CN101730462B - Installation method of electronic component, installation device and installation sequence determination method thereof - Google Patents

Installation method of electronic component, installation device and installation sequence determination method thereof Download PDF

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Publication number
CN101730462B
CN101730462B CN2009102081977A CN200910208197A CN101730462B CN 101730462 B CN101730462 B CN 101730462B CN 2009102081977 A CN2009102081977 A CN 2009102081977A CN 200910208197 A CN200910208197 A CN 200910208197A CN 101730462 B CN101730462 B CN 101730462B
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China
Prior art keywords
electronic unit
base plate
installation head
printed base
supply device
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CN2009102081977A
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CN101730462A (en
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大山和义
泉原弘一
大西圣司
柏谷尚克
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Yamaha Motor Co Ltd
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Hitachi High Tech Instruments Co Ltd
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Abstract

The present invention provides an installation method of an electronic component, an installation device of the electronic component, and an installation sequence determination method for the installation device of the electronic component. Even at a state that the number of components taken from a component supplying device by an installation head of a beam at one side is small, the operation state of the beam of one side can be increased and the operation efficiency is increased. When one printed substrate is being manufactured, when a step that the electronic component is taken out from a tray supplying part (5) with an installation head (10) provided on the beam (7) is finished, the beam (7) enters the side of the component supplying device (3). The installation head (10) and the installation head (11) equally move between a printed substrate (P) on a conveying device (2) and the component supplying device (3). The electronic components are taken out from the component supplying device (3) with the absorption nozzles equipped on each installation head (10, 11) and are equipped to the printed substrate (P).

Description

The installation method of electronic unit, erecting device and erection sequence are confirmed method
Technical field
The electronic unit erection sequence that the present invention relates to a kind of installation method, electronic component mounting apparatus and electronic component mounting apparatus of electronic unit is confirmed method; This electronic component mounting apparatus utilizes adsorption mouth from assembly supply device attract electrons parts it to be taken out, and attaches it on the printed base plate that is positioned.The electronic unit erection sequence that particularly relates to installation method, electronic component mounting apparatus and the electronic component mounting apparatus of following electronic unit is confirmed method, and this electronic component mounting apparatus has: the carrying device of conveyance printed base plate, be provided with and supply with across this carrying device electronic unit assembly supply device, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize the drive source can be respectively in the installation head that on the direction of said each beam, moves.
Background technology
This electronic component mounting apparatus for example is disclosed in patent documentation 1 grade.Usually, the assembly supply device of supplying with electronic unit is located at two outsides of the carrying device of conveyance printed base plate respectively, has corresponding said each assembly supply device of beam of installation head and is provided with a pair of.That is, each beam is corresponding with each assembly supply device usually, and the installation head on the beam only is installed on the printed base plate from corresponding components feedway taking-up electronic unit and with it.
Patent documentation 1: (Japan) spy opens the 2006-286707 communique
But; When two arranged outside assembly supply devices at carrying device; When particularly using following pallet supply unit as an assembly supply device, promptly this pallet supply unit carries electronic unit and places on the pallet and utilize adsorption mouth that it is taken out, and is used to be installed to taking out from this pallet supply unit under the few situation of electronic unit quantity on the printed base plate of substrate kind of a kind; The working condition variation of corresponding beam causes production efficiency low.
Summary of the invention
Therefore, the objective of the invention is to, even if under the few situation of the electronic unit of assembly supply devices such as pallet supply unit taking-up, also can improve the operating state of beam and seek to enhance productivity.
Therefore; In the installation method of electronic unit of first invention; Electronic component mounting apparatus has: the carrying device of conveyance printed base plate, supply with electronic unit assembly supply device, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source can be respectively in the installation head that on the direction of said each beam, moves; The said assembly supply device of two arranged outside at said carrying device; Drive said each drive source, each installation head of being located on the said a pair of beam is moved between printed base plate on the said carrying device and said assembly supply device, utilize the adsorption mouth of being located at said each installation head; Be installed on the said printed base plate from said assembly supply device taking-up electronic unit and with it; This installation method is characterised in that, supplies with and carries out the installation head of the few side of mounted component quantity from the said assembly supply device of a side, the electronic unit absorption that will supply with from the assembly supply device of opposite side and installing.
In the installation method of electronic unit of second invention; Electronic component mounting apparatus has: the carrying device of conveyance printed base plate, supply with electronic unit assembly supply device, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source can be respectively in the installation head that on the direction of said each beam, moves; An outside and the said assembly supply device of another arranged outside at said carrying device; Drive said each drive source; The said installation head that makes the said installation head of being located at an outside and be located at another outside moves between the said assembly supply device in the said assembly supply device in the printed base plate on the said carrying device and an outside and another outside; The adsorption mouth of said each installation head is located in utilization; Be installed on the said printed base plate from said assembly supply device taking-up electronic unit and with it; This installation method is characterised in that, supplies with and carries out the adsorption head in the few outside of mounted component quantity from the said assembly supply device in an outside, the electronic unit absorption that will supply with from the assembly supply device in another outside and installing.
In the installation method of electronic unit of the 3rd invention; Electronic component mounting apparatus has: the carrying device of conveyance printed base plate, supply with electronic unit assembly supply device, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source can be respectively in the installation head that on the direction of said each beam, moves; The said assembly supply device of two arranged outside at said carrying device; Drive said each drive source; Each installation head of being located on said two beams is moved between printed base plate on the said carrying device and said assembly supply device; The adsorption mouth of said each installation head is located in utilization; Be installed on the said printed base plate from said assembly supply device taking-up electronic unit and with it; This installation method is characterised in that, supplies with and is used to be installed to the few installation head of number of components on the printed base plate of substrate kind of a kind from the said assembly supply device of a side, the electronic unit absorption that will supply with from the assembly supply device of opposite side and installing.
In the installation method of electronic unit of the 4th invention; Electronic component mounting apparatus has: the carrying device of conveyance printed base plate, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source to be located at an outside in the installation head that on the direction of said each beam, moves, across said carrying device and supply with the pallet supply unit of the electronic unit that is incorporated in pallet and be located at another outside and supply with the assembly supply device of the electronic unit of being taken in respectively; Drive said each drive source; Each installation head of being located on said two beams is moved between the printed base plate on the said carrying device and said pallet supply unit and said assembly supply device; The adsorption mouth of said each installation head is located in utilization; Take out electronic unit and it is installed on the said printed base plate from said pallet supply unit and said assembly supply device; This installation method is characterised in that; Supply with and be used to be installed to the few installation head of number of components of printed base plate of the substrate kind of a kind from said pallet supply unit, the electronic unit absorption that will supply with from said assembly supply device and installing.
The installation method of the electronic unit of the 5th invention is in the 4th invention; It is characterized in that; When the electronic unit of supplying with and be installed on printed base plate from said pallet supply unit becomes when not having, be used for the electronic unit absorption that the few installation head of mounted component quantity will supply with from said assembly supply device and install.
In the installation method of electronic unit of the 6th invention; Electronic component mounting apparatus has: the carrying device of conveyance printed base plate, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source to be located at an outside in an installation head that on the direction of said each beam, moves and another installation head, across said carrying device and supply with the pallet supply unit of the electronic unit that is incorporated in pallet and be located at another outside and supply with the assembly supply device of the electronic unit of being taken in respectively; Drive said each drive source; A said installation head and another installation head are moved between the printed base plate on the said carrying device and said pallet supply unit and said assembly supply device; The adsorption mouth of said each installation head is located in utilization; Take out electronic unit and it is installed on the said printed base plate from said pallet supply unit and said assembly supply device; This installation method is characterised in that; Supply with and be used for the said installation head that mounted component becomes not to be had from said pallet supply unit, the electronic unit absorption that will supply with from said assembly supply device and installing.
In the electronic component mounting apparatus of the 7th invention; It is characterized in that; Have: the carrying device of conveyance printed base plate, supply with electronic unit and be located at respectively two outsides of said carrying device assembly supply device, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source can be respectively in the installation head that on the direction of said each beam, moves; Drive said each drive source; Utilization is located at the adsorption mouth of the installation head on said each beam and is taken out electronic unit from any said assembly supply device; And; The electronic unit that said printed base plate was taken out and be installed on to said adsorption mouth on a beam from the said assembly supply device of being located at an outside after a little while, the said adsorption mouth on the beam is taken out parts and it is installed on said printed base plate from the said assembly supply device of being located at another outside.
The electronic unit erection sequence of electronic component mounting apparatus in the 8th invention is confirmed in the method; Electronic component mounting apparatus has: the carrying device of conveyance printed base plate, supply with electronic unit assembly supply device, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source can be respectively in the installation head that on the direction of said each beam, moves; An outside and the said assembly supply device of another arranged outside at said carrying device; Drive said each drive source; The said installation head that makes the said installation head of being located at an outside and be located at another outside moves between the said assembly supply device in the said assembly supply device in the printed base plate on the said carrying device and an outside and another outside; The adsorption mouth of said each installation head is located in utilization; Be installed on the said printed base plate from said assembly supply device taking-up electronic unit and with it; This electronic unit erection sequence confirms that method is characterised in that; Have the step of confirming as follows, promptly supply with and carry out the adsorption head in the few outside of mounted component quantity, the electronic unit absorption that will supply with from the assembly supply device in another outside and installing from the said assembly supply device in an outside.
The electronic unit erection sequence of electronic component mounting apparatus in the 9th invention is confirmed in the method; Electronic component mounting apparatus has: the carrying device of conveyance printed base plate, supply with electronic unit assembly supply device, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source can be respectively in the installation head that on the direction of said each beam, moves; The said assembly supply device of two arranged outside at said carrying device; Drive said each drive source; Each installation head of being located on said two beams is moved between printed base plate on the said carrying device and said assembly supply device; The adsorption mouth of said each installation head is located in utilization; Be installed on the said printed base plate from said assembly supply device taking-up electronic unit and with it, this electronic unit erection sequence confirms that method is characterised in that, has the step of confirming as follows; Promptly supply with and be used to be installed to the few installation head of number of components of printed base plate of the substrate kind of a kind, the electronic unit absorption that will supply with from the assembly supply device of opposite side and installing from the said assembly supply device of a side.
The electronic unit erection sequence of electronic component mounting apparatus in the tenth invention is confirmed in the method; Electronic component mounting apparatus has: the carrying device of conveyance printed base plate, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source to be located at an outside in the installation head that on the direction of said each beam, moves, across said carrying device and supply with the pallet supply unit of the electronic unit that is incorporated in pallet and be located at another outside and supply with the assembly supply device of the electronic unit of being taken in respectively; Drive said each drive source; Each installation head of being located on said two beams is moved between the printed base plate on the said carrying device and said pallet supply unit and said assembly supply device; The adsorption mouth of said each installation head is located in utilization; Take out electronic unit and it is installed on the said printed base plate from said pallet supply unit and said assembly supply device; This electronic unit erection sequence confirms that method is characterised in that; Has the step of confirming as follows; Promptly supply with and be used to be installed to the few installation head of number of components of printed base plate of the substrate kind of a kind, the electronic unit absorption that will supply with from said assembly supply device and installing from said pallet supply unit.
Even if the present invention under the few situation of the electronic unit that takes out from assembly supply devices such as pallet supply units, also can improve the working condition of beam and seek to enhance productivity.
Description of drawings
Fig. 1 is the simple vertical view of the electronic component mounting apparatus of first execution mode;
Fig. 2 is the control block diagram;
Fig. 3 is the figure of the installation data of expression substrate kind A;
Fig. 4 is the figure of component configuration data of the assembly supply device of expression substrate kind A;
Fig. 5 is the figure of component configuration data of the pallet supply unit of expression substrate kind A;
Fig. 6 is the figure of expression substrate kind A in the layer data of pallet supply unit;
Fig. 7 is the figure of the installation data of expression substrate kind B;
Fig. 8 is the figure of component configuration data of the assembly supply device of expression substrate kind B;
Fig. 9 is the figure of component configuration data of the pallet supply unit of expression substrate kind B;
Figure 10 is the figure of expression substrate kind B in the layer data of pallet supply unit;
Figure 11 is the figure of the installation data of expression substrate kind C;
Figure 12 is the figure of component configuration data of the assembly supply device of expression substrate kind C;
Figure 13 is in the first embodiment, the simple plane graph of electronic component mounting apparatus when the beam of pallet supply unit side moves to the assembly supply device side;
Figure 14 is that wherein this electronic component mounting apparatus has the pallet supply unit with the simple plane graph of the hookup wire of a plurality of electronic part feeders bindings that comprise electronic component mounting apparatus;
Figure 15 is the simple plane graph of the electronic component mounting apparatus of other execution mode;
Figure 16 is in other embodiments, the simple plane graph of electronic component mounting apparatus when the beam of pallet supply unit side moves to the assembly supply device side;
Figure 17 is the simple plane graph of major part of the electronic component mounting apparatus of other execution modes.
Description of reference numerals
1 electronic component mounting apparatus, 2 carrying devices, 3 assembly supply devices, 4 pallets, 5 pallet supply units, 7,8 beams, 10,11 installation head, 13 parts feed unit P printed base plates
Embodiment
Below, based on Fig. 1～Fig. 4, the electronic component mounting apparatus that electronic unit is installed is explained first execution mode on printed base plate.On electronic component mounting apparatus 1, be provided with: along the carrying device 2 of directions X conveyance printed base plate P; Be located at the pallet supply unit 5 of a side promptly inboard (above being) of this carrying device 2 in Fig. 1; The opposite side of being located at carrying device 2 is the transfer cart assembly supply devices 3 such as (カ one ト) that front side (below being) and the for example a plurality of parts feed units loading and unloading that will supply with electronic unit are arranged freely in Fig. 1; The a pair of beam 7,8 that utilizes drive source to move towards a direction; Has adsorption mouth respectively and in the installation head 10,11 of on the direction of said each beam 7,8, utilizing each drive source to move.
Pallet supply unit 30 is assembly supply devices of following supply electronic unit; Promptly; Exchange taking on the above-below direction to carry to be equipped with the supporting plate 44 of pallet 4 and supporting plate 44 is supplied with between the position at incorporating section and parts, this pallet 4 for example disposes a plurality of electronic unit proper alignment.This pallet supply unit 30 has: the branch multilayer is taken in the case of supporting plate 44, the derivation mechanism that the supporting plate 44 of the appointment in this case is drawn, the supporting plate 44 that this derivation mechanism is drawn rise to the elevating mechanism that electronic unit is supplied with the position always; But be not limited to this; So long as use the assembly supply device of pallet 4 supply electronic units to get final product, with its structure-irrelevant.
Said carrying device 2 is by constituting like lower component: the substrate supply unit, and it is equipped on the pars intermedia of electronic component mounting apparatus 1 and accepts printed base plate P from the upstream side device; The location division, for the electronic unit that is kept by each adsorption mouth 100,110 absorption of said each installation head 10,11 is installed, it will be located from the printed base plate P that the substrate supply unit is supplied with and be fixing; Discharge portion, its acceptance utilize this location division be equipped with electronic unit printed base plate P and with its conveyance to the downstream device.
In addition; Said assembly supply device 3 has the base portion 12 of supply; On this supply base portion 12, loading and unloading and being arranged with a plurality of parts feed units freely is parts feed unit 13, and various electronic units are supplied to its parts taking-up portion (parts absorption position) respectively one by one.
The beam 7 of the side (pallet supply unit 7 sides) on directions X in a pair of beam in front and back of length and the beam 8 of opposite side (assembly supply device 3 sides); Utilize the driving of each Y direction linear motor 9; The guide rail that extends along pair of right and left along front and back slides the slide block that is fixed on said each beam and moves along the Y direction respectively.The linear electric tools of said Y direction has: along the fixing a pair of stator up and down of pair of right and left matrix 1A, 1B be fixed in the movable part 9a of the bottom of the mounting panel that is provided with at said beam 7,8 both ends.
In addition, on said beam 7,8, on its length direction (directions X), be provided with installation head 10,11 respectively in the inboard, this installation head 10,11 moves along guide rail through directions X linear motor 23 (with reference to Fig. 2).Said directions X linear motor by a pair of stator in front and back that is fixed in each beam 7,8 and between each stator and the movable part of being located at said installation head 10,11 constitute.
Therefore, each installation head 10,11 is located at the inboard of each beam 7,8 with the mode of facing mutually, above the parts extracting position of the printed base plate P on the location division of said carrying device 2 or parts feed unit 13 or pallet 4, moves.
In addition; Also can on each installation head 10,11, be equipped with adsorption mouth with reserving predetermined distance in a circumferential direction; This adsorption mouth for example utilizes four springs to be applied in active force downwards, and a plurality of parts feed units 13 of arranging setting from the adsorption mouth that is positioned at 3 and 9 positions of utilizing each installation head 10,11 take out electronic unit simultaneously.Lower shaft motor 25 (with reference to Fig. 2) can go up and down in this adsorption mouth utilization; In addition; Utilize θ axle motor 26 (with reference to Fig. 2) to make installation head 10,11 around vertical axle rotation; Consequently, each adsorption mouth 5 of each installation head 10,11 can move along directions X and Y direction, can rotate and can move up and down around plumb line.
In addition, on each installation head 10,11, be provided with substrate identification camera 14,14, the printed base plate P that is positioned gone up incidental positioning mark take.In addition, utilize component identification camera 15, the electronic unit that is kept by each adsorption mouth absorption is taken in the lump.
Fig. 2 is used to the control block diagram that relevant control is installed with the electronic unit of electronic component mounting apparatus 1 is described, below describes.Each key element of electronic component mounting apparatus 1 is stored ROM (read-only memory) 36 of the program relevant with this control and RAM (random access memory) 17 of store various kinds of data and is linked together via bus 18 through CPU (CPU) 16 centralized control.The touch-screen switch 21 as input mechanism that is used for the monitor 20 of display-operation picture etc. and is formed at the display frame of this monitor 20 links together with CPU16 via interface 22.In addition, said Y direction linear motor 9 grades are connected with said CPU16 via drive circuit 24, interface 22.
In said RAM17, the kind (substrate kind) of corresponding every kind of printed base plate P and store the NC data, these NC data comprise: operating data, step data, installation data, component configuration data etc.Said operating data comprises: accomplish pattern as the having or not of the thickness of the size of the directions X of the explanation of NC data name, printed base plate and Y direction, printed base plate, prepackage (Japanese: prepay) parts, the height of preassembled unit, substrate.For example the installation data of substrate kind A is as shown in Figure 3 as the many printed base plate of the quantity of the electronic unit of supplying with from substrate supply unit 5.In this installation data; When utilizing electronic component mounting apparatus 1 to produce the printed base plate P of substrate kind A; In order alternately to take out electronic unit extremely effectively and it to be installed on printed base plate, will take out the order optimization of electronic units and preestablish from assembly supply device 3 and pallet supply unit 5 from assembly supply device 3 or pallet supply unit 5.
In addition; Information corresponding to the kind (parts ID) of each electronic unit of the parts feed unit config. number of said each parts feed unit 13 is that the component configuration data are as shown in Figure 4, is that the component configuration data are as shown in Figure 5 corresponding to the information of the kind (parts ID) of each electronic unit of the config. number of the pallet 4 of pallet supply unit 5.And, in RAM17, store and be illustrated in the layer data of which layer to take in which pallet (FDR) in the pallet supply unit 5 shown in Figure 6.
In addition, about the few substrate kind B of quantity of the electronic unit of supplying with as printed base plate and from pallet supply unit 5 after substrate kind A, produced, predefined installation data shown in Figure 7 is stored among the RAM17.In this installation data; When utilizing electronic component mounting apparatus 1 to produce the printed base plate P of substrate kind B; In order to take out electronic unit extremely efficiently from assembly supply device 3 or pallet supply unit 5 and it to be installed on the printed base plate, will take out the order optimization of electronic units and preestablish from assembly supply device 3 and pallet supply unit 5.For example; To be positioned at a side and be few pallet supply unit 5 sides of mounted component (promptly; The side that mounted component is few) installation head 10 (No.1) is set via following steps; Promptly for example in step number [0009]～[0012] etc., the step of confirming with the mode of adsorbing from another many feedway side of mounted component number.In addition, about the component configuration data shown in Figure 8 of parts feed unit, be stored among the RAM17 about the component configuration data shown in Figure 9 of pallet supply unit and layer data shown in Figure 10.And, predefined installation data shown in Figure 11, be stored among the RAM17 as substrate kind C printed base plate, that do not have the electronic unit of supplying with from pallet supply unit 5 about the component configuration data shown in Figure 12 of parts feed unit about what produce after the substrate kind B.For example; To be positioned at pallet supply unit 5 sides that promptly there are not mounted component in a side (promptly; A side that does not have mounted component) installation head 10 (No.1) is set via following steps; Promptly for example in step number [0005]～[0008], [0013]～[0016] etc., the step of confirming with the mode of adsorbing from another many feedway side of mounted component number.
Installation data shown in Figure 3 take in corresponding its each erection sequence (each step number) with the bight of the left upper portion of each printed base plate P as the config. number information (FDR) of the number information (by [1]～[4] expression) of the directions X of the installation coordinate of each electronic unit in each printed base plate P of initial point (in Fig. 1 right-hand for just), Y direction (below in Fig. 1 for just) and setting angle information or adsorption mouth, each parts feed unit, the number information of installation head 10,11 (be located at installation head 10 on the inboard beam 7 by [1] expression, the installation head 11 in front of being located on the beam 8 of side is by [2] expression) etc.
According to this installation data, step number [0001]～[0004] and [0009]～[0012] ... the installation head of being located on the inboard beam 7 10 (No.1 sign indicating number [1]) is used in expression, and electronic unit is installed on printed base plate P.Installation head 11 (No.1 sign indicating number [2]) in front of step number [0005]～[0008] and [0013]～[0016] expression are used and be located on the beam 8 of side is installed on printed base plate P with electronic unit.
In addition, in said RAM13, also store by shape data, recognition data, control data, parts and supply with the part library data etc. that data constitute and represent the characteristic of each electronic unit.
Reference numeral 27 is the recognition process units that are connected with said CPU16 via interface 17; The identification of the image that utilizes said substrate identification camera 14 or 15 shootings of component identification camera and be taken into is handled and is undertaken by recognition process unit 27, and result is passed out among the CPU16.That is, CPU16 outputs to recognition process unit 27 so that the image that utilizes substrate identification camera 14 or component identification camera 15 to take is discerned processings (calculating of position offset etc.) with indication, and self-identifying processing unit 27 receives and discerns results.
According to above structure, below action is described.
At first, the operator carries out pressing operation to the touch-screen switch 21 that is shown in monitor 20, and the kind of the printed base plate P that after this produces is appointed as substrate kind A, and through pushing the running switch, electronic component mounting apparatus 1 begins to produce running.
Then; As shown in arrow 33; When making on its supply unit that is present in carrying device 2 when accepting printed base plate P from upstream side device (not shown), the printed base plate P on the supply unit is moved to the location division, this printed base plate P carries out located and fixed on in-plane and above-below direction.
Then; P positions when printed base plate; The guide rail that then inboard beam 7 utilizes the driving of Y direction linear motor 9 to extend along front and back slides slide block and moves to the Y direction, and installation head 10 utilizes directions X linear motor 23 to move and move to always the parts extracting position top of pallet 4 to directions X; The driving of lower shaft motor descends adsorption mouth 101 in the utilization, thereby takes out electronic unit from pallet 4.At this moment, make installation head 10 move and make its rotation to directions X, and then adsorption mouth 101 is gone up and down, thus, a plurality of adsorption mouth 101 can be taken out electronic units from pallet 4.
Then; P positions when printed base plate; Then CPU16 controls according to the installation data (with reference to Fig. 3) that is stored in the substrate kind A among the RAM17 as follows; Promptly the installation head 10,11 of two beams 7,8 is taken out electronic unit from pallet 4 and 13 whiles (not being " synchronously ") of parts feed unit, and is installed to simultaneously on each printed base plate P.At this moment, the Y direction control so that two beams 7,8 not too near, and directions X control so that two installation head 10,11 not too near, prevent that thus the installation head 10,11 of two beams 7,8 from producing conflict.
At first; From step number [0001] to [0004]; The installation head 10 (the No.1 sign indicating number [1] among Fig. 3) that utilization is located on the inboard beam 7 is taken out electronic unit successively from pallet 4; Meanwhile, to [0008], utilize the installation head 11 (the No.1 sign indicating number [2] among Fig. 3) on the beam 8 of being located at the front side to take out electronic unit successively from step number [0005] from parts feed unit 13.Promptly; Each installation head 10,11 is as follows according to four electronic units of step number absorption of correspondence and with its taking-up; Promptly in step number [0001], the pallet 4 of adsorption mouth 101 self-configurings number [301] of being located at the ozzle number [1] of the installation head 10 on the inboard beam 7 takes out electronic units, meanwhile; In step number [0005], the parts feed unit 13 of adsorption mouth 111 self-configurings number [221] of the ozzle number [1] of the installation head 11 in front of being located on the beam 8 of side takes out electronic unit.At this moment; The beginning of the parts absorption of the installation head 11 of front side produces deviation sometimes with the beginning of the parts absorption of inboard installation head 10; In addition, the absorption of whole parts of the installation head 11 of front side finishes and the absorption of whole parts of the installation head 10 of inboard finishes also to produce sometimes deviation.
In addition; After carrying out this taking-up, the adsorption mouth 101,111 of two installation head 10,11 is risen, make installation head 10,11 through component identification camera 15 tops; In this moving process; Each four electronic unit to being kept by four adsorption mouth, 101,111 absorption of two installation head 10,11 are taken in the lump, and 27 pairs of these images that are taken of recognition process unit are discerned processing, thereby hold the offset of electronic unit with respect to each adsorption mouth 101,111.
After this; The substrate identification camera 8 of the installation head 10,11 of being located at two beams 7,8 is moved to each printed base plate P top; The incidental positioning mark of printed base plate P to location on carrying device 2 is taken; 27 pairs of these images that are taken of recognition process unit are discerned processing, hold the position of each printed base plate P thus.Then, in the installation coordinate of installation data, add position recognition result and each the component identification result of each printed base plate P, thus, the capable revisal of each adsorption mouth 101,111 contraposition offset shift-in, and respectively electronic unit is installed on each printed base plate P.
Promptly; Electronic unit for step number [0001] to [0004]; The adsorption mouth 101 of being located at the installation head 10 on the inboard beam 7 is adsorbed maintenance to supplying with from pallet 4 on printed base plate P electronic unit carries out revisal and installs successively; Meanwhile; For the electronic unit of step number [0005] to [0008], the adsorption mouth 111 of the installation head 11 in front of being located on the beam 8 of side is carried out revisal to the electronic unit that is adsorbed maintenance from 13 supplies of parts feed unit and is installed successively on printed base plate P.In this case, also utilize corresponding Y direction linear motor 9 of CPU16 control and directions X linear motor 23 so that the installation head 10,11 of two beams 7,8 is not conflicted.At this moment; The beginning that the parts of the installation head 11 of front side are installed produces deviation sometimes with the beginning that the parts of inboard installation head 10 are installed; In addition, the installation of whole parts of the installation head 11 of front side finishes and the installation of whole parts of the installation head 10 of inboard finishes also to produce sometimes deviation.
Then; From step number [0009] to [0012]; The installation head 10 that utilization is located on the inboard beam 7 is taken out electronic unit successively from inboard pallet 4; Meanwhile, to [0016], utilize the parts feed unit 13 of installation head 11 side on the beam 8 of being located at the front side to take out electronic units from step number [0013] from the front.In addition, after carrying out this taking-up, as stated, two installation head 10,11 move, and during this period, recognition process unit 22 is discerned processing, thereby the electronic unit that assurance is adsorbed is with respect to the offset of adsorption mouth.
Then, in the installation coordinate of installation data, add position recognition result and each the component identification result of each printed base plate P, thus, the capable revisal of each adsorption mouth 101,111 contraposition offset shift-in, and respectively electronic unit is installed on each printed base plate P.Promptly; Electronic unit for step number [0009] to [0012]; On the printed base plate P electronic unit of being located at the adsorption mouth 101 absorption maintenances that are provided with on the installation head 10 on the inboard beam 7 is being carried out revisal and installing successively; Meanwhile, for the electronic unit of step number [0013] to [0016], carry out revisal and install successively at the electronic unit that on the printed base plate P adsorption mouth 111 absorption that are provided with on by the installation head 11 on the beam 8 of side in front of being located at is kept.
Like this; Electronic unit from step number [0009] to [0012] is mounted after pallet 4 takes out; During before above installation head 10 arrival pallets 4; Pallet supply unit 5 moves based on the signal from CPU16, and the pallet 4 that is positioned at carrying device 2 sides replaces with the pallet 4 of config. number [301].
Then; From step number [0017] to [0020]; The installation head 10 that utilization is located on the inboard beam 7 is taken out electronic unit successively from inboard pallet 4; Meanwhile, to [0024], utilize the parts feed unit 13 of installation head 11 side on the beam 8 of being located at the front side to take out electronic units from step number [0021] from the front.In addition, after carrying out this taking-up, as stated, two installation head 10,11 move, and during this period, recognition process unit 22 is discerned processing, thereby the electronic unit that assurance is adsorbed is with respect to the offset of adsorption mouth.
Then, in the installation coordinate of installation data, add position recognition result and each the component identification result of each printed base plate P, thus, the capable revisal of each adsorption mouth 101,111 contraposition offset shift-in, and respectively electronic unit is installed on each printed base plate P.Promptly; Electronic unit for step number [0017] to [0020]; On the printed base plate P electronic unit of being located at the adsorption mouth 101 absorption maintenances that are provided with on the installation head 10 on the inboard beam 7 is being carried out revisal and installing successively; Meanwhile, for the electronic unit of step number [0021] to [0024], carry out revisal and install successively at the electronic unit that on the printed base plate P adsorption mouth 111 absorption that are provided with on by the installation head 11 on the beam 8 of side in front of being located at is kept.
Then; Likewise; To [0028], utilize the installation head of being located on the inboard beam 7 10 to take out electronic unit successively, meanwhile from step number [0025] from inboard pallet 4; To [0032], utilize the parts feed unit 13 of installation head 11 side on the beam 8 of being located at the front side to take out electronic units from step number [0029] from the front.Then, on printed base plate P, the electronic unit from step number [0025] to [0028] is carried out revisal and also install successively, meanwhile, on printed base plate P, the electronic unit from step number [0029] to [0032] is carried out revisal and also install successively.
After, utilize the installation head of inboard installation head 10 and front side to take out the electronic unit that is incorporated in pallet 4 and parts feed unit 13 in the lump, be installed on successively on the printed base plate P; When electronic unit when the installation of a printed base plate P finishes; Utilize carrying device 2 to take out of this printed base plate P, in addition, move into new printed base plate from upstream side; As stated, electronic unit is installed on the printed base plate.Like this, utilize the installation head 11 of inboard installation head 10 and front side to share the electronic unit that is incorporated in pallet 4 and parts feed unit 13 and adsorb maintenance, and it is installed on the printed base plate successively, therefore, can do one's utmost to shorten and install intermittently.
In addition; After the production of the printed base plate of substrate kind A finishes; Then, the operator carries out pressing operation to the touch-screen switch 21 that is shown in monitor 20, the kind of the printed base plate P that after this produces is appointed as the few substrate kind B of quantity of the electronic unit of installing from 5 taking-ups of pallet supply unit; Through pushing the running switch, the production running of the printed base plate of beginning substrate kind B.
Then; When making on its supply unit that is present in carrying device 2 when accepting the printed base plate P of substrate kind B from upstream side device (not shown); Printed base plate P on the supply unit is moved to the location division, and this printed base plate P carries out located and fixed on in-plane and above-below direction.
Then; When printed base plate P positions; CPU16 controls according to the installation data that is stored in the substrate kind B that Fig. 7 put down in writing among the RAM17 as follows; Promptly the installation head 10,11 of two beams 7,8 is taken out electronic unit from pallet 4 and 13 whiles (not being " synchronously ") of parts feed unit, and attaches it on each printed base plate P.
In the installation data of substrate kind B; When utilizing electronic component mounting apparatus 1 to produce the printed base plate P of substrate kind B; Take out and the quantity of the electronic unit installed and take out and balance between the quantity of the electronic unit installed when having difference from pallet supply unit 5 from assembly supply device 3; In this embodiment; The quantity of the electronic unit that the quantity of the electronic unit of installing from 5 taking-ups of pallet supply unit is installed than taking out from assembly supply device 3 after a little while; On installation head 10 and installation head 11, identical adsorption mouth is installed respectively; The quantity of the electronic unit of installing to do one's utmost to make installation head 10 to take out take out with installation head 11 and equilibrium phase between the quantity of the electronic unit installed with, that is, carry out optimization with the electronic unit of each adsorption head 101,111 taking-up of distributing each installation head 10,11 and distribute each step.
In addition; Owing to beam 7 can not be crossed apparatus for mounting component 3 sides that beam 8 moves to the front side, therefore, through do one's utmost to distribute more electronic unit to pallet supply unit 5; And do one's utmost to reduce the electronic unit that distributes to assembly supply device 3, thereby can do one's utmost to improve the operating efficiency of installation head 10.
At this moment, the Y direction control so that two beams 7,8 not too near, and directions X control so that two installation head 10,11 not too near, prevent that thus the installation head 10,11 of two beams 7,8 from producing conflict.
At first; From the step number [0001] of installation data shown in Figure 7 to [0004]; The installation head 10 (the No.1 sign indicating number [1] among Fig. 3) that utilization is located on the inboard beam 7 is taken out electronic unit successively from pallet 4; Meanwhile, to [0008], utilize the installation head 11 (the No.1 sign indicating number [2] among Fig. 3) on the beam 8 of being located at the front side to take out electronic unit successively from step number [0005] from parts feed unit 13.Promptly; Each installation head 10,11 is as follows according to four electronic units of step number absorption of correspondence and with its taking-up; Promptly in step number [0001], the pallet 4 of adsorption mouth 101 self-configurings number [301] of being located at the ozzle number [1] of the installation head 10 on the inboard beam 7 takes out electronic units, meanwhile; In step number [0005], the parts feed unit 13 of adsorption mouth 111 self-configurings number [201] of the ozzle number [1] of the installation head 11 in front of being located on the beam 8 of side takes out electronic unit.At this moment; When producing substrate kind A likewise; The beginning of the parts absorption of the installation head 11 of front side produces deviation sometimes with the beginning of the parts absorption of inboard installation head 10; In addition, the absorption of whole parts of the installation head 11 of front side finishes and the absorption of whole parts of the installation head 10 of inboard finishes also to produce sometimes deviation.
In addition, after carrying out this taking-up, likewise, two installation head 10,11 move during with above-mentioned production substrate kind A, and during this period, recognition process unit 22 is discerned processing, thereby hold the offset with respect to adsorption mouth of the electronic unit that is adsorbed.
Then, in the installation coordinate of installation data, add position recognition result and each the component identification result of each printed base plate P, thus, the capable revisal of each adsorption mouth 101,111 contraposition offset shift-in, and respectively electronic unit is installed on each printed base plate P.Promptly; For electronic unit from step number [0001] to [0004]; On the printed base plate P electronic unit of being located at the adsorption mouth 101 absorption maintenances that are provided with on the installation head 10 on the inboard beam 7 is being carried out revisal and installing successively; Meanwhile, for electronic unit, carry out revisal and install successively at the electronic unit that on the printed base plate P adsorption mouth 111 absorption that are provided with on by the installation head 11 on the beam 8 of side in front of being located at is kept from step number [0005] to [0008].
Be merely the electronic unit of above-mentioned steps number [0001] to [0004] from the electronic unit of pallet supply unit 5 supplies.Below, the taking-up of above-mentioned electronic unit and installation action are finished the back electronic unit describe to the installation action of printed base plate P.
In parts installation data shown in Figure 7, also be set with electronic unit finishes the back electronic unit from the supply of pallet supply unit 5 installation steps.Be installed on the printed base plate P based on the electronic unit of these installation steps from step number [0009] to [0032].
Promptly; Shown in figure 13, the installation head of being located on the inboard beam 7 10 moves to the top of the parts feed unit 13 of front side, from step number [0009] to [0012]; Utilize installation head 10 to take out electronic unit successively from parts feed unit 13; Meanwhile, to [0016], utilize the installation head 11 on the beam 8 of being located at the front side to take out electronic units from step number [0013] from parts feed unit 13.In addition; After carrying out this taking-up, as stated, make component identification camera 15,15 tops of two installation head 10,11 through side in front of being located at side by side; In this moving process; Each four electronic unit to being kept by four adsorption mouth, 101,111 absorption of two installation head 10,11 are taken in the lump, and 27 pairs of these images that are taken of recognition process unit are discerned processing, thereby hold the offset of electronic unit with respect to each adsorption mouth 101,111.
Then, in the installation coordinate of installation data, add position recognition result and each the component identification result of each printed base plate P, thus, the capable revisal of each adsorption mouth 101,111 contraposition offset shift-in, and respectively electronic unit is installed on each printed base plate P.Promptly; For electronic unit from step number [0009] to [0012]; Carrying out revisal at the electronic unit that on the printed base plate P adsorption mouth 101 absorption of being located at the installation head 10 on the inboard beam 7 is kept also installs successively; Meanwhile, for electronic unit, carry out revisal at the electronic unit that on the printed base plate P adsorption mouth 111 of the installation head 11 on the beam 8 of side in front of being located at is adsorbed maintenance and also install successively from step number [0013] to [0016].
Like this; When producing a printed base plate; When the electronic unit quantity of supplying with from pallet supply unit 5 after a little while, be located at pallet supply unit 5 same side promptly the installation head 10 of inboard beam 7 take out electronic units and after the running that printed base plate P installs finished, beam moved to the direction of parts feed unit 13 from pallet supply unit 5; Installation head 10 is crossed printed base plate P and is moved to the front side; Likewise be installed on the printed base plate P with installation head 11, therefore, when producing printed base plate, can utilize the installation head 10 of pallet supply unit 5 sides from parts feed unit 13 taking-up electronic units and with it.Consequently, the working condition that beam 7 is an installation head 10 can be improved, and the production efficiency of printed base plate P can be improved.
Then; To [0020], with from the electronic unit of step number [0009] to [0012] likewise, inboard beam 7 is to parts feed unit 13 side shiftings from step number [0017]; Utilize installation head 10 to take out electronic unit successively from parts feed unit 13; Meanwhile, to [0024], utilize the parts feed unit 13 of installation head 11 side on the beam 8 of being located at the front side to take out electronic units from step number [0021] from the front.In addition, after carrying out this taking-up, as stated, two installation head 10,11 move, and during this period, recognition process unit 22 is discerned processing, thereby the electronic unit that assurance is adsorbed is with respect to the offset of adsorption mouth.
Then, in the installation coordinate of installation data, add position recognition result and each the component identification result of each printed base plate P, thus, the capable revisal of each adsorption mouth 101,111 contraposition offset shift-in, and respectively electronic unit is installed on each printed base plate P.Promptly; For electronic unit from step number [0017] to [0020]; Carrying out revisal at the electronic unit that on the printed base plate P adsorption mouth 101 absorption of being located at the installation head 10 on the inboard beam 7 is kept also installs successively; Meanwhile, for electronic unit, carry out revisal at the electronic unit that on the printed base plate P adsorption mouth 111 of the installation head 11 on the beam 8 of side in front of being located at is adsorbed maintenance and also install successively from step number [0021] to [0024].
Then; Likewise; To [0028], utilize the parts feed unit 13 of being located at installation head 10 side on the inboard beam 7 to take out electronic unit successively, meanwhile from step number [0025] from the front; To [0032], utilize the parts feed unit 13 of installation head 11 side on the beam 8 of being located at the front side to take out electronic units from step number [0029] from the front.In addition; On printed base plate P, the electronic unit from step number [0025] to [0028] being carried out revisal also installs successively; Meanwhile; On printed base plate P, the electronic unit from step number [0029] to [0032] is carried out revisal and also install successively, thereby utilize electronic component mounting apparatus 1 many ground to produce printed base plate P.
Like this, when producing the printed base plate P of substrate kind B, according to predefined installation data shown in Figure 7; Electronic unit is after the supply of pallet supply unit 5 finishes; The installation head 10 of beam 7 of being located at pallet supply unit 5 sides is to parts feed unit 13 side shiftings of a side opposite with pallet supply unit 5, be located on the beam 8 installation head 11 likewise, receive the electronic unit of supplying with from parts feed unit 13; And electronic unit is installed in continuation on printed base plate P; Therefore, the working condition that beam 7 is an installation head 10 can be further improved, and the production efficiency of printed base plate P can be done one's utmost to improve.
After this, when producing the printed base plate P of substrate kind B, when printed base plate P of every production; When finishing when pallet supply unit 5 takes out electronic unit, utilize the installation head 11 of inboard installation head 10 and front side to take out electronic unit in the lump, and be installed on successively on the printed base plate P from parts feed unit 13; When electronic unit when the installation of a printed base plate P finishes; Utilize carrying device 2 to take out of this printed base plate P, in addition, move into new printed base plate from upstream side; As stated, electronic unit is installed on the printed base plate.Like this; When the electronic unit quantity of taking out from pallet 4 after a little while, utilize the installation head 11 of inboard installation head 10 and front side to share the electronic unit and the absorption that are incorporated in parts feed unit 13 and keep, successively it is installed on the printed base plate; Therefore, can do one's utmost to shorten installation intermittently.
In addition; When producing the printed base plate P of substrate kind B; Shown in the installation data as shown in Figure 7; Installation head 10 is taken out electronic units and the step of installing is made as from initial step number [0001] to [0004] from pallet supply unit 5, after pallet supply unit 5 takes out electronic units and installs, take out electronic units and install from assembly supply device 3; But when producing printed base plate P of substrate kind B, installation head 10 also aborning arbitrary place on way take out electronic units and install from pallet supply unit 5.That is, also can installation head 10 be taken out electronic units and the step of installing is located at any place of the step of installation data from pallet supply unit 5, all can do one's utmost to improve the production efficiency of printed base plate P.
In addition; After the production of the printed base plate that finishes substrate kind B; Then, the operator carries out pressing operation to the touch-screen switch 21 that is presented in the monitor 20, the kind of the printed base plate P that after this produces is appointed as the substrate kind C that does not for example have the electronic unit of supplying with from pallet supply unit 5; Through pushing the running switch, the production running of the printed base plate of beginning substrate kind C.
Then; When making on its supply unit that is present in carrying device 2 when accepting the printed base plate P of substrate kind C from upstream side device (not shown); Printed base plate P on the supply unit is moved to the location division, and this printed base plate P carries out located and fixed on in-plane and above-below direction.
Then; P positions when printed base plate; Then CPU16 controls according to installation data that is stored in the substrate kind C that Figure 11 put down in writing among the RAM17 and component configuration data shown in Figure 12 as follows; Promptly the installation head 10,11 of two beams 7,8 is taken out electronic unit from 13 whiles (not being " synchronously ") of parts feed unit, and attaches it on each printed base plate P.In the case, also the Y direction control so that two beams 7,8 not too near, and directions X control so that two installation head 10,11 not too near, prevent that thus the installation head 10,11 of two beams 7,8 from producing conflict.
At first; From the step number [0001] to [0004] of installation data shown in Figure 11 and from step number [0005] to [0008], utilize these two installation head of installation head 10,11 (the No.1 sign indicating number [2,1] among Figure 11) on the beam 7,8 of being located at inboard and front side to take out electronic unit successively from parts feed unit 13.Promptly; Each installation head 10,11 as follows according to the step number of correspondence from parts feed unit four electronic units of 13 absorption and with its taking-up; Promptly in step number [0001]; The parts feed unit 13 of adsorption mouth 101 self-configurings number [201] of being located at the ozzle number [1] of the installation head 10 on the inboard beam 7 takes out electronic units; Meanwhile, in step number [0005], the parts feed unit 13 of adsorption mouth 111 self-configurings number [231] of the ozzle number [1] of the installation head 11 in front of being located on the beam 8 of side takes out electronic unit.At this moment; With produce above-mentioned each substrate kind time-like likewise; The beginning of the parts absorption of the installation head 11 of front side produces deviation sometimes with the beginning of the parts absorption of inboard installation head 10; In addition, the absorption of whole parts of the installation head 11 of front side finishes and the absorption of whole parts of the installation head 10 of inboard finishes also to produce sometimes deviation.
In addition, after carrying out this taking-up, and produce above-mentioned substrate kind time-like likewise, two installation head 10,11 move, and during this period, recognition process unit 22 is discerned processing, thereby hold the offset with respect to adsorption mouth of the electronic unit that is adsorbed.
Then, in the installation coordinate of installation data, add position recognition result and each the component identification result of each printed base plate P, thus, the capable revisal of each adsorption mouth 101,111 contraposition offset shift-in, and respectively electronic unit is installed on each printed base plate P.
In parts installation data shown in Figure 11, also be set with step number [0009] installation steps afterwards.Based on these installation steps, be installed on the printed base plate P from the electronic unit of step number [0009] to [0032].
Promptly; Shown in figure 13, the installation head of being located on the inboard beam 7 10 moves to the top of the parts feed unit 13 of front side, from step number [0009] to [0012]; Utilize installation head 10 to take out electronic unit successively from parts feed unit 13; Meanwhile, to [0016], utilize the installation head 11 on the beam 8 of being located at the front side to take out electronic units from step number [0013] from parts feed unit 13.In addition; After carrying out this taking-up, as stated, make component identification camera 15,15 tops of two installation head 10,11 through side in front of being located at side by side; In this moving process; Each four electronic unit to being kept by four adsorption mouth, 101,111 absorption of two installation head 10,11 are taken in the lump, and 27 pairs of these images that are taken of recognition process unit are discerned processing, thereby hold the offset of electronic unit with respect to each adsorption mouth 101,111.
Then, in the installation coordinate of installation data, add position recognition result and each the component identification result of each printed base plate P, thus, the capable revisal of each adsorption mouth 101,111 contraposition offset shift-in, and respectively electronic unit is installed on each printed base plate P.Promptly; For electronic unit from step number [0009] to [0012]; Carrying out revisal at the electronic unit that on the printed base plate P adsorption mouth 101 absorption of being located at the installation head 10 on the inboard beam 7 is kept also installs successively; Meanwhile, for electronic unit, carry out revisal at the electronic unit that on the printed base plate P adsorption mouth 111 of the installation head 11 on the beam 8 of side in front of being located at is adsorbed maintenance and also install successively from step number [0013] to [0016].
Then; To [0020], with from the electronic unit of step number [0009] to [0012] likewise, inboard beam 7 is to parts feed unit 13 side shiftings from step number [0017]; Utilize installation head 10 to take out electronic unit successively from parts feed unit 13; Meanwhile, to [0024], utilize the parts feed unit 13 of installation head 11 side on the beam 8 of being located at the front side to take out electronic units from step number [0021] from the front.In addition, after carrying out this taking-up, as stated, two installation head 10,11 move, and during this period, recognition process unit 22 is discerned processing, thereby the electronic unit that assurance is adsorbed is with respect to the offset of adsorption mouth.
Then, in the installation coordinate of installation data, add position recognition result and each the component identification result of each printed base plate P, thus, the capable revisal of each adsorption mouth 101,111 contraposition offset shift-in, and respectively electronic unit is installed on each printed base plate P.
Then; Likewise; To [0028], utilize the parts feed unit 13 of being located at installation head 10 side on the inboard beam 7 to take out electronic unit successively, meanwhile from step number [0025] from the front; To [0032], utilize the parts feed unit 13 of installation head 11 side on the beam 8 of being located at the front side to take out electronic units from step number [0029] from the front.In addition; On printed base plate P, the electronic unit from step number [0025] to [0028] being carried out revisal also installs successively; Meanwhile; On printed base plate P, the electronic unit from step number [0029] to [0032] is carried out revisal and also install successively, thereby utilize electronic component mounting apparatus 1 many ground to produce printed base plate P.
Like this, when producing the printed base plate P of substrate kind C, according to predefined installation data shown in Figure 11; When electronic unit when the taking-up of pallet supply unit 5 does not exist; Be located at installation head 10 on the beam 7 also to parts feed unit 13 side shiftings of a side opposite with pallet supply unit 5, be located on the beam 8 installation head 11 likewise, receive the electronic unit of supplying with from parts feed unit 13; And electronic unit is installed in continuation on printed base plate P; Therefore, the working condition that beam 7 is an installation head 10 can be further improved, and the production efficiency of printed base plate P can be done one's utmost to improve.
In addition; After the printed base plate P that produces substrate kind B; When producing the printed base plate P of substrate kind C, even if take off pallet supply unit 5 and delete the operation task that the assembly supply device with parts feed unit is installed, as stated; When producing the printed base plate P of substrate kind C, also can use installation head 10, can avoid production efficiency to reduce.
After this, when producing the printed base plate P of substrate kind C, when printed base plate P of every production; Utilize the installation head 11 of inboard installation head 10 and front side to take out electronic unit in the lump, and be installed on successively on the printed base plate P from parts feed unit 13, when electronic unit when the installation of a printed base plate P finishes; Utilize carrying device 2 to take out of this printed base plate P, in addition, move into new printed base plate from upstream side; As stated, electronic unit is installed on the printed base plate.Like this; When the electronic unit quantity of taking out from pallet 4 after a little while, utilize the installation head 11 of inboard installation head 10 and front side to share the electronic unit and the absorption that are incorporated in parts feed unit 13 and keep, successively it is installed on the printed base plate; Therefore, can do one's utmost to shorten installation intermittently.
In addition; Be not limited to pallet supply unit 5; When producing a printed base plate, even if under the situation that is provided with assembly supply device 3 assembly supply devices such as grade outside the promptly inboard pallet supply unit 5 of a side, when the parts of this assembly supply device certainly take out quantity after a little while; Through being arranged in after this assembly supply device takes out the step end of parts; Perhaps this assembly supply device certainly take out the step of parts during in, the installation head 10 utilized on the beam 7 of being located at a side is set takes out the step of electronic units and electronic unit is installed on the printed base plate, thereby can improve the operating efficiency of installation head 10 from the parts feed unit 13 of opposite side; Consequently, can do one's utmost to improve the production efficiency of printed base plate P.
And; By Y direction linear motor and the directions X linear motor of CPU16 control, also can utilize adsorption mouth 101,111 any in assembly supply device 3 or pallet supply unit 5 of being located at the installation head 10,11 on said each beam 7,8 to take out electronic unit corresponding to said beam 7,8.Therefore, also can take out electronic unit by each installation head 10,11 from pallet supply unit 5, thereby improve the operating efficiency of each installation head according to the substrate kind of the printed base plate of producing.
In above-mentioned first execution mode; Explained for an electronic component mounting apparatus 1 electronic unit is installed on the example of printed base plate that Figure 14 is the simple plane graph of the hookup wire L that two electronic component mounting apparatus 31,32 linked at the upstream side of electronic component mounting apparatus 1.In electronic component mounting apparatus 31,32, substitute the pallet supply unit of electronic component mounting apparatus 1, in the inboard parts feed unit 3 is connected, other structures are identical with electronic component mounting apparatus 1.
Like this; On the hookup wire L that constitutes in that a plurality of electronic component mounting apparatus 1,31 and 32 are linked; As shown in arrow 33, carry printed base plate P, utilize electronic component mounting apparatus 31,32 from each assembly supply device 13 supply part; And utilize the installation head of being located on each beam 7,8 10,11 to take out electronic unit, it is installed on the printed base plate P.In addition; In electronic component mounting apparatus 1, passing through electronic component mounting apparatus 31,32 and being equipped with on the printed base plate P of electronic unit, as explaining in above-mentioned first execution mode; Pallet 4 from pallet supply unit 5 is supplied with electronic unit and is utilized installation head 10 with its taking-up; And installation head 11 is taken out electronic units and is installed on the printed base plate P from assembly supply device 3, when the electronic unit that takes out from pallet supply unit 5 after a little while; Installation head 10 moves to assembly supply device 3 sides and takes out electronic units and install from assembly supply device 3; Therefore, during the printed base plate P of the substrate kind that the electronic unit quantity of taking out and installing from pallet supply unit 5 in production is few, can improve the operating efficiency of the installation head 10 of pallet supply unit 5 sides.
Consequently; Can improve the running efficiency of electronic component mounting apparatus 1; As the printed base plate P that will produce by the electronic component mounting apparatus of upstream side 32 during to electronic component mounting apparatus 1 conveyance; The situation of wait conveyance can be done one's utmost to avoid postponing and producing, the production efficiency of whole erection line can be improved in the production of electronic component mounting apparatus 1.
As the installation data of hookup wire, can make the installation data of whole erection line, perhaps, the electronic unit fabrication and installation data that also can install to being assigned to each electronic component mounting apparatus 1,31,32.
In addition, making each adsorption mouth 101 of being installed on installation head 10 and each adsorption mouth of being located at installation head 11 111 common is prerequisite, common through being made as, and can utilize installation head 10 to take out electronic units from assembly supply device 13.
In addition; Even if promptly be accommodated in the adsorption mouth that the adsorption mouth of being located at installation head 10 101 is used for pallet under the situation of adsorption mouth (be called pallet and use adsorption mouth) of the electronic component-use of pallet 4, utilize this adsorption mouth to take out electronic units and get final product from the assembly supply device 3 of opposition side.In addition, also can pallet be installed on installation head 10 with the adsorption mouth that is used for assembly supply device 3 outside the adsorption mouth, at this moment, through the adsorption mouth more than four is installed, thereby can increase the kind of the adsorption mouth 101 that is installed on installation head 10 on installation head 10.
In addition; In above-mentioned each execution mode, on each electronic component mounting apparatus 31,32 and 1, locate a printed base plate P and electronic unit is installed, but be not limited to this; Also can locate two printed base plate P and install; And, two carrying devices 2 also can be set, locate one or two printed base plate P and electronic unit is installed.
When locating two printed base plate P and electronic unit be installed; Also can two printed base plates be moved into electronic component mounting apparatus 1 simultaneously and take out of, particularly, when two printed base plates are same substrate kind time-like; Through moving into simultaneously and take out of, thereby can enhance productivity.In addition, regard two printed base plates as a printed base plate,, and electronic unit is installed on printed base plate, thus, can more effectively produce printed base plate the taking-up of parts order or erection sequence optimization.
And; In the above-described embodiment, each installation head 10,11 of electronic component mounting apparatus 1 is arranged on each beam 7,8, still with the mode of facing mutually in the inboard; As the electronic component mounting apparatus 50 of Figure 15, Figure 16 and other execution modes shown in Figure 17; Wide and two ends are positioned at the outside of beam 51 than this beam 51 for two feets, 61,62 backbars 51 and beam 52 about utilization, the width of this beam 52, and height and position separately is different and be provided with along the Y direction with being free to slide.In addition, also can make each installation head 10,11 be free to slide and can suspend in midair up or down and be arranged at each beam 51,51 times along directions X.At this moment, be located at the stroke up and down of the installation head 11 on the beam 52 of upper side or the lifting travel of adsorption mouth 111, bigger than the lifting travel of the stroke up and down of the installation head 10 of beam 51 or adsorption mouth 111.In addition, in Figure 15, Figure 16 and Figure 17, for electronic component mounting apparatus 1 identical mechanism shown in Figure 1, mark identical Reference numeral and omit its detailed description.
Through being made as aforesaid structure; With electronic component mounting apparatus 1 likewise; The assembly supply device that the installation head 10 of being located at beam 51 not only can move to the few inboard of the electronic unit quantity of taking-up is a pallet supply unit 5; And the assembly supply device 3 (with reference to Figure 16) of side in front of can moving to, with electronic component mounting apparatus 1 likewise, can improve the operating efficiency of installation head 10.In addition, beam 51 is crossed beam 52, installation head 10 compare installation head 11 can be positioned in front of side be the assembly supply device side, thereby can further improve the operating efficiency of installation head 10.
Consequently, can improve the running efficiency of electronic component mounting apparatus 50.
In addition, as the electronic component mounting apparatus 50 of Figure 15, Figure 16 and other execution modes shown in Figure 17, make the height of each beam 51,52 different; Each installation head and installation head 10,11 likewise also can be provided with relative mode in the side of each beam 51,52, through being made as such structure; Compare with the situation that each installation head is suspended on each beam; Can suppress the difference in height of each beam 51,52 little, consequently, can do one's utmost to reduce the height of electronic component mounting apparatus.
And, like each beam 7 of above-mentioned electronic component mounting apparatus 1,8, also can installation head be suspended to the below of each highly identical or roughly the same beam; Like this, through each installation head is suspended on each highly identical or roughly the same beam, thereby can do one's utmost to reduce each installation head in the horizontal direction from the overhang of each beam; Consequently; Can make each beam close to each other, in addition, can do one's utmost to avoid each installation head to conflict each other.
In addition; As also can be unlike the feed mechanism that electronic unit all is set in inboard and front side electronic component mounting apparatus 1 or the electronic component mounting apparatus 50; But feed mechanism is set at either side; And change and each beam to be set to heavens so that it can be moved to the feed mechanism that is set up each other, in addition, also installation head can be set respectively below each beam.
As stated; Execution mode of the present invention is illustrated, but to those skilled in the art, can expects various replacement examples, carry out various corrections or distortion based on above-mentioned explanation; The present invention comprises aforementioned various replacement example, revises or distortion in the scope that does not break away from its purport.

Claims (10)

1. the installation method of an electronic unit; Electronic component mounting apparatus has: the carrying device of conveyance printed base plate, supply with electronic unit assembly supply device, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source can be respectively in the installation head that on the direction of said each beam, moves; The said assembly supply device of two arranged outside at said carrying device; Drive said each drive source; Each installation head of being located on the said a pair of beam is moved between printed base plate on the said carrying device and said assembly supply device; The adsorption mouth of said each installation head is located in utilization, is installed on the said printed base plate from said assembly supply device taking-up electronic unit and with it, and this installation method is characterised in that; The installation head of one side will be adsorbed from the electronic unit that the assembly supply device of opposite side is supplied with and install, and a said side is carried out a mounted component side few with respect to opposite side quantity for supplying with from the said assembly supply device of a side.
2. the installation method of an electronic unit; Electronic component mounting apparatus has: the carrying device of conveyance printed base plate, supply with electronic unit assembly supply device, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source can be respectively in the installation head that on the direction of said each beam, moves; An outside and the said assembly supply device of another arranged outside at said carrying device; Drive said each drive source; Make the said installation head of being located at an outside and be located at the said installation head in another outside mobile between the said assembly supply device in the said assembly supply device in the printed base plate on the said carrying device and an outside and another outside; The adsorption mouth of said each installation head is located in utilization; Be installed on the said printed base plate from said assembly supply device taking-up electronic unit and with it; This installation method is characterised in that the adsorption head in an outside will adsorb from the electronic unit that the assembly supply device in another outside is supplied with and install, and mounted component is carried out with respect to another few outside of quantity, outside for supplying with from the said assembly supply device in an outside in a said outside.
3. the installation method of an electronic unit; Electronic component mounting apparatus has: the carrying device of conveyance printed base plate, supply with electronic unit assembly supply device, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source can be respectively in the installation head that on the direction of said each beam, moves; The said assembly supply device of two arranged outside at said carrying device; Drive said each drive source; Each installation head of being located on said two beams is moved between printed base plate on the said carrying device and said assembly supply device; The adsorption mouth of said each installation head is located in utilization, is installed on the said printed base plate from said assembly supply device taking-up electronic unit and with it, and this installation method is characterised in that; Supply with and be used to be installed to a kind of parts installation head few of printed base plate from the said assembly supply device of a side, the electronic unit absorption that will supply with from the assembly supply device of opposite side and installing with respect to opposite side quantity.
4. the installation method of an electronic unit; Electronic component mounting apparatus has: the carrying device of conveyance printed base plate, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source to be located at an outside in the installation head that on the direction of said each beam, moves, across said carrying device and supply with the pallet supply unit of the electronic unit that is incorporated in pallet and be located at another outside and supply with the assembly supply device of the electronic unit of being taken in respectively; Drive said each drive source; Each installation head of being located on said two beams is moved between the printed base plate on the said carrying device and said pallet supply unit and said assembly supply device; The adsorption mouth of said each installation head is located in utilization; Take out electronic unit and it is installed on the said printed base plate from said pallet supply unit and said assembly supply device; This installation method is characterised in that; Be used to be installed to a kind of parts installation head few of printed base plate from said pallet supply unit supply, will adsorb from the electronic unit that said assembly supply device is supplied with and install with respect to opposite side quantity.
5. the installation method of electronic unit as claimed in claim 4; It is characterized in that; When the electronic unit of supplying with and be installed on printed base plate from said pallet supply unit becomes when not having, be used for the electronic unit absorption that the few installation head of mounted component quantity will supply with from said assembly supply device and install.
6. the installation method of an electronic unit; Electronic component mounting apparatus has: the carrying device of conveyance printed base plate, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source to be located at an outside in an installation head that on the direction of said each beam, moves and another installation head, across said carrying device and supply with the pallet supply unit of the electronic unit that is incorporated in pallet and be located at another outside and supply with the assembly supply device of the electronic unit of being taken in respectively; Drive said each drive source; A said installation head and another installation head are moved between the printed base plate on the said carrying device and said pallet supply unit and said assembly supply device; The adsorption mouth of said each installation head is located in utilization; Take out electronic unit and it is installed on the said printed base plate from said pallet supply unit and said assembly supply device; This installation method is characterised in that; Supplying with and be used for mounted component quantity from said pallet supply unit is a zero said installation head, will adsorb from the electronic unit that said assembly supply device is supplied with and install.
7. electronic component mounting apparatus; It is characterized in that; Have: the carrying device of conveyance printed base plate, supply with electronic unit and be located at respectively two outsides of said carrying device assembly supply device, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source can be respectively in the installation head that on the direction of said each beam, moves; Drive said each drive source; Utilization is located at the adsorption mouth of the installation head on said each beam and is taken out electronic unit from any said assembly supply device; And; Said adsorption mouth on a beam took out and be installed on said printed base plate from the said assembly supply device of being located at an outside electronic unit with respect to another outside after a little while, the said adsorption mouth on the beam is taken out parts and it is installed on said printed base plate from the said assembly supply device of being located at another outside.
8. the electronic unit erection sequence of an electronic component mounting apparatus is confirmed method; Electronic component mounting apparatus has: the carrying device of conveyance printed base plate, supply with electronic unit assembly supply device, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source can be respectively in the installation head that on the direction of said each beam, moves; An outside and the said assembly supply device of another arranged outside at said carrying device; Drive said each drive source; Make the said installation head of being located at an outside and be located at the said installation head in another outside mobile between the said assembly supply device in the said assembly supply device in the printed base plate on the said carrying device and an outside and another outside; The adsorption mouth of said each installation head is located in utilization; Be installed on the said printed base plate from said assembly supply device taking-up electronic unit and with it; This electronic unit erection sequence confirms that method is characterised in that; Have the step of confirming as follows, promptly the adsorption head in an outside will adsorb from the electronic unit that the assembly supply device in another outside is supplied with and install, and mounted component is carried out with respect to another few outside of quantity, outside for supplying with from the said assembly supply device in an outside in a said outside.
9. the electronic unit erection sequence of an electronic component mounting apparatus is confirmed method; Electronic component mounting apparatus has: the carrying device of conveyance printed base plate, supply with electronic unit assembly supply device, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source can be respectively in the installation head that on the direction of said each beam, moves; The said assembly supply device of two arranged outside at said carrying device; Drive said each drive source; Each installation head of being located on said two beams is moved between printed base plate on the said carrying device and said assembly supply device; The adsorption mouth of said each installation head is located in utilization; Be installed on the said printed base plate from said assembly supply device taking-up electronic unit and with it, this electronic unit erection sequence confirms that method is characterised in that, has the step of confirming as follows; Promptly supply with and be used to be installed to a kind of parts installation head few of printed base plate, the electronic unit absorption that will supply with from the assembly supply device of opposite side and installing with respect to opposite side quantity from the said assembly supply device of a side.
10. the electronic unit erection sequence of an electronic component mounting apparatus is confirmed method; Electronic component mounting apparatus has: the carrying device of conveyance printed base plate, utilize drive source can be to a pair of beam that a direction moves, have an adsorption mouth and utilize each drive source to be located at an outside in the installation head that on the direction of said each beam, moves, across said carrying device and supply with the pallet supply unit of the electronic unit that is incorporated in pallet and be located at another outside and supply with the assembly supply device of the electronic unit of being taken in respectively; Drive said each drive source; Each installation head of being located on said two beams is moved between the printed base plate on the said carrying device and said pallet supply unit and said assembly supply device; The adsorption mouth of said each installation head is located in utilization; Take out electronic unit and it is installed on the said printed base plate from said pallet supply unit and said assembly supply device; This electronic unit erection sequence confirms that method is characterised in that; Has the step of confirming as follows; Promptly be used to be installed to a kind of parts installation head few of printed base plate, will adsorb from the electronic unit that said assembly supply device is supplied with and install with respect to another routine quantity from said pallet supply unit supply.
CN2009102081977A 2008-10-31 2009-11-02 Installation method of electronic component, installation device and installation sequence determination method thereof Active CN101730462B (en)

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JP2008282329A JP5085509B2 (en) 2008-10-31 2008-10-31 Electronic component mounting method, electronic component mounting apparatus, and electronic component mounting order determination method for electronic component mounting apparatus

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JP5755505B2 (en) * 2011-05-31 2015-07-29 ヤマハ発動機株式会社 Electronic component mounting method and mounting device
JP5916357B2 (en) * 2011-11-28 2016-05-11 富士機械製造株式会社 Electronic component mounting system
JP6046362B2 (en) * 2012-03-29 2016-12-14 ヤマハ発動機株式会社 Electronic component mounting device
JP7133021B2 (en) * 2018-08-23 2022-09-07 株式会社Fuji MOVEMENT WORK MANAGEMENT DEVICE, MOUNTING SYSTEM AND MANAGEMENT METHOD

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CN1575123A (en) * 2003-05-23 2005-02-02 株式会社日立高新技术仪器 Electronic component mounting method

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