JP2003188599A - Electronic part mounting system and electronic part loading machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make it possible to mount electronic parts on a circuit board of large size even in the case of using a compact electronic part loader. <P>SOLUTION: The electronic part mounting system is provided with a plurality of compact electronic part loading machine 1. Each electronic part loading machine 1 loads an electronic part on a circuit board B which is larger than a loadable range P capable of loading the electronic part. Since the stop position of the circuit board B is changed in each loading machine 1, electronic parts can be loaded in respectively different areas M1, M2 on the circuit board B in each loading machine 1. An area combining respective areas M1, M2 is larger than a required loading area N requiring mounting of electronic parts on the circuit board B. Thereby the whole electronic part mounting system can mount necessary electronic parts on the circuit board B having the required mounting area larger than the mountable range P of each electronic part loading machine 1. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting system having a plurality of electronic component mounting machines and an electronic component mounting machine.

[0002]

2. Description of the Related Art Conventionally, an electronic component mounting machine has a nozzle for adsorbing an electronic component, a shaft for mounting the nozzle, and a head unit equipped with a plurality of shafts for positioning in the Z-axis (vertical) direction and the θ-axis rotational direction. , XY the head unit
An XY drive unit that moves and positions in the coordinate direction, a component supply device that supplies electronic components, a substrate transfer unit that loads and unloads a circuit board, and fixes the circuit board at a predetermined position, and a control unit that controls these. ing.

Then, the nozzle mounted on the shaft of the head unit sucks the electronic component from the component supply device, and X
The head unit is moved by the Y drive unit and is transported to a predetermined position on the circuit board fixed to the substrate transport unit. After that, the operation of mounting the electronic component on the circuit board by repeating the operation of lowering the nozzle to release the suction, the electronic component is automatically mounted.

An electronic component mounting method using such an electronic component mounting machine includes, for example, a step of printing a solder paste on the circuit board as a pre-process of mounting the electronic component on the circuit board by the electronic component mounting machine. In the electronic component mounting machine, there is a step of applying an adhesive agent to the circuit board in advance to temporarily fix the electronic component to the circuit board, and a reflow step of melting solder as a post step. The electronic component mounting line (electronic component mounting system) having such steps is equipped with an electronic component mounting machine. In order to increase production efficiency in such an electronic component mounting line,
Place multiple electronic component mounting machines on the line in a row,
Electronic components may be mounted on a single circuit board from a plurality of electronic component mounting machines. Further, in such a case, when the number of electronic component mounting machines is increased, a small electronic component mounting machine is often arranged so that the occupied area of the electronic component mounting line does not become too large.

[0005]

By the way, the electronic component mounting machine can mount the electronic components on the circuit board only within the range in which the head unit can move, and the mountable range in which the electronic components can be mounted is limited. It has been decided. Further, in the board transfer unit, the maximum size of the circuit board that can be transferred and fixed at a predetermined position is determined so as to correspond to the mountable range. In addition, if the electronic component mounting machine is a circuit board within a predetermined maximum size, it is possible to mount the electronic component on the entire area of the mounting required area requiring the mounting of the electronic component on the circuit board. Has become.

Since the size of the electronic component mounting machine is determined approximately in accordance with the maximum size of the circuit board on which electronic components can be mounted, in a small electronic component mounting machine, the electronic components should be mounted on a large circuit board. I can't. Therefore, in an electronic component mounting line that includes a plurality of small electronic component mounting machines as described above, by installing a small electronic component mounting machine, the maximum size of the circuit board on which electronic components can be mounted I had no choice but to reduce. That is, in the small electronic component mounting machine, the size of the circuit board on which the electronic components can be mounted is limited to a relatively small size.

An object of the present invention is to enable mounting of electronic components on a large-sized circuit board even if a small-sized electronic component mounting machine is used.

[0008]

The invention according to claim 1 is
For example, as shown in FIGS. 1 to 5, an electronic component mounting machine 1 for mounting mounting components such as electronic components on a board (circuit board B)
An electronic component mounting system comprising a plurality of electronic component mounting machines, wherein the electronic component mounting machine mounts the electronic components on the substrate, wherein the electronic component mounting machine holds the mounted components in a detachable manner on the substrate. A head unit 3 that conveys and mounts the mounted component on a substrate, a moving unit (XY drive unit 4) that moves the head unit when the mounted component is mounted on the substrate, and a substrate that is loaded and unloaded. A board transfer means (board transfer unit 6) for unloading and fixing the board at a predetermined position for mounting the mounting component, and a mounting required area N for mounting the mounting component on the board. , A wider side than a mountable range P in which the mounting component can be mounted by the head unit moved by the moving means, and a predetermined side edge of the substrate for each electronic component mounting machine. The mounting position of the board is different so that the distance from the mountable range is different, and each electronic component mounting machine is determined by the mounting position of the board, and overlaps a part of the mounting required area. The mounting components are mounted within the mountable range corresponding to the board, and the mountable range of each electronic component mounting machine is combined to correspond to the area on the board. The electronic component mounting system is characterized by overlapping the entire required area.

According to the first aspect of the present invention, the head unit that is moved by the moving unit moves a mounting required area of the substrate that is transported to the substrate transporting unit and that requires mounting of the mounting component. Since it is wider than the mountable range of mounting components, one electronic component mounting machine cannot mount electronic components in the entire mounting required area of one board, but for one board An electronic component mounting system, in which electronic components are mounted by a plurality of electronic component mounting machines, and the area where the mountable range of each electronic component mounting machine is combined overlaps the entire required mounting area of the board. As a whole, all the required electronic components can be mounted on the board having a mounting required area wider than the mountable range of each electronic component mounting machine. Therefore, according to this electronic component mounting system, it is possible to mount electronic components on a large board even in an electronic component mounting system including a plurality of small electronic component mounting machines. It should be noted that the portion of the board conveying means for carrying the board and fixing the board needs to correspond to the board having a mounting required area larger than the mountable range of the electronic component mounting machine. According to the invention, the area on the substrate is divided into a plurality of areas,
Electronic components are mounted by different electronic component mounting machines for each of the divided areas, but the respective areas may partially overlap each other.

According to a second aspect of the present invention, in the electronic component mounting system according to the first aspect, when the substrate conveyed by the substrate conveying means is stopped and the substrate is fixed,
An electronic component characterized in that a fixed position of the substrate is made different along a transport direction of the substrate by making a stop position of the substrate different from the mountable range for each electronic component mounting machine. It is a mounting system.

According to the second aspect of the present invention, the substrate is divided into a plurality of regions arranged in the substrate transport direction (the regions may partially overlap each other), and each of the divided regions is divided into regions. Different electronic component mounting machines will mount electronic components. As a result, it is possible to obtain the same effect as that of the first aspect of the invention. Further, by changing the stop position of the substrate conveyed to the substrate conveying means for each electronic component mounting machine, each electronic component mounting machine can select the above-mentioned divided area on the substrate on which the electronic component is mounted. Therefore, it is not necessary to significantly change the structure of the substrate transfer means from the conventional one. For example, the position of the stopper that determines the stop position of the substrate can be changed, or the stopper can be provided at a plurality of positions. You can Further, in the case of such a configuration, the width orthogonal to the substrate transport direction is
Basically, it is almost the same as a board on which electronic components can be mounted by a conventional electronic component mounting machine of the same size, so the width of the substrate transfer means does not become wide, and even if electronic components can be mounted on a large substrate, It is possible to easily reduce the size of the component mounter. Further, for example, a part of the board on which the electronic component is mounted in one electronic component mounting machine may be slightly protruded into the device in the pre-process or the device in the post-process,
With this configuration, even if the electronic component is mounted on the board that is long in the carrying direction, it is possible to prevent the substrate carrying means from becoming long, and the electronic component mounting machine can be used to mount the electronic component on the large board. Can be miniaturized.
In addition, when a part of the substrate is protruded to the apparatus of the pre-process or the apparatus of the post-process, the protruding amount needs to be in a range that does not interfere with the operation of the apparatus of the pre-process or the post-process.

The invention according to claim 3 is the invention according to claim 1 or 2.
The electronic component mounting system as described above, wherein a plurality of the head units are arranged side by side along the transfer direction of the substrate.

According to the third aspect of the invention, in addition to the effect of the first or second aspect of the invention, the mounting efficiency can be further improved by mounting the mounting parts by a plurality of head units. . Further, since the plurality of head units are arranged side by side in the substrate transport direction, for example, the X-axis frame along the substrate transport direction can be moved to X
In the electronic component mounting machine provided in the Y drive unit, the number of head units can be relatively easily increased by mounting a plurality of head units on the X-axis frame.

According to a fourth aspect of the present invention, there is provided a plurality of electronic component mounting machines for mounting mounting components such as electronic components on a substrate, and the electronic components are mounted on the substrate by the plurality of electronic component mounting machines. In the mounting system, the electronic component mounting machine detachably holds the mounted component, conveys the mounted component onto the substrate, and mounts the mounted component on the substrate; and the mounted component on the substrate. A moving means for moving the head unit when mounted on a substrate, and a substrate carrying means for loading and unloading the substrate and fixing the substrate at a predetermined position for mounting the mounted component,
In addition, the mounting required area of the board, which requires mounting of the mounting component, is made wider than the mountable range in which the mounting component can be mounted by the head unit moved by the moving means, and each electronic component mounting machine The fixed positions of the board are differentiated so that the distance from the predetermined side edge of the board to the mountable range is different, and each electronic component mounting machine is determined by the fixed position of the board and The mounting component is mounted within the mountable range corresponding to the substrate overlapping a part of the required area, and at least one electronic component mounting machine fixes the substrate at least one fixing position. The position of the mountable range of the electronic component mounting machine on the board is changed more than once to change the electronic parts for each mountable range changed on the board. The area corresponding to the mountable area of each electronic component mounting machine including the mountable area whose position has been changed corresponds to the entire area of the board required mounting area of the board. The electronic component mounting system is characterized in that it overlaps with.

According to the fourth aspect of the present invention, the electronic component has the same effects as the first aspect of the present invention, and in at least one electronic component mounting machine, the position of the substrate is shifted and the electronic component is repeated a plurality of times. By mounting the, the mountable range in one electronic component mounting machine can be increased. As a result, for example, the number of electronic component mounting machines required to mount electronic components on the largest size substrate can be reduced. That is, in the case of a board of a medium size or smaller that is smaller than the maximum size, each electronic component mounting machine of the electronic component mounting system performs one mounting process for one substrate, and a larger size than that. For the above board, if at least one electronic component mounting machine shifts the position of the board and carries out the mounting process a plurality of times for one board, the electronic component corresponding to the largest size Space efficiency can be improved without increasing the number of component mounting machines.

According to a fifth aspect of the present invention, in the electronic component mounting system according to any one of the first to fourth aspects, the substrate conveying means of each electronic component mounting machine conveys the substrate continuously. In addition, each electronic component mounting machine is connected, and the mounting components to be mounted on each electronic component mounting machine are determined so that the time required for mounting the electronic components on each electronic component mounting machine becomes almost equal. It is a featured electronic component mounting system.

According to the fifth aspect of the invention, each electronic component mounting machine simultaneously mounts an electronic component on a corresponding area of the substrate, and each electronic component mounting machine mounts an electronic component on the area. When finished, each of them is carried out to the next electronic component mounting machine, or if it is carried out to the next process of electronic component mounting, each electronic component mounting machine mounts electronic components almost at the same time. After finishing, it is possible to carry out the board at the same time as the board is carried in and to mount the board on the next board, and to mount the electronic part on the next board. it can. In other words, if the time required to mount the electronic components on each electronic component mounting machine varies, it is necessary to carry out or carry in the board at the end of the mounting on the electronic component mounting machine that takes the longest time to mount the electronic components. Until then, the electronic component mounting machine, in which the electronic components have been mounted early, is in a stopped state, but this can be prevented and the work can be made more efficient.

According to a sixth aspect of the present invention, a mounting unit such as an electronic component is detachably held and conveyed onto a substrate to mount the mounting component on the substrate, and the mounting component is mounted on the substrate. A moving means for moving the head unit when it is mounted on the substrate, and a substrate transporting means for loading and unloading the substrate and fixing the substrate at a predetermined position for mounting the mounted component, and The required mounting area for mounting the mounted component is made wider than the mountable range in which the mounted component can be mounted by the head unit moved by the moving means, and the fixing position of the substrate is changed at least once or more. Then, the position of the mountable range on the board is changed, and the electronic component is mounted for each changed mountable range, and the position is changed. Region to correspond to the circuit board together range mounting is that an electronic component mounting machine, characterized in that is adapted to overlap with the entire area of the mounting space required by the substrate.

According to the sixth aspect of the invention, even in a small electronic component mounting machine, the electronic components are mounted on a large substrate by shifting the position of the substrate and mounting the electronic components a plurality of times. It becomes possible. As a result, even if there is a possibility of mounting electronic components on a large board, it is not necessary to have a large electronic component mounting machine, but only a small electronic component mounting machine is required, thus reducing costs and improving space efficiency. Can be planned.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION An electronic component mounting system and an electronic component mounting machine according to an embodiment (first embodiment) of an electronic component mounting machine of the present invention will be described below with reference to FIGS. The electronic component mounting system of this example, like the well-known electronic component mounting system, accommodates and supplies the circuit board B and supplies a board (not shown), and a solder printer that prints a solder paste on the circuit board B ( (Not shown), an adhesive application device (not shown) for applying an adhesive to a circuit board B at a predetermined position for temporarily fixing an electronic component (not shown), and the electronic device for mounting the electronic part on the circuit board B. The component mounting machine 1 (illustrated in FIG. 1 and the like) and a reflow furnace (not shown) that melts solder and connects electronic components to the circuit board B are provided. Further, as shown in FIG. 2, the electronic component mounting system includes a plurality of electronic component mounting machines 1 (1a, 1b) connected to each other so that the circuit boards B can be carried out and carried in. here,
The electronic component mounting system includes two electronic component mounting machines 1a,
1b is provided.

The electronic component mounting machine 1 will be described below. As shown in FIG. 1, the electronic component mounting machine 1 of the present invention is
Basically, similarly to a well-known electronic component mounting machine, a nozzle (not shown) for adsorbing electronic components, a shaft 2 to which the nozzle is attached, a plurality of shafts 2 are provided, and positioning in the Z axis (vertical) direction and the θ axis rotation direction Head unit 3 for moving, XY drive unit 4 for moving and positioning the head unit 3 in the XY axis coordinate directions, and component supply device 5 for supplying electronic components
(Illustrated in FIG. 2 and the like), a substrate transfer unit 6 for loading / unloading the circuit board B and fixing the circuit board B at a predetermined position, a nozzle changer 7 in which a plurality of various nozzles are exchangeably held by the shaft 2, and It is roughly configured by a control unit that controls these.

The XY drive section (moving means) 4 has two Y-axis frames 41 arranged in parallel with each other, and both ends of the Y-axis frame 41 are movably supported in the Y-axis direction. And a shaft frame 42. The X-axis frame 42 supports the head unit 3 movably in the X-axis direction. Then, the XY drive unit 4 drives the X-axis frame 42 and the head unit 3 to
The head unit 3 is moved in the XY axis directions and positioned.

The component supply device 5 is prepared for each type of component to be mounted, and is removably mounted in parallel on the holder 11 of the electronic component mounting machine 1. The holder 11 is arranged outside one or both side portions of the substrate transfer unit 6, and as shown in FIG. They are arranged outside the side portions, respectively.

The substrate transfer unit 6 (substrate transfer means) is
The circuit board B is carried in from the previous step and fixed at a predetermined position.
Then, when the mounting of the electronic component on the circuit board B is completed,
The circuit board B is carried out to the next process in response to a signal from the control unit indicating the end of mounting. 2 and 3, the transfer direction of the substrate transfer unit 6 is the direction indicated by arrow A. Further, the board transfer unit 6 is provided with guide members 61, 61 for guiding the circuit board B along the transfer direction and for transferring the circuit board B on both left and right sides and having a not-illustrated transfer belt. There is. In addition, the guide member 6
1, 1 and 61 are provided with board fixing means for fixing the circuit board B in a state in which the left and right side edge portions of the circuit board B are held by pressing the circuit board B that is lifted by a backup pin (not shown) from the upper side.

Further, when fixing the circuit board B to the board fixing means, stoppers 62, 63 for deciding the position of the circuit board B along the carrying direction are provided as a part of the fixing positioning means for deciding the position of the circuit board B. I have it. Stopper 62,
The reference numeral 63 is provided so as to be retractable (movable up and down) with respect to a transfer path along which the circuit board B is transferred. Then, the stoppers 62, 63 are brought into contact with, for example, the front edge of the circuit board B (the rear edge when the circuit board B is retracted as described later) by protruding onto the transport path, and the circuit board B The position of the circuit board B is determined by stopping the conveyance of B by the conveyance belt.

In the present invention, a plurality of stoppers 62, 63 are provided so that the stop position of the circuit board B can be largely changed beyond the fine adjustment range, or the stoppers 62, 63 are movably provided. Has been. In this example, for example, the stopper 63 that stops the front edge of the circuit board B advancing in the carrying direction and the stopper 6 that stops the rear edge of the circuit board B when the circuit board B is retracted along the carrying direction.
Two are provided. Note that stoppers 63 that stop the front edge of the circuit board B that advances in the carrying direction may be provided at a plurality of locations at intervals along the carrying direction, or the stoppers 62 and 63 may be slightly moved along the carrying direction. You may make it possible to move largely in the range beyond adjustment. Further, the stopper 63 may be arranged outside the substrate transfer unit 6 along the transfer direction.

In the present invention, the substrate transfer unit 6 can be mounted on the electronic component mounting machine 1 by the movement of the head unit 3 in the mountable range P in which electronic components can be mounted.
Larger required mounting area N (illustrated by the one-dot chain line in Fig. 2 etc.)
A circuit board B having a size (an area in which two mounting areas M1 and M2, which will be described later and hatched in FIG. 3 are combined) can be transported and can be fixed at a predetermined position. Here, the mountable range P is, for example, from the movable range of the nozzles when the head unit 3 is moved by the XY drive section 4 from the component supply device 5 and the circuit board B.
This excludes the range where electronic parts are transported between and.
Further, the mounting required area N is an area in which mounting components such as electronic components on the circuit board B are required to be mounted, and basically, in each side edge portion, the mounting is arranged closest to the side edge. It is a range surrounded by a straight line parallel to the side edge passing through the position of the component. For example, in the rectangular circuit board B, the side passing through the electronic component arranged in the vicinity of the most side edge of each of the four side edge portions. It is a range surrounded by four straight lines parallel to the edge.

In the first embodiment, the circuit board B, which is long in the carrying direction of the circuit board B with respect to the mountable range P, can be carried and fixed. The board transfer unit 6 can also transfer a circuit board B smaller than the maximum transferable size. That is, the substrate transfer unit 6 adjusts the width in the direction orthogonal to the transfer direction (adjusts the distance between the left and right guide members 61 by moving one of the guide members 61) to obtain the maximum size circuit. The circuit board B, which is narrower than the board B, can also be transported. In addition, in FIG. 2 and FIG. 3, for example,
The circuit board B has a maximum width that can be transferred by the circuit board transfer unit 6. The positioning in the direction orthogonal to the carrying direction when fixing the position of the circuit board B is, for example, not shown, in which one side guide member 61 of the left and right guide members 61 is brought into contact with the side edge of the circuit board B. The restriction member is provided, and the other guide member 61 is provided with a not-shown pressing means for pressing the circuit board B toward the one guide member 61 side.

The control unit is an RO that stores the production program.
XY concerning relative mounting positioning of M and each electronic component
From a Z-coordinate, a non-volatile memory such as an EPROM that stores various changeable parameters such as the type and coordinate of the component supply device 5, a RAM that temporarily stores various data and various programs, and various sensors It has a CPU for receiving the information and making various calculations and judgments, and sends a control signal to each operating part of the electronic component mounting machine to control the overall operation of the apparatus.

Next, a method of mounting electronic components in the electronic component mounting system of the first embodiment will be described. The printing of the solder paste and the application of the adhesive on the circuit board B are performed by known methods. When mounting the electronic component on the circuit board B by the electronic component mounting machine 1, as is well known, the nozzle of the head unit 3 is moved to a component supply device 5 that supplies a preset electronic component, and the nozzle is moved. Is lowered to suck the electronic component from the component supply device 5, and then the nozzle is raised. Next, the head unit 3 is moved to lower the nozzle that has sucked the electronic component at a set position on the circuit board B, release the suction to mount the electronic component on the circuit board B, and raise the nozzle. By repeating this operation for all the electronic components mounted, the electronic components are mounted on the circuit board B.

Here, in the first embodiment, a plurality (two) of electronic component mounting machines 1a and 1b are provided, the electronic components to be mounted on the circuit board B are divided into two, and one circuit is mounted. Electronic components are mounted on the board B by the plurality of electronic component mounting machines 1a and 1b. The plurality of electronic component mounting machines 1a and 1b are connected to each other so that the circuit board B can be transported from the electronic component mounting machine 1a on the upstream side in the transport direction of the circuit board B to the electronic component mounting machine 1b on the downstream side. Are arranged side by side. Further, as shown in FIG. 3, the mounting required area N on the circuit board B is defined by the electronic component mounting machines 1a and 1b.
It is wider than the mountable range P of 1., and it is impossible to mount all the electronic components required on the circuit board B by mounting the electronic components by one electronic component mounting machine 1.

Therefore, as shown in FIG. 2, in the electronic component mounting machine 1a on the upstream side in the transport direction of the circuit board B, approximately half the front side (upstream side) of the mounting required area N of the circuit board B ( Electronic components are mounted in the mounting area M1), and in the electronic component mounting machine 1b on the downstream side, as shown in FIG. 3, on the rear side (downstream side) of the mounting required area N of the circuit board B. Electronic components are mounted in almost half the area. That is, a plurality of electronic component mounting machines 1
The mounting areas M1 of a and 1b are arranged in the carrying direction on the mounting required area N of the circuit board B.

The mounting areas M1 and M2 described above are shown in FIG.
As shown in, the parts are partially overlapped. Further, the mounting areas M1 and M2 may not overlap each other. However, for example, the head unit 3 may be provided with a plurality of nozzles, and a plurality of adjacent electronic components may be simultaneously mounted by the plurality of nozzles. In such a case, a plurality of mounting areas M1, M
If the two are not overlapped, the mounting positions of two electronic components that can be simultaneously mounted adjacent to each other are divided into two adjacent mounting areas M1 and M2, which makes it impossible to mount these electronic components at the same time. Sometimes. In addition, the mounting order of the electronic components is determined so that the electronic components can be efficiently arranged corresponding to the mounting position of each electronic component, but in this case as well, two adjacent mounting areas M1 and M2 must not overlap. May result in poor efficiency.
Further, although the mounting areas M1 and M2 on the circuit board B on which the components are actually mounted are made narrower than the mountable range P in each of the electronic component mounting machines 1a and 1b, the mountable range P
The mounting areas M1 and M2 may have the same size, and the mounting areas M1 and M2 may be shaped so as to be within the mountable range P.

In addition, a component supply device 5 for supplying electronic components to be mounted in the mounting area M1 on the circuit board B is set in advance in the electronic component mounting machine 1a.
A component supply device 5 for supplying electronic components mounted on the mounting area M2 on the circuit board B is set in b. Also,
Data for mounting electronic components corresponding to the mounting areas M1 and M2 is input to the control units of the electronic component mounting machines 1a and 1b.

In mounting the electronic component, in the electronic component mounting machine 1a on the upstream side, as shown in FIG. 1, the front side of the circuit board B which is carried in from the previous step by the board carrying unit 6 along the carrying direction. The stop position of the circuit board B along the transfer direction is determined by contacting the stopper 63 whose edge has already been projected, and the circuit board B is fixed by the board transfer unit 6 at the stop position. At this time, the front side portion of the mounting required area N of the circuit board B mainly falls within the mountable range of the upstream electronic component mounting machine 1a. Then, an area slightly wider than the front half of the required mounting area N of the circuit board B becomes a mounting area M1 in which electronic components are mounted by the upstream electronic component mounting machine 1a, and the electronic components are mounted in this mounting area M1. .

Next, after the electronic parts mounting machine 1a on the upstream side finishes mounting the electronic parts on the mounting area M1, the circuit board B is carried out to the board transfer unit 6 of the electronic parts mounting machine 1b on the downstream side. . Then, the board transfer unit 6 of the electronic component mounting machine 1b carries in the circuit board B and continues to carry it. Here, for example, when the sensor or the like (not shown) detects that the circuit board B has passed the upstream stopper 62, the circuit board B is stopped from being conveyed by the board conveying unit 6. Next, the circuit board B is retracted in the direction opposite to the transfer direction by the board transfer unit 6 and the stopper 62 is projected. As a result, the trailing edge of the circuit board B contacts the stopper 62 to stop the circuit board B, and the position of the circuit board B is fixed by the board transport unit 6 at this stop position.

As a result, the mounting area M2 of the rear half of the circuit board B falls within the mountable range P of the electronic component mounting machine 1b on the downstream side. That is, the distance from the front edge of the circuit board B at the fixed position of the circuit board B of the electronic component mounting machine 1a on the upstream side to the mountable range P of the electronic component mounting machine 1a, and the circuit on the electronic component mounting machine 1b on the downstream side. The electronic component mounting machine 1 on the upstream side and the downstream side is arranged so that the distance from the front edge of the circuit board B to the mountable range P of the electronic component mounting machine 1b at the fixed position of the board B is different.
The mounting areas M1 and M2 in the electronic component mounting machines 1a and 1b can be separated by making a difference between the fixed positions (stop positions) of the circuit boards at a and 1b.

Note that a stopper may be provided at a position where the front edge of the circuit board B shown in FIG. 3 abuts without retracting the circuit board B. Further, in FIG. 3, the front edge of the circuit board B is illustrated as projecting from the downstream end of the board transport unit 6 of the electronic component mounting machine 1b, and the stopper that abuts on the front edge of the circuit board B is The substrate transfer unit 6 is arranged so as to extend to the downstream side. Further, if the front edge of the circuit board B has a size that does not protrude from the downstream end of the board transfer unit 6, the stopper that abuts the front edge of the circuit board B is the board transfer unit 6.
It is located within the range of.

Next, in the electronic component mounting machine 1b, electronic components are mounted in the mounting area M2. Then, after the electronic components are mounted, the circuit board B is mounted on the board transfer unit 6
Then, the solder is melted in the reflow furnace in the next step, and the mounted electronic component and the circuit board B are connected to each other. In addition, in FIGS. 2 and 3, in order to facilitate understanding,
When the circuit board B is fixed to one of the electronic component mounting machines 1a and 1b, the circuit board B is not fixed to the other electronic component mounting machine 1a and 1b. The circuit board B is driven by the electronic component mounting machine 1a on the upstream side.
While the electronic components are being mounted in the mounting area M1 of the circuit board B, the mounting area M2 of the circuit board B in which the electronic parts are already mounted in the mounting area M1 in the downstream electronic component mounting machine 1b.
Electronic components are mounted on.

Then, all the electronic component mounting machines 1a, 1b
When the mounting of the electronic components is completed, the upstream electronic component mounting machine 1a carries out the circuit board B on which the mounting is completed and carries in the circuit board B from the previous process, and the electronic component mounting machine on the downstream side is carried out. 1b carries out the circuit board B which has been mounted, and at the same time, the circuit board B from the electronic component mounting machine 1a on the upstream side.
Bring in.

In this way, the electronic component mounting machines 1a, 1b
Then, at the same time, when electronic components are mounted in different mounting areas M1 and M2 of different circuit boards B, by making the working time required for mounting the electronic components in the respective electronic component mounting machines 1a and 1b substantially equal, The working time can be shortened. Therefore, each electronic component mounting machine 1
Electronic components to be mounted on the circuit board B are allocated to a and 1b so that the work times are substantially equal to each other. At this time, the areas of the mounting regions M1 and M2 in the electronic component mounting machines 1a and 1b may be different in order to make the working time the same.

According to the electronic component mounting system as described above, when the work efficiency is improved by using the plurality of electronic component mounting machines 1a, 1b, each of the electronic component mounting systems is controlled in order to prevent an increase in the occupied area. By reducing the size of the electronic component mounting machines 1a and 1b, it is possible to prevent the maximum size of the circuit board B on which the electronic components can be mounted from decreasing. As shown by broken lines in FIG. 2 and FIG. 3, at least one electronic component mounting machine 1a of each electronic component mounting machine 1a, 1b,
A plurality of head units 3 may be arranged on 1b side by side along the transport direction. That is, a plurality (two) of head units 3 may be attached to the X-axis frame 42. By doing so, the work efficiency can be further improved.

Next, an electronic component mounting system according to the second embodiment of the present invention will be described with reference to FIGS. 4 and 5. The basic device configuration in the electronic component mounting system of the second form is the same as that of the first form, and the basic configuration of the electronic component mounting machine 1 (1c, 1d) used is also the same as that of the first form.
Detailed description of those components will be omitted.

The width of the largest size circuit board B that can be carried by the board carrying unit 6 of the first embodiment, which is orthogonal to the carrying direction, is slightly larger than the mountable range P. The width of the largest size circuit board that can be carried by the board carrying unit 6 of the electronic component mounting machines 1c and 1d in the embodiment is considerably larger than the mountable range P, for example, 1.5 times or more. It is big. Further, in the board transfer unit 6 of the second embodiment, the stopper 65 that stops the transfer of the circuit board B is only the one that contacts the front edge of the circuit board B and stops the circuit board B. In addition, the stopper 65 is configured to be retractable in the conveyance path of the circuit board B. In addition, in the electronic component mounting machines 1c and 1d of the second embodiment, the holder 11 for mounting the component supply device 5 is provided only outside the one guide member 61 of the substrate transport unit 6, and the electronic component on the upstream side is provided. The mounting machine 1c and the electronic component mounting machine 1d on the downstream side are arranged such that the holders 11 are arranged on the opposite sides of the substrate transport unit 6 in between.

The upstream electronic component mounting machine 1c has a mountable range P mainly on the left side of the substrate transfer unit 6 in the direction of transfer of the circuit board B indicated by the arrow A, and the downstream side The electronic component mounting machine 1d has a mountable range P in a portion on the right side of the substrate transport unit 6 in the transport direction. Therefore, in the electronic component mounting machine 1c on the one hand, the left half of the mounting required area N of the circuit board B in the carrying direction is the mountable range P, and the other electronic component mounting machine 1c.
As for d, the mountable range P is substantially the right half of the required mounting area N of the circuit board B in the carrying direction. Therefore,
The mountable range P of the two electronic component mounting machines 1c and 1d is
When corresponding to the circuit board B, they are arranged side by side in a direction orthogonal to the transport direction. Further, the mountable ranges P of the two electronic component mounting machines 1c and 1d are arranged so as to partially overlap each other when they are made to correspond to each other on the circuit board B, but are arranged so as not to overlap. Is also good.

The two electronic component mounting machines 1c and 1d
With the arrangement as described above, the holder 1
It is possible to widen the width of the substrate transfer unit 6 as compared with the electronic component mounting machine provided with two 1. In addition, the positions of the holders 11 of the two electronic component mounting machines 1c and 1d are arranged to the left and right, and the mountable range P of the two electronic component mounting machines 1c and 1d is the component supply device 5 and the circuit board. In order to shorten the transfer time of the electronic component with the B, it is arranged close to the holder 11 (component supply device 5).

Next, in the electronic component mounting method using the electronic component mounting system of the second embodiment, a mounting method of electronic components different from the first embodiment will be described. Similar to the case of the first embodiment, the circuit board B is carried by the board carrying unit 6 from the previous step to the upstream electronic component mounting machine 1c. Then, the circuit board B contacts the protruding stopper 65, and the circuit board B stops at a predetermined stop position. At this time, a region slightly wider than the left half of the mounting required region N of the circuit board B (a region where mounting regions M3 and M4 described later as shown in FIG. 5 are combined) is within the mountable range of the electronic component mounting machine 1c. It is like this. In this state, the electronic components are mounted by the electronic component mounting machine 1c, and the circuit board B is placed within the range where the required mounting area N of the circuit board B and the mountable range P overlap each other.
The electronic components are mounted in the mounting area M3 which is slightly larger than the left half of the above.

Next, the board transfer unit 6 of the electronic component mounting machine 1c to the board transfer unit 6 of the electronic component mounting machine 1d.
The circuit board B is conveyed to the circuit board B, and the circuit board B is stopped in the electronic component mounting machine 1d on the downstream side, as in the case described above.
At this time, a region slightly wider than the right half of the required mounting region N of the circuit board B is included in the mountable range of the electronic component mounting machine 1d. By doing so, the electronic parts mounting machines 1c and 1d are different in fixed position of the board so that the distance from the predetermined side edge (right side edge or left side edge) of the board to the mountable range P is different. Is attached.
In this state, the electronic components are mounted by the electronic component mounting machine 1d, and within the range in which the required mounting area N of the circuit board B and the mountable range P overlap each other, the mounting is slightly larger than the left half of the circuit board B. Electronic components are mounted in the area M4.

Next, a plurality of electronic component mounting machines 1c, 1d
Thus, the circuit board B on which the electronic component is mounted is carried out to the next step. In the electronic component mounting system of the second embodiment as described above, as in the first embodiment, when a plurality of electronic component mounting machines are used to increase production efficiency, a small electronic component mounting machine 1c, By using 1d, it is possible to prevent the circuit board on which the electronic component can be mounted from being downsized.

Further, the second mode can be applied to the circuit board B having a wide width in the direction orthogonal to the carrying direction. In order to deal with the circuit board B having a large width in the direction orthogonal to the transfer direction, it is necessary to make the width of the board transfer unit 6 wide, but the width of the board transfer unit 6 is wide. However, the electronic component mounting machines 1c and 1d do not necessarily increase in size. For example, by disposing the component supply device 5 only on one side as described above, the electronic component mounting machines 1c and 1d can be installed. The width of the substrate transfer unit 6 can be increased with the size reduced.

In addition, by arranging the component supply devices in the upstream electronic component mounting machine 1c and the downstream electronic component mounting machine 1d in reverse, the two electronic component mounting machines 1c and 1d are used for the circuit board B. It is possible to supply electronic components to the areas near the component supply device 5 of the circuit board B when the components are mounted by dividing the required mounting area N into the left and right, and the component supply device 5 may be provided on only one side. It is possible to efficiently carry the electronic components from the component supply device 5 onto the circuit board B by the head unit 3.

Also in the second embodiment, while the electronic components are mounted on the circuit board B by the upstream electronic component mounting machine 1c, in the downstream electronic component mounting machine 1d,
At the previous stage, the electronic component is mounted on the circuit board B on which the electronic component is already mounted by the electronic component mounting machine 1c. Therefore, by allocating the electronic components to be mounted in each of the electronic component mounting machines 1c and 1d in advance so that the time required for mounting in the plurality of electronic component mounting machines 1c and 1d is substantially equal, As in the case, work efficiency can be improved. At this time, in order to adjust the working time in the two electronic component mounting machines 1c and 1d, the mounting areas M3 and M4 may be adjusted to have different areas. Further, when electronic components are mounted on the mounting areas M3 and M4 whose positions are different in the direction orthogonal to the transport direction of the circuit board B, the circuit board B is transported along the direction orthogonal to the transport direction while the circuit board B is transported. It may be configured to shift.

Next, with reference to FIGS. 6A and 6B, an electronic component mounting machine 1e according to the third embodiment of the present invention will be described. The third embodiment of the present invention is not the electronic component mounting system but the invention of the electronic component mounting machine 1e used in the electronic component mounting system. However, as the electronic component mounting system of the present invention described above, It may be used for a well-known electronic component mounting system.

The electronic component mounting machine 1 used here is also used.
The configuration of e is the same as that of the electronic component mounting machines 1a and 1b described in the first embodiment except for the mounting method of the electronic component, and thus detailed description of the configuration is omitted. A method of mounting electronic components by the electronic component mounting machine 1e will be described.

In the third embodiment, as shown in FIG. 6 (A), in the electronic component mounting machine 1e, the front edge of the circuit board B already transported by the substrate transport unit 6 from the previous step along the transport direction is already formed. By making contact with the projected stopper 63, the stop position of the circuit board B along the carrying direction is determined, and the circuit board B is fixed by the board carrying unit 6 at the stop position. At this time, mainly the front side portion of the mounting required area N of the circuit board B falls within the mountable range of the upstream electronic component mounting machine 1e. And the circuit board B
A region slightly larger than the front half of the mounting required region N becomes a mounting region M1 where electronic components are mounted by the upstream electronic component mounting machine 1e, and the electronic components are mounted in this mounting region M1.

Next, after the mounting of the electronic component on the mounting area M1 is completed, the circuit board B is transported to the downstream side. Here, for example, by a sensor or the like not shown, the circuit board B
When it is detected that the voltage exceeds the stopper 62 on the upstream side, the conveyance of the circuit board B by the substrate conveyance unit 6 is stopped, and then the circuit board B is retracted in the opposite direction to the conveyance direction by the substrate conveyance unit 6. , The stopper 62 is projected. As a result, the rear edge of the circuit board B is stopped by the stopper 62.
The circuit board B is stopped by making contact with the., And the position of the circuit board B is fixed by the board transfer unit 6 at this stop position.

As a result, the mounting area M2 of the rear half of the circuit board B falls within the mountable range P of the electronic component mounting machine 1e. Next, in the electronic component mounting machine 1e, electronic components are mounted in the mounting area M2. By the above operation, the electronic component mounting machine 1e can mount the electronic component on the circuit board B having the mounting required area N (area where the mounting areas M1 and M2 are combined) larger than the mountable range P thereof. In this way, one electronic component mounting machine 1e shifts the fixing position of the circuit board B to mount electronic components in different mounting areas M1 and M2 (they may partially overlap).
By separately performing the above, the electronic components can be mounted on the large circuit board B even with the small electronic component mounting machine 1e.

Further, by using the board transfer unit 6 as described above to change the fixed position of the circuit board B, the circuit board B is newly moved to change the fixed position of the circuit board B. It is not necessary to provide means for this.
The substrate transfer unit 6 must be provided with a plurality of stoppers 62 and 63 or a stopper that can be moved largely beyond the range of fine adjustment in order to change the fixed position. Further, when the fixed position of the circuit board B is changed by the board transfer unit 6, the fixed position of the circuit board B can be changed only in the direction along the transfer direction. If the means for moving the circuit board B to change the fixed position of the circuit board B along a direction other than the carrying direction is provided, the fixed position can be changed in a direction other than the carrying direction.

The present invention is not limited to the above-mentioned embodiment, and for example, as a modification shown in FIG.
The electronic components may be mounted on the circuit board B by combining the operation of the electronic component mounting machines 1a and 1b in the first embodiment and the operation of the electronic component mounting machines 1c and 1d in the first embodiment. For example, the electronic component mounting machine 1b of the first mode, the electronic component mounting machine 1c of the second mode, and the electronic component mounting machine 1d of the second mode are arranged and connected in this order.

Then, the electronic component mounting machine 1b of the first embodiment mounts the electronic component on the mounting area M5 on the rear side of the circuit board B indicated by the arrow A in the carrying direction. Next, the circuit board B is transported, and the electronic component mounting machine 1c of the second example mounts the electronic component on the mounting area M6 on the left side on the front side of the circuit board B in the transport direction. Next, transport the circuit board B,
The electronic component mounting machine 1d of the second example may mount the electronic component on the mounting area M7 on the right side of the circuit board B on the front side in the carrying direction.

As a modification, for example, two electronic component mounting machines 1e of the third embodiment may be used in combination. As shown in FIG. 8, in the first electronic component mounting machine 1e, the mounting position of the circuit board B is shifted to mount the electronic components, whereby four mounting areas M8 arranged in the transport direction on the circuit board B are arranged. ~ Mounting area M8 of M11
And electronic components are mounted on M9. Next, the circuit board B is transported to the second electronic component mounting machine 1e, and the mounting area M10
Electronic components may be mounted on the mounting area M11. Further, when the mounting areas M8 to M11 are divided as shown in FIG. 8, at least one of the electronic component mounting machines 1e described above is replaced with two electronic component mounting machines 1a, 1a of the first example.
b may be used.

Also in these modified examples, in each electronic component mounting machine 1, by mounting electronic components on different circuit boards B at the same time, production efficiency can be improved. It is preferable to distribute the electronic components mounted by each electronic component mounting machine so that the work time required for mounting the electronic components of the component mounting machine becomes substantially equal,
By doing so, the production efficiency can be further improved.

Further, in the first to third forms and the modified examples,
The order of mounting electronic components on the mounting areas M1 to M11 is as follows.
This is optional and can be changed by changing the arrangement order of the electronic component mounting machine 1 that mounts the electronic components in the respective mounting areas M1 to M11. Depending on the arrangement order of the electronic component mounting machine 1, there may be a difference in space efficiency or production efficiency based on the shape of the circuit board B, etc. In consideration of these efficiencies, the mounting areas M1 to M11 It is preferable that the order of mounting the electronic components on the board and the arrangement of the electronic component mounting machine 1 are determined.

[0064]

According to the first aspect of the present invention, it is possible to mount electronic components on a large board even in an electronic component mounting system including a plurality of small electronic component mounting machines.

According to the second aspect of the invention, the same effect as the invention of the first aspect can be obtained by changing the stop position of the substrate conveyed to the substrate conveying means for each electronic component mounting machine. Can

According to the third aspect of the present invention, in addition to the effect of the first or second aspect of the present invention, by mounting the mounting parts by a plurality of head units, the production efficiency can be further improved. .

According to the invention described in claim 4, while having the same operation and effect as the invention described in claim 1, by mounting the electronic component by shifting the position of the substrate in at least one electronic component mounting machine. It is possible to widen the mountable range in one electronic component mounting machine.

According to the fifth aspect of the present invention, each electronic component mounting machine simultaneously mounts the electronic component on the corresponding area of the substrate, and each electronic component mounting machine mounts the electronic component on the area. When finished, each of them is carried out to the next electronic component mounting machine, or if it is carried out to the next process of electronic component mounting, each electronic component mounting machine mounts electronic components almost at the same time. After finishing, it is possible to carry out the board at the same time as the board is carried in and to mount the board on the next board, and to mount the electronic part on the next board. it can.

According to the sixth aspect of the invention, even in a small-sized electronic component mounting machine, the electronic components can be mounted on a large substrate by shifting the positions of the substrates and mounting the electronic components.

[Brief description of drawings]

FIG. 1 is a perspective view showing an electronic component mounting machine according to the present embodiment.

FIG. 2 is a plan view showing two electronic component mounting machines used in the electronic component mounting system of the first embodiment of the present embodiment.

FIG. 3 is a plan view showing two electronic component mounting machines used in the electronic component mounting system of the first embodiment.

FIG. 4 is a plan view showing two electronic component mounting machines used in the electronic component mounting system of the second embodiment of the present embodiment.

FIG. 5 is a plan view showing two electronic component mounting machines used in the electronic component mounting system of the second embodiment.

FIG. 6 is a plan view showing an electronic component mounting machine of a third mode of the present embodiment.

FIG. 7 is a drawing showing a mounting area of a fixed substrate for explaining a modified example of the electronic component mounting system of the present embodiment.

FIG. 8 is a drawing showing a mounting area of a fixed substrate for explaining a modified example of the electronic component mounting system of the present embodiment.

[Explanation of symbols]

B circuit board (board) 1 Electronic component mounting machine 3 head unit (head) 4 XY drive unit (moving means) 6 Substrate transport unit (substrate transport means)

Claims (6)

[Claims] 1. An electronic component mounting system comprising a plurality of electronic component mounting machines for mounting mounting components such as electronic components on a substrate, and mounting the electronic components on the substrate by the plurality of electronic component mounting machines, The electronic component mounting machine detachably holds the mounted component, conveys the mounted component onto the substrate, and mounts the mounted component on the substrate; and a head unit that mounts the mounted component on the substrate. The apparatus further comprises a moving means for moving the head unit, a board carrying means for loading and unloading the board and fixing the board at a predetermined position for mounting the mounting component, and mounting the mounting component on the board. The required mounting area is made wider than the mountable range in which the mounting component can be mounted by the head unit that is moved by the moving unit, and each electronic component mounting machine The fixed position of the board is made different so that the distance from the predetermined side edge of the board to the mountable range is different, and each electronic component mounting machine is determined by the fixed position of the board and The mounting components are designed to be mounted within the mountable range corresponding to a part of the required area on the board, and the mountable range of each electronic component mounting machine is matched to correspond to the board. The electronic component mounting system is characterized in that the above-mentioned region overlaps the entire mounting required region of the substrate. 2. The electronic component mounting system according to claim 1, wherein the mountable range is set for each electronic component mounting machine when the substrate transported by the substrate transport means is stopped and the substrate is fixed. An electronic component mounting system, characterized in that by making the stop position of the substrate different with respect to, the fixing position of the substrate is made different along the transport direction of the substrate. 3. The electronic component mounting system according to claim 1 or 2, wherein a plurality of the head units are arranged side by side along a transfer direction of the substrate. 4. An electronic component mounting system comprising a plurality of electronic component mounting machines for mounting mounting components such as electronic components on a substrate, and mounting the electronic components on the substrate by the plurality of electronic component mounting machines, The electronic component mounting machine detachably holds the mounted component, conveys the mounted component onto the substrate, and mounts the mounted component on the substrate; and a head unit that mounts the mounted component on the substrate. The apparatus further comprises a moving means for moving the head unit, a board carrying means for loading and unloading the board and fixing the board at a predetermined position for mounting the mounting component, and mounting the mounting component on the board. The required mounting area is made wider than the mountable range in which the mounting component can be mounted by the head unit that is moved by the moving unit, and each electronic component mounting machine The fixed position of the board is made different so that the distance from the predetermined side edge of the board to the mountable range is different, and each electronic component mounting machine is determined by the fixed position of the board and The mounting component is mounted within the mountable range corresponding to the substrate overlapping a part of the required area, and at least one electronic component mounting machine fixes the substrate at least one fixing position. The position of the mountable range on the board by the electronic component mounting machine is changed more than once, and the electronic parts are mounted for each mountable range changed on the board. The area where the mountable range of each electronic component mounting machine including the mounted mountable area is made to correspond on the board is overlapped with the entire mountable area of the board. An electronic component mounting system characterized in that 5. The electronic component mounting system according to any one of claims 1 to 4, wherein each electronic component is mounted so that the substrate transfer means of each electronic component mounting machine continuously transfers the substrate. Electronic component mounting, in which the mounting components to be mounted in each electronic component mounting machine are determined so that the mounting time of the electronic components in each electronic component mounting machine is almost the same as the machines are connected. system. 6. A head unit for removably holding a mounting component such as an electronic component and transporting the mounting component onto a substrate to mount the mounting component on the substrate, and a mounting unit for mounting the mounting component on the substrate. The apparatus further comprises a moving means for moving the head unit, a board carrying means for loading and unloading the board and fixing the board at a predetermined position for mounting the mounting component, and mounting the mounting component on the board. The necessary mounting required area is made wider than the mountable range in which the mounting component can be mounted by the head unit that is moved by the moving unit, and the fixing position of the substrate is changed at least once or more, and the mounting position on the substrate is changed. The position of the mountable range is changed so that electronic components are mounted for each changed mountable range. Region to correspond to the circuit board Te is, the electronic component mounting machine, characterized in that is adapted to overlap with the entire area of the mounting space required by the substrate.