present invention, after the suction nozzle is attached, the suction nozzle is projected by the optical detection means provided in the head unit while rotating the suction nozzle. Is detected,
Detect the center of rotation of the suction nozzle, and during the subsequent main work,
While the suction nozzle is being rotated, the deviation of the suction position of the component is determined based on the projection of the component detected by the optical detection means and the rotation center. Even when there is a deviation, the component mounting position can be accurately corrected.

[Brief description of drawings]

FIG. 1 is a plan view of a component mounting device according to an embodiment of the present invention.

FIG. 2 is a front view of the same device.

FIG. 3 is an enlarged side view of a mounting head unit.

FIG. 4 is an enlarged front view of a nozzle replacement station.

FIG. 5 is a block diagram showing a control system.

FIG. 6 is a block diagram showing a configuration of a main controller in the control system.

FIG. 7 is a flowchart showing a process as a reference nozzle height detecting means.

8A and 8B are explanatory diagrams of operations in the flowchart of FIG. 7.

FIG. 9 is an explanatory diagram related to calculation of a recognition height.

FIG. 10 is a flowchart showing processing as rotation center detection means.

FIG. 11 is an explanatory diagram showing a deviation between a rotation center and a nozzle center.

FIG. 12 is an explanatory diagram showing a locus of a nozzle center and a rotation center.

FIG. 13 is an explanatory diagram showing a displacement of a nozzle center according to a rotation angle.

FIG. 14 is a flowchart showing a specific procedure for component suction and mounting.

FIG. 15 is an explanatory diagram showing a state when a component projection width is detected.

FIG. 16 (a) shows a normal adsorption state, and FIG. 16 (b).
(C) is explanatory drawing which shows an adsorption | suction abnormal state.

FIG. 17 is a diagram for explaining how to determine a mounting position correction amount.

[Explanation of symbols]

 3 Printed Circuit Board 4 Component Supply Section 5 Head Unit 20 Component 21 Adsorption Nozzle 9, 15, 24, 26, 28 Servo Motor 10, 16, 25, 27, 29 Position Detection Means 31 Laser Unit (Optical Detection Means) 34 Nozzle Replacement Station 40 main controller 43 main calculation unit 45 storage means 54 rotation center detection means 55 correction means

Claims (2)

[Claims] 1. After performing a preparatory work for attaching a suction nozzle selected from a plurality of types of suction nozzles to a head unit according to the type of the component to be mounted, the head unit sucks the component and In the component mounting method for performing the main work of mounting at a predetermined position, after mounting the suction nozzle to the head unit in the above-mentioned preparatory work,
While rotating the suction nozzle, the center of rotation of the suction nozzle is detected based on the detection of the projection of the suction nozzle by the optical detection means provided in the head unit, the center of rotation of the suction nozzle is stored, and the book after that is stored. During the operation, the deviation of the component suction position is obtained based on the projection of the component detected by the optical detection means and the rotation center of the suction nozzle while rotating the suction nozzle that sucks the component. How to wear. 2. A head unit, which is movable between a component supply side and a mounting side and to which a suction nozzle is attached, adsorbs a component from the component supply side by the head unit, and mounts the component on a predetermined side of the mounting side. In a component mounting device mounted at a position, an optical detection unit that detects projection of an article by a parallel light beam irradiation unit and a light receiving unit that are provided in a head unit, a rotation drive unit that rotates the suction nozzle, and the suction nozzle. A rotation center detection means for detecting the rotation center of the suction nozzle based on the data when the projection of the suction nozzle is detected by the optical detection means while rotating, and a storage means for storing the rotation center of the suction nozzle. After the suction nozzle picks up the component, the suction nozzle is rotated and the projection of the component is detected by the optical detection means. A component mounting apparatus comprising: a correction unit that determines a mounting position correction amount corresponding to a component suction position shift based on the detection data of the above and the rotation center read from the storage unit.