JP4970023B2 - Electronic component mounting device - Google Patents

Description

  The present invention provides at least a plurality of types of electronic components to be mounted on the printed circuit board, each disposed at an upstream position and a downstream position of the apparatus main body, each of which transports a printed circuit board in parallel. Two component supply unit groups, and at least two mounting heads that are respectively arranged at an upstream position and a downstream position of the apparatus main body and take out electronic components supplied from the component supply unit group and mount them on the printed circuit board. The present invention relates to an electronic component mounting apparatus provided.

  In general, an electronic component mounting apparatus mounts an electronic component supplied from a component supply device on a single printed board carried by a single substrate transport device from a plurality of suction nozzles provided in a mounting head. Yes, an electronic component is mounted on each printed circuit board.

However, from the viewpoint of improving productivity, in one electronic component mounting apparatus, it is conceivable that two board transfer apparatuses each for transferring each printed board are provided in parallel to mount the electronic components. Moreover, in order to further improve productivity, it is conceivable to mount electronic components on two printed circuit boards positioned at the upstream position and the downstream position of each substrate transport apparatus.
JP 2004-31469 A

  However, if the component supply unit group runs out of components at the upstream position or downstream position of any of the board transfer devices, the electronic component mounting device stops, and the board width of the board transfer device is replaced. When performing, it is necessary to stop an electronic component mounting apparatus, and productivity may not be improved on the contrary.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus that can further improve productivity in an electronic component mounting apparatus that includes two board transfer apparatuses that transfer each printed circuit board.

For this reason, the first invention provides two board transfer apparatuses each carrying a printed board in parallel, and a plurality of types of electronic components disposed on the printed board respectively disposed at an upstream position and a downstream position of the apparatus main body. At least two component supply unit groups, and at least two component components that are respectively disposed at an upstream position and a downstream position of the apparatus main body and take out electronic components supplied from the component supply unit group and mount them on the printed circuit board A mounting head, and an electronic component supplied from the corresponding component supply unit group on each printed circuit board positioned at one upstream position and the other downstream position of the two substrate transfer devices. The print head is removed and mounted at the one downstream position and the other upstream position. With pass without being attached to, when the device component depletion on one of the component supply unit group of the component feeding unit group arranged respectively upstream position and a downstream position of the body occurs, the portion out of stock parts look the other printed circuit board of one of the printed circuit board corresponding to the supply unit group to the other substrate transport device is not a one substrate transfer device for transferring is delivered, the mounting head corresponding to the other printed circuit board according to the Is provided with a control device for controlling the electronic component to be mounted on the other printed circuit board and controlling the mounting head corresponding to the one printed circuit board not to take out and mount the electronic component . It is characterized by that.

According to a second aspect of the present invention, there are provided two board transfer apparatuses each carrying a printed board in parallel, and a plurality of types of electronic components mounted on the printed board respectively disposed at an upstream position and a downstream position of the apparatus body. At least two component supply unit groups to be supplied, and at least two mounting units that are respectively disposed at the upstream position and the downstream position of the apparatus main body and take out electronic components supplied from the component supply unit group and mount them on the printed circuit board The electronic component supplied from the corresponding component supply unit group on each printed circuit board positioned at one upstream position and the other downstream position of the two substrate transfer devices. Taking out and mounting by the mounting head, the one downstream position and the other upstream position to the printed circuit board. With pass without wear, when the substrate width setup change of one of the corresponding one of the substrate transfer device to the printed circuit board is started, it sees other to the other substrate transfer apparatus which does not overlap the sort the substrate width setup A control device is provided for controlling the electronic component to be mounted on the other printed circuit board by the mounting head corresponding to the other printed circuit board when the printed circuit board is delivered .

The present invention is an electronic component mounting apparatus equipped with two board transfer devices for transferring printed circuit boards in parallel, and the component supply unit group disposed at each of the upstream position and the downstream position of the apparatus body is out of components. An electronic component mounting apparatus that can further improve the productivity can be provided even when the occurrence of this occurs or when the substrate width change-over of one substrate transport apparatus corresponding to one printed circuit board is started .

  Hereinafter, an embodiment of an electronic component mounting apparatus will be described based on the drawings. FIG. 1 is a plan view of an electronic component mounting device 1, and electronic components as a component supply device are supplied one by one to a component extraction position (component suction position) on a machine base (device main body) 2 of the electronic component mounting device 1. The component supply unit group 3 which is a known tape feeder is divided into four blocks 3A1, 3A2, 3B1, 3B2, that is, left and right left stages and right stages, and front and rear front SIDE and rear SIDE for each stage. As a result, it is divided into four blocks.

  And in the intermediate part of this mounting apparatus 1, there are two supply conveyors 4 and positioning parts (including a conveyor and a positioning mechanism) between the front and rear component supply unit groups 3A1, 3A2 and 3B1, 3B2, respectively. Substrate transport devices 5A and 5B having 5 and a discharge conveyor 6 are provided in parallel. Further, the delivery device 7 provided on the upstream side moves back and forth so as to be connectable to the substrate transport device 5A or 5B, and delivers the printed circuit board P to either.

  In the present embodiment, the positioning unit 5 forms the mounting stages 5A1 and 5B2 at one upstream position and the other downstream position of the two substrate transfer apparatuses 5A and 5B, and at one downstream position and the other upstream position. Passing stages 5A2 and 5B1 are formed at the positions (first mode).

  A mounting stage is formed at the downstream position of the two substrate transfer apparatuses 5A and the upstream position of the substrate transfer apparatus 5B, and the passing stage is formed at the upstream position of the substrate transfer apparatus 5A and the downstream position of the substrate transfer apparatus 5B. Or a third mode in which two mounting stages are provided without providing a passing stage at the upstream position and the downstream position of the two substrate transfer apparatuses 5A and 5B. These three modes can be selected so that they can be used properly. In the present embodiment, the description will be made assuming that the first mode is selected.

  Accordingly, in the positioning unit 5 of the substrate transport apparatus 5A, electronic components are mounted on the printed circuit board P positioned on the upstream mounting stage 5A1, but the printed circuit board P is positioned on the downstream passing stage 5A2. It passes without being moved to the discharge conveyor 6. Further, in the positioning unit 5 of the substrate transport device 5B, the printed circuit board P passes through the upstream stage passing stage 5B1 without positioning, and the electronic component is mounted on the printed circuit board P by positioning at the downstream mounting stage 5B2. Is done.

  Reference numeral 8 denotes a pair of beams that are long in the X direction, and a printed circuit board that is fixed by a positioning mechanism by sliding a slider fixed to each beam 8 along a pair of left and right guides by driving each Y linear motor 9. The component feed unit group 3 is moved individually in the Y direction above the component delivery position (component suction position). The Y linear motor 9 is composed of a pair of left and right stators fixed to the machine base 2 and a mover fixed to lower portions of mounting plates provided at both ends of the beam 8.

  Each beam 8 is provided with a mounting head body 11 which moves along the guide by an X linear motor 10 in the longitudinal direction, that is, in the X direction. The X linear motor 10 includes a pair of front and rear stators fixed to the beam 8 and a mover provided on the mounting head body 11. Each mounting head body 11 includes a mounting head 16 having twelve suction nozzles (not shown) urged upward by springs.

  The mounting head 16 can be rotated in the θ direction by a θ pulse motor 17. Twelve suction nozzles are arranged on the mounting head 16 on the circumference at predetermined intervals, and are moved up and down by a vertical pulse motor 18. It is provided as possible.

  Reference numeral 19 denotes a component recognition camera, which is provided with a total of four corresponding to each mounting head 16, and how much the electronic component is held by suction with respect to the suction nozzle in the XY direction and the rotation angle. On the other hand, all the electronic components sucked and held by the plurality of suction nozzles are collectively imaged for recognition processing by the recognition processing device 38, and a plurality of electronic components can be simultaneously imaged.

  The Y linear motor 9, the X linear motor 10, the θ pulse motor 17, the vertical pulse motor 18, and the component recognition camera 19 are provided for each of the mounting heads 16 in total, but in FIG. For convenience, only one is listed. Similarly, the substrate conveyor motors 4M, 5M, and 6M are provided in the supply conveyors 4, the positioning units 5, and the discharge conveyors 6 of the substrate conveyance devices 5A and 5B. In FIG. List only the blocks.

  Next, in the control block diagram of FIG. 2, each element of the electronic component mounting apparatus 1 is centrally controlled by a CPU (Central Processing Unit) 30, and a ROM (Read Only Memory) that stores a control program. 33) and a RAM (Random Access Memory) 32 as a storage device for storing various data are connected via a bus line 31. Further, a monitor 36 for displaying an operation screen and the like, and a touch panel switch 37 as input means formed on the display screen of the monitor 36 are connected to the CPU 30 via an interface 34. The Y linear motor 9 and the like are connected to the CPU 30 via the drive circuit 35 and the interface 34.

  The RAM 32 stores mounting data for each type of printed circuit board related to component mounting, and even if the printed circuit board P is the same type, the electronic data is stored on the mounting stage 5A1 of the positioning unit 5 of the substrate transport apparatus 5A. The mounting data of the printed circuit board P on which the component is mounted is different from the mounting data of the printed circuit board P on which the electronic component is mounted on the mounting stage 5B2 of the positioning unit 5 of the substrate transport apparatus 5B. The mounting data includes the X coordinate, Y coordinate, angle, height information from each origin, which is the mounting position of each electronic component in each printed circuit board, for each mounting order (for each step number), 2 stores arrangement number information (arrangement order information) and the like of each component supply unit.

  The RAM 32 stores information (component ID) of each electronic component type corresponding to the component supply unit arrangement number of each component supply unit, that is, component arrangement data. Stored is component library data relating to the size and thickness information of the components in the X and Y directions, the nozzle ID of the used suction nozzle of the mounting head 16 used, and the like. Furthermore, a maximum of 12 suction nozzles can be attached to each mounting head 16, and the nozzle ID of the suction nozzle is stored for each suction nozzle attachment position (attachment number) to each mounting head 16.

  With the above configuration, the touch panel switch 37 is pressed to select the first mode, and the electronic component is mounted on the printed circuit board P by the mounting stage 5A1 of the substrate transport apparatus 5A and the mounting stage 5B2 of the substrate transport apparatus 5B. A mounting operation operation for mounting the will be described. First, the operator presses the touch panel switch 37 displayed on the monitor 36 and uses the two rows (two units) of the substrate transfer devices 5A and 5B to transfer them to the mounting stages 5A1 and 5B2 to be printed on the printed circuit board P. When it is selected that the electronic component is controlled to be mounted thereon and the operation start switch portion of the touch panel switch 37 is operated, the mounting operation is started.

  First, when there is no printed board P on the board transfer devices 5A and 5B, the delivery device 7 is moved so as to be connected to the board transfer device 5A, and the substrate driven in the same manner from the delivery device 7 by driving the conveyor. The printed circuit board P is delivered to the supply conveyor 4 of the transport device 5A. Thereafter, the printed board P is conveyed from the supply conveyor 4 to the mounting stage 5A1 of the positioning unit 5 and positioned. Further, after delivering the printed circuit board P from the delivery device 7 to the supply conveyor 4 of the substrate transport device 5A, the delivery device 7 moves so as to connect to the substrate transport device 5B, and transfers the printed circuit board to the supply conveyor 4 of the substrate transport device 5B. Then, P is passed, and further, it passes through the passing stage 5B1 of the board transfer device 5B and is transferred to the mounting stage 5B2, and the printed board P is positioned.

  As described above, as soon as the printed circuit board P can be transported and delivered, it is transported from the delivery device 7 to the downstream side in order. Then, according to the mounting data stored in the RAM 32, one of the suction nozzles of the mounting head 16 on the left back side is placed on the printed circuit board P positioned on the mounting stage 5A1 from the component supply unit group 3A1 or on the left front side. Any of the suction nozzles of the mounting head 16 takes out the electronic components from the component supply unit group 3B1 and sequentially mounts them. Similarly, according to the mounting data stored in the RAM 32, one of the suction nozzles of the mounting head 16 on the right rear side is placed on the printed circuit board P positioned on the mounting stage 5B2 from the component supply unit group 3A2 or on the right front side. The suction nozzles of the mounting heads 16 take out electronic components from the component supply unit group 3B2 and sequentially mount them.

  In this case, the suction nozzle of each mounting head 16 corresponding to the component type of the electronic component moves so as to be positioned above the component supply unit that stores the corresponding electronic component, but the Y direction is driven by the Y linear motor 9 in the X direction. Since each X linear motor 10 is driven and each mounting head 16 is moved, and a predetermined supply unit is already in a state where components can be taken out at the component suction position, each vertical pulse motor 18 is driven to correspond to the above. The suction nozzle descends and picks up and takes out the electronic component, and then the suction nozzle moves above each component recognition camera 19 to image each electronic component held by suction, and recognition processing is performed by the component recognition processing device 38. Based on the result, each mounting head 16 is moved, and the suction nozzle corrects the positional deviation by adding the component recognition result to the mounting coordinates of the mounting data, as described above. Mounting electronic components on a printed board on P.

  When all the electronic components are mounted on each printed circuit board P, they are sequentially conveyed to the downstream side. That is, when all the electronic components have been mounted, the printed circuit board P is transported from the mounting stage 5A1 of the positioning unit 5 through the passing stage 5A2 to the discharge conveyor 6 in the board transfer device 5A, and waits at the discharge conveyor 6. Then, if it can be delivered, it is delivered to a downstream device (not shown) and delivered, and the substrate carrying device 5B carries it from the mounting stage 5B2 of the positioning unit 5 to the discharge conveyor 6, and this discharge conveyor 6 When it becomes possible to deliver the product, it is conveyed to a downstream device (not shown) and delivered.

  Here, for example, an operation when the remaining number of electronic components in the component supply unit group 3A1 or 3B1 is less than a predetermined number due to continued mounting operation, that is, when a component is cut out will be described. In this case, since information regarding the number of electronic components stored and the remaining number of electronic components to be notified for each component supply unit is stored in the RAM 32, the suction nozzle is sequentially taken out from the component supply unit and printed on the printed circuit board P. The CPU 30 can determine that the number of stored parts has been reduced, and the CPU 30 can determine that the parts have run out when the number of stored parts reaches the remaining number to be notified that the electronic parts have run out.

  Therefore, when the CPU 30 determines that an electronic component related to one of the component supply units of the component supply unit group 3A1 or 3B1 has run out, the left back side and the left front side mounting heads 16 corresponding to the component supply unit groups 3A1 and 3B1. The θ pulse motor 17 and the vertical pulse motor 18 which are driving sources of the mounting heads 16 on the left back side and the left front side are stopped so as to stop the component picking and mounting operations, and the mounting heads 16 on the left back side and the left front side are stopped. Control is performed so that the corresponding Y linear motor 9 and X linear motor 10 are stopped, and control is performed so that the printed circuit board P is not transferred from the transfer device 7 to the substrate transfer device 5A and is transferred only to the substrate transfer device 5B. To do.

  Accordingly, control is performed so that the components of the mounting head 16 on the left rear side and the left front side cannot be removed and mounted, and the electronic component mounting is performed without mounting the electronic component on the printed circuit board P of the mounting stage 5A1 of the substrate transport apparatus 5A. Control is performed so that mounting of electronic components can be continued on the printed circuit board P of the mounting stage 5B2 of the substrate transport apparatus 5B without stopping the operation of the apparatus.

  In this case, in each positioning unit 5 of the substrate transport apparatus 5A, if there is a printed board P that is finished (all electronic components are mounted) under the control of the CPU 30, the substrate transport motor of each positioning unit 5 5M is driven, the said printed circuit board P is conveyed to each discharge conveyor 6, and stops. In addition, when the mounting of all the electronic components is not completed, each board transport motor 5M stops with the stop of the mounting operation of the electronic components.

  For this reason, in the electronic component mounting apparatus provided with the two board | substrate conveyance apparatuses 5A and 5B which convey each printed circuit board, productivity can be improved more.

  In addition, for example, when the substrate width change of the substrate transfer device 5A is selected by pressing the touch panel switch 37 displayed on the monitor 36 in order to change the substrate width of the substrate transfer device 5A, a selection signal is received. The CPU 30 controls to start this setup change operation. That is, the CPU 30 is a drive source for the mounting heads 16 on the left back side and the left front side so as to stop the component removal and mounting operations of the mounting heads 16 on the left back side and the left front side corresponding to the component supply unit groups 3A1 and 3B1. The θ pulse motor 17 and the vertical pulse motor 18 are stopped, and the Y linear motor 9 and the X linear motor 10 corresponding to the mounting heads 16 on the left back side and the left front side are controlled, and the printed circuit board P is controlled. Control is performed so that the delivery device 7 does not deliver to the substrate transfer device 5A, and only delivers it to the substrate transfer device 5B.

  Accordingly, control is performed so that the components of the mounting head 16 on the left rear side and the left front side cannot be removed and mounted, and the electronic component mounting is performed without mounting the electronic component on the printed circuit board P of the mounting stage 5A1 of the substrate transport apparatus 5A. Control is performed so that mounting of electronic components can be continued on the printed circuit board P of the mounting stage 5B2 of the substrate transport apparatus 5B without stopping the operation of the apparatus.

  In addition, although the operation | movement when a component cut-out has occurred in any of the component supply units in the component supply unit group 3A1 and the operation in the case where the substrate width changeover has occurred in the substrate transfer device 5A has been described above, other component supply units As for the operation when the component supply unit of any of the groups 3B1 and 3B2 has run out or the substrate width changeover has occurred in the substrate transfer device 5B, the CPU 30 corresponds to the component supply unit groups 3A2 and 3B2. Control is performed to stop the component removal and mounting operations of the mounting head 16 on the back side and the mounting head 16 on the right front side, and the printed circuit board P is not transferred from the transfer device 7 to the substrate transfer device 5B, and the substrate transfer device 5A. Control to pass only to.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a top view of an electronic component automatic placement device. It is a control block diagram.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3A1, A2, B1, B2 Component supply unit 5A, 5B Substrate conveyance apparatus 4M, 5M, 6M Substrate conveyance motor 7 Delivery apparatus 9 Y linear motor 10 X linear motor 16 Mounting head 17 θ pulse motor 18 Up and down Pulse motor 30 CPU
32 RAM
36 Monitor 37 Touch panel switch

Claims (2)

Two board transport devices each for transporting printed circuit boards in parallel, and at least two component supplies for supplying a plurality of types of electronic components to be mounted on the printed circuit boards respectively disposed at upstream and downstream positions of the apparatus body 2 units including a unit group and at least two mounting heads that are respectively disposed at an upstream position and a downstream position of the apparatus main body and take out electronic components supplied from the component supply unit group and mount them on the printed circuit board. The electronic component supplied from the corresponding component supply unit group on each printed circuit board positioned at one upstream position and the other downstream position of the substrate transport apparatus is taken out and mounted by the corresponding mounting head. In addition, the one downstream position and the other upstream position are not attached to the printed circuit board. Together is, if the component depletion in one of the component supply unit group of the component feeding unit group arranged respectively upstream position and a downstream position of the apparatus main body has occurred, the component supply unit group according to the portion out of stock The other printed circuit board is transferred only to the other substrate transport apparatus that is not the one substrate transport apparatus that transports one printed circuit board corresponding to the other printed circuit board, and the other printed circuit board is mounted by the mounting head corresponding to the other printed circuit board. An electronic device comprising: a control device for controlling an electronic component to be mounted on the first printed circuit board and controlling the mounting head corresponding to the one printed circuit board not to take out and mount the electronic component. Component mounting device. Two board transport devices each for transporting printed circuit boards in parallel, and at least two component supplies for supplying a plurality of types of electronic components to be mounted on the printed circuit boards respectively disposed at upstream and downstream positions of the apparatus body 2 units including a unit group and at least two mounting heads that are respectively disposed at an upstream position and a downstream position of the apparatus main body and take out electronic components supplied from the component supply unit group and mount them on the printed circuit board. The electronic component supplied from the corresponding component supply unit group on each printed circuit board positioned at one upstream position and the other downstream position of the substrate transport apparatus is taken out and mounted by the corresponding mounting head. In addition, the one downstream position and the other upstream position are not attached to the printed circuit board. Together is, when the substrate width setup change of one substrate conveying device corresponding to one of the printed circuit board is started, see other printed circuit board to the other substrate transport device that does not overlap the sort the substrate width setup receives pass is, the electronic component mounting apparatus characterized by electronic components on the other printed circuit board by the mounting head corresponding to the other printed circuit board is provided with a control device for controlling to be worn.

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