JP3760274B2 - Electronic component mounting method and apparatus - Google Patents

Description

[0001]
[Technical field to which the invention belongs]
The present invention relates to an electronic component mounting method and apparatus for mounting electronic components on a printed circuit board.
[0002]
[Prior art]
Among electronic components mounted on a printed circuit board, chip components are the most common. When this chip component is mounted on a printed circuit board, it is automatically mounted by vacuum suction using a suction nozzle. In this case, in order to accurately mount at a preset position on the mounting surface of the printed board, the mounting position is specified by XY coordinates, and the mounting angle is specified by θ. On the other hand, in order to reduce the manufacturing cost, it is desired to mount many chip parts in a short time. For this reason, control is performed so that the sucked chip component is mounted at the designated position as quickly as possible.
[0003]
[Problems to be solved by the invention]
However, the center of the suction nozzle and the center of the suctioned chip part do not always coincide. Moreover, the angle | corner of the adsorbed chip component may also have shifted | deviated. For this reason, the XY coordinates and the mounting angle θ of the mounted chip component are shifted, and as a result, the printed circuit board on which the component is mounted may be defective. Therefore, there is a problem that mounting the picked-up chip parts at the designated position as fast as possible increases the manufacturing cost.
An object of the present invention is to enable many electronic components to be mounted accurately in a short time.
[0004]
[Means for Solving the Problems]
The invention of the electronic component mounting method includes an XY axis indicating a position on a mounting surface on which an electronic component is mounted, a Z axis indicating a height position perpendicular to the mounting surface, and a θ axis indicating an angle around the Z axis. When the electronic component is mounted based on the coordinates of the XY axis, the sucked electronic component is moved up along the Z axis, moved along the XY axis, and rotated along the θ axis. When the first signal indicating that the predetermined position range is reached and the second signal indicating that the predetermined angle range on the θ axis has been received, the electronic component is lowered along the Z axis, An electronic component that has reached the mounting position on the XY axis and the mounting angle on the θ axis while descending is mounted on the mounting surface.
[0005]
The invention of an electronic component mounting apparatus includes an XY axis indicating a position on a mounting surface on which an electronic component is mounted, a Z axis indicating a height position perpendicular to the mounting surface, and a θ axis indicating an angle around the Z axis. An electronic component mounting apparatus for mounting an electronic component based on the coordinates of the electronic component, a suction controller for sucking the electronic component, and a Z-axis controller for lifting the electronic component sucked by the suction controller along the Z axis An X-axis and Y-axis controller that moves the sucked electronic component along the XY axis, a θ-axis controller that rotates the sucked electronic component along the θ-axis, and an XY axis from the X-axis and Y-axis controller When the first signal indicating that the predetermined position range is reached and the second signal indicating that the predetermined angle range is reached on the θ axis is received from the θ axis controller, the Z axis controller is Control Control that lowers the electronic component along the Z-axis and controls the X-axis and Y-axis controllers during the lowering to mount the electronic component on the mounting surface according to the mounting position on the XY-axis and the mounting angle on the θ-axis And means.
[0006]
According to these inventions, when the adsorbed electronic component is lifted, moved, and rotated, the electronic component has reached a predetermined position range on the plane, and the electronic component has a predetermined angular range. When receiving a signal to notify that the electronic component has been reached, the electronic component is lowered, the electronic component is moved to the correct mounting position using the time during the lowering, and the correct mounting angle is obtained. Rotate until
[0007]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a diagram showing an internal structure of such an electronic component mounting apparatus. In the apparatus, there is provided a substrate transport unit 1 for transporting and positioning a printed circuit board, and a component supply in which chip components (hereinafter simply referred to as components) to be mounted on the transported printed circuit board (not shown) are stored. The part 2 is fixed to the supply part mounting base 3. Although one component supply unit 2 is shown in the figure, the number of component supply units corresponding to the type of component to be mounted is actually attached. The components are vacuum-sucked by a suction nozzle 5 provided at the lower part of the suction head 4. For this reason, an XY robot 6 for moving the suction head 4 in the horizontal direction is provided, and although not shown in the drawing, a vertical moving means for moving the suction head 4 in the vertical direction is provided.
[0008]
FIG. 2 is a block diagram showing a system configuration of the electronic component mounting apparatus shown in FIG. The control unit (control means) 7 controls the suction controller 8, the X-axis controller 9, the Y-axis controller 10, the Z-axis controller 11, and the θ-axis controller 12, and includes motors (not shown) corresponding to the respective axes. The suction head drive unit 13 is driven to move the suction nozzle 5. Then, the component 14 of the component supply unit 2 is transported and the component 14 is mounted on the printed circuit board 15 transported to a predetermined position by the printed circuit board transport unit 1. The control unit 7 receives an encoder pulse signal according to the rotation of the motor of each axis. The controller 7 also controls the laser alignment sensor controller 17 connected by the RS422 interface 16 to drive the laser unit 18. The laser unit 18 includes a light emitting unit 18a that emits parallel belt-shaped laser beams and a light receiving unit 18b that receives the laser beams. Therefore, when the sucked component 14 is at the position of the laser beam, a projection image of the component 14 can be obtained.
[0009]
FIG. 3 is a diagram illustrating a state in which the component 14 sucked by the suction nozzle 5 is raised to the position of the laser beam of the laser unit 18 by the Z-axis controller 11 and rotated along the θ axis around the Z axis. By this rotation, the minimum value of the projected image of the component 14 is detected, and the position and the rotation angle at that time are measured, thereby detecting the deviation of the component 14 in the X-axis direction, the Y-axis direction, and the θ-axis direction.
[0010]
Next, the electronic component mounting method according to the embodiment will be described with reference to flowcharts showing the operation of the control unit 7 shown in FIGS.
4, the Z-axis controller 11 is instructed to lower the suction head 4 along the Z-axis (step S1), and it is determined whether or not the tip of the suction nozzle 5 has reached the suction position (step S2). ). When the suction position has been reached, the lowering of the Z-axis is stopped (step S3), and the suction controller 8 is instructed to suck the component 14 (step S4).
[0011]
After the component suction, the Z-axis controller 11 is instructed to raise the Z-axis (step S5), and it is determined whether or not a height position that can be moved in the XY directions has been reached (step S6). When reaching a movable height position, XY movement is started (step S7). Next, it is determined whether or not the position of the sucked component 14 in the Z-axis direction has reached the laser beam detection area of the laser unit 18 (step S8). When the detection area is not reached, the process returns to the main flow (not shown), but when the detection area is reached, the Z-axis controller 11 is instructed to stop the Z-axis ascending (step S9).
[0012]
Next, the rotation about the θ axis is instructed to the θ axis controller 12 (step S10). Next, in FIG. 5, the XY impo that is the first signal indicating that the predetermined position range on the XY axis has been reached is received from the X axis controller 9 and the Y axis controller 10, or from the θ axis controller 12. It is determined whether or not the θ impodium that is the second signal indicating that the predetermined angle range on the θ axis has been reached (step S11). If none of the imposes are received, the process returns to the main flow, but if the XY impose is received, the XY flag is set to 1 (step S12). Next, a predetermined numerical value m is set in the counter register C1 (step S13). This m is the number of pulses that the control unit 7 receives from the X-axis controller 9 and the Y-axis controller 10 from when the XY imposi is received until it reaches the correct position for actual mounting. Next, the C1 pulse interrupt is canceled (step S14). By releasing the pulse interrupt, the value of C1 is decremented every time a pulse signal is interrupted from the X-axis controller 9 and the Y-axis controller 10, as shown in FIG. Then, it is determined whether or not the θ flag is 1 (step S15). When this flag is 0, the reception of θ imposi is waited in step S11.
[0013]
In step S11, when θ impo is received, 1 is set in the θ flag (step S16). Next, a predetermined numerical value n is set in the counter register C2 (step S17). This n is the number of pulses that the control unit 7 receives from the θ-axis controller 12 during the period from when the θ imposure is received until the correct mounting angle is reached. Next, the C2 pulse interrupt is canceled (step S18). By releasing the pulse interrupt, the value of C2 is decremented every time there is an interrupt of the pulse signal from the θ-axis controller 12, as shown in FIG. 6B. Then, it is determined whether or not the XY flag is 1 (step S19), and when this flag is 0, reception of XY imposi is waited for in step S11.
[0014]
If the θ flag is 1 in step S15, or if the XY flag is 1 in step S19, the Z-axis controller 11 is instructed to lower the Z-axis (step S20). Then, it is determined whether or not the counter register C1 has become 0 (step S21), and when C1 has not become 0, the process returns to the main flow. When C1 becomes 0, the X-axis controller 9 and the Y-axis controller 10 are controlled to stop the XY movement (step S22). Further, it is determined whether or not C2 has become 0 (step S23), and when C2 has not become 0, the process returns to the main flow. When C2 becomes 0, the θ-axis controller 12 is controlled to stop component rotation around the θ-axis (step S24).
[0015]
Next, it is determined whether or not the adsorbed component has reached the mounting surface of the printed board (step S25). When this position is reached, the Z-axis controller 11 is instructed to stop the lowering of the Z-axis (step S26). After the descent stop, parts are mounted (step S27) and the process returns to the main flow.
[0016]
As described above, in the above embodiment, when the component 14 sucked by the suction nozzle 5 is lifted, moved, and rotated, the component 14 has reached a predetermined position range on the plane, and the component. When receiving an impo informing that 14 has reached a predetermined angle range, the component 14 is lowered, and the component 14 is moved to an accurate mounting position using the time during the descent. And it rotates until it reaches the correct mounting angle. Then, the component 14 is mounted on the printed board. Therefore, the mounting time of one component can be shortened compared with the case where the component 14 is lowered after being set to an accurate mounting position and mounting angle. As a result, many parts can be mounted accurately in a short time.
[0017]
In the above embodiment, the case where one component is mounted has been described. However, the present invention can be applied to a case where a plurality of components are mounted by a plurality of suction nozzles. In this case, the time from component adsorption to component mounting can be further shortened.
[0018]
【The invention's effect】
According to the present invention, when the sucked electronic component is lifted, moved, and rotated, the electronic component has reached a predetermined position range on the plane, and the electronic component is within a predetermined angular range. When receiving a signal to notify that the electronic component has been reached, the electronic component is lowered, the electronic component is moved to the correct mounting position using the time during the lowering, and the correct mounting angle is set. Rotate until Therefore, the mounting time of one electronic component can be shortened as compared with a case where the electronic component is lowered after being set to an accurate mounting position and mounting angle. As a result, many electronic components can be mounted accurately in a short time.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an internal structure of an electronic component mounting apparatus according to an embodiment.
2 is a block diagram showing a system configuration of the electronic component mounting apparatus in FIG. 1;
FIG. 3 is an enlarged perspective view of an adsorption nozzle and a laser unit that adsorb components.
FIG. 4 is a flowchart showing an operation of component mounting in a control unit.
FIG. 5 is a flowchart showing the component mounting operation following FIG. 4;
FIG. 6 is an interrupt flowchart.
[Explanation of symbols]
4 Suction head 5 Suction nozzle 7 Control unit 8 Suction controller 9 X-axis controller 10 Y-axis controller 11 Z-axis controller 12 θ-axis controller 13 Suction head drive unit 14 Parts

Claims (4)

An electronic component based on coordinates on an XY axis indicating a position on a mounting surface on which the electronic component is mounted, a Z axis indicating a height position perpendicular to the mounting surface, and a θ axis indicating an angle around the Z axis When the sucked electronic component is lifted along the Z axis, moved along the XY axis, and rotated along the θ axis, a predetermined position on the XY axis. When receiving the first signal indicating that the range has been reached and the second signal indicating that the predetermined angle range on the θ-axis has been reached, the electronic component is lowered along the Z-axis An electronic component mounting method comprising mounting the electronic component that has reached a mounting position on the XY axis and a mounting angle on the θ axis. Stops movement along the XY axis when it has moved a predetermined distance after receiving the first signal, and the θ axis when rotated by a predetermined angle after receiving the second signal 2. The electronic component mounting method according to claim 1, wherein the rotation along the axis is stopped. An electronic component based on coordinates on an XY axis indicating a position on a mounting surface on which the electronic component is mounted, a Z axis indicating a height position perpendicular to the mounting surface, and a θ axis indicating an angle around the Z axis An electronic component mounting apparatus for mounting
A suction controller that picks up electronic components;
A Z-axis controller that lifts the electronic component sucked by the suction controller along the Z-axis;
An X-axis and Y-axis controller for moving the sucked electronic component along the XY axis;
A θ-axis controller that rotates the sucked electronic component along the θ-axis;
A first signal indicating that a predetermined position range on the XY axis has been reached from the X axis and Y axis controllers, and a second signal indicating that a predetermined angle range on the θ axis has been reached from the θ axis controller. When the signal is received, the Z-axis controller is controlled to lower the electronic component along the Z-axis, and during the lowering, the X-axis and Y-axis controllers are controlled to mount on the XY axis. Control means for mounting the electronic component on the mounting surface according to the position and the mounting angle on the θ-axis;
An electronic component mounting apparatus comprising: The control means stops the movement along the XY axes by the X-axis and Y-axis controllers when it moves by a predetermined distance after receiving the first signal, and receives the second signal 4. The electronic component mounting apparatus according to claim 3, wherein the rotation along the θ-axis by the θ-axis controller is stopped when it is rotated by a predetermined angle later.

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