JPH1041697A - Method of correcting part mounting position and part mounting equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a part mounting equipment which is capable of accurately mounting electronic parts on a printed circuit board at prescribed mounting positions respectively, by a method wherein the direction of rotation or angle error and position error of each part are calculated based on the measurements of a projected image, and each part is corrected on its center position and angle. SOLUTION: Collimated laser beams 11c and 12c are projected from the light projectors 11a and 12a of two laser sensors onto a electronic part W1 , and a projected image formed by shutting off the laser beams 11c and 12c with the electronic part W1 is detected by photodetectors 11b and 12b . The middle point of the projected image is calculated by an operational means and compared with the center O0 of rotation of the part W1 , whereby deviations ΔA and ΔB are calculated. Then, the deviations ΔA and ΔB are outputted as corrections for the mounting position of an electronic part to the control device of a robot and the rotation drive means of a mounting head. The control device of the robot successively mounts electronic parts W on a printed circuit board at a right position and at a right angle of orientation by making corrections respectively. By this setup, an electronic part can be accurately mounted in a short time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for mounting a component on a base, and a positional error and an angular error between the mounting head and the component when a plurality of components are gripped by the respective mounting heads. The present invention relates to a mounting position correction method for accurately mounting each component at a component mounting position of a base and a component mounting apparatus employing the correction method, and in particular, to accurate positioning. The parts supplied by the part supply device that cannot perform the operation are sucked and gripped by the suction nozzles of the plurality of mounting heads, and the position error and the angle error of the plurality of parts are corrected for each part, and the predetermined position of the base is adjusted. And a component mounting apparatus that employs the correction method for mounting the electronic component accurately on the component mounting position. In the installation, electronic components are supplied by a tray supply device or a taping component supply device that cannot perform accurate positioning, and the positional errors and angular errors of the multiple electronic components that are simultaneously suctioned and gripped by the suction nozzles of multiple mounting heads are checked. The present invention relates to a method for correcting a component mounting position for accurately mounting each electronic component at a predetermined mounting position on a printed circuit board by correcting each component, and an electronic component mounting apparatus employing the correction method.

[0002]

2. Description of the Related Art Electronic components are supplied by a component supply device such as a tray supply device or a taping component supply device.
When the electronic component cannot be accurately positioned at the specified component supply position during component supply, such as when the component is supplied by suction using the suction nozzle of the mounting head, when the electronic component is suctioned by the nozzle Naturally, a positional error between the center position of the nozzle and the central position of the electronic component and an angular error in the direction (suction angle) of the electronic component occur between the nozzle and the electronic component, and these electronic components are accurately mounted. In order to surely mount the electronic component at the correct position (angle), it is necessary to correct the positional error of the center position and the angular error of the suction angle of the component before mounting the electronic component.

FIG. 1 shows an example of an electronic component mounting apparatus suitable for adopting the component mounting position correcting method according to the present invention, which is arranged in a holding container in a matrix. A tray supply device 1a in which electronic components are stored in a storage recess, and a taping component supply device 1b in which electronic components are stored in a storage recess formed in a row in a tape.
Electronic components supplied by the component supply device 1 such as X
A plurality of (three in this embodiment) suction nozzles 4 of the mounting heads 3 provided on the robot 2 movable in the Y direction and movable in the up and down direction are attached to a predetermined component mounting position on the printed circuit board P. Implemented.

[0004] In any of these component supply devices, the electronic components are loosely fitted and stored in storage recesses formed in a plastic holding container or tape. The electronic component W that can move and is sucked by the suction nozzle 4 of the mounting head 3
Between the center position of the nozzle 4 and the electronic component W
Of the electronic component W and an error in the direction (suction angle) of the electronic component W naturally occur.

When components are supplied by a component supply device 1 such as a tray supply device 1a or a taping component supply device 1b that cannot accurately position components at a predetermined component supply position, a component supply device is required. 1 is added with a component positioning device, and accurate positioning is performed by this positioning device. The component is once conveyed from the component supply device 1 to a component positioning device provided at a suction position by the nozzle 4 of the mounting head 3, and is positioned by the positioning device and then suctioned by the nozzle 4. While the component is sucked to the nozzle 4 of the mounting head 3 and is conveyed, the mounting head 3 or the nozzle 4
The parts are centered and positioned by a centering device provided in the maker. The deviation of the center position and the suction angle of the component adsorbed by the nozzle 4 of the mounting head 3 with respect to the nozzle 4 is optically detected, and when the electronic component W is mounted on the printed circuit board P, the deviation is calculated from the deviation. The calculated position error and angle error of the component are corrected and mounted as correction values of the center position and the angle of the electronic component W at the mounting position. The electronic component W is accurately mounted at a predetermined mounting position on the printed circuit board P by these methods.

According to the present invention, the deviation of the center position and the suction angle of the electronic component W with respect to the nozzle 4 is optically detected and calculated based on the deviation, and the electronic component W is attached to the printed circuit board P. The present invention relates to a mounting method for obtaining a correction value of a mounting position (including a center position and an angle) when mounting the electronic component W, correcting the center position and the suction angle of the electronic component W by the correction value, and mounting the component. As a method of detecting the deviation amount between the center position and the suction angle, a method using an image processing device and a method using a line sensor are known. Here, the method using the image processing apparatus can process at high speed, but has a disadvantage that the apparatus is complicated and expensive. On the other hand, the method using a line sensor can be manufactured at low cost with a relatively simple device, but has a disadvantage that the time required for detection is long.

As a method of detecting the error of the center position and the suction angle of the electronic component W by the latter line sensor, particularly the laser line sensor, in a non-contact manner, a light projecting unit for projecting parallel light (laser light) as a light source And a light receiving unit for receiving light from the light emitting unit is provided as a pair. A sensor is provided at a measurement position provided between the light emitting unit and the light receiving unit. The electronic component W sucked by the nozzle 4 is rotated while the length of the light (hereinafter, referred to as a projected image) blocked by the electronic component W is measured by the light receiving unit. When the length of the image is minimized, it is assumed that the parallel light (laser light) of the line sensor and the outer shape of the electronic component W are arranged in parallel, and a projected image in which the outer shape of the electronic component W is cut off at this time. Is calculated from the length of the When the electronic component W is mounted on the printed circuit board P based on the calculation result, an error between the center position of the electronic component 4 and the center position of the electronic component W sucked by the nozzle 4 is calculated. A method of correcting a component mounting position by correcting a component mounting position by a position error is known. Regarding the error in the rotation direction of the nozzle 4 (electronic component W) at this time, since the outer shape of the electronic component W is arranged parallel to the laser beam, an error in the suction angle (hereinafter referred to as an angle error) occurs. Think not.

However, in this prior art, the electronic component W sucked by the nozzle 4 is supplied to the measurement position of the line sensor, the nozzle 4 is rotated in an arbitrary direction, and the length of the projected image of the electronic component W is reduced. When the length of the projection image of the electronic component W increases, the rotation is performed in the opposite direction, and the nozzle 4 stops at the position where the length of the projection image of the electronic component W is minimized. The deviation amount (position error) between the center position of the electronic component W and the center position of the electronic component W is measured, and then the deviation amount between the center position of the nozzle 4 and the center position of the electronic component W at a position rotated by 90 °. (Position error) is measured, the error of the center position of the electronic component W is calculated from the measurement result, and the position error is corrected and mounted on the printed circuit board P. When rotated in the opposite direction in the step, the electronic component W
In order to confirm that the length of the projected image of the electronic component W has become the minimum, the reverse rotation is performed after detecting that the length of the projected image of In the meantime, the length of the projected image of the electronic component W and the length and the amount of deviation of the projected image of the electronic component W by the line sensor, such as returning to a position where the length of the projected image of the electronic component W is minimized after overrun once. It wasted time that was not directly related to the measurement.

In order to save such wasted time, Japanese Patent Application Laid-Open No. Hei 6-21697 discloses that when the mounting head 3 sucking the electronic component W from the component supply device 1 rises, the suction nozzle 4 is simultaneously set to a predetermined position. After pre-rotation by a predetermined angle in the direction, the electronic component W offset in the rotation direction by the pre-rotation rotation angle is inserted into the measurement position of the line sensor by lowering the mounting head 3, and then the nozzle 4 is rotated in reverse to the pre-rotation. By measuring the length of the projected image while rotating in the direction, the electronic component W is always rotated in the direction in which the length of the projected image decreases, and the rotation of the nozzle 4 when the length of the projected image is minimized. Is disclosed. This technology prevents the electronic component W sucked by the nozzle 4 from being rotated in the reverse direction in the above-described process, thereby eliminating the waste of the rotation of the electronic component W, and measuring the length of the projected image of the electronic component W and the amount of deviation. There is no wasted time trying to reduce.

However, the electronic component W supplied to the component supply position is preliminarily rotated after being sucked by the nozzle 4, and
The pre-rotation angle is the electronic component W sucked by the nozzle 4.
It is necessary to set the angle to be sufficiently larger than the maximum error of the suction angle, so that the rotation angle of the nozzle 4 at the measurement position of the line sensor becomes large and extra time is required. It is.

On the other hand, in the electronic component mounting apparatus, in order to reduce the time required for the mounting head 3 sucking the electronic component W by the nozzle 4 to move from the component supply position to the mounting position, a plurality of (normally three) mounting devices are mounted. The electronic components W are attracted to the nozzles 4 of the head 3, respectively, and a plurality (three) of the electronic components W are moved while the mounting head 3 moves once from the component supply position to the mounting position.
Is also implemented to reduce the travel time per unit. In such a case, a measurement method for collectively measuring the plurality of electronic components W adsorbed on the plurality of nozzles 4 has been known. For example, Japanese Patent Application Laid-Open No. 6-21698 discloses a measuring method. One example is disclosed. However, also in this measurement method, the method of measuring the error of the center position and the suction angle of each of the plurality of electronic components W is the same as the conventional method, and still involves wasteful and extra operations. As a result, the useless time increases as a result of the reduced travel time.

[0012]

SUMMARY OF THE INVENTION According to the present invention, there is provided a mounting head configured to eliminate wasteful time due to such extra operation, and to simultaneously suction and transport a plurality of electronic components W to a mounting position. Also in the nozzle 4 of No. 3, the length and displacement of the projected image of each electronic component W are quickly measured by the line sensor, and the individual electronic components W Of the mounting position (correction value of the position error and the angle error) at the predetermined position, and the respective electronic components W are placed at predetermined component mounting positions on the printed circuit board P.
Is to be implemented accurately and in a short time.

[0013]

SUMMARY OF THE INVENTION In order to solve such a problem, the present invention can measure the length and the amount of displacement of a projected image of a part at a position symmetrical at a predetermined angle with respect to a reference line. , Two component sensors, component position measuring means provided with at least one set of the two sensors, and the component supplied to predetermined measurement positions of the two sensors provided in the component position measuring device. A robot device having a plurality of component transfer means, a plurality of mounting heads for gripping the plurality of components, respectively, and mounting them at predetermined component mounting positions on a base; Rotation driving means for rotating a plurality of parts for each part, wherein a projected image of the part supplied to the predetermined measurement position is measured for each part by the two sensors, and a projected image for each part is provided. Direction of rotation for each part based on the measured value of An angle error and a position error are calculated, and a center position and an angle of the plurality of components are corrected for each component based on the calculation result, and a mounting method of a mounting position of a component for mounting the component on a base is adopted. In particular, the rotation driving means for rotating the component rotates the plurality of component transport means for each component, and measures the length of the projected image measured by the two sensors for each component. Rotate in the rotation direction selected based on the value until the length of the projected image matches, stop the rotation when they match, measure the amount of deviation of the projected image, and calculate the position error of the part from this measured value. This is more effective by calculating and correcting the plurality of components for each component based on the calculation result and adopting a method of correcting the mounting position of the component mounted on the base. Alternatively, the rotation driving means for rotating the component rotates the plurality of mounting heads for each component, and for each component, measures the length of the projected image measured by the two sensors and the amount of deviation. A position error and an angle error of a component are calculated based on the values, and a position error and an angle error of the plurality of components are corrected for each component based on a result of the calculation, and a mounting position correction method of a component mounted on a base is corrected. Is more effective by adopting.

Further, in the method of correcting the mounting position of the component, the formula for calculating the position error of the component is as follows: ΔX = (ΔA + ΔB) / 2 cos θ ΔY = (ΔA−ΔB) / 2 sin θ Is calculated as: tan α = cot (β−θ) · (A ₁ −B ₁ ) / (A ₁
+ B ₁ ).

Two sensors arranged at positions symmetrical at a predetermined angle with respect to the reference line and capable of measuring the length and the amount of deviation of the projected image of the component supplied to the predetermined measurement position; A component position measuring means having at least one set of two sensors, a plurality of component conveying means for gripping and supplying a component from the component supply device to the predetermined measurement position, respectively;
A plurality of mounting heads for gripping a component whose projection image length and deviation amount are measured by the plurality of sensors, moving to a predetermined component mounting position on the base, and mounting each component, Rotation driving means for rotating the supplied plurality of components for each component, a robot apparatus holding the plurality of mounting heads and moving the mounting head to the predetermined component mounting position, and the component position measuring means Calculating means for calculating the rotation direction or angular error and position error of each component, and the correction value of the mounting head, based on the measured values of the length and the amount of deviation of the projected image measured for each component by the two sensors And a control unit that corrects and controls the movement of the mounting head with the correction value at the component mounting position, and in particular, the component transfer unit and the mounting head A plurality of sets of two sensors which are shared by a plurality of mounting heads provided in the robot apparatus and wherein the component position measuring means has the predetermined measurement positions provided in the same number and at the same pitch as the plurality of mounting heads This is a component mounting device configured to consist of:

[0016]

According to the present invention having the above-described structure,
A component (electronic component W) to be mounted on the base (printed circuit board P) is gripped by the component transfer means (nozzle 4 of the mounting head 3) and is being transferred to a component mounting position on the base (printed circuit board P). And the sensor in which the light emitting part and the light receiving part are paired is 2
A plurality of sets of component position measuring means are supplied to predetermined measurement positions in each of the two sets of sensors, and the length of the projected image of the component (electronic component W) is set for each of the two sets of sensors. The direction in which each component (electronic component W) should be rotated is directly selected by measuring with a sensor and comparing the measured value of the length of the projected image, and this component (electronic component W) is rotated for each component. When the component is rotated when the lengths of the projected images measured by the two sensors coincide with each other, the component is rotated by the error of the suction angle, Are corrected such that the error is corrected and the outline or center line serving as the reference of the component is parallel or orthogonal to the reference line (Y axis). The position error between the center of the suction nozzle 4 (the rotation center of the component sucked by the nozzle 4) and the center position of the component (electronic component W) in each component is
As described later, it can be easily obtained by calculation from the deviation amount of the projected image when the rotation of the component is stopped.

When the component (electronic component W) is mounted on the base (printed circuit board P), the suction nozzle 4 is rotated by a required angle (the orientation angle of the electronic component W) with respect to the stop position of the component. Can be rotated to orient the components in a predetermined direction, so that the robot apparatus 2 moves the mounting head 3 to the mounting position (electronic component mounting position) of the base (printed circuit board P), or After attaching the parts,
Orientation is possible while moving to the mounting position for mounting the next component, and the positional error between the center of the suction nozzle 4 and the center position of the component (electronic component W) is determined at the mounting position of each component. Processing can be performed as a correction value, and processing can be performed in the same manner as the correction of the mounting position (angle) in the related art.

Alternatively, the length and the amount of deviation of the projected image of each component (electronic component W) are measured by each of the two sensors, and the measured values of the length and the amount of deviation of the projected image are measured as described later. By calculating with arithmetic means based on
A position error between the center of the mounting head (the center of rotation of the component sucked by the nozzle 4) and the center position of the component and an error (angle error) in the direction of the sucked component are calculated, and are composed of the position error and the angle error. It is possible to subtract the error of the component mounting position from the moving position of the robot and the rotation angle of the suction nozzle 4 of the mounting head 3 as a correction value as a correction value, and process the error of the component mounting position and angle as a correction value. Can be processed in the same manner as the correction of the mounting position (angle) in the related art.

These corrections are calculated while the robot 2 moves the mounting head 3 to the mounting position (electronic component mounting position) of the base (printed circuit board P), and the mounting position (electronic component By subtracting from the coordinates of the mounting position) or the orientation angle of the electronic component W, the electronic component W is mounted (mounted) at the correct mounting position (electronic component mounting position) at the correct orientation angle without extra time. )
can do.

Even when only one set of two sensors is provided in the component position measuring means, a plurality of (three) component conveying means (nozzles 4 of the mounting head 3) grasp a plurality of components. If the (electronic component W) is sequentially supplied to a predetermined measurement position of the component position measuring means and the measurement is repeated by each of the two sensors, the correction value can be calculated in exactly the same manner.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described based on embodiments. As described above, FIG. 1 shows an example of an electronic component mounting apparatus suitable for adopting the method for correcting a mounting position of a component (electronic component W) according to the present invention. The electronic components supplied by the component supply device 1 such as the taping component supply device 1b are vertically attached to a plurality of (three in this embodiment) mounting heads 3 provided on, for example, a robot 2 movable in the XY directions. Each of the suction nozzles 4 is sucked and held one by one by an arbitrary component conveying means such as the suction nozzle 4 movably held, and a component (electronic component W) is measured from the component supply device 1 by a component position not shown. After being conveyed to a predetermined measurement position of the means and measured by two sensors (see FIGS. 2 and 3), a predetermined component mounting position on a base, for example, a printed circuit board P on which components are mounted ( It is mounted to be transported to the places). Each of the plurality of suction nozzles 4 can be rotated to a predetermined rotation angle by the rotation driving means 5 in order to mount the electronic component W on the printed circuit board P in a predetermined direction (orientation angle). ing.

In the embodiment shown in FIG. 1, an example is shown in which three suction nozzles 4 are simultaneously rotated by a single drive motor as the rotary drive means 5, but the rotary drive means 5 is attached to each mounting head 3. And the individual suction nozzles 4 may be individually driven to rotate. Alternatively, as in the embodiment, the suction nozzles 4 may be driven to rotate by a single rotation driving means 5 so that the suction nozzle 4 descends to move the component position. By rotating only the suction nozzle 4 that has supplied a component to a predetermined measurement position of the measuring unit, the component may be sequentially rotated for each component. This method is suitably applied to a case where the component position measuring means has only one measurement position (only one set of two sensors).

In the embodiment shown in FIG. 1, the component conveying means for conveying a component (electronic component W) to a predetermined measuring position of the component position measuring means is the suction nozzle 4 of the mounting head 3 and the base (printing). The component is shared by the mounting head 3 for mounting the component at a predetermined position on the circuit board P), but the component is conveyed by another independent robot device and is rotatable provided at a predetermined measurement position of the component position measuring means. The component placed on the mounting table is rotated by the rotation driving means 5, and after the measurement by each of the two sensors, the component is taken out by the mounting head 3 and removed from the base. Of course, it is also possible to configure so as to be mounted at a predetermined position.

The predetermined measurement position of the component position measuring means is provided at an arbitrary position (not shown) on the transport path of the component to be transported from the component supply device 1 to the predetermined component mounting position on the printed circuit board P. This measurement position,
The number of sensors (laser line sensors in the embodiment) configured as a pair of the light projecting unit and the light receiving unit shown in FIG. 2 or FIG. 3 is the same as the number of component conveying means (suction nozzle 4) (only one set in the embodiment). Are drawn at the same pitch and symmetrically at a predetermined angle with respect to the reference line, and the length of the projected image of the component is measured by a sensor (a set of two) of the component position measuring means. And the amount of deviation are measured.

That is, the mounting head 3 which sucks and holds the electronic component W and supplies it to a predetermined measuring position of the component position measuring means.
Are the same in number as the set of two laser line sensors and are arranged at the same pitch as the measurement position.
After moving the mounting head 3 above the measurement position,
By lowering the suction nozzles 4 of the three mounting heads 3, the electronic component W can be supplied to the measurement position of the component position measuring means.

Alternatively, the suction nozzle 4 of one mounting head 3 is moved above the measurement position by the robot 2, and the suction nozzle 4 descends to supply the electronic component W to the measurement position of the component position measuring means. After measuring the length and the amount of deviation of the projected image of the component by the sensor of the component position measuring means, the suction nozzle 4 of the next mounting head 3 is moved above the measurement position, and the suction nozzle 4 is lowered and the measurement position is measured. By repeating the supply of the electronic component, the predetermined measurement position of the component position measuring means can be set to only one.

FIGS. 2 and 3 show these two sensors 11,
12 is a plan view conceptually depicting a method and an apparatus for measuring the length and the amount of deviation of the projected image of the component by the component position measuring means consisting of 12 parts. Of the center position of the nozzle 4 (not shown) (the rotation center of the electronic component W) and the center position of the electronic component W, and the variation of the suction angle between the nozzle 4 and the electronic component W (the deviation amount of the suction angle). FIG. 4 is an explanatory view for explaining a method and an apparatus for detecting the electronic component W. FIG. 4 is an explanatory view showing only the central part of FIGS. 2 and 3 in an enlarged manner, and FIGS. 6 is a flowchart illustrating an operation from suction of a device to mounting on a printed circuit board P.

As shown in FIGS. 2 and 3, the component position measuring means includes a light projecting portion and a light receiving portion at positions symmetrical at a predetermined angle θ with respect to a reference line (in the embodiment, Y axis). Are arranged so as to have the same height, and three sets of these two sensors 11, 12 are arranged (only one set is shown in the figure, and the other two sets are omitted). ing. 2 and 3, the sensors 11 and 12 are used.
Is a laser line sensor.
Described as 1 and 12. However, as is clear from the figure,
Since the laser sensors 11 and 12 have a light-emitting unit and a light-receiving unit separated from each other, the light-emitting unit and the light-receiving unit are respectively denoted by reference numerals to form light-emitting units 11a, 12a and light-receiving units 11b and 12b. The entry of reference numerals for the entire laser sensor is omitted. Therefore, the two laser sensors 11 and 12 each include a light projecting unit 11a and a light receiving unit 11b, and a light projecting unit 12a and a light receiving unit 12b, and the parallel laser beams 11c and 12c from the light projecting units 11a and 12a, respectively. Are projected, and the projected image whose light is blocked by the electronic component W on the way is received by the light receiving sections 11b and 1b.
The light is received at 2b, and the length and the amount of deviation of the projected image are measured.

There are three sets of these two laser sensors 11 and 12, and at a predetermined measurement position provided at the center of each measurement range (the range where the laser beams 11c and 12c intersect), 3 in FIG. The electronic components W are sucked and supplied by the nozzles 4 of the mounting heads 3 respectively. Here, the supplied electronic component W fits loosely into a storage recess formed in a plastic holding container or tape of the component supply device 1 (see FIG. 1) such as the tray supply device 1a or the taping component supply device 1b. And the deviation between the center position of the nozzle and the center position of the electronic component or the deviation between the nozzle and the electronic component within a range in which the nozzle and the electronic component can move freely inside the holding recess of the holding container or the tape. Since the deviation of the angle occurs, the outline or the center line (the center axis in the longitudinal direction of the electronic component W in the embodiment of FIG. 2 or FIG. 3) which is the reference of the component is the reference line (Y axis).
Are supplied in a substantially parallel or orthogonal (in the embodiment, orthogonal) posture within a range in which it can move inside the holding container or the tape accommodating recess.

In the embodiment of the present invention, the laser sensor 11,
12 and a plurality of nozzles 4 of the mounting head 3 (3
However, in the measurement of the length of the projected image and the amount of deviation at the measurement position, the measurement of one electronic
Therefore, in the following description, two laser sensors 1 will be described based on FIGS. 2 and 3.
One combination of the electronic components W and 1 and the combination of the electronic component W sucked by the nozzle 4 of the mounting head 3 will be described.

FIG. 2 is a view for explaining a first embodiment of the mounting position correcting method and apparatus according to the present invention, wherein the electronic component W supplied to the measuring position includes two laser sensors 11 and 12.
Laser beam 11 emitted from light emitting units 11a and 12a
In a plane (measurement plane) through which c and 12c pass, the cross-sectional shape is a non-circular, symmetrical shape (a rectangle in the embodiment), and in the present embodiment, by rotation of the nozzle 4,
Since the electronic component W rotates, the electronic component W is gripped such that the center position of the nozzle 4 and the rotation center of the electronic component W coincide with the center O ₀ of the predetermined measurement position.

Here, the center position of the nozzle 4 and the electronic component W
Are aligned at the center O ₀ of the measurement position, and supplied without any error such that the reference outline or center line is parallel or orthogonal to the reference line (Y axis). , i.e., the supplied electronic component W is indicated by the electronic component W ₀ position, drawn in phantom lines when the error in the position and angle is supplied in a state no.

On the other hand, the electronic component W which is actually supplied has a center position O of the electronic component with respect to the center position O ₀ of the nozzle 4.
_1. Suction is performed with the angle shifted by α and supplied to the measurement position. This, in FIG. 2, is displayed in the electronic component W ₁ depicted in phantom. Light projecting portion 11a of the electronic component W ₁ into two laser sensors 11 and 12, parallel to the laser beam 11c from 12a, the 12c is projected, the projected image light is blocked by the electronic component W ₁ is received The light is received by the units 11b and 12b. Assuming that the lengths of the projected images are A ₁ and B ₁ , when the cross-sectional shape of the electronic component W ₁ is rectangular or square, the lengths of the two diagonal lines match, and the center of the cross-sectional shape is 2 The center position O ₁ of the electronic component is determined by the suction angle α of the electronic component W with respect to the nozzle 4.
Irrespective of, the intersection of the two diagonals (the midpoint of the projected image of each diagonal), therefore, the center position O ₁ of the electronic component W _{1 in} the projected image is always the length A ₁ , B of the projected image
A _first midpoint _{(A 1/2, B 1} /2 positions).

Hereinafter, the steps will be described according to the flowchart of FIG. 5 with reference to FIG. The robot 2 operates so that the nozzle 4 of the mounting head 3 is located above the component supply device 1 such as the tray supply device 1a and the taping component supply device 1b shown in FIG. Alternatively, from the taping component supply device 1b, the three nozzles 4 each suck and hold one electronic component, and the nozzle 4 rises to move the electronic component W from the component supply device 1.
Is taken out (step 21). At this time, it is assumed that the center position O ₁ of the electronic component is offset from the center position O ₀ of the nozzle 4, and the electronic component is sucked at an angle α.

Next, the mounting head 3 is moved by the robot 2 to a predetermined measurement position provided at the center of the measurement range of the two laser sensors 11 and 12, and the nozzle 4 descends to
The laser sensors 11 and 12 are arranged at a predetermined measurement position O ₀ (a position where the rotation center of the nozzle 4 is at the predetermined measurement position O ₀ ) of the component position measurement means. In this position, as depicted in phantom in FIG. 2, the center position O ₁ of the electronic component W ₁ is at a position offset from the center position O ₀ of the nozzle 4, inclined by an angle error alpha 2 The laser is supplied within the measurement range of the laser sensors 11 and 12 (step 22).

[0036] Here, comparing the length A ₁ of the projected image of the electronic component W _1, B ₁ were measured by two laser sensors 11, 12 (step 23), the length A ₁ of the projected image, B ₁ (Steps 24 and 25). Length A ₁ , B of projected image of electronic component W _1
1 is a projection image with respect to a diagonal line having the same length as described above.
In the case where the diagonal angle is deviated from 1c and 12c), the lengths A ₁ and B ₁ of the projected images are compared, and when A ₁ > B ₁ as shown in FIG. A rotation direction is selected, and when A ₁ <B _1, a clockwise rotation direction is selected, and the nozzle 4 is rotated in the selected rotation direction by the rotation driving means 5 (see FIG. 1) (Steps 26 and 27). .
The rotation driving means 5 for rotating the nozzle 4 is provided in almost all electronic component mounting apparatuses for mounting electronic components at a predetermined orientation angle. Is omitted.

When the nozzle 4 is rotated in the selected rotation direction, the length of the projected image of the electronic component W ₁ gradually becomes A ₁ = B ₁
And rotation of the suction nozzle 4 is stopped when A ₁ = B ₁ (A ₂ = B _{2 in} the display of FIG. ₂ ) (step 2).
8). This state, in FIG. 2, are displayed in the electronic component W ₂ drawn with a solid line. The direction of rotation of the nozzle 4 by the rotation drive means 5 is the light projection unit 1 of the two laser sensors 11 and 12.
It depends on the arrangement of 1a, 12a and the light receiving units 11b, 12b, the direction of the outline or the center line serving as the reference of the electronic component W, and the like. It is very difficult to define the arrangement and the like of the two laser sensors and the electronic components based on the configuration requirements, and, as shown in FIG. Since it is extremely easy to determine the rotation direction corresponding to the comparison of the lengths of the projected images, the rotation direction of the nozzle 4 is defined here as the direction in which the angle error α of the suction angle of the electronic component W with respect to the nozzle 4 decreases. I do.

The cross-sectional shape of the electronic component W at the positions of the laser sensors 11 and 12 is rectangular or square in the plane on which light is projected, so that the length of the diagonal line is the same and the reference line (Y axis) The lengths A ₂ and B ₂ of the projected images of the electronic component W ₂ by the two sets of laser sensors 11 and 12 arranged symmetrically at the same angle θ are A ₂ = B ₂ . The two diagonal lines of the electronic component W are projected from the two sets of laser sensors 11 and 12 into the laser beams 11 c and 12.
2 shows that the angle is the same as the angle c, and as is apparent from FIG. 2, the outline or center line (the center axis in the longitudinal direction of the electronic component W in the embodiment) serving as the reference of the electronic component W is the reference line. This indicates that it is parallel or orthogonal to the (Y axis) (orthogonal in the embodiment), indicating that the correction of the angle error α of the suction angle at the time of suction of the electronic component W has been completed. Then, as shown in FIG. 2, the center position O ₂ of the electronic component W ₂ is offset from the center position O ₀ of the nozzle 4 by (ΔX, ΔY), and the center position O _{0 of the} nozzle 4 is set.
Are projected onto the light receiving portions 11b and 12b of the laser sensors 11 and 12 as projection images deviated by the amounts of deviation ΔA and ΔB with respect to. Of course, when A ₁ = B ₁ (A ₂ = B ₂ ) from the beginning, the rotation of the mounting head 3 by the rotation driving means 5 is unnecessary.

Next, deviation amounts ΔA, ΔB between the center position O _{0 of} the nozzle 4 (the center of rotation of the electronic component W) O ₀ and the center position O ₂ of the electronic component W ₂ for which the correction of the angle error α of the suction angle has been completed. Is measured (step 29). The deviation amounts ΔA, ΔA, ΔB obtained by performing the measurement steps (steps 22 to 29) of these deviation amounts ΔA, ΔB in parallel or sequentially for each component held by the mounting head 3
The measured value of ΔB is sent to the calculating means, and the calculating means calculates a position error (ΔX, ΔY) between the rotation center O ₀ and the center position O ₂ of the component for each component.

As described above, the center position O ₂ of the electronic component W ₂ is located at the intersection of the midpoints of the lengths A ₂ and B ₂ of the respective projected images when the cross-sectional shape is substantially rectangular or square. It is obvious that the two laser sensors 11 and 12
Then, the positions of both ends of each projected image and their lengths A ₂ and B ₂ are measured, and the intersection of the midpoint of the projected image is calculated by the calculating means, thereby calculating the center position O ₂ of the electronic component W ₂ . Then, by comparing the rotational center O ₀ of the center position O ₂ and the electronic component W of this electronic part W _2, deviation amount ΔA of the electronic component W _2, .DELTA.B (.DELTA.B in the embodiment of FIG. 2 is negative)
Is calculated.

When the measurement of the positions at both ends of each projected image and the lengths A ₂ and B ₂ is completed, the robot 2 holding the mounting head 3 moves toward the electronic component mounting position on the printed circuit board P. (Step 30). At the same time, the correction values ΔX, ΔY at the electronic component mounting position are calculated from the deviation amounts ΔA, ΔB of the center position O ₂ of the electronic component W ₂ by the calculation means according to the following formula (step 31). ΔX = (ΔA + ΔB) / 2 cos θ ΔY = (ΔA−ΔB) / 2 sin θ where ΔX and ΔY are positional errors between the rotation center and the center position of the component, and are correction values at the electronic component mounting position (FIG. 2).
In the embodiment, ΔX is a negative number), ΔA and ΔB are the deviation amounts of the center position O ₂ of the electronic component W ₂ , and θ is the angle of the two sets of laser sensors 11 and 12 with respect to the reference line (Y axis).

FIG. 4 shows FIG. 2 to derive the above formula.
FIG. 3 is an explanatory diagram illustrating only a central portion of FIG. In the figure, a laser beam 11 passing through a center position O ₂ of an electronic component W ₂ is shown.
Assuming that the distances from the origin O _{0 at} the intersections of c and 12c with the X axis are a and b (b is a negative number), ΔB, ΔX and b are negative numbers in the embodiment of FIG. In two triangles projecting downward, a · cos θ = ΔA a = ΔA / cos θ b · cos θ = ΔB b = ΔB / cos θ, and in the two triangles projecting upward, 2ΔY · tan θ = (a + b) ΔY = (A + b) / 2 tan θ ΔX = (a + b) / 2−a = (ba) / 2 Therefore, ΔX = (a + b) / 2 = (ΔA / cos θ + ΔB / cos θ) / 2 = (ΔA + ΔB) / 2 cos θ ΔY = (ab) / 2 tan θ = (ΔA / cos θ−ΔB / cos θ) / 2 × cos θ / sin θ = (ΔA−ΔB) / 2 sin θ.

The arithmetic means sends the position error (ΔX, ΔY) between the rotation center O ₀ and the center position O ₂ of the component to each of the three electronic components calculated in this manner, and sends the error to the robot controller. Output as a correction value of the component mounting position. In the robot controller, the correction values (ΔX, ΔY) are input during the movement of the robot 2 to the electronic component mounting position of each electronic component.
Y) is added (subtracted in the actual operation) (step 32),
The electronic component mounting position on the printed circuit board P is corrected by rotating the electronic component whose angle error has been corrected by rotating the electronic component by an angle necessary for mounting (orientation angle when mounting the electronic component). (Step 33).

When the robot 2 reaches each electronic component mounting position, the suction nozzles 4 of the mounting head 3 descend sequentially corresponding to the electronic components to be mounted, and the three electronic components W Correct to the correct position and mount at the correct orientation angle at the three component mounting positions (Step 3
4). When the mounting of the electronic component W is completed, the robot 2 returns to the origin and repeats the same supply and mounting process for the next electronic component W (step 35).

In the second embodiment shown in FIG. 3, similarly to the first embodiment, the electronic component W actually supplied has a center position of the electronic component with respect to the center position O ₀ of the nozzle 4. O
_1. Suction is performed with the angle offset by α and supplied to the measurement position. This is the electronic component W drawn by the solid line.
Display with ₁ . Light projecting portion 11a of the electronic component W ₁ into two laser sensors 11 and 12, respectively parallel to the laser beam 11c from 12a, 12c is projected, the projected image light is blocked by the electronic component W ₁ is the light receiving portion Light is received at 11b and 12b. When the length of the projected image and A _1, B _1, respectively, in the case of the cross-sectional shape is an electronic component W ₁ of the rectangular or square, as in the first embodiment, the center position of the electronic component W ₁ in the projection image O _1, the length a _1, B ₁ at the midpoint of the projected image _{(a 1/2, B 1} /2 position), and the deviation amount .DELTA.A, delta
The position B is shifted from the center position O _{0 of the} nozzle 4 by B.

Hereinafter, the steps will be described in accordance with the flowchart of FIG. 6 with reference to FIG. The robot 2 operates so that the nozzle 4 of the mounting head 3 is located above the component supply device 1 such as the tray supply device 1a and the taping component supply device 1b shown in FIG. Alternatively, the electronic component is sucked and gripped from the taping component supply device 1b, and the nozzle 4 is raised to take out the electronic component from the component supply device 1 (step 41). At this time, the center position O ₁ of the electronic component is tilted by an angle α with respect to the center position O ₀ of the nozzle 4 around a position offset within a movable range in the storage recess of the component supply device 1. Adsorbed.

Next, the mounting head 3 is moved by the robot 2 to a predetermined measurement position provided at the center of the measurement range of the two laser sensors 11 and 12, and the nozzle 4 descends to
The laser sensors 11 and 12 are arranged at a predetermined measurement position O ₀ (a position where the rotation center of the nozzle 4 is at the predetermined measurement position O ₀ ) of the component position measurement means. In this position, as depicted by the solid line in FIG. 3, the center position O of the electronic component W _1
1 is offset from the center position O ₀ of the nozzle 4 by (ΔX, ΔY) and tilted by an angle error α and supplied to the measurement range of the two laser sensors 11 and 12 (Step 4).
2).

Here, the lengths A ₁ and B ₁ of the projected image of the electronic component W ₁ , the center position O _{0 of the} nozzle 4 and the electronic component W ₁
The deviation amounts ΔA and ΔB from the center position O ₁ are measured by the two laser sensors 11 and 12, respectively (step 43). When the cross-sectional shape is substantially rectangular or square, the center position O ₁ of the electronic component W ₁ has the same diagonal length, and the intersection of the midpoints of the lengths A ₁ and B ₁ of the respective projected images. It is clear that the two laser sensors 11, 1
2, the positions of both ends of each projected image and their lengths A ₁ and B ₁ are measured, and the midpoint of the projected image is calculated by the arithmetic means and compared with the rotation center O ₀ of the electronic component W. The deviation amounts ΔA and ΔB (ΔB in the embodiment of FIG. 2 is a negative number) can be calculated.

When the measurement of the lengths A ₁ and B ₁ and the deviation amounts ΔA and ΔB of the respective projected images is completed, the robot 2 holding the mounting head 3 moves to the electronic component mounting position on the printed circuit board P. (Step 44). At the same time, the arithmetic means
The length A ₁ of the projected image of the electronic component W _1, B ₁ and the center position O
_From the deviation amounts ΔA and ΔB of _1, the position errors ΔX and ΔY and the angle error α, which are the correction values at the electronic component mounting position, are calculated according to the following formula (step 45). Here, a calculation formula for calculating the component position error (ΔX, ΔY) is as follows: ΔX = (ΔA + ΔB) / 2 cos θ ΔY = (ΔA−ΔB) / 2 sin θ The calculation formula for calculating the component angle error α is , Tanα = cot (β−θ) · (A ₁ −B ₁ ) / (A ₁
+ B ₁ ), and ΔX and ΔY are the rotation center O ₀ and the center position O of the component.
A positional error from ₁ and a correction value at the electronic component mounting position (ΔX in the embodiment of FIG. 3 is a negative number), α is an angular error of the suction angle, and A ₁ and B ₁ are the lengths of the projected images of the respective laser sensors. is, L is the diagonal length of the part of the cross-sectional shape, the angle between the β is the outer line or center line as a reference component diagonal, .DELTA.A, .DELTA.B the center position O ₁ of the electronic component W ₁
Is the angle of the pair of laser sensors 11 and 12 with respect to the reference line (Y axis).

FIG. 4 shows the position errors (ΔX, Δ
FIG. 4 is an explanatory diagram in which only a central portion of FIG. 3 is enlarged to derive a calculation formula for calculating Y). FIG. 4 same as the first embodiment.
As can be seen from this, this calculation formula is exactly the same as the calculation formula in the first embodiment, and is derived by the same calculation process, so that the details are omitted here.

Meanwhile, calculation formula for calculating the angular error alpha of components in FIG. _{1, A 1/2 = L} / 2 · cos (α-β + θ) B 1/2 = L / 2 · cos (α + β-θ Therefore, A ₁ = L ｛cosα · cos (β−θ) + sinα · s
in (β−θ)｝ B ₁ = L ｛cosα · cos (β−θ) −sinα · s
When in (β-θ)} or subtracting the two _{equations, A 1 + B 1 = 2L} {cosα · cos (β-θ)} A 1 -B 1 = 2L {sinα · sin (β-θ)} Therefore, sin .alpha = (A ₁ −B ₁ ) / 2L sin (β−θ) cos α = (A ₁ + B ₁ ) / 2 L cos (β−θ) or tan α = {(A ₁ −B ₁ ) / (A ₁ + B ₁ )} cot
(Β−θ).

For the three electronic components thus calculated, the position error (ΔX, ΔY) and the angle error α between the rotation center O ₀ of the component and the center position O _{1 of the} component are determined by the robot controller and The correction value of the electronic component mounting position is output to the rotation driving means of the head 3. In the robot controller, the correction values (ΔX, ΔY) and α are input during the movement of the robot 2 to the electronic component mounting position. Therefore, the correction values (ΔX, ΔY) are added to the coordinate values of the electronic component mounting position. The movement amount of the robot 2 is corrected by adding (subtracting as an actual operation) (step 46), and the rotation angle (orientation angle at which the electronic component is mounted) necessary for mounting the electronic component is corrected by the angle error. The correction value α is added (subtracted as an actual operation) (step 46), and the mounting head 3 is rotated by the rotation driving means 5 to move to the electronic component mounting position on the printed circuit board P (step 47).

When the robot 2 reaches the electronic component mounting position, the suction nozzle 4 of the mounting head 3 descends, and the electronic components W are sequentially corrected on the printed circuit board P to the correct position and mounted at the correct orientation angle. (Step 48). When the mounting of the three electronic components W is completed, the robot 2 returns to the origin and repeats the same supply and mounting process for the next electronic component W (step 49).

As shown in FIG. 1, a plurality (3 in FIG. 1)
In the electronic component mounting apparatus having the mounting head 3 and the suction nozzle 4, the suction nozzle 4 is
In order to individually measure the length and the amount of deviation of the projected image of the electronic component W when rotating, each nozzle 4 is disposed above the above-described predetermined measurement position, and one nozzle 4 is provided at a time. The laser sensors 11 and 12 are sequentially lowered to a predetermined measurement position and rotated by a single rotation driving means 5 so that three laser sensors 11 and 12
By correcting the direction of the electronic component W by either of the above, the length of the projected image of the electronic component W is measured, or the length and the amount of deviation of the projected image are measured, so that the electronic component in each nozzle 4 is The correction value of the position error (and angle error) of W can be obtained individually. 3 suction nozzles 4
Rotation driving means 5 capable of independently and simultaneously driving the rotation
Is used, it is needless to say that it is possible to simultaneously measure the length and the amount of deviation of the projected images of the electronic components W of the three suction nozzles 4.

Even when a cylindrical electronic component W or the like is mounted on the horizontal axis, the cross-sectional shape of the electronic component W in a plane serving as an optical path of the laser light projected from the laser sensors 11 and 12 is substantially equal. becomes rectangular or square, the diagonal of the intersection of the cross-sectional shape becomes the center position O ₁ of the component can be cross section handled in exactly the same as that of the rectangular or square. Further, for example, as shown in FIG. 8, even in a part W having electrodes fitted at both ends and a cross-sectional shape of a drum, the diagonal and center position of the part can be obtained in exactly the same manner as a rectangle or a square. It can be treated as a rectangle or a square.

If the cross-sectional shape is a component having a symmetrical shape in the left-right or up-down direction, as shown in FIG. 7, as an example, the length of two corresponding diagonal lines is always the same regardless of the cross-sectional shape. Match. However, the center position O ₀ ′ of the part is always 2
It is not always at the intersection O ₁ 'of the diagonal of the book. In this case, the position error ΔY ′ (or ΔX ′) between the center position O ₀ ′ of the component and the intersection O ₁ ′ of the diagonal is calculated and stored in advance, and the intersection O ₁ ′ of the two diagonals is determined. When calculating the position of a part as a reference point and correcting the movement amount of the robot 2,
Further, as an additional correction value, a correction value based on the position error ΔY ′ (or ΔX ′) is obtained by exactly the same arithmetic processing, and the position error or the angle error is added and corrected.
Operation processing can be performed in exactly the same manner.

Similarly, for a part whose cross-sectional shape is not symmetrical or a part whose mounting position is offset from the center of the part, the positional error ΔY between the center position O ₀ ′ of the part and the intersection O ₁ ′ of the diagonal line is similarly obtained. By calculating and storing ', ΔX' or α 'in advance, the position errors ΔY', ΔX ', α' can be corrected as additional correction values, and the same processing can be performed. In this case, however, in the first embodiment, the difference (or dimensional ratio) of the lengths of the projection lines is specified and stored in advance even when the rotation direction of the component is determined or stopped. The direction of rotation must be selected or stopped according to the difference (or dimensional ratio) of the lengths of the projection lines. A part having a circular cross-sectional shape corresponds to a part having no error in the suction angle α. The deviation amounts ΔA and ΔB of the center position are directly measured, and the rotation center O ₀ and the center position O ₁ ( Alternatively, the correction method and the component mounting apparatus of the present invention can be used by calculating the correction values ΔX and ΔY with O ₂ ).

When calibrating the center position O _{0 of the} nozzle 4 and the position of the reference line, a reference piece which has substantially the same shape as the electronic component W and has the same length as the diagonal line is used. Therefore, the position error and the angle error (or the angle at which the nozzle 4 is rotated) are measured at two positions where the nozzle 4 is rotated by approximately 180 ° or 90 °, and the calibration can be performed based on the average value. If it is necessary to mount with higher accuracy, the position error and the angle error (or the rotated angle) are measured at two places similarly rotated by approximately 180 ° (or a predetermined angle). By using the average value as the position error and the angle error (or the rotated angle), the mounting can be performed with higher accuracy.

In the above description, the electronic component W has been described as a component. However, as is apparent from the description of a component having a non-circular cross-sectional shape and a symmetrical shape or a component having a non-symmetrical cross-sectional shape, The present invention is applicable to parts of any shape and use. The sensor need not be limited to a laser sensor, but may be any non-contact sensor such as an arbitrary line sensor or optical sensor, and is preferably a non-contact optical sensor.

Further, in the embodiment, the rotation driving means has been described by using the suction nozzle 3, but the two laser sensors 11 and
When measuring the length and deviation of the projected image of the component by 12 or while moving to the mounting position after measuring the length and deviation of the projected image of the component, it rotates around a predetermined rotation center. In the first embodiment, in particular, in the first embodiment, a component supplied to a predetermined measurement position by the suction nozzle 3 is mounted, or the mounting nozzle is suctioned from below and rotated as an independent mounting table. The mounting table can be rotated by the rotary drive means, or in the second embodiment, it can be a mounting head separate from the component supply means for supplying components to the measurement position. With this configuration, it is possible to employ a more accurate part rotating means, and the position accuracy of the rotation center of the part is increased, and at the same time, the next part is supplied to the measurement position at the time of mounting the previous part. Therefore, it is possible to measure the length and the amount of deviation of the projected image of the component by the two sensors, so that there is an effect of further reducing the cycle time.

[0061]

According to the present invention, the length and the displacement of the projected image of the electronic component W adsorbed on the nozzle 4 to be mounted on the printed circuit board P are reduced by two lasers. In the first embodiment, the direction in which the nozzle 4 is to be rotated is immediately determined by comparing the measured values. In the first embodiment, the nozzle 4 is rotated by the error of the suction angle of the electronic component W in the correct rotation direction, and the nozzle is immediately rotated. The rotation of the nozzle 4 can be stopped. When the rotation of the nozzle 4 is stopped, it is determined based on the difference between the measured values of the two laser sensors. Alternatively, in the second embodiment, the position error and the angle error are immediately calculated, and when the electronic component W is mounted on the printed circuit board P, the position error and the angle error are converted to the electronic component mounting position or the orientation angle of the electronic component W. , The position error (and the angle error) can be corrected while the robot apparatus 2 moves the mounting head 3 to the electronic component mounting position on the printed circuit board P, as in the prior art. Next, after the electronic component is supplied to the measurement position by the laser sensor, the nozzle 4 that has sucked the electronic component W is trially rotated to check whether the rotation direction is correct, or the maximum error of the suction angle of the electronic component W is checked. It is not necessary to make the pre-rotation sufficiently larger than the above, and no wasted time that is not directly related to the measurement of the length of the projected image of the electronic component W by the line sensor is required. Do correction is possible, efficiently in which performs correction of the component mounting position and it is possible to mount the components on the base.

Then, the electronic component W is mounted on the printed circuit board P.
When mounting, the rotation of the nozzle 4 of the mounting head 3 is
The electronic component W is oriented in a predetermined direction by rotating the nozzle 4 by a necessary angle (the orientation angle of the electronic component W) with respect to the stop position of the nozzle 4 for each electronic component W to be mounted, or Since the correction value of the angle error may be added to the orientation angle, orientation can be performed while the mounting head 3 is moved by the robot device 2 to the electronic component mounting position on the printed circuit board P. Further, since the position error between the center position of the nozzle 4 and the center position of the electronic component W is obtained as a correction value of the electronic component mounting position by calculation by the calculating means, the processing is performed only by adding the correction value to the electronic component mounting position. It is possible to Therefore, according to the present invention, accurate measurement can be performed more quickly for each electronic component to be mounted, and a position error and an angle error of each electronic component can be corrected and the electronic component can be efficiently mounted at an accurate mounting position. It is what becomes.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of an electronic component mounting apparatus suitable for adopting a component mounting position correcting method according to the present invention.

FIG. 2 is a plan view conceptually illustrating a method and an apparatus of the first embodiment for measuring the length and the amount of deviation of a projected image of a component at a measurement position.

FIG. 3 is a plan view conceptually illustrating a method and apparatus according to a second embodiment for measuring the length and the amount of deviation of a projected image of a component at a measurement position.

FIG. 4 is an explanatory diagram showing only a central portion of FIGS. 2 and 3 in an enlarged manner.

FIG. 5 is a flowchart illustrating an operation from suction of an electronic component by a suction nozzle to mounting on a printed circuit board in the first embodiment.

FIG. 6 is a flowchart illustrating an operation from suction of an electronic component by a suction nozzle to mounting on a printed circuit board in the second embodiment.

FIG. 7 is a plan view conceptually depicting a part having a symmetrical cross-sectional shape.

FIG. 8 is a plan view conceptually depicting a drum-shaped component in cross section.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Component supply apparatus 1a Tray supply apparatus 1b Taping component supply apparatus 2 Robot apparatus 3 Mounting head 4 Suction nozzle 5 Rotation drive means 11 Laser sensor 11a Light emitting part 11b Light receiving part 12 Laser sensor 12a Light emitting part 12b Light receiving part P Printed circuit board W Electronic components

Claims (6)

[Claims] 1. Two sensors arranged at positions symmetrical with respect to a reference line at a predetermined angle so as to be able to measure the length and deviation of a projected image of a part, and at least one set of the two sensors A component position measuring unit provided, a plurality of component transporting units for supplying the component to predetermined measurement positions of the two sensors provided in the component position measuring unit, and a plurality of the plurality of components, respectively. A robot apparatus having a plurality of mounting heads mounted at predetermined component mounting positions on a base, and rotation driving means for rotating a plurality of components supplied by the plurality of component transport means for each component. A projection image of the component supplied to the predetermined measurement position is measured for each component by the two sensors, and a rotation direction or an angular error and a position error are determined for each component based on the measurement value of the projection image for each component. Is calculated, and the result of the calculation A method for correcting a mounting position of a component, comprising correcting a center position and an angle of a plurality of components for each component and mounting the component on a base. 2. A method according to claim 1, wherein said rotation driving means for rotating said parts rotates said plurality of parts conveying means for each part, and for each part, the length of the projected image measured by said two sensors is determined. The projection image is rotated in the rotation direction selected based on the measured value until the length of the projected image matches.When the lengths match, the rotation is stopped and the amount of deviation of the projected image is measured. 2. The method according to claim 1, wherein the plurality of components are corrected for each component based on a result of the calculation, and mounted on a base. 3. A rotary driving means for rotating said parts, said plurality of mounting heads being rotated for each part,
For each component, a position error and an angle error of the component are calculated based on the measured values of the length and the amount of deviation of the projected image measured by the two sensors, and the position error of the plurality of components is calculated based on the calculation result. 2. The method according to claim 1, further comprising: correcting an angle error for each component and mounting the component on a base. 4. In the method of correcting a mounting position of a component, a formula for calculating a position error of the component is: ΔX = (ΔA + ΔB) / 2 cos θ ΔY = (ΔA−ΔB) / 2 sin θ Is calculated as: tan α = cot (β−θ) · (A ₁ −B ₁ ) / (A ₁
Correction method for the mounting position of the component according to claim 1 to 3, wherein the + B ₁₎ is. 5. Two sensors arranged at positions symmetrical at a predetermined angle with respect to a reference line and capable of measuring the length and the amount of deviation of a projected image of a component supplied to a predetermined measurement position, Component position measuring means having at least one pair of two sensors;
A plurality of component conveying means for gripping and supplying the components from the component supply device to the predetermined measurement positions, and a component for measuring the length and the amount of deviation of the projected image by the two sensors; A plurality of mounting heads for moving to a predetermined component mounting position above and mounting each component, rotation driving means for rotating the plurality of components supplied by the component conveying means for each component, A robot apparatus for holding the mounting head and moving the mounting head to the predetermined component mounting position, and measuring the length and the amount of deviation of the projected image measured for each component by two sensors of the component position measuring means Rotation direction or angle error and position error for each part based on the value,
A component mounting apparatus comprising: a calculating unit that calculates a correction value of the mounting head; and a control unit that corrects and controls the mounting head with the correction value at the component mounting position. 6. The component conveying means and the mounting head,
The component position measurement means is shared by a plurality of mounting heads provided in the robot apparatus, and the component position measuring means is provided by a plurality of sets of two sensors having the predetermined measurement positions provided in the same number and at the same pitch as the plurality of mounting heads. The component mounting apparatus according to claim 5, wherein