JP4865175B2 - Parts assembly equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component assembling apparatus for delivering a printed circuit board to a downstream side after assembling the printed circuit board inherited from the upstream side by performing a predetermined operation.
[0002]
[Prior art]
Such a component assembling apparatus is provided with a display device that displays that an abnormality has occurred when an abnormality occurs in a series of operations related to the assembly.
[0003]
[Problems to be solved by the invention]
However, when checking the input / output of the sensor, etc. in order to investigate the cause when the error occurs, reset the error display screen and move to the input / output check screen to find and check the related input / output. Was. For this reason, it is necessary to perform multiple operations to pursue the cause of abnormality analysis, for example, to reset the abnormality display screen and display the abnormality analysis screen via the production screen, device maintenance screen, device diagnosis screen, etc. It was cumbersome for the operator.
[0004]
Accordingly, an object of the present invention is to provide a component assembling apparatus in which the cause of an abnormality can be accurately checked by a simple operation in view of the above points.
[0005]
[Means for Solving the Problems]
Therefore, according to the first aspect of the present invention, the substrate transferred from the upstream side is transported, and the substrate is transported to the downstream side after being assembled by performing a predetermined operation on the substrate at the positioning portion. In the assembling apparatus, when an abnormality related to the transport of the substrate occurs, a display device that displays an error screen for displaying an abnormality analysis switch for analyzing the abnormality and displaying that an abnormality has occurred , The display device includes a plurality of sensors provided in the positioning unit for detecting the substrate at the positioning position and an abnormality analysis screen for displaying detection states of the plurality of sensors instead of the error screen by operating the abnormality analysis switch. And a control device that controls the display to be displayed on the screen.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. As a component assembly device, an adhesive application device that applies an adhesive onto a printed circuit board, a screen printer that applies solder paste, and an electronic component are mounted. There are electronic component mounting apparatuses and the like. Here, the electronic component mounting apparatus will be described as an example.
[0009]
FIG. 1 is a plan view of an electronic component mounting apparatus 1 as a component assembling apparatus. Components that supply various electronic components one by one to a component take-out portion (component adsorption position) on a base 2 of the apparatus 1. A plurality of supply units 3 are arranged in parallel.
[0010]
A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided on the base 2 between the opposed parts supply unit 3 groups. The supply conveyor 4 conveys the printed circuit board P received from the upstream device to the positioning unit 5, and after the electronic components are mounted on the substrate P positioned by the positioning unit 5 (not shown), the discharge conveyor 6 To the downstream device.
[0011]
Then, along the guides 5C provided between the fixed chute 5A and the fixed member 5B of the positioning portion 5, the movable chute 5D is adjusted to the size of the printed circuit board P by a drive motor (not shown) in the Y direction. It can be moved to.
[0012]
As shown in FIG. 2, the fixed chute 5A and the movable chute 5D of the positioning unit 5 are provided with a driving roller 9 and a plurality of rollers 10 that are rotated by a driving motor 5F via a driving circuit 5E shown in FIG. A conveyor belt 11 stretched between the printed circuit boards P is provided, and the printed circuit board P can be conveyed.
[0013]
The movable chute 4D is moved in the Y direction according to the size of the printed circuit board P by a drive motor (not shown) along a guide 4C provided between the fixed chute 4A and the fixed member 4B of the supply conveyor 4. It can be moved.
[0014]
As shown in FIG. 2, the fixed chute 4A and the movable chute 4D of the supply conveyor 4 are provided with a driving roller 15 and a plurality of rollers 16 which are rotated by a driving motor 4F via a driving circuit 4E shown in FIG. A conveyor belt 17 stretched between the printed circuit boards P is provided, and the printed circuit board P can be conveyed.
[0015]
The movable chute 6D is moved in the Y direction according to the size of the printed circuit board P by a drive motor (not shown) along a guide 6C provided between the fixed chute 6A and the fixed member 6B of the discharge conveyor 6. It can be moved.
[0016]
As shown in FIG. 2, the fixed chute 6A and the movable chute 6D of the discharge conveyor 6 have a driving roller 21 and a plurality of rollers 22 that are rotated by a driving motor 6F via a driving circuit 6E shown in FIG. A conveyor belt 23 stretched between the printed circuit boards P is provided, and the printed circuit board P can be conveyed.
[0017]
Reference numerals 30A and 30B denote a pair of beams that are long in the X direction, and a printed board P or component supply unit that is fixed to the positioning unit 5 along a pair of left and right guides 31 by rotating a screw shaft by driving a Y-axis motor 50. 3 above the part take-out part (part suction position) individually in the Y direction.
[0018]
Each of the beams 30A and 30B is provided with mounting heads 32A and 32B that move along the guide by the X-axis motor 49 in the longitudinal direction, that is, the X direction. Each mounting head 32A or 32B is equipped with a vertical axis motor 52 for moving the four suction nozzles 33 up and down, and a θ-axis motor 51 for rotating around the vertical axis. Accordingly, the suction nozzles 33 of the two mounting heads 32A and 32B can move in the X direction and the Y direction, can rotate around the vertical line, and can move up and down.
[0019]
Reference numeral 34 denotes a component recognition camera for component position recognition, which is provided in correspondence with each of the mounting heads 32A and 32B, and how much the electronic component is displaced and held with respect to the suction nozzle 33 in the XY directions. In addition, the electronic component is imaged to recognize the position of the rotation angle.
[0020]
Reference numerals 35 and 35 denote nozzle stockers for storing various suction nozzles 13 for replacement of the suction nozzle 13.
[0021]
Then, the cables and air tubes for the mounting heads 32A and 32B are arranged in parallel and fixed with an adhesive to form a flat cable 36 and 36 in a substantially flat shape, and one end thereof is connected to each motor or the like. Then, the other end is connected to a control circuit board (not shown) and an air supply source (not shown).
[0022]
Next, in FIG. 3, reference numeral 40 denotes a CPU (mounting control unit) as a control unit that performs overall control of the mounting apparatus 1. The CPU 40 is connected to a RAM (Random Access Memory) 42 and a ROM (ROM) via a bus line. A read only memory) 43 is connected. Based on the data stored in the RAM 42, the CPU 40 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 43.
[0023]
That is, the CPU 40 drives the drive motors 4F, 5F, 6F via the interface 44 and drive circuits 4E, 5E, 6E, and the X-axis motor via the interface 44 and drive circuits 45, 46, 47, 48. 49, the Y axis motor 50, the θ axis motor 51, and the vertical axis motor 52 are controlled to be driven.
[0024]
The RAM 42 stores mounting data relating to component mounting. For each mounting order (step number), the X direction (indicated by X), the Y direction (indicated by Y), and the angle within the printed circuit board. Information (indicated by Z), arrangement number information of each component supply unit 3 indicated by FDR, and the like are stored. The RAM 42 stores component arrangement data, which stores the type (component ID) of each electronic component corresponding to the arrangement number of each component supply unit 3. Further, the RAM 42 stores component library data representing the characteristics of each electronic component.
[0025]
A recognition processing unit 53 is connected to the CPU 40 via the interface 44. The recognition processing unit 53 performs recognition processing of an image captured by the component recognition camera 34 based on the component library data. The processing result is sent to the CPU 40. That is, the CPU 40 outputs an instruction to the recognition processing unit 53 so as to perform recognition processing (calculation of a positional deviation amount) on the image captured by the recognition camera 34 and receives a recognition processing result from the recognition processing unit 53. is there.
[0026]
A touch panel 54 is attached on the screen of the CRT 55 via an attachment (not shown). The touch panel 54 has a transparent conductive film coated on the entire surface of the glass substrate, and electrodes are printed on four sides. Therefore, when a very small current is passed through the surface of the touch panel 54 and the operator touches it, current changes are caused in the electrodes on the four sides, and the coordinate value touched by the circuit board connected to the electrodes is calculated. Therefore, if the coordinate value matches the coordinate value in the coordinate value group previously stored in the RAM 42 as a switch unit for performing a certain operation, the operation is performed.
In this embodiment, the portion surrounded by the double frame of the screen displayed on the CRT 55 is stored for each screen so as to be the switch portion.
[0027]
Next, referring to FIG. 4, each sensor related to the conveyance of the printed circuit board P will be described. L1 is a sensor for detecting the printed circuit board P at the entrance of the supply conveyor 4, and L2 is a sensor for detecting the printed circuit board P at the exit of the supply conveyor 4. The drive roller 15 and the plurality of rollers 16 are rotated by driving the drive motor 4F. Then, the printed circuit board P is transported by the transport belt 17, but when the sensor L1 detects the printed circuit board P supplied from the upstream device, the drive circuit 4E starts changing the rotational speed of the drive motor 4F, and the substrate P When the sensor L2 detects this, the drive motor 4F is stopped, and it is made to stand by at the exit of the supply conveyor 4.
[0028]
P1 is a sensor for detecting the printed circuit board P at the entrance of the positioning unit 5, P2 is a sensor for detecting the printed circuit board P at the standby position, P3 is a sensor for detecting the printed circuit board P at the intermediate position, P4 is an exit of the positioning unit 5, That is, it is a sensor that detects the printed circuit board P at the positioning position. The drive roller 9 and the plurality of rollers 10 are rotated by driving the drive motor 5F to transport the printed circuit board P by the transport belt 11, but supplied from the supply conveyor 4. When the sensor P1 detects the printed circuit board P, if the printed circuit board P is smaller than a predetermined size, the rotational speed of the drive motor 5F is reduced by the drive circuit 5E and the stopper 12 is raised to remove from the supply conveyor 4. When the printed circuit board P is prevented from being inherited, and the sensor P2 detects the small circuit board P, the driving is performed. The motor 5F is stopped to stand by at a standby position. When the sensor P3 detects the substrate P, the rotation speed of the drive motor 5F is started to be changed. When the sensor P4 detects the substrate P, the drive motor 5F is stopped. And wait at the positioning position.
[0029]
R1 is a sensor for detecting the printed board P at the entrance of the discharge conveyor 6, and R2 is a sensor for detecting the printed board P at the exit of the discharge conveyor 6. The drive roller 21 and the plurality of rollers 22 are rotated by driving of the drive motor 6F. Then, the printed circuit board P is transported by the transport belt 23. When the sensor R1 detects the printed circuit board P supplied from the positioning unit 5, the drive circuit 6E starts changing the rotational speed of the drive motor 6F, and the substrate P Is detected by the sensor R2, the drive motor 6F is stopped, and the exit of the discharge conveyor 6 is made to wait.
[0030]
The operation will be described below with the above configuration. First, the printed circuit board P is supplied to the supply conveyor 4 from an upstream device (not shown), and the drive roller 15 and a plurality of rollers 16 are rotated by driving the drive motor 4F to transport the printed circuit board P by the transport belt 17. When the sensor L1 detects the printed circuit board P supplied from the side device, the drive circuit 4E starts to increase the rotational speed of the drive motor 4F. When the sensor L2 detects the circuit board P, the drive motor 4F is stopped and supplied. Wait at the exit (standby position) of the conveyor 4.
[0031]
If there is no printed circuit board P in the positioning unit 5, the driving rollers 4 F and 5 F for transporting the supply conveyor 4 and the positioning unit 5 are driven to rotate the driving rollers 9 and 15 to rotate the plurality of rollers 10 and 16. The positioning part 5 takes over the printed circuit board P by the rotation of the conveyor belts 11 and 17 via the. At this time, when the sensor P1 detects the printed circuit board P supplied from the supply conveyor 4, if the printed circuit board P is larger than a predetermined size, the stopper 12 is raised to receive the printed circuit board P from the supply conveyor 4. When the sensor P2 detects the large substrate P, the CPU 40 does not control anything, and when the sensor P3 detects the large substrate P, the rotation speed of the drive motor 5F starts to increase. When the sensor P4 detects the substrate P, the drive motor 5F is stopped and waits at the positioning position.
[0032]
Next, at this positioning position, the board positioning unit 5 positions and fixes the printed board P by a positioning mechanism (not shown). After this positioning, in accordance with the mounting data stored in the RAM 42 on the printed circuit board P, the electronic component to be mounted by the suction nozzle 33 corresponding to the component type of the electronic component is picked up from the predetermined component supply unit 3 and taken out. Become.
[0033]
The suction nozzle 33 of the mounting head 32A moves so as to be positioned above the component supply unit 3 for storing the electronic component to be mounted. In the Y direction, the beam is moved along the pair of guides 31 by the Y-axis motor 50 being driven. In the X direction, the X-axis motor 49 is driven and the mounting head 32A is moved, and the predetermined supply unit 3 is already driven and the component can be taken out at the component suction position. 52 is driven and the suction nozzle 33 is lowered to suck and take out the electronic component. Next, the mounting head 32A is lifted and the suction nozzle 33 is moved above the component supply unit 3 for storing the electronic component to be mounted next. Similarly, the nozzle 33 descends to suck and take out the electronic component.
[0034]
At this time, the suction nozzle 33 of the mounting head 32B also moves above the component supply unit 3 that stores the electronic component to be mounted, the nozzle 33 descends to suck and take out the electronic component, and then the mounting head 32B rises. At the same time, the suction nozzle 33 moves above the component supply unit 3 for storing the electronic component to be mounted next, and similarly, the nozzle 33 descends to suck and take out the electronic component.
[0035]
Then, as described above, the electronic components that are moved by the Y-axis motor 50 and the X-axis motor 49 so that the suction nozzles 33 of the mounting head 32A are positioned above the component recognition cameras 34, and are sucked by the nozzles 33. Is picked up, and each suction nozzle 33 of the mounting head 32B is also moved to be positioned above the other component recognition camera 34. Each electronic component sucked by each nozzle 33 is picked up, and each electronic component is picked up by the nozzle. The recognition processing unit 53 calculates a recognition result for the XY direction and the rotation angle to determine how much the position is shifted with respect to the position.
[0036]
Then, the beam 30A and the mounting head 32A that have been processed to occupy the mounting area are moved, and the suction nozzle 33 mounts each electronic component on the printed circuit board P while correcting the positional deviation in consideration of the component recognition result. Since the next step data is extracted by stepping up the sequence data, the mounting area is opened and each electronic component is mounted one after another.
[0037]
As described above, mounting is performed sequentially on the printed circuit board P in accordance with the mounting data. However, after all the components are mounted, the printed circuit board P is transferred from the positioning unit 5 to the discharge conveyor 6 and inherited. That is, the drive motors 5F and 6F of the positioning unit 5 and the discharge conveyor 6 are driven, and the printed circuit board P after the completion of component mounting is delivered to the discharge conveyor 6.
[0038]
In the discharge conveyor 6, the driving roller 21 and the plurality of rollers 22 are rotated by driving the driving motor 6 </ b> F and the printed circuit board P is conveyed by the conveying belt 23. The sensor R <b> 1 detects the printed circuit board P supplied from the positioning unit 5. When detected, the drive circuit 6E starts to increase the rotational speed of the drive motor 6F. When the sensor R2 detects the substrate P, the drive motor 6F is stopped and waits at the exit of the discharge conveyor 6. Further, when preparation for receiving the downstream apparatus is completed, the drive motor 6F is driven, and the printed circuit board P is conveyed to the downstream apparatus.
[0039]
As described above, the printed circuit board P is transported and electronic components are mounted. Here, a case where an abnormality relating to the transport of the printed circuit board P occurs will be described below. That is, when an abnormality occurs, the CPU 40 displays an error screen (abnormal display screen) as shown in FIG. On this screen, "P conveyor board detection error" and "There is an inappropriate board on the P conveyor" are displayed. The P conveyor means the positioning unit 5, and the operator can understand that an inappropriate printed board P exists in the positioning unit 5.
[0040]
Accordingly, the touch panel 54 displays the “RESET” switch portion, the “abnormality analysis” switch portion, and the “close” switch portion on the error screen (abnormality display screen) of the CRT 55, so that the operator can select the “abnormality analysis” switch portion. When the button is touched, the CPU 40 displays the abnormality analysis screen (input / output check screen) directly on the CRT 55 as shown in FIG. 6 from the error screen.
[0041]
Therefore, the state of each sensor related to substrate conveyance is displayed on this abnormality analysis screen. "Substrate detection P1 (meaning sensor P1)" and "Substrate detection P4 (meaning sensor P4)" are in state "1 (meaning presence is detected)", and other sensors are in state "0 (not present) ) "Is displayed. For this reason, the worker understands that the printed circuit board P exists on the sensor P4 even though it should not exist on the sensor P1, and understands the cause of the abnormality related to the board conveyance. The cause relating to the abnormality can be eliminated.
[0042]
In addition, although this embodiment demonstrated only the abnormality which concerns on board | substrate conveyance, even if abnormality concerning the mounting operation | movement of an electronic component etc. generate | occur | produces not only this but an abnormality screen is similarly displayed on CRT, and an abnormality analysis screen is displayed. By displaying, the cause of the abnormality can be removed.
[0043]
Further, the present invention can be applied not only to a component mounting device but also to a component assembly device such as an adhesive application device and a screen printing machine.
[0044]
Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.
[0045]
【Effect of the invention】
As described above, according to the present invention, the abnormality analysis screen displaying the detection states of the plurality of sensors is displayed on the display device by operating the abnormality analysis switch displayed on the error screen. Therefore, it is possible to provide a component assembling apparatus in which the cause of the occurrence of the problem can be accurately checked by a simple operation. Therefore, the cause can be quickly removed and the productivity can be improved.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus.
FIG. 2 is a cross-sectional view taken along the line BB of FIG.
FIG. 3 is a control block diagram.
FIG. 4 is a schematic side view of a board transfer unit of the electronic component mounting apparatus.
FIG. 5 is a CRT error display screen.
FIG. 6 is a CRT abnormality analysis screen.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 4 Supply conveyor 5 Positioning part 6 Discharge conveyor 40 CPU
54 Touch Panel 55 CRT

Claims (1)

In the component assembling apparatus that transports the board inherited from the upstream side, assembles the board by performing a predetermined operation in the positioning unit, transports the board, and delivers the board to the downstream side. A display device for displaying an error screen for displaying an abnormality analysis switch for analyzing the abnormality, and a positioning device provided in the positioning unit for the conveyance. A plurality of sensors for detecting the substrate at a position, and a control for controlling to display on the display device an abnormality analysis screen for displaying detection states of the plurality of sensors instead of the error screen by operating the abnormality analysis switch An apparatus for assembling parts comprising the apparatus.

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