JP3128403B2 - Component mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting device for sequentially mounting chip-shaped electronic components on a printed circuit board mounted on an XY table.

[0002]

2. Description of the Related Art A component mounting apparatus of this type is disclosed in Japanese Patent Application Laid-Open No. 3-145198 filed by the present applicant. However, in the case of a component that easily rolls, such as a cylindrical component, after the component is mounted on the board, the component rolls due to the moving acceleration of the movement of the XY table when the subsequent component is moved to the mounting position on the board. There was that.

In addition, when such a component that easily rolls is mounted, a method has been devised in which the moving acceleration of the substrate at the time of mounting the next component is performed at a low speed. In this case, both the direction in which rolling is difficult to roll and the direction in which rolling is easy depending on the mounting angle of the cylindrical component to the substrate are moved at a low speed (at the same speed).
It took time to move to the next component mounting position.

[0004]

SUMMARY OF THE INVENTION Accordingly, the present invention relates to a method for mounting a rollable component such as a cylindrical component on a substrate when the table is moved to the next component mounting position after the component is mounted on the substrate. In consideration of the mounting angle of the cylindrical part, the table is moved at high speed when moving the part in the direction in which it is difficult to roll, and at low speed when moving in the direction in which the part is easy to roll, so that the table moving time is reduced. The purpose is to measure.

[0005]

SUMMARY OF THE INVENTION Accordingly, the present invention provides a component mounting apparatus for sequentially mounting chip-shaped electronic components on a printed circuit board mounted on an XY table. A storage device for storing data relating to mounting such as a mounting position and a mounting angle, and a cylindrical component which is easy to roll based on the mounting angle data stored in the storage device after the next component is mounted on the substrate. X of the XY table to the mounting position of the component based on the mounting position data
A calculating device for calculating a moving acceleration in the X direction and the Y direction from the mounting angle data of the cylindrical component already mounted on the substrate during the Y movement, and a moving acceleration in the X direction and the Y direction calculated by the calculating device. And a control device for moving the XY table based on the XY table.

Further, the present invention relates to a component mounting apparatus for sequentially mounting chip-shaped electronic components on a printed circuit board mounted on an XY table. A first storage device for storing data relating to the mounting of the component, etc., and the XY table to the mounting position of the next component based on the mounting position data of the next component after the rollable cylindrical component is mounted on the board. X direction and Y for each mounting angle of the cylindrical part during XY movement
A second storage device for storing moving acceleration data in the direction;
A control device for moving the XY table based on the movement acceleration data in the X and Y directions stored in the second storage device when the XY table is moved after the cylindrical component is mounted; It is a thing.

[0007]

With the above arrangement, the components are mounted on the board based on the mounting data such as the mounting position and the mounting angle on the board stored in each step indicating the mounting order in the storage device. Next, when moving to the mounting position of the component after the easily rolled cylindrical component is mounted, the following calculation is performed based on the mounting angle data of the component mounted on the board stored in the storage device by the calculation device. The movement acceleration in the X and Y directions to the component mounting position is calculated. When moving the XY table to the next component mounting position, the control device moves the table based on the accelerations in the X and Y directions calculated by the calculation device.

Further, components are mounted on the board based on mounting data such as a mounting position and a mounting angle on the board stored in the first storage device for each step indicating the mounting order. Next, when the component is moved to the mounting position after the easily rolled cylindrical component is mounted, X to the mounting angle of the component mounted on the substrate stored in the second storage device is set.
The table is moved based on the movement acceleration data in the direction and the Y direction.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings. 2 and 3, (1) is an XY table that is moved in the X and Y directions by driving the X-axis servo motor (2) and the Y-axis servo motor (3). A printed circuit board (5) on which a chip component (4) is mounted is placed.

In (6), a plurality of component supply units (7) for supplying chip components (4) of the same type are detachably provided at equal intervals to supply a large number of chip components (4). Component supply unit as a component supply unit
By the rotation of the ball screw (9) driven by the component supply servo motor (8), the ball screw (9) is guided by the guide (10) to
Is moved in the left-right direction (side-by-side direction).

(11) A suction head section (1) provided with a plurality of suction nozzles (12) on its lower surface for taking out and transporting the chip component (4) from the component supply unit (7).
3) is a rotary table that is installed on the periphery of many
The rotary servomotor (14) shown in FIG. 1 is intermittently rotated via an index unit (not shown). The suction head section (13) is provided corresponding to the intermittent rotation pitch.

(I) is a suction station for taking out the chip component (4) from the component supply unit (7), and a component presence / absence detecting device () for detecting whether or not the suction nozzle (12) sucks the chip component (4). 15) is provided. The component presence / absence detection device (15) is, for example, a nozzle (1).
When the chip component (4) is normally sucked in 2), the presence or absence of the component is detected by the fact that light from a projector (not shown) is reflected by the component (4) and not received by the light receiver. The position of the detection device (15) is changeable according to various components (4). Further, a reflection type detection device may be used. In this case, the light reflected by the component (4) is received by the light receiver to detect the presence of the component.

(II) is a recognition station for picking up an image of the state of the chip component (4) sucked by the suction nozzle (12) by a recognition device (16) composed of a CCD camera and recognizing it. (III) is a nozzle rotation correction station for performing rotation correction on the chip component (4), and based on the recognition result of the recognition device (16), the first nozzle such that the angle of the component (4) becomes the mounting angle. The rotation of the nozzle (12) is corrected by the rotation device (16).

(IV) A so-called part standing abnormality detecting device (such as a part standing abnormality in which the chip part (4) after the operation at the nozzle rotation correcting station (III) is standing and sucked while standing on the nozzle (12)). This is a component standing detection station which is detected by (19). The part standing detection device (19)
Has a structure equivalent to that of the component presence / absence detection device (15), and a reflection type detection device may be used similarly.

(V) is a mounting station for mounting the chip component (4) on the printed circuit board (5). (VI)
Is a nozzle component (12) in a state where it is detected as a result of recognition by the recognition device (16), for example, a chip component (4) that is determined to be abnormally recognized, or a component standing detection device (19) that is detected as being stuck upright. Parts adsorbed on the surface (4)
Is a discharge station for discharging the wastewater.

(VII) is the adsorption station (I)
Suction nozzle (1) corresponding to the chip component (4)
At a nozzle selection station for selecting 2), a gear (not shown) provided on an outer diameter portion of the suction head portion (13) is moved by a drive system (not shown) and engaged with the gear, and then rotated. The desired suction nozzle (12) is selected by the rotation of the drive gear (18) by the rotation of the drive gear servomotor.

(VIII) is a nozzle origin positioning station. (28) is a second nozzle rotating device. FIG. 3 (25) shows a supply conveyor for transporting the printed circuit board (5) to the XY table (1), and (26) shows the supply board (5) on the XY table (1). It is a discharge conveyor for discharging.

In FIG. 1, (20) is a CPU (21)
And a component presence detection device (15), a recognition device (16), and a component standing detection device (1).
9) is connected. (22) is R as a storage device
In the AM, NC data relating to the component mounting operation shown in FIG. 4, data relating to the component type corresponding to the reel number where each supply unit (7) shown in FIG. 5 is installed, and each component type (component ID) shown in FIG. 6 and FIG. Each part data and the like are stored. (23) is a ROM for storing a program related to the component mounting operation.

The data stored in the RAM (22) will be described. As shown in FIG. 4, the NC data includes the mounting position (X coordinate data, Y coordinate data) on the printed circuit board (5) and the mounting angle indicating the mounting direction for each step number indicating the mounting order of the component (4). Data (θ angle)
And a reel number indicating the number of the mounting position on the supply table (6) of the component supply unit (7) for supplying the chip component (4) to be taken out. In the case of the present embodiment, the reel numbers are assigned in order from the left side of FIG. The control command "E" indicates the end of the step.

As shown in FIG. 5, the data relating to the component type corresponding to the reel number is data in which a component ID indicating the component type supplied from the supply unit (7) installed at that position is stored for each reel number. In this embodiment, the NC data of FIG. 4 and the data on the component type corresponding to the reel number are stored as a set in the RAM (22) as data for mounting components on a predetermined type of board (5).

As shown in FIG. 6 and FIG. 7, the part data includes, for example, a part size (X direction, Y direction) and shape for each part (4), the number of a nozzle used to suck the part (4), and the part. When the XY table is moved after (4) is mounted, data on the ratio of the moving acceleration (X direction, Y direction) to the reference maximum moving acceleration stored in the RAM (22) in advance is stored in the RAM (22). ) Is stored. FIG. 8 shows acceleration / deceleration patterns at the time of movement of the XY table (1) at the reference maximum movement acceleration.

The operation will be described below. First, the printed circuit board (5) is transported to the supply conveyor (25) and
It is placed on a table (1). The component supply table (6) is moved by the drive of the component supply unit servomotor (8), and N
The component supply unit (7) with the reel number "1" of the step number "1" of the C data is on standby at the component suction position of the suction station (I). With the rotation of the rotary table (11), the nozzle (12) which moves to the component pick-up position of the suction station (I) next moves at the nozzle selection station (VII) by the rotation of the drive gear (18) at the suction head. The part (13) is rotated, and the data of the component type corresponding to the reel number shown in FIG.
2)) is selected, and the suction nozzle (12) is lowered by the lowering of the suction head (13), and the unit (7) is lowered.
Is taken out. The component presence / absence detection device (15) of the suction station detects the presence / absence of the component (4) of the suction nozzle (12), and hereafter, it is assumed that the chip component (4) is detected as being suctioned.

Next, the suction nozzle (12) sucking the component (4) is driven by a rotary servomotor (14) to rotate the rotary table (1) at a predetermined speed suitable for the type of component.
It moves to the recognition station (II) by the rotation of 1). In the recognition station (II), the recognition device (1) recognizes the positional deviation of the component (4) sucked by the nozzle (12) with respect to the suction nozzle (12) and the recognition of the suction state and the like.
6).

Based on the recognition result of the recognition device (16), the CPU
If (21) is determined to be defective, the part (4) is discharged at the discharge station (VI) without being mounted at the mounting station (V). Next, when the suction nozzle (12) reaches the nozzle rotation correction station by the rotation of the rotary table (11), the nozzle is set to the angle specified by the NC data based on the recognition result of the recognition device (15). The rotating device (17) rotates the nozzle (12) to perform angular positioning of the chip component (4).

Next, a component standing detection station (IV)
The component standing detection device (19) detects whether or not the component (4) is standing and sucked by the suction nozzle (12), and it is detected that the chip component (4) is normally suctioned. And When the CPU (21) determines from the detection result of the component standing detection device (19) that the component (4) is sucked while standing on the nozzle (12), the component (4) is mounted on the mounting station (V). Is discharged at the discharge station (VI) without being mounted.

Next, at the mounting station (V), the X-axis servo motor (2) and the Y-axis servo motor (3) are rotated by the lowering of the suction nozzle (12), and the designated position of the NC data (X1, Y1). The chip component (4) is mounted on the printed board (5) on which is positioned based on the angle data (0 degrees). Next, when the nozzle (12) sucking the component (4) of the step number "1" stops at the recognition station (II), the next nozzle (12)
Stops at the suction station (I), but after the part (4) having the step number "1" is sucked, the reel number "2" indicated by the step number "2" is displayed during the rotation of the rotary table (11). The parts supply unit (7) is a suction stay
The suction nozzle (12) is moved by moving the supply table (6).
To the part removal position. That is, the supply table (6) is 1
It moves by the interval of one unit (7). Thus, the suction nozzle (12) sucks the component (4) in the same manner as in the case of the step number "1" and moves to the designated position (X2, Y2) on the printed circuit board (5) in the same manner as in the case of the step number "1". 9
The part (4) is mounted at an angle of 0 degrees. At this time, the board (5) has been moved so that the designated position (X2, Y2) of the substrate (5) is located below the nozzle (12) that has sucked the component (4) by the movement of the XY table (1). During this movement, the part (4) of the part ID “A” set in the parts data shown in FIG. Was attached at an angle of 0 degrees as described above, so that the maximum acceleration was 10% in each of the X and Y directions.
It is moved at a movement acceleration (maximum acceleration) of 0%. That is,
The part (4) mounted at the step number "1" is XY
It is a component that is unlikely to be displaced by the movement of the table (1).

Next, in order to pick up the component having the step number "3", the supply table (6) moves the adjacent unit (7) having the reel number "3" to the component suction position as in the case of the step number "2". Then, the component (4) is moved by one unit, and the part (4) is mounted at a specified position (X3, Y3) on the board (5) at an angle of 180 degrees. At this time, since the component (4) is mounted at a mounting angle of 90 degrees based on the part data (see FIG. 7) of the component (4) mounted at the step number "2", the CPU (21) determines the X direction. 50% of the maximum acceleration when moving to
Of 90% of the maximum acceleration when moving in the Y direction.
The XY table (1) is moved at a rate of movement acceleration of%. That is, the part (4) having the step number "2" is a cylindrical part (4) that easily rolls. After the cylindrical part (4) is mounted, the mounting angle of the cylindrical part (4) is considered. The table (1) is moved. That is, since the mounting angle of the cylindrical part (4) is 90 degrees, the part (4) is placed on the X-axis of the board (5) via the table (1) as shown in FIG.
When the component (4) of the next step number “3” is moved to the mounting position, the component (4) is moved in the X direction so that the component (4) is not rolled. It is necessary to lower the moving acceleration of the table at the time of moving in the Y direction.

The above operation is repeated, and the chip component (4) is sucked and mounted, and the step number "40" is set.
Is completed, the control command of the NC data is "E", the end of the step number is judged, and the printed board (5) is discharged from the XY table (1) by the discharge conveyor (26), and the next step is performed. The substrate (5) is placed on the XY table (1).

Further, in this embodiment, the moving acceleration data when the XY table (1) is moved to the subsequent component mounting position in accordance with the mounting angle at the time of mounting each component (4) is previously calculated as ratio data to the maximum acceleration. However, the present invention is not limited to this. For example, the moving acceleration during the movement in the X direction and the Y direction is sequentially calculated based on the mounting angle data of the part (4), and a table ( 1) may be moved. In this case, for example, a CPU as a calculation device
(21) calculates the moving acceleration of the moving component in the X direction and the moving component in the Y direction when moving from the mounting position of the step number “2” to the mounting position of the step number “3”, respectively. At the same time, the data is stored in the RAM (22). Then, the table (1) is moved based on each moving acceleration.

The component (4) mounted on the substrate (5)
When the mounting angles are 180 and 270 degrees, 0 and 9
Use 0 degree data. Furthermore, in order to correspond to various mounting angles, ratio data for each mounting angle can be set more finely, such as 45 degrees, and the movement acceleration can be calculated when moving in the X and Y directions for each mounting angle. It is possible.
In addition, when calculating the sequential movement acceleration, if the next movement distance is shorter than the cycle time required for one attachment, the acceleration is further slower than the calculated movement acceleration (within the cycle time). The component (4) can be moved, and the component (4) can be prevented from being displaced.

Further, according to the present invention, since the movement acceleration of the XY table after the component is mounted on the board can be set for each component type, the present invention is not limited to cylindrical components, and for example, large components and heavy components It can also be applied to the case where things that are likely to shift due to the movement of the board, such as those having a high center of gravity, those having a small contact area with the board, are mounted, and after each part is mounted, The movement acceleration when the XY table moves in the X and Y directions can be adjusted.

[0032]

As described above, according to the present invention, after a component that is easy to roll such as a cylindrical component is mounted on a substrate, the table is mounted on the substrate when the table is moved to the next component mounting position. In consideration of the mounting angle of the cylindrical part, the table is moved at a high speed when moving the part in the direction in which the part is difficult to roll, and at a low speed when moving in the direction where the part is easy to roll, so the table moving time can be reduced. .

[Brief description of the drawings]

FIG. 1 is a circuit diagram of a component mounting apparatus according to the present invention.

FIG. 2 is a plan view of the mounting device.

FIG. 3 is a perspective view of the mounting device.

FIG. 4 is a diagram showing NC data.

FIG. 5 is a diagram showing data on a component type with respect to a reel number.

FIG. 6 is a diagram showing part data.

FIG. 7 is a diagram showing part data.

FIG. 8 is a diagram showing an acceleration / deceleration pattern when the XY table moves at a reference movement acceleration (maximum movement acceleration).

FIG. 9 is a diagram showing a state of a substrate on which chip components are mounted.

[Explanation of symbols]

 (1) XY table (4) Chip-shaped electronic component (5) Printed circuit board (6) Component supply table (7) Component supply unit (12) Suction nozzle (21) CPU (22) RAM

Claims (2)

(57) [Claims] In a component mounting apparatus for sequentially mounting chip-shaped electronic components on a printed circuit board mounted on an XY table, mounting such as a mounting position on a substrate and a mounting angle for each step indicating a mounting order. Storage device for storing data relating to the storage device, and a cylindrical component that easily rolls based on the mounting angle data stored in the storage device. A calculating device for calculating a moving acceleration in the X direction and the Y direction from mounting angle data of the cylindrical component already mounted on the board when the XY table moves to the mounting position in the XY direction, and an X direction calculated by the calculating device And a control device for moving the XY table based on a movement acceleration in the Y direction. 2. A component mounting apparatus for sequentially mounting chip-shaped electronic components on a printed circuit board mounted on an XY table, wherein the mounting position, mounting angle, and the like on the substrate are set for each step indicating the mounting order. And a XY movement of the XY table to a mounting position of a next component after a rollable cylindrical component is mounted on the board, based on mounting position data of the component. A second storage device for storing X- and Y-direction movement acceleration data with respect to each mounting angle of the cylindrical component at the time of movement, and a second storage device for moving the XY table after the cylindrical component is mounted.
And a controller for moving the XY table based on the movement acceleration data in the X and Y directions stored in the storage device.