JPH0682898U - Electronic component automatic mounting device - Google Patents

Abstract

(57) [Abstract] [Purpose] When electronic components are taken out before detection of a defect in each unit board of a multi-layer board, even if the first unit board is defective, the loss of parts is reduced. [Configuration] The CPU (25) is a defective mark detection device (1
When 9) detects that the defect identification mark (22) of the unit board (A) is defective, the chip component (4) which has already been taken in is the same type in the unit board (B) which is another unit board. The step number for mounting the component is searched from the NC data, and if a component of the same type is present, the chip component (4) already attached to the mounting position of the step number is mounted.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention is an electronic component automatic mounting device for picking up electronic components from a component supply device by a plurality of suction heads provided around the periphery of a rotary table and mounting the electronic components on a printed circuit board mounted on a horizontal moving table as the rotary table rotates. Regarding

[0002]

[Prior art]

 In this type of automatic electronic component mounting apparatus, as disclosed in Japanese Patent Laid-Open No. 109699/1998, a mark indicating whether or not the unit board corresponding to each unit board of a multi-faced board composed of a plurality of unit boards is defective. Is detected by the detection device, and electronic components are not attached to defective unit boards.

Further, in this type of device, the electronic components to be mounted on the printed circuit board are attracted by the XY table after the printed circuit board on which the component mounting is completed is discharged from the XY table and is conveyed by the supply conveyor. -When the board is placed on the XY table and positioned so that the multiple suction heads provided on the rotary table start to pick up electronic components until the board is placed on the table. We do not take time to start mounting parts.

However, when the unit board on which components are mounted at the beginning of the multi-sided circuit board is defective and should not be mounted, the unit board is already mounted on the unit board before the mark indicating this is detected. Some of the necessary parts were taken out, and when the detection device detected a defect, the electronic parts that had already been adsorbed could not be mounted and were discharged at the discharge station, resulting in a loss of parts.

[0005]

[Problems to be solved by the device]

 Therefore, an object of the present invention is to reduce the loss of parts even when the first unit board is defective when an electronic component is taken out before detecting the failure of each unit board of the multi-layer board.

[0006]

[Means for Solving the Problems]

 Therefore, in an electronic component automatic mounting device that picks up electronic components from a component supply device by a plurality of suction heads provided on the periphery of a rotary table and mounts them on a printed circuit board mounted on a horizontal moving table as the rotary table rotates. , A detection device for detecting whether or not components may be mounted on each unit board of a printed circuit board having a plurality of unit boards, and a component mounting on the unit board where the detection device should first mount electronic components. When it is determined that the electronic component already adsorbed by the adsorption head can be mounted on another unit board when it is detected that the electronic component must not be mounted, A control means for controlling mounting of the electronic component on a mountable unit board is provided.

[0007]

[Action]

 When the detection device detects that the detector should not mount the component on the unit board where the electronic component should be mounted first, the electronic component already adsorbed by the suction head can be mounted on another unit substrate. Whether the electronic component is mountable is determined by the control means when the determination means determines that the electronic component can be mounted.

[0008]

【Example】

 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 2 and 3, (1) is an XY table as a horizontal moving table which moves in the XY directions by the rotation of the X-axis motor (2) and the Y-axis motor (3). A printed board (5) on which a component (hereinafter referred to as a chip component or a component) (4) is mounted is placed.

Reference numeral (6) is a supply table, and a large number of component supply devices (7) for supplying the chip components (4) are arranged. Reference numeral (8) is a supply table driving motor, and by rotating the ball screw (9), a supply table is inserted through a nut (not shown) fitted to the ball screw (9) and fixed to the supply table (6). (6) is guided by the linear guide (10) and moves.

(11) is a rotary table that rotates intermittently, and a mounting head (13) having four suction nozzles (12) is arranged on the outer edge of the table (11) at equal intervals according to the intermittent pitch. It is set up. The suction nozzle (12) lowers the component (4) from the supply device (7) and sucks and picks it up. Stop position of the mounting head (13) (position of the hour hand at 12 o'clock on the rotary table (11) in FIG. 3). Is a suction station, and the suction nozzle (12) located at the outermost side of the rotary table (11) sucks the component (4) at the suction station.

The position where the mounting head (13) stops next to the suction station is the recognition station, and the component recognition camera (14) recognizes the displacement of the chip component (4). The position where the mounting head (13) stops next is the angle correction station, and the suction nozzle (12) drives the nozzle rotation roller (16) described later based on the recognition result by the recognition camera (14). It is rotated in the θ direction by (15) and the positional deviation of the rotation angle of the component (4) is corrected.

The position where the mounting head (13) stops next (the 6 o'clock position on the rotary table (11) in FIG. 3) is the mounting station, and it depends on the lowering of the mounting head (13). As the suction nozzle (12) descends, the chip component (4) is mounted on the printed board (5) on the XY table (1). The next station after the mounting station is the parts discharging station. If necessary, the chip parts (4) sucked by the suction nozzles (12) that were not mounted in the mounting station are discharged to the discharge box ( It is discharged to 17).

(18) is a base, and the XY table (1) moves XY with respect to the base (18), but (19) is a defective mark detection device, The defective identification mark (22) described later attached to the printed board (5) mounted on the XY table (1) and fixed to the support plate (20) fixed to (18) is identified. The detection device is a photosensor and detects a difference in lightness or shade of the mark (22). The inspection device (19) may use an imaging camera.

The printed board (5) is divided into two parts, a unit board (A) and a unit board (B), as shown in FIG. 4, and these two parts are provided as shown in NC data of FIG. 6 described later. The unit boards have different component mounting patterns. The defect identification mark (22) is attached to each unit board and is a mark indicating whether each unit board is defective, that is, whether the electronic component (4) can be mounted. For example, when the black mark (22) is painted black, the unit substrate is defective. In FIG. 4, the hatched mark (22) on the unit substrate (A) indicates a defect, and the mark (22) on the unit substrate (B) indicates a non-defective product. There are various types of so-called multi-chambered boards divided into several unit boards in this way, depending on the method of forming the component mounting pattern for each unit board, such as a plurality of unit boards of the same component mounting pattern or the same pattern. In some cases, a unit identification board (22) is provided for each unit board. ing.

Reference numeral (23) is a supply conveyor that conveys the printed circuit board (5) and supplies it onto the XY table (1), and (24) is a discharge conveyor that discharges the printed circuit board (5) on which components have been mounted. Is. Next, the control block of this embodiment shown in FIG. 5 will be described. In FIG. 4, reference numeral (25) is a CPU, and based on various data stored in the RAM (26) and signals from the defective mark detection device (19), according to a program stored in the R0M (28). It controls various operations related to the mounting operation of the chip component (4) on the printed circuit board (5) of the electronic component automatic mounting apparatus.

A drive circuit (31) and the detection device (19) are connected to the CPU (25) via an interface (30). An X-axis motor (2), a Y-axis motor (3), a supply base drive motor (8) and a nozzle rotation motor (16) are connected. The RAM (28) stores NC data indicating the mounting order of the components for each type of the printed circuit board (5), but the NC data of the printed circuit board (5) shown in FIG. 4) Mounting position (X coordinate data, Y coordinate data) on the printed circuit board (5) for each step number indicating the mounting sequence, mounting angle data (θ angle) indicating the mounting direction, and chip component (4) to be taken out. The component type of is stored. The component mounting pattern of the unit board (A) is composed of step numbers "1" to "10", and the unit board of which the step number is "E" is displayed in the control command column is "1". Indicates the end. The unit board (B) has step numbers “11” to “18”, and the end of all step numbers of NC data is indicated by “Z” in the control command column.

Further, as will be described later, the RAM (26) is defective in the first unit substrate on which the chip component (4) that has been adsorbed by the time when it is detected by the detection device (19) is mounted. There is a step number that can be mounted on the unit board of, and a mounted step memory that stores the step number when mounting is provided, and the component adsorption and mounting operation of the already mounted step number is not performed. I am trying. The mounted step memory is cleared every time the component mounting on one board (5) is completed.

Furthermore, when the pre-prepared chip component (4) is mounted in the RAM (26) but the first unit board to be mounted is defective but cannot be mounted on another unit board, it is mounted on the next board. A next substrate use memory is provided for storing the step number for loading. The operation will be described below with the above configuration. First, the printed circuit board (5) is transported from the upstream device (device for applying adhesive) by the supply conveyor (23), transferred onto the XY table (1), and transferred to the table by a positioning device (not shown). It is positioned and fixed at the predetermined position of (1). The rotary table (11) intermittently rotates while the print substrate (5) is being conveyed, and the suction nozzle (12) provided on the mounting head (13) indicates the step number of the NC data in FIG. The suction operation of the chip component (4) is started from "1". The timing of this start may be immediately after all the parts have been mounted on the board (4), or it may be synchronized with the operation of discharging the board from the XY table (1), and then the parts are mounted. The substrate (4) to be transferred may be detected by a sensor (not shown) before being transferred to the XY table (1), or it may be transferred from the supply conveyor (23) to the XY table (1). Alternatively, it may be started by the signal of the instruction.

Next, the XY table (1) on which the printed circuit board (5) is placed moves in the XY directions, and the defect identification mark (22) is detected. That is, the X-axis motor (2) and the Y-axis motor (3) are driven and rotated by the drive circuit (31) under the control of the CPU (25), and the XY table (1) is identified as a defect of the unit board (A). The mark (22) is moved so as to be located below the defective mark detecting device (19). Based on the signal detected by the detection device (19), the CPU (25) determines that the unit board (A) is defective and that components should not be mounted.

Next, the XY table (1) is moved so that the defect identification mark (22) of the unit board (B) is located below the detection device (19), and the mark (22) is detected. The CPU (25) determines that the unit board (B) is non-defective. The component suction operation that has already been performed will be described. The suction head (13) moves to the suction station and the suction nozzle (12) descends to rotate the motor (8) based on the component type in the order of step numbers in the NC data stored in the RAM (26). Thus, the component supply device (7) for supplying the desired component (5) is positioned at the suction position and the chip component (4) is taken out.

Next, the suction nozzle (12) that suction-holds the chip component (4) moves to each work station by intermittent rotation of the rotary table (11) and the camera is used in the recognition station. The position shift of the component (5) with respect to the suction nozzle (12) is recognized by (14), and in the angle correction station, the angle of the component (4) is rotated by the rotation of the nozzle rotation roller (15) based on the recognition result. Although the correction is performed and the mounting station is reached, if the positioning of the printed circuit board (5) on the XY table (1) is not completed by this time, the rotary table (11) is kept in this state. Is stopped, and the suction nozzle (12) is on standby at each station.

Next, when the detection is completed, the CPU (25) judges whether or not the adsorbed component (4) can be mounted according to the flowchart of FIG. 1, and after the judgment is completed, the component mounting operation is started based on this judgment. To do. The judgment of the CPU (25) according to the flowchart of FIG. 1 and the component mounting operation based on the judgment will be described for each head (13).

First, since the defective identification mark (22) is identified as described above and it is found that the unit substrate (A) cannot be mounted, the chip component (4) to be adsorbed from now on is the step of NC data. It is decided to adsorb the one from the number "11". Next, the CPU (25) can already mount the substrate (5) currently mounted on the XY table (1) for the chip component (4) attracted by each head (13). Look for a step number that can be mounted on another unit board (B).

That is, the CPU (25) sucks the component type “R1” of the step number “1” by the suction nozzle (12) of the mounting station, but the step number “13” of the unit board (B). , It is determined that the same type of chip component (4) can be mounted, and it is determined that the chip component (4) should be mounted at the position of the step number. To store. Next, the CPU (25) judges that the chip component (4) of the step number "1" has been corrected in the angle θ in the angle correction station and confirms whether it needs to be corrected again. However, in the NC data, it is determined that the θ angle data is different between the step number “1” and the step number “13”, and it is decided to incorporate it into the θ correction sequence again.

According to this judgment, in the mounting station, the suction nozzle (12) does not descend and component mounting is not performed, and the chip component (4) is sucked by the nozzle (12) and remains on the rotary table (11). When it makes one revolution by intermittent rotation and is again θ swung by the angle correction station to perform angular positioning at the 90-degree angular position indicated by step number "13", and when the mounting station is reached by the next intermittent rotation. The XY table (1) is moved so that the position of the recognition result in the already performed recognition station is corrected to the mounting position (X11, Y11) of step number "13", and the suction nozzle (12 ), The chip component (4) is mounted on the printed circuit board (5).

Next, the chip part (4) of step number “2” is waiting in the angle correction station, but the CPU (25) can be mounted in step number “12”. It is determined that the θ angle has been corrected, but since the θ angle is the same, it is decided to mount it as it is, and the step number “12” is stored in the mounted step memory. That is, according to this determination, when the suction nozzle (12) for sucking the chip component (4) with the step number "2" by the rotation of the rotary table (11) reaches the mounting station, the XY table (1). The chip component (4) is mounted at the mounting position of step number "12" by the movement of.

Next, the CPU (25) waits for the chip component (4) with the step number “3” at the recognition station, but the component type is “R3” and the chip component (4) is mounted with the step number “17”. It is possible to wear it, but since θ correction has not been completed yet, and θ angle data is different, it is decided to install at the position of step number “17” after θ correction, and the step number “17” is stored in the installed step memory. Is memorized.

That is, according to this judgment, the rotary table (11) is rotated to be corrected and rotated to the 0 ° of the step number “17” in the next angle correction station, and to the next attachment station. (X17, Y17) position. Next, the part (4) with the step number "4" stands by at the station next to the suction station, but the CPU (25) searches for each step number of the NC data and finds the same part. Since there is no product type, it is judged to be discharged when the productivity-oriented mode is selected.

That is, when the rotary table (11) is rotated, the component (4) does not perform the mounting operation even when it reaches the mounting station through each station, and when the discharging station reaches the discharging station. The part (4) is discharged into the box (17). When the productivity-oriented mode is not selected, the head (13) is skipped during the production of the current board (5) and the step number is stored in the next board use memory in the RAM (26). The suction nozzle (12) mounts the component (4) on the next substrate (5) while the component (4) is still sucked.

In this way, the components of the suction nozzle (12) that have been pre-prepared and waiting are mounted and the components are discharged, but the component (4) of the unit substrate (A) that has already been suctioned is processed. Is determined by the CPU (25), the suction nozzle (12) of the next mounting head (13) that has not yet picked up the component picks up the component of step number "11" of the unit board (B).

Next, since the next suction nozzle (12) has the step numbers “12” and “13” stored in the installed step memory, these steps are skipped and the component of the component type designated by the step number “14” is skipped. Adsorb (4). In this way, recognition and angle correction are performed in the same manner as described above, and the component (4) is mounted at the designated position on the printed circuit board (5).

In this way, when component mounting is completed for the unit board (B), the mounted step memory is cleared, the board (5) is discharged by the discharge conveyor (24), and the next board (5) is supplied. It is supplied onto the XY table (1) by the conveyor (23). If the mounting head (13) has not yet reached the mounting station when the defective identification mark (22) is detected, the mounting head (13) is stopped at the station where it has reached, and in that state the flowchart of FIG. You can make a decision according to the above, and if the time required for the decision is short, you can make a decision without stopping and deal with it.

Further, in this embodiment, when the unit board on which the pre-prepared component is to be mounted is defective and the unit board can be mounted on another unit board, if the θ swing is not performed, the θ swing is set to another unit. If the unit is mounted in the next mounting station and the θ swing is completed and it cannot be mounted on another unit substrate at that θ angle, rotate the rotary table (11) once. The components were mounted after re-tapping again, but instead of mounting them immediately like this, components were mounted according to the step number in the NC data, and when the corresponding step number was reached, the component to be adsorbed was printed on the board. It may be attached to (5). Also in this case, it is necessary to store the step number where the pre-prepared component is to be mounted in the memory so that the component suction operation of the step number is not performed.

Further, as in the present embodiment, the components are not mounted on the other unit substrate only when the components are not re-launched or the components are not re-launched or the angles of the same are the same. The parts may be discharged. Further, in this embodiment, the component suction operation is started before the defect identification mark (22) is detected, and in the mounting station, the suction nozzle (12) waits with the component (4) sucked. However, it is possible to wait until the end of detection in the state immediately before the angle correction station or in the state where the angle correction is not performed in the angle correction station. If they are the same, even if the θ angle data is different, the θ angle positioning can be performed according to the data and the device can be mounted at the mounting position of another step number.

In the present embodiment, the first unit board (A) and the next unit board (B) have different component mounting patterns, but the first unit board and the next unit substrate have the same component mounting pattern. Even if it is a pattern, it is possible to mount the component (4) that is still adsorbed to the next unit board according to the flowchart of FIG. 1, but in this case, the first unit board The step number may not be attached, and the unit board may be controlled to be attached from the beginning of the step number. Furthermore, the component mounting pattern of the first unit board differs from the component mounting pattern of the next unit board, but if there is another component mounting pattern of the first unit board, the same component mounting pattern has already been sucked. You may make it equip with a component.

Further, in the case of the board (4) having the defect identification mark, the components of the board may not be sucked until the detection of the mark is completed.

[0037]

[Effect of device]

 As described above, according to the present invention, when the component cannot be mounted on the first unit board, if the component already adsorbed on the other unit board can be mounted on the other unit board, the component loss is reduced.

[Brief description of drawings]

FIG. 1 is a diagram showing a flow chart of the present invention.

FIG. 2 is a perspective view of an electronic component automatic mounting device to which the present invention is applied.

FIG. 3 is a plan view of an electronic component automatic mounting device to which the present invention is applied.

FIG. 4 is a plan view of a printed circuit board.

FIG. 5 is a control block diagram of the present invention.

FIG. 6 is a diagram showing NC data.

[Explanation of symbols]

 (1) XY table (horizontal moving table) (4) Chip-shaped electronic component (electronic component) (5) Printed circuit board (7) Component supply device (11) Rotary table (13) Mounting head (suction head) (19) ) Defect mark detection device (detection device) (25) CPU (judgment means) (control means) (A) unit substrate (B) unit substrate

Claims (1)

[Scope of utility model registration request] 1. An electronic component automatic mounting device for picking up an electronic component from a component supply device by a plurality of suction heads provided on the periphery of a rotary table and mounting the electronic component on a printed circuit board mounted on a horizontal moving table as the rotary table rotates. In the above, a detection device for detecting whether or not components may be mounted on each unit board of a printed circuit board having a plurality of unit boards, and a component mounting on the unit board where the detection device should first mount electronic components. Determining means for determining whether or not the electronic component already adsorbed to the adsorption head can be mounted on another unit substrate when it is detected that the electronic head must not be mounted; An electronic component automatic mounting apparatus comprising a control means for controlling mounting of electronic components on a mountable unit substrate.