JP5905732B2 - Board work system - Google Patents

Description

  The present invention relates to an on-board working system capable of performing work on both sides of a circuit board.

  The circuit board has a double-sided mounting board on which electronic components are mounted on both the front and back sides, and the double-sided mounting board was worked on one side of the circuit board by an on-board working system Later, the circuit board is turned upside down, and the other surface of the circuit board is operated to produce the circuit board. The following patent document describes an example of a substrate working system capable of producing a double-sided mounting board.

JP 2011-124329 A

  In the double-sided mounting board, it may be preferable to mount the electronic component on one surface of the front surface and the back surface of the circuit board before the other surface. In other words, it may be preferable to set a priority surface, which is a surface on which work is to be performed, of both surfaces of the circuit board. The priority surface is set, for example, by the number, weight, material, etc. of electronic components mounted on one surface of the circuit board. Then, mounting is performed on one surface of the circuit board set as the priority surface, and mounting is performed on the other surface after completing the mounting operation on the one surface, so that double-sided mounting is performed. It becomes possible to produce a board | substrate suitably.

  However, due to the carelessness of the operator, there is a case where the mounting work is performed on the surface opposite to the priority surface before the priority surface. And production efficiency decreases. The present invention has been made in view of such circumstances, and provides an on-board working system capable of prohibiting a mounting operation from being performed prior to a priority surface with respect to a surface opposite to the priority surface. This is the issue.

  In order to solve the above-described problems, an on-board work system according to claim 1 of the present application includes a work execution device that performs work on a circuit board, and (A) controls the operation of the work execution device, An on-board work execution unit that performs work on any one of the two surfaces, (B) an identification symbol acquisition unit that acquires an identification symbol of a circuit board, and (C) the acquired by the identification symbol acquisition unit A controller having a work surface storage unit that associates and stores an identification symbol and a work surface of a circuit board for which work execution by the substrate work execution unit has been completed, and performs work on both surfaces of the circuit board In an executable board-to-board system, the control device is scheduled for a circuit board and a priority surface storage unit that stores a priority surface that is a surface on which the work should be performed first of both surfaces of the circuit board. Scheduled work that is A scheduled work surface acquisition unit that acquires which of the two surfaces of the road substrate is the work, and the substrate work execution unit is a surface acquired by the planned work surface acquisition unit When the work surface is the priority surface, the scheduled work is allowed to be executed. When the work surface is not the priority surface, the priority surface is associated with the identification symbol in the work surface storage unit. It is configured to allow the scheduled work to be executed on condition that the work surface is stored.

  According to a second aspect of the present invention, there is provided the on-board working system according to the first aspect, wherein the priority surface storage unit stores the priority surface input by an operator.

  According to a third aspect of the present invention, there is provided the on-board working system according to the first or second aspect, wherein the control device has a surface on which the work is actually performed out of both sides of the circuit board. An actual work surface acquisition unit for acquiring which surface is the surface, and the substrate work execution unit, when the surface acquired by the actual work surface acquisition unit and the scheduled work surface are different, Configured to prohibit execution of scheduled work.

  In the on-board work system according to the first aspect, the scheduled work is allowed to be executed when the planned work surface is a priority surface. Specifically, for example, when the surface of the circuit board is set as a priority surface, execution of work corresponding to the surface is permitted on the surface that is the priority surface. On the other hand, when the planned work surface is not the priority surface, that is, when it is determined that the surface opposite to the priority surface is the same as the planned work surface, specifically, for example, the surface of the circuit board is set as the priority surface. If the work corresponding to the back surface is to be performed on the back surface that is not the priority surface, the work on the front surface that is the priority surface is completed based on the data stored in the work surface storage unit. It is determined whether or not there is. Only when the work on the front surface, which is the priority surface, is completed, the work on the back surface opposite to the priority surface is allowed. That is, when the work on the priority surface is not completed, the work on the surface opposite to the priority surface is prohibited. Therefore, according to the substrate work system of the first aspect, it is possible to surely prohibit the work on the surface opposite to the priority surface from being performed before the priority surface.

  In the on-board work system according to the second aspect, the priority plane is set by the input of the operator. Accordingly, the priority plane can be set at the production site of the circuit board, and the priority plane can be set in consideration of the production result of the circuit board.

  Further, in the on-board work system according to claim 3, an actual work surface that is a surface on which the work is actually performed on the circuit board, that is, a surface facing the circuit board being conveyed and a planned work surface If they are different, execution of the scheduled work is prohibited. That is, for example, when an operation corresponding to the back surface is to be performed on a circuit board being conveyed with the front surface facing upward, the execution of the operation is prohibited. As a result, it is possible to reduce the discard of the circuit board due to an erroneous operation, and it is possible to improve the production efficiency.

It is a schematic plan view which shows the to-substrate working system which is an Example of this invention. It is a top view which shows the electronic component mounting machine with which the board | substrate work system shown in FIG. 1 is provided in the state which removed the cover. It is a block diagram which shows the control apparatus with which the to-substrate work system shown in FIG. 1 is provided. It is a schematic diagram which shows the selection button displayed on the display apparatus with which the board | substrate work system shown in FIG. 1 is provided. It is a figure which shows notionally the data regarding the work performance of a circuit board. It is a flowchart which shows an on-board work program.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

<Configuration of the work system for substrates>
FIG. 1 shows an on-board working system 10 according to an embodiment of the present invention. The on-board working system 10 is a system for producing a circuit board on which an electronic circuit component (hereinafter may be abbreviated as “electronic component”) is mounted. The identification symbol reader 12, the electronic component mounting machine 14, And a reflow furnace 16. These three working machines 12, 14, and 16 are arranged in the order of the identification symbol reader 12, the electronic component mounting machine 14, and the reflow furnace 16, and the identification symbol reader 12 moves toward the reflow furnace 16. The circuit board is transported. Incidentally, in the following description, the direction in which the identification symbol reader 12, the electronic component mounting machine 14, and the reflow furnace 16 are arranged is referred to as an X-axis direction, and a horizontal direction perpendicular to the direction is referred to as a Y-axis direction.

  The identification symbol reader 12 includes a reader transport device 20 that transports a circuit board, and a mark camera (see FIG. 3) 22 that images the circuit board. The reader transport device 20 is disposed so as to extend in the X-axis direction. The circuit board supported by the reader transport device 20 is transported in the X-axis direction by an electromagnetic motor (see FIG. 3) 26 and a predetermined amount is provided. In this position, the circuit board is fixedly held. A mark camera 22 is provided above the position where the circuit board is fixedly held, so that the circuit board held fixedly can be imaged. Further, the identification symbol reader 12 is provided with an image processing device (see FIG. 3) 28, and image data obtained by the mark camera 22 is processed by the image processing device 28, which will be described in detail later. In addition, an identification symbol or the like for identifying each circuit board is acquired.

  In addition, as shown in FIG. 2, the electronic component mounting machine 14 moves a mounting machine transport device 32 that transports the circuit board 30, a mounting head 34 that mounts electronic components on the circuit board 30, and the mounting head 34. A moving device 36 and a pair of supply devices 38 for supplying electronic components are provided, and an electronic component mounting operation is performed on the circuit board 30. The mounting machine transport device 32 is disposed on the base 40 so as to extend in the X-axis direction, and is connected to the reader transport device 20 of the identification symbol reader 12. As a result, the placement machine transport device 32 transports the circuit board transported by the reader transport device 20 toward the downstream side by the electromagnetic motor (see FIG. 3) 42, and the circuit board 30 at a predetermined position. The structure is fixedly held.

  The mounting head 34 mounts an electronic component on the circuit board 30 held by the mounting machine transport device 32, and has a suction nozzle 50 that sucks the electronic component on the lower surface. The suction nozzle 50 communicates with a positive / negative pressure supply device (see FIG. 3) 52 through negative-pressure air and positive-pressure air passages. The suction nozzle 50 sucks and holds electronic components at a negative pressure, and a slight positive pressure is supplied. In this way, the held electronic component is detached. Further, the mounting head 34 has a nozzle lifting device (see FIG. 3) 56 that lifts and lowers the suction nozzle 50 and a nozzle rotation device (see FIG. 3) 58 that rotates the suction nozzle 50 about its axis. It is possible to change the vertical position of the electronic component to be held and the holding posture of the electronic component. The suction nozzle 50 is attachable to and detachable from the mounting head 34 and can be changed according to the size, shape, etc. of the electronic component.

  The mounting head 34 can be moved to an arbitrary position on the base 40 by a moving device 36. Specifically, the moving device 36 includes an X-axis direction slide mechanism 60 for moving the mounting head 34 in the X-axis direction, and a Y-axis direction slide mechanism 62 for moving the mounting head 34 in the Y-axis direction. ing. The X-axis direction slide mechanism 60 has an X-axis slider 64 provided on the base 40 so as to be movable in the X-axis direction, and an electromagnetic motor (see FIG. 3) 66. The shaft slider 64 can be moved to an arbitrary position in the X-axis direction. The Y-axis direction sliding mechanism 62 includes a Y-axis slider 68 provided on the side surface of the X-axis slider 64 so as to be movable in the Y-axis direction, and an electromagnetic motor (see FIG. 3). The motor 70 can move the Y-axis slider 68 to an arbitrary position in the Y-axis direction. The mounting head 34 can be moved to an arbitrary position on the base 40 by the moving device 36 by attaching the mounting head 34 to the Y-axis slider 68. The mounting head 34 can be attached to and detached from the Y-axis slider 68 with a single touch, and can be changed to a different type of working head, such as a dispenser head.

  The pair of supply devices 38 are disposed on both sides of the base 40 in the Y-axis direction so as to sandwich the mounting machine transport device 32. Each of the pair of supply devices 38 is a feeder-type supply device, and has a plurality of tape feeders 72 that hold the taped electronic components and send out the electronic components one by one. Each of the plurality of tape feeders 72 is configured to supply an electronic component to a supply position to the mounting head 34.

  Moreover, the reflow furnace 16 is provided with the reflow furnace conveyance apparatus 80, as shown in FIG. The reflow furnace transport device 80 is disposed so as to extend in the X-axis direction, and is connected to the mounting machine transport device 32 of the electronic component mounting machine 14. Thus, the circuit board transported by the mounting machine transport apparatus 32 is transported through the reflow furnace 16 by the electromagnetic motor (see FIG. 3) 82 and is transported out of the substrate work system 10.

  Further, the substrate work system 10 includes a control device 90 as shown in FIG. The control device 90 includes a controller 92 mainly composed of a computer including a CPU, a ROM, a RAM, and the like. On the other hand, the electronic component mounting machine 14 includes a plurality of drive circuits 94 corresponding to the electromagnetic motors 42, 66, 70, the positive / negative pressure supply device 52, the nozzle lifting / lowering device 56, the nozzle rotation device 58, and the tape feeder 72. The reader 12 includes a drive circuit 96 corresponding to the electromagnetic motor 26, and the reflow furnace 16 includes a drive circuit 98 corresponding to the electromagnetic motor 82. The controller 92 is connected to a drive source such as each of the devices 20 and 36 such as a transfer device and a moving device via each drive circuit 94, 96 and 98. Etc. can be controlled. The controller 92 is connected to an image processing device 28 that processes image data obtained by the mark camera 22.

  Further, the display device 100 is connected to the controller 92. The display device 100 displays information related to work by the electronic component mounting machine 14 and the like, and is a touch panel type display device. Note that a selection button 102, which will be described in detail later, is displayed on the display device 100, and an operation result of the selection button is input to the controller 92.

<Working on both sides of the circuit board by the substrate working system>
In the substrate work system 10, the inside of the three work machines 12, 14, 16 of the identification symbol reader 12, the electronic component mounting machine 14, and the reflow furnace 16 is transferred by the transfer devices 20, 32, 80 with the above-described configuration. By transporting and performing the work by each of the work machines 12, 14, and 16, it is possible to produce a circuit board having electronic components mounted on one surface. Then, the circuit board having the electronic component mounted on one surface thereof is inverted in the vertical direction, and the inside of each work machine 12, 14, 16 is again carried by the respective transfer devices 20, 32, 80, and each work machine. By performing the operations of 12, 14, and 16, it is possible to produce a circuit board having electronic components mounted on both sides.

  Thus, when mounting electronic components on both sides of the circuit board, it may be preferable to mount the electronic components on one side of the front and back surfaces of the circuit board before the other side. In other words, it may be preferable to set a priority surface, which is a surface on which work is to be performed, of both surfaces of the circuit board. The priority surface is set, for example, by the number, weight, material, etc. of electronic components mounted on one surface of the circuit board. Specifically, for example, when a heavy electronic component is mounted, since it is desirable that the transport time of the circuit board on which the heavy electronic component is mounted is short, the opposite side to the surface on which the heavy electronic component is mounted The plane is set as the priority plane. For example, when an electronic component that is not preferable to be heated twice by the reflow furnace 16 is mounted, the surface opposite to the surface on which such an electronic component is mounted is set as the priority surface.

  Electronic components are mounted on both sides by performing the mounting operation on one surface of the circuit board set as the priority surface and performing the mounting operation on the other surface after completing the mounting operation on the one surface. It is possible to suitably produce a circuit board on which is mounted. However, due to the carelessness of the operator, the mounting work may be performed on the surface opposite to the priority surface prior to the priority surface. And production efficiency decreases. In view of the above, in the substrate work system 10, double-sided mounting work that can prohibit the mounting work from being performed prior to the priority surface is performed on the surface opposite to the priority surface.

  More specifically, in the double-sided mounting operation in the system 10, first, the operator inputs which of the two sides of the circuit board is set as the priority side. Specifically, when the double-sided mounting operation is executed, the selection button 102 shown in FIG. The selection button 102 includes a button for “designating the front surface as a priority surface”, a button for “designating the back surface as a priority surface”, and a button for “not designating a priority surface”. It is a radio button. Then, when the operator touches each button on the screen of the display device 100, any item is selected. In the figure, a screen of the display device 100 when a button for “designating the surface as a priority surface” is selected is shown.

  Then, after the priority surface is input by the operator, the conveyance of the circuit board is started, and the scheduled work, which is the work scheduled for the circuit board, is the work for either the front surface or the back surface of the circuit board. Is acquired. Specifically, it is acquired whether the program for executing the mounting operation on the circuit board in the electronic component mounting machine 14 is for the front surface or the back surface of the circuit board. As a result, a scheduled work surface, which is a surface on which both sides of the circuit board are scheduled, is acquired.

  Further, in the identification symbol reader 12, the circuit board is imaged by the mark camera 22, and the image data is processed in the image processing device 28, whereby various information on the circuit board is acquired. Specifically, an identification symbol 110 and a specific mark 112 are written on the circuit board 30 as shown in FIG. The identification symbol 110 is an ID for identifying the circuit board 30 and is written on both the front and back surfaces of the circuit board. For this reason, the identification symbol of the circuit board conveyed in the system 10 is acquired from the image data of the mark camera 22. On the other hand, the specific mark 112 is written only on the surface of the circuit board, and the specific mark 112 can specify the actual work surface, which is the surface on which the work is actually performed, of both surfaces of the circuit board 30. It has become. Specifically, for example, since the specific mark 112 is marked on the circuit board 30 in FIG. 2, it can be seen that the circuit board 30 in FIG. 2 is conveyed with the surface facing up. . That is, in the electronic component mounting machine 14 of FIG. 2, the electronic component is mounted on the surface of the circuit board, and the surface of the circuit board becomes the actual work surface. In this way, the actual work surface of the circuit board being conveyed into the system 10 is also acquired from the image data of the mark camera 22.

  Further, in the present system 10, work results for circuit boards are stored for each circuit board, and work results for each circuit board are stored separately for the front surface and the back surface. Specifically, data relating to work results for each circuit board is stored as shown in FIG. The work performance of each circuit board is stored in association with the identification symbol acquired from the image data of the mark camera 22, and stores whether or not the work for each of the front and back surfaces of the circuit board has been executed. . For example, for a circuit board with an identification symbol “Panel 01”, a work record indicating that the work on the front surface has been performed and the work on the back surface has not been performed is stored, and the circuit board with the identification symbol “Panel 02”. As for the circuit board having the identification symbol “Panel 03”, the operation result indicating that the operation on both sides is not executed is stored.

  Then, based on the priority surface, the scheduled work surface, the identification symbol, the actual work surface, and the work results, it is determined whether or not work can be performed on the circuit board. Specifically, it is first determined whether or not the planned work surface and the actual work surface are the same. That is, it is determined whether the surface of the work program by the electronic component mounting machine 14 is the same as the surface facing the circuit board being conveyed. In this determination, if it is determined that the surface of the work program is different from the surface facing the circuit board being transferred, execution of the mounting operation is prohibited. Specifically, for example, when the mounting work according to the work program for the back surface is to be executed on the circuit board conveyed with the front side facing up, the execution of the mounting work is prohibited.

  Next, when it is determined that the scheduled work surface and the actual work surface are the same, it is determined whether or not the priority surface and the scheduled work surface are the same. When the priority surface and the scheduled work surface are the same, the scheduled operation is performed on the surface on which the work should be performed first, so that the mounting operation is naturally allowed. Specifically, for example, when the mounting work according to the work program for the surface is to be performed on the circuit board conveyed with the surface being the priority surface facing up, the mounting work is allowed to be performed. . Then, after the mounting work on the surface of the circuit board is executed and the heating work in the reflow furnace 16 is also finished, the work results shown in FIG. 5 are rewritten. Specifically, when the above operation is performed on the circuit board “Panel 03” shown in FIG. 5, “Unworked” in “Surface Work Status” is rewritten to “Worked”.

  On the other hand, when it is determined that the priority plane and the planned work plane are different, that is, when it is determined that the plane opposite to the priority plane and the planned work plane are the same, specifically, for example, the priority plane is the surface. Whether or not the work on the front surface, which is the priority surface, has been completed when attempting to perform mounting work in accordance with the work program for the back surface on the circuit board conveyed with the back surface facing up. Is determined. This determination is made based on the work performance shown in FIG.

  Specifically, for example, on the circuit board with the identification symbol “Panel 03” acquired from the image data of the mark camera 22, the work status of the surface that is the priority surface is “unworked”. That is, work on the surface which is the priority surface is not performed. Therefore, in the circuit board having the identification symbol “Panel 03”, it is not preferable to perform the work on the back surface of the circuit board on which the work on the surface which is the priority surface is not performed, and therefore the execution of the mounting work is prohibited.

  Further, for example, on the circuit board having the identification symbol “Panel 01” acquired from the image data of the mark camera 22, the work status of the surface that is the priority surface is “work completed”. Therefore, in the circuit board having the identification symbol “Panel 01”, since there is no problem in performing the work on the back surface of the circuit board on which the work of the front surface which is the priority surface is performed, the mounting work is allowed to be performed. Then, after the mounting work for the back surface of the circuit board is executed and the heating work in the reflow furnace 16 is also completed, the work record shown in FIG. 5 is rewritten. Specifically, when the above operation is performed on the circuit board “Panel 01” shown in FIG. 5, “Unworked” in the “Backside Work Status” is rewritten to “Worked”. In other words, regarding the work result of the circuit board “Panel 01”, the work situation on both sides is set to “worked” in the same manner as the work result of the circuit board “Panel 02”. Note that the data on the work results of the circuit boards whose work status on both sides is “work completed” is sequentially deleted. That is, the data of “Panel 01” after rewriting “Panel 02” and “Back side work status” is deleted.

  As described above, in the present system 10, it is possible to perform a double-sided mounting operation that can surely prohibit the work on the surface opposite to the priority surface from being performed before the priority surface. ing. Therefore, according to the present system 10, it is possible to eliminate waste such as disposal of the circuit board and suppress a decrease in production efficiency.

<Control program>
The above-described circuit board double-side mounting operation is performed by executing an on-board operation program whose flowchart is shown in FIG. In the board-to-board work program, in step 1 (hereinafter simply referred to as “S1”; the same applies to other steps), it is determined whether or not a priority plane has been input to the selection button 102 of the display device 100. If it is determined that a surface has been input, the input priority surface is stored in S2. Next, in S <b> 3, conveyance by each of the conveying devices 20, 32, and 80 is started, and in S <b> 4, a planned work surface is acquired based on a mounting work program scheduled in the electronic component mounting machine 14.

  When the planned work surface is acquired, the circuit board is imaged by the mark camera 22, and the actual work surface is acquired in S5 based on the image data obtained by the imaging, and the circuit board identification symbol is acquired in S6. Is done. Then, in S7, it is determined whether or not the acquired actual work surface and the scheduled work surface are the same. If it is determined that the actual work surface and the scheduled work surface are the same, it is determined in S8 whether or not the priority surface and the scheduled work surface are the same, and the priority surface and the scheduled work surface are the same. If it is determined that it is, execution of the scheduled work is started in S9.

  If it is determined in S8 that the priority plane is different from the scheduled work plane, in S10, the work for the priority plane has been executed or not executed based on the work results of the circuit board shown in FIG. It is determined whether there is any. If it is determined that the work for the priority plane has been performed, the execution of the scheduled work is started in S9.

  After execution of the scheduled work is started in S9, it is determined in S11 whether or not the execution of the scheduled work is finished. If it is determined that the execution of the scheduled work has been completed, in S12, the work performance of the circuit board relating to the surface on which the planned work has been executed is stored, that is, the work performance of the circuit board shown in FIG. And the execution of this program ends. If it is determined in S10 that the work for the priority surface has not been executed, the system 10 is stopped in S13, and the execution of this program ends. If it is determined in S7 that the actual work surface is different from the scheduled work surface, an error is displayed on the display device 100 in S14, and the execution of this program ends.

<Functional configuration of control device>
In view of the execution process, the control device 90 that executes the above-described substrate work program can be considered to have a functional configuration as shown in FIG. As can be seen from the figure, the control device 90 uses the priority plane storage unit 120 as a functional unit that executes the process of S2, that is, a functional unit that stores the priority plane, and a functional unit that executes the process of S4. As the function unit for acquiring the work surface, the planned work surface acquisition unit 122 is used as the function unit for executing the process of S5, that is, as the function unit for acquiring the actual work surface, the actual work surface acquisition unit 124 is set as the function of S6. As the functional unit to be executed, that is, the functional unit to acquire the identification symbol of the circuit board, the identification symbol acquiring unit 126 determines whether or not the functional unit that executes the processing of S7 to S10, that is, whether the scheduled work can be performed on the circuit board. Then, as a functional unit that executes the scheduled work, the on-board work execution unit 128 is a functional unit that executes the processing of S12, that is, a functional unit that stores the identification symbol and the surface on which the scheduled work is performed in association with each other. Product The surface storage unit 130, and respectively.

  Incidentally, in the above-described embodiment, the board work system 10 is an example of the board work system, and the electronic component mounting machine 14 and the control device 90 constituting the board work system 10 are examples of the work execution device and the control device. It is. In addition, the priority plane storage unit 120, the scheduled work plane acquisition unit 122, the actual work plane acquisition unit 124, the identification symbol acquisition unit 126, the substrate work execution unit 128, and the work plane storage unit 130 included in the control device 90 are the priority planes. It is an example of a memory | storage part, a plan work surface acquisition part, an actual work surface acquisition part, an identification symbol acquisition part, a board | substrate work execution part, and a work surface memory | storage part.

  In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, the mark camera 22 is provided above the reader transport device 20, but may be provided at two locations above and below the reader transport device 20. Thus, by providing the mark cameras 22 at two locations above and below the reader transport device 20, it is possible to deal with a circuit board on which an identification symbol is written only on one side.

  In the above embodiment, two work states of “unworked” and “worked” are set as the work states of the front and back surfaces of the circuit board, but other work states are set. Also good. Specifically, for example, for a circuit board in which the mounting work on the circuit board is interrupted for some reason, it may be set as “working in progress”. If the mounting operation is defective, “work defect” may be set. Note that when the work status of the priority surface is “work in progress” or “work failure”, it is not considered that the priority surface work by the electronic component mounting machine 14 has been completed. When the work surface is different, execution of the scheduled work on the surface opposite to the priority surface is prohibited.

  Further, in the above embodiment, when the execution of the scheduled work is prohibited, an error is displayed on the display device 100 or the system 10 is stopped, but the scheduled work is executed by another method. It may be prohibited. Specifically, for example, a retreat lane may be provided in the circuit board transport lane, and the circuit board may be transported to the retreat lane when execution of the scheduled work is prohibited.

  DESCRIPTION OF SYMBOLS 10: Board | substrate work system 14: Electronic component mounting machine (work execution apparatus) 90: Control apparatus 120: Priority surface memory | storage part 122: Planned work surface acquisition part 124: Actual work surface acquisition part 126: Identification symbol acquisition part 128: Pair Substrate work execution unit 130: Work surface storage unit

Claims (3)

A work execution device for performing work on the circuit board;
(A) Control of the operation of the work execution device, and an on-board work execution unit that performs work on any one of both sides of the circuit board; and (B) acquisition of an identification code for obtaining an identification code of the circuit board. And (C) a work surface storage unit that associates and stores the identification symbol acquired by the identification symbol acquisition unit and the work surface of the circuit board for which the execution of the work by the substrate work execution unit has been completed. A control device comprising:
In an on-board working system capable of performing work on both sides of a circuit board,
The control device is
A priority surface storage unit that stores a priority surface that is a surface on which work should be performed first on both sides of the circuit board;
A scheduled work surface acquisition unit that acquires which surface of the both sides of the circuit board is a scheduled work that is a scheduled work for the circuit board;
Have
The substrate work execution unit is
When the scheduled work surface, which is the surface acquired by the scheduled work surface acquisition unit, is the priority surface, the execution of the scheduled work is allowed, and when the scheduled work surface is not the priority surface, the priority surface The board-to-board work system is characterized in that execution of the scheduled work is permitted on the condition that the work surface is stored in the work surface storage unit in association with the identification symbol.   The on-board working system according to claim 1, wherein the priority surface storage unit stores the priority surface input by an operator. The control device has an actual work surface acquisition unit that acquires which surface of the both sides of the circuit board is actually operated,
The board-to-board work execution unit prohibits execution of the scheduled work when the surface acquired by the actual work surface acquisition unit is different from the scheduled work surface. 3. The substrate work system according to 2.

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