JP3778764B2 - Mounting line - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mounting line in which a plurality of electronic component mounting devices for mounting electronic components on a printed board by taking out electronic components from a component supply unit.
[0002]
[Prior art]
The alternate function of the electronic component mounting apparatus is disclosed in, for example, Japanese Patent Laid-Open Nos. 5-167286 and 8-172296, and generally known as the cassette alternate, stage alternate, and tray alternate functions. This function is only a function possessed within one electronic component mounting apparatus.
[0003]
Recently, in order to handle a wide variety of electronic components, it has become necessary to install a plurality of electronic component mounting apparatuses in parallel.
[0004]
[Problems to be solved by the invention]
However, in such a case, even if the above-described alternate function is used in each electronic component mounting device, if the component of the electronic component is cut by one mounting device, the mounting device must be stopped, The mounting operation rate of the entire mounting line could not be improved.
[0005]
In view of this, the present invention provides a mounting line in which a plurality of electronic component mounting devices are arranged side by side, and even if a single mounting device is out of electronic components, the mounting line is not stopped and mounting is continued. The purpose is to improve the operating rate.
[0006]
[Means for Solving the Problems]
Therefore, according to the present invention, in the mounting line in which a plurality of electronic component mounting devices for taking out the electronic components from the component supply unit and mounting them on the printed circuit board are arranged side by side, There is no electronic component to be mounted in the component supply unit of the electronic component mounting device , while controlling the electronic component mounting operation by the memory storing the information of where the component supply unit is stored, and the electronic component mounting device In this case, when it is possible to determine whether or not alternative electronic component mounting apparatus can perform alternative mounting based on the information stored in the memory, the component mounting unit of the other electronic component mounting apparatus uses the component. The electronic component mounting device is provided with a control device that requests the other electronic component mounting device to take out the electronic component from the supply unit and mount it on the printed circuit board.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described below based on the drawings. FIG. 1 is a schematic plan view showing a part of an electronic component mounting line, in which electronic component mounting apparatuses 1, 2, and 3 are arranged in parallel. A plurality of component supply units 5 and component supply trays 6 for supplying various electronic components one by one to the component take-out portion (component suction position) are arranged in parallel on the base 4 of each mounting apparatus.
[0009]
Between the component supply unit 5 and the component supply tray 6 facing each other, a supply conveyor, a positioning unit, and a discharge conveyor (not shown) are provided. The supply conveyor transports the printed circuit board received from the upstream to the positioning unit, and after the electronic components are mounted on the substrate positioned by a positioning mechanism (not shown), transports it to the discharge conveyor, and further transports it to each downstream device. To do.
[0010]
Reference numeral 7 denotes a component mounting portion having a plurality of suction nozzles for mounting electronic components on the substrate, and is moved in the X and Y directions by, for example, an X-axis motor and a Y-axis motor. Each component mounting portion 7 is equipped with a vertical axis motor for moving each suction nozzle up and down and a θ-axis motor for rotating around the vertical axis. Therefore, each suction nozzle of the component mounting portion 7 can move in the X direction and the Y direction, can rotate around the vertical line, and can move up and down.
[0011]
FIG. 2 is a control block diagram of the electronic component mounting apparatuses 1, 2, and 3, which will be described below. Reference numerals 10, 20, and 30 denote CPUs that collectively control the mounting devices 1, 2, and 3. The CPUs 10, 20, and 30 are connected to the RAMs (Random Access Memory) 12 and 22 via bus lines 11, 21, and 31. 32 and ROM (Read Only Memory) 13, 23, 33 are connected. The CPUs 10, 20, and 30 perform component mounting operations of the electronic component mounting apparatuses 1, 2, and 3 according to the programs stored in the ROMs 13, 23, and 33 based on the data stored in the RAMs 12, 22, and 32. Controls such operations as a whole.
[0012]
That is, each CPU 10, 20, 30 controls each component mounting unit 7 via the interfaces 14, 24, 34. The electronic component mounting apparatuses 1, 2, and 3 are connected via interfaces 15, 25, and 35.
[0013]
The RAM 12 stores master mounting data (see FIG. 3) related to mounting of the entire electronic component mounting apparatus 1, 2, and 3 and is stored in the printed circuit board for each mounting order (for each step number). X direction (indicated by X), Y direction (indicated by Y) and angular position (indicated by θ) information, arrangement number information of each component supply unit 5 and component supply tray 6, and which mounting device is used The machine information, the electronic component type information, the mounting device that can be alternated (alternative mounting) and the arrangement number information that can be alternated in the mounting device are stored.
[0014]
That is, it is the electronic component mounting apparatus 1 that is first mounted on the printed circuit board (step number 1), and a component of the type “RS1005” having an arrangement number of “101” is placed on the “X1 coordinate, Y1 coordinate, It means that it is mounted at a position of “angle θ1”.
[0015]
Then, if the part of the type “RS1005” disappears in the part supply unit 5 with the arrangement number “101” and the part is out of stock, the part with the arrangement number “201” in the mounting apparatus 1 is mounted. Means that. Furthermore, when the component supply unit 5 with the arrangement number “201” is lost and the component is out of stock, it means that the component supply unit 5 with the arrangement number “102” of the mounting apparatus 2 is taken out and mounted. Interpret.
[0016]
Based on the master mounting data stored in the RAM 12, the CPU 10 distributes the master mounting data to the mounting devices 1, 2, 3 in consideration of line balance and the like, and stores them in the respective RAMs 12, 22, 32. . In this case, simple distribution may be performed as shown in FIG. 4, or distribution may be performed with minimum mounting data as shown in FIG.
[0017]
With the above configuration, the operation will be described below.
[0018]
First, according to the program stored in the ROM 13, 23, 33, the electronic component mounting apparatuses 1, 2, 3 start operation. First, the printed circuit board is transported from the upstream apparatus to the positioning unit via the supply conveyor, and positioned. It is positioned and fixed by the mechanism. Here, for convenience of explanation, the operation of the mounting apparatus 1 will be described mainly based on FIGS. 4, 6, and 7.
[0019]
First, it is determined whether there is an alternate request from another connecting device on the downstream side, that is, the mounting device 2 or 3. If there is a request, the mounting device 1 performs an alternate step valid process. That is, the CPU 10 that has received a request from the CPU 20 or the CPU 30 rewrites the command “S (skip)” of the predetermined step number stored in the RAM 12 in the upper part of FIG. The
[0020]
Next, when there is no request for the alternate, or there is the alternate step valid process, the electronic component type “RS1005” of the arrangement number “101” to be mounted at step number 001 is out of components. It is determined by the CPU 10 whether or not it has occurred. If the component has not run out, the component is mounted. If the component has run out, a “component run out” display or the like is displayed. In this case, for example, the initial number of parts is managed and added or subtracted every time it is mounted, and when the number of parts becomes zero or zero, it is determined that “parts are out” or a part supply detection sensor is provided in the part supply unit 5. If there is no suction component and the presence / absence detection sensor detects that there is no suction component even if the suction nozzle repeats the suction operation multiple times, there are various methods for determining it. good.
[0021]
Then, it is determined whether or not a replenishment process for the electronic component that has run out of parts has been performed. If the replenishment process has not been performed, it is next determined whether or not the mounting apparatus 1 can perform an alternate. If the electronic component type “RS1005” of the arrangement number “201” is “parts present” and can be alternated, the placement apparatus 1 performs an alternation process that invalidates the arrangement number “101” of the parts out, and this arrangement number. The component mounting unit 7 mounts the electronic component type “RS1005” of “201”. If replenishment processing has been performed, alternate processing for validating the arrangement number “101” replenished in the mounting apparatus 1 is performed.
[0022]
However, if the alternation is impossible in the mounting apparatus 1 (there is no part type “RS1005”), it is determined whether or not the alternate processing can be performed by another connecting apparatus on the downstream side, that is, the mounting apparatus 2 or 3. . Here, if the alternate processing is possible, the “material out of stock display” processing to the effect that there is no part type “RS1005” in the mounting apparatus 1 is performed, and the CPU 10 executes the command “−” of the command of step number 1 stored in the RAM 12. "Is rewritten to" S "and the skip processing in the mounting apparatus 1 is performed. If the placement device 2 has the electronic component type “RS1005” in the arrangement number “102”, the placement device 2 is subjected to a step validity request process. That is, the CPU 20 that has received the request from the CPU 10 rewrites “S” of the command of step number 1 stored in the RAM 22 to “−”, and places the component of the mounting device 2 on the printed board received from the mounting device 1. The mounting unit 7 mounts a component type “RS1005” that could not be mounted by the mounting apparatus 1. In this case, the mounting may be performed at the end or immediately before the transport from the mounting device 2 to the mounting device 3, or may be performed while being interrupted.
[0023]
As shown in FIG. 7, when there is no electronic component type “RS1005” in the arrangement number “102” in the mounting device 2, the electronic component type “RS1005” of the arrangement number “202” is mounted. When there is no electronic component type “RS1005” in the arrangement number “202” in the mounting apparatus 2, the command “S” of step number 1 stored in the RAM 22 is left as it is, and the CPU 30 stores the step number 1 stored in the RAM 32. The command “S” is rewritten to “−”, and the mounting device 3 mounts the electronic component type “RS1005” having the arrangement number “103”. Further, when the placement device 3 does not have the electronic component type “RS1005” in the placement number “103”, the placement device 3 attaches the electronic component type “RS1005” of the placement number “203”.
[0024]
Further, when the alternate processing is impossible in the mounting apparatuses 2 and 3, that is, when there is no component type “RS1005”, the mounting apparatuses 1, 2, and 3 are stopped due to running out of material.
[0025]
It should be noted that an alternate request to another mounting device should be given priority to the downstream device. This eliminates the production of a printed circuit board on which electronic components cannot be mounted, and eliminates the waste of the printed circuit board.
[0026]
【The invention's effect】
As described above, according to the present invention, even when a material shortage occurs in an electronic component mounting device with a mounting line (all components of the component are out), the electronic component mounting device is provided with the electronic component mounting device. The control device that controls the mounting operation of the electronic component by the device can determine whether or not alternative mounting can be performed by another electronic component mounting device based on the information stored in the memory provided in the electronic component mounting device. In this case, the component mounting unit of the other electronic component mounting apparatus can request the other electronic component mounting apparatus to take out the electronic component from the component supply unit and mount it on the printed circuit board. By performing alternate processing (alternative mounting) with the electronic component mounting apparatus, production can be continued without stopping.
[Brief description of the drawings]
FIG. 1 is a schematic plan view showing a part of a mounting line for electronic components.
FIG. 2 is a control block diagram of a part of the mounting line.
FIG. 3 is master mounting data relating to component mounting of the entire electronic component mounting apparatus 1, 2, 3;
FIG. 4 is a diagram showing mounting data (in the case of simple distribution) stored in each RAM of each electronic component mounting apparatus;
FIG. 5 is a diagram showing mounting data (minimum data) stored in each RAM of each electronic component mounting apparatus;
FIG. 6 is a flowchart according to the electronic component mounting apparatus 1;
FIG. 7 is a view for explaining an alternate according to the present invention.
[Explanation of symbols]
1, 2, 3 Electronic component mounting device 5 Component supply unit 7 Component mounting unit 10, 20, 30 CPU
12, 22, 32 RAM
13, 23, 33 ROM

Claims (1)

In a mounting line in which a plurality of electronic component mounting devices are arranged in parallel by the component mounting unit taking out electronic components from the component supply unit and mounting them on the printed circuit board.
A memory for storing information about where in the electronic component mounting apparatus the electronic component of the same type is stored, and the electronic component mounting operation by the electronic component mounting apparatus are controlled. If there is no electronic component to be mounted in the component supply unit, it is possible to determine whether or not alternative mounting by another electronic component mounting apparatus is possible based on the information stored in the memory. The electronic component mounting apparatus is provided with a control device for requesting the other electronic component mounting apparatus so that the component mounting section of the electronic component mounting apparatus takes out the electronic component from the component supply section and mounts the electronic component on the printed circuit board. A characteristic mounting line.

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