JP2002353687A - Method and program for supporting board data preparation - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ease input operation of numerical values corresponding to input items concerning a board. SOLUTION: A computation processing part indicates an input screen in accordance with this program. On the input screen, a board pattern 44 showing a board is graphically indicated in a board drawing 43. Furthermore, items to be inputted such as layout offset of board size or external dimension of board, etc., are indicated corresponding to the board pattern 44, by arrow marks 47 and 48 or outgoing lines, in the board drawing 43.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board data creation supporting method for supporting creation of board data and a program for realizing the method.

[0002]

2. Description of the Related Art Conventionally, an electronic component mounting apparatus for mounting an electronic component on a surface of a substrate includes a component supply device for supplying the electronic component, a substrate transport device for transporting the substrate, and a head unit for sucking and holding the electronic component. XY moving device for moving the head unit, and a control device for controlling each unit. In order for the control device to control each unit and for the electronic component mounting device to mount the board on the electronic component, the operator needs to input board data relating to the shape and size of the board to the control device in advance.

[0003] For this purpose, the control device displays an input screen for inputting board data. FIG. 9 shows an example of a conventional input screen. As shown in FIG. 9, a dimension setting section 90 for allowing an operator to input board data is displayed on an input screen. Each input item is indicated by characters in the dimension setting section 90, and the operator inputs numerical values (coordinate values and lengths) corresponding to each input item using a keyboard or the like.

[0004]

However, the definition of the input items may be unclear, and the operator may erroneously input the numerical values of the input items, which may cause confusion in the input operation of the operator. is there. In addition, since the way of setting the coordinate system changes depending on the board transfer direction and the reference direction, there is a problem that it is difficult to know where the coordinate values and lengths of the input items are on the board.

SUMMARY OF THE INVENTION It is an object of the present invention to facilitate input operation of numerical values corresponding to input items relating to a substrate.

[0006]

Means for Solving the Problems To solve the above problems, the invention described in claim 1 is, for example, shown in FIGS.
As shown in FIG. 6 and FIG. 6, the board data is input to an apparatus (electronic component mounting apparatus 1) that performs a given operation on the board (14) based on the board data. In a board data creation supporting method for supporting creation of a board, a board figure (board figure 44) is displayed on a display unit (display unit 28), and items to be input for the board are associated with the figure on the display unit. The method includes a step of displaying (step S5) and a step of storing data inputted for the item in the storage means (substrate data storage unit 21) as substrate data in association with the item (step S12).

A program according to a fourth aspect of the present invention displays a figure of a board (a board figure 44) on a computer (arithmetic processing unit 26), for example, as shown in FIGS. Means (display unit 28) for displaying the items to be input for the substrate in the display means in association with the figure (step S5), and associating the data input for the items with the items. Storage means (substrate data storage unit 2)
(1) and a means for storing (step S12).

According to the first or fourth aspect of the present invention, the items to be input are displayed corresponding to the figures on the board.
It becomes visually clear to an operator or the like which part or part of the substrate the item means. That is, even if the coordinate system is changed depending on the board transfer direction or the reference direction, the operator can grasp which coordinate value or length of the board is the item to be input. Then, an operator or the like inputs data on an item, but since the meaning and definition of the item are clarified by the graphic, the data can be easily input. Then, the data input for the item is stored in association with the item, so that the board data is created and the creation of the board data is supported. As described above, the meaning and definition of the item are easy to understand for the operator and the like, and the input data is stored as the board data in association with the item, so that the efficiency of creating the board data is improved. Note that the given operation is to mount an electronic component on a substrate, or to apply an application material such as an adhesive or solder to the substrate.

According to a second aspect of the present invention, as shown in FIG. 4, in the method of supporting board data creation according to the first aspect, when the data input for the item is incorrect, the input data is Is displayed on the display means to indicate that is incorrect (step S9).

According to the second aspect of the present invention, the fact that the input data is incorrect is displayed, so that it becomes clear to the operator or the like that the data was incorrectly input. Therefore, data input errors are extremely reduced, and an operator or the like can create accurate board data.

According to a third aspect of the present invention, as shown in FIG. 4, for example, in the board data creation supporting method according to the first or second aspect, the graphic is changed according to the data input for the item and re-executed. Step of displaying (Step S
9, step S10).

According to the third aspect of the present invention, the figure of the substrate is changed according to the input data.
If the operator enters the data incorrectly, an incorrect graphic will be displayed. Therefore, a mistake in data input becomes visually clear to the operator.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a specific embodiment of a substrate data creation supporting method according to the present invention will be described with reference to the drawings. However, the scope of the invention is not limited to the illustrated example.

First, an electronic component mounting apparatus 1 to which the present invention is applied will be described. As shown in FIG. 1, the electronic component mounting apparatus 1 includes a board transport positioning device 2 that transports the board 14 in the left-right direction (X direction) and positions the transported board 14 at a predetermined position, and a plurality of electronic components. A supply device 3 for storing the electronic components and supplying the electronic components; a suction nozzle 4 for sucking the electronic components supplied by the supply device 3 and releasing the suction on the substrate 14 to mount the electronic components on the substrate 14; A nozzle 4 is provided and a head unit 5 for vertically moving and rotating the suction nozzle 4 and recognizing the electronic component sucked by the suction nozzle 4, and between the positioned substrate 14 and the supply device 3. An XY moving device 13 (shown in FIG. 3) for horizontally moving the head unit 5;
4 includes a recognition camera 12 for recognizing a BOC mark 14a (shown in FIG. 2B) and a bad mark, a control device 6 for controlling the entire electronic component mounting apparatus 1, and the like.

Note that, as shown in FIG.
Is provided with a BOC mark 14a for position correction and a positioning hole 14b for positioning. In some cases, a bad mark indicating that no electronic component is mounted is written on the substrate 14.

As shown in FIGS. 2A and 2B, the substrate transfer / positioning device 2 includes a stopper unit 7 having a vertically movable stopper pin 7 for vertically moving the stopper pin 7, and a vertically movable stopper unit 8. A pin unit 10 having the pins 9 and moving the pins 9 up and down, and a substrate 14 in a left-right direction (X direction).
And a substrate transport device 11 for transporting the substrate. When the substrate 14 is transported with the stopper pins 7 raised, the substrate 14 stops. Then, the pins 9 are raised, and the pins 9 are inserted into the positioning holes 14b, whereby the substrate 14 is positioned.

As shown in FIG. 1 and FIG.
Is a board data storage unit 21 that stores data such as the external dimensions of the board, data serving as a board mounting reference position (board data), and data on the position of electronic components mounted on the board and the type and number of electronic components. Mounting data storage unit 2 for storing data, data (mounting data) in a range for mounting electronic components, and the like.
2, a component data storage unit 23 that stores data and the like (component data) referred to for recognizing the electronic component sucked by the suction nozzle 4, data of a position where the suction nozzle 4 should be sucked, and a suction nozzle 4 and a suction data storage unit 24 for storing suction force data and the like (suction data);
And the substrate transfer device 11), the supply device 3, the suction nozzle 4,
A drive control unit 25 that performs drive control on the head unit 5 and the XY moving device 13; an arithmetic processing unit 26; an input unit 27 including a keyboard and a mouse; a display unit 28 such as a monitor; Program storage unit 2 for storing arithmetic processing program 30 executable by processing unit 26
9 and the like.

Each of the drive control unit 25 and the arithmetic processing unit 26 includes a CPU for performing arithmetic processing, a RAM serving as a work area of the CPU, and the like. Board data storage unit 2
1. The mounting data storage unit 22, the component data storage unit 23, the suction data storage unit 24, and the program storage unit 29 are configured by a storage medium. Board data storage unit 21,
The mounting data storage unit 22, the component data storage unit 23, the suction data storage unit 24, and the program storage unit 29
It may be a storage area of one storage medium or separate storage media.

The arithmetic processing unit 26 includes a program storage unit 29
The arithmetic processing program 30 is read from the CPU, and various processes can be performed according to the arithmetic processing program 30. That is, the arithmetic processing unit 26 that has executed the arithmetic processing program 30 can cause the display unit 28 to display a data input screen or the like.
Further, the arithmetic processing unit 26 can store the board data based on the input signal from the input unit 27 in the board data storage unit 21 and store the mounting data based on the input signal in the mounting data storage unit 22. Thus, component data based on the input signal can be stored in the component data storage unit 23, and suction data based on the input signal can be stored in the suction data storage unit 24. The arithmetic processing unit 26
Are the board data stored in the board data storage unit 21, the mounting data stored in the mounting data storage unit 22, the component data stored in the component data storage unit 23, and the suction data stored in the suction data storage unit 24. By referring to the data, a production program including each data can be generated, and this production program can be output to the drive control unit 25.

The drive control unit 25 to which the production program has been input
According to the production program, the substrate transfer positioning device 2, the supply device 3, the suction nozzle 4, the head unit 5, and the XY
It controls the moving device 13. That is, the drive control unit 25 causes the substrate transport / positioning device 2 to transport the substrate 14 and
Position 4 Thereafter, the drive control unit 25 moves the head unit 5 to a predetermined position on the supply device 3 and causes the suction nozzle 4 to suck the electronic component. Thereafter, the drive control unit 2
5 moves the head unit 5 to a predetermined position on the substrate 14,
By releasing the suction state of the suction nozzle 4, the electronic component is mounted on the board 14. Since the control of the drive control unit 25 is a well-known technique, a detailed description is omitted.

In the electronic component mounting apparatus 1, in order to mount electronic components on the board 14 according to a production program including the board data, the board data is created in advance, and the created board data is sent to the electronic component mounting apparatus 1 in advance. Must be entered. A feature of the present invention is to support creation of board data by displaying a board graphic on an input screen displayed on the display unit 28 at the time of board data input operation. Hereinafter, the processing flow of the arithmetic processing unit 26, the input operation of the substrate data, and the input screen at the time of the input operation of the substrate data will be described in detail.

FIG. 4 shows the flow of processing of the arithmetic processing unit 26 according to the arithmetic processing program 30 when the operator inputs board data to the control device 6 (arithmetic processing unit 26). First, the arithmetic processing unit 26 checks the mechanical origin by feeding back the mechanical origin from the substrate transfer positioning device 2 via the drive control unit 25 (step S1). That is, in FIG. 1 or FIG. 2, the arithmetic processing unit 26 determines whether or not the mechanical origin is on the near side or the far side of the substrate transfer device 11. In the present embodiment, a description will be given assuming that the mechanical origin is set on the front side of the substrate transfer device 11.

Next, the arithmetic processing section 26 feeds back the transfer direction from the substrate transfer device 11 and checks the transfer direction (step S2). That is, FIG. 1 or FIG.
Whether the transport direction is rightward or leftward in
The arithmetic processing unit 26 determines.

Next, the arithmetic processing section 26 displays a basic setting screen, which is displayed when the basic setting of the substrate is input, on the display section 28.
Display with. FIG. 5 shows an example of the basic setting screen displayed on the display unit 28. As shown in FIG. 5, on the basic setting screen, an ID input field 31 for allowing the operator to input a board ID, a selection field 32 for allowing the operator to select a positioning method, A selection field 33 for selecting a configuration, a selection field 34 for allowing the operator to select a BOC mark type, a selection field 35 for allowing the operator to select whether or not there is a bad mark, Button 36
Is displayed.

In the ID input box 31, a board ID to be associated with each board data can be input. In the selection field 32, one of “positioning hole reference” and “outer shape reference” can be selected. The "positioning hole reference" means that the substrate 9 is positioned by inserting the pins 9 into the positioning holes 14b of the substrate 14 as described above, and the positioning hole 14b is used as a reference. The “outer shape reference” is based on the outer shape of the positioned substrate 14.

In the selection field 33, one of "single-panning", "multi-panning matrix", and "multi-panning non-matrix" can be selected. “Single-panning” means that one circuit is configured for one substrate. The “multi-pan matrix” means that a plurality of circuits are formed on one substrate, and the plurality of circuits are arranged in a matrix on the substrate. "Multi-panel non-matrix" means that a plurality of circuits are formed on one substrate and the plurality of circuits are not arranged in a matrix.

In the selection field 34, one of "do not use", "use the mark of the board", and "use the mark of each circuit" can be selected. "Do not use" means that the displacement of the substrate is not corrected using the BOC mark.
“Using the mark of the substrate” means that the displacement of the substrate is corrected using the BOC mark. "Using the mark for each circuit" means that if the configuration of the substrate is a multi-panel matrix or a non-multi-panel matrix, a BOC mark is written for each circuit on one substrate, and the circuit is printed using the BOC mark for each circuit. That is, the displacement of the substrate is corrected every time.

In the selection box 35, one of "do not use" and "use" can be selected. "Use" means that when a bad mark is marked on a circuit of a substrate (especially a multi-matrix matrix substrate or a multi-matrix non-matrix substrate), when the recognition camera 12 recognizes the bad mark, the circuit includes an electronic component. Is not implemented. "Do not use" means that when a bad mark is written on a circuit on the board, even if the recognition camera 12 recognizes the bad mark, an electronic component is mounted on the circuit.

The arithmetic processing section 26 displaying the basic setting screen as described above waits for the setting button 36 to be clicked (step S4). Here, the operator operates the input unit 27.
After selecting or inputting an item corresponding to each column on this basic setting screen by clicking, the input is completed when the setting button 36 is clicked.
Obtains, as data, selection contents or input contents of items corresponding to the respective fields via the input unit 27 (step S).
4: Yes).

When the setting button 36 is clicked, the arithmetic processing unit 26 displays an input screen, which is displayed when inputting data of the dimensions of the substrate, on the display unit 28 (step S5). FIG. 6 shows an example of an input screen displayed on the display unit 28. As shown in FIG. 6, the input screen includes
A basic setting display section 41 on which the contents selected and input on the basic setting screen are displayed, a dimension setting section 42 for allowing an operator to input board dimension data and the like, and a plan view of the board are shown. The board drawing section 43 is displayed.

In the dimension setting section 42, items to be input are displayed according to the contents selected and input on the basic setting screen. In Fig. 6, the positioning method is "positioning hole reference".
The case where the substrate configuration is “single-pane” and the BOC type is “use substrate mark” is shown. In this case, in the dimension setting unit 42, the item of “board external dimension”, the item of “positioning hole position”, the item of “board dimension layout offset”, and the “BOC mark position No. 1”
To "BOC mark position No. 3" can be input. Note that “BOC mark position No. 1” to “B
OC mark position No. For item 3), besides the position,
The diameter of the BOC mark can also be entered.

At the center of the board drawing section 43, a rectangular board figure 44, which is a figure of the board, is shown in a plan view. Further, a stopper figure 45 which is a figure of a stopper pin
Are shown on the right side of the substrate graphic 44,
And the stopper graphic 45 are displayed in contact with each other.
In addition, "single-chamfering" is displayed on the upper left of the board drawing section 43, and the mechanical origin is in front of the board drawing section 4.
3 is displayed at the upper right of the screen as a “front reference”. Also,
A coordinate axis 46 representing the XY directions is displayed at the lower left of the board drawing unit 43. In addition, an arrow indicating the substrate transfer direction is displayed above the substrate graphic 44.

Further, each item to be input is displayed corresponding to each portion of the board graphic 44 shown in the figure. That is,
In the item of “substrate outer dimensions”, an arrow 47 indicating the length of the substrate in the X direction and “substrate dimension X” are displayed on the upper side of the substrate graphic 44, and an arrow indicating the length of the substrate in the Y direction. 48 and “substrate dimension Y” are displayed on the left side of the substrate graphic 44. In the item of “board size layout offset”, the lower right coordinate value of the board with respect to the “origin position” is indicated by adding a leader line to the lower right corner of the board graphic 44. If the mechanical origin is on the far side and the transport direction is on the right, a leader line is attached to the upper right corner of the board graphic 44 in the item of “board size layout offset”. When the mechanical origin is on the near side and the transport direction is the left direction, in the item of “board size layout offset”, a drawing line is attached to the lower left corner of the board figure 44, and the stopper figure 45 It is displayed adjacent to the left side of the figure 44. When the mechanical origin is on the back side and the transport direction is on the left, in the item of “board size layout offset”, a leader line is attached to the upper left corner of the board figure 44, and the stopper figure 45 It is displayed adjacent to the left side of the figure 44.

Further, “BOC mark position No. 1” to
In the item of “BOC mark position No. 3”, the BO
The position of the BOC mark is indicated by the drawing line of the C mark being attached to the substrate figure 44. Also,
In the item of “positioning hole position”, the outline position of the positioning hole is shown in the substrate graphic 44 by drawing out the lead of the positioning hole to the substrate graphic 44.
In the board drawing section 43, “(,)” or “()” is displayed adjacent to each item to be input, and the numerical value of each item is input to “(,)” and “()”. can do. Note that the X coordinate of the “origin position” is zero and the Y coordinate is also set to zero, and the mounting position of the electronic component is determined based on the “origin position”.

The arithmetic processing unit 26 displaying the input screen as described above waits for data of each item to be input (step S6). Then, the operator operates the input unit 27 to input data of each item while referring to the board drawing unit 43. At this time, data may be input by the dimension setting unit 42 or data may be input by the board drawing unit 43. After the operator has entered the data for each item,
The arithmetic processing unit 26 acquires input data of each item via the input unit 27 (Step S6: Yes). Then
The arithmetic processing unit 26 performs a coordinate calculation based on the input data (step S7). For example, the arithmetic processing unit 26
Calculates the coordinate values of the four corners of the board graphic 44 based on the input coordinate values of the board dimension layout offset (based on the “origin position”) and the board outer dimensions. That is, the coordinate value of the lower right corner of the board graphic 44 is the coordinate value of the board dimension layout offset. The X coordinate value of the upper right corner of the board graphic 44 is the X coordinate value of the board dimension layout offset, and the Y coordinate value of the upper right corner is the value obtained by adding the board dimension Y to the Y coordinate value of the board dimension layout offset. . The X coordinate value of the upper left corner of the board graphic 44 is a value obtained by subtracting the board dimension X from the X coordinate value of the board dimension layout offset, and the Y coordinate value of the upper left corner is the board coordinate of the board dimension layout offset. This is a value obtained by adding the dimension Y. The X coordinate value of the lower left corner of the board graphic 44 is a value obtained by subtracting the board dimension X from the X coordinate value of the board dimension layout offset, and the Y coordinate value of the lower left corner is the Y coordinate value of the board dimension layout offset. .

Next, the arithmetic processing unit 26 determines whether the input data of each item is correct or incorrect (step S8). For example, “BOC mark position No. 1” to
Regarding the item of “BOC mark position No. 3”, the arithmetic processing unit 26 sets the coordinates of the four corners of the board graphic 44 and the BOC
When the BOC mark is located within the board graphic 44, the input data is determined to be correct, and the BOC mark is compared with the coordinate value of the mark (based on the “origin position” and the input data). If the mark is located outside the board graphic 44, it is determined that the input data is incorrect. Also, for example, for the item of “board external dimensions”, the arithmetic processing unit 2
6 compares the coordinate values of the four corners of the board graphic 44 with the mounting data stored in the mounting data storage unit 22, and if the mounting position of the electronic component is located within the board graphic 44, the input data is correct. If the electronic component mounting position is located outside the board graphic 44, it is determined that the input data is incorrect. In addition, for example, for the items of “board size layout offset” and “board outer size”, the arithmetic processing unit 26 refers to the coordinate values of the four corners of the board shape 44 and sets the “origin position” in the board shape 44. If it is located, it is determined that the input data is correct, and if the “origin position” is located outside the board graphic 44, it is determined that the input data is incorrect.

If the data of each input item is correct, the processing of the arithmetic processing unit 26 proceeds to step S10, and if it is incorrect, the processing of the arithmetic processing unit 26 proceeds to step S9. In step S10, the arithmetic processing unit 26 sets the board drawing unit 4 in accordance with the input data of each item.
3 is updated, and the input screen is displayed again on the display unit 28. That is, the arithmetic processing unit 26 displays the board figure 44 having a size corresponding to the input data of the “board outside dimension”,
"Board dimensions layout offset" and "Board dimensions"
Is displayed with the origin position aligned with the position based on the input data of "BOC mark position No. 1" to "BOC mark position No. 3". .

In step S9, the arithmetic processing unit 26
Updates the display contents of the board drawing section 43 in accordance with the input data of each item, and redisplays the input screen on the display section 28. Here, the arithmetic processing unit 26 displays an error for an erroneous input data item (displays that the item is erroneous). For example, in the board drawing section 43, the input data (numeric values in “()” and “(,)”) and the items of the input data are blinked or displayed in red.

After step S9, the process of the arithmetic processing unit 26 returns to step S6, and steps S6 to S9 are repeated until the input data is correct. When the input data is correct, the process proceeds to step S10 as described above.

Then, after step S10, the arithmetic processing unit 2
The process of Step 6 proceeds to Step S11. In step S11, the arithmetic processing unit 26 determines whether data input for each item has been completed. Then, when the operator inputs the data input completion via the input unit 27 (Step S
11: Yes), and the processing of the arithmetic processing unit 26 proceeds to step S1.
The operator proceeds to step 2 and the operator informs the input section 27 that data is to be re-input.
(Step S11: No), the process of the arithmetic processing unit 26 returns to Step S6.

In step S12, the arithmetic processing unit 26
Stores input data corresponding to each item in the board data storage unit 21 as board data. Thereby, substrate data is created. Thereafter, the processing of the arithmetic processing unit 26 ends.

The positioning method is "positioning hole reference".
And the board configuration is a “multi-pan matrix”, and B
When the OC type is “use mark for each circuit”, the input screen displayed in step S5 is shown in FIG. In this case, in the dimension setting unit 42, the item of “board outer dimension”, the item of “positioning hole position”, the item of “board size layout offset”, and the “BOC mark position N”
o. In addition to the items “1” to “BOC mark position No. 3”, an item of “circuit outer dimensions”, an item of “circuit layout offset”, an item of “top circuit position”, an item of “number of circuit divisions”, and The item of "pitch between circuits" and the item of "bad mark position" can be input.

At the center of the board drawing section 43, a rectangular board figure 44 is displayed as in the input screen of FIG.
The board graphic 44 is divided and displayed in a matrix area, and a circuit is displayed in a rectangular shape in the divided area. As with the input screen of FIG. 6, each item to be input is displayed corresponding to each location of the illustrated board graphic 44. The operator, in the board drawing section 43,
The length of the substrate in the X direction, the length of the substrate in the Y direction, the coordinate value of the substrate dimension layout offset, and the coordinate value of the BOC mark can be input.

Further, in addition to these items, in the item of "circuit outer dimensions", an arrow indicating the length of the circuit in the X direction and "circuit size X" are displayed on the upper side of the circuit. Indicating the length in the Y direction of the arrow and "Circuit dimension Y"
Is displayed on the left side of the circuit, and the operator can input numerical values in the item of “circuit external dimensions”. Further, in the item of “circuit layout offset”,
The coordinates of the lower left corner of the circuit with respect to the "circuit origin position" are indicated by adding a leader line to the lower right corner of the circuit, and the operator can numerically enter the "circuit dimension layout offset" item. it can. In the item of “head circuit position”, the coordinate value of the lower left corner of the lower left circuit with respect to “origin position” is indicated by adding a leader line to the lower left corner of the lower left circuit. You can enter a numerical value for the item "Top circuit position". In the item of “inter-circuit pitch”, an arrow indicating the length in the X direction between “circuit origin positions” of adjacent circuits and “circuit dimension X” are displayed, and the X direction between “circuit origin positions” is displayed. Are displayed, and the operator can input a numerical value in the item of "pitch between circuits".

The positioning method is "positioning hole reference".
And the substrate configuration is "multi-plane non-matrix"
FIG. 8 shows an input screen displayed in step S5 when the BOC type is “use mark for each circuit”. In this case, in the dimension setting unit 42, the item of “board outer dimension”, the item of “positioning hole position”, the item of “board size layout offset”, and the “BOC mark position N”
o. 1 ”to“ BOC mark position No. 3 ”,“ Circuit external dimensions ”,“ Circuit layout offset ”,“ Pitch between circuits ”, and“ Bad mark position ” can do.

Further, on this input screen, a circuit setting section 49 for inputting data of the position and the rotation angle of each circuit to the operator is displayed. In the circuit setting section 49, an item of "circuit position" and an item of "circuit angle" of each circuit can be input.

At the center of the board drawing part 43, a rectangular board figure 44 is displayed as in the input screen of FIG.
The board graphic 44 is divided into regions and displayed.
The circuit is displayed in a rectangular shape in the divided area. As with the input screen of FIG. 6, each item to be input is displayed corresponding to each location of the illustrated board graphic 44. The operator can input the length of the board in the X direction, the length of the board in the Y direction, the coordinate value of the board dimension layout offset, and the coordinate value of the BOC mark in the board drawing unit 43.

Further, in addition to these items, in the item of "circuit outer dimensions", an arrow indicating the length of the circuit in the X direction and "circuit size X" are displayed on the upper side of the circuit. Indicating the length in the Y direction of the arrow and "Circuit dimension Y"
Is displayed on the left side of the circuit, and the operator can input numerical values in the item of “circuit external dimensions”. Further, in the item of “circuit layout offset”,
The coordinates of the reference corner of the circuit with respect to the “circuit origin position” of each circuit are indicated by adding a leader line to the corner of each circuit. Numerical values can be entered. In the item of “circuit position”, it is indicated by adding a leader line to the reference corner of each circuit to indicate that it is the coordinate value of the reference corner of each circuit with respect to the “origin position”. “1 position” to “circuit 4 position” are displayed), and the operator can input numerical values in the item of “circuit position”.

As in the case of the input screen of FIG. 6, the arithmetic processing unit 26 displays the input screen of FIG. 7 or FIG.
When the operator inputs the data of each item, the coordinates are calculated based on the input data. Then, the arithmetic processing unit 26, in accordance with the input data of each item, the board drawing unit 43
Is updated, and the input screen is displayed again on the display unit 28. Here, for the item for which the input data is incorrect, in the redisplayed input screen, the arithmetic processing unit 26
Gives an error indication.

In the above embodiment, it is possible for the operator to input data for each item of the board data in accordance with the screen displayed by the processing of the arithmetic processing unit 26, and the input data is associated with the item. Since the data is stored as the board data, the creation of the board data is supported. Then, as shown in FIG. 6 to FIG.
By adding a leader line or an arrow,
Is displayed in correspondence with the item, so that the meaning of each item becomes clear to the operator. That is, the operator can easily grasp which coordinate value on the board, which length of the board, and the like each item is. Therefore, the operator can easily input the data of each item on the input screen. In particular, regarding the item of “board size layout offset”, the board angle changes depending on the board transfer direction and the position of the machine origin, but the “board size layout offset”
Items are attached to the board figure 44 by the leader lines,
The operator can visually grasp the coordinate values of the corners of the substrate to be input.

Further, if the input data of each item is incorrect, an error is displayed in step S9.
The operator can visually recognize that an input error has been made. Therefore, even if an input error occurs, the operator can re-input incorrect input data to an accurate one in step S6 again, so that the number of data input errors is extremely reduced. Then, the board data storage unit 21
Is also accurate.

Further, step S9 or step S10
In the above, according to the input data, the board drawing unit 4
Since the display content of No. 3 is updated, even if the data cannot be determined as an input error by the arithmetic processing unit 26, the operator can visually grasp that the input data is an input error. Therefore, the operator can input data more accurately for each item. As described above, the meaning of each item is easy for the operator to understand, and the input mistake of each item is easy for the operator to understand.
The efficiency of creating the board data is improved, and more accurate board data is created.

The present invention is not limited to the above embodiment, and various improvements and design changes may be made without departing from the spirit of the present invention.

For example, when the operator inputs a command to reduce or enlarge via the input unit 27, the arithmetic processing unit 26
May be displayed in a reduced or enlarged manner on the board figure 44, the lead line, the arrow, or each item displayed in the board drawing section 43.

Further, in the board drawing section 43, a board graphic 44, a point representing a position of an "origin position", a point representing a position of a "board layout offset", a point representing a position of a "head circuit position", and a BOC mark. , The point indicating the position of the “circuit layout offset”, the leader line, the arrow, and the like may be displayed in different colors and may be color-coded. In the board drawing unit 43, the display position of each item and the display position of “()” or “(,)” are not limited to those in the above-described embodiment, and may be freely displayed by the operator operating the input unit 27, for example. The position may be changed.

Although the board graphic 44 is a plan view, it may be a diagram (for example, a perspective view) showing the board in a three-dimensional manner. The items to be input are not limited to the items described above, and may be, for example, items necessary for controlling the electronic component mounting apparatus 1 (for example, items relating to the thickness of the board).

Further, the apparatus to which the present invention can be applied is not limited to an electronic component mounting apparatus, but is an application apparatus for applying an application material such as an adhesive or solder to a substrate or a screen printing apparatus for printing a circuit on a substrate. Is also good.

[0058]

As described above, according to the first or fourth aspect of the present invention, the items to be input for the board are displayed corresponding to the graphics of the board, so that the definition and meaning of the items for the operator and the like are provided. Becomes clear to an operator or the like. Therefore, the operator can efficiently create board data in which items are associated with input data for the items.

According to the second aspect of the present invention, the fact that the input data is incorrect is displayed, so that the operator or the like can grasp that the data of the item has been incorrectly input.

According to the third aspect of the present invention, since the graphics on the board are changed in accordance with the input data, if the operator inputs the data by mistake, the changed graphics are displayed incorrectly. Thus, the operator notices a mistake in data entry. Therefore, more accurate substrate data is created.

[Brief description of the drawings]

FIG. 1 is a front view showing a specific mode of an electronic component mounting apparatus to which the present invention is applied.

FIG. 2 is a view showing a specific mode of a board transfer / positioning apparatus provided in the electronic component mounting apparatus; FIG. 2 (a) is a front view of the board transfer / positioning apparatus; FIG. 2 (b) is a plan view of the substrate transfer positioning device.

FIG. 3 is a block diagram showing a control system of the electronic component mounting apparatus.

FIG. 4 is a flowchart showing a flow of processing according to a program according to the present invention.

FIG. 5 is an example of a basic setting screen displayed on a display unit provided in the electronic component mounting apparatus.

FIG. 6 is an example of an input screen displayed on the display unit.

FIG. 7 is an example of an input screen displayed on the display unit.

FIG. 8 is an example of an input screen displayed on the display unit.

FIG. 9 is an example of a conventional input screen.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus (apparatus) 21 Substrate data storage part (storage means) 26 Operation processing part (computer) 27 Input part 28 Display part (display means) 29 Program storage part 30 Operation processing program (program) 41 Basic setting display part 42 Dimension setting section 43 Board drawing section 44 Board figure 45 Stopper figure 46 Coordinate axis 47 Arrow 48 Arrow 49 Circuit setting section

Claims (4)

[Claims] 1. A board data creation support method for supporting creation of board data for inputting the board data to an apparatus that performs a given operation on a board based on the board data. Displaying the graphic on the display means, and displaying on the display means the items to be input for the substrate in association with the graphic, and associating the data input for the item with the item, as substrate data Storing the data in a storage means. 2. The board data creation support method according to claim 1, further comprising the step of displaying, on the display means, that the input data is incorrect when the data input for the item is incorrect. A board data creation support method, further comprising: 3. The board data creation support method according to claim 1, further comprising the step of changing the figure in accordance with the data input for the item and redisplaying the figure. How to help. 4. A means for displaying, on a display means, a graphic of a substrate to a computer, and displaying on the display means an item to be input for the substrate in association with the graphic, and data input for the item. For storing in the storage means as substrate data in association with the above items.