CN111031782A - Multi-axis cooperative control method for optimized surface mounting of components of surface mounting machine - Google Patents
Multi-axis cooperative control method for optimized surface mounting of components of surface mounting machine Download PDFInfo
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- CN111031782A CN111031782A CN201911405011.7A CN201911405011A CN111031782A CN 111031782 A CN111031782 A CN 111031782A CN 201911405011 A CN201911405011 A CN 201911405011A CN 111031782 A CN111031782 A CN 111031782A
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- axis
- mounting
- control method
- chip mounter
- components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/0882—Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Abstract
A multi-axis cooperative control method for optimized surface mounting of components of a surface mounting machine belongs to the field of electrical engineering; the prior art has a great deal of waiting time and low mounting efficiency; the method comprises the following steps that a, a chip mounter receives a component mounting instruction; step b, disassembling the instruction into instruction information X on an X axisdAnd the instruction information Y on the Y axisdDesired angle R of R axisdAnd Z-axis expectation ZdA location; c, starting a XYR three-axis motion control state and tracking instruction information; d, acquiring a three-axis motion state of XYR, judging whether the X axis is over-adjusted to 10%, if not, re-executing the step d, and if so, executing the step e; step e, starting Z-axis motion control; f, acquiring the motion state of the Z axis, judging whether the XYRZ axis reaches the instruction designated position, if not, re-executing the step f, and if so, executing the step g(ii) a Step g, blowing by an air pump to carry out component mounting, and resetting an XYRZ axis; the problem of time waste caused by a traditional sequential control method is solved, and the mounting efficiency is improved.
Description
Technical Field
The invention belongs to the field of electrical engineering, and particularly relates to a multi-axis cooperative control method for optimized surface mounting of components of a surface mounting machine.
Background
The high-precision chip mounter technology is an important part in the electronic assembly technology and is responsible for mounting components on a printed circuit board according to the known PCB layout so as to facilitate subsequent welding and assembly. However, the technology of the domestic chip mounter is not mature, a great deal of import is relied on, and a large gap exists between the mounting speed and the mounting precision and the foreign advanced equipment. The improvement of the mounting process and the control method of the existing chip mounter is an important way for improving the chip mounting speed and the mounting precision of the chip mounter.
The control of the component mounting process of the existing chip mounter mainly adopts a mode of separating control of each axis, and each axis needing to participate in the component mounting task is independently controlled. The XYR three shafts are controlled to reach an accurate position, then the Z shaft of the mounting shaft is controlled to move to a mounting height, and then time delay blowing is carried out to finish mounting. The method has ideal control effect under the condition of not requiring high-speed mounting of the chip mounter, but the Z axis needs to start to move until the XYR three axes completely reach the accurate position by adopting the control method, and a large amount of waiting time can be generated due to the control characteristic of the motor, so that the mounting efficiency of the chip mounter is obviously influenced.
Disclosure of Invention
The invention overcomes the defects of the prior art, provides the multi-axis cooperative control method for the optimized mounting of the components of the chip mounter, performs cooperative control on all axes during the mounting of the components of the chip mounter, solves the problem of time waste caused by the traditional sequential control method, reduces the waiting time generated by the existence of the adjusting time in the control characteristic curve of the motor, and plays an important role in improving the mounting efficiency of the chip mounter.
The technical scheme of the invention is as follows:
a multi-axis cooperative control method for optimized surface mounting of components of a surface mounting machine comprises the following steps:
step a, a chip mounter receives a component mounting instruction;
step b, disassembling the instruction into instruction information X on an X axisdAnd the instruction information Y on the Y axisdDesired angle R of R axisdAnd Z-axis expectation ZdA location;
c, starting a XYR three-axis motion control state and tracking instruction information;
d, acquiring a three-axis motion state of XYR, judging whether the X axis is over-adjusted to 10%, if not, re-executing the step d, and if so, executing the step e;
step e, starting Z-axis motion control;
f, acquiring a Z-axis motion state, judging whether the XYRZ axis reaches a command designated position, if not, re-executing the step f, and if so, executing the step g;
and g, blowing by an air pump to carry out component mounting, and resetting the XYRZ axis.
Further, the component mounting instruction is sent out through an upper computer.
And further, in the step b, the command is disassembled and then is issued to the four-axis controller.
Further, in the step d, the motion state of the XYR three-axis is obtained by transmitting state information to an upper computer through a bus by the XYR three-axis controller.
Further, in step d, the determination that the X-axis is not overshot by 10% is performed by defining a status flag bit s, and setting an initial value s of the status flag bit to 0 indicates that the X-axis is not overshot by 10%.
Further, in step d, the judgment that the X-axis overshoot reaches 10% is performed by defining a status flag bit s, and setting the status flag bit s to 1 means that the overshoot reaches 10%.
Furthermore, the step e of starting the Z-axis motion control is to start the Z-axis controller when the status flag s is equal to 1, so as to control the Z-axis to reach a desired position, and at this time, the XYR-axis has substantially reached the specified position and is in the adjustment stage.
Further, the motion state of the Z axis is obtained in the step f, and the Z axis reaches the designated position to generate a trigger signal which indicates that each axis reaches the designated position.
Further, the XYRZ axis is reset in step g, and the status flag s is set to 0.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a multi-axis cooperative control method for optimized mounting of components of a chip mounter, which takes the adjustment time in the control process of a motor into consideration, starts the control of a Z-axis motor when a certain overshoot occurs to an X-axis motor, starts the Z-axis motor to move under the control of a controller when an XYR axis is in an adjustment stage, does not need to wait until the XYR three axis reaches an accurate position to start the Z-axis, avoids the waiting time caused by the XYR three-axis adjustment, effectively improves the mounting efficiency and accuracy of the chip mounter, improves the speed and accuracy of the chip during the mounting operation of the components, and improves the quality and performance of the mounting process of the chip mounter; the method has the advantages that the axes are cooperatively controlled when the components of the chip mounter are mounted, the problem of time waste caused by a traditional sequential control method is solved, the waiting time caused by the adjustment time existing in a motor control characteristic curve is reduced, and the method plays an important role in improving the mounting efficiency of the chip mounter.
The invention starts Z-axis control in the overshoot stage instead of the rising stage, and avoids machine damage caused by mechanical collision and the like due to the fact that the XYR axis does not move in place.
Drawings
FIG. 1 is an overall flow chart of the present invention;
FIG. 2 is a schematic diagram of the present invention;
fig. 3 is a flow chart of conventional component mounting.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings.
A multi-axis cooperative control method for optimized surface mounting of components of a surface mounting machine is disclosed, as shown in FIG. 1, and comprises the following steps:
step a, a chip mounter receives a component mounting instruction;
step b, disassembling the instruction into instruction information X on an X axisdAnd the instruction information Y on the Y axisdDesired angle R of R axisdAnd Z-axis expectationZdA location;
c, starting a XYR three-axis motion control state and tracking instruction information;
d, acquiring a three-axis motion state of XYR, judging whether the X axis is over-adjusted to 10%, if not, re-executing the step d, and if so, executing the step e;
step e, starting Z-axis motion control;
f, acquiring a Z-axis motion state, judging whether the XYRZ axis reaches a command designated position, if not, re-executing the step f, and if so, executing the step g;
and g, blowing by an air pump to carry out component mounting, and resetting the XYRZ axis.
Specifically, the component mounting instruction is sent out through an upper computer.
Specifically, in the step b, the command is disassembled and then issued to the four-axis controller.
Specifically, in the step d, the motion state of the XYR three-axis is obtained by the XYR three-axis controller transmitting state information to the upper computer through a bus.
Specifically, in step d, the determination that the X-axis is not overshot by 10% is performed by defining a status flag bit s, and setting an initial value s of the status flag bit to 0 indicates that the X-axis is not overshot by 10%.
Specifically, in step d, the judgment that the X-axis overshoot reaches 10% is performed by defining the status flag bit s, and setting the status flag bit s to 1 means that the overshoot reaches 10%.
Specifically, in the step e, the Z-axis motion control is started when the status flag s is equal to 1, and the Z-axis is controlled to reach a desired position, at which time the XYR axis has substantially reached the specified position, and is in the adjustment stage.
Specifically, in the step f, a Z-axis motion state is acquired, and when the Z-axis reaches a specified position, a trigger signal is generated to indicate that each axis reaches the specified position.
Specifically, the XYRZ axis is reset in step g, and the status flag s is set to 0.
As shown in fig. 3, when a component is mounted on an existing chip mounter, the component needs to be mounted at a designated position at a certain angle, which relates to linear motion and R-axis rotational motion of an X-axis, a Y-axis and a Z-axis of an operating platform of the chip mounter. Considering the actual structure of the chip mounter, in the process of mounting components, the components need to move to a specified position in the XY direction (namely the horizontal direction) and move to a specified angle in the R axis, then the Z axis is controlled to reach the mounting height, and then delayed air blowing is performed to finish mounting and control the Z axis to reach an idle position.
The method controls all axes during component mounting, is different from the control of all axes during mounting of the existing chip mounter, starts the control of the Z axis when the control curve of the X axis is in an overshoot stage, and finishes the adjusting process of the XYR axis in the process of moving the Z axis from an idle position to the mounting height. As shown in FIG. 2, where σpIndicating overshoot, t, in the control process of the motor of each shaft1、tp、tsTime to overshoot 10%, peak time and conditioning time, respectively.
Unlike the existing XYRZ axis control scheme, t of the control curve is controlled on the XYR axis1The control of the Z axis is started at the moment, and when the X axis does not reach the steady state position by taking the X axis response curve as a reference, namely the X axis is still in the adjusting stage t1～tsThe X-Y-Z-R type visual detection chip mounter is particularly suitable for improving the mounting speed of the X-Y-Z-R type visual detection chip mounter in component mounting.
Claims (9)
1. A multi-axis cooperative control method for optimized surface mounting of components of a surface mounting machine is characterized by comprising the following steps:
step a, a chip mounter receives a component mounting instruction;
step b, disassembling the instruction into instruction information X on an X axisdAnd the instruction information Y on the Y axisdDesired angle R of R axisdAnd Z-axis expectation ZdA location;
c, starting a XYR three-axis motion control state and tracking instruction information;
d, acquiring a three-axis motion state of XYR, judging whether the X axis is over-adjusted to 10%, if not, re-executing the step d, and if so, executing the step e;
step e, starting Z-axis motion control;
f, acquiring a Z-axis motion state, judging whether the XYRZ axis reaches a command designated position, if not, re-executing the step f, and if so, executing the step g;
and g, blowing by an air pump to carry out component mounting, and resetting the XYRZ axis.
2. The multi-axis cooperative control method for the optimal mounting of components on a chip mounter according to claim 1, wherein the component mounting instruction is issued by an upper computer.
3. The multi-axis cooperative control method for the optimized mounting of components and parts of a chip mounter according to claim 2, wherein the command is disassembled and then issued to the four-axis controller in the step b.
4. The multi-axis cooperative control method for the optimized mounting of components of a chip mounter according to claim 3, wherein in the step d, the manner of obtaining the motion state of the three axes of XYR is that a three-axis XYR controller transmits state information to an upper computer through a bus.
5. The multi-axis cooperative control method for optimal mounting of components of a chip mounter according to claim 4, wherein the step d of determining that the X-axis is not overshot by 10% defines a status flag bit s, and setting an initial value s of the status flag bit to 0 indicates that the overshoot is less than 10%.
6. The multi-axis cooperative control method for optimal mounting of components of a chip mounter according to claim 5, wherein the judgment of 10% overshoot of the X axis in step d is performed by defining a status flag bit s, and setting the status flag bit s to 1 means that the overshoot reaches 10%.
7. The multi-axis cooperative control method for component optimal mounting of a chip mounter according to claim 6, wherein the step e of starting the Z-axis motion control is to start the Z-axis controller when the status flag s is 1, so as to control the Z-axis to reach a desired position, and at this time, the XYR-axis has substantially reached the designated position and is in the adjustment stage.
8. The multi-axis cooperative control method for the optimal mounting of components of a chip mounter according to claim 7, wherein a Z-axis motion state is obtained in step f, and when the Z-axis reaches a specified position, a trigger signal is generated to indicate that each axis has reached the specified position.
9. The multi-axis cooperative control method for the optimal mounting of components and parts of a chip mounter according to claim 8, wherein in the step g, the XYRZ axis is reset, and the status flag s is set to 0.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911405011.7A CN111031782A (en) | 2019-12-31 | 2019-12-31 | Multi-axis cooperative control method for optimized surface mounting of components of surface mounting machine |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911405011.7A CN111031782A (en) | 2019-12-31 | 2019-12-31 | Multi-axis cooperative control method for optimized surface mounting of components of surface mounting machine |
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| CN111031782A true CN111031782A (en) | 2020-04-17 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1140992A (en) * | 1997-07-18 | 1999-02-12 | Yamagata Casio Co Ltd | Method and device for mounting electronic component |
| JP2002111284A (en) * | 2000-09-26 | 2002-04-12 | Matsushita Electric Ind Co Ltd | Method for mounting electronic component |
| CN101175395A (en) * | 2006-11-01 | 2008-05-07 | Juki株式会社 | Surface installation device |
| CN102245010A (en) * | 2010-04-26 | 2011-11-16 | 富士机械制造株式会社 | Component mounting apparatus |
| CN103796499A (en) * | 2014-01-18 | 2014-05-14 | 山东大学 | Stepwise locating and pin shaping type multi-plug-in-piece-head special-shaped electronic component plug-in machine and application thereof |
| CN108243600A (en) * | 2017-01-06 | 2018-07-03 | 广东华志珹智能科技有限公司 | A kind of screening cover control system of chip mounting machine and method |
-
2019
- 2019-12-31 CN CN201911405011.7A patent/CN111031782A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1140992A (en) * | 1997-07-18 | 1999-02-12 | Yamagata Casio Co Ltd | Method and device for mounting electronic component |
| JP2002111284A (en) * | 2000-09-26 | 2002-04-12 | Matsushita Electric Ind Co Ltd | Method for mounting electronic component |
| CN101175395A (en) * | 2006-11-01 | 2008-05-07 | Juki株式会社 | Surface installation device |
| CN102245010A (en) * | 2010-04-26 | 2011-11-16 | 富士机械制造株式会社 | Component mounting apparatus |
| CN103796499A (en) * | 2014-01-18 | 2014-05-14 | 山东大学 | Stepwise locating and pin shaping type multi-plug-in-piece-head special-shaped electronic component plug-in machine and application thereof |
| CN108243600A (en) * | 2017-01-06 | 2018-07-03 | 广东华志珹智能科技有限公司 | A kind of screening cover control system of chip mounting machine and method |
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Application publication date: 20200417 |
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