JP7401324B2 - Board transport management device, board transport management method, and mounted parts sorting system - Google Patents

Description

The present specification relates to a device and method for managing board transportation when applied to a component mounting line in which a plurality of component mounting machines are installed in parallel, and a system for distributing work for mounting multiple types of components to each component mounting machine. .

BACKGROUND ART A technology for mass-producing board products by performing board-to-board work on boards with printed wiring has become widespread. Furthermore, a component mounting line is constructed by arranging a plurality of component mounting machines in parallel to take charge of component mounting work in the board-to-board work. Generally, a component mounting machine includes a board transport device that transports a board, a component supply device that supplies a plurality of types of components, and a component transfer device that performs a work of mounting components onto a board. Here, if an impact occurs when the board is transported, there is a risk that the parts attached using the creamy solder may fall over or skid. Therefore, it is necessary to control transport conditions such as the transport speed and acceleration of the substrate. Technical examples regarding control of substrate transport conditions are disclosed in Patent Documents 1 and 2.

The printed circuit board transport device of Patent Document 1 includes a transport arm that transports a board, a drive device that drives the transport arm, and a control device that controls the drive device. The present invention is characterized in that the control device is provided with a storage means that stores acceleration patterns and deceleration patterns of the transport arm, and a control means that controls the drive device based on the respective patterns. According to this, when a board is transported, it is possible to optimally control the acceleration/deceleration pattern according to the center of gravity position, contact area, etc. of the components mounted on it, and it is possible to transport the board at high speed. .

Further, in the electronic component mounting method of Patent Document 2, the inertia parameter of the component already mounted on the board is determined in the board loading section, and the operating parameter slow speed of the board conveyance speed is automatically set in accordance with the magnitude of the inertia parameter. Furthermore, it has been shown that the height, mounting area, and volume of mounted components are used as inertial parameters. According to this, it is possible to transport the board at an appropriate transport speed even if the mounting condition of the parts changes, so there is no possibility of parts shifting or scattering, and there is no need to reduce the transport speed unnecessarily. It is said that productivity can be improved without any problems.

Japanese Patent Application Publication No. 4-299898 Japanese Patent Application Publication No. 2003-51698

By the way, in the technique of Patent Document 1, a plurality of types of acceleration/deceleration patterns are selectively used depending on the type of components mounted on the board. For this reason, it is necessary to manually change the settings of the acceleration and deceleration patterns of multiple component mounting machines during setup change work when changing the type of board product produced on the component mounting line. Therefore, it takes time for the operator to make settings.

On the other hand, the technology disclosed in Patent Document 2 uses a sensor (such as a height measuring section) installed in the board loading section to determine the inertia parameter of the mounted component and automatically sets the slow conveyance speed, thereby saving labor. is realized. However, the additional installation of sensors increases the cost of the device, and in addition, the transport operation is restricted until the sensor detection signals are processed.

The present specification provides a board transfer management device and method that can appropriately automatically set at least one of transport speed, acceleration, and deceleration when each component mounting machine that makes up a component mounting line transports a board. The problem to be solved is to provide the following.

This specification is applied to a component mounting line in which a plurality of component mounting machines are installed in parallel to place components on a transported board, and the transport conditions indicate transport conditions regarding the transport speed of the board for each type of component. A storage unit that stores information, assignment information indicating the type of the component to be assigned to the mounting work of the plurality of component mounting machines, and the transportation condition information, the transportation speed, acceleration, and A board transfer management device is disclosed, including a setting unit that sets at least one deceleration to each of the transfer sections of the plurality of component mounting machines.

Further, the present specification is applied to a component mounting line in which a plurality of component mounting machines are installed in parallel to perform a work of mounting components on a transported board, and transport conditions regarding the transport speed of the board are shown for each type of component. a storage unit that stores transport condition information; assignment information indicating the type of the component to be shared in the mounting work of the plurality of component mounting machines; and the transport speed and acceleration of the board based on the transport condition information. , and a setting unit configured to set at least one deceleration to each of the transport sections of the plurality of component placement machines; Disclosed is a mounting component distribution system comprising: an adjustment unit that adjusts the distribution method so that the cycle time, which is the sum of the mounting time required for work and the transportation time required for transporting the board, is equal for each of the component mounting machines. do.

Furthermore, the present specification is applied to a component mounting line in which a plurality of component mounting machines are installed in parallel for mounting components onto transported boards, and transport conditions regarding the transport speed of the board are shown for each type of component. a storing step of storing conveyance condition information, assignment information indicating the type of the component to be shared in the mounting work of the plurality of component mounting machines, and the conveyance speed and acceleration of the board based on the conveyance condition information; , and a setting step of setting at least one deceleration to each of the transport sections of the plurality of component mounting machines.

In the board transport management device and method disclosed in this specification, appropriate transport condition information that prevents the parts mounted on the board from falling over or skidding and that improves production efficiency is provided for each type of part. can be memorized. Further, by referring to the assignment information, it is possible to determine which components have been mounted on the board at any position on the component mounting line. Therefore, based on the assignment information and the transport condition information, at least one of the transport speed, acceleration, and deceleration when each component mounting machine transports the board can be automatically and appropriately set. As a result, good production efficiency can be ensured, and in addition, the operator does not have to make settings.

Further, the mounted parts distribution system disclosed in this specification is configured by adding an adjustment section to the above-described board transport management device. Therefore, according to this system, like the board transport management device, at least one of the transport speed, acceleration, and deceleration when each component mounting machine transports a board can be automatically and appropriately set. Furthermore, when distributing the work of mounting multiple types of components to each component mounting machine, this system not only takes into account the mounting time of the components, but also takes into account the board transport time managed by the board transport management device. Make adjustments. Therefore, compared to conventional technology that does not take into account changes in board transport time, this system improves the calculation accuracy of cycle time for each component mounting machine and has the effect of shortening the line cycle time of the entire component mounting line. becomes noticeable.

FIG. 1 is a perspective view showing an example of the configuration of a component mounting line to which the board transfer management device of the embodiment is applied. FIG. 2 is a perspective view showing a configuration example of a component mounting machine. FIG. 2 is a functional block diagram of a substrate transport management device according to an embodiment. FIG. 3 is a diagram schematically illustrating conditions under which parts do not fall over and conditions under which parts do not skid. 1 is a diagram conceptually showing a transport control type substrate transport device. 1 is a diagram conceptually showing a stopper type substrate transfer device. FIG. 3 is an operation flow diagram illustrating the operation of the substrate transport management device. FIG. 2 is a functional block diagram of a mounted parts sorting system according to an embodiment. FIG. 3 is an operation flow diagram illustrating the operation of the installed parts sorting system.

1. Configuration Example of Component Mounting Line 2 First, a configuration example of the component mounting line 2 to which the substrate transport management device 1 of the embodiment is applied will be described with reference to FIG. 1. The component mounting line 2 is configured by four common bases 2A1, 2A2, 2A3, and 2A4 arranged in parallel, each carrying two component mounting machines of the same structure. Therefore, the component mounting line 2 is configured with a total of eight component mounting machines (21 to 28) arranged in parallel. Note that the number of component mounting machines constituting the component mounting line 2 may be other than eight. An unillustrated solder printing machine and a print inspection machine are arranged in parallel on the upstream side of the component mounting line 2, and an unillustrated board appearance inspection machine and a reflow machine are arranged in parallel on the downstream side.

The component mounting machine 21 on the back left side of FIG. 1 is on the upstream side of the line, and the component mounting machine 28 on the front right side is on the downstream side of the line. Also, as shown in the XY coordinate axes in the figure, the direction in which the eight component mounting machines 21 to 28 sequentially transport the boards is the X-axis direction, and the direction perpendicular to the X-axis direction in the horizontal plane is the Y-axis direction. shall be. The device configuration of the component mounting machine 28 will be described in detail with reference to FIG. 2 showing one component mounting machine 27, 28 for one common base 2A4.

The component mounting machine 28 is configured by assembling a board transfer device 3, a component supply device 4, a component transfer device 5, a component camera 6, etc. onto a base 2B. The board transfer device 3 is arranged near the center of the component mounting machine 28 in the Y-axis direction. The substrate transfer device 3 is a so-called double conveyor type device in which a first transfer device 31 and a second transfer device 32 are arranged in parallel. A mounting position is set approximately at the center of the transport path of the first transport device 31 and the second transport device 32. A clamp device (numerical symbol omitted) is provided below the mounting position for pushing up and positioning the transported substrate from the base 2B side. Note that the substrate transfer device 3 may be a single conveyor type device.

The component supply device 4 is arranged at the front part of the component mounting machine 28 in the Y-axis direction (front left side in FIG. 2). The component supply device 4 is configured by arranging a plurality of cassette type feeders 41. The cassette feeder 41 includes a feeder main body 42, a supply reel 43 rotatably and detachably attached to the rear of the feeder main body 42, and a component supply section 44 provided at the top of the tip of the feeder main body 42. A carrier tape (not shown) holding a large number of components at regular intervals is wound around the supply reel 43 . The leading end of this carrier tape is pulled out to the component supply section 44, and components are supplied.

The component transfer device 5 is arranged from the rear part of the component mounting machine 28 in the longitudinal direction to above the component supply device 4. The component transfer device 5 is a so-called XY robot type device that can move in the X-axis direction and the Y-axis direction. The component transfer device 5 includes a head drive mechanism 51, a mounting head 52, and the like. The head drive mechanism 51 drives the mounting head 52 in the X-axis direction and the Y-axis direction. A rotary tool 53 is provided at the bottom of the mounting head 52. The rotary tool 53 holds a plurality of suction nozzles (not shown) rotatably and movably up and down. The suction nozzle is a typical example of a component mounting tool that picks up a component from the component supply device 4 and mounts it on a mounting position on a board. Note that other component mounting tools, such as one large suction nozzle or a clamping type mounting tool, may be provided below the mounting head 52.

The component camera 6 is arranged on the base 2B between the component supply device 4 and the first transport device 31. The component camera 6 images the component picked up by the suction nozzle of the component transfer device 5 from below, and acquires image data. This image data is subjected to image processing to determine whether the parts are good or bad, and to recognize the suction state of the parts. The results of the image processing are reflected in the attachment operation of the suction nozzle.

An unillustrated control section is communicatively connected to the substrate transport device 3, component supply device 4, component transfer device 5, component camera 6, and operation display section 62 using control lines. The control unit controls component mounting work based on job data determined for each type of board product. The operation display section 62 is arranged at the upper front side of the cover 2C. The operation display section 62 serves as a man-machine interface for exchanging information between the operator and the control section.

2. Functional configuration of the substrate transport management device 1 according to the embodiment Let's move on to the description of the substrate transport management device 1 according to the embodiment. As shown in FIG. 3, eight component mounting machines (21 to 28) are communicatively connected to a line management device 71. The line management device 71 is a computer device that has a CPU and operates on a program. The line management device 71 can access the storage device 72. The storage device 72 does not need to be dedicated to the line management device 71, and may be shared with other computer devices.

The line management device 71 is further communicatively connected to the production management device 8 . The production control device 8 manages various information such as design information of the board products to be produced, types, quantities, production schedules, etc. of the board products. The line management device 71 collectively controls eight component mounting machines (21 to 28) according to commands from the production management device 8. The eight component mounting machines (21 to 28) share the task of mounting multiple types of components.

The substrate transport management device 1 includes a storage section 11, a setting section 15, and an assignment information storage section 16. The storage unit 11 includes a shape storage unit 12 and a calculation unit 13. The calculation unit 13 and the setting unit 15 are realized by a program of the line management device 71. The shape memory unit 12 and the assignment information storage unit 16 are realized by data stored in the storage device 72.

When producing a board product, the board transport management device 1 presets transport conditions (transport conditions to be used) for transporting a base board or a board in the middle of production before the start of production. At least one of substrate transport speed, acceleration, and deceleration is set as the transport condition to be used. The board transport management device 1 acquires assignment information regarding the relevant board product from the production management device 8 and stores it in the assignment information storage section 16 . The assignment information is data indicating the types of parts to be assigned to the mounting work of the eight component mounting machines (21 to 28).

The storage unit 11 stores transport condition information indicating transport conditions regarding the board transport speed for each type of component. To explain in detail, the shape memory section 12 that constitutes the memory section 11 stores shape information of parts. The shape information includes at least one of the external shape, external dimensions, mass, center of gravity position, and mounting area of the component. This storage operation may be performed in advance for all types of components, or may be performed each time for the types of components required for the board product to be produced.

Next, the calculation unit 13 that constitutes the storage unit 11 calculates transport conditions based on the shape information for each type of component, and associates the transport conditions with the type of part to provide transport condition information. This calculation operation is performed regardless of the component mounting machines (21 to 28) that share the task of mounting the component in question. Further, the calculated transport conditions represent an upper limit permissible value of at least one of the transport speed, acceleration, and deceleration of the substrate, and are different from the transport conditions actually used.

An example of the calculation contents of the calculation unit 13 will be explained with reference to FIG. 4. The calculation unit 13 determines transport conditions within a range in which the component P mounted on the board K does not fall over or skid sideways. In FIG. 4, a component P is attached to the top surface of a board K using creamy solder H. Further, as shown by a white arrow M, a situation is assumed in which the substrate K is being transported while being accelerated to the right. On the center of gravity G of the part P, a backward force F1 due to acceleration, a downward force F2, and a forward force F3 that balances the force F1 act.

Here, the conditions for the part P not to fall are shown by the inequality (1) regarding the rotational moment around the rear lower point RU of the part P, and the inequality (2) which is a rewrite of the inequality (1).
F1・Y < F2・X …………………(1)
ma・Y < (mg+f)・X ………(2)
However, m is the mass of the component P, a is the acceleration of the board K, g is the gravitational acceleration, f is the adhesive force of the creamy solder H, Y is the height of the center of gravity G from the top surface of the board K, and X is the center of gravity G and the back. This is the horizontal distance of the lower point RU. Note that the adhesive force f of the creamy solder H is an amount that depends on the mounting area between the board K and the component P.

Further, the conditions under which the part P does not skid are expressed by inequality (3) regarding the magnitude relationship of horizontal forces, and inequality (4) which is a rewrite of inequality (3).
F1 < F3 ……………(3)
ma < mgu…………(4)
However, u is a coefficient of static friction that depends on the viscosity of the creamy solder H.

The calculation unit 13 determines the upper limit value of the acceleration a that satisfies both inequality (2) and inequality (4). Next, the calculation unit 13 divides the upper limit value by a safety factor larger than 1 to obtain the upper limit allowable value of acceleration, and uses this as transport condition information for each type of component P. Note that since the vertically long component P is likely to fall over, inequality (2) becomes a constraint in many cases. On the other hand, since a laterally long part P is difficult to fall over, inequality (4) becomes a constraint in many cases. Further, it is possible to assume a situation where the substrate K is transported while being decelerated, and the calculation unit 13 calculates the upper limit allowable value of the deceleration based on the same concept. Parts P that are long in the vertical direction and parts P that have a large mass m tend to have severe conveyance condition information (small upper limit tolerance).

Note that the adhesive force f of the creamy solder H included in inequality (2) and the static friction coefficient u included in inequality (4) change depending on the temperature of the creamy solder H. Therefore, the conveyance condition information may be corrected based on the result of actually measuring or estimating the temperature of the creamy solder H. An example of a device for actually measuring the temperature of the creamy solder H is a non-contact thermometer that detects infrared rays. An example of a method for estimating the temperature of the creamy solder H is a method based on a characteristic curve representing the relationship between the elapsed time after the creamy solder H is printed on the substrate K and the temperature drop. Further, the calculation unit 13 may calculate the conveyance conditions using calculation expressions other than inequality (2) and inequality (4).

Furthermore, the storage section 11 is not limited to the combination of the shape storage section 12 and the calculation section 13. For example, a parts manufacturer may recommend upper limit tolerances for transport conditions allowed for the part. In this case, the storage unit 11 may include an input unit for inputting the upper limit permissible value of the conveyance conditions, and a permissible value storage unit for storing the input upper limit permissible value.

Further, specific items of the transport condition information depend on the configuration of the substrate transport device 3. Examples of the substrate transfer device 3 include a transfer control type substrate transfer device 3A conceptually shown in FIG. 5, and a stopper type substrate transfer device 3B conceptually shown in FIG. In FIGS. 5 and 6, the substrate K is shown in the mounting position.

The transfer control type substrate transfer device 3A includes, for example, a transfer conveyor 33, a driving sprocket 34D, a driven sprocket 34F, a substrate detection sensor 35, a pulse motor 36, and a conveyor control section 37. One of the driving sprocket 34D and the driven sprocket 34F is provided at the entrance, and the other is provided at the exit. The conveyor 33 is rotatably spanned between a driving sprocket 34D and a driven sprocket 34F. Note that three or more sprockets may be used in combination. A substrate K is placed on the transport conveyor 33. The substrate detection sensor 35 is provided at the front edge of the conveyor 33, that is, near the entrance, and detects the substrate K. An example of the substrate detection sensor 35 is a photoelectric sensor that detects the substrate K by blocking detection light that crosses the transport path.

The pulse motor 36 rotates the drive sprocket 34D to rotate the conveyor 33 clockwise in FIG. 5 (see arrow Q). When the substrate detection sensor 35 detects the arrival of the substrate K, the conveyor control section 37 outputs a control pulse to control the pulse motor 36. Thereby, the conveyor control unit 37 controls the increase/decrease of the conveyance speed of the substrate K while carrying it in and stopping it at the mounting position. In this configuration, the larger one of the acceleration and deceleration acting on the substrate K may be considered as the cause of the force F1. Therefore, the calculation unit 13 obtains at least one of acceleration and deceleration as conveyance condition information.

On the other hand, the stopper-type substrate transfer device 3B includes, for example, a transfer conveyor 33, a driving sprocket 34D, a driven sprocket 34F, a general motor 38, and a stopper member 39. The conveyor 33 is rotatably spanned between a driving sprocket 34D and a driven sprocket 34F. A substrate K is placed on the transport conveyor 33. The motor 38 can be switched on and off, and rotates the drive sprocket 34D to rotate the conveyor 33 clockwise in FIG. 6 (see arrow Q). The stopper member 39 is provided in front of the mounting position so as to be movable up and down.

With this configuration, the substrate K collides with the stopper member 39 and stops, and then the motor 38 is turned off. In other words, as the cause of the force F1, it is necessary to consider the deceleration when the transport speed is suddenly reduced due to the collision of the substrate K. Therefore, the calculation unit 13 obtains the conveyance speed as the conveyance condition information.

The setting unit 15 sets at least one of the board transport speed, acceleration, and deceleration for each of the transport sections of the eight component mounting machines (21 to 28) based on the assignment information and the transport condition information. The conveyance section can be divided into a carry-in section from the carry-in entrance to the mounting position and a carry-out section from the mounting position to the carry-out exit. The setting unit 15 sets a transport condition (at least one of transport speed, acceleration, and deceleration) that satisfies the transport condition information of the component P mounted on the board K.

Here, the setting unit 15 can reliably prevent the parts P from falling or skidding by setting small transport conditions, but the transport time becomes longer and the production efficiency of the component mounting line 2 decreases. Therefore, it is preferable that the setting unit 15 sets the smallest upper limit tolerance among the transport condition information of the plurality of types of parts P that have been mounted as the transport condition to be used. Thereby, good production efficiency of the component mounting line 2 can be ensured.

Moreover, as the part mounting line 2 goes downstream, the number of parts P mounted on the board K increases, so the restrictions on the conveyance condition information increase. Furthermore, small, low-profile parts P with loose conveyance condition information (large upper limit tolerance) are mounted on the upstream side of component mounting line 2, and small, low-profile components P with strict conveyance condition information (small upper limit tolerance) are installed on the downstream side. Large parts and parts with special shapes are installed. Therefore, the setting unit 15 monotonically decreases at least one of the conveyance speed, acceleration, and deceleration toward the downstream of the component mounting line 2. Monotonically decreasing means that the value does not increase in the middle, maintains the same value, or decreases. The functions of the setting unit 15 will be described in detail in the following operation description.

3. Operation of the substrate transport management device 1 Next, the operation of the substrate transport management device 1 will be described with reference to the operation flow shown in FIG. 7. Before starting the operation flow, the board products to be produced are determined. In step S1 of FIG. 7, the shape memory unit 12 stores shape information for the type of component P required for the board product to be produced. In the next step S2, the calculation unit 13 calculates the upper limit allowable value of the transport condition based on the shape information for each type of part P, and associates it with the type of part P as transport condition information.

In the next step S3, the setting unit 15 acquires assignment information. In the next step S4, the setting unit 15 focuses on the most upstream component mounting machine 21. In the next step S5, the setting unit 15 extracts components that have been mounted on the board K in the carry-in section and the carry-out section of the component mounting machine 21 of interest. Naturally, there are no installed parts in the delivery section. Further, in the carry-out section, the mounted component can be easily determined to be the component P to be mounted by the component mounting machine 21 by referring to the assignment information.

In the next step S6, the setting unit 15 sets transport conditions (at least one of transport speed, acceleration, and deceleration) to be used for the carry-in section and the carry-out section of the component mounting machine 21, respectively. In the carry-in section, there are no mounted parts, so large conveyance conditions are set. In the carry-out section, conveyance conditions that satisfy the conveyance condition information of the component P mounted by the component mounting machine 21 are set. In other words, the conveyance conditions are set so that the component P mounted on the board K does not fall over and does not skid sideways. However, when two substrates K are placed on the conveyor 33 of the component mounting machine 21 and carried in and carried out at the same time, the same conveyance conditions as in the carry-out section are set in the carry-in section, not the large conveyance conditions. Even so, the conveyance conditions in the carry-out section are not greater than the conveyance conditions in the carry-in section.

In the next step S7, the setting unit 15 determines whether the settings for the most downstream component mounting machine 28 have been completed. In step S8 when the process has not been completed, the setting unit 15 focuses on the next downstream component mounting machine 22 and returns execution of the operation flow to step S5. In the second step S5, the setting unit 15 extracts components that have been mounted on the board K in the carry-in section and the carry-out section of the component mounting machine 22 of interest. In the carry-in section, the mounted components match the mounted components in the carry-out section of the component mounting machine 21. Further, in the carry-out section, the mounted component can be easily determined to be the component P to be mounted by the two component mounting machines 21 and 22 by referring to the assignment information.

In the second step S6, the setting unit 15 sets the transport conditions to be used for the carry-in section and the carry-out section of the component mounting machine 22, respectively. In the carry-in section, the same conveyance conditions as in the carry-out section of the component mounting machine 21 are set. In the carry-out section, conveyance conditions that satisfy the conveyance condition information for the parts P mounted by the two component mounting machines 21 and 22 are set. However, when two substrates K are placed on the conveyor 33 of the component mounting machine 22 and carried in and carried out at the same time, the same conveyance conditions as in the carry-out section are set in the carry-in section. Even so, the conveyance conditions in the carry-out section are not greater than the conveyance conditions in the carry-in section.

After this, execution of the operation flow returns to step S5 via step S7 and step S8. In step S5 for the third time, the setting unit 15 extracts components that have been mounted on the board K in the carry-in section and the carry-out section of the component mounting machine 23 of interest. In the carry-in section, the mounted components match the mounted components in the carry-out section of the component placement machine 22. Further, in the carry-out section, by referring to the assignment information, it can be easily determined that the mounted components are parts P to be mounted by the three component mounting machines 21, 22, and 23.

In the third step S6, the setting unit 15 sets the transport conditions to be used for the carry-in section and the carry-out section of the component mounting machine 23, respectively. In the carry-in section, the same conveyance conditions as in the carry-out section of the component mounting machine 22 are set. In the carry-out section, conveyance conditions that satisfy the conveyance condition information of the parts P mounted by the three component mounting machines 21, 22, and 23 are set. However, when two substrates K are placed on the conveyor 33 of the component mounting machine 23 and carried in and carried out at the same time, the same conveyance conditions as in the carry-out section are set in the carry-in section.

Thereafter, steps S5 to S7 are repeated eight times by the same operation. As a result, the conveyance conditions to be used are set for the carry-in section and the carry-out section of the eight component mounting machines (21 to 28), respectively. For example, a transport condition that satisfies the transport condition information of all the parts P mounted by the eight component mounting machines (21 to 28) is set for the carry-out section of the most downstream component mounting machine 28. The set conveyance conditions become part of the job data of each component mounting machine (21 to 28). After this, the condition of step S7 is satisfied and the operation flow ends.

In the board transport management device 1 of the embodiment, appropriate transport condition information that prevents the part P mounted on the board K from falling over or skidding, and improves production efficiency, is provided for each type of part P. Can be memorized. Further, by referring to the assignment information, the component P that has been mounted on the board K at an arbitrary position on the component mounting line 2 can be determined. Therefore, based on the assignment information and the transport condition information, it is possible to automatically and appropriately set at least one of the transport speed, acceleration, and deceleration when each of the component mounting machines (21 to 28) transports the board K. can. As a result, good production efficiency can be ensured, and in addition, the operator does not have to make settings.

Further, the substrate transport management device 1 is realized by a combination of programs and data. Therefore, there is no need to additionally install hardware such as sensors, and an increase in device cost is suppressed. Further, the substrate transport management device 1 can preset transport conditions (at least one of transport speed, acceleration, and deceleration) for the substrate K before starting production of the board product. Therefore, the disadvantage that the conveying operation is restricted until the processing of the sensor detection signal is finished does not occur.

4. Mounted parts sorting system 1A of embodiment
Next, a mounted parts sorting system 1A according to an embodiment will be described. As shown in FIG. 8, the installed parts sorting system 1A is configured by adding an adjustment section 17 to the configuration of the board transport management device 1. The adjustment unit 17 is realized by a program of the line management device 71. The assignment information is treated as variable data that is adjusted by the adjustment unit 17 rather than fixed data.

As a conventional technique for adjusting assignment information, there is a simulation method described in Japanese Patent Laid-Open No. 2004-146641. In this conventional technique, the cycle time is simulated by distributing the mounting work for one board to a plurality of component mounting machines. However, in this prior art, although the types of distributed components are taken into consideration, changing the conveyance speed of the board according to the mounted components is not considered. Therefore, even if the board transfer management device 1, which sets transfer conditions individually for each of the component mounting machines (21 to 28), is combined with the above-mentioned conventional technology, the cycle time calculation accuracy decreases.

Regarding this problem, the second objective of the mounted parts distribution system 1A of the embodiment is to improve the cycle time calculation accuracy and shorten the line cycle time of the entire component mounting line 2. The added adjustment unit 17 adjusts in advance the way in which the mounting work of a plurality of types of parts P is distributed to each component mounting machine (21 to 28) before the start of production. Specifically, the adjustment unit 17 adjusts the cycle time, which is the sum of the mounting time required for the mounting operation and the transport time required for transporting the board K, to be equal for each component mounting machine (21 to 28).

The operation of the installed parts sorting system 1A is shown in the operation flow of FIG. 9. In step S11 of FIG. 9, the adjustment unit 17 temporarily sets one way of distributing the mounting work of the plurality of types of parts P to each component mounting machine (21 to 28). In other words, the adjustment unit 17 temporarily sets one piece of assignment information. In the next step S12, the entire operation flow shown in FIG. 7 is executed, and the conveyance conditions used in each component mounting machine (21 to 28) are estimated.

In the next step S13, the adjustment unit 17 estimates the transportation time of the board K in each component mounting machine (21 to 28) based on the transportation conditions estimated in step S12. At this time, the time for positioning the board K at the mounting position and the time for confirming or correcting the actual position of the positioned board K are included in the transport time.

In the next step S14, the adjustment unit 17 estimates the time required to mount the component P in each component mounter (21 to 28) based on the provisionally set assignment information. At this time, the adjustment unit 17 also adjusts other factors that affect the wearing time. Other factors include the arrangement position of multiple types of parts P in each component mounting machine (21 to 28) (order of arrangement of cassette feeders 41), order of mounting work, and type of component mounting tool (suction nozzle, etc.) used. and size can be exemplified.

In the next step S15, the adjustment unit 17 estimates the cycle time for each component mounting machine (21 to 28). The cycle time is determined by adding the mounting time and the transport time. In the next step S16, the adjustment unit 17 estimates the line cycle time of the component mounting line 2. The line cycle time is the maximum value of the cycle times for each component mounting machine (21 to 28).

In the next step S17, the adjustment unit 17 determines whether there is a possibility that the line cycle time can be shortened by changing the assignment information. In step S18 when there is a possibility, the adjustment unit 17 changes and sets the assignment information and returns execution of the operation flow to step S12. For example, if the cycle times of the component mounting machines (21 to 28) are not equalized, this means that the load of the mounting work is unevenly distributed. In this case, a possibility arises by reducing the allocation to the component mounting machine with a long cycle time and allocating it to a component mounting machine with a short cycle time. That is, by equalizing the cycle time for each component mounting machine (21 to 28), the line cycle time can be shortened.

Steps S12 to S18 are repeated, and when there is no changeable assignment information, execution of the operation flow proceeds from step S17 to step S19. In step S19, the adjustment unit 17 adopts the shortest line cycle time among the trial calculations, and adopts the corresponding assignment information (distribution method) and the corresponding conveyance conditions. The adopted assignment information and transport conditions become part of the job data of each component mounting machine (21 to 28). This completes the operation flow.

A mounted component sorting system 1A according to the embodiment is configured by adding an adjustment section 17 to the board transfer management device 1. Therefore, according to the present system 1A, similarly to the board transport management device 1, each of the component mounting machines (21 to 28) appropriately controls at least one of the transport speed, acceleration, and deceleration when transporting the board K. Can be set automatically. Furthermore, in this system 1A, when distributing the mounting work of multiple types of components P to each component mounting machine (21 to 28), not only the mounting time of the component P is taken into account, but also the mounting time is managed by the board transport management device 1. Adjustments are made taking into consideration the transport time of the substrate K. Therefore, compared to the conventional technology that does not take into account changes in the transport time of the board K, according to the present system 1A, the calculation accuracy of the cycle time for each component mounting machine (21 to 28) is improved, and the entire component mounting line 2 is The effect of shortening line cycle time is significant.

5. Applications and Modifications of Embodiments The substrate transport management device 1 of the embodiment can also be implemented as a substrate transport management method including a storage step and a setting step. Further, in step S17 and step S18 of FIG. 9, which represents the operation of the mounted parts sorting system 1A of the embodiment, the adjustment unit 17 may try all sorting methods other than the clearly unreasonable sorting method. . Further, in the two embodiments, the calculation unit 13, the setting unit 15, and the adjustment unit 17 may be provided in a computer device other than the line management device 71. The two embodiments are capable of various other applications and modifications.

1: Board transport management device 11: Storage unit 12: Shape memory unit 13: Calculation unit 15: Setting unit 16: Allotment information storage unit 17: Adjustment unit 1A: Mounting parts distribution system 2: Component mounting line 21 to 28: Component mounting Machines 3, 3A, 3B: Board transfer device 33: Transfer conveyor 36: Pulse motor 37: Conveyor control unit 38: Motor 39: Stopper member 4: Component supply device 5: Component transfer device 71: Line management device 72: Storage device 8: Production control device K: Board P: Parts

Claims (6)

It is applied to a component mounting line where multiple component mounting machines are installed in parallel to attach components to transported boards.
a storage unit that stores transport condition information indicating transport conditions regarding the transport speed of the substrate for each type of the component;
At least one of the conveyance speed, acceleration, and deceleration of the board is set to a plurality of times based on assignment information indicating the type of the component to be shared in the mounting work of the plurality of component mounting machines and the conveyance condition information. a setting unit for setting each of the conveyance sections of the component mounting machine ,
The setting unit monotonically decreases at least one of the conveyance speed, the acceleration, and the deceleration toward the downstream of the component mounting line.
Board transport management device. The board transport management device according to claim 1, wherein the setting unit sets at least one of the transport speed, the acceleration, and the deceleration that satisfies the transport condition information of the component mounted on the board. . 3. The substrate transport management device according to claim 1 , wherein the storage unit includes a shape memory unit that stores shape information of the component, and a calculation unit that calculates the transport conditions based on the shape information. 4. The board transfer management device according to claim 3 , wherein the shape information includes at least one of an external shape, external dimensions, mass, center of gravity position, and mounting area of the component. It is applied to a component mounting line where multiple component mounting machines are installed in parallel to attach components to transported boards.
a storage unit that stores transport condition information indicating transport conditions regarding the transport speed of the substrate for each type of the component;
At least one of the conveyance speed, acceleration, and deceleration of the board is set to a plurality of times based on assignment information indicating the type of the component to be shared in the mounting work of the plurality of component mounting machines and the conveyance condition information. a setting section for setting each of the transport sections of the component mounting machine;
When the mounting work of the plurality of types of parts is distributed to each of the component mounting machines, the cycle time obtained by adding the mounting time required for the mounting work and the transport time required for transporting the board is the cycle time for each of the component mounting machines. An adjustment section that adjusts the distribution method so that it is evenly distributed,
Installed parts sorting system. It is applied to a component mounting line where multiple component mounting machines are installed in parallel to attach components to transported boards.
a storing step of storing transport condition information indicating transport conditions regarding the transport speed of the substrate for each type of the component;
At least one of the conveyance speed, acceleration, and deceleration of the board is set to a plurality of times based on assignment information indicating the type of the component to be shared in the mounting work of the plurality of component mounting machines and the conveyance condition information. a setting step for setting each of the conveyance sections of the component mounting machine ,
In the setting step, at least one of the transport speed, the acceleration, and the deceleration is monotonically decreased toward the downstream of the component mounting line.
Board transport management method.

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