JP3308228B2 - Component recognition device for surface mounter - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component recognition device provided in a surface mounter and used for detecting the position of a chip component.

[0002]

2. Description of the Related Art Conventionally, there has been known a recognition apparatus in which an image of an object picked up by an image pickup means such as a CCD camera is processed by an image processing means to detect the position of the object. See Japanese Unexamined Patent Publication No. Hei 1-240987). Such a recognition device is used, for example, in a surface mounter that mounts a chip component on a printed circuit board, for example, for correcting the mounting position based on the position detection of the chip component.

That is, the surface mounter sucks a chip component (electronic component) from a component supply unit such as a tape feeder by a component mounting head unit having a suction nozzle, and places the chip component (electronic component) on a positioned printed board. The head unit and the printed circuit board are automatically moved in the X-axis direction and the Y-axis direction, and the suction nozzle is moved. It is movable and rotatable in the Z-axis direction, and is provided with a drive mechanism for movement and rotation in each direction. In this surface mounter, the position of the chip component (center position and rotation angle) varies at the stage when the chip component is sucked by the suction nozzle. Therefore, the position of the chip component is detected, and mounting is performed based on the detected position. It is required to correct the position. for that reason,
It has been considered that the position of the chip component is detected by the component recognition device after the chip component is sucked by the suction nozzle of the head unit.

[0004]

In the above-described component recognizing apparatus, an illumination for illuminating an object to be imaged such as a chip component is usually provided at the time of imaging by the imaging means. Conventionally, the amount of light of the illumination is appropriately set according to an object to be imaged. For example, when applied to position detection of a chip component in a surface mounter, a component image having an appropriate brightness is obtained. The adjustment has only been performed to such an extent that the amount of power to the illumination power supply is set in advance so as to obtain a constant light amount.

[0005] However, the optimal brightness for imaging for component recognition varies depending on the size of the chip component, the lead interval, and the like.

In view of the above circumstances, the present invention appropriately adjusts the brightness of an image in accordance with the type of a chip component to be recognized when an image is taken by an imaging means and image processing is performed while illuminating the chip component with illumination. It is an object of the present invention to provide a component recognition device for a surface mounter that can perform the operation.

[0007]

In order to achieve the above object, the present invention comprises a head unit which sucks a component by a suction nozzle and mounts the component at a predetermined position on a substrate. Surface mounter, comprising: imaging means for imaging a component picked up, illumination for irradiating the component at the time of imaging, and image processing means for detecting a component suction position of a suction nozzle from an image captured by the imaging means. An illumination light quantity control means for changing the illumination light quantity according to the type of component;
Storage means for storing the adjustment value of
The control means depends on the type of the parts sucked by the suction nozzle.
The light of the illumination based on the adjustment value read from the storage means.
The amount is to be controlled .

According to this configuration, the amount of light is adjusted according to the type of the component so as to cope with the fact that the optimum brightness for imaging varies depending on the size of the chip component, the lead interval, and the like, and a clearer component image is obtained. It becomes possible.

In the present invention, the light amount of the illumination
Irradiating a constant object while changing
The brightness of the image of the fixed object obtained by imaging
Detects when the brightness of the image substantially matches the reference value.
Means for determining the amount of light as illumination adjustment data;
When this lighting adjustment data is stored in the storage means,
In addition, the illumination light amount control means was sucked by the suction nozzle.
Adjustment value read from the storage means according to the type of part
The illumination adjustment data read from the storage means.
The amount of light from the illumination is controlled based on the
Is preferred.

[0010]

1 and 2 show the entire structure of a surface mounter provided with a component recognition device according to an embodiment of the present invention. In these figures, on a base 1, a conveyor 2 for transporting a printed circuit board extending in the X-axis direction (transfer direction) is provided, and a printed circuit board 3 is transported on the conveyor 2, and a work station 6A, 6B is stopped at a fixed position.

On both sides of the portion where the conveyor 2 is disposed,
A component supply unit 4 is provided. The component supply unit 4 includes a plurality of rows of supply tapes 4a. Each supply tape 4a stores and holds chip-shaped chip components such as ICs, transistors, and capacitors at equal intervals, and is wound around a reel. ing. A ratchet-type feed mechanism is incorporated at the supply end of the supply tape 4a, and the head units 5A and 5B are described later.
As the chip component is picked up from the feeding end, the supply tape 4a is intermittently fed out, and the above-described pickup operation can be repeated.

Above the base 1, head units 5A and 5B for mounting components are provided, and the head units 5A and 5B and the printed circuit board 3 on the work stations 6A and 6B are relatively X-axis. In the illustrated embodiment, the work stations 6A and 6B that hold the printed circuit board 3 are movable in the Y-axis direction and the Y-axis direction (the direction orthogonal to the X-axis on the horizontal plane). The head units 5A and 5B are movable in the X-axis direction.

The structure will be described in detail. In the drawing, the head units 5A and 5B and the work units 5A and 5B are used in order to improve the processing efficiency by simultaneously mounting the two printed circuit boards 3. Station 6A,
6B are deployed two by two, and the work station 6
A and 6B are provided at two positions shifted in the X direction.
Each of the work stations 6A and 6B has a board holding device for holding the printed board 3, and can hold the printed board 3 sent from the conveyor 2 to the work stations 6A and 6B via the transfer device. It has become.

At the positions where the work stations 6A and 6B are arranged, two guide rails 8 extending in the Y-axis direction are arranged on the base 7 in parallel with each other at a predetermined interval. As a feed mechanism for
In the vicinity of one guide rail 8, a Y-axis servo motor 10
The ball screw shaft 9 which is rotationally driven by is provided. Both sides of the work stations 6A and 6B are movably supported by guide rails 7, and nut portions 11 provided in the work stations 6A and 6B are screwed to the ball screw shaft 9. With such a structure, the work stations 6A, 6B
However, it moves in the Y-axis direction as the ball screw shaft 9 rotates while holding the printed board 3.

An X-axis frame for holding the head units 5A and 5B movably in the X-axis direction is provided above the base 1. In the figure, two X-axis frames 13A and 13A are provided.
13B are parallel to each other at a predetermined interval,
It extends in the axial direction. These X-axis frames 13A, 13B
An X-axis guide 14 is formed on both upper and lower sides of the ball screw shaft, and a ball screw shaft 15 positioned between the upper and lower X-axis guides as an X-axis feed mechanism, and the ball screw shaft 15 is rotated. An X-axis servomotor 16 to be driven is provided. The head units 5A and 5B are movably supported by the X-axis guide 14, and nuts (not shown) provided on the head units 5A and 5B are screwed to the ball screw shaft 15, and the ball screw The rotation of the shaft 15 causes the head units 5A and 5B to move in the X-axis direction.

The head units 5A and 5B are provided with suction nozzles 20 for sucking chip components. In the illustrated example, each of the head units 5A and 5B is provided with 16 suction nozzles 20. As shown in detail in FIGS. 3 and 4, each of the suction nozzles 20 can move in the Z-axis direction (vertical direction) along the Z-axis guide 21 and rotate around the R-axis (nozzle center axis). The Z-axis servo motor 22 and the R-axis servo motor 23 for the suction nozzle 20 are rotated by the head unit 5.
A, 5B. Then, the suction nozzle 20 is moved up and down via the Z-axis ball screw shaft 24 by the driving of the Z-axis servo motor 22, and the R-axis servo motor 2
3 drives the R-axis ball screw shaft 25 and the R-axis rack 26
Further, the suction nozzle 20 is rotated via the R-axis pinion 27. Further, the head unit 5
A and 5B are printed on the printed circuit board 3 by detecting a mark (not shown) attached to the printed circuit board 3 in advance.
A CCD camera 28 for detecting the position of the substrate for detecting the position is mounted.

On the base 1, the head units 5A, 5A
A CCD camera 31 as an imaging means for detecting a component position is provided at a location corresponding to an appropriate position within the X-axis direction movement range of B, for example, at a location between the arrangement locations of the work stations 6A and 6B and the component supply unit 4. And a lamp house 32 for illumination during imaging.

FIG. 5 schematically shows an image processing system. In this figure, a CCD camera 31 for detecting a component position is shown.
Is connected to an image processing unit (image processing means) 33. The CCD camera 28 for detecting the substrate position provided in the head units 5A and 5B is also connected to the image processing unit 33.

The lamp house 32 is connected to a flash unit 35 via a fiber cable 34, and the flash unit 35 is connected to the image processing unit 33. The image processing unit 33 is connected to the controller 36.

FIG. 6 schematically shows the head units 5A and 5B having the suction nozzle 20 and the like, the CCD camera 31, the lamp (illumination) 37 and the illumination power supply 38, and the functions of the image processing unit 33 and the controller 36. 1 shows a typical configuration. The CCD camera 31, the lamp 37 and the illumination power supply 38 are connected to two head units 5
Two sets are provided corresponding to A and 5B. Reference numeral 39 denotes a chip component sucked by the suction nozzle 20.

In this figure, each of the CCD cameras 31
The illumination power supply 38 is connected to an image processing unit 33 via an interface 40. The image processing unit 33 includes a component position detection unit 41, an image brightness detection unit 42, and an illumination light amount control unit 43. include. During the mounting operation in which a series of operations for sucking and mounting the chip component 39 are automatically performed, the component position detecting means 41 detects the CCD camera 3 after the suction of the component by the suction nozzle 20.
The center position and the rotation angle of the chip component 39 are detected from the image of the chip component 39 captured in step 1. Further, the image brightness detecting means 42 detects the brightness of the image captured from the CCD camera 31 at the time of the illumination offset data adjustment which is performed before the component mounting operation under a predetermined condition. Illumination light amount control means 43
Controls the amount of illumination by controlling the illumination power supply 38, and changes the amount of illumination according to the type of component.

The controller 36 connected to the image processing unit 33 comprises a microcomputer or the like.
It includes a storage means 44 such as a ROM and a RAM, a command / calculation means 45, an interface 46, and various drive units such as a head unit drive unit 47, a suction nozzle drive unit 48, and a work station drive unit 49. The various sensors 50 and the suction / supply / discharge switching valve 5 for suction vacuum
1. Various servo motors 10, 16, 22, 23 and the like are electrically connected to the interface 46 and the driving units 47 to 49. Further, the keyboard 52 and the CR
T53 is connected to the controller 36.

The storage means 44 stores a sequence of a series of component mounting operations and the like and various data. The data stored in the storage unit 44 includes component data relating to various chip components, and the component data includes adjustment values (L1, L2,...) Of the illumination light amount according to the type of the component. Have been. Further, the storage means 44 stores a predetermined brightness reference value So to be used as a reference for comparing the brightness of the image in the illumination offset data adjustment processing described later, and also stores the illumination obtained by the illumination offset data adjustment processing described later. The values (I1, I2,...) Of the adjustment data (this is referred to as illumination offset data) for each component recognition device are rewritably stored.

The command / calculation means 45 executes a sequence such as the component mounting operation. The command / calculation means 45 further includes a comparison means 54 for comparing the brightness of the image of the fixed object read from the camera 31 at the time of the illumination offset data adjustment processing with the brightness reference value So, and a light quantity of the illumination. Means 55 for detecting the amount of illumination when the brightness of the image substantially matches the reference value So based on the comparison by the comparing means 54 during that time, and using the detected light quantity as offset data.

That is, in the present embodiment, the light quantity of the illumination such that the brightness of the image of the fixed object becomes the reference value So is checked and used as offset data. By taking into account the value,
The amount of illumination light for each component is determined.

A method of component recognition by such an apparatus is as follows.
This will be described with reference to the flowcharts of FIGS.

In FIG. 7, first, at step S1, the process waits until the keyboard mounting operation start switch is turned ON. When this switch is turned on, it is determined whether or not the illumination offset data does not exist (step S2), whether or not a predetermined time has elapsed since the previous adjustment (step S3), and the optical system (camera, It is determined whether or not there has been a change in lighting or the like (step S4) and step S1 described later
7. In step S20, it is determined whether or not the cumulative error number E of the image processing checked from the previous processing is greater than or equal to a predetermined number Ea (step S5). If at least one of these determinations is YES,
Routine for Lighting Offset Data Adjustment (Step S)
After 6) is performed, the process moves to step S7. When step S6 is executed, the accumulated error number is reset to zero.

If all of the steps S2 to S5 are NO, the process directly proceeds to the step S7 because the illumination offset data already exists and does not need to be changed.

Steps S7 and subsequent steps are a series of processes for automatically mounting components by a hardware device as shown in FIGS. 1 to 4. First, the initial process is performed in accordance with the printed circuit board 3 to be carried in. Then, board data indicating the number and type of chip components to be mounted is selected (step S7), and an address counter described later is cleared for initialization (step S8).
Is loaded onto the work stations 6A and 6B and positioned (step S9).

Next, by the operation of the head units 5A and 5B and the operation of the suction nozzle 20, the suction nozzle 20 is moved to the component supply section 4, and the chip component is sucked by the negative pressure supplied to each suction nozzle 20. (Step 10, S1
1). Then, based on the determination as to whether or not any other nozzles and components that can be sucked are left (step S12), if this is YES, the processes of steps S10 and S11 are repeated. When the suction of the required number of chip components is completed, the head unit is moved above the CCD camera 31 (step S13).

Turning to FIG. 8, in step S14, the illumination offset data I1 obtained and stored in the illumination offset data adjustment routine (step S6) performed previously and the type of the chip component are determined according to the type of the chip component. The illumination light amount is adjusted to I1 + Ln by the illumination light amount adjustment value Ln read from the component data.
Irradiation (flash) of illumination is sequentially performed on the suction nozzles 20 passing above the suction nozzles 2, and the suction nozzles 2
The chip component adsorbed to 0 is imaged by the camera 31,
The image is captured. The reason why the illumination light amount adjustment value Ln is determined according to the type of component is that the optimal brightness for imaging differs depending on the size of the chip component, the lead interval, and the like.

Subsequently, the position of the component is detected from the image, and the deviation from the position of the suction nozzle 20 to the position of the component is calculated based on the detected component position (step S15). As a method of detecting the component position, for example, the lead edges at both ends of the four sides of the component are obtained by operating the image, and the center position and the rotation angle of the component are calculated from these.

In step S16, it is determined whether or not the component recognition processing in steps S14 and S15 has been completed for the picked-up component.
14, S15 are repeated.

When the recognition process is completed, n
It is determined whether or not a recognition error has occurred with respect to the suction nozzle 2 (step S17).
0 is moved to the mounting position corrected by the shift amount (step S18), and the chip component is mounted at the mounting position by lowering the suction nozzle, cutting off the negative pressure supply, and the like (step S19). If it is determined in step S17 that an error has occurred, an error counter is counted up as an error process (step S20), and the number of errors is stored in the storage unit. Then, based on the determination as to whether or not the mounting (or error processing) of all the sucked components has been completed (step S21), if not completed, step S17 is performed.
To S21 are repeated.

When the mounting is completed, it is determined whether there is any component not mounted due to an error (step S2).
2) If there is a component that has not been mounted due to an error, the component is discarded (step S23), and the process returns to step S10, so that processing from component suction is performed again for the error.

If there is no component that has not been mounted due to the error, an address counter indicating the mounting address is counted up (step S24), and whether mounting of all components for one printed circuit board has been completed. It is determined whether or not the process has been completed (step S25). If the process has not been completed, the process returns to step S10, and a new process from suction is performed.

If it is determined in step S25 that the printing has been completed, the printed circuit board is unloaded (step S26).
It is determined whether or not the mounting of all the printed circuit boards has been completed (step S27). If this determination is NO, the process returns to step S7 and the subsequent processing is repeated. When the mounting of all the boards is completed, the process ends.

FIG. 9 shows a routine for adjusting the illumination offset data performed in step S6. In this routine, a certain object is imaged for measuring the brightness of the image, and in this case, a jig of a certain color may be sucked to the suction nozzle 20 of the head unit to image the same. In this case, a specific location of the head unit itself may be imaged. In such a case, the brightness of the image of the head unit, which has been checked under certain conditions, may be set as the reference value So.

In this routine, the head unit is first moved to a predetermined brightness adjustment position (step S31), and the illumination light amount control amount I10 is initially set to 0 (step S32).

Next, the head unit is imaged while emitting light with the amount of illumination light controlled to I10, and the image is captured (steps S33 and S34). continue,
The brightness at a predetermined position of the image is detected (step S3).
5) Further, the brightness Sa averaged in the screen area is obtained (step S36), and it is determined whether or not this brightness Sa is substantially equal to the reference value So (step S36).
37). If this determination is NO, the light amount control amount I1
0 is increased by a fixed amount ΔI (step S38), and it is determined whether or not the maximum value Imax has been exceeded (step S39).
Are returned to step S33 to obtain the maximum value Ima
As long as the value is equal to or less than x, the processing of steps S33 to S37 is repeated while the light amount control amount I10 is gradually increased, and a search is made for a place where the brightness Sa is substantially equal to the reference value So.

Then, in step S37, the brightness Sa
Is substantially equal to the reference value So, the light amount control amount I10 at that time is stored in the storage means 44 as the illumination offset data I1 (step S4).
0). Further, if the determination of NO is repeated in step S37 until the light amount control amount I10 reaches the maximum value Imax, it means that appropriate brightness cannot be obtained by the above adjustment due to deterioration of the lamp 37, etc. Error processing such as display indicating that 37 should be replaced is performed (step S41).

In the above flowchart, the illumination offset data is set to I1 as the processing for one of the plurality of component recognition devices provided in the surface mounter. However, the same applies to other component recognition devices. Is performed, and the illumination offset data is set to I2.

According to the surface mounter of this embodiment as described above, the suction of the chip components from the component supply unit 4 by the suction nozzles 20 of the head units 5A and 5B, the CCD camera 3
A series of operations of component position detection based on imaging and image processing at the first installation position and mounting of the chip component at the mounting position corrected based on the component position detection are automatically performed.

In the part position detection processing by the part recognizing device in this series of operations, a chip part illuminated by illumination is imaged. In this case, the illumination offset data I1 (I2) and the adjustment value Ln Adjusts the amount of illumination light. By changing the adjustment value Ln according to the type of the component, the light amount can be adjusted so as to correspond to the fact that the optimal brightness for imaging differs depending on the size of the chip component, the lead interval, and the like.

The illumination offset data I1 is
The brightness of the image of the chip component is appropriately adjusted by the adjustment by the processing in the routine of FIG. 9 described above. That is, even when the external light differs depending on the installation location of the component recognition device, or when the amount of illumination changes due to aging, the brightness of the image is reduced by the adjustment offset data adjustment routine performed under predetermined conditions. The illumination offset data I1 is adjusted so as not to cause fluctuation due to aging.

Therefore, the brightness of the image is reduced for a plurality of component recognition devices of the surface mounter or for different surface mounters while using the same component data (the adjustment value Ln). The adjustment is appropriately performed, and the component position detection by the image processing is accurately performed. Also, the accuracy of the component position detection is ensured even with aging.

The overall structure of the surface mounter is not limited to the above embodiment. For example, the printed board 3 may be positioned and stopped at the time of mounting, and the head unit may be moved in the X-axis direction and the Y-axis direction. A structure that can be used may be used.

[0048]

According to the present invention, there is provided a component recognition apparatus for picking up a component sucked by a suction nozzle of a surface mounter and detecting a component suction position of the suction nozzle from the image. Illumination light amount control means that changes the amount of light to irradiate according to the type of component
Storage means for storing the adjustment value of the amount of illumination light;
From the above storage means according to the type of the component sucked by the whirl
The light amount of the illumination is controlled based on the read adjustment value.
Since that is a earthenware pots, as optimum brightness in imaging depending on the size and lead spacing, etc. of chip components corresponding to different, it is possible to adjust the light intensity according to the type of component. Therefore, a clearer component image can be obtained, and recognition failure can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view of a surface mounter provided with a component recognition device according to an embodiment of the present invention.

FIG. 2 is a front view of a head unit arrangement portion of the surface mounter.

FIG. 3 is an enlarged front view of a head unit.

FIG. 4 is a view of the head unit as viewed from the line IV-IV in FIG. 3;

FIG. 5 is a perspective view schematically showing a head unit, an image processing device, and the like.

FIG. 6 is a block diagram illustrating a mechanical configuration of an image processing and control system.

FIG. 7 is a flowchart illustrating a specific example of a component recognition method.

FIG. 8 is a flowchart following the flowchart of FIG. 7;

FIG. 9 is a flowchart showing a routine for adjusting illumination offset data.

[Explanation of symbols]

 5A, 5B head unit 20 suction nozzle 31 CCD camera (imaging means) 33 image processing unit 36 controller 37 lamp 38 illumination power supply 43 illumination light quantity control means

Claims (2)

(57) [Claims] An image pickup means for picking up a component picked up by a suction nozzle and mounting the component at a predetermined position on a substrate; an image pickup means for picking up an image of the component picked up by the suction nozzle; In a surface mounter provided with illumination for irradiating light and image processing means for detecting a component suction position of a suction nozzle from an image taken by the imaging means, illumination for changing the light amount of the illumination according to the type of component Light intensity control means and illumination light intensity by component type
Storage means for storing the adjustment value of
The control means depends on the type of the parts sucked by the suction nozzle.
The light of the illumination based on the adjustment value read from the storage means.
A component recognition device for a surface mounter, characterized in that the amount is controlled . 2. A constant object while changing the amount of illumination light.
Obtained by illuminating the body and imaging by the imaging means
Detecting the brightness of the image of the fixed object,
The light intensity of the illumination when
Data for lighting adjustment.
The storage amount is stored in the storage unit, and the illumination light amount control is performed.
The means is based on the type of component sucked by the suction nozzle.
The adjustment value read from the storage means is read from the storage means.
Based on the added lighting adjustment data
It is characterized by controlling the amount of bright light
The component recognition device for a surface mounter according to claim 1.