TWI475189B - Wiring board measuring device and wiring board measurement method - Google Patents

Description

Wiring board measuring device and wiring board measuring method

The present invention relates to a wiring board measuring device and a wiring board measuring method.

Conventionally, in order to mount electronic components such as IC chips, resistors, and capacitors, a multilayer printed wiring board has been used. Each of the multilayer printed wiring boards is formed into a printed wiring board of each layer, and finally obtained by laminating a printed wiring board formed.

When the printed wiring board is laminated, since the wiring patterns of the respective printed wiring boards are not in the correct positional relationship, it is preferable to accurately measure the position of the wiring pattern formed on the printed wiring board. In particular, when a large number of multilayer printed wiring boards are produced, the printed wiring boards are laminated at each position (offset) of the wiring patterns, and the multilayer printed wiring boards can be efficiently manufactured.

In order to detect the position of the wiring pattern formed on the printed wiring board, the printed wiring board is placed on the mounting table, and an alignment mark formed on the printed wiring board is imaged vertically upward (for example, see Patent Document 1). In the device described in Patent Document 1, the temporary perforation position of the printed wiring board is obtained based on the image of the alignment mark by the X-ray camera, and the temporary perforation is corrected based on the temperature of the mounting table and the printed wiring board measured by the thermometer. The position also determines the perforation position of the printed wiring board in accordance with the temperature change of the printed wiring board.

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-227422

In the current state of high density of electronic equipment, high processing accuracy or measurement accuracy is required, and deformation due to deformation or temperature of the printed wiring board can be ignored. In the device described in Patent Document 1, since the photographic data is corrected by the computer based on the detected temperature, the accuracy of the sensor or the computer for detecting the temperature is required. Therefore, it is desirable to measure the printed wiring board without affecting the temperature change by other means.

The present invention has been made in view of the above circumstances, and an object thereof is to measure a printed wiring board with a simple configuration without affecting the temperature change of the printed wiring board.

In order to achieve the above object, a wiring board measuring apparatus according to a first aspect of the present invention measures a position of the mark of a printed wiring board provided with at least two marks for position measurement, and the wiring board measuring apparatus is characterized by: a mounting table for mounting the printed wiring board; a pressing plate for pressing the printed wiring board; and a pressing plate loading mechanism for carrying the pressing plate on the mounting table a printed wiring board; and a mark detecting means, which is carried by the above-mentioned pressing plate carrier mechanism In the state of the pressing plate, the mark of the printed wiring board is detected from above vertically.

Further, a moving means for moving the mounting table in a predetermined moving direction is provided, and the mark detecting means detects the mark of the printed wiring board when the mounting table is moved to a specific position by the moving means.

Further, the pressing plate carrier mechanism may move the pressing plate on the mounting table along the moving direction of the printed wiring board by the moving means.

Further, the pressing plate carrier mechanism may ride the pressing plate on the printed wiring board even if the mounting table moves toward the specific position by the moving means.

Further, when the pressing plate is loaded on the printed wiring board, the moving means moves the mounting table only by the first distance, and the pressing plate carrier mechanism moves the pressing plate only to be shorter than the first distance The second distance is also possible.

Further, the rotation detecting means for horizontally rotating the mounting table is provided, and the mark detecting means has a first imaging means for photographing the first range from the vertical direction, and a smaller range from the vertical upper side than the first imaging means. In the second imaging device, the wiring board measuring device picks up a mark of the printed wiring board by the first imaging means, and rotates the mounting table into at least two of the printed wiring boards by the rotating means based on the image data. The mark is equal to the relationship of the specific reference mark, and the mark of the printed wiring board is also photographed by the second imaging means. can.

Further, the mark detecting means may be provided at a position close to the initial position of the mounting table in the order of the second imaging means and the first imaging means.

Further, the pressing plate carrier mechanism may ride the pressing plate on the printed wiring board even if the mounting table moves toward the first imaging position in which the marking of the printed wiring board is photographed by the first imaging means. .

The wiring board measuring method according to the second aspect of the present invention is for measuring a position of the mark by printing a printed wiring board provided with a conductor layer and at least two marks for position measurement, and the wiring board measuring method is characterized by including a process of placing the printed wiring board on a mounting table; and a process of loading a pressing plate having a plate surface larger than a surface of the printed wiring board on a printed wiring board placed on the mounting table; and loading the above In the state where the plate is pressed, the process of marking the printed wiring board is detected vertically upward.

In the process of detecting the marking of the wiring board, when the mounting table is moved to a specific position by moving the mounting table to a specific direction, the marking of the printed wiring board is detected, and the pressing is performed. In the board engineering, even if the mounting table moves toward the specific position of the mounting table by the moving means, the pressing plate may be carried on the printed wiring board.

According to the wiring board measuring apparatus and the wiring board measuring method of the present invention, the printed wiring board can be measured with a simple configuration without affecting the temperature change of the printed wiring board.

A wiring board measuring device relating to an embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, the wiring board measuring device 1 includes a frame 10, a mounting table 2 on which the printed wiring board PCB belonging to the workpiece is placed, and a transport unit 3 for moving the mounting table 2, which are pressed. The plate 40 is loaded on the pressing plate carrier 4 on the mounting table 2, the imaging unit 5 that images the mounting table 2 from above vertically, and the control unit 6 (not shown in the second drawing) of the entire control device. Hereinafter, the direction in which the transport unit 3 moves the mounting table 2 is set to the Y direction, the horizontal direction perpendicular to the Y direction is the X direction, and the vertical direction is the Z direction. In addition, in the first drawing and the second drawing, the printed wiring board PCB on the mounting table 2 is indicated by a broken line, and the pressing plate 40 is indicated by a dotted line.

The blank arrows in the first and second figures are the positions of the operator, and the operator stands in the direction of the arrow (the positive direction of the Y-axis), and the printed wiring board PCB is put into the wiring board measuring device 1, and when the measurement is completed, Then, the printed wiring board PCB is taken out from the wiring board measuring device 1. The input and removal of the printed wiring board PCB can be performed by a transport device. The conveying device may be constituted by a robot arm provided with an adsorber adsorbed by, for example, air.

The mounting table 2 mounts the printed wiring board PCB on the upper mounting surface, The conveyance unit 3 moves to the Y-axis direction. The mounting table 2 is supported by the transport unit 3 at a specific height, and the mounting surface is horizontal. An adsorption hole 2a is formed in a central portion of the mounting table 2, and an adsorption device (not shown) that causes the adsorption hole 2a to be a negative pressure is connected. When the printed wiring board PCB is placed on the mounting table 2, the suction hole 2a becomes a negative pressure, and the printed wiring board PCB is adsorbed to the mounting table 2 and fixed.

The transport unit 3 moves the mounting table 2 in the Y direction and rotates the mounting table 2 in the Z direction, so that the arrangement of the mounting table 2 can be adjusted. The transport unit 3 includes a moving table 31, guide rails 32a and 32b that are fixed to the frame 10 and extend in one of the Y directions, a ball screw 33 that extends in the Y direction, and a moving motor 34 that rotates the ball screw 33, and The turntable 35 that rotates the stage 2 to the moving table 31. The moving table 31 supports the mounting table 2, and the ball nut (not shown) provided in the moving table 31 is engaged with the ball screw 33. With this configuration, when the ball screw 33 is rotated by the moving motor 34, the moving table 31 moves in the Y direction along the guide rails 32a and 32b, and the mounting table 2 supported by the moving table 31 and the moving table 31 are simultaneously Move in the Y direction. Further, the mounting table 2 rotates the moving table 31 in the Z direction by the rotating table 35. The turntable 35 has a drive mechanism (not shown) that rotates the mount 2 .

The pressing plate carrier 4 is attached to the pressing plate 40 on the printed wiring board PCB placed on the mounting table 2. The pressing plate 40 has a plate surface larger than the plate surface of the printed wiring board PCB, and is formed in a rectangular shape by a transparent resin or the like. It is desirable that the pressing plate 40 has a sufficient weight to remove deformation due to distortion or temperature of the printed wiring board PCB, and must be caused by temperature. The deformation is small, and the imaging unit 5 does not interfere with the material and shape of the printed wiring board PCB. According to such conditions, the material or shape of the pressing plate 40 can be appropriately determined.

The pressing plate carrier 4 includes an actuator 41 that moves the pressing plate 40 up and down, and a pressing plate moving portion 43 that moves the pressing plate 40 in the Y direction. The actuator 41 simultaneously raises and lowers the lifting table 42 located at the four corners of the pressing plate 40, and lifts the pressing plate 40 up to the upper surface of the mounting surface of the mounting table 2 or to the mounting table 2. The pressing plate moving portion 43 moves the pressing plate 40 lifted by the lifting table 42 in the Y direction by moving the lifting table 42 in the Y direction. Since the pressing plate moving portion 43 is required to move in comparison with the mounting table 2 or the imaging unit 5, in the present embodiment, the non-ball screw is rotated by the motor, and the lifting table is interlocked with the belt. 42 movers.

The imaging unit 5 includes one set of pre-alignment cameras 51a and 51b, one set of measurement cameras 52a and 52b, a moving pre-alignment camera 51a, a left camera moving unit 53L for measuring cameras 52a, and a moving pre-alignment camera 51b. And the right camera moving portion 53R of the measuring camera 52b.

The pre-alignment cameras 51a and 51b photograph the guide marks M, which will be described later, from the upper side of the printed wiring board PCB, and capture a relatively wide range (for example, a range of 100 mm × 100 mm). Further, the measuring cameras 52a and 52b are capable of photographing the guide marks M of the printed wiring board PCB from above vertically, and can accurately photograph a narrower range than the pre-alignment cameras 51a and 51b (for example, tens of mm × tens of mm Scope). The pre-alignment cameras 51a and 51b are fixed to the mounts 54L and 54R from the side farther from the operator (the right side in FIG. 2), and the measurement cameras 52a and 52b are separated from the operator. The near side (the left side in Fig. 2) is fixed to the mounts 54L, 54R.

The pre-alignment camera 51a and the measurement camera 52a are fixed to the gantry 54L, and are moved in the X direction by the left camera moving portion 53L. The left camera moving portion 53L includes a ball screw 55L extending in the X direction, a ball nut (not shown) that is fixed to the frame 54L and engaged with the ball screw 55L, and a left camera motor 56L that rotates the ball screw 55L. In the left camera moving unit 53L, the ball screw 55L is rotated by the left camera motor 56L, and the gantry 54L is moved in the X direction, and the pre-aligning camera 51a and the measuring camera 52a are moved in the X direction.

The pre-alignment camera 51b and the measurement camera 52b are fixed to the gantry 54R, and are moved in the X direction by the right camera moving portion 53R. The right camera moving portion 53R includes a ball screw 55R extending in the X direction, a ball nut (not shown) that is fixed to the frame 54R and engaged with the ball screw 55R, and a left camera motor 56R that rotates the ball screw 55R. In the right camera moving unit 53R, the ball screw 55R is rotated by the right camera motor 56R, and the gantry 54R is moved in the X direction, and the pre-aligning camera 51b and the measuring camera 52b are moved in the X direction.

As shown in FIG. 3, the control unit 6 includes a control unit 61, a main storage unit 62, an external storage unit 63, an operation unit 64, a display unit 65, and an input/output unit 66. The main memory unit 62, the external memory unit 63, the operation unit 64, the display unit 65, and the input/output unit 66 are connected to the control unit 61 via the internal bus bar 68.

The control unit 61 is configured by a CPU (Central Processing Unit) or the like, and performs the subsequent measurement along with the program stored in the external storage unit 63. The amount is processed.

The main memory unit 62 is constituted by a RAM (Random-Access Memory) or the like, and downloads a program stored in the external storage unit 63 to be used as a work area of the control unit 61.

The external storage unit 63 is composed of a non-volatile memory such as a flash memory, a hard disk, a DVD-RAM (Digital Versatile Disc Random-Access Memory), or a DVD-RW (Digital Versatile Disc Rewritable). The program for causing the control unit 61 to execute the above processing, and further, with the instruction of the control unit 61, supplies the data memorized by the program to the control unit 61, and memorizes the material supplied from the control unit 61.

The operation unit 64 is constituted by a pointing device such as a keyboard or a mouse, and an interface device such as a keyboard and a pointing device connected to the internal bus bar 68. The operation unit 64 inputs an instruction to start or end the processing, and the like, and supplies it to the control unit 61.

The display unit 65 is constituted by a CRT (Cathode Ray Tube) or an LCD (Liquid Crystal Display) or the like, and indicates a printed wiring board PCB that has been photographed or measured by the pre-alignment cameras 51a and 51b or the measurement cameras 52a and 52b. The coordinates of the guidance mark M, warnings, instructions to the operator, and the like.

The input/output unit 66 is composed of a serial interface or a LAN (Local Area Network) interface. An image signal or the like photographed from the pre-alignment cameras 51a and 51b or the measurement cameras 52a and 52b is input via the input/output unit 66. Further, an adsorption unit or a conveyance unit (not shown) that drives the mounting table 2 is output. The portion 3, the signal of the plate mounting portion 4 and the imaging unit 5.

The wiring board measuring device 1 of the above configuration can measure the printed wiring board PCB. In the printed wiring board PCB of the present embodiment, as shown in FIG. 4, four guide marks M1 to M4 (hereinafter also referred to collectively as "guide mark M") are printed. The guide marks M1 to M4 are disposed in the vicinity of the apex of the printed wiring board PCB 4, and are printed at positions equidistant from the four sides of the rectangular printed wiring board PCB.

Next, the operation of the wiring board measuring device 1 will be described. The control unit 61 of the wiring board measuring device 1 performs initial processing by driving various actuators, for example, at the time of starting. In the initial processing, the mounting table 2, the pressing plate 40, the pre-alignment cameras 51a and 51b, and the measurement cameras 52a and 52b are moved to a specific initial position. In the present embodiment, the mounting table 2 is disposed at a position close to the operator, and the pressing plate 40 is disposed at a position offset from the mounting table 2 (see FIGS. 1 and 2).

Then, the control unit 61 executes the wiring board measurement processing shown in FIG. 5 by, for example, turning on the measurement switch (not shown) by the operator. The control unit 61 first fixes the printed wiring board PCB belonging to the measurement target on the mounting table 2 (step S1). At this time, the control unit 61 displays a message on the display unit 65 to present the introduction of the printed wiring board PCB, and causes the operator to mount the printed wiring board PCB as a workpiece on the mounting table 2.

When the wiring board measuring device 1 is provided with a transport device for supplying and removing the printed wiring board PCB, the instruction is directed to the transport device to instruct the introduction of the printed wiring board PCB, and the printed wiring board PCB is introduced onto the mounting table 2, And receiving a message indicating completion of mounting of the printed wiring board PCB from the carrier.

The control unit 61 causes the mounting table 2 to be placed when the printed wiring board PCB is placed on the mounting table 2 by a switching operation from a pressure sensor or a switch from a worker, a signal from the carrier, or the like. The adsorption hole 2a is placed at a negative pressure, and the printed wiring board PCB is placed on the mounting table 2.

Next, the control unit 61 rides the pressing plate 40 on the printed wiring board PCB in accordance with the movement of the mounting table 2 (step S2). At this time, as shown in FIG. 6, the transport unit 3 moves the mounting table 2 to the position where the guide mark M1 of the printed wiring board PCB is within the field of view of the pre-alignment camera 51a, and the guide mark M2 is in the pre-alignment camera. The position within the field of view of 51b. At the same time, the pressing plate carrier 4 moves the pressing plate 40 to be close to the mounting table 2. The moving distance of the pressing plate 40 at this time is set to Lw1. Then, when the pressing plate 40 moves on the mounting table 2, the pressing plate 40 is lowered onto the mounting table 2 by the pressing plate loading portion 4. In the present embodiment, when the pressing plate 40 is loaded on the printed wiring board PCB, the moving distance Lw1 of the pressing plate 40 generated by the pressing plate carrying portion 4 is smaller than that by the moving mechanism. The moving distance Lb (Lb>Lw1) of the generated stage 2 is generated.

When the pressing plate 40 is placed on the printed wiring board PCB as described above, the deformation of the printed wiring board PCB or the temperature change is suppressed by the pressing of the pressing plate 40.

Next, the control unit 61 is in a state where the pressing plate 40 is loaded on the printed wiring board PCB, and is photographed by the pre-alignment cameras 51a, 51b. The guide marks M1, M2 of the wiring board PCB are brushed (step S3). At this time, the control unit 61 moves the gantry 54L, 54R so that the pre-alignment cameras 51a, 51b are at a distance equal to the distance Lx of the guide marks M1, M2 in the X direction, and the guide marks M are photographed by the pre-alignment cameras 51a, 51b. . As described above, the pre-alignment cameras 51a and 51b can capture a relatively wide range, so that the guide marks M1 and M2 can be easily photographed.

Next, the control unit 61 adjusts the image of the image to be imaged by the pre-alignment cameras 51a and 51b so that the guide mark M is arranged in the X direction and the Y direction, and the stage 3 is rotated by the turntable 35 to adjust The direction of the printed wiring board PCB (step S4). Further, as the mounting table 2 is rotated by the rotary table 35, the printed wiring board PCT or the pressing plate 40 also rotates.

The guide marks M1 to M4 of the printed wiring board PCB placed on the mounting table 2 by the shift of the mounting position caused by the operator or the transport device, or the manufacturing error of the wiring pattern formed on the printed wiring board PCB. It is arranged to be offset in the X direction and the Y direction with respect to a position to be arranged in the design. Therefore, in the present embodiment, the guide marks M1 and M2 are photographed by the pre-alignment cameras 51a and 51b having a relatively wide imaging range, and the direction of the printed wiring board PCB is adjusted based on the image data to be photographed so that the guide mark M is made. The position is a specific relationship (for example, the relationship between the guide marks M1 to M4 in the X direction and the Y direction).

Next, the control unit 61 photographs the guide marks M of the printed wiring board PCB by the measuring cameras 52a and 52b (step S5). At this time, the control unit 61 first makes the mounting table by the measuring cameras 52a, 52b, for example. 2 moving to the position of the photographic guide marks M3, M4, and moving the gantry 54L, 54R so that the distance between the measuring cameras 52a, 52b is equal to the distance Lx of the guiding mark M in the X direction by the measuring cameras 52a, 52b Photography guide marks M3, M4. Next, the measuring cameras 52a and 52b move the mounting table 2 to the positions where the photographable guiding marks M1 and M2 are positioned, and the guiding cameras M1 and M2 are photographed by the measuring cameras 52a and 52b. Further, when the photographing is performed by the measuring cameras 52a and 52b, the center positions of the measuring cameras 52a and 52b in the X direction may be moved based on the data photographed by the pre-aligning cameras 51a and 51b.

In the measuring cameras 52a and 52b, feature points of the guide mark M and the printed wiring board PCB are photographed so as to measure the position of the wiring pattern in the printed wiring board PCB. For example, a reference mark not shown in the printed wiring board PCB or a side of the printed wiring board PCB may be used as a feature point of the printed wiring board PCB. As described above, the cameras 52a and 52b for measurement can be accurately imaged compared to the cameras 51a and 51b for pre-alignment. Therefore, the printed wiring board PCB can be accurately measured by the measuring cameras 52a and 52b. Further, since the pre-alignment cameras 51a and 51b and the turntable 35 adjust the direction of the printed wiring board PCB so as to guide the marks M1 to M4 in the X direction and the Y direction, it is easy to photograph and guide in the vicinity of the photographing center. Mark M and measure the printed wiring board PCB quickly and precisely.

In this manner, in the present embodiment, the measuring cameras 52a and 52b are disposed closer to the mounting table 2 than the pre-aligning cameras 51a and 51b. The initial position. On the other hand, as shown in FIG. 6(b), when the distances of the pressing plates 40 when the measuring cameras 52a and 52b and the pre-alignment cameras 51a and 51b are arranged oppositely are set to Lw2, Lw1 is obtained. <Lw2.

Therefore, in the configuration shown in Fig. 6(a) and the configuration shown in Fig. 6(b), when the time from the introduction of the printed wiring board PCB to the lowering of the pressing plate 40 to the mounting table 2 is constant, In the configuration shown in Fig. 6(a), the moving speed of the pressing plate carrier 4 can be made slower than the configuration shown in Fig. 6(b). Furthermore, the movable range of the design pressing plate carrier portion 4 can be reduced.

When the guide marks M of the printed wiring board PCB are photographed by the measuring cameras 52a and 52b, the control unit 61 assigns a correlation to the identification number of the printed wiring board PCB belonging to the measuring object, and memorizes the measurement data based on the photographed data. The storage unit 62 (step S6). When the identification number of the printed wiring board PCB is, for example, the first printed wiring board measured on the day, it is set to the number 1. Others, even if they are related to batch numbers, etc. The control unit 61 calculates the position of the wiring pattern in the printed wiring board PCB based on the image data captured by the measurement cameras 52a and 52b as the measurement data, and stores it in the main memory unit 62. For example, in terms of measurement data, the distance between the X-direction and the Y-direction of the memory from the center of the guide marks M1 to M4 to the side (feature point) of the printed wiring board PCB can be considered.

In this way, when the measurement data of the printed wiring board PCB is memorized, the control unit 61 moves the mounting table 2 to the specific lifting position by the conveying portion 3, and moves the lifting table 42 by pressing the plate moving portion 43. ,Make The lifting table 42 is located below the pressing plate 40. Then, after the pressing plate 40 is lifted from the mounting table 2 and the printed wiring board PCB by the elevating table 42, the mounting table 2 is moved to the initial position (step S7), and after the mounting table 2 is moved to the initial position, the printed wiring is released. The board PCB and the mounting table 2 are fixed (step S8), and the wiring board measurement processing is ended. The pressing plate 40 may stay in the field even if it is installed after the work, and if it does not obstruct the removal operation of the printed wiring board PCB, the pressing plate moving portion 43 of the board riding portion 4 is moved to not move. The position where the printed wiring board PCB is taken out may be hindered. The control unit 61 releases the negative pressure of the adsorption hole 2a of the mounting table 2 and releases the fixing of the mounting table 2, and then displays a message on the display unit 65 to prompt the removal of the printed wiring board PCB, thereby causing the operator to remove the printed wiring board. PCB. Further, when the transport device (not shown) is provided, the transport device is driven to remove the printed wiring board PCB from the mounting table 2.

As described above, the wiring board measuring apparatus 1 of the present embodiment is mounted on the printed wiring board PCB by the pressing board 40 having the board surface larger than the board surface of the printed wiring board PCB, by the pre-alignment camera 51a, The 51b and the measuring cameras 52a and 52b measure the guide mark M, so that the printed wiring board PCB can be measured by suppressing the distortion or deformation of the printed wiring board PCB, and the printed wiring board PCB can be measured without affecting the temperature change.

Further, since the pressing plate 40 is carried on the printed wiring board PCB by the movement of the mounting table 2 of the transport unit 3, the moving distance of the pressing plate 40 by the pressing board riding portion 4 can be reduced. Therefore, the movable range of the pressing plate carrier portion 4 can be reduced, or the pressing plate 40 can be quickly loaded on the printed wiring board PCB, or the moving speed of the pressing plate carrier portion 4 can be changed. slow. Further, after the pressing plate 40 is placed on the mounting table 2, the pressing plate 40 is moved by the conveying unit 3. Therefore, as described in the present embodiment, it is possible to adopt a configuration in which the pressing plate carrier portion 4 is driven by an inexpensive leather belt without using a high-priced ball screw, and the cost of the wiring board measuring device 1 can be reduced.

The present invention has been described above by way of an embodiment, but the present invention is not limited to the above-described embodiments, and its application and modifications are arbitrary. For example, in the above embodiment, although a CCD camera is used as the pre-alignment cameras 51a and 51b or the measurement cameras 52a and 52b, if the guide mark M of the printed wiring board PCB can be measured, even if, for example, X-rays are used, Any of the cameras, etc. can also be used. In this case, the pressing plate 40 may be used without detecting the marking of the printed wiring board. Further, even with the pre-alignment cameras 51a and 51b and the measurement cameras 52a and 52b, different types of cameras may be used. Further, the pre-alignment cameras 51a and 51b and the measurement cameras 52a and 52b may be arranged on the lower side or the upper side and the lower side of the mounting table 2, respectively.

In the above-described embodiment, the deformation of the printed wiring board PCB is suppressed by the weight of the pressing plate 40. However, the mechanism for pressing the pressing plate 40 against the mounting surface of the mounting table 2 may be employed. Further, even if the pressing plate 40 is pressed against the mounting table 2, it may be fixed to the mounting table 2 with the printed wiring board PCB instead of the adsorption device.

In the above-described embodiment, the pressing plate 40 is carried on the printed wiring board PCB by the movement of the mounting table 2 of the transport unit 3, but the mounting plate is not required to be carried by the transport unit 3 2 by moving by pressing The platen carrier 4 may also carry the pressing plate 40 on the printed wiring board PCB.

In the above-described embodiment, the pre-alignment cameras 51a and 51b and the measurement cameras 52a and 52b are provided. However, the pre-alignment cameras 51a and 51b may not be provided. Further, even if the measurement cameras 52a and 52b are placed up and down, they may serve as a measurement camera and a pre-alignment camera. Further, even if the rotary table 35 for rotating the mounting table 2 is not provided, the mechanism for moving the mounting table 2 in the X direction may be provided instead of or in addition to the rotary table 35.

In the above embodiment, the guide marks M1 to M4 are provided at four corners of the printed wiring board PCB. However, the present invention is not limited to such an example, and at least two guide marks may be provided. Further, the guide mark is not limited to printing, and may be a hole or the like.

Further, even in the wiring board measuring device 1, another configuration such as an opening mechanism for opening a hole in the printed wiring board PCB may be mounted.

1‧‧‧Wiring board measuring device

2‧‧‧ mounting table

2a‧‧‧Adsorption holes

3‧‧‧Transportation Department

4‧‧‧Press board ride

5‧‧‧Photography Department

6‧‧‧Control Department

10‧‧‧Frame

30‧‧‧Mobile Department

31‧‧‧Mobile station

32a, 32b‧‧‧ rails

33‧‧‧Rolling screw

34‧‧‧Moving motor

35‧‧‧Rotating table

40‧‧‧ Press plate

41‧‧‧Actuator

42‧‧‧Elevator

43‧‧‧ Pressing plate moving part

51a, 51b‧‧‧Pre-alignment camera

52a, 52b‧‧‧Measurement cameras

53L‧‧‧ Left Camera Movement Department

53R‧‧‧Right Camera Movement Department

61‧‧‧Control unit

62‧‧‧Main Memory

63‧‧‧External Memory Department

64‧‧‧Operation Department

65‧‧‧Display Department

66‧‧‧Input and output

68‧‧‧Internal busbar

M1~M4‧‧‧ boot mark

Fig. 1 is a side view schematically showing an outline of a configuration of a wiring measuring device according to an embodiment of the present invention.

Fig. 2 is a top view showing the outline of the configuration of the wiring board measuring device.

Fig. 3 is a view showing an outline of a configuration of a control unit.

Fig. 4 is a view showing an example of a guide mark printed on a printed wiring board.

Fig. 5 is a flow chart showing an example of wiring board measurement processing.

Fig. 6 is a schematic view for explaining an operation when the pressing plate is placed on the printed wiring board, wherein (a) shows the operation of the wiring board measuring device according to the present embodiment, and (b) shows a comparative example. The operation of the wiring board measuring device.

1‧‧‧Wiring board measuring device

2‧‧‧ mounting table

2a‧‧‧Adsorption holes

3‧‧‧Transportation Department

4‧‧‧Press board ride

5‧‧‧Photography Department

10‧‧‧Frame

32a, 32b‧‧‧ rails

33‧‧‧Rolling screw

34‧‧‧Moving motor

35‧‧‧Rotating table

40‧‧‧ Press plate

42‧‧‧Elevator

51a, 51b‧‧‧Pre-alignment camera

52a, 52b‧‧‧Measurement cameras

53L‧‧‧ Left Camera Movement Department

53R‧‧‧Right Camera Movement Department

54L‧‧‧Rack

54R‧‧‧Rack

55L‧‧·ball screw

55R‧‧·ball screw

56L‧‧‧Left camera motor

56R‧‧‧Right camera motor

Claims (9)

A wiring board measuring device for measuring a position of the mark of a printed wiring board provided with at least two marks for position measurement, the wiring board measuring device comprising: a mounting table on which the printed wiring board is placed; a pressing plate for pressing the printed wiring board; a pressing plate loading mechanism for tying the pressing plate on a printed wiring board placed on the mounting table; and a marking detecting means The mark of the printed wiring board is detected from a vertically upward state in a state in which the pressing plate is loaded by the pressing plate carrier mechanism, and a moving means for moving the mounting table in a predetermined moving direction, the mark The detecting means detects the mark of the printed wiring board when the mounting table is moved to the specific position by the moving means, and the pressing plate loading mechanism moves along the moving direction of the printed wiring board by the moving means The pressing plate is moved on the mounting table. The wiring board measuring device according to the first aspect of the invention, wherein the pressing plate riding mechanism moves the pressing plate on the printed wiring board as the mounting table moves toward the specific position by the moving means. Such as the wiring board measuring device described in item 2 of the patent application scope In the case where the pressing plate is carried on the printed wiring board, the moving means moves the mounting table only by the first distance, and the pressing plate loading mechanism moves the pressing plate only to be shorter than the first distance. The second distance. A wiring board measuring device for measuring a position of the mark of a printed wiring board provided with at least two marks for position measurement, the wiring board measuring device comprising: a mounting table on which the printed wiring board is placed; a pressing plate for pressing the printed wiring board; a pressing plate loading mechanism for tying the pressing plate on a printed wiring board placed on the mounting table; and a marking detecting means The mark of the printed wiring board is detected from a vertically upward state in a state in which the pressing plate is loaded by the pressing plate carrier mechanism, and a moving means for moving the mounting table in a predetermined moving direction, the mark The detecting means detects the mark of the printed wiring board when the mounting table is moved to the specific position by the moving means, and the pressing plate riding mechanism moves toward the specific position by the moving means along with the moving table The pressing plate is carried on the printed wiring board. The wiring board measuring device according to claim 4, wherein the shifting is performed when the pressing plate is loaded on the printed wiring board The moving means moves the mounting table only by the first distance, and the pressing plate riding mechanism moves the pressing plate only by a second distance shorter than the first distance. A wiring board measuring device for measuring a position of the mark of a printed wiring board provided with at least two marks for position measurement, the wiring board measuring device comprising: a mounting table on which the printed wiring board is placed; a pressing plate for pressing the printed wiring board; a pressing plate loading mechanism for tying the pressing plate on a printed wiring board placed on the mounting table; and a marking detecting means The mark of the printed wiring board is detected from a vertically upward state in a state in which the pressing plate is loaded by the pressing plate carrier mechanism; and the moving means is configured to move the mounting table in a predetermined moving direction; and a rotating means The mark detecting means detects the mark of the printed wiring board when the mounting table moves to a specific position by the moving means, and the mark detecting means has a vertical upward direction. The first imaging means of the first range of photography, and the second imaging device that is smaller than the first imaging means from the vertical upper precision imaging In the above-described wiring board measuring apparatus, the marking of the printed wiring board is imaged by the first imaging means, and the mounting table is rotated into at least two of the printed wiring boards by the rotating means based on the captured data. The mark is equal to the relationship of the specific reference mark, and by the second camera described above The means of photographing the marking of the printed wiring board described above. The wiring board measuring device according to claim 6, wherein the mark detecting means is provided at a position close to an initial position of the mounting table in the order of the second imaging means and the first imaging means. The wiring board measuring device according to claim 6 or 7, wherein the pressing plate riding mechanism is a first image in which the marking of the printed wiring board is photographed by the first imaging means as the mounting table faces The position is moved, and the pressing plate is carried on the printed wiring board. A wiring board measuring method for measuring a position of the mark by printing a printed wiring board provided with a conductor layer and at least two marks for position measurement, the wiring board measuring method characterized by: mounting the printing on a mounting table a work of a wiring board; a process of loading a pressing plate having a plate surface larger than a surface of the printed wiring board on a printed wiring board placed on the mounting table; and vertically loading the pressing plate In the process of detecting the mark of the printed wiring board above, in the process of detecting the mark of the wiring board, when the mounting table is moved to a specific position by moving the mounting table to a specific direction, the detection is detected. In the process of riding the pressing plate, the marking of the printed wiring board moves toward the specific position of the mounting table by the moving means by the moving means. The above-mentioned pressing plate is carried on the printed wiring board.