JPH0687528A - Positioning device for semiconductor element - Google Patents

Abstract

PURPOSE:To prevent the damage and bending of a lead in the positioning process of a semiconductor element and also prevent the generation of a reattraction error. CONSTITUTION:The mold part 1a of a semiconductor element 1 is guided by a cam 4a with its thickness changed in the moving direction so as to perform the space positioning of the semiconductor element 1. The lead 1b of the semiconductor element 1 is not therefore touched it is prevented from being damaged or bent, and the generation of a reattraction error is also prevented since attraction is never released, even once.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element positioning device, and more particularly to a semiconductor element positioning device for measuring and selecting semiconductor elements in advance so that the leads of the semiconductor element match the positions of the measuring sockets of the measuring section. An apparatus for positioning an element.

[0002]

2. Description of the Related Art A conventional semiconductor element positioning apparatus, as shown in FIGS.
Positioning is performed by guiding the leads.

5 (a) to 5 (c) are sectional views for explaining a device using a conventional positioning claw. A plurality of semiconductor elements 1 that have been pushed and carried by a carrying section (not shown)
Is picked up by the suction head 3 and conveyed in the air to a position right above the positioning block 9a, then the suction is released and the product naturally falls. The positioning block 9a is provided with a plurality of positioning claws 9b according to the number of the semiconductor elements 1, and the leads 1b of the semiconductor element 1 that have naturally dropped can be guided by the positioning claws 9b to perform positioning.

FIGS. 6 (a) to 6 (c) show JP-A-2-180.
099 is a cross-sectional view for explaining an apparatus using the inverted pyramidal hole 10. The semiconductor element 1 picked up by the suction head 3 is transported in the air to the midpoint of the positioning hole 10 having the shape of an inverted pyramid, the suction is released, and the semiconductor element 1 is naturally dropped. Further, the leads 1b extending in four directions from the semiconductor element 1 are guided by the slopes of the inverted pyramidal holes and reach the bottom of the holes and can be positioned at the same time.

[0005]

When the positioning claw shown in FIG. 5 is used, as shown in FIG. 7A, the lead 1b of the semiconductor element 1 extends downward, and the semiconductor element has a DIP shape. Is effective against. However, FIG.
SO in which the lead 1b as in (b) extends horizontally
With respect to the P-shaped semiconductor element, there is a problem that it is impossible to guide and position the lead.

Further, in the case of using the inverted pyramidal hole of FIG. 6,
This is effective for a QFP-shaped semiconductor element having leads 1b extending in four directions as shown in FIG. 7 (c). However, in the SOP-shaped semiconductor device as shown in FIG.
Positioning in the direction orthogonal to the direction in which the lead 1b extends must depend on the end surface of the mold portion 1a. Therefore, the positioning accuracy is lowered due to the variation in the size of the mold burr 1c, or the lead tip is guided, which may lead to lead damage or lead bending. Furthermore, in order to realize smooth guidance, it is necessary to increase the bevel angle α of the inverted pyramid hole 10, but as a result, the depth D of the hole becomes deeper, and the suction nozzle 3 during re-pickup.
There is a problem in that the vertical movement amount S of the device increases and the processing capacity of the device decreases.

Further, as a problem common to both the case of using these positioning claws and the case of using the inverted pyramid hole, the semiconductor element 1 is once separated from the suction bed 3, so that a suction error at the time of re-sucking occurs. It had the drawback of inducing.

An object of the present invention is to solve these problems and to provide a semiconductor element positioning apparatus capable of reliably positioning various semiconductor elements without requiring re-suction.

[0009]

According to the structure of the present invention, a transport means for transferring a plurality of manufactured semiconductor elements, a holding means for holding the plurality of semiconductor elements, and a holding means held by the holding means are adjacent to each other. A semiconductor element positioning device having a space adjusting means for adjusting the space between the semiconductor elements,
The interval adjusting means is a cam member that is inserted between the adjacent semiconductor elements and has a taper that gradually changes the interval between the semiconductor elements according to the insertion amount, and cam driving means that drives the cam member in its moving direction. It is characterized by having.

In the present invention, the cam member is a disc-shaped cam formed such that when the disc rotates about its central axis, the thickness of the outer periphery of the disc changes in a taper direction. The cam driving means can also be composed of a gear connected to the central axis of the disc-shaped cam and a pulse motor connected to the gear to drive the gear, and the cam member is
The linear cam includes a linear cam whose thickness changes in a taper shape and a guide plate which supports the linear cam and slides in the linear direction. The cam driving means includes a rack connected to the linear cam and a gear system. And a pulse motor connected to drive the pulse motor.

[0011]

1 is a perspective view for schematically explaining a first embodiment of the present invention, and FIGS. 2A to 2C are sectional views for explaining the operation of FIG. 1 in the order of steps. The semiconductor element 1 is sucked by a suction head 3 which is pushed and vacuum-sucked by the transport unit 2 to be transported.
Is adsorbed by.

On the other hand, the disk-shaped cam 4a has a structure in which the thickness thereof changes in a taper shape depending on the rotating direction, is connected to the gear 5b, and is driven by the gear 5a coupled to the pulse motor 6. After the semiconductor element 1 is positioned by the cam 4a, the semiconductor element 1 can be conveyed to the measuring unit 7 while being sucked by the suction head 3.

First, the plurality of semiconductor elements 1 transported by the transport unit 2 are picked up by the suction head 3 and transported to the air just above the cam 4a whose thickness changes in the rotating direction. The minimum value of the thickness of the cam 4a is set to be smaller than the gap C1 (FIG. 2 (a)) formed between the closely contacted semiconductor elements. At this time, the cam 4a has a minimum thickness portion. Is controlled so as to face the semiconductor element 1 and is stopped.

Next, as shown in FIG. 2B, the semiconductor element 1 is lowered together with the suction head 3 to a position where the cam 4a is inserted into the gap between the semiconductor elements by about 1 to 2 mm, and the cam 4a is moved to a predetermined position. It rotates by the angle of and stops when the gap between the semiconductor elements reaches a predetermined amount C2.

The semiconductor element 1 which has been thus positioned is lifted up together with the suction head 3, and the semiconductor element 1 shown in FIG.
In the next process, for example, it is conveyed in the air to the measuring unit 7.

FIG. 3 is a perspective view for schematically explaining the second embodiment of the present invention, and FIGS. 4A to 4C are a plan view and a sectional view for explaining the operation of FIG. 3 in the order of steps. In this example,
It shows a case where a linear cam 4b provided with a rack is used instead of the disc-shaped cam 4a of FIG. 1, and the cam b is guided by a linear guide portion 8 and is driven by a gear 5a connected to a pulse motor 6. Driven.

The plurality of semiconductor elements 1 transported by the transport unit 2 are picked up by the suction head 3 and transported to the air just above the cam 4b whose thickness changes in a taper shape in the movable direction. The minimum value of the thickness of the cam 4b is set to be smaller than the gap C1 formed between the closely contacted semiconductor elements, and the cam 4b at this time is retracted to a position where it does not interfere even if the semiconductor element 1 descends.

Next, as shown in FIG. 4B, the lower surface of the molded portion of the semiconductor element 1 is 1 to 2 mm from the upper surface of the cam 4b.
After the semiconductor element 1 descends together with the suction head 3 to a height such that the height is lowered, the cam 4b moves by a predetermined amount and stops when the gap between the semiconductor elements reaches a predetermined amount C2.

The thus-positioned semiconductor element 1 rises together with the suction head 3 and is conveyed in the air to the next step, for example, the measuring section 7 as shown in FIG. 4C.

[0020]

As described above, according to the present invention, the mold portion of the semiconductor element is guided by the cam whose thickness changes in the rotating or linear direction. Therefore, the lead of the semiconductor element is damaged or the lead is bent. In addition, since the positioning is performed while the semiconductor element is sucked, the occurrence rate of the re-chucking error can be reduced.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a first embodiment of the present invention.

2 is a cross-sectional view in the orthogonal direction for explaining the operation of FIG. 1 in the order of steps.

FIG. 3 is a perspective view of a second embodiment of the present invention.

4A and 4B are a top view and a side sectional view for explaining the operation of FIG. 3 in the order of steps.

FIG. 5 is a cross-sectional view illustrating a case of using a conventional positioning claw in the order of steps.

6A to 6C are cross-sectional views illustrating a case of using a conventional inverted pyramid hole in the order of steps.

FIG. 7 is a perspective view of a semiconductor device having various general leads.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor element 1a Mold part of semiconductor element 1b Lead of semiconductor element 1c Burr of mold part 2 Conveying part 3 Adsorption head 4a Cam whose thickness changes in the rotational direction 4b Cams 5a and 5b whose thickness changes in the linear direction 5a Gear 6 Pulse motor 7 Measuring part 8 Linear guide part 9a Positioning block 9b Positioning claw 10 Positioning hole

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Claims (3)

[Claims] 1. A transfer means for transferring a plurality of manufactured semiconductor elements, a holding means for holding the plurality of semiconductor elements, and a gap adjustment for adjusting a gap between adjacent semiconductor elements held by the holding means. And a cam member having a taper that is inserted between the adjacent semiconductor elements and that gradually changes the distance between the semiconductor elements according to the insertion amount, and the cam member. And a cam driving means for driving the device in the moving direction thereof. 2. The cam member comprises a disc-shaped cam formed such that when the disc rotates about its central axis, the thickness of the outer periphery of the disc changes in a taper direction in the rotational direction. 2. The semiconductor device positioning device according to claim 1, wherein the means comprises a gear connected to the central axis of the disc-shaped cam and a pulse motor connected to the gear to drive the gear. 3. The cam member comprises a linear cam whose thickness changes in a taper shape in a linear direction, and a guide plate which supports the linear cam and slides in the linear direction, and the cam driving means includes the linear cam. 2. A rack connected to the cam-like cam and a pulse motor which is connected by a gear system and drives the same.
A semiconductor device positioning device as described above.