KR20120134065A - Electronic component mounting method and mounting apparatus - Google Patents

Abstract

PURPOSE: A method for mounting an electronic component and a mounting apparatus is provided to improve production efficiency by using a mounting head. CONSTITUTION: Two transfer device(2A,2B) transfers a substrate. Two component feeding devices(3A,3B) are formed in the substrate. Electronic components are supplied to two component feeding devices. A pair of beams are mounted is mounted in a mounting head(6A,6B). Other electronic components are mounted in the substrate.

Description

ELECTRONIC COMPONENT MOUNTING METHOD AND MOUNTING APPARATUS}

The present invention provides two conveying apparatuses each carrying a substrate in parallel, two component supply apparatuses arranged on the front side and the inner side of the apparatus main body and supplying a plurality of types of electronic components mounted on the substrate, and one direction. A pair of opposing beams movable by a one-way drive source having a mounting head movable in the other direction orthogonal to the one direction, respectively, wherein either one of the mounting heads provided in one of the beams The electronic component taken out from the component supply apparatus of this invention relates to the mounting method and mounting apparatus of the electronic component which mount on the said board | substrate conveyed by either said said conveyance apparatus.

The electronic component mounting apparatus which takes out an electronic component and mounts it on a board | substrate by the adsorption nozzle attached to the mounting head from a component supply apparatus is disclosed by patent document 1 etc. In recent years, multivariate variable production forms have become widespread, and measures to reduce "non-operation time" other than the time when production facilities are mounted, such as a model change time of a production equipment and a work order change work time, are requested | required. have. In order to achieve this correspondence, the configuration having two mounting heads in two beams of opposite type is used as a specification having two rows of transfer devices (dual lanes) provided in parallel, and different models of substrates are each used in two rows of transfer devices. Proposals for independent production modes are beginning. The basic operation is to make the two mounting heads opposed to each other mount to the electronic component on the substrate in each transfer apparatus.

Japanese Patent Application Laid-open No. 2010-87305

However, a remarkable difference occurs in the mounting processing time of the electronic components of the mounting heads provided in the two beams, and the electrons become a bottleneck on the balance of the production efficiency of each electronic component mounting apparatus in the mounting line of the electronic components. There is a case where a parts mounting apparatus is generated, and a solution for correcting this is required.

Therefore, in view of these problems, the present invention, even if there is a significant deviation in the mounting processing time of the electronic component of the mounting head provided in the two beams, the production efficiency of each electronic component mounting apparatus in the mounting line of the electronic component It aims at preventing the electronic component mounting apparatus which becomes a bottleneck on a balance from generating.

To this end, the first invention provides two conveying apparatuses each carrying a substrate in parallel, and two component supply apparatuses for supplying a plurality of types of electronic components arranged on the front side and the inner side of the apparatus main body and mounted on the substrate. And a mounting head movable on the opposite pair of beams movable in one direction by one direction driving source, the mounting head movable in the other direction orthogonal to the one direction, respectively, and provided in one of the beams. A mounting method of an electronic component for mounting an electronic component taken out of one of the component supply apparatuses on the substrate conveyed by either of the transfer apparatuses, wherein the mounting head of the one of the beams is in an idle state. If there is, the installation situation of the electronic component to the board | substrate in the said other conveyance apparatus which grasp | ascertains, The mounting head in the idle state is mounted on the electronic component that is not mounted on the substrate in the other transfer device based on the result of grasping the mounting state of the electronic component.

2nd invention provides two conveying apparatuses which convey a board | substrate in parallel, two component supply apparatuses which are arrange | positioned at the front side and the inner side of an apparatus main body, and supply several types of electronic components attached to the said board | substrate, A pair of opposing beams movable in one direction by a one-way drive source, each having a mounting head movable in the other direction orthogonal to the one direction by a driving source in another direction; In the mounting method of the electronic component which mounts the electronic component extracted from one component supply apparatus on the said board | substrate conveyed by either said conveying apparatus, mounting of an electronic component is completed and the said mounting of the said one beam In the case where the head is in the standby state, on the mounting of the electronic component on the substrate in the other opposite transfer apparatus The mounting head in the standby state is attached to an electronic component in which the electronic component is not attached to the substrate in the other transfer device based on the result of grasping the sulfur and the mounting status of the electronic component. It is characterized by.

3rd invention provides two conveying apparatuses which carry a board | substrate in parallel, two component supply apparatuses which are arrange | positioned at the front side and the inner side of an apparatus main body, and supply several types of electronic components attached to the said board | substrate, A pair of opposing beams movable in one direction by a one-way drive source, each having a mounting head movable in the other direction orthogonal to the one direction by a driving source in another direction; In the mounting method of the electronic component which mounts the electronic component extracted from one component supply apparatus on the said board | substrate conveyed by either said conveying apparatus, mounting of an electronic component is completed and the said mounting of the said one beam In the case where the head is in the standby state, on the mounting of the electronic component on the substrate in the other opposite transfer apparatus On the basis of the result of grasping sulfur and the mounting status of this electronic component, the mounting process in the mounting data corresponding to the substrate in the other transfer device performs an unprocessed mounting step of the beam in the standby state. The mounting in the standby state with respect to an electronic component in which one reciprocation is extracted and the electronic component is not mounted on the substrate in the other transfer device based on the extracted unprocessed mounting step of the reciprocation. It is characterized in that the head is mounted.

4th invention provides the two conveying apparatuses which convey a board | substrate in parallel, two component supply apparatuses which are arrange | positioned at the front side and the inner side of an apparatus main body, and supply several types of electronic components attached to the said board | substrate, A pair of opposing beams movable in one direction by a one-way drive source, each having a mounting head movable in the other direction orthogonal to the one direction by a driving source in another direction; In the mounting apparatus of the electronic component which mounts the electronic component extracted from one component supply apparatus on the said board | substrate conveyed by either said conveying apparatus, When the said mounting head of any one said beam is in an idle state. Grasping means for grasping the mounting state of the electronic component on the substrate in the transfer device on the other side, and Control to control the mounting head in the idle state to be mounted on the electronic component that is not mounted on the substrate in the other transfer device based on a result of the grasp of the mounting state of the electronic component by the grasp means; A means is provided.

5th invention is the two conveying apparatus which each conveys a board | substrate in parallel, the two component supply apparatuses which are arrange | positioned at the front side and the inner side of an apparatus main body, and supply several types of electronic components attached to the said board | substrate, A pair of opposing beams movable in one direction by a one-way drive source, each having a mounting head movable in the other direction orthogonal to the one direction by a driving source in another direction; In the mounting apparatus of the electronic component which mounts the electronic component extracted from one component supply apparatus on the said board | substrate conveyed by either said said conveying apparatus, mounting of an electronic component is completed and the said mounting of the said one beam In the case where the head is in the standby state, on the mounting of the electronic component on the substrate in the other opposite transfer apparatus The grasp means for grasping sulfur and the electronic component that is not attached to the substrate in the other transfer device based on the grasping state of the electronic component by the grasping means. And control means for controlling the mounting head to be mounted.

The sixth invention includes two conveying apparatuses each carrying a substrate in parallel, two component supply apparatuses arranged on the front side and the inner side of the apparatus main body and supplying a plurality of types of electronic components mounted on the substrate; A pair of opposing beams movable in one direction by a one-way drive source, each having a mounting head movable in the other direction orthogonal to the one direction by a driving source in another direction; In the mounting apparatus of the electronic component which mounts the electronic component extracted from one component supply apparatus on the said board | substrate conveyed by either said said conveying apparatus, mounting of an electronic component is completed and the said mounting of the said one beam In the case where the head is in the standby state, on the mounting of the electronic component on the substrate in the other opposite transfer apparatus The mounting process in the mounting data corresponding to the said board | substrate in the said other said conveyance apparatus is based on the grasp | membrane which grasp | disconnects sulfur, and the result of having grasped | ascertained the mounting state of an electronic component by this grasp | measurement The electronic component to the said board | substrate in the said other conveyance apparatus based on the extraction means which extracts a step for 1 round trip of the said beam of a standby state, and the unprocessed mounting step of the 1 round trip for which this extraction means extracted. And control means for controlling the mounting head in the standby state to be mounted on the electronic component which is not mounted.

The present invention is directed to the other conveying apparatus by the attaching head of the one beam when the mounting work of the electronic component on the substrate in the one conveying apparatus by the mounting head of the one beam is idle. The mounting work on the substrate can be assisted. Therefore, even if there is a significant deviation in the mounting processing time of the electronic components of the mounting heads provided in the two beams, this can be eliminated, and the bottleneck on the balance of the production efficiency of each electronic component mounting apparatus in the mounting line of the electronic components It is possible to prevent the occurrence of the electronic component mounting apparatus.

1 is a plan view of an electronic component mounting apparatus.
2 is a control block diagram of an electronic component mounting apparatus.
3 is a diagram illustrating mounting data of a printed circuit board conveyed to the conveying apparatus 2A.
4 is a diagram illustrating mounting data of a printed circuit board conveyed to the conveying apparatus 2B.
FIG. 5: is a figure which shows component arrangement data regarding the component supply unit on the cart stand 7A.
FIG. 6: is a figure which shows component arrangement data regarding the component supply unit on the cart stand 7A.
7 is a flowchart showing the mounting operation.
8 is a flowchart of an operation in assist mode.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described about the electronic component mounting apparatus 1 which mounts an electronic component on a board | substrate based on FIG. In this electronic component mounting apparatus 1, while conveying each printed board P which is a board | substrate in parallel, and carrying out two rows of conveying devices ("lane") provided so as to position each printed board P, it is omitted. (2A, 2B), component supply devices 3A, 3B disposed on the front side and the inner side of the apparatus main body to supply electronic components, and movable in one direction by a driving source (reversely movable in the Y direction) Mounting heads 6A, 6B are provided with a pair of beams 4A, 4B and adsorption nozzles 5, respectively, and movable by respective drive sources in the directions along the beams 4A, 4B. .

The said conveying apparatus 2A, 2B is arrange | positioned at the front-back middle part of the inner side and the front side of the electronic component mounting apparatus 1, respectively, and the positioning part which positions and fixes a supply conveyor and the printed board P, respectively, A discharge conveyor is provided. And each said supply conveyor conveys each printed board P received from the upstream to each said positioning part, and an electronic component is mounted on each board | substrate P positioned by the positioning apparatus in this each positioning part. After that, it is conveyed to each discharge conveyor and is conveyed to a downstream apparatus after that.

The component supply apparatuses 3A, 3B are arranged at the inner and front positions of the conveying apparatus 2A, 2B, and the component supply unit 8 is placed on the feeder base of the cart bases 7A, 7B as the mounting table. Many parallel. Each cart stand 7A, 7B is detachably disposed to the apparatus main body via a connector so that the tip end of the part supply side of the part supply unit 8 faces the conveyance path of the printed board P, and each cart stand 7A is provided. When 7B is normally attached to the main body of the device, power is supplied to the component supply unit 8 mounted on the cart seats 7A and 7B. It can be a configuration.

Then, the front and rear pair of beams 4A and 4B that are long in the X direction, the sliders fixed to the respective beams are slid along the left and right pairs of front and rear guides driven by the respective Y-direction linear motors 9. To move individually in the Y direction. The Y-direction linear motor 9 has a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and movable fixed to a lower portion of a mounting plate provided at both ends of the beams 4A and 4B. It consists of a ruler 9A.

In addition, the beams 4A and 4B are provided with the mounting heads 6A and 6B, which move along the guide by the X-direction linear motor 10 in the longitudinal direction (X direction), respectively. The directional linear motor 10 is constituted by a pair of front and rear stators fixed to the respective beams 4A and 4B, and a mover disposed between the stator heads and mounted between the stator heads 6A and 6B.

Therefore, each mounting head 6A, 6B is provided inside each beam 4A, 4B so as to face each other, and the corresponding printed circuit board P on the said conveying apparatus 2A, 2B and the corresponding component supply are normally provided. The component extraction position of the apparatus 3A, 3B is moved upward.

That is, the mounting heads 6A and 6B provided in the beams 4A and 4B perform the operation of taking out the electronic component from the component supply unit 8 of the corresponding component supply apparatus 3A, 3B, and in principle (normal mode) ), The mounting head 6A provided on the beam 4A takes out the electronic component from the component supply apparatus 3A on the inner side, mounts it only on the printed board P on the transport apparatus 2A on the inner side, and attaches it to the beam 4B. The attached mounting head 6B is sharing so that an electronic component can be taken out from the component supply apparatus 3B of the front side, and will be attached only to the printed board P on the conveyance apparatus 2B of the front side.

However, in the assist mode described later, the mounting head 6A provided on the beam 4A takes the electronic component out of the component supply apparatus 3A on the inner side and attaches it to the printed board P on the front conveying apparatus 2B. In addition, the mounting head 6B provided in the beam 4B is controlled to take out an electronic component from the component supply apparatus 3B of the front side, and to mount it to the printed board P on 2 A of inner side conveyers.

And four adsorption nozzles 5 urged downward by each spring are arrange | positioned at the circumference at predetermined intervals, and each adsorption nozzle 5 is equipped with the up-and-down shaft motor ( 12, and by rotating the mounting heads 6A and 6B around the vertical axis by the θ-axis motor 13, each suction nozzle 5 of each mounting head 6A and 6B is consequently It is movable in the X direction and the Y direction, is rotatable around the vertical line, and is movable up and down.

In addition, each component recognition camera 14 collectively picks up the electronic components adsorbed and held by each suction nozzle 5 provided in each mounting head 6A, 6B.

2 is a control block for controlling the electronic component mounting of the electronic component mounting apparatus 1, which will be described below. Each element of the electronic component mounting apparatus 1 is collectively controlled by a CPU (central processing unit) 15, and a ROM (lead only memory) 16 and various data for storing a program relating to this control. RAM (random access memory) 17 which stores the data is connected via a bus line 18. The CPU 15 is also connected to the monitor 19 displaying an operation screen and the like and a touch panel switch 20 as an input means formed on the display screen of the monitor 19 via the interface 21. The Y-direction linear motor 9 and the like are connected to the CPU 15 via the drive circuit 22 and the interface 21. The CPU 15 also functions as a control means, grasping means, confirmation means, determination means, extraction means, and the like.

In the RAM 17, mounting data is stored for each type of the printed circuit board P related to component mounting for each of the transport apparatuses 2A and 2B. 3 and 4 show mounting data on one type of printed board P, respectively, corresponding to the transfer devices 2A and 2B. That is, for each mounting procedure (step number P), the positional information (mounting coordinate X) of the X direction of the mounting coordinates of each electronic component in the printed circuit board P, the positional information (mounting coordinate Y) of the Y direction, and mounting Angle information (mounting angle Z), nozzle number information (shown by nozzle number N, "1" to "4") of the suction nozzle 5, arrangement number information (feeder number FDR) of each component supply unit 8, Number information of the mounting heads 6A and 6B (head number HD, the mounting head 6A provided on the inner beam 4A is "1", and the mounting head 6B provided on the front beam 4B is "2". ], The conveyance lane information (DUAL) which shows 2 A of conveyance apparatuses 2A of 2nd and 2B of inside conveyance apparatuses as "B", and the conveyance apparatus 2B of the front side is represented by "A". Lanes A / B) and control commands.

In addition, assist data A consisting of status information and head number information (head number) for each mounting procedure (step number P) of the mounting data, nozzle number information of the suction nozzle 5 to be used when assisting, The assist data B which consists of arrangement | positioning number information of each component supply unit 8, and the number information of the mounting head 6A, 6B is stored.

The status information of the assist data A is information indicating the state of processing execution for the management of the assist operation, "0" indicates that the mounting processing of the electronic component is not processed, and "1" indicates the completion of the mounting step number. Up to four chain adsorptions can be performed (including during adsorption operation, during processing) in the sense of the determination of the mounting step number to be processed in one round trip between the supply apparatuses 3A and 3B and the printed board P. ), And "2" means completion of the mounting process, respectively. In addition, the head number information of the said assist data A is information which adds the mounting head number data which performs this extracted mounting process, when a mounting step is extracted, "0" is an unassigned state, and "1" is a mounting head. The number "1" (meaning of the mounting head 6A) performs the mounting process, and "2" means that the mounting head number "2" (meaning of the mounting head 6B) performs the mounting process.

In addition, it is possible to assist that the nozzle number information of the suction nozzle 5 in the assist data B, the arrangement number information of each component supply unit 8 and the number information of the mounting heads 6A and 6B are "?". It shows that there is no target conveying apparatus. The mounting data of the printed board P produced in the said conveying apparatus 2A is shown in FIG. 3, and the mounting data of the printed board P produced in the said conveying apparatus 2B is shown in FIG.

In the RAM 17, as shown in FIG. 5, each electron corresponding to the component supply unit arrangement number (FDR number) of the component supply unit 8 disposed on one cart stand 7A is provided. The information (part arrangement data) of the type (part ID) of the part is stored, and as shown in FIG. 6, the part supply of each of the parts supply units 8 disposed on the other cart stand 7B. Information (part arrangement data) of the type (part ID) of each electronic component corresponding to the unit arrangement number (FDR number) is stored.

5 and 6, the component supply unit 8 of FDR numbers "105"-"117" regarding the cart stand 7A corresponding to the said conveying apparatus 2A, and the said conveying apparatus ( The component supply unit 8 of FDR number "205"-"217" regarding the cart stand 7B corresponding to 2B) is a structure which can supply the electronic components of the same kind (part ID is the same), and is assisted later. It means that it is the common component supply unit 8 which can operate.

In addition, component library data for each electronic component, which is composed of shape data, recognition data, control data, component supply data, and the like, which are characteristic of electronic components, are stored.

Reference numeral 23 denotes a recognition processing device connected to the CPU 15 via an interface 21, and the recognition processing device 23 recognizes the image recognition process acquired by the component recognition camera 14. The processing result is sent to the CPU 15. In other words, the CPU 15 outputs an instruction to the recognition processing device 23 to recognize the image captured by the component recognition camera 14 (calculation of positional deviation, etc.), and also recognizes the recognition processing result. It is received from the device 23.

With the above configuration, the mounting operation will be described below with reference to FIG. 7. When the component mounting on one printed circuit board P is finished, first, the CPU 15 checks whether or not there is a board on which the electronic component is mounted in the electronic component mounting apparatus 1 (step SO1). Since there is the board | substrate P with which mounting was completed, next, it is confirmed whether there exists a board | substrate request from a post process apparatus (step S02), and if there is a request, discharge operation | movement of the printed board P is carried out by a post process apparatus (step S03). After the discharging is completed, a substrate request is made to the preprocessing apparatus (S04), but immediately after that, it is checked whether the substrate P is loaded from the preprocessing apparatus (S05).

At the time of judging at step S05 immediately after issuing the substrate request, the substrate P is not loaded, so the CPU 15 controls to start the assist mode processing described later.

That is, after completion of component mounting, the board request to the pre-processing apparatus is output in the state where there is no board P, and the board P is waiting to be loaded, and the mounting head 6A or 6B is mounted. Assist mode processing is performed by determining that the device is in the standby state where the operation cannot be performed.

After the assist mode processing is executed, the process returns to step SO1, but since the mounted substrate P is not discharged, it is determined whether the substrate P has been loaded from the previous step (S05).

If the board | substrate P is not carried in from the preprocessing apparatus, the assist mode process is performed again using the standby state of the mounting head 6A or 6B (S05, S06). If it is carried in from the preprocessing apparatus, after the substrate request to the preprocessing apparatus is turned off (step S07), the printed board P is obtained and positioned in the positioning unit (step S08).

Next, the CPU 15 extracts the processing mounting step, extracts it based on the mounting data, and writes the assist data A (step S09). That is, in the mounting data shown in FIG. 3 or 4, the mounting processing of the electronic components is in an unprocessed state in order for the mounting head 6A or 6B to adsorb and take out the electronic components from the respective component supply devices 3A or 3B. The mounting step whose status information indicating that is "0" is extracted, extraction is performed from this extracted mounting step, the status information is written as "1", and the head number information (head number) is written (step S09). . In this case, if extraction of a mounting step is mounting data of the printed circuit board P of the conveying apparatus 2A, "1" is attached as the head number of the mounting head 6A, and the mounting of the printed board P of the conveying apparatus 2B is carried out. If data, "2" is written as the head number of the mounting head 6B.

Then, for example, if the extraction of the mounting step is the mounting step number "0001" to "0004" of the mounting data of the printed circuit board P of the conveying apparatus 2A, the mounting head 6A will first be attached to the mounting step number "0001". Since the electronic components adsorb and take out the electronic components from the component supply unit 8 on the cart stand 7A having the FDR number "101" (step S10), and other electronic components adsorb to the mounting head 6A, The electronic components are adsorbed and taken out from the component supply unit 8 on the cart stand 7A of "102", "103", and "104" (step S11).

And the CPU 15 controls the carry-out adjustment process in the mounting part of the printed board P on the conveying apparatus 2A, ie, the control which escapes so that the mounting head 6A and 6B may not collide. (Step S12), it is determined whether entry into the mounting area of the printed board P is possible (Step S13), that is, the mounting state in the assist operation of the opposing beam 4A or 4B is checked. It is determined whether or not entry into the wearing area is possible, and control of the adjustment processing of the carry-in is repeated until entry is enabled.

Then, when it is determined that entry is possible, the component recognition camera 14 collectively picks up the electronic components adsorbed and held by the four adsorption nozzles 5 of the mounting head 6A, and the recognition processing device 23 performs the recognition processing. (Step S14).

That is, the mounting head 6A is passed through the component recognition camera 14, and during this movement, a plurality of electronic components adsorbed and held by the respective adsorption nozzles 5 of both mounting heads 6A are collectively imaged, and The recognition processing device 23 recognizes the picked-up image and grasps the positional shift with respect to the suction nozzle 5.

Subsequently, each component recognition processing result is added to the mounting coordinates of the mounting data, and the upper and lower shaft motors 12 and the θ shaft motors 13 are moved onto the printed circuit board P positioned on the conveying apparatus 2A. ), The adsorption nozzle 5 is lowered sequentially, and an electronic component is mounted (step S15).

In this case, "2" is written as status information of the assist data A of the mounting step number for each mounting operation of the electronic component (record change from "1" to "2" (step S16)). Check if there are other electronic components to be mounted on the mounting head 6A, repeat until the mounting of all the electronic components of the mounting head 6A is completed, and the mounting of all the electronic components of the mounting head 6A is finished. If it is determined (step S17), it is determined next whether or not all the electronic components specified in the mounting data have finished mounting (step S18).

If it is determined that the electronic parts specified through the mounting data are not all finished, the process returns to step S09 and the next extraction and mounting are repeated until the control command in the mounting data becomes "E".

And the acquisition of the electronic component by the above-mentioned extraction and attachment to the printed circuit board A is performed with respect to the printed circuit board P of the conveying apparatus 2A, and the printed board P of the conveying apparatus 2B. Then, it is determined whether or not all the electronic components specified through the mounting data have finished mounting (step S18). When it is determined that the end has been completed, it is determined whether there is an instruction to stop the mounting operation (step S19), and the stop instruction. If there is a stop, the mounting operation is controlled to end, and if there is no stop instruction, the process returns to step SO1. In addition, since the stop switch operates when the stop button is pressed by the operator, for example, the CPU 15 can confirm the instruction of the stop of the mounting operation.

Since it returns to step SO1 and there is the board | substrate P which was mounted, it is confirmed whether there exists a board | substrate request | requirement from a post process apparatus (step S02), but if there is no, an assist mode process is performed (step S06).

After the assist mode processing is executed, the process returns to step SO1, but if there is no substrate request from the later step (step S02), the assist mode processing is executed again (step S06).

In this manner, when a substrate request from the post-processing device occurs (step S02), the substrate discharge operation is executed as described above (step S03), and the substrate request to the pre-processing device is made (step S04).

Here, as mentioned above, if there is a printed board P which has been mounted in the electronic component mounting apparatus 1 (step S01), and there is a board request from the post-processing device (step S02), Further, after turning on the substrate request to the preprocessing device (step S04), it is checked whether or not the printed board P is loaded from the preprocessing device (step S05), and if it is not loaded, the assist mode processing is performed. The assist mode processing operation will be described based on FIG. 8.

That is, also in any of the above cases, the mounting operation of the electronic component on the substrate in one of the transfer devices 2A or 2B by the mounting heads 6A and 6B of one beam 4A or 4B is in a standby state. In this case, for example, the mounting of the electronic component is completed and the mounting head 6A of the beam 4A or the mounting head 6B of the beam 4B is waiting regardless of the presence or absence of the printed board P. When it is in a state, the assist mode processing operation which assists the operation regarding attachment of the electronic component to the printed circuit board P in the other conveying apparatus 2B or 2A is demonstrated. Moreover, the conveying apparatus 2A or 2B with which the board | substrate P is transmitted by the assist mode process operation | movement of the electronic component of the mounting heads 6A and 6B with which the two beams 4A and 4B were equipped is carried out. Balance of production efficiency of each electronic component mounting apparatus 1 in the mounting line of an electronic component, even if there is a significant deviation between the several electronic component mounting apparatus which comprises a mounting line with respect to said said lane comprised by The occurrence of the electronic component mounting apparatus 1 that becomes the bottleneck on the top can be prevented as much as possible.

In addition, even if it is not the above-mentioned standby state, the abnormality of one lane generate | occur | produces regardless of the presence or absence of the board | substrate P, the work order change of the component supply unit 8 of the cart stand 7 of one lane, and the said component Idle state where the mounting head 6A or 6B cannot mount parts to the substrate P to which the mounting head 6A or 6B is to be originally mounted on one lane side (self-side) due to extraction of the supply unit 8 (the standby state is also idle state) In this case, the CPU 15 may control to perform the assist mode processing by determining the idle state.

In FIG. 8, first, the conveying apparatus 2A or 2B which opposes (the lane of the side which is assisted by the "counter lane") determines whether there is a printed board P (step S21), and if there is no facing conveyance, The apparatus 2A or 2B is also waiting, and the assist operation is suspended, and the assist mode processing operation is terminated.

However, if there is a printed circuit board P in the opposing conveying apparatus 2A or 2B (the conveying apparatus on the assisted side), the CPU 15 will determine the mounting state of the electronic component of the printed circuit board P in the opposing lane. (Step S22). Specifically, the mounting situation is grasped with reference to the mounting data of the printed circuit board P in the opposing lane.

Then, the mounting step number of the assisted unprocessed (the status information of assist data A is "0") processed in one round trip between the component supply apparatus 3A or 3B and the printed circuit board P, namely, from the top, i.e. Up to four are extracted from the order with the smallest mounting step number (step S23).

Next, "1" is written with respect to the status information of assist data A in this extracted mounting step number, and the number of the mounting head 6A or 6B which assists is written (step S24).

Therefore, using the mounting head 6A or 6B of this written number, an electronic component is attracted and taken out from the component supply unit 8 on the said cart stand 7A or 7B (step S25). Next, it is checked whether there are other electronic components adsorbed by this mounting head 6A or 6B (step S26), and it repeats until all the electronic components which should be taken out are absorbed and taken out.

In addition, if it is the printed circuit board P of the said conveying apparatus 2A that is assisted, and the unprocessed attachment step number of assist is "0201"-"0204", as shown in FIG. 3, according to the assist data B, Each of feeder numbers "214" to "217" on the cart stand 7B using the numbers "1" to "4" of the suction nozzle 5 of the mounting head 6B having the mounting head number "2". The electronic component is taken out from the component supply unit 8. In addition, if it is the printed board P of the said conveying apparatus 2B that is assisted, and the unprocessed mounting step number of assisted is "0301"-"0304", as shown in FIG. 4, according to the assist data B, Feeder numbers "113" to "116" on the cart stand 7A using the numbers "1" to "4" of the suction nozzle 5 of the mounting head 6A having the mounting head number "1". The electronic component is taken out from the component supply unit 8.

And when taking out all these electronic components by the mounting head 6A or 6B is complete | finished, CPU15 will carry in in the mounting part of the printed board P on the conveying apparatus 2A or 2B which should be assisted. Control of the adjustment process, i.e., control to escape so that the mounting heads 6A and 6B do not collide (step S27), and it is determined whether or not entry into the mounting area of the printed board P is possible ( Step S28), that is, the mounting state in the assist operation of the opposing beams 4A or 4B is checked to determine whether entry into the mounting area is possible, and control of the adjustment processing of the carry-in until the entry is enabled. When it is repeatedly determined that entry is possible, the component recognition camera 14 collectively picks up the electronic components sucked and held by the four suction nozzles 5 of the mounting head 6A or 6B, and the recognition processing device 23 Recognition process ( Tap S29).

That is, the mounting head 6A or 6B is passed above the component recognition camera 14, and a plurality of electronic components adsorbed and held by the respective adsorption nozzles 5 of both mounting heads 6A or 6B are collectively placed during this movement. The imaging process recognizes the captured image, and the recognition processing device 23 recognizes the positional shift with respect to the suction nozzle 5.

Thereafter, each component recognition processing result is added to the mounting coordinates of the mounting data to move onto the printed circuit board P positioned on the conveying apparatus 2A or 2B, and the vertical axis motor 12 and the θ axis motor While adjusting control of (13), the adsorption nozzle 5 is lowered sequentially, and an electronic component is mounted (step S30).

In this case, it writes "2" as status information of the assist data of a mounting step number for every mounting operation of an electronic component (recording changes from "1" to "2" (step S31)). If there are other electronic components to be mounted on the mounting head 6A or 6B (step S32), the mounting operation and the writing operation are repeated.

If it is determined that the mounting of all the electronic components of the mounting head 6A or 6B is completed (step S32), the process returns to step S01 shown in FIG. 7 and the above-described operation is performed.

In this way, when all the electronic components are mounted on the printed board P, based on the board request from the post-processing device, the printed board P is transferred from the substrate positioning unit to the post-processing device via the discharge conveyor. To pass.

In addition, although the post-processing apparatus was the next apparatus, it comprises the conveying apparatus 2A, 2B, and a printed circuit board is carried out to the discharge conveyor which delivers the board | substrate with which components were completed from the positioning position of the board | substrate P, and discharges it to the apparatus of a post-process. If (P) can stop, you may think of this discharge conveyor as a post-processing apparatus. In addition, although the preprocessing apparatus was the former apparatus, it comprises the conveying apparatus 2A, 2B, and the printed board P is stopped by the supply conveyor which supplies and conveys the printed board P to the positioning position where components are mounted, and transmits it. If possible, you may think of this supply conveyor as a preprocessing apparatus.

While the embodiments of the present invention have been described as described above, various alternatives, modifications, or variations are possible to those skilled in the art based on the above description, and the present invention provides various alternatives described above without departing from the spirit, It includes modifications or variations.

1: electronic component mounting device
2A, 2B: Carrier
3A, 3B: Parts Feeder
8: parts supply unit
6A, 6B: Mounting Head
7A, 7B: cart stand
15: CPU
17: RAM
P: printed board

Claims (6)

Two conveying apparatuses each carrying the substrate in parallel, two component supply apparatuses arranged on the front side and the inner side of the apparatus main body and supplying a plurality of types of electronic components mounted on the substrate, and in one direction to a one-way drive source. A pair of opposing beams movable by means of a mounting head movable in a different direction orthogonal to the one direction, respectively by a driving source in one direction, wherein either one of the component supply apparatuses in the mounting head provided in one of the beams In the mounting method of the electronic component which mounts the electronic component taken out from the said board | substrate conveyed by either said said conveying apparatus,
When the mounting head of one of the beams is in an idle state, the mounting state of the electronic component on the substrate in the opposite transfer device of the other is grasped,
On the basis of the result of grasping the mounting state of this electronic component, the said mounting head of the said idle state is attached to the electronic component which is not attached to the board | substrate in the said other conveyance apparatus of the electronic component characterized by the above-mentioned. Mounting method. Two conveying apparatuses each carrying the substrate in parallel, two component supply apparatuses arranged on the front side and the inner side of the apparatus main body and supplying a plurality of types of electronic components mounted on the substrate, and in one direction to a one-way drive source. A pair of opposing beams movable by means of a mounting head movable in a different direction orthogonal to the one direction, respectively by a driving source in one direction, wherein either one of the component supply apparatuses in the mounting head provided in one of the beams In the mounting method of the electronic component which mounts the electronic component taken out from the said board | substrate conveyed by either said said conveying apparatus,
When the mounting of the electronic component is completed and the mounting head of one of the beams is in the standby state, the mounting state of the electronic component on the substrate in the other opposite transfer apparatus is grasped,
The mounting head of the said standby state is attached to the electronic component in which the electronic component to the board | substrate of the said other conveyance apparatus is not mounted based on the result of having grasped | ascertained the mounting state of this electronic component. How to mount the parts. Two conveying apparatuses each carrying the substrate in parallel, two component supply apparatuses arranged on the front side and the inner side of the apparatus main body and supplying a plurality of types of electronic components mounted on the substrate, and in one direction to a one-way drive source. A pair of opposing beams movable by means of a mounting head movable in a different direction orthogonal to the one direction, respectively by a driving source in one direction, wherein either one of the component supply apparatuses in the mounting head provided in one of the beams In the mounting method of the electronic component which mounts the electronic component taken out from the said board | substrate conveyed by either said said conveying apparatus,
When the mounting of the electronic component is completed and the mounting head of one of the beams is in the standby state, the mounting state of the electronic component on the substrate in the other opposite transfer apparatus is grasped,
Based on the result of grasp | ascertaining the mounting state of this electronic component, the mounting process in the mounting data corresponding to the said board | substrate in the said other conveyance apparatus extracts an unprocessed mounting step for 1 round trip of the said beam of a standby state, ,
The mounting head in the standby state is attached to an electronic component on which the electronic component is not mounted on the substrate in the other transfer device based on the extracted unprocessed mounting step for one round trip. The mounting method of the electronic component to make. Two conveying apparatuses each carrying the substrate in parallel, two component supply apparatuses arranged on the front side and the inner side of the apparatus main body and supplying a plurality of types of electronic components mounted on the substrate, and in one direction to a one-way drive source. A pair of opposing beams movable by means of a mounting head movable in a different direction orthogonal to the one direction, respectively by a driving source in one direction, wherein either one of the component supply apparatuses in the mounting head provided in one of the beams In the mounting apparatus of the electronic component which mounts the electronic component taken out from the said board | substrate conveyed by either said said conveying apparatus,
Grasp means for grasp | ascertaining the mounting state of the electronic component to the board | substrate in the said other conveyance apparatus when the said mounting head of one of the said beams becomes idle,
On the basis of the result of the mounting state of the electronic component being grasped by this grasp means, the control unit is mounted such that the mounting head in the idle state is mounted on the electronic component that is not attached to the substrate in the other transfer device. A device for mounting an electronic component, comprising a control means. Two conveying apparatuses each carrying the substrate in parallel, two component supply apparatuses arranged on the front side and the inner side of the apparatus main body and supplying a plurality of types of electronic components mounted on the substrate, and in one direction to a one-way drive source. A pair of opposing beams movable by means of a mounting head movable in a different direction orthogonal to the one direction, respectively by a driving source in one direction, wherein either one of the component supply apparatuses in the mounting head provided in one of the beams In the mounting apparatus of the electronic component which mounts the electronic component taken out from the said board | substrate conveyed by either said said conveying apparatus,
Holding means for grasping the mounting state of the electronic component to the substrate in the other conveying apparatus that is opposed when the mounting of the electronic component is completed and the mounting head of one of the beams is in a standby state. and,
On the basis of the result that the mounting state of the electronic component is grasped by this grasp means, the mounting head in the standby state is controlled to be mounted on the electronic component that is not attached to the substrate in the other transfer device. A device for mounting an electronic component, comprising a control means. Two conveying apparatuses each carrying the substrate in parallel, two component supply apparatuses arranged on the front side and the inner side of the apparatus main body and supplying a plurality of types of electronic components mounted on the substrate, and in one direction to a one-way drive source. A pair of opposing beams movable by means of a mounting head movable in a different direction orthogonal to the one direction, respectively by a driving source in one direction, wherein either one of the component supply apparatuses in the mounting head provided in one of the beams In the mounting apparatus of the electronic component which mounts the electronic component taken out from the said board | substrate conveyed by either said said conveying apparatus,
Holding means for grasping the mounting state of the electronic component to the substrate in the other conveying apparatus that is opposed when the mounting of the electronic component is completed and the mounting head of one of the beams is in a standby state. and,
On the basis of the result of the mounting state of the electronic component being grasped by this grasp means, the mounting process in the mounting data corresponding to the substrate in the other conveying apparatus performs an unprocessed mounting step of the beam in the standby state. Extraction means for extracting one round trip,
The mounting head in the standby state with respect to an electronic component on which the electronic component is not mounted on the substrate in the other transfer device based on one round trip unprocessed mounting step extracted by this extraction means A mounting apparatus for an electronic component, comprising a control means for controlling the mounting.

Images