JP2007198903A - Position adjusting method and position adjusting apparatus for transfer equipment, and ic handler - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a position adjusting method and a position adjusting apparatus for a transfer equipment, which are simply structured, performs a calibration operation easily and detects a shifted position precisely, and also to provide an IC handler. <P>SOLUTION: An electronic component and a suction nozzle are lowered relatively to linear beams emitted from X-axis and Y-axis light emitting devices 31a, 32a so as to block the beams. X-axis and Y-axis line sensors 31b, 32b output X-axis and Y-axis component position detection signals SLTX, SLTY when the electronic component T blocks the beams. The X-axis and Y-axis line sensors 31b, 32b output X-axis and Y-axis nozzle position detection signals SLNX, SLNY when the suction nozzle blocks the beams. A CPU 51 acquires the center position of the electronic component T and the center position of the suction nozzle 25 from the X-axis and Y-axis component position detection signals SLTX, SLTY and the X-axis and Y-axis component position detection signals SLTX, SLTY, and computes a sifted amount thereof. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a position adjustment method for a transfer device, a position adjustment device for a transfer device, and an IC handler.

  2. Description of the Related Art Generally, an electronic device testing apparatus such as a semiconductor chip is provided with an IC handler as a transfer device. The IC handler picks up and holds the electronic components housed in the tray pocket and separates them from the test socket. After the test is finished, the electronic components are picked up and held in the collection tray pocket according to the test result. It is intended to leave.

  This type of IC handler needs to accurately hold and hold a predetermined position (center position) of the electronic component, and to accurately dispose the electronic component at a predetermined position. For this reason, the movement position is adjusted in advance so that the hand that holds the electronic component by suction (the center position of the holding member) moves to a predetermined movement destination.

  However, when the test is performed by heating the electronic component with a heater or the like during operation, the position of the pocket (center position) which is deviated by the supply tray being thermally expanded and deformed by the heating source is determined in advance. There is a deviation from the position of the movement destination of the gripping member. Further, the position of the movement destination of the gripping member that is determined in advance is biased due to a variation in the amount of movement of the gripping member to the movement destination due to mechanical distortion that proceeds during operation. Furthermore, since each tray has individual differences, each time the tray is changed to another tray, the position of the pocket (center position) and the movement destination of the gripping member determined in advance by the individual difference of the tray. Deviation occurs from the position.

In view of this, there has been proposed a technique in which the center position of the gripping member is obtained and the position is adjusted based on the center position of the gripping member to adjust the deviation (for example, Patent Document 1).
However, in the above-mentioned patent document 1, only the center position of the gripping member is obtained, and the relative positional relationship with the electronic component to be sucked and gripped is not considered. Therefore, the gripping member can be moved to a predetermined movement destination, but the gripping member does not always hold the electronic component by suction while the center position of the gripping member and the center position of the electronic component match. Similarly, it is not always possible to place an electronic component that has been sucked and held in a pocket or a test socket as a movement destination.

  This is because the pocket for receiving the electronic component (same as for the test socket) is tapered around the edge to prevent the electronic component from being caught completely by the edge, and the pocket is slightly larger than the electronic component. It is formed larger. Therefore, the electronic component housed in the pocket can be freely arranged within a limited range in the pocket, and even if the hand is moved to a predetermined position with high accuracy, In a state where the center positions of the electronic components are matched, the gripping member cannot suck and grip the electronic components.

  Therefore, for example, when the electronic component is separated from the test socket, the electronic component is obliquely separated from the hand (dropped) due to the gravity balance. As a result, a state occurs in which the electronic component is caught at the edge and is not completely accommodated.

Also proposed is a device that uses a component recognition camera to capture an electronic component gripped by a gripping member, perform image processing to determine the displacement position of the electronic component, correct the movement destination from the determined displacement position, and place it in a test socket or the like. (Patent Document 2).
JP 2005-183760 A JP 2003-255018 A

  By the way, since the image data of an electronic component is acquired using the component recognition camera in Patent Document 2, and the image recognition is performed using the image data to obtain the shift position, the load on the control device (CPU) increases and the cost increases. Device. In addition, when taking an image of an electronic component, the image is taken with light applied. At this time, since the degree of reflected light from the connection terminal of the electronic component differs depending on the type of the electronic component, it is necessary to perform a calibration operation each time in order to perform highly accurate image processing.

  This calibration operation requires obtaining and storing a large amount of imaging information for recognizing electronic components such as aperture adjustment, setting of light intensity area, and focusing according to the electronic component to be tested. Operation was not easy and took a lot of time.

  The present invention has been made to solve the above-described problems, and its purpose is to simplify the configuration, to easily perform a calibration operation, and to detect any position with high accuracy. An object of the present invention is to provide a position adjustment method for a transfer device, a position adjustment device for a transfer device and an IC handler.

  In the position adjustment method of the transport device of the present invention, the gripping member of the hand is moved to the gripping position of the supply unit, the transported object arranged in the supply unit is gripped by the gripping member, and the gripped transported object is In the position adjustment method of the transport device disposed in the receiving unit, the transport object disposed in the supply unit is previously gripped by the grip member, and the center position of the gripped transport object and the state of gripping the transport object are When the amount of deviation from the center position of the hand is obtained and the conveyed object arranged in the supply unit is grasped by the grasping member, the grasping position of the grasping member in the supply unit is determined based on the obtained amount of deviation. It correct | amends and the conveyed product arrange | positioned at the said supply part is hold | gripped with the said holding member.

  According to the position adjustment method of the transport device of the present invention, there is an error in the gripping position of the transported object arranged in the supply unit due to formation variation (individual difference) of the supply unit, thermal expansion of the supply unit, mechanical distortion due to operation, and the like. Even if it occurs, the gripping member can grip the transported object arranged in the supply unit so that the center position of the transported object matches the center of the gripping member.

  According to the position adjustment method of the transport device of the present invention, the gripping member of the hand gripping the transported object disposed in the supply unit is moved to the release position of the receiving unit, and the transported object gripped by the gripping member is disposed in the receiving unit. In the position adjustment method of the transporting apparatus, the transported object disposed in the receiving unit is gripped by the gripping member in advance, and the gripper in the state of gripping the transported object and the center position of the gripped transported object The amount of deviation from the center position of the member is obtained, and when the conveyed product is arranged in the receiving portion by the gripping member, the separation position of the receiving portion is corrected based on the obtained amount of deviation, and the conveyed product is received. Placed in the section.

  According to the position adjustment method of the conveying device of the present invention, there is an error in the separation position of the gripping member in the receiving portion of the conveyed object due to formation error (individual difference) of the receiving portion, thermal expansion of the receiving portion, mechanical distortion due to operation, and the like. Even if it occurs, the gripping member can disengage and place the conveyed product at the arrangement position of the receiving unit so that the central position of the receiving unit matches the central position of the conveyed product.

The position adjustment device of the transport device according to the present invention moves the gripping member of the hand to the gripping position of the supply unit, grips the transported object arranged in the supply unit with the gripping member, and removes the gripped transported object. In the position adjustment device of the transport device disposed in the receiving unit, the first light emitting device that emits the first line light in a line shape in the first direction, and the first light emitting device are arranged to face each other, A first line sensor that receives the first line light; a second light emitting device that emits line-shaped second line light in a second direction orthogonal to the first direction; and the second light. A second line sensor that is arranged to face the emission device and receives the second line light, and the gripping member in a state of gripping the transported object, perpendicular to the first direction and the second direction. Move in the third direction to hold the transported object and the grip A moving means for passing the first line light and the second line light, and a center position of the conveyed object in the first direction and the gripping member based on a detection signal from the first line sensor; A first direction deviation amount calculating means for calculating a deviation from the center position as a first direction deviation amount, and based on a detection signal from the second line sensor, the center position of the conveyed object in the second direction and the grip A second direction deviation amount calculating means for calculating a deviation from the center position of the member as a second direction deviation amount; and gripping of the holding member in the supply unit based on the first direction deviation amount and the second direction deviation amount First correction value calculating means for obtaining a first correction value of the position.

  According to the position adjustment device of the transfer device of the present invention, the moving member moves the holding member in the third direction orthogonal to the first direction and the second direction while holding the transfer object. The first direction deviation amount between the center position of the conveyed product and the center position of the gripping member in the first direction, and the second direction deviation amount between the center position of the conveyed object and the center position of the gripping member in the second direction can be calculated. . Therefore, the first direction displacement amount and the second direction displacement amount are calculated in a short time with a simple configuration of moving in one direction (third direction), and the gripping position of the gripping member supply portion is calculated. One correction value can be obtained. As a result, even if an error occurs in the gripping position of the transported object arranged in the supply part due to the formation variation (individual difference) of the supply part, thermal expansion of the supply part, mechanical distortion due to operation, etc., the center position of the transported object The gripping member can grip the conveyed object arranged in the supply unit so that the center of the gripping member coincides.

  The position adjustment device of the transport device of the present invention moves the gripping member of the hand gripping the transported object arranged in the supply unit to the release position of the receiving unit, and arranges the transported object gripped by the gripping member in the receiving unit. In the position adjustment device of the transport device, the first light emitting device that emits the first line light in a line shape in the first direction, the first light emitting device, the first light emitting device, and the first light emitting device that are opposed to each other, A first line sensor that receives line light, a second light emitting device that emits line-shaped second line light in a second direction orthogonal to the first direction, and relative to the second light emitting device The second line sensor that receives the second line light, and grips the transported object disposed in the receiving unit, and grips the gripping member in a state of gripping the transported object. Move in one direction and a third direction orthogonal to the second direction And the moving means for passing the first line light and the second line light through the transported object and the gripping member, and the detection signal from the first line sensor based on the detection signal from the first line sensor. Based on a detection signal from the second line sensor, a first direction deviation amount calculating means for calculating a deviation between the center position of the conveyed product and the center position of the gripping member as a first direction deviation amount, in the second direction Based on the second direction deviation amount calculating means for calculating the deviation between the center position of the conveyed product and the center position of the gripping member as a second direction deviation amount, and based on the first direction deviation amount and the second direction deviation amount, And a second correction value calculating means for obtaining a second correction value of the separation position of the gripping member in the receiving portion.

According to the position adjustment device of the transfer device of the present invention, the moving member moves the holding member in the third direction orthogonal to the first direction and the second direction while holding the transfer object. The first direction deviation amount between the center position of the conveyed product and the center position of the gripping member in the first direction, and the second direction deviation amount between the center position of the conveyed object and the center position of the gripping member in the second direction can be calculated. . Therefore, the first direction deviation amount and the second direction deviation amount are calculated in a short time with a simple configuration of moving in one direction (third direction), and the first position of the separation position at the receiving portion of the gripping member is calculated. 2 correction values can be obtained. As a result, even if there is an error in the separation position at the receiving part of the transported object due to the formation error (individual difference) of the receiving part, thermal expansion of the receiving part, mechanical distortion due to operation, etc., the center position of the receiving part and the transported object The gripping member can detach and arrange the conveyed product at the receiving position of the receiving portion so that the center positions coincide.

An IC handler of the present invention includes the position adjusting device for the transfer device.
According to the IC handler of the present invention, the position adjustment can be performed in a short time by the position adjusting device, and the IC handler can immediately perform the work for gripping the electronic component from the supply unit and transporting it to the receiving unit.

An IC handler of the present invention includes the position adjusting device for the transfer device.
According to the IC handler of the present invention, the position adjustment can be performed in a short time by the position adjusting device, and the IC handler can immediately perform the work for gripping the electronic component from the supply unit and transporting it to the receiving unit.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings.
FIG. 1 shows a plan view of an IC handler 10 as a transport device. The IC handler 10 includes first and second hot plates 12 and 13 on the upper surface 11 a of the base 11. Each hot plate 12, 13 has a plurality of rectangular pockets 12 a, 13 a recessed on the upper surface thereof. The plurality of pockets 12a and 13a formed in each hot plate 12 and 13 are formed at predetermined intervals in two rows in the front-rear direction (Y direction). In the first and second hot plates 12 and 13, electronic parts T before inspection are arranged in the pockets 12 a and 13 a, and the arranged electronic parts T are heated (preliminarily heated). The first hot plate 12 and the second hot plate 13 are configured such that the electronic components T in the pockets 12a and 13a are controlled to be heated to a desired temperature separately.

The electronic component T is a semiconductor chip in the present embodiment, and its outer shape is a rectangular parallelepiped as shown in FIG.
First and second test sockets 14 and 15 are provided on the upper surface 11 a of the base 11 and at the rear (Y direction) positions of the first and second hot plates 12 and 13. The first and second test sockets 14 and 15 as receiving parts are rectangular recesses, and a plurality of connection terminals are formed on the bottom surface thereof, and the measuring device U1 provided in the base 11 (see FIG. 12). ) And are electrically connected. When the electronic component T is disposed in the first and second test sockets 14 and 15, the electronic component T has an external terminal formed on the lower surface Tb thereof electrically connected to the measuring device U1. The electrical characteristics are inspected by U1.

  In the right half of the base 11, a supply tray 16, a plurality of non-defective product collection trays 17, and a plurality of defective product collection trays 18 are arranged. The supply tray 16 as a supply unit has a plurality of rectangular pockets 16a recessed in two lines in the front-rear direction (Y direction). As shown in FIG. 3, each pocket 16a of the supply tray 16 accommodates an electronic component T before inspection. As with the supply tray 16, the non-defective product collection tray 17 has a plurality of rectangular pockets 17a that are recessed in two lines in the front-rear direction (Y direction). Each pocket 17a of the non-defective product collection tray 17 accommodates an electronic component T that is determined to be non-defective for the inspection of the measuring device U1. As with the supply tray 16, the defective product collection tray 18 has a plurality of rectangular pockets 18 a recessed in two rows in the front-rear direction (Y direction). Each pocket 18a of the defective product collection tray 18 accommodates an electronic component T determined to be defective for the inspection of the measuring device U1.

That is, the electronic component T before inspection accommodated in the pocket 16a of the supply tray 16 is accommodated in one of the pockets 12a and 13a of the first and second hot plates 12 and 13 and heated to a predetermined temperature. Is done. The electronic component T heated in the pockets 12a and 13a is disposed in one of the first and second test sockets 14 and 15, and is measured and inspected by the measuring device U1. Then, the electronic component T determined to be a non-defective product for the inspection of the measuring device U1 is disposed in a predetermined pocket 17a of a predetermined non-defective product collection tray 17. On the contrary, the electronic component T determined to be defective for the inspection of the measuring apparatus U1 is placed in a predetermined pocket 18a of a predetermined defective product collection tray 18.

Next, a transport mechanism that grips and transports the electronic component T from a predetermined position to a predetermined position will be described.
In FIG. 1, a Y-axis guide member 21 is installed on the left side of the base 11 in the front-rear direction (Y direction) as the second direction, and the X-axis guide member 22 disposed on the upper side is placed in the front-rear direction (Y direction). It is movably supported. The X-axis guide member 22 extends in the left-right direction (X direction) as the first direction, and its base end portion is supported and connected to the Y-axis guide member 21 so as to be movable in the front-rear direction (Y direction). Is extended to the right side of the base 11. The X-axis guide member 22 is moved along the Y-axis guide member 21 via a known moving mechanism that is driven by forward / reverse rotation of the Y-axis motor MY provided in the Y-axis guide member 21, that is, in the front-rear direction ( (Y direction) is reciprocated.

  The X-axis guide member 22 supports a carriage 23 on its rear side surface so as to be movable in the left-right direction (X direction). The carriage 23 reciprocates along the X-axis guide member 22, that is, in the left-right direction (X direction) via a known moving mechanism that is driven by forward and reverse rotation of an X-axis motor MX provided in the X-axis guide member 22. It is supposed to move. Therefore, the carriage 23 controls the driving of the Y-axis motor MY and the X-axis motor MX, and thereby the first and second hot plates 12, 13 provided on the upper surface 11a (XY plane) of the base 11 and the first and second hot plates 12. The second test sockets 14 and 15, the supply tray 16, the respective non-defective product collection trays 17, and the respective defective product collection trays 18 are moved and arranged.

  The carriage 23 is provided with a hand 24. The hand 24 has a hand main body 24a fixed to the carriage 23. As shown in FIG. 4, the hand main body 24a has a cylindrical suction nozzle 25 as a gripping member in a vertical direction (Z direction) as a third direction. ) Is movably provided. The suction nozzle 25 extends in the vertical direction via a known moving mechanism that is driven by forward / reverse rotation of the Z-axis motor MZ provided in the hand body 24a, with the central axis C1 extending in parallel with the vertical direction (Z direction). It reciprocates in the (Z direction).

  The suction nozzle 25 has a passage 26 connected to a negative pressure generation source (not shown) via a switching valve BL (see FIG. 12) such as an electromagnetic valve. When the negative pressure source is connected by switching the switching valve BL, negative pressure is supplied to the opening end 25a of the suction nozzle 25, and the electronic component T is opened to the opening end 25a as shown in FIG. It is designed to adsorb to. On the other hand, when the negative pressure source is connected to the atmosphere by switching the switching valve BL, the opening end 25a of the suction nozzle 25 becomes atmospheric pressure, and the sucked electronic component T is detached from the opening end 25a.

  Accordingly, the suction nozzle 25 is positioned directly above the electronic component T accommodated in the pocket 16a of the supply tray 16, the pockets 12a and 13a of the first and second hot plates 12 and 13, and the first and second test sockets 14 and 15. Respectively. Subsequently, the suction nozzle 25 is moved downward to a position where it contacts the upper surface of the electronic component T, and the electronic component T is detached by the suction nozzle 25, whereby the pockets 16a, 12a, 13a, the test socket 14 are removed. , 15 etc., each of the electronic components T can be taken out.

Further, the suction nozzle 25 is connected to the pockets 12a and 13a of the first and second hot plates 12 and 13, the first and second test sockets 14 and 15, the pocket 17a of the non-defective product collection tray 17, or the pocket 18a of the defective product collection tray 18. It is arranged at the position just above. Subsequently, when the suction nozzle 25 is moved downward and the electronic component T sucked by the suction nozzle 25 is removed, the electronic component T is placed in the pockets 12a, 13a, 17a, 18a, the test sockets 14, 15 and the like, respectively. Can be accommodated.

  That is, the electronic mechanism T of the pocket 16a of the supply tray 16 is transported to the pockets 12a and 13a of the first and second hot plates 12 and 13 by the transport mechanism, and the electronic components T of the pockets 12a and 13a are transported to the first. It can be transported to one of the first and second test sockets 14 and 15. The transport mechanism transports the electronic components T of the first and second test sockets 14 and 15 to a predetermined pocket 17 a of a predetermined non-defective product collection tray 17 or a predetermined pocket 18 a of a predetermined defective product collection tray 18. Can do.

A shift position detection device 30 is provided on the upper surface 11 a of the base 11 between the first and second hot plates 12 and 13 and the first and second test sockets 14 and 15.
FIG. 6 is an overall perspective view of the shift position detecting device 30, and FIG. 7 is a plan view thereof. In FIG. 6, the misalignment position detection device 30 includes an X-axis misalignment position detection unit 31 and a Y-axis misalignment position detection unit 32. The X-axis deviation position detection unit 31 includes an X-axis light emitting device 31a as a first light emitting device and an X-axis line sensor 31b as a first line sensor. The Y-axis deviation position detection unit 32 includes a Y-axis light emitting device 32a as a second light emitting device and a Y-axis line sensor 32b as a first line sensor.

  The X-axis light emitting device 31a and the X-axis line sensor 31b are arranged at a constant interval so as to face each other in the front-rear direction (Y direction). The Y-axis light emitting device 32a and the Y-axis line sensor 32b are arranged at a constant interval so as to face each other in the left-right direction (X direction). A planar rectangular space indicated by a two-dot chain line surrounded by the respective housings of the X-axis light emitting device 31a and the X-axis line sensor 31b and the respective housings of the Y-axis light emitting device 32a and the Y-axis line sensor 32b. Is a detection space Z. The detection space Z is a space that can accommodate the electronic component T from above with a margin.

  The X-axis light emitting device 31a and the Y-axis light emitting device 32a include a light emitting diode, a corinometer, a cylindrical lens, and the like, and the light from the light emitting diode is converted into parallel light by the collimator, and the parallel light is linearly formed by the cylindrical lens. Beams LX and LY are emitted.

  That is, the X-axis light emitting device 31a emits the beam LX as the first line light in a line shape parallel to the left-right direction (X direction) toward the X-axis line sensor 31b located at the opposite position. Further, the Y-axis light emitting device 32a emits a beam LY as a second line light in a line shape parallel to the front-rear direction (Y direction) toward the Y-axis line sensor 32b at the opposite position.

  The X-axis line sensor 31b and the Y-axis line sensor 32b each include a light receiving element array such as a photodiode provided in a line, and the light receiving element array receives the corresponding linear beams LX and LY, respectively. Each light receiving element performs photoelectric conversion to output an electrical signal. The X-axis line sensor 31b has a slit-shaped light receiving surface formed in parallel with the left-right direction (X direction), and the light-receiving element array receives the line-shaped beam LX emitted from the X-axis light emitting device 31a. To do. The Y-axis line sensor 32b has a slit-shaped light receiving surface formed in parallel with the front-rear direction (Y direction), and the light-receiving element array receives the line-shaped beam LY emitted from the Y-axis light emitting device 32a. To do.

In this embodiment, the height positions of the linear beams LX and LY parallel to the XY plane (positions in the Z direction from the upper surface 11a of the base 11) are such that the electronic component T is placed on the upper surface 11a of the base 11. When arranged, the upper surface Ta of the electronic component T is set to a height position that is sufficiently below the beams LX and LY.

  Accordingly, the suction nozzle 25 is moved downward. When the suction nozzle 25 that sucks and holds the electronic component T in the detection space Z is accommodated from above, first, the electronic component T passes through the line-shaped beams LX and LY from the top to the bottom, and then the suction nozzle 25 continues to the line. The shaped beams LX and LY are blocked.

  At this time, as shown in FIG. 8, the part facing the X-axis light emitting device 31 a side of the electronic component T blocks part of the line-shaped beam LX, and on the Y-axis light emitting device 32 a side of the electronic component T. The facing portion blocks a part of the line beam LY. Subsequently, as shown in FIG. 9, the portion of the suction nozzle 25 facing the X-axis light emitting device 31 a blocks a part of the line-shaped beam LX, and the suction nozzle 25 faces the Y-axis light emitting device 32 a. The facing portion blocks a part of the line beam LY.

  The X-axis line sensor 31b receives the linear beam LX partially blocked by the electronic component T, thereby indicating which light receiving element of the light receiving element array has received the light or not received the light. Are output from each light receiving element. That is, the X-axis line sensor 31b outputs an X-axis component position detection signal SLTX for detecting from what number to what number of light receiving elements of the light receiving element array arranged in the X direction does not receive light. Specifically, as shown in FIG. 8, the X-axis line sensor 31 b is positioned at both ends in the left-right direction (X direction) facing the X-axis light emitting device 31 a side of the electronic component T sucked by the suction nozzle 25. An X-axis component position detection signal SLTX that can determine the positions of PTx1 and PTx2 is output.

  Similarly, the Y-axis line sensor 32b receives a linear beam LY partially blocked by the electronic component T, thereby determining which light receiving element of the light receiving element array has received light or has not received light. The electrical signal shown is output from each light receiving element. That is, the Y-axis line sensor 32b outputs a Y-axis component position detection signal SLTY for detecting from what number to what number of light receiving elements of the light receiving element array arranged in the Y direction does not receive light. Specifically, as shown in FIG. 8, the Y-axis line sensor 32 b is positioned at both ends in the front-rear direction (Y direction) facing the Y-axis light emitting device 32 a side of the electronic component T sucked by the suction nozzle 25. A Y-axis component position detection signal SLTY that can determine the positions of PTy1 and PTy2 is output.

  Further, the X-axis line sensor 31b receives a linear beam LX partially blocked by the suction nozzle 25, thereby indicating which light receiving element of the light receiving element array has received light or has not received light. An electric signal is output from each light receiving element. That is, the X-axis line sensor 31b outputs an X-axis nozzle position detection signal SLNX for detecting from what number to what number of light receiving elements of the light receiving element array arranged in the X direction does not receive light. Specifically, as shown in FIG. 9, the X-axis line sensor 31 b is provided at both end portions in the left-right direction (X direction) facing the X-axis light emitting device 31 a side of the suction nozzle 25 in a state where the electronic component T is sucked. An X-axis nozzle position detection signal SLNX that can determine the positions of the positions PNx1 and PNx2 is output.

  Similarly, the Y-axis line sensor 32b receives a linear beam LY partially blocked by the suction nozzle 25, thereby determining which light receiving element of the light receiving element array has received light or has not received light. The electrical signal shown is output from each light receiving element. That is, the Y-axis line sensor 32b outputs a Y-axis nozzle position detection signal SLNY for detecting from what number to what number of light receiving elements of the light receiving element array arranged in the Y direction does not receive light. More specifically, as shown in FIG. 9, the Y-axis line sensor 32 b is provided at both ends in the front-rear direction (Y direction) facing the Y-axis light emitting device 32 a side of the suction nozzle 25 in a state where the electronic component T is sucked. A Y-axis nozzle position detection signal SLNY that can determine the positions of the positions PNy1 and PNy2 is output.

  Then, as shown in FIG. 8, the width Wtx (= X direction) of the electronic component T sucked by the suction nozzle 25 facing the X-axis light emitting device 31a side by the X-axis component position detection signal SLTX (= PTx1-PTx2) and the center position at that time (X-axis component center position Txc (= Wtx / 2)) are calculated. At the same time, according to the Y-axis component position detection signal SLTY, the width Wty (= PTy1-PTy2) in the front-rear direction (Y direction) facing the Y-axis light emitting device 32a side of the electronic component T sucked by the suction nozzle 25 and at that time Center position (Y-axis component center position Tyc (= Wty / 2)) is calculated.

  On the other hand, as shown in FIG. 9, by the X-axis nozzle position detection signal SLNX, the width Wnx (= PNx1) in the left-right direction (X direction) of the suction nozzle 25 that sucks the electronic component T facing the X-axis light emitting device 31a side. -PNx2) and the center position at that time (X-axis nozzle center position Nxc (= Wnx / 2)) are calculated. At the same time, according to the Y-axis nozzle position detection signal SLNY, the width Wny (= PNy1-PNy2) in the front-rear direction (Y direction) facing the Y-axis light emitting device 32a side of the suction nozzle 25 sucking the electronic component T and at that time Center position (Y-axis nozzle center position Nyc (= Wny / 2)) is calculated.

  Further, as shown in FIG. 10, the center position (center of the suction nozzle 25 in the left-right direction (X direction) facing the X-axis light emitting device 31a side is determined by the X-axis component center position Txc and the X-axis nozzle center position Nxc. A deviation (X-axis deviation amount ΔX (= Txc−Nxc)) between the axis C1) and the center position C2 of the electronic component T is obtained. Further, as shown in FIG. 11, the center position (center axis C1) of the suction nozzle 25 in the front-rear direction (Y direction) facing the Y-axis light emitting device 32a side by the Y-axis component center position Tyc and the Y-axis nozzle center position Nyc. ) And the center position C2 of the electronic component T (Y-axis deviation amount ΔY (= Tyc−Nyc)) is obtained.

Next, the electrical configuration of the IC handler 10 configured as described above will be described with reference to FIG.
In FIG. 12, the IC handler 10 includes a control unit 40, an X-axis motor driver 41, a first direction deviation amount calculation unit, a second direction deviation amount calculation unit, a first correction value calculation unit, and a second correction value calculation unit. A Y-axis motor driver 42, a Z-axis motor driver 43, an X-axis deviation position detection driver 44, a Y-axis deviation position detection driver 45, a valve driver 46, and an external input / output interface (external IF) 47 are provided. The control unit 40 is connected to each driver 41 to 46 and the external input / output IF 47 via a bus.

  The X-axis motor driver 41 is electrically connected to an X-axis motor MX provided in the X-axis guide member 22, and rotates forward and backward with respect to the X-axis motor MX based on an X-axis control signal CX from the control unit 40. To generate and output an X-axis drive signal DCX. Then, when the X-axis motor MX rotates forward and backward in response to the X-axis drive signal DCX, the carriage 23 (suction nozzle 25) reciprocates in the left-right direction (X direction) along the X-axis guide member 22. The X-axis motor driver 41 is electrically connected to an X-axis encoder 48 provided on the X-axis motor MX. The X-axis encoder 48 is a rotary encoder, detects the amount of rotation of the X-axis motor MX, and outputs an X-axis detection signal SX to the X-axis motor driver 41. The X-axis motor driver 41 outputs the X-axis detection signal SX to the control unit 40.

The Y-axis motor driver 42 is electrically connected to a Y-axis motor MY provided in the Y-axis guide member 21 and rotates forward and backward based on a Y-axis control signal CY from the control unit 40 with respect to the Y-axis motor MY. A Y-axis drive signal DCY is generated and output. Then, when the Y-axis motor MY rotates forward and backward in response to the Y-axis drive signal DCY, the X-axis guide member 22 (suction nozzle 25) reciprocates in the front-rear direction (Y direction) along the Y-axis guide member 21. Move. The Y-axis motor driver 42 is electrically connected to a Y-axis encoder 49 provided on the Y-axis motor MY. The Y-axis encoder 49 is a rotary encoder, detects the amount of rotation of the Y-axis motor MY, and outputs a Y-axis detection signal SY to the Y-axis motor driver 42. The Y-axis motor driver 42 outputs this Y-axis detection signal SY to the control unit 40.

  The Z-axis motor driver 43 constituting the moving means is electrically connected to the Z-axis motor MZ also constituting the moving means provided in the hand body 24a, and the Z-axis motor MZ from the control unit 40 is connected to the Z-axis motor MZ. Based on the control signal CZ, a Z-axis drive signal DCZ for forward / reverse rotation is generated and output. Then, when the Z-axis motor MZ rotates forward and backward in response to the Z-axis drive signal DCZ, the suction nozzle 25 reciprocates in the vertical direction (Z direction) along the hand body 24a. The Z-axis motor driver 43 is electrically connected to a Z-axis encoder 50 provided in the Z-axis motor MZ. The Z-axis encoder 50 is a rotary encoder, detects the amount of rotation of the Z-axis motor MZ, and outputs the Z-axis detection signal SZ to the Z-axis motor driver 43. The Z-axis motor driver 43 outputs the Z-axis detection signal SZ to the control unit 40.

  The X-axis deviation position detection driver 44 is connected to the X-axis light emitting device 31a and the X-axis line sensor 31b of the deviation position detection device 30 (X-axis deviation position detection unit 31). The X-axis deviation position detection driver 44 generates and outputs a light emission drive signal DCLX for causing the light-emitting diode to emit light based on the X-axis light emission control signal CLX from the control unit 40 to the X-axis light emitting device 31a. The X-axis light emitting device 31a emits a linear beam LX toward the X-axis line sensor 31b in response to the light emission drive signal DCLX. The X-axis line sensor 31 b outputs the X-axis component position detection signal SLTX and the X-axis nozzle position detection signal SLNX based on the reception of the line beam LX to the X-axis deviation position detection driver 44. The X-axis deviation position detection driver 44 outputs an X-axis component position detection signal SLTX and an X-axis nozzle position detection signal SLNX to the control unit 40.

  The Y-axis deviation position detection driver 45 is connected to the Y-axis light emitting device 32a and the Y-axis line sensor 32b of the deviation position detection device 30 (Y-axis deviation position detection unit 32). The Y-axis deviation position detection driver 45 generates and outputs a light emission drive signal DCLY for causing the light-emitting diode to emit light based on the Y-axis light emission control signal CLY from the control unit 40 to the Y-axis light emitting device 32a. The Y-axis light emitting device 32a emits a linear beam LY toward the Y-axis line sensor 32b in response to the light emission drive signal DCLY. The Y-axis line sensor 32 b outputs the Y-axis component position detection signal SLTY and the Y-axis nozzle position detection signal SLNY to the Y-axis deviation position detection driver 45 based on the reception of the line beam LY. The Y-axis deviation position detection driver 45 outputs a Y-axis component position detection signal SLTY and a Y-axis nozzle position detection signal SLNY to the control unit 40.

  The valve driver 46 is connected to a switching valve BL that switches the suction nozzle 25 between the negative pressure generating source and the atmosphere, and switches the switching valve BL based on a suction / detachment control signal from the control unit 40. The valve driver 46 connects the suction nozzle and the negative pressure generation source via the switching valve BL in response to the suction control signal from the control unit 40, and acts by the negative pressure generated at the opening end 25 a of the suction nozzle 25. The electronic component T is adsorbed. Further, the valve driver 46 connects the suction nozzle and the atmosphere via the switching valve BL in response to the separation control signal from the control unit 40, and the suction is performed with the open end 25a of the suction nozzle 25 at atmospheric pressure. The electronic component T is removed.

The external input / output IF 47 is connected to the measuring apparatus U1. The external input / output IF 47 inputs the measurement result of the electronic component T from the measuring device U1 and outputs the measurement result to the control unit 40. The external input / output IF 47 is connected to a peripheral device such as a teaching pendant or a personal computer. The external input / output IF 47 receives information such as teaching data from the peripheral device U2 (electronic component transport data for the electrical characteristic test of the electronic component T) and outputs the information to the control unit 40.

  The control unit 40 includes a CPU (central processing unit) 51, a ROM 52, and a RAM 53. Based on the electronic component transport program stored in the ROM 52, the CPU 51 transfers the electronic component T to the pocket 16 a of the supply tray 16 → the first or second pocket 12 a or 13 a of the second hot plate 12 or 13 → first or second. X-axis, Y-axis, and Z-axis control signals CX, CY, and CZ for transporting in the order of the test sockets 14 and 15 to the pocket 17a of the non-defective product collection tray 17 or the pocket 18a of the defective product collection tray 18 are generated.

  Further, the CPU 51, based on the shift position calculation program stored in the ROM 52, the center position C2 of the electronic component T and the center position (center axis C1) of the suction nozzle 25 when the suction nozzle 25 sucks the electronic component T. The operation of calculating the amount of deviation is executed.

  More specifically, the CPU 51 inputs the X-axis detection signal SX from the X-axis encoder 48 via the X-axis motor driver 41, and the coordinate position (center position Nxc) of the central axis C1 of the suction nozzle 25 at that time in the X direction. And is stored in the X coordinate register of the RAM 53. Similarly, the CPU 51 inputs the Y-axis detection signal SY from the Y-axis encoder 49 via the Y-axis motor driver 42, and the coordinate position (center position Nyc) in the Y direction of the central axis C1 of the suction nozzle 25 at that time is input. Calculate and store in the Y coordinate register of the RAM 53. Then, the CPU 51 determines the position of the center axis C1 of the suction nozzle 25 on the upper surface 11a of the base 11 (on the XY plane) from each coordinate position (center position Nxc and center position Nyc) stored in the X and Y coordinate registers. It comes to know if it is in the position.

  Further, the CPU 51 inputs the Z-axis detection signal SZ from the Z-axis encoder 50 via the Z-axis motor driver 43, and calculates the coordinate position (height position) in the Z direction of the opening end 25a of the suction nozzle 25 at that time. And stored in the Z coordinate register of the RAM 53. The CPU 51 grasps how high the opening end 25 a of the suction nozzle 25 is from the upper surface 11 a of the base 11 from the coordinate position (height position) stored in the Z coordinate register. Further, the CPU 51 discriminates an X-axis component position detection signal SLTX (Y-axis component position detection signal SLTY) and an X-axis nozzle position detection signal SLNX (Y-axis nozzle position detection signal SLNY) from this height position. It has become.

  The CPU 51 inputs the X-axis component position detection signal SLTX and the X-axis nozzle position detection signal SLNX from the X-axis line sensor 31b via the X-axis deviation position detection driver 44. The CPU 51 determines the positions of the positions PTx1 and PTx2 at both ends in the left-right direction (X direction) facing the X-axis light emitting device 31a side of the suction nozzle 25 that sucks the electronic component T based on the X-axis component position detection signal SLTX. Find out. Further, the CPU 51 determines, based on the X-axis nozzle position detection signal SLNX, positions PNx1 at both ends in the left-right direction (X direction) facing the X-axis light emitting device 31a side of the suction nozzle 25 that is sucking the electronic component T. , The position of PNx2 is determined.

  Then, the CPU 51 determines the width Wtx (= PTx1-PTx2) in the left-right direction (X direction) facing the X-axis light emitting device 31a side of the electronic component T from the positions PTx1 and PTx2 at both ends of the electronic component T and the center at that time. The position (X-axis component center position Txc (= Wtx / 2)) is calculated.

  Further, the CPU 51 determines the width Wnx (= PNx1-PNx2) in the left-right direction (X direction) facing the X-axis light emitting device 31a side of the suction nozzle 25 from the positions PNx1 and PNx2 at both ends of the suction nozzle 25 and the center at that time. The position (X-axis nozzle center position Nxc = Wnx / 2)) is calculated.

On the other hand, the CPU 51 receives the Y-axis line sensor 32 via the Y-axis deviation position detection driver 45.
The Y-axis component position detection signal SLTY and the Y-axis nozzle position detection signal SLNY from b are input. The CPU 51 determines the positions of the positions PTy1 and PTY2 at both ends in the front-rear direction (Y direction) facing the Y-axis light emitting device 32a side of the suction nozzle 25 that sucks the electronic component T based on the Y-axis component position detection signal SLTY. Find out. Further, based on the Y-axis nozzle position detection signal SLNY, the CPU 51 positions PNy1 at both ends in the front-rear direction (Y direction) facing the Y-axis light emitting device 32a side of the suction nozzle 25 that sucks the electronic component T. , And determine the position of PNy2.

  Then, the CPU 51 determines the width Wty (= PTy1-PTy2) in the front-rear direction (X direction) facing the Y-axis light emitting device 32a side of the electronic component T from the positions PTy1 and PTy2 at both ends of the electronic component T and the center at that time. The position (Y-axis component center position Tyc (= Wty / 2)) is calculated.

  Further, the CPU 51 determines the width Wny (= PNy1-PNy2) in the front-rear direction (Y direction) facing the Y-axis light emitting device 32a side of the suction nozzle 25 from the positions PNy1 and PNy2 at both ends of the suction nozzle 25 and the center at that time. The position (Y-axis nozzle center position Nyc (= Wny / 2)) is calculated.

  When obtaining the X-axis component center position Txc and the X-axis nozzle center position Nxc, the CPU 51 determines the center position (center axis C1) of the suction nozzle 25 in the left-right direction (X direction) facing the X-axis light emitting device 31a and the electron. A deviation (X-axis deviation amount ΔX (= Txc−Nxc)) of the center position C2 of the component T is obtained and stored in the RAM 53. Similarly, when obtaining the Y-axis component center position Tyc and the Y-axis nozzle center position Nyc, the CPU 51 determines the center position (center axis C1) of the suction nozzle 25 in the front-rear direction (Y direction) facing the Y-axis light emitting device 32a. ) And the center position C2 of the electronic component T (Y-axis deviation amount ΔY (= Tyc−Nyc)) is obtained and stored in the RAM 53. The CPU 51 corrects the teaching data based on the deviation amounts ΔX and ΔY.

  That is, when the center axis C1 of the suction nozzle 25 is arranged immediately above the center position C2 of the electronic component T accommodated in the supply tray 16 based on the teaching data, and the electronic component T is sucked, the supply tray 16 is thermally expanded. If the positions of the pockets 16a vary, for example, the center axis C1 of the suction nozzle 25 and the center position C2 of the electronic component T do not match. This deviation is represented by an X-axis deviation amount ΔX and a Y-axis deviation amount ΔY. The suction nozzle 25 sucks a position shifted from the center position C1 of the electronic component T. When the electronic component T is detached from the suction nozzle 25, the electronic component T is detached in a tilted state, and the hot plate 12, It will be accommodated in the 13 pockets 12a, 13a in an inclined state. Therefore, if the X-axis deviation amount ΔX and the Y-axis deviation amount ΔY are obtained in advance and the arrangement position of the central axis C1 of the suction nozzle 25 based on the teaching data is corrected with both deviation amounts ΔX, ΔY, After the suction nozzle 25 sucks and conveys the electronic component T so that the central axis C1 and the center position C2 of the electronic component T coincide with each other, the electronic component T can be detached from the horizontal state and securely accommodated in the pocket. it can.

  For example, when the electronic component T is accommodated in the center positions of the first and second test sockets 14 and 15 and the pockets 17a and 18a of the good and defective product collection trays 17 and 18 based on the teaching data, the test socket 14 15 and the collection trays 17 and 18 are thermally expanded, etc., and the positions of the pockets 17a and 18a fluctuate, the suction nozzle 25 has the center position C2 of the electronic component T at the center of the test sockets 14 and 15 and the pockets 17a and 18a. It is accommodated in a state shifted from the position. Therefore, the electronic component T is not reliably accommodated in the pockets 17a and 18a, but is accommodated in an inclined state. Therefore, the electronic components T are accommodated in the pockets 17a and 18a of the non-defective and defective product collecting trays 17 and 18 in advance, and the center axis C1 of the suction nozzle 25 is set to the test sockets 14 and 15 and the collecting tray 17 based on the teaching data. , 18 is disposed immediately above the center position of the pockets 17a, 18a to attract the electronic component T. At this time, the suction nozzle 25 sucks a position shifted from the center position C2 (the center position of the socket or the like) of the electronic component T, and this shift is represented by an X-axis shift amount ΔX and a Y-axis shift amount ΔY. The

  As a result, also in this case, the X-axis deviation amount ΔX and the Y-axis deviation amount ΔY are obtained in advance, and the test sockets 14 and 15 and the pockets 17a and 18a of the collection trays 17 and 18 related to the suction nozzle 25 based on the teaching data are obtained. If the arrangement position is corrected with the amount of deviation ΔX, ΔY, the suction nozzle 25 is placed in the state in which the center position C2 of the electronic component T coincides with the center position of the test sockets 14, 15 and the pocket P. Can be detached into the test sockets 14 and 15 and the pockets 17a and 18a.

Next, the displacement position calculating operation of the IC handler 10 configured as described above will be described with reference to the flowcharts shown in FIGS.
For convenience of explanation, in order to hold the electronic component T disposed in the pocket 16a of the supply tray 16, correction values (suction position correction values ΔPx1, ΔPy1) with respect to the movement position (suction position) of the suction nozzle 25 to the pocket 16a. ) And a correction value (arrangement position correction value ΔPx2, ΔPy2) with respect to the movement position (detachment position) of the suction nozzle 25 to the first test socket 14 for arranging the electronic component T in the first test socket 14. The processing operation will be described.

  Further, for convenience of explanation, the test electronic components T are accommodated in all the pockets 16 a of the set supply tray 16 on the base 11 of the IC handler 10, and all the electronic components T are sequentially placed in the first test socket 14. The electronic component T arranged in the first test socket 14 is arranged in the pocket 17 a of the non-defective product collection tray 17. That is, this operation is performed for the number of test electronic components T accommodated in the pocket 16a of the supply tray 16, and the suction position correction values ΔPx1, ΔPy1 and the arrangement position correction values ΔPx2, ΔPy2 are obtained.

  The position data of the suction position of the suction nozzle 25 in each pocket 16a of the supply tray 16 is predetermined reference position data. That is, the position data of the suction position indicates that the suction nozzle 25 is at its center position (center axis C1) if there is no mechanical distortion that proceeds during operation, individual differences in the supply tray 16, position error of the pocket 16a due to thermal expansion, or the like. The data of the suction position where the electronic component T in the pocket 16a of the supply tray 16 is sucked at the center position C2 of the electronic component T.

  The position data of the arrangement position of the suction nozzle 25 in the first test socket 14 is reference position data determined in advance. That is, as for the arrangement position data of the first test socket, if there is no position error or the like due to mechanical distortion or thermal expansion that proceeds during operation, the suction nozzle 25 places the electronic component T at the center position (center axis C1). It is the data of the separation position for accommodating in the test socket 14.

  Furthermore, the position data of the arrangement position of the suction nozzle 25 in each pocket 17a of the non-defective product collection tray 17 is a predetermined reference position data. That is, if the position data of the arrangement position does not include mechanical distortion that progresses during operation, individual differences of the supply tray 16, position errors due to thermal expansion, etc., the suction nozzle 25 places the electronic component T at the center position of the non-defective product collection tray. This is data of a detachment position that can be accommodated in 17 pockets 17a.

Now, an electronic component T for testing in a predetermined pocket 16a of the supply tray 16 set at a predetermined position on the base 11 of the IC handler 10 is accommodated.
In FIG. 13, when an operation for calculating the deviation position is performed, the CPU 51 first sets the content N of the test number counter provided in the RAM 53 to “0” in accordance with the deviation position calculation program stored in the ROM 52 in advance ( Step S1). Subsequently, the CPU 51 reads position data of the suction position of the suction nozzle 25 into the pocket 16a of the supply tray 16 in which the test electronic component T is accommodated (step S2).

  When the position data of the suction position is read, the CPU 51 checks whether there are suction position correction values ΔPx1 and ΔPy1 for the suction position in the RAM 53 (step S3). When there are correction values ΔPx1 and ΔPy1 for the suction position in the RAM 53 (YES in step S3), the CPU 51 corrects the suction position with the correction values ΔPx1 and ΔPy1 (step S4), and the corrected position of the new suction position. Based on the data, the hand 24 (suction nozzle 25) is guided to a suction position (above the pocket 16a where the electronic component T is disposed) (step S5). On the other hand, if the RAM 53 does not have the correction values ΔPx1 and ΔPy1 for the suction position (NO in step S1-3), the CPU 51 proceeds to step S5 and based on the read position data of the suction position, the hand 24 (suction nozzle 25). Is guided to the suction position.

  At this time, since it has just started, the RAM 53 does not store correction values ΔPx1 and ΔPy1 for the suction position. Therefore, in step S5, the CPU 51 drives and controls the X-axis and Y-axis motors MX and MY via the X-axis and Y-axis motor drivers 41 and 42 based on the read position data of the suction position, and the hand 24 (Suction nozzle 25) is guided to a suction position based on the position data.

  When the hand 24 (suction nozzle 25) is moved to the suction position, the CPU 51 lowers the suction nozzle 25 (step S6). The CPU 51 drives and controls the Z-axis motor MZ via the Z-axis motor driver 43 to lower the suction nozzle 25 to the upper surface position of the electronic component T disposed in the pocket 16a. Subsequently, the CPU 51 drives and controls the switching valve BL via the valve driver 46, sucks and holds the electronic component T by the suction nozzle 25, and then drives and controls the Z-axis motor MZ via the Z-axis motor driver 43. Then, the suction nozzle 25 that sucks and holds the electronic component T is raised (step S7).

  Next, the CPU 51 drives and controls the X-axis and Y-axis motors MX and MY to guide the suction nozzle 25 that sucks the electronic component T to a position above the detection space Z of the shift position detection device 30 (step S8). ). When the suction nozzle 25 that sucks the electronic component T is guided to a position above the detection space Z, the CPU 51 drives and controls the Z-axis motor MZ via the Z-axis motor driver 43 to suck toward the detection space Z. The nozzle 25 is lowered (step S9).

  When the suction nozzle 25 that sucks the electronic component T is lowered, first, the electronic component T passes from the top to the bottom while blocking the linear beams LX and LY emitted from the X-axis and Y-axis light emitting devices 31a and 32a. To do. Thereby, the CPU 51 acquires the X-axis and Y-axis component position detection signals SLTX and SLTY detected by the X-axis and Y-axis line sensors 31b and 32b, respectively, and calculates the X-axis and Y-axis component center positions Txc and Tyc, respectively. (Step S10).

  Subsequently, the suction nozzle 25 sucking the electronic component T passes from the top to the bottom while blocking the line beams LX and LY. As a result, the CPU 51 acquires the X-axis and Y-axis nozzle position detection signals SLNX and SLNY detected by the X-axis and Y-axis line sensors 31b and 32b, respectively, and calculates the X-axis and Y-axis nozzle center positions Nxc and Nyc, respectively. (Step S11).

  When the CPU 51 calculates the X-axis and Y-axis nozzle center positions Nxc and Nyc, the CPU 51 immediately raises the suction nozzle 25 that sucks the electronic component T to a position above the detection space Z. At the same time, the CPU 51 calculates a deviation amount (X-axis deviation amount ΔX1 and Y-axis deviation amount ΔY1) between the center position of the suction nozzle 25 and the center position of the electronic component T, and stores it in the RAM 53 (step S12).

That is, the fact that there is a deviation amount (X-axis deviation amount ΔX1 and Y-axis deviation amount ΔY1) between the center position (center axis C1) of the suction nozzle 25 and the center position C2 of the electronic component T progresses during thermal expansion or operation. This means that a relative displacement or the like between the pocket 16a and the hand 24 (suction nozzle) occurs due to mechanical distortion or the like, and the magnitude of the displacement is an X-axis displacement amount ΔX1 and a Y-axis displacement amount ΔY1. expressed.

  Subsequently, the CPU 51 performs statistical processing using the calculated deviation amounts (X-axis deviation amount ΔX1 and Y-axis deviation amount ΔY1), calculates correction values ΔPx1 and ΔPy1 for the next suction position, and stores them in the RAM 53 (Step 53). S13). Here, the statistically processed correction values ΔPx1 and ΔPy1 are obtained by calculating a plurality of X-axis deviation amounts ΔX1 and Y-axis deviation amounts ΔY1 as shown in the following equations, and the plurality of X-axis deviation amounts ΔX1 and Y-axis deviation amounts. Values obtained by adding ΔY1 and dividing by the added number are corrected values ΔPx1 and ΔPy1 obtained by statistical processing.

ΔPx1 = (ΔX11 + ΔX12 +... + ΔX1j) / j
ΔPy1 = (ΔY11 + ΔY12 +... + ΔY1j) / j
At this time, since the number of X-axis deviation amounts ΔX1 and Y-axis deviation amounts ΔY1 is one, the X-axis deviation amount ΔX1 and the Y-axis deviation amount ΔY1 become correction values ΔPx1 and ΔPy1, respectively.

  Subsequently, the CPU 51 reads position data of the first test socket (step S14). When the position data of the arrangement position is read, the CPU 51 checks whether or not the RAM 53 has arrangement position correction values ΔPx2 and ΔPy2 for the arrangement position (step S15). If there are correction values ΔPx2 and ΔPy2 for the arrangement position in the RAM 53 (YES in step S15), the CPU 51 corrects the arrangement position with the correction values ΔPx2 and ΔPy2, and based on the corrected position data of the new arrangement position. The hand 24 (suction nozzle 25) is moved to the arrangement position (above the first test socket 14). Subsequently, after lowering the suction nozzle 25, the CPU 51 separates the electronic component T from the suction nozzle 25 and places it in the first test socket 14 (step S16). Then, after removing the electronic component T, the CPU 51 raises the suction nozzle 25 to a predetermined position and waits at the raised position (step S18).

  On the other hand, if the RAM 53 does not have the correction values ΔPx2 and ΔPy2 for the arrangement position (NO in step S15), the CPU 51 adds the previously obtained X-axis deviation amount ΔX1 and Y-axis deviation amount ΔY1 to the arrangement position position data. Then, the hand 24 (suction nozzle 25) is moved to the arrangement position (above the first test socket 14). Subsequently, after lowering the suction nozzle 25, the CPU 51 separates the electronic component T from the suction nozzle 25 and places it in the first test socket 14 (step S17). Similarly, after detaching the electronic component T, the suction nozzle 25 is raised to a predetermined position and waits at the raised position (step S18).

  Then, the CPU 51 causes the measurement device U1 to measure the electronic component T arranged in the first test socket 14, and waits for the measurement by the measurement device U1 to end (step S19). When the measurement by the measuring apparatus U1 is completed (YES in step S1-19), the CPU 51 lowers the suction nozzle 25 waiting in the raised position to the upper surface position of the electronic component T arranged in the first test socket 14 (step S1-19). S20). Subsequently, the CPU 51 drives and controls the switching valve BL via the valve driver 46, sucks and holds the electronic component T by the suction nozzle 25, and then drives and controls the Z-axis motor MZ via the Z-axis motor driver 43. Then, the suction nozzle 25 that sucks and holds the electronic component T is raised (step S21).

Next, the CPU 51 drives and controls the X-axis and Y-axis motors MX and MY to guide the suction nozzle 25 that sucks the electronic component T to a position above the detection space Z of the shift position detection device 30 (step S22). ). When the suction nozzle 25 that sucks the electronic component T is guided to a position above the detection space Z, the CPU 51 drives and controls the Z-axis motor MZ via the Z-axis motor driver 43 to suck toward the detection space Z. The nozzle 25 is lowered (step S23).

  When the suction nozzle 25 that sucks the electronic component T is lowered, first, the electronic component T passes from the top to the bottom while blocking the linear beams LX and LY emitted from the X-axis and Y-axis light emitting devices 31a and 32a. To do. Thereby, the CPU 51 acquires the X-axis and Y-axis component position detection signals SLTX and SLTY detected by the X-axis and Y-axis line sensors 31b and 32b, respectively, and calculates the X-axis and Y-axis component center positions Txc and Tyc, respectively. (Step S24).

  Subsequently, the suction nozzle 25 sucking the electronic component T passes from the top to the bottom while blocking the line beams LX and LY. As a result, the CPU 51 acquires the X-axis and Y-axis nozzle position detection signals SLNX and SLNY detected by the X-axis and Y-axis line sensors 31b and 32b, respectively, and calculates the X-axis and Y-axis nozzle center positions Nxc and Nyc, respectively. (Step S25).

  When the CPU 51 calculates the X-axis and Y-axis nozzle center positions Nxc and Nyc, the CPU 51 immediately raises the suction nozzle 25 that sucks the electronic component T to a position above the detection space Z. At the same time, the CPU 51 calculates a deviation amount (X-axis deviation amount ΔX2 and Y-axis deviation amount ΔY2) between the center position of the suction nozzle 25 and the center position of the electronic component T, and stores it in the RAM 53 (step S26).

  In other words, the fact that there is a deviation amount (X-axis deviation amount ΔX2 and Y-axis deviation amount ΔY2) between the center position (center axis C1) of the suction nozzle 25 and the center position C2 of the electronic component T progresses during thermal expansion or operation. This means that a relative deviation or the like between the first test socket 14 and the hand 24 occurs due to mechanical distortion or the like, and the magnitude of the deviation is expressed as an X-axis deviation amount ΔX2 and a Y-axis deviation amount ΔY2. Is done.

  Subsequently, the CPU 51 performs statistical processing using the calculated deviation amounts (X-axis deviation amount ΔX 2 and Y-axis deviation amount ΔY 2), calculates arrangement position correction values ΔPx 2 and ΔPy 2 for the next arrangement position, and stores them in the RAM 53. Store (step S27). The correction values ΔPx2 and ΔPy2 subjected to the statistical processing here are similar to the above, and a plurality of X-axis deviation amounts ΔX2 and Y-axis deviation amounts ΔY2 are obtained as in the following equation, and the plurality of X-axis deviation amounts ΔX2 are obtained. And the Y axis deviation amount ΔY2 are added and divided by the added number as the corrected values ΔPx2 and ΔPy2 obtained by statistical processing.

ΔPx2 = (ΔX21 + ΔX22 +... + ΔX2j) / j
ΔPy2 = (ΔY21 + ΔY22 +... + ΔY2j) / j
At this time, since the number of X-axis deviation amounts ΔX2 and Y-axis deviation amounts ΔY2 is one, the X-axis deviation amount ΔX2 and the Y-axis deviation amount ΔY2 become correction values ΔPx2 and ΔPy2, respectively.

  Subsequently, the CPU 51 reads out the arrangement position data of the pockets 17a of the non-defective product collection tray 17 (step S28). The position data of the pocket 18a is reference position data determined in advance. When the arrangement position data is read, the CPU 51 adds the X-axis deviation amount ΔX2 and the Y-axis deviation amount ΔY2 obtained previously to the arrangement position data, and moves the hand 24 (suction nozzle 25) to move the electronic component T to the suction nozzle. It is separated from 25 and placed in the pockets 17a and 18a (step S29).

When the electronic component T is placed in the pocket 17a of the non-defective product collection tray 17, the CPU 51 sets the content N of the test number counter provided in the RAM 53 to “1”, assuming that the first shift position calculation processing by the electronic component T is completed. (Step S1-30). Subsequently, the CPU determines whether the content N of the test number counter has reached a predetermined reference value Nk (step S31). The reference value Nk is the number of shift position calculation processes by the electronic component T described above. In this embodiment, the reference value Nk is set to the number of test electronic components T accommodated in all the pockets 16a of the supply tray 16. ing. That is, the shift position calculation processing is performed for all the electronic components T accommodated in the pocket 16a of the supply tray 16.

  If the content N of the test number counter does not reach the reference value Nk (NO in step S31), the CPU 51 returns to step S1-2, and the predetermined next arranged in the pocket 16a of the supply tray 16 is performed. The position data of the suction position for sucking and gripping the electronic component T is read out. Thereafter, the same operation is performed to calculate the deviation amounts ΔX1, ΔY1, ΔX2, and ΔY2, and the respective correction values ΔPx1, ΔPy1, ΔPx2, and ΔPy2 are obtained.

  Eventually, when the content N of the test number counter reaches the reference value Nk (YES in step S1-31), the CPU 51 finalizes the suction position correction values ΔPx1, ΔPy1 and the arrangement position correction values ΔPx2, ΔPy2 obtained last. After storing the correction value in the RAM 53 (step S32), the shift position calculating operation is terminated.

  The determined suction position correction values ΔPx1, ΔPy1 and arrangement position correction values ΔPx2, ΔPy2 stored in the RAM 53 are used as correction values when the suction nozzle 25 is moved when the actual electronic component T is measured. The

  More specifically, when the electronic component T before measurement is sucked and held from the pocket 16 a of the supply tray 16, suction position data regarding the pocket 16 a of the supply tray 16 is read from the RAM 53. The suction position data is data of coordinate values (X1, Y1) of the suction position of the suction nozzle 25. At this time, the CPU 51 adds the suction position correction values ΔPx1 and ΔPy1 to the coordinate values (X1, Y1), respectively, to generate new suction position coordinate values (X1 + ΔPx1, Y1 + ΔPy1). That is, the CPU 51 creates a coordinate value that offsets a relative shift between the pocket 16a and the hand 24 (suction nozzle) due to thermal expansion, mechanical distortion that proceeds during operation, or the like.

  Then, the CPU 51 uses the new suction position coordinate values (X1 + ΔPx1, Y1 + ΔPy1) as new suction position data, and moves the suction nozzle 25 based on the new suction position data. Subsequently, when the CPU 51 lowers the suction nozzle 25 and grips and holds the electronic component T accommodated in the pocket 16a immediately below the suction nozzle 25, the central position of the suction nozzle 25 and the central position of the electronic component T coincide with each other. In this state, the suction nozzle 25 can suck and hold the electronic component T. Therefore, when the electronic component T is detached at the next transport destination, the electronic component T can be detached horizontally without being inclined.

  Next, in order to arrange the suction nozzle 25 that sucks and holds the electronic component T in the state where the center position of the suction nozzle 25 and the center position of the electronic component T coincide with each other, The arrangement position data relating to one test socket 14 is read. The arrangement position data is data of coordinate values (X2, Y2) of the separation position of the suction nozzle 25. At this time, the CPU 51 adds the arrangement position correction values ΔPx2 and ΔPy2 to the coordinate values (X2, Y2), respectively, to generate new adsorption position coordinate values (X2 + ΔPx2, Y2 + ΔPy2). That is, the CPU 51 creates a coordinate value that offsets a relative shift between the first test socket 14 and the hand 24 (suction nozzle) due to thermal expansion, mechanical distortion that proceeds during operation, or the like.

Then, the CPU 51 uses the coordinate value (X2 + ΔPx2, Y2 + ΔPy2) of the new arrangement position as new adsorption position data, and moves the adsorption nozzle 25 based on the new arrangement position data. Subsequently, when the CPU 51 lowers the suction nozzle 25 to a predetermined position and removes the electronic component T, the electronic component T can be accommodated in the first test socket 14. Therefore, the electronic component T securely arranged in the first test socket 14 is measured by the measuring device U1 without causing a connection failure.

Next, the effect of this embodiment is described below.
(1) According to the present embodiment, the electronic component T accommodated in the pocket 16a of the supply tray 16 is sucked and held by the suction nozzle 25, and the central axis C1 of the suction nozzle 25 and the electronic component T are held in the gripped state. An X-axis deviation amount ΔX1 and a Y-axis deviation amount ΔY1 with respect to the center position C2 were obtained. Then, the suction position of the central axis C1 of the suction nozzle 25 based on the teaching data is corrected based on both deviation amounts ΔX1, ΔY1.

  Therefore, even if a relative displacement or the like between the pocket 16a and the suction nozzle 25 occurs due to thermal expansion or mechanical distortion that proceeds during operation, the center axis C1 of the suction nozzle 25 and the center position C2 of the electronic component T So that the suction nozzle 25 can hold the electronic component T by suction. As a result, in a state where the central axis C1 of the suction nozzle 25 and the center position C2 of the electronic component T coincide with each other, the suction nozzle 25 releases the electronic component T in a horizontal state and reliably transports it to the placement pocket or socket. Can be made.

  (2) According to this embodiment, the electronic component T housed in the first test socket 14 is sucked and held by the suction nozzle 25, and the center axis C1 of the suction nozzle 25 and the center of the electronic component T are held in the gripped state. An X-axis deviation amount ΔX2 and a Y-axis deviation amount ΔY2 from the position C2 were obtained. Then, the position (arrangement position) at which the center position (center axis C1) of the suction nozzle 25 is separated based on the teaching data is corrected based on both deviation amounts ΔX2 and ΔY2.

  Therefore, even if a relative deviation or the like between the first test socket 14 and the suction nozzle 25 occurs due to thermal expansion or mechanical distortion that proceeds during operation, the center position of the suction nozzle 25 (that is, the electronic component) With the center position C2) of T coinciding with the center position of the first test socket 14, the suction nozzle 25 can reliably accommodate the electronic component T in the first test socket 14.

  (3) According to the present embodiment, a plurality of X-axis deviation amounts ΔX1 and Y-axis deviation amounts ΔY1 are obtained, and the obtained X-axis deviation amounts ΔX1 and Y-axis deviation amounts ΔY1 are statistically processed, respectively. ΔPy1 was determined. The suction position correction values ΔPx1 and ΔPy1 subjected to the statistical processing are added to the actual suction position data to generate new suction position data.

  Therefore, it is possible to absorb fluctuations in the X-axis deviation amount ΔX1 and the Y-axis deviation amount ΔY1 calculated from time to time. As a result, the suction position of the suction nozzle 25 for making the center axis C1 of the suction nozzle 25 coincide with the center position C2 of the electronic component T for suction gripping can be corrected with higher accuracy.

  (4) According to the present embodiment, a plurality of X-axis deviation amount ΔX2 and Y-axis deviation amount ΔY2 are obtained, and the obtained X-axis deviation amount ΔX2 and Y-axis deviation amount ΔY2 are statistically processed, respectively. ΔPy2 was determined. Then, the arrangement position correction values ΔPx2 and ΔPy2 subjected to the statistical processing are added to the actual arrangement position data to generate new arrangement position data.

  Therefore, it is possible to absorb fluctuations in the X-axis deviation amount ΔX2 and the Y-axis deviation amount ΔY2 calculated from time to time. As a result, the placement position of the suction nozzle 25 for separating the suction nozzle 25 so that the center axis C1 of the suction nozzle 25 (ie, the center position C2 of the electronic component T) coincides with the center position of the first test socket 14 is corrected with higher accuracy. Can do.

(5) According to the present embodiment, the suction nozzle 25 that sucks the electronic component T to the linear beams LX and LY emitted from the X-axis and Y-axis light emitting devices 31a and 32a is used as the beams LX and LY. X-axis and Y-axis component position detection signals SLTX, SLTY and X-axis and Y-axis for determining the center position (center axis C1) of the suction nozzle 25 and the center position C2 of the electronic component T simply by lowering so as to block. The nozzle position detection signals SLNX and SLNY can be detected.

  Therefore, the center position (center axis C1) of the suction nozzle 25 and the center position C2 of the electronic component T are obtained with a simple configuration and operation of moving the suction nozzle 25 that sucks the electronic component T in the vertical direction (Z direction). Therefore, the work for calculating the displacement position can be performed in a very short time.

In addition, you may change the said embodiment into the following aspects.
In the above embodiment, the suction position correction values ΔPx1 and ΔPy1 at the suction position of the supply tray 16 as the supply unit are obtained. The first and second hot plates 12 and 13 and the first and second test sockets 14 and 15 are used as supply units, and the first and second hot plates 12 and 13 and the first and second test sockets 14 and 15 are provided. You may make it obtain | require the adsorption position correction value in 15 adsorption positions.

  In the above embodiment, the arrangement position correction values ΔPx2 and ΔPy2 at the arrangement position of the first test socket 14 are obtained as receiving parts. This is a second test socket 15, first and second hot plates 12, 13 and non-defective and defective product collection trays 17, 18 as receiving parts, and these second test socket 15, first and second hot plates 12, 18 13. Arrangement position correction values at the arrangement positions of the non-defective product and defective product collection trays 17 and 18 may be obtained.

  In the above-described embodiment, the IC handler that transports the electronic component T such as a semiconductor chip is embodied as the transported object, but the transported object is not limited to the electronic component. Accordingly, the present invention is not limited to an IC handler as long as it is required to grip a conveyed product with high accuracy and convey it to a predetermined position, and any conveying device may be used.

  In the above embodiment, the test electronic components T are accommodated in all the pockets 16a of the supply tray 16, and the amount of deviation is calculated by the number of the accommodated test electronic components T, and the suction position correction values ΔPx1, ΔPy1 are obtained. Asked. Alternatively, the test electronic component T may be continuously supplied to one of the pockets 16a of the supply tray 16, and the displacement amount may be obtained to obtain the suction position correction values ΔPx1 and ΔPy1.

  In the above embodiment, a series of calculation of the suction position correction values ΔPx1 and ΔPy1 related to the suction position of the suction nozzle 25 in the supply tray 16 and the placement position correction values ΔPx2 and ΔPy2 related to the placement position where the suction is shifted in the first test socket 14 Determined by movement. This may be carried out by calculating individually.

  In the above-described embodiment, the suction position correction values ΔPx1 and ΔPy1 obtained by statistically processing the X-axis deviation amount ΔX1 and the Y-axis deviation amount ΔY1 are obtained. However, the X-axis deviation amount ΔX1 and the Y-axis deviation are obtained without performing statistical processing. The amount ΔY1 may be directly used as a correction value.

  In the above embodiment, the arrangement position correction values ΔPx2 and ΔPy2 obtained by statistically processing the X-axis deviation amount ΔX2 and the Y-axis deviation amount ΔY2 are obtained, but the X-axis deviation amount ΔX2 and the Y-axis deviation are obtained without performing statistical processing. The amount ΔY2 may be directly used as a correction value.

  In the above embodiment, the suction position correction values ΔPx1 and ΔPy1 and the arrangement position correction values ΔPx2 and ΔPy2 obtained by the statistical processing are the average values of the obtained deviation amounts, but the suction position correction is performed by other statistical processing methods. The values ΔPx1, ΔPy1 and the arrangement position correction values ΔPx2, ΔPy2 may be obtained.

The top view for demonstrating the IC handler in this embodiment. The whole perspective view for demonstrating the external shape of an electronic component. The principal part sectional view which shows the electronic component accommodated in the pocket of a supply tray. The whole perspective view of the hand provided with the suction nozzle. Explanatory drawing for demonstrating the adsorption | suction holding | grip of the electronic component by an adsorption | suction nozzle. The whole perspective view of a shift position detecting device. The figure which looked at the shift position detection device from the top. Explanatory drawing explaining the relationship between a line-shaped beam and the electronic component which interrupts the beam. Explanatory drawing explaining the relationship between a line-shaped beam and the suction nozzle which interrupts the beam. Explanatory drawing explaining the shift | offset | difference of the center position of the suction nozzle and electronic component in a X direction. Explanatory drawing explaining the shift | offset | difference of the center position of the suction nozzle and electronic component in a Y direction. The block circuit diagram which shows the electric constitution of IC handler. 7 is a flowchart for explaining a shift position calculating operation. Similarly, the flowchart explaining shift position calculation operation. Similarly, the flowchart explaining shift position calculation operation.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... IC handler as a conveying apparatus, 12 ... 1st hot plate as a receiving part, 12a ... Pocket, 13 ... 2nd hot plate, 13a ... Pocket, 14 ... 1st test socket, 15 ... 2nd test socket, 16 ... Supply tray as supply section, 16a ... Pocket, 17 ... Good product collection tray, 17a ... Pocket, 18 ... Defective product collection tray, 18a ... Pocket, 21 ... Y-axis guide member, 22 ... X-axis guide member, 23 ... Carriage 24 ... hand, 24a ... hand body, 25 ... adsorption nozzle as a gripping member, 25a ... open end, 26 ... passage, 30 ... deviation position detector, 31 ... X-axis deviation position detector, 31a ... first light emission X-axis light emitting device as a device, 31b ... X-axis line sensor as a first line sensor, 32 ... Y-axis deviation position detector, 32a ... Second light output Y-axis light emitting device as device, 32b... Y-axis line sensor as second line sensor, 40... First direction deviation amount calculating means, second direction deviation amount calculating means, first correction value calculating means and second correction. Control unit as value calculation means, 41... X-axis motor driver, 42... Y-axis motor driver, 43... Z-axis motor driver constituting moving means, 44... X-axis deviation position detection driver, 45. Driver, 46 ... Valve driver, 47 ... External input / output interface (external input / output IF), 48 ... X-axis encoder, 49 ... Y-axis encoder, 50 ... Z-axis encoder, 51 ... CPU, 52 ... ROM, 53 ... RAM, MX ... X-axis motor, MY ... Y-axis motor, MZ ... Z-axis motor constituting moving means, BL ... switching valve, .DELTA.X ... X-axis deviation amount, .DELTA.Y ... Y-axis deviation amount, T ... conveyed material. And electronic components, Z ... detection space of, LX ... beam as a first line of light, LY ... second beam as a line light.

Claims (6)

A position adjustment method for a conveying device that moves a gripping member of a hand to a gripping position of a supply unit, grips a transported object disposed in the supply unit with the gripping member, and places the gripped transported object in a receiving unit. In
Preliminarily grip the transported object placed in the supply unit with the gripping member, and determine the amount of deviation between the center position of the gripped transported object and the center position of the hand in the state of gripping the transported object,
When gripping the transported object placed in the supply unit with the gripping member, the gripping position of the gripping member in the supply unit is corrected based on the obtained shift amount and placed in the supply unit. A method for adjusting a position of a transport apparatus, wherein a transported object is gripped by the gripping member. In the position adjustment method of the transport device, the gripping member of the hand gripping the transported object arranged in the supply unit is moved to the release position of the receiving unit, and the transported object gripped by the gripping member is arranged in the receiving unit.
Preliminarily gripping a transported object placed in the receiving unit with the gripping member, and determining a deviation amount between the center position of the gripped transported object and the center position of the gripping member in a state of gripping the transported object. Seeking
When placing the conveyed product in the receiving unit with a gripping member, the separation position of the receiving unit is corrected based on the obtained deviation amount, and the conveyed product is arranged in the receiving unit. A method for adjusting the position of a transfer device. A position adjustment device for a transport device that moves a gripping member of a hand to a gripping position of a supply unit, grips a transported object arranged in the supply unit with the gripping member, and places the gripped transported material in a receiving unit In
A first light emitting device that emits line-shaped first line light in a first direction;
A first line sensor arranged to face the first light emitting device and receiving the first line light;
A second light emitting device for emitting line-shaped second line light in a second direction orthogonal to the first direction;
A second line sensor arranged to face the second light emitting device and receiving the second line light;
The gripping member is moved in a third direction orthogonal to the first direction and the second direction while the transported object is gripped, and the transported object and the gripping member are moved to the first line light and the first direction. Moving means for passing two line lights;
Based on a detection signal from the first line sensor, a first direction deviation amount calculation means for calculating a deviation between the center position of the conveyed product and the center position of the gripping member in the first direction as a first direction deviation amount. When,
Second direction deviation amount calculating means for calculating a deviation between the center position of the conveyed product and the center position of the gripping member in the second direction as a second direction deviation amount based on a detection signal from the second line sensor; ,
A transport apparatus comprising: a first correction value calculation unit that obtains a first correction value of a grip position of the grip member in the supply unit based on the first direction shift amount and the second direction shift amount. Position adjustment device. In the position adjustment device of the transport device that moves the gripping member of the hand that grips the transported object arranged in the supply unit to the disengagement position of the receiving unit and places the transported object gripped by the gripping member in the receiving unit,
A first light emitting device that emits line-shaped first line light in a first direction;
A first line sensor arranged to face the first light emitting device and receiving the first line light;
A second light emitting device for emitting line-shaped second line light in a second direction orthogonal to the first direction;
A second line sensor arranged to face the second light emitting device and receiving the second line light;
Grasping the transported object arranged in the receiving unit, and moving the gripping member in a third direction perpendicular to the first direction and the second direction while gripping the transported object, Moving means for passing the first line light and the second line light through the gripping member;
Based on a detection signal from the first line sensor, a first direction deviation amount calculation means for calculating a deviation between the center position of the conveyed product and the center position of the gripping member in the first direction as a first direction deviation amount. When,
Second direction deviation amount calculating means for calculating a deviation between the center position of the conveyed product and the center position of the gripping member in the second direction as a second direction deviation amount based on a detection signal from the second line sensor; ,
And a second correction value calculating unit that obtains a second correction value of the separation position of the gripping member in the receiving portion based on the first direction deviation amount and the second direction deviation amount. Position adjustment device. An IC handler comprising the transport device position adjusting device according to claim 3. An IC handler comprising the transport device position adjusting device according to claim 4.

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