JP6959128B2 - Component mounting device - Google Patents

Description

The present invention relates to a component mounting device for mounting components on a substrate.

A component mounting device that mounts (mounts) electronic components (hereinafter, simply referred to as "components") on a board such as a printed wiring board to produce an electronic circuit board is provided with a head unit having a holder for holding the components. There is. The head unit moves to a predetermined component mounting position while holding the component by the holder, and mounts the component on the board at the component mounting position.

In the component mounting device, when an electronic circuit board is produced, it is determined whether or not a component has a defect such as "chip" or "crack" (see, for example, Patent Documents 1 and 2). In the technique disclosed in Patent Document 1, a chip component on a wafer is imaged to acquire an image, and based on the captured image, it is determined whether or not a defect such as "chip" has occurred in the chip component. .. Further, in the technique disclosed in Patent Document 2, a die on which a component is formed on a wafer is imaged to acquire an image, and whether or not a defect such as "chip" occurs in the die based on the image. Is determined. That is, in the prior art, it is determined whether or not a defect has occurred in the component before mounting on the substrate.

By the way, when the component held by the holder of the head unit is mounted on the substrate, a pressing load is applied to the component. For example, when the pressing load on the component is excessive, defects such as "chips" and "cracks" may occur on the upper surface of the component to be held on the side held by the holder in the component after mounting on the substrate. There is. In the prior art, since it is determined whether or not a component has a defect before mounting on the board, the component after mounting on the board is caused by the mounting operation of the component on the board by the holder in the component mounting device. At present, it is not possible to determine the defects that have occurred in. In such a conventional technique, there is a possibility that a board on which a defective component having a defect is mounted may be carried out from the component mounting device.

Japanese Unexamined Patent Publication No. 2012-199321 Japanese Unexamined Patent Publication No. 2012-190879

The present invention has been made in view of such circumstances, and an object of the present invention is to enable determination of whether or not a component after mounting on a substrate has a defect, and a defective component in which a defect has occurred. It is an object of the present invention to provide a component mounting device capable of suppressing the removal of the board on which the vehicle is mounted as much as possible.

The component mounting device according to one aspect of the present invention is arranged in a device main body, a substrate transport unit that is arranged in the device main body and conveys a substrate, and is arranged in the device main body to supply components to a predetermined component supply position. The component supply device and the component arranged in the device main body and supplied to the component supply position are held, and the held component is transferred to the substrate which is transported to a predetermined component mounting position by the substrate transport unit. Before carrying out the board from the apparatus main body by transporting the head unit having the holder to be mounted and the board transporting unit, the head unit images the components mounted on the board from above, and after mounting. It includes an imaging unit that acquires a component image, and a defect determination unit that determines whether or not a defect has occurred on the upper surface of the component mounted on the substrate based on the mounted component image. The image pickup unit is configured to take an image of the component supplied to the component supply position from above before being held by the holder, and acquire an image of the component before holding in addition to the image of the component after mounting. The defect determination unit determines whether or not a defect has occurred on the upper surface of the component mounted on the substrate by comparing the image of the component before holding with the image of the component after mounting.

According to this component mounting device, the image pickup unit acquires a post-mounting component image, which is an image of the post-mounting component on the substrate. This post-mounting component image is an image acquired by capturing an image of the component mounted on the board from above by the holder of the head unit before the board is carried out from the main body of the apparatus by the transfer of the board transfer unit. That is, the image of the component after mounting is an image obtained by capturing the upper surface of the component after mounting on the substrate, which is the surface to be held on the side held by the holder, before the substrate is carried out from the main body of the apparatus. Then, the defect determination unit determines whether or not a defect has occurred on the upper surface of the component mounted on the board based on the image of the component after mounting. As a result, it is possible to determine whether or not a defect has occurred in the component after mounting on the board, and it is possible to prevent the board on which the defective component having the defect is mounted from being carried out as much as possible.

In this aspect, the imaging unit acquires the image of the component before holding in addition to the image of the component after mounting. This pre-holding component image is an image acquired by capturing an image of the component supplied to the component supply position by the component supply device from above before holding by the holder. Then, the defect determination unit can determine with high accuracy whether or not a defect has occurred on the upper surface of the component mounted on the substrate by comparing the image of the component before holding and the image of the component after mounting.

The component mounting device according to another aspect of the present invention is arranged in a device main body, a substrate transport unit arranged in the device main body and transports a substrate, and is arranged in the device main body to supply components to a predetermined component supply position. The component supply device and the component arranged in the device main body and supplied to the component supply position are held, and the held component is transferred to the substrate which is transported to a predetermined component mounting position by the substrate transport unit. Before carrying out the board from the apparatus main body by transporting the head unit having the holder to be mounted and the board transporting unit, the head unit images the components mounted on the board from above, and after mounting. It includes an imaging unit that acquires a component image, and a defect determination unit that determines whether or not a defect has occurred on the upper surface of the component mounted on the substrate based on the mounted component image. Regarding the setting of the adjustment control of the pressing load on the component, the holder can switch the setting between the load control execution setting for executing the adjustment control and the load control non-execution setting for not executing the adjustment control. The defect determination unit does not perform a determination operation when the holder is set to the load control execution setting, and does not perform a determination operation when the holder is set to the load control non-execution setting. I do.

In this aspect, the holder is configured so that the setting can be switched between the load control implementation setting and the load control non-implementation setting. When the holder is set to the load control implementation setting, the holder performs adjustment control of the pressing load on the component when the component is mounted on the substrate. As a result, it is possible to prevent the pressing load on the component from becoming excessive, and to prevent defects from occurring in the component after mounting on the board due to the mounting operation of the component on the board by the holder. NS. On the other hand, when the holder is set to the load control non-execution setting, the holder does not perform the adjustment control of the pressing load on the component when the component is mounted on the substrate. In this case, the pressing load of the holder against the component may be excessive, and the possibility that the component after mounting on the substrate is defective increases. Therefore, the defect determination unit does not perform the determination operation when the holder is set to the load control execution setting, and performs the determination operation when the holder is set to the load control non-execution setting. As a result, the determination operation can be performed only when there is a high possibility that a defect will occur in the component after mounting on the substrate. Therefore, the time required for the determination operation by the defect determination unit can be shortened, and the load of the determination operation by the defect determination unit can be reduced.

The component mounting device includes a head drive control unit that controls the head unit, controls the holding operation of the component by the holder, and controls the mounting operation of the component on the substrate, and the defect determination. An information output unit that outputs condition change command information relating to a command for changing each operation condition of the holding operation and the mounting operation when it is determined by the unit that a defect has occurred on the upper surface of the component, and the operation. It further includes an operation unit that receives an operation for inputting operation condition information related to the condition.

In this embodiment, when the defect determination unit determines that a defect has occurred on the upper surface of the component, the information output unit holds the component by the holder and mounts the component on the substrate by the holder. Outputs the condition change command information related to the command to change the operating condition of. According to the condition change command information output from this information output unit, the operator changes the operating conditions of the holder so that the parts after mounting on the board do not have defects, and the operating condition information regarding the changed operating conditions is transmitted. It can be input via the operation unit.

As described above, according to the present invention, it is possible to determine whether or not a defect has occurred in a component after mounting on the board, and it is possible to carry out the board on which the defective component with the defect is mounted. It is possible to provide a component mounting device that can be suppressed.

It is a top view which shows the structure of the component mounting apparatus which concerns on one Embodiment of this invention. It is a figure which shows schematic the component supply apparatus provided in the component mounting apparatus. It is a figure which shows the structure of the tape guide provided in the component supply apparatus. It is a perspective view of the component storage tape attached to the component supply device. It is a side view of the part stored in the part storage tape. It is a side view of the head unit provided in the component mounting apparatus. It is the figure which looked at the head unit from the bottom. It is a block diagram which shows the control system of a component mounting apparatus. It is a figure for demonstrating the operating condition information input to the operation part of a component mounting apparatus. It is a figure which shows typically the image of the component before holding acquired by the 2nd imaging unit of the component mounting apparatus. It is a figure which shows typically the post-mounting component image acquired by the 2nd imaging unit. It is a figure which shows typically the post-holding component image acquired by the 3rd imaging unit of the component mounting apparatus. It is a figure for demonstrating the condition change command information output from the information output part of a component mounting apparatus. It is a flowchart which shows the control operation of a component mounting apparatus. It is a flowchart which shows the control operation of a component mounting apparatus.

Hereinafter, a component mounting device according to an embodiment of the present invention will be described with reference to the drawings. In the following, the directional relationship will be described using the XYZ orthogonal coordinate axes. The X direction is a direction parallel to the horizontal plane, the Y direction is a direction orthogonal to the X direction on the horizontal plane, and the Z direction is a vertical direction orthogonal to both the X and Y directions. Further, the one-way side in the X direction is referred to as "+ X side", and the other direction side opposite to the one-way side in the X direction is referred to as "-X side". Further, one direction side in the Y direction is referred to as "+ Y side", and the other direction side opposite to the one direction side in the Y direction is referred to as "-Y side". Further, the one-way side in the Z direction is referred to as "+ Z side", and the other direction side opposite to the one-way side in the Z direction is referred to as "-Z side".

<Structure of component mounting device>
FIG. 1 is a plan view showing a configuration of a component mounting device 1 according to an embodiment of the present invention. The component mounting device 1 is a device for producing an electronic circuit board by mounting (mounting) components on a board P. The component mounting device 1 includes a device main body 1a, a moving frame 2, a board transport unit 3, a component supply unit 4 to which the component supply device 5 is mounted, a head unit 6, a first drive mechanism 7, and a second. It includes a drive mechanism 8 and an image pickup device 9.

The device main body 1a is a structure in which each part constituting the component mounting device 1 is arranged, and is formed in a substantially rectangular shape in a plan view seen from the Z direction. The substrate transport unit 3 is a conveyor that is arranged in the apparatus main body 1a and extends in the X direction. The substrate transport unit 3 transports the substrate P in the X direction. The substrate P is conveyed by the substrate transport unit 3 and is positioned at a predetermined component mounting position (position where components are mounted on the substrate P).

The component supply units 4 are arranged at four locations in total, two locations in the X direction, respectively, in the + Y side and −Y side region portions in the Y direction of the apparatus main body 1a. The component supply unit 4 is an area in which a plurality of component supply devices 5 are mounted side by side in the device main body 1a, and is a target to be sucked by a suction nozzle 63 which is a holder provided in the head unit 6 described later. The set position of each component supply device 5 is divided for each component.

The parts supply device 5 is detachably attached to the parts supply unit 4 of the device main body 1a. The component supply device 5 is a tape feeder that supplies small pieces of electronic components (hereinafter, simply referred to as components) such as ICs, transistors, and capacitors using a tape as a carrier. The parts supply device 5 will be described with reference to FIGS. 2 to 5. FIG. 2 is a diagram schematically showing a component supply device 5 provided in the component mounting device 1. FIG. 3 is a diagram showing a configuration of a tape guide 45 provided in the component supply device 5. FIG. 4 is a perspective view of the component storage tape 100 mounted on the component supply device 5. FIG. 5 is a side view of the component E stored in the component storage tape 100.

The component supply device 5 is attached to an attachment portion 31 provided in the component supply unit 4. The mounting portion 31 is provided with a plurality of slots 32 arranged at regular intervals in the X direction and extending in parallel with each other in the Y direction, and a fixing base 33 extending in the X direction at a position in front of the slots 32. Then, the component supply device 5 is set in each slot 32, and each component supply device 5 is fixed to the fixing base 33. As a result, a plurality of component supply devices 5 are arranged side by side in the X direction in the component supply unit 4.

The component supply device 5 includes a main body 41 having an elongated shape in the front-rear direction (Y direction). The component supply device 5 is fixed to the fixing base 33 with the main body 41 inserted (set) in the slot 32.

The parts supply device 5 is further provided in the first tape sending section 42 provided in the front end portion of the main body 41, the second tape sending section 43 provided in the rear end portion of the main body 41, and the main body 41. The tape passage 44 and the tape guide 45 are provided.

The tape passage 44 is a passage for guiding the component storage tape 100. The tape passage 44 extends obliquely upward from the rear end portion of the main body portion 41 toward the front upper portion. The component storage tape 100 as a component storage member is introduced into the inside from the rear end portion of the main body portion 41, and is guided to the upper surface front portion of the main body portion 41 through the tape passage 44.

As shown in FIG. 4, the component storage tape 100 is a long tape composed of a tape main body 101 and a cover tape 102. A large number of component storage portions 103 (recesses) opened at the top of the tape main body 101 are formed at regular intervals in the longitudinal direction (tape feed direction), and the component E is stored in each component storage portion 103. The cover tape 102 is adhered to the upper surface of the tape main body 101, whereby each component storage portion 103 is closed by the cover tape 102. Further, on the side of the component storage portion 103 of the tape main body 101, a plurality of fitting holes 104 are provided which are arranged at regular intervals in the longitudinal direction and penetrate the tape main body 101 in the thickness direction thereof.

In the component supply device 5, the tape guide 45 is provided on the upper surface of the front portion of the main body portion 41. The tape guide 45 covers the component storage tape 100 that has passed through the tape passage 44, and guides the component storage tape 100 substantially horizontally along the upper surface of the main body 41 to the component supply position P1. The component supply position P1 is a position at which the head unit 6 is allowed to take out components, and is set at a position close to the front end of the upper surface of the main body 41.

As shown in FIG. 3, an opening 45A is provided at a position corresponding to the component supply position P1 in the tape guide 45, and a component exposed portion 451 is provided at a position rearward from the opening 45A. ing. The component exposed portion 451 exposes the component E in the component accommodating portion 103 of the component accommodating tape 100 guided by the tape guide 45. The component exposed portion 45 includes an insertion portion 4511, a blade portion 4512, and a cover tape post-processing portion 4513.

The insertion portion 4511 is a thin plate-shaped portion formed in a tapered shape, and the tape main body 101 and the cover tape 102 are provided with respect to the component storage tape 100 in a state where the tip is guided by the tape guide 45 and the tip is a free end. Inserted in between. In the component exposed portion 451 the blade portion 4512 is arranged on the downstream side in the tape feeding direction with respect to the insertion portion 4511, and the cover tape 102 is cut in a straight line along the tape feeding direction according to the running of the component storage tape 100. do. In the component exposed portion 451 the cover tape post-processing portion 4513 is arranged on the downstream side in the tape feeding direction with respect to the blade portion 4512, and performs a process of spreading the cover tape 102 cut by the blade portion 4512. As a result, the component E can be exposed in the component storage section 103 of the component storage tape 100. The component E exposed in the component storage unit 103 in this way is attracted by the suction nozzle 63 of the head unit 6 in the component mounting device 1 through the opening 45A of the tape guide 45 at the component supply position P1. Taken out.

The first tape delivery unit 42 has a plurality of transmission gears that transmit the driving force of the first sprocket 51, the first motor 52, and the first motor 52 arranged below the tape guide 45 to the first sprocket 51. It is provided with a first gear group 53 including the above. The first sprocket 51 has teeth that fit into the fitting holes 104 of the component storage tape 100 that is guided along the tape guide 45. That is, the first tape delivery unit 42 sends out the component storage tape 100 toward the component supply position P1 by rotationally driving the first sprocket 51 by the first motor 52.

The second tape delivery unit 43 is a plurality of sheets that transmit the driving force of the second sprocket 54, the second motor 55, and the second motor 55 arranged at the rear end of the main body 41 to the second sprocket 54. It includes a second gear group 56 composed of transmission gears. The second sprocket 54 faces into the tape passage 44 from above, and has teeth that fit into the fitting holes 104 of the component storage tape 100 guided along the tape passage 44. That is, the second tape delivery unit 43 sends the component storage tape 100 forward (part supply position P1) by rotationally driving the second sprocket 54 by the second motor 55.

The component storage tape 100 is intermittently delivered toward the component supply position P1 by the delivery portions 42 and 43, and the component E is taken out through the opening 45A of the tape guide 45 at the component supply position P1.

As shown in FIG. 5, the parts E housed in the part storage tape 100 include a ceramic base E1, a conductor E2 provided on the ceramic base E1, a resistor E3 provided on the ceramic base E2, and a resistor E3. It is provided with an overcoat E4 for covering the ceramic substrate E1 and electrodes E5 provided at both end portions of the ceramic substrate E1. In the component E, the side on which the overcoat E4 is provided is the upper surface, and the side opposite to it is the lower surface. The upper surface of the component E on the overcoat E4 side becomes a held surface when the component E is held by the suction nozzle 63 of the head unit 6 described later. The component E shown in FIG. 5 is an example of a component stored in the component storage tape 100.

Next, referring to FIG. 1, the moving frame 2 provided in the component mounting device 1 extends in the X direction and is movably supported by the device main body 1a in a predetermined moving direction (Y direction). The head unit 6 is mounted on the moving frame 2. The head unit 6 is mounted on the moving frame 2 so as to be movable in the X direction. That is, the head unit 6 can move in the Y direction as the moving frame 2 moves, and can move in the X direction along the moving frame 2. The head unit 6 is movable over a component supply position P1 of the component supply device 5 mounted on the component supply unit 4 and a predetermined component mounting position of the substrate P conveyed by the substrate transfer unit 3, and is a component supply position. In P1, the component E is taken out from the component supply device 5, and the taken out component E is mounted (mounted) on the substrate P at the component mounting position. Details of the head unit 6 will be described later.

The first drive mechanism 7 is arranged at the + X side and −X side ends of the apparatus main body 1a. The first drive mechanism 7 is a mechanism for moving the moving frame 2 in the Y direction. The first drive mechanism 7 includes, for example, a drive motor, a ball screw shaft extending in the Y direction and connected to the drive motor, and a ball nut disposed on the moving frame 2 and screwed with the ball screw shaft. Consists of. The first drive mechanism 7 having such a configuration moves the moving frame 2 in the Y direction by moving the ball nut forward and backward along the ball screw shaft as the ball screw shaft is rotationally driven by the drive motor.

The second drive mechanism 8 is arranged on the moving frame 2. The second drive mechanism 8 is a mechanism for moving the head unit 6 in the X direction along the moving frame 2. Similar to the first drive mechanism 7, the second drive mechanism 8 includes, for example, a drive motor, a ball screw shaft extending in the X direction and connected to the drive motor, and a ball screw shaft disposed on the head unit 6. It is configured to include a ball nut to be screwed. The second drive mechanism 8 having such a configuration moves the head unit 6 in the X direction by moving the ball nut forward and backward along the ball screw shaft as the ball screw shaft is rotationally driven by the drive motor.

In this example, the first drive mechanism 7 and the second drive mechanism 8 have a configuration in which the moving frame 2 and the head unit 6 are moved by the drive motor via the ball screw shaft. However, for example, a linear motor may be used as a drive source to directly drive the moving frame 2 and the head unit 6.

The head unit 6 will be described with reference to FIGS. 6 and 7 in addition to FIG. FIG. 6 is a side view of the head unit 6, and FIG. 7 is a plan view of the head unit 6 as viewed from below. The head unit 6 includes a head body 61, a rotating body 62, and a suction nozzle 63. The head main body 61 constitutes a main body portion of the head unit 6. The rotating body 62 is formed in a columnar shape, and is provided on the head main body 61 so as to be rotatable around a vertical axis (axis extending in the Z direction) by a rotating body driving mechanism 65 (see FIG. 8 described later).

A plurality of suction nozzles 63 are arranged at the outer peripheral edge of the rotating body 62 at predetermined intervals in the circumferential direction. The suction nozzle 63 is a holder capable of sucking and holding the component E supplied to the component supply position P1 by the component supply device 5. The suction nozzle 63 can communicate with any of the negative pressure generator, the positive pressure generator, and the atmosphere via the electric switching valve. That is, the negative pressure is supplied to the suction nozzle 63 to enable the suction nozzle 63 to hold the suction of the component E (take out the component), and then the positive pressure is supplied to hold the component E to suction. It will be released. In the present embodiment, the holder other than the suction nozzle 63 may be, for example, a chuck that grips and holds the component E.

The suction nozzle 63 is provided on the rotating body 62 so as to be able to move up and down in the vertical direction (Z direction) by the nozzle raising and lowering drive mechanism 66 (see FIG. 8 described later). The suction nozzle 63 is located in the Z direction (vertical direction) between the holding position where the component E supplied to the component supply position P1 by the component supply device 5 can be held and the retracted position on the upper side of the holding position. It is possible to move along. That is, when the component E supplied to the component supply position P1 is held, the suction nozzle 63 is lowered from the retracted position to the holding position by the nozzle elevating drive mechanism 66, and the component E is sucked and held at the holding position. On the other hand, the suction nozzle 63 after the suction and holding of the component E is raised from the holding position to the retracted position by the nozzle elevating drive mechanism 66.

Further, the suction nozzle 63 can move along the Z direction (vertical direction) between the mountable position where the held component E can be mounted on the substrate P and the retracted position on the upper side with respect to the mountable position. Is. That is, when the component E is mounted on the substrate P transported to the component mounting position by the substrate transport unit 3, the suction nozzle 63 is lowered from the retracted position to the mountable position by the nozzle elevating drive mechanism 66, and the subject E is mounted. The component E held at the mountable position is mounted on the substrate P. On the other hand, the suction nozzle 63 after mounting the component E on the substrate P rises from the mountable position to the retracted position by the nozzle elevating drive mechanism 66.

Further, the suction nozzle 63 is a component in the suction holding operation of the component E (descending operation from the retracted position to the holding position) and the mounting operation of the component E on the substrate P (descending operation from the retracted position to the mountable position). It is possible to adjust and control the pressing load against E. Then, the suction nozzle 63 sets the setting of the adjustment control of the pressing load on the component E between the load control execution setting for executing the adjustment control and the load control non-execution setting for not executing the adjustment control. It is configured to be switchable. When the suction nozzle 63 is set to the load control execution setting, the suction nozzle 63 executes the adjustment control of the pressing load on the component E when executing the suction holding operation and the mounting operation. On the other hand, when the suction nozzle 63 is set to the load control non-execution setting, the suction nozzle 63 does not perform the adjustment control of the pressing load on the component E when executing the suction holding operation and the mounting operation.

Further, the component mounting device 1 according to the present embodiment includes an imaging device 9 as shown in FIGS. 1, 6 and 7. The image pickup apparatus 9 includes a first image pickup unit 91, a second image pickup unit 92, and a third image pickup unit 93.

The first imaging unit 91 is a substrate recognition camera fixed on the lower surface of the head body 61 of the head unit 6 to the outside (−X side) of the rotating body 62 via a mounting member 64. The first image pickup unit 91 includes, for example, an image pickup element such as a CMOS (Complementary metallic-axis-semiconductor) or a CCD (Charged-coupled devices). The first imaging unit 91 moves together with the head unit 6 to identify and position the type of the substrate P, and images various marks written on the upper surface of the substrate P from above.

The second imaging unit 92 is a first component recognition camera fixed on the lower surface of the head body 61 of the head unit 6 to the outside (−X side) of the rotating body 62 via a mounting member 64. Like the first image pickup unit 91, the second image pickup unit 92 includes an image pickup element such as CMOS or CCD. The second imaging unit 92 takes an image of the component E supplied to the component supply position P1 by the component supply device 5 from above, and is an image of the component E before being held by the suction nozzle 63. (See FIG. 10 below) is acquired. Further, the second imaging unit 92 images the component E mounted on the substrate P from above by the head unit 6 (suction nozzle 63), and the post-mounting component image G2 which is an image of the component E after mounting on the substrate P. (See FIG. 11 below) is acquired. The timing at which the second imaging unit 92 acquires the component image G2 after mounting is before the substrate P is carried out from the apparatus main body 1a by the transfer of the substrate transfer unit 3.

The third imaging unit 93 is a second component recognition camera arranged at a position between each component supply unit 4 and the substrate transport unit 3 on the apparatus main body 1a. The third image pickup unit 93, like the first image pickup unit 91 and the second image pickup unit 92, includes an image pickup element such as CMOS or CCD. Before mounting on the substrate P, the third imaging unit 93 takes an image of the component E sucked and held by the suction nozzle 63 from below, and is an image of the component E after being held by the suction nozzle 63. (See FIG. 12 below) is acquired.

<Control system for component mounting equipment>
Next, the control system of the component mounting device 1 will be described with reference to the block diagram of FIG. The component mounting device 1 includes a control unit 10, an operation unit 20, and an information output unit 21. The control unit 10 is composed of a CPU (Central Processing Unit), a ROM (Read Only Memory) for storing a control program, a RAM (Random Access Memory) used as a work area of the CPU, and the like. The control unit 10 comprehensively controls the operation of the component mounting device 1 by executing the control program stored in the ROM by the CPU. As shown in FIG. 8, the control unit 10 includes a board transfer control unit 11, a component supply control unit 12, a head drive control unit 13, an operating condition storage unit 14, an information output control unit 15, and a defect determination unit. 16 and.

The substrate transfer control unit 11 controls the transfer operation of the substrate P by the substrate transfer unit 3. The board transport unit 3 controlled by the board transport control unit 11 transports the board P carried into the device main body 1a from outside the device of the component mounting device 1 toward the component mounting position, and the component E is transported at the component mounting position. When mounted on the board P, the board P on which the component E is mounted is carried out from the device main body 1a to the outside of the device.

The component supply control unit 12 controls the supply operation of the component E to the component supply position P1 by the component supply device 5.

The head drive control unit 13 controls the movement of the head unit 6 by the first drive mechanism 7 and the second drive mechanism 8 on the horizontal plane with respect to the X direction and the Y direction. Further, the head drive control unit 13 controls the elevating operation of the suction nozzle 63 by the nozzle elevating drive mechanism 67. Further, the head drive control unit 13 controls the rotational operation of the rotating body 62 by the rotating body driving mechanism 66. As a result, the head drive control unit 13 executes the control of the suction holding operation of the component E by the suction nozzle 63 at the component supply position P1 and the control of the mounting operation of the component E with respect to the substrate P at the component mounting position.

The operating condition storage unit 14 stores the operating conditions of the suction holding operation of the component E by the suction nozzle 63 and the mounting operation of the component E on the substrate P by the suction nozzle 63. The operating condition information J1 (see FIG. 9) relating to the operating condition of the suction nozzle 63 is input by the operator's input operation to the operation unit 20. The operation unit 20 receives an operation for inputting the operating condition information J1.

The head drive control unit 13 controls the suction holding operation of the component E by the suction nozzle 63 and the substrate P by referring to the operation condition information J1 input via the operation unit 20 and stored in the operation condition storage unit 14. Control of the mounting operation of the component E with respect to the above. Here, the operating condition information J1 input via the operation unit 20 and stored in the operating condition storage unit 14 will be described with reference to FIG. As shown in FIG. 9, the operating condition information J1 includes, for example, the operating condition item information J11 (operating condition item) indicating the item of the operating condition of the suction nozzle 63, and the setting status information J12 indicating the setting status for each operating condition. Is the information associated with. The operating condition item information J11 includes, for example, suction holding height information K1 (suction holding height), mounting height information K2 (loading height), load control setting information K3 (load control setting), and target load. Information K4 (target load) and component thickness information K5 (component thickness) are included.

The suction holding height information K1 is information representing operating conditions related to the suction holding operation of the suction nozzle 63 with respect to the component E at the component supply position P1, and is a target when the suction nozzle 63 is lowered from the retracted position by the nozzle elevating drive mechanism 66. This is information indicating the height position of the holding position which is the descending position. In the example shown in FIG. 9, "AA" is associated with the suction holding height information K1 as the setting status information J12, and the holding position is set to "AA" in the suction holding operation of the suction nozzle 63. Is shown.

The mounting height information K2 is information representing operating conditions related to the mounting operation of the suction nozzle 63 with respect to the substrate P at the component mounting position, and is a target lowering position when the suction nozzle 63 is lowered from the retracted position by the nozzle elevating drive mechanism 66. This is information indicating the height position of the mountable position. In the example shown in FIG. 9, "BB" is associated with the mounting height information K2 as the setting status information J12, and the mounting possible position is set to "BB" in the mounting operation of the suction nozzle 63. It is shown.

The load control setting information K3 determines whether the setting of the adjustment control of the pressing load on the component E in the suction holding operation and the mounting operation of the suction nozzle 63 is set to the load control implementation setting or the load control non-execution setting. Information to represent. In the example shown in FIG. 9, "load control non-execution setting" is associated with the load control setting information K3 as the setting status information J12, and the setting related to the adjustment control of the pressing load of the suction nozzle 63 is "load control non-execution". It is shown that it is set in "Implementation settings".

The target load information K4 is information representing a target value of the pressing load on the component E when the suction nozzle 63 is set to the load control implementation setting. In the example shown in FIG. 9, “−” is associated with the target load information K4 as the setting status information J12, indicating that the target value of the pressing load on the component E is not set.

The component thickness information K5 is information representing the thickness of the component E supplied by the component supply device 5. In the example shown in FIG. 9, "CC" is associated with the component thickness information K5 as the setting status information J12, and the thickness of the component E to be suction-held by the suction nozzle 63 is set to "CC". It is shown to be.

With reference to FIG. 8, the defect determination unit 16 of the control unit 10 is based on the pre-holding component image G1 (see FIG. 10) and the post-mounting component image G2 (see FIG. 11) acquired by the second imaging unit 92. Therefore, it is determined whether or not a defect has occurred on the upper surface of the component E mounted on the substrate P.

Here, the pre-holding component image G1 and the post-mounting component image G2 that the defect determination unit 16 refers to when determining a defect of the component E will be described with reference to FIGS. 10 and 11. First, the pre-holding component image G1 acquired by the second imaging unit 92 is an image of the component E supplied to the component supply position P1 by the component supply device 5 as described above, and is captured from above. It is an image of the component E before being held by the nozzle 63. The pre-holding component image G1 includes a component storage area G11 composed of pixels corresponding to the component storage unit 103 of the component storage tape 100, and a component area G12 composed of pixels corresponding to the component E stored in the component storage unit 103. including. In the pre-holding component image G1, the component region G12 is formed against the background of the component storage region G11. Further, the component region G12 includes an electrode region G121 composed of pixels corresponding to the electrode E5 on the upper surface of the component E and an overcoat region G122 composed of pixels corresponding to the overcoat E4 on the upper surface of the component E.

The post-mounting component image G2 acquired by the second imaging unit 92 is an image of the component E mounted on the substrate P by the suction nozzle 63 of the head unit 6 as described above, and is an image of the component E mounted on the substrate P from above. It is an image of the component E after mounting with respect to. As shown in FIG. 11A, the post-mounting component image G2 includes a substrate region G21 composed of pixels corresponding to the substrate P and a component region G22 composed of pixels corresponding to the component E mounted on the substrate P. .. In the post-mounting component image G2, the component region G22 is formed against the background of the substrate region G21. Further, the component region G22 includes an electrode region G221 composed of pixels corresponding to the electrode E5 on the upper surface of the component E and an overcoat region G222 composed of pixels corresponding to the overcoat E4 on the upper surface of the component E.

If the component E after mounting on the substrate P has defects such as "chips" and "cracks" due to the mounting operation of the component E on the substrate P by the suction nozzle 63, the second imaging unit 92 The post-mounting component image acquired by the above is the post-mounting component image G2A as shown in FIG. 11 (B). In the post-mounting component image G2A shown in FIG. 11B, the overcoat region G222 of the component region G22 includes a defect region G223 composed of pixels corresponding to the defects.

The defect determination unit 16 determines whether or not a defect has occurred on the upper surface of the component E mounted on the substrate P by comparing the pre-holding component image G1 and the post-mounting component image G2 (G2A). do. As shown in FIG. 8, the defect determination unit 16 includes a feature amount calculation unit 161 and a determination unit 162.

The feature amount calculation unit 161 calculates the first feature amount of each of the electrode region G121 and the overcoat region G122 in the component region G12 included in the pre-holding component image G1. In the present embodiment, the feature amount calculation unit 161 uses the first luminance information (average value, dispersion value) of each region as the first feature amount of each of the electrode region G121 and the overcoat region G122 in the pre-holding component image G1. Calculate each. Further, the feature amount calculation unit 161 calculates the second feature amount of each of the electrode region G221 and the overcoat region G222 in the component region G22 included in the post-mounting component image G2 (G2A). In the present embodiment, the feature amount calculation unit 161 sets the second luminance information (average value, dispersion) of each region as the second feature amount of each of the electrode region G221 and the overcoat region G222 in the post-mounting component image G2 (GA2). Value) are calculated respectively.

The determination unit 162 includes the first luminance information of each of the electrode region G121 and the overcoat region G122, which are the first feature quantities based on the pre-holding component image G1 calculated by the feature quantity calculation unit 161 and the post-mounting component image G2. By comparing the second luminance information of each of the electrode region G221 and the overcoat region G222, which are the second feature quantities based on (G2A), a defect is generated on the upper surface of the component E mounted on the substrate P. Judge whether or not.

As shown in FIG. 11A, the second luminance information of each of the electrode region G221 and the overcoat region G222 in the post-mounting component image G2 that does not include the defect region consisting of pixels corresponding to the defects is the component image before holding. There is no big difference as compared with the first luminance information of each of the electrode region G121 and the overcoat region G122 in G1. That is, the difference between the second luminance information in the post-mounting component image G2 that does not include the defect region and the first luminance information in the pre-holding component image G1 is less than a predetermined determination reference value.

On the other hand, as shown in FIG. 11B, the second luminance information of each of the electrode region G221 and the overcoat region G222 in the post-mounting component image G2A including the defect region G223 composed of pixels corresponding to the defects is before holding. Compared with the first luminance information of each of the electrode region G121 and the overcoat region G122 in the component image G1, a difference of a predetermined determination reference value or more occurs. That is, the difference between the second luminance information in the post-mounting component image G2A including the defect region G223 and the first luminance information in the pre-holding component image G1 is equal to or greater than a predetermined determination reference value particularly with respect to the luminance information in the overcoat region. Become.

Therefore, the determination unit 162 compares the first luminance information of the pre-holding component image G1 with the second luminance information of the post-mounting component image G2 (G2A) on the upper surface of the component E mounted on the substrate P. , It is possible to determine whether or not a defect has occurred.

As described above, according to the component mounting device 1 according to the present embodiment, the post-mounting component image G2 (G2A), which is an image of the post-mounting component E on the substrate P, is acquired by the second imaging unit 92. The post-mounting component image G2 (G2A) is acquired by imaging the component E mounted on the substrate P from above by the suction nozzle 63 before the substrate P is carried out from the apparatus main body 1a by the transfer of the substrate transfer unit 3. It is an image. That is, the post-mounting component image G2 (G2A) is a held surface on the side held by the suction nozzle 63 in the post-mounting component E before the board P is carried out from the apparatus main body 1a. This is an image in which the upper surface is captured. Then, the defect determination unit 16 determines whether or not a defect has occurred on the upper surface of the component E mounted on the substrate P based on the pre-holding component image G1 and the post-mounting component image G2 (G2A). This makes it possible to determine whether or not the component E after mounting on the board P has a defect, and prevents the board P on which the defective component has a defect from being carried out from the device main body 1a as much as possible. can do.

Further, the defect determination unit 16 refers to the operation condition information J1 (FIG. 9) stored in the operation condition storage unit 14 which the head drive control unit 13 refers to when controlling each of the suction holding operation and the mounting operation of the suction nozzle 63. In (see), when the load control setting information K3 is associated with the "load control implementation setting", the determination operation is not performed, and when the load control setting information K3 is associated with the "load control non-implementation setting". It may be configured to perform a determination operation. That is, the defect determination unit 16 does not perform the determination operation when the suction nozzle 63 is set to the “load control execution setting”, and the determination operation is performed when the suction nozzle 63 is set to the “load control non-execution setting”. I do.

When the suction nozzle 63 is set to the “load control implementation setting”, the suction nozzle 63 performs adjustment control of the pressing load on the component E in the suction holding operation and the mounting operation. As a result, it is possible to prevent the pressing load on the component E from becoming excessive, and to prevent defects from occurring in the component E due to the suction holding operation and the mounting operation by the suction nozzle 63. On the other hand, when the suction nozzle 63 is set to the "load control non-execution setting", the suction nozzle 63 does not perform the adjustment control of the pressing load on the component E in the suction holding operation and the mounting operation. In this case, the pressing load of the holder against the component may be excessive, and the possibility that the component E is defective increases. Therefore, the defect determination unit 16 does not perform the determination operation when the suction nozzle 63 is set to the "load control execution setting", and does not perform the determination operation when the suction nozzle 63 is set to the "load control non-execution setting". I do. As a result, the determination operation can be performed only when there is a high possibility that a defect will occur in the component E. Therefore, the time required for the determination operation by the defect determination unit 16 can be shortened, and the load of the determination operation by the defect determination unit 16 can be reduced.

Further, the defect determination unit 16 has a defect on the lower surface of the component E held by the suction nozzle 63 based on the post-holding component image G3 (see FIG. 12) acquired by the third imaging unit 93. It may be configured to determine whether or not it is present.

Here, the post-holding component image G3 that the defect determination unit 16 refers to when determining a defect on the lower surface of the component E will be described with reference to FIG. As described above, the post-holding component image G3 acquired by the third imaging unit 93 is an image of the component E sucked and held by the suction nozzle 63 before being mounted on the substrate P, and is captured from below. It is an image of the component E after being held by the nozzle 63. As shown in FIG. 12A, the post-holding component image G3 is composed of a nozzle tip region G31 composed of pixels corresponding to the tip 631 of the suction nozzle 63 and pixels corresponding to the component E held by the suction nozzle 63. Includes the component region G32. In the post-holding component image G3, the component region G32 is formed with the nozzle tip region G31 as a background. Further, the component region G32 includes an electrode region G321 composed of pixels corresponding to the electrode E5 on the lower surface of the component E and a substrate region G322 composed of pixels corresponding to the ceramic substrate E1 on the lower surface of the component E.

If defects such as "chips" and "cracks" occur on the lower surface of the component E held by the suction nozzle 63, the post-holding component image G3 acquired by the third imaging unit 93 will be described above. Similar to the post-mounting component image G2A, a defect region composed of pixels corresponding to the defects is included. The defect determination unit 16 determines whether or not a defect has occurred on the lower surface of the component E held by the suction nozzle 63, depending on whether or not the defect region is included in the held component image G3. be able to.

Further, the component E may be held by the suction nozzle 63 in an abnormal posture such as a tilted posture. A post-holding component image G3A of the component E in an abnormal posture is shown in FIG. 12 (B). If the component E is held by the suction nozzle 63 in an abnormal posture, the component E may not be mounted accurately on the substrate P. Therefore, the defect determination unit 16 determines whether or not the component E held by the suction nozzle 63 is in an abnormal posture based on the post-holding component image G3A acquired by the third imaging unit 93. It may be configured.

With reference to FIG. 8, the information output control unit 15 of the control unit 10 controls the information output operation of the information output unit 21. When the defect determination unit 16 determines that the component E has a defect, the information output control unit 15 controls the information output unit 21 to output the condition change command information J2 (see FIG. 13). The condition change command information J2 is information regarding a command for changing the respective operating conditions of the suction holding operation of the component E by the suction nozzle 63 and the mounting operation of the component E on the substrate P by the suction nozzle 63. As shown in FIG. 13, the condition change command information J2 includes, for example, message information J21 for prompting the operator to change the operating conditions of the suction nozzle 63, and list information J22.

In the example shown in FIG. 13, the message information J21 is information represented by the character string "A defect has been detected in a component on the board. Please consider changing the operating conditions." The message information J21 included in the condition change information J2 output from the information output unit 21 allows the operator to recognize that the component E mounted on the substrate P has a defect, and to perform the suction holding operation of the suction nozzle 63 and the suction holding operation of the suction nozzle 63. It is possible to consider changing the operating conditions of the mounting operation.

The list information J22 of the condition change command information J2 includes, for example, the operating condition item information J221 (operating condition item) indicating the item of the operating condition of the suction nozzle 63 and the current setting status information J222 indicating the current setting status for each operating condition. This is information in which (current setting status) and setting change input information J223 (setting change input) indicating the setting change input status for each operating condition are associated with each other. The setting change input information J223 can be rewritten by an operator's input operation via the operation unit 20. When the setting change input information J223 is rewritten via the operation unit 20, the operating condition information J1 (see FIG. 9) stored in the operating condition storage unit 14 is updated according to the rewriting.

Similar to the operating condition information J1 stored in the operating condition storage unit 14, the operating condition item information J221 of the list information J22 in the condition change command information J2 includes, for example, suction holding height information K1 (suction holding height). , Mounting height information K2 (mounting height), load control setting information K3 (load control setting), target load information K4 (target load), and component thickness information K5 (component thickness) are included.

In the example shown in FIG. 13, "AA" is associated with the suction holding height information K1 as the current setting status information J222, and the holding position is set to "AA" in the suction holding operation of the suction nozzle 63. It is shown to be. Further, "AA1" is associated with the suction holding height information K1 as the setting change input information J223, and the holding position is changed from the current setting "AA" to "AA1" in the suction holding operation of the suction nozzle 63. It has been shown to change.

In the example shown in FIG. 13, "BB" is associated with the mounting height information K2 as the current setting status information J222, and the mounting position is set to "BB" in the mounting operation of the suction nozzle 63. Is shown. Further, "BB1" is associated with the mounting height information K2 as the setting change input information J223, and the mounting position in the mounting operation of the suction nozzle 63 is changed from the current setting "BB" to "BB1". It has been shown to be done.

In the example shown in FIG. 13, "load control non-execution setting" is associated with the load control setting information K3 as the current setting status information J222, and the setting related to the adjustment control of the pressing load of the suction nozzle 63 is "load control". It is shown that it is set to "Non-implementation setting". Further, the "load control implementation setting" is associated with the load control setting information K3 as the setting change input information J223, and the setting related to the adjustment control of the pressing load of the suction nozzle 63 is the current setting "load control not implemented". It is shown that it will be changed from "Settings" to "Load Control Implementation Settings".

In the example shown in FIG. 13, “−” is associated with the target load information K4 as the current setting status information J222, indicating that the target value of the pressing load on the component E is not set. Further, "DD" is associated with the target load information K4 as the setting change input information J223, and the target value of the pressing load on the part E is changed from the current setting "-" to "DD". It is shown.

In the example shown in FIG. 13, "CC" is associated with the component thickness information K5 as the current setting status information J222, and the thickness of the component E to be suction-held by the suction nozzle 63 is set to "CC". It is shown that Further, "CC1" is associated with the component thickness information K5 as the setting change input information J223, and the thickness of the component E to be suction-held by the suction nozzle 63 is changed from the current setting "CC" to "CC1". It is shown to be changed to.

As described above, the information output unit 21 controlled by the information output control unit 15 has operating conditions of the suction holding operation of the component E by the suction nozzle 63 and the mounting operation of the component E on the substrate P by the suction nozzle 63. The condition change command information J2 related to the command to change is output. According to the condition change command information J2 output from the information output unit 21, the operator changes the operating condition of the suction nozzle 63 so as not to cause a defect in the component E after mounting on the substrate P, and relates to the changed operating condition. The operating condition information J1 can be input via the operation unit 20.

<About the operation of the component mounting device>
Next, the operation of the component mounting device 1 will be described with reference to the flowcharts of FIGS. 14A and 14B.

When the command signal for starting the component mounting operation of the component E on the substrate P is input by the operator's operation, the component mounting device 1 starts the component mounting operation. First, the component supply control unit 12 controls the component supply device 5. The component supply device 5 supplies the component E to the component supply position P1 by intermittently sending out the component storage tape 100 (step s1).

Next, the head drive control unit 13 controls the movement of the head unit 6 by the first drive mechanism 7 and the second drive mechanism 8 on the horizontal plane with respect to the X direction and the Y direction. The first drive mechanism 7 and the second drive mechanism 8 move the head unit 6 so that the suction nozzle 63 is located directly above the component supply position P1 (step s2). At this time, the second imaging unit 92 images the component E supplied to the component supply position P1 from above and acquires the component image G1 (see FIG. 10) before holding (step s3). Then, the defect determination unit 16 determines whether or not a defect has occurred on the upper surface of the component E before being held by the suction nozzle 63 based on the image G1 of the component before holding (steps 4 and s5).

When the defect determination unit 16 determines that the component E is not defective, the head drive control unit 13 controls the elevation operation of the suction nozzle 63 by the nozzle elevation drive mechanism 66. The nozzle elevating drive mechanism 66 lowers the suction nozzle 63. The lowered suction nozzle 63 sucks and holds the component E supplied to the component supply position P1 (step s6). When the suction nozzle 63 holds the component E, the head drive control unit 13 raises the suction nozzle 63. At this time, the third imaging unit 93 images the component E held by the suction nozzle 63 from below and acquires the component image G3 (see FIG. 12) after holding the component E (step s7). Then, the defect determination unit 16 determines whether or not a defect has occurred on the lower surface of the component E held by the suction nozzle 63 based on the held component image G3 (steps 8 and s9).

On the other hand, in step s5, when the defect determination unit 16 determines that the component E has a defect, the head drive control unit 13 executes a component disposal operation of discarding the component E held by the suction nozzle 63. As described above, the operation of the head unit 6 is controlled (step s10). Further, even when the defect determination unit 16 determines that the component E has a defect in step s9, the component disposal operation of discarding the component E held by the suction nozzle 63 is executed in step s10. By discarding the defective component E in this way, it is possible to reduce the occurrence of the substrate P on which the defective component with the defect is mounted.

When the defect determination unit 16 determines in step s9 that no defect has occurred in the component E, the board transfer control unit 11 controls the board transfer unit 3 to transfer the board P toward the component mounting position (step). s11). At this time, the first imaging unit 91 images various marks written on the upper surface of the substrate P from above in order to identify and position the type of the substrate P. As a result, the substrate P transported by the substrate transport unit 3 is positioned at the component mounting position.

Next, the head drive control unit 13 controls the movement of the head unit 6 by the first drive mechanism 7 and the second drive mechanism 8 on the horizontal plane with respect to the X direction and the Y direction. The first drive mechanism 7 and the second drive mechanism 8 move the head unit 6 so that the suction nozzle 63 is located directly above the component mounting position on the substrate P conveyed by the substrate transfer unit 3 (step s12). .. Further, the head drive control unit 13 is arranged directly above the component mounting position, lowers the suction nozzle 63 holding the component E, and executes the component mounting operation of the component E on the substrate P (step s13). In this way, the component E can be mounted on the substrate P. At this time, the second imaging unit 92 images the component E mounted on the substrate P from above and acquires the component image G2 (see FIG. 11) after mounting (step s14). Then, the defect determination unit 16 compares the pre-holding component image G1 acquired in step s3 with the post-mounting component image G2 acquired in step s14 on the upper surface of the component E mounted on the substrate P. It is determined whether or not a defect has occurred (step s15, step s16).

When the defect determination unit 16 determines that the component E after mounting on the board P is not defective, the board transfer control unit 11 controls the board transfer unit 3 and transfers the board P on which the component E is mounted. The substrate P is carried out from the apparatus main body 1a (step s17). As a result, the substrate P on which the defect-free component E is mounted can be carried out from the apparatus main body 1a.

On the other hand, in step s16, when the defect determination unit 16 determines that the component E after mounting on the substrate P has a defect, the control unit 10 suspends the production of the electronic circuit board (step s18). .. Then, the information output control unit 15 controls the information output unit 21 to output the condition change command information J2 (see FIG. 13) (step s19).

When the condition change command information J2 is output from the information output unit 21, the operator changes the operating conditions of the suction nozzle 63 according to the condition change command information J2 so that the component E after mounting on the substrate P does not have a defect. Then, the operating condition information J1 (see FIG. 9) regarding the changed operating condition can be input via the operation unit 20 (step s20). When the operating condition information J1 regarding the changed operating condition is input via the operating unit 20, the control unit 10 releases the suspension of the production of the electronic circuit board and restarts the production (step s21).

1 Parts mounting device 1a Device body 3 Board transfer part 5 Parts supply device 6 Head unit 63 Suction nozzle (holder)
9 Imaging device 91 1st imaging unit 92 2nd imaging unit 93 3rd imaging unit 10 Control unit 11 Board transfer control unit 12 Parts supply control unit 13 Head drive control unit 14 Operating condition storage unit 15 Information output control unit 16 Defect determination unit 161 Feature calculation unit 162 Judgment unit 20 Operation unit 21 Information output unit G1 Pre-holding part image G2, G2A Post-mounting part image G3 Post-holding part image J1 Operating condition information J2 Condition change command information

Claims (3)

With the device body
A substrate transfer unit that is arranged on the main body of the device and conveys the substrate,
A component supply device that is placed in the device body and supplies components to a predetermined component supply position,
A holder that is arranged in the apparatus main body and holds the component supplied to the component supply position, and mounts the held component on the substrate transported to a predetermined component mounting position by the substrate transport unit. With the head unit to have
Before the board is carried out from the main body of the apparatus by the transfer of the board transfer unit, the head unit captures the component mounted on the board from above, and the image pickup unit acquires an image of the component after mounting.
A defect determination unit for determining whether or not a defect has occurred is provided on the upper surface of the component mounted on the substrate based on the image of the component after mounting .
The image pickup unit is configured to take an image of the component supplied to the component supply position from above before being held by the holder, and acquire an image of the component before holding in addition to the image of the component after mounting.
The defect determination unit determines whether or not a defect has occurred on the upper surface of the component mounted on the substrate by comparing the image of the component before holding with the image of the component after mounting. .. With the device body
A substrate transfer unit that is arranged on the main body of the device and conveys the substrate,
A component supply device that is placed in the device body and supplies components to a predetermined component supply position,
A holder that is arranged in the apparatus main body and holds the component supplied to the component supply position, and mounts the held component on the substrate transported to a predetermined component mounting position by the substrate transport unit. With the head unit to have
Before the board is carried out from the main body of the apparatus by the transfer of the board transfer unit, the head unit captures the component mounted on the board from above, and the image pickup unit acquires an image of the component after mounting.
A defect determination unit for determining whether or not a defect has occurred is provided on the upper surface of the component mounted on the substrate based on the image of the component after mounting.
Regarding the setting of the adjustment control of the pressing load on the component, the holder can switch the setting between the load control execution setting for executing the adjustment control and the load control non-execution setting for not executing the adjustment control. Consists of
The defect determination unit does not perform a determination operation when the holder is set to the load control implementation setting, and performs a determination operation when the holder is set to the load control non-execution setting. Product mounting device. A head drive control unit that controls the head unit and executes control of the holding operation of the component by the holder and control of the mounting operation of the component on the substrate.
When the defect determination unit determines that a defect has occurred on the upper surface of the component, an information output unit that outputs condition change command information relating to a command for changing the operation conditions of the holding operation and the mounting operation. ,
The component mounting device according to claim 1 or 2 , further comprising an operation unit that receives an operation for inputting operation condition information related to the operation condition.

Images