JP2009272562A - Method of deciding mounting condition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of deciding mounting conditions for securing the maximum rate of operation in all of component mounting apparatuses and deciding mounting conditions of a component having excellent area productivity without stopping the component mounting apparatus as much as possible even during a setup change in a restricted arrangement space of the component mounting apparatus. <P>SOLUTION: The method includes: a component allocation step S4 for dividing a plurality of components mounted to the substrate of a substrate type for each substrate type for allocating to a plurality of component mounting apparatuses; and a component arrangement position decision step S6 for deciding a component arrangement position for collectively arranging the component allocated in the component allocation step for each component mounting apparatus at a component supply section for supplying components in substrate type units of the substrate to which the component is mounted. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for determining a mounting condition for mounting a component on a board, and more particularly to a mounting condition determining method for a production line having a component mounting machine that includes a plurality of transport lanes in parallel for transporting a board.

  In a component mounter that mounts electronic components on a substrate such as a printed wiring board, it is desired to produce a component mounting substrate on which a plurality of components are mounted with a shorter tact. Here, the “tact” is a mounting time which is determined for each component mounting machine and required to mount a plurality of predetermined components on one board.

For example, a component mounter in which a component to be mounted on a board is selected from a plurality of component mounters in which different sets of components are arranged in advance in the component supply unit, and the selected component mounter is selected. There has been proposed a method for producing a plurality of types of component mounting boards with a shorter tact by conveying the board to (see, for example, Patent Document 1). Thereby, the throughput of the production line (the number of produced component mounting boards per unit time) can be improved.
Japanese Patent No. 3391039

  However, when the type of the component mounting board to be produced is changed, the changeover of the parts arranged in the component supply unit of the component mounting machine is performed so that the parts corresponding to the changed board type can be mounted on the board. It is necessary to do. For this reason, the production of the board by the component mounter that is the target of the setup change must be stopped while the setup of the parts is being changed.

  In addition, there is a method of selecting a component mounter as a substrate transfer destination from among a plurality of component mounters, as described in Patent Document 1, so that it is not necessary to replace components. However, in this case, the component mounters that are not selected are in a non-operating state during that time. For this reason, there exists a problem that the operation rate of the whole component mounting machine becomes low. Furthermore, there is a problem that there is a wasteful production space including a component mounting machine in a non-operating state, and area productivity (unit time and the number of boards produced per unit area) is reduced.

  The present invention has been made in order to solve the above-described problems, and within the limited mounting space of the component mounting machine, all of the components mounting machine can be stopped without stopping as much as possible even during setup change. It is an object of the present invention to provide a mounting condition determining method for determining a mounting condition of a component that secures the maximum operating rate of the component mounting machine and that is excellent in area productivity.

  In order to achieve the above object, a mounting condition determination method according to the present invention includes mounting a component on a production line each having a plurality of transport lanes and connected to a plurality of component mounting machines for mounting components on a board. A mounting condition determining method for determining a condition, wherein each set of transport lanes forming a series of paths is included in the set so that substrates of a plurality of substrate types are transported on the plurality of transport lanes. A board type assigning step for assigning any one of the plurality of board types to the transfer lane, and a plurality of components mounted on the board of the board type for each board type, and the plurality of component mounting machines The component allocation step assigned to each component mounting unit, and the components allocated in the component allocation step for each component mounter are grouped together by the board type unit of the board on which the components are mounted on the component supply unit that supplies the components. Characterized in that it comprises a component arrangement position determining step of determining a component placement position for location.

  In the production line, when there is a change in the board type to be produced, it is placed in a component cassette or nozzle station arranged in a component supply unit of a component mounter that mounts a component on the board type. It is necessary to change the arrangement of the replacement nozzle, the support pins on the support pin plate, and the like. However, it is not necessary to stop the component mounter even while the operator is performing such a change operation. That is, components of a plurality of board types are arranged on one component mounter. For this reason, it is possible to mount a component on a substrate of another substrate type that is not a component replacement target even during the component replacement operation. Therefore, a high operating rate can be ensured without stopping all the component mounting machines even during the setup change.

  Also, the components are grouped in units of board types and arranged in the component supply unit. For this reason, since the components of the board type to be replaced can be taken out in a lump, the component replacement operation can be performed efficiently, and a high operating rate can be ensured.

  Further, since each component mounting machine includes a plurality of transfer lanes, it is possible to produce a plurality of board types on one production line. Therefore, area productivity is also improved.

  Preferably, each of the plurality of component mounting machines includes a plurality of mounting heads that alternately mount components on a substrate, and a plurality of the component supply units that respectively supply components to the plurality of mounting heads. In the component placement position determination step, the component placement for placing the components assigned in the component assignment step in units of the board types of the boards on which the components are mounted, in the component assignment unit, for each component supply unit. The position is determined.

  While parts are being replaced in each component supply unit, components of other board types that are not subject to component replacement are arranged in each component supply unit. For this reason, all the mounting heads can take out the components of the board of the other board type, and the components can be mounted on the board using all the mounting heads. Therefore, a high operating rate can be ensured without stopping all the component mounting machines even during the setup change.

  The present invention can be realized not only as a mounting condition determination method including such characteristic steps, but also as a mounting condition determination device using the characteristic steps included in the mounting condition determination method as means. Alternatively, it can be realized as a program that causes a computer to execute the characteristic steps included in the mounting condition determination method. Needless to say, such a program can be distributed via a recording medium such as a CD-ROM (Compact Disc-Read Only Memory) or a communication network such as the Internet.

  According to the present invention, within the limited placement space of the component mounter, even when the setup is being changed, the component mounter is stopped as much as possible, and the operation rate of all the component mounters is ensured to the maximum, In addition, it is possible to provide a mounting condition determination method for determining a mounting condition for a component having excellent area productivity.

  Hereinafter, a component mounting system according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is an external view showing a configuration of a component mounting system 10 that realizes a mounting condition determination method according to the present invention.

  The component mounting system 10 is a production line that mounts components on a board to produce a circuit board, and includes a mounting condition determining device 100 and a plurality of component mounting machines 200 (three component mounting machines in the example shown in FIG. 1). And.

  The mounting condition determining apparatus 100 is an apparatus that executes the mounting condition determining method according to the present invention. The mounting condition determining apparatus 100 determines mounting conditions so as to ensure a high operation rate of the component mounting machine in the entire production line and to realize excellent area productivity.

  The component mounter 200 is a device that mounts a component such as an electronic component on a substrate as a part of the component mounting system 10 in accordance with the mounting condition determined by the mounting condition determining device 100.

  Specifically, the plurality of component mounting machines 200 mount components while sending a board from upstream to downstream. That is, first, the upstream component mounter 200 receives a board and mounts the component on the board. Then, the board on which the component is mounted is sent to the component mounter 200 on the downstream side. In this way, the boards are sequentially sent to the component mounting machines 200, and the components are mounted.

  FIG. 2 is a plan view showing the main configuration inside the component mounter 200. Here, the substrate transport direction is the X-axis direction, and the front-rear direction of the component mounter orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction.

  The component mounting machine 200 includes a transport lane 215 and a transport lane 216 for transporting the two boards 21 and 22, respectively, and two mounting units 210a and 210b for mounting components on the two boards. Substrates of different substrate types can be transported on the transport lane 215 and the transport lane 216. Even if the same substrate is used, the front and back surfaces are considered to be different substrate types because the component type, the component mounting position, and the like of the components to be mounted are different.

  The transport lane 215 is disposed on the mounting unit 210a side, and the transport lane 216 is disposed on the mounting unit 210b side so as to be parallel to the X-axis direction.

  The transport lane 215 includes a fixed rail 215a and a movable rail 215b that are parallel to the X-axis direction. The position of the fixed rail 215a is fixed in advance, and the movable rail 215b is movable in the Y-axis direction according to the length of the substrate 21 to be transported in the Y-axis direction.

  Similarly to the transfer lane 215, the transfer lane 216 includes a fixed rail 216a and a movable rail 216b. The position of the fixed rail 216a is fixed in advance, and the movable rail 216b is movable in the Y-axis direction according to the length of the substrate 22 to be transported in the Y-axis direction.

  Further, the substrate 21 and the substrate 22 are independently transferred to the transfer lane 215 and the transfer lane 216, respectively.

  The two mounting units 210 a and 210 b cooperate with each other to perform mounting operations on the substrate 21 and the substrate 22.

  The mounting unit 210a and the mounting unit 210b have the same configuration. That is, the mounting unit 210a includes a component supply unit 211a, a mounting head 213a, a nozzle station 218a, and a component recognition camera (not shown). Similarly, the mounting unit 210b includes a component supply unit 211b, a mounting head 213b, a nozzle station 218b, and a component recognition camera (not shown).

  Here, a detailed configuration of the mounting unit 210a will be described. The detailed configuration of the mounting unit 210b is the same as that of the mounting unit 210a, and the detailed description thereof will not be repeated.

  The component supply unit 211a includes an array of a plurality of component cassettes 212a that store component tapes. The component tape is, for example, a plurality of components of the same component type arranged on a tape (carrier tape) and supplied in a state of being wound on a reel or the like. The parts arranged on the part tape are, for example, chips and the like, specifically, 0402 chip parts (chip parts having a size of 0.4 mm × 0.2 mm) and 1005 chip parts (1.0 mm × 0.5 mm). Size chip components). In the following description, it is assumed that a maximum of 30 types of components can be arranged in the component supply unit 211a. However, the number of parts that can be arranged is not limited to this.

  The mounting head 213a can include, for example, a maximum of 10 suction nozzles, and can mount a maximum of 10 components from the component supply unit 211a and mount them on the substrate 21 and the substrate 22.

  The nozzle station 218a is a table on which replacement suction nozzles for accommodating various types of component types are placed.

  The component recognition camera is used for photographing the component sucked by the mounting head 213a and inspecting the suction state of the component two-dimensionally or three-dimensionally.

  When components are mounted on the board, support pins that support the board from the back side are used, and the support pin plates for raising the support pins are located directly below the transfer lanes 215 and 216 (directly below the boards 22 and 21 shown in FIG. 2). ).

  The board production method of the component mounter 200 for mounting on a plurality of board types is roughly divided into two methods, a method called “synchronous mode” and a method called “asynchronous mode”. .

  The “synchronous mode” is a mode in which mounting of components is started after a board is carried into two transport lanes. That is, when the board is loaded only in one lane, the component mounting is not started. In the synchronous mode, the two mounting heads alternately mount components on the two boards. Note that the mounting order of the components by the two mounting heads is determined with respect to the one board, regarding the two boards as one large board. In the case of a component mounter having three or more transfer lanes, a mode in which component mounting is started after a board is loaded into two or more transfer lanes may be set as a synchronous mode.

  The “asynchronous mode” is a mode in which component mounting is started after a board is carried into any one of the plurality of conveyance lanes. In the asynchronous mode, two mounting heads alternately mount components on one board. That is, for example, when the board 21 is first carried into the transport lane 215, the two mounting heads perform a cooperative operation to mount components on the board 21 in the transport lane 215. Next, when the board 22 is carried into the transfer lane 216, the two mounting heads perform a cooperative operation to mount components on the board 22 in the transfer lane 216.

  The board production method by the component mounter 200 described in the present embodiment may be in any mode.

  FIG. 3 is a schematic diagram showing the positional relationship between the mounting head 213a and the component cassette 212a.

  As described above, for example, a maximum of ten suction nozzles nz can be attached to the mounting head 213a. The mounting head 213a to which the ten suction nozzles nz are attached can suck components from each of a maximum of ten component cassettes 212a at the same time (by one up and down movement).

  FIG. 4 is a diagram illustrating an example of a component tape and a reel that contain components.

  Components such as chip-type electronic components are accommodated in a storage recess 221a formed in a plurality at a constant interval on the carrier tape 221 shown in FIG. 4, and the cover tape 222 is attached to the upper surface for packaging. . The carrier tape 221 with the cover tape 222 attached in this way is supplied to the user in a taping form wound around the reel 223 by a predetermined quantity. The carrier tape 221 and the cover tape 222 constitute a component tape. The configuration of the component tape may be other than the configuration shown in FIG.

  The mounting unit 210a of such a component mounting machine 200 moves the mounting head 213a to the component supply unit 211a and causes the mounting head 213a to attract the component supplied from the component supply unit 211a. The mounting unit 210a moves the mounting head 213a onto the component recognition camera at a constant speed, causes the component recognition camera to capture images of all the components sucked by the mounting head 213a, and accurately detects the suction position of the component. Let Further, the mounting unit 210a moves the mounting head 213a to, for example, the substrate 21 and sequentially mounts all the sucked components on the mounting points of the substrate 21. The mounting unit 210a mounts all the predetermined components on the board 21 by repeatedly performing such operations of suction, movement, and mounting by the mounting head 213a. Similarly, the mounting unit 210 a mounts all predetermined components on the board 22.

  Similarly to the mounting unit 210a, the mounting unit 210b also repeatedly performs the operations of suction, movement, and mounting by the mounting head 213b to mount all the predetermined components on the substrate 21 and the substrate 22.

  Then, each of the mounting unit 210a and the mounting unit 210b sucks a component from the component supply unit when the other mounting unit is mounting a component, and conversely, the other mounting unit sucks a component from the component supply unit. When mounting the components, the components are alternately mounted on the substrate 21 and the substrate 22 so as to mount the components. In other words, the component mounter 200 is configured as a so-called alternating component mounter.

  In the present invention, for each component mounting machine 200, a target board on which a component is to be mounted is determined in advance as a mounting condition among the boards 21 and 22. In accordance with this mounting condition, the two mounting units 210a and 210b mount a component only on a board that is a component mounting target. For this reason, the board | substrate which is not made into the mounting object of components among the board | substrate 21 and the board | substrate 22 is not mounted, but the board | substrate is conveyed to the following component mounting machine.

  FIG. 5 is a block diagram showing a functional configuration of the mounting condition determining apparatus 100 in the present embodiment.

  This mounting condition determining apparatus 100 is a computer that performs processing such as determining mounting conditions so as to ensure a high operating rate of component mounting machines in the entire production line and to realize excellent area productivity. is there. The mounting condition determining apparatus 100 includes an arithmetic control unit 101, a display unit 102, an input unit 103, a memory unit 104, a program storage unit 105, a communication I / F (interface) unit 106, and a database unit 107.

  The mounting condition determining apparatus 100 is realized by a general-purpose computer system such as a personal computer executing the program according to the present invention, and is not connected to the component mounting machine 200, but is a stand-alone simulator (for mounting conditions). It also functions as a decision tool. It should be noted that the function of the mounting condition determining apparatus 100 may be provided in the component mounter 200.

  The arithmetic control unit 101 is a CPU (Central Processing Unit), a numerical processor, or the like, and loads and executes a necessary program from the program storage unit 105 to the memory unit 104 in accordance with an instruction from an operator or the like. A processing unit that controls each of the components 102 to 107.

  The display unit 102 is a CRT (Cathode-Ray Tube), an LCD (Liquid Crystal Display), or the like, and the input unit 103 is a keyboard, a mouse, or the like. These are mounted condition determination devices under the control of the arithmetic control unit 101. 100 is used for dialogue between an operator and the like.

  The communication I / F unit 106 is a LAN (Local Area Network) adapter or the like, and is used for communication between the mounting condition determining apparatus 100 and the component mounting machine 200. The memory unit 104 is a RAM (Random Access Memory) or the like that provides a work area for the arithmetic control unit 101.

  The program storage unit 105 is a hard disk or the like that stores various programs that implement the functions of the mounting condition determination apparatus 100. The program is a program for determining mounting conditions by the component mounter 200, and functionally (as a processing unit that functions when executed by the arithmetic control unit 101), the board type allocation unit 105a, the component allocation unit 105b, and the components An arrangement position determination unit 105c is included.

  The board type assigning unit 105a is a processing unit that assigns a board type to be transported to the transport lane for each transport lane that transports the same board based on transport lane data 107c described later.

  The component allocation unit 105b is a processing unit that divides a plurality of components mounted on a board of the board type for each board type and allocates the divided parts to a plurality of component mounters.

  The component arrangement position determination unit 105c arranges the components allocated by the component allocation unit 105b for each component mounting machine in a unit of the board type of the board on which the components are mounted on the component supply unit that supplies the components. It is a processing part which determines the component arrangement position.

  The database unit 107 is a hard disk or the like that stores mounting point data 107a, component library 107b, transport lane data 107c, and the like, which are data used for mounting condition determination processing by the mounting condition determination apparatus 100.

  FIG. 6 is a diagram illustrating an example of the mounting point data 107a.

  The mounting point data 107a is a collection of information indicating mounting points of all components to be mounted. One mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, control data φi, and a mounting angle θi. Here, the component type corresponds to the component name in the component library 107b shown in FIG. 7, the X coordinate and the Y coordinate are the coordinates of the mounting point (coordinates indicating a specific position on the board), and the control data is Restriction information (mounting nozzle type nz that can be used, maximum moving acceleration of the mounting head, etc.) regarding the mounting of the component is shown. The mounting angle θi indicates an angle at which the nozzle that sucks the component of the component type ci should rotate. NC (Numeric Control) data to be finally obtained is an arrangement of mounting points that minimizes the line tact. Here, the “line tact” is the maximum tact among the tacts of each component mounter included in the production line.

  FIG. 7 is a diagram illustrating an example of the component library 107b.

  The component library 107b is a library in which unique information about all component types that can be handled by the component mounter 200 is collected. As shown in FIG. 7, the component library 107b includes a component size for each component type (component name), tact (tact specific to the component type under a certain condition), and other constraint information (for usable suction nozzles nz). Type, recognition method by component recognition camera, speed level of mounting head, etc.). In the drawing, the external appearance of the components of each component type is also shown for reference. In addition, the component library 107b may include information such as the color and shape of the component.

  FIG. 8 is a diagram illustrating an example of the transportation lane data 107c.

  The transfer lane data 107c is a collection of information indicating a correspondence relationship between a transfer lane that transfers the same substrate and a substrate type that is transferred on the transfer lane. The transport lane data 107c includes “transport lane”, “substrate type”, and the like.

  The “transport lane” is a transport lane in which a substrate is transported. Specifically, the name specifies the transport lane 215 or the transport lane 216. For example, the transportation lane 215 is the F lane, and the transportation lane 216 is the R lane.

  “Substrate type” is the type of the substrate that is transported on the target transport lane. For example, the type of the substrate transported on the F lane which is the transport lane 215 is the substrate type A.

  FIG. 9 is a flowchart showing an example of the operation of the mounting condition determining apparatus 100 in the present embodiment. In the following description, it is assumed that the board types A and B are switched to the board types C and D after the production of the board types A and B in the production line, the mounting conditions of components on the boards of the board types A and B, and A method for determining the mounting conditions of components on the substrates of the substrate types C and D will be described with specific examples. Note that the mounting condition determination method described below is also applicable when only one board type is switched.

  The board type assignment unit 105a determines the transfer lane to which the board types A and B are assigned from the transfer lane data 107c (S2). For example, from the transfer lane data 107c shown in FIG. 8, it is determined that the board type A is assigned to the F lane and the board type B is assigned to the R lane.

  Next, the component allocation unit 105b is configured to mount components mounted on the substrate of the substrate type A (hereinafter referred to as “substrate type A” as appropriate) so that the number of component types is uniform among the plurality of component mounters 200 constituting the production line. This also applies to other board types.) Is divided and assigned to a plurality of component mounters 200. Similarly, for the board type B, the component allocating unit 105b divides the board type B components so that the number of component types is uniform among the plurality of component mounting machines 200 constituting the production line. Assigned to the component mounting machine 200 (S4). For example, it is assumed that the number of component types of the component of board type A is 120, and the number of component types of the component of substrate type B is 60. In this case, 40 (= 120/3) types of components of board type A are assigned to each component mounting machine 200, and 20 (= 60/3) types of components of board type B are assigned to each component mounting machine 200. Assigned. The number of component types of components mounted on each substrate type can be counted from the mounting point data 107a.

  The component arrangement position determination unit 105c determines the arrangement of the components of the board types A and B for the component supply units 211a and 211b of each component mounter 200 (S6). As shown in FIG. 10, components are mounted on the substrates of the substrate types A and B by three component mounters 200 (component mounters MC1, MC2, and MC3 in order from the top). The substrate type A substrate is transported on the F lane, and the substrate type B substrate is transported on the R lane. The mounting heads 213a and 213b included in each of the component mounting machines MC1 to MC3 mount components on both the board type A and board type B boards. By the component allocation process (S4) described above, the number of component types of the substrate types A and B allocated to each component mounter 200 is determined to be 40 types and 20 types, respectively. For this reason, as shown in FIG. 10, in each component mounter 200, the components are supplied so that the number of component types of the substrate type A and the substrate type B allocated to the component supply units 211a and 211b is equal. Assigned to the sections 211a and 211b. That is, 20 (= 40/2) types of board type A components are assigned to the component supply units 211a and 211b of each component mounting machine 200, and 10 (= 20/2) types of board type B components are assigned. Assigned. With this arrangement, the board type A components are arranged in both of the component supply units 211a and 211b. Therefore, the mounting head 213a and the mounting head 213b alternately place the components on the board type A board. Can be implemented. Similarly, since the board type B components are also arranged in both of the component supply units 211a and 211b, the mounting head 213a and the mounting head 213b can alternately mount the components on the board type B board. . That is, both the substrates of the substrate types A and B can be mounted alternately by the mounting heads 213a and 213b, so that the mounting tact can be reduced.

  As shown in FIG. 10, the component arrangement position determination unit 105c divides the component into a group of components of board type A and a group of substrate type B in each of the component supply units 211a and 211b. The part placement position is determined such that the parts are placed. That is, the board type A component and the board type B component are not mixedly arranged. Thereby, when replacing the substrate type, the components of the substrate type to be replaced can be taken out at a time, and the component replacement operation can be performed efficiently.

  Next, mounting conditions when the board type of the board to be mounted as a component is changed from the board types A and B to the board types C and D will be described. Here, it is assumed that the number of component types of the components of the substrate types C and D is 90. For this reason, after the board type of the board to be mounted is changed from the board type A to the board type C, the board type B is changed to the board type D. Note that the substrate type B may be changed to the substrate type C after the substrate type A is changed to the substrate type D.

  The reason why the substrate type A is changed prior to the substrate type B is that the substrate type B cannot be changed first. For example, consider the case where the board type B is changed to the board type C after component mounting on the boards of the board types A and B is completed. Before changing the board type, as shown in FIG. 10, there are no empty positions where components can be further arranged in the component supply units 211 a and 211 b of all the component mounting machines 200. On the other hand, the number of component types of the substrate type C is larger than the number of component types of the substrate type B. For this reason, in the component supply units 211a and 211b, if the board type B component is replaced with the board type C component, a part of the board type C component cannot be arranged. Such a situation is the same even when the substrate type B is replaced with the substrate type D.

  The board type assignment unit 105a determines the transfer lane to which the board types C and D are assigned from the transfer lane data 107c (S8). For example, by changing the board type A to the board type C, the same F lane as the board type A is assigned to the board type C. Further, since the board type B is changed to the board type D, the same R lane as the board type B is assigned to the board type D.

  Next, the component allocating unit 105b divides the board type C components so that the number of component types is uniform among the plurality of component mounters 200 constituting the production line. assign. Similarly, for the board type D, the component allocating unit 105b divides the board type D components so that the number of parts types is uniform among the plurality of component mounting machines 200 constituting the production line. Assigned to the component mounting machine 200 (S10). As described above, the number of component types of the substrate types C and D is 90, respectively. In this case, 30 (= 90/3) types of components of board type C are assigned to each component mounting machine 200, and 30 (= 90/3) types of components of board type D are assigned to each component mounting machine 200. Assigned. The number of component types of components mounted on each substrate type can be counted from the mounting point data 107a.

  The component arrangement position determination unit 105c determines the arrangement of the components of the board types C and D for the component supply units 211a and 211b of each component mounter 200 (S12). As shown in FIG. 11, the components are mounted on the substrates of the substrate types C and D by the component mounters MC1, MC2 and MC3. A substrate of substrate type C is conveyed on the F lane, and a substrate of substrate type D is conveyed on the R lane. The mounting heads 213a and 213b included in each of the component mounting machines MC1 to MC3 mount components on both the board type C and the board type D. Through the above-described component allocation process (S10), the number of component types of the substrate types C and D allocated to each component mounter 200 is determined to be 30 types. For this reason, as shown in FIG. 11, in each component mounting machine 200, the components are supplied so that the number of component types of the substrate type C and the substrate type D allocated to the component supply units 211a and 211b is equal. Assigned to the sections 211a and 211b. That is, 15 (= 30/2) types of board type C components are assigned to the component supply units 211a and 211b of each component mounting machine 200, and 15 (= 30/2) types of board type D components are assigned. Assigned. With such an arrangement, the components of the board type C are arranged in both the component supply units 211a and 211b. Therefore, the components are alternately mounted on the board of the board type C by the mounting head 213a and the mounting head 213b. Can be implemented. Similarly, since the components of the board type D are also arranged in both the component supply units 211a and 211b, the components can be alternately mounted on the board of the board type D by the mounting head 213a and the mounting head 213b. . That is, since both the boards of the board types C and D can be mounted with the mounting heads 213a and 213b alternately, the mounting tact can be reduced.

  As shown in FIG. 11, in each of the component supply units 211a and 211b, the component arrangement position determination unit 105c divides the component into a component group of the substrate type C and a group of the substrate type D, and the component is determined for each group. The part placement position is determined such that the parts are placed. That is, the board type C component and the board type D component are not mixedly arranged. Thereby, when replacing the substrate type, the components of the substrate type to be replaced can be taken out at a time, and the component replacement operation can be performed efficiently. Further, the board type to be mounted on the component is changed from the board type A to the board type C, and the board type B is changed to the board type D. For this reason, the component placement position determination unit 105c places the board type C component at the position where the board type A component is placed, and places the board type D component at the position where the board type C component is placed. The component arrangement positions in the component supply units 211a and 211b are determined so as to be arranged.

  As described above, the component placement position in the component supply unit that is the component mounting condition is determined.

  Next, a component replacement operation when replacing the board type of the component mounting target board based on the determined component placement position will be described. 12-14 is a figure for demonstrating an example of component replacement work.

  As shown in FIG. 12, when the component mounting operation on the substrate of the board type A is completed, the operator installs 20 types of parts of the board type A in each of the component supply units 211a and 211b of the component mounting machines MC1 to MC3. Fifteen types of components of board type C are arranged at the positions where the removed and removed components are arranged. The mounting heads 213a and 213b can continue to operate during the component replacement operation, and the component mounting operation to the substrate of the substrate type B is continued.

  When the mounting operation of the component of the board type C is completed, the component mounters MC1 to MC3 are in a state as shown in FIG. That is, the board types B and C are arranged in the component supply units 211a and 211b, the board type C board is transferred to the F lane, and the board type B board is transferred to the R lane. In this state, components are mounted on the board types B and C by the mounting heads 213a and 213b.

  Next, when the component mounting operation on the substrate of the board type B is completed, as shown in FIG. 14, the operator can select 10 types of the board type B in each of the component supply units 211a and 211b of the component mounting machines MC1 to MC3. The 15 parts of the board type D are placed at the positions where the removed parts are placed. The mounting heads 213a and 213b can continue to operate during the component replacement operation, and the component mounting operation to the substrate of the substrate type C is continued.

  When the mounting operation of the component of the board type D is completed, the component mounters MC1 to MC3 are in a state as shown in FIG. That is, the components of the substrate types C and D are arranged in the component supply units 211a and 211b, the substrate of the substrate type C is transferred to the F lane, and the substrate of the substrate type D is transferred to the R lane. In this state, components are mounted on the board types C and D by the mounting heads 213a and 213b.

  FIG. 15 is a flowchart showing the operation of the component mounter 200.

  The component mounter 200 mounts components on the board in accordance with the mounting conditions determined by the mounting condition determination apparatus 100.

  The component mounting machine 200 waits until the board is carried in (S32), and when the board is carried in (YES in S32), the control unit (not shown) of the component mounting machine 200 determines that the board loaded is the component. It is determined whether or not the board type is a mounting target (S34). Whether or not the board type is a component mounting target is determined by the difference in the loading lane into which the board is loaded. For example, considering a case where a production line is formed by three component mounters 200 (MC1 to MC3) as shown in FIG. 12, each component mounter 200 receives a board in the F lane. In the case where it is determined that the board that has been loaded is not the board type that is the component mounting target, and the board is loaded into the R lane, the loaded component is the board type that is the component mounting target (that is, board type B). ).

  If the board that has been carried in is the board type to be mounted on the component (YES in S34), the component mounter 200 mounts the component on the board and sends it downstream (S36). If the board that has been loaded is not a board type that is a component mounting target (NO in S34), the component mounter 200 sends out the board downstream without mounting the component on the board (S38).

  The component mounter 200 repeatedly executes the above processing (S32 to S38) until the production of all the boards is completed (S40).

  As described above, according to the present embodiment, when there is a change in the board type to be produced in the production line, it is arranged in the component supply unit of the component mounter that mounts the component on the board type. It is necessary to change the parts cassette, the replacement nozzle placed on the nozzle station, the arrangement of the support pins on the support pin plate, and the like. However, it is not necessary to stop the component mounter even while the operator is performing such a change operation. That is, components of a plurality of board types are arranged on one component mounter. For this reason, it is possible to mount a component on a substrate of another substrate type that is not a component replacement target even during the component replacement operation. Therefore, a high operating rate can be ensured without stopping all the component mounting machines even during the setup change.

  Also, the components are grouped in units of board types and arranged in the component supply unit. For this reason, since the components of the board type to be replaced can be taken out in a lump, the component replacement operation can be performed efficiently, and a high operating rate can be ensured.

  Further, since each component mounting machine includes a plurality of transfer lanes, it is possible to produce a plurality of board types on one production line. Therefore, area productivity is also improved.

  The mounting condition determination method according to the present invention has been described above by using the embodiment, but the present invention is not limited to this embodiment.

  For example, in the present embodiment, the component mounter 200 includes two transport rails, but the number of transport rails may be three or more. For example, even when the component mounting machine 200 includes three transport rails, the components may be mounted only on the board transported to the two transport rails. When there are three or more transfer lanes, there may be three or more substrate types.

  In the present embodiment, the component mounter 200 is an alternating component mounter. However, the component mounter 200 is not limited to an alternate component mounter, and is mounted on one board. On the other hand, it may be a component mounter that mounts components with one mounting head.

  In the component placement position determination process (S6 and S12 in FIG. 9), instead of placing a plurality of board types of components in each component supply unit as shown in FIGS. 10 and 11, the following is performed. Parts may be placed. That is, as shown in FIG. 16, only one board type component is arranged in one component supply unit, and different board type components are arranged in the component supply unit 211a and the component supply unit 211b. Good. As a result, a plurality of board types can be arranged on one component mounting machine, so that even when a board of a certain board type (for example, board type E) is being replaced, A component of a seed (for example, a substrate type F) can be taken out from the component supply unit and mounted on the substrate. Further, when replacing the board type, it is only necessary to replace the component for only one component supply unit for each component mounting machine 200. For this reason, the trouble of replacing parts is reduced.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be applied to a mounting condition determination method in a production line having a component mounting machine that includes a plurality of transport lanes in parallel for transporting boards, and in particular, mounting condition determination that can improve the throughput of the entire production line. Applicable to methods.

1 is an external view showing a configuration of a component mounting system according to an embodiment of the present invention. It is a top view which shows the main structures inside a component mounting machine. It is a schematic diagram which shows the positional relationship of a mounting head and a component cassette. It is a figure which shows the example of the component tape and the reel which accommodated components. It is a block diagram which shows the function structure of the mounting condition determination apparatus in this Embodiment. It is a figure which shows an example of mounting point data. It is a figure which shows an example of a component library. It is a figure which shows an example of conveyance lane data. It is a flowchart which shows an example of operation | movement of the mounting condition determination apparatus in this Embodiment. It is a figure for demonstrating the arrangement | positioning determination processing (S6 of FIG. 9) of the components of board | substrate types A and B. FIG. It is a figure for demonstrating the arrangement | positioning determination processing (S12 of FIG. 9) of the components of the board | substrate types C and D. FIG. It is a figure for demonstrating the component replacement | exchange operation | work after the completion of the component mounting operation | work to the board | substrate of the board | substrate type A. FIG. It is a figure which shows the components arrangement | positioning in the component supply part after replacing | exchanging the components of the component supply part from the component of the board | substrate type A to the component of the board | substrate type C. It is a figure for demonstrating the component replacement | exchange operation | work after the completion of the component mounting operation | work to the board | substrate of the board | substrate type B. FIG. It is a flowchart which shows operation | movement of a component mounting machine. It is a figure for demonstrating the modification of the component supply position in a component supply part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Component mounting systems 21 and 22 Board | substrate 100 Mounting condition determination apparatus 101 Operation control part 102 Display part 103 Input part 104 Memory part 105 Program storage part 105a Board type allocation part 105b Component allocation part 105c Component arrangement position determination part 106 Communication I / F Unit 107 database unit 107a mounting point data 107b component library 107c transport lane data 200, MC1 to MC3 component mounters 210a, 210b mounting units 211a, 211b component supply units 212a, 212b component cassettes 213a, 213b mounting heads 215, 216 transport lanes

Claims (8)

A mounting condition determination method for determining a mounting condition of a component in a production line each having a plurality of transfer lanes and connecting a plurality of component mounters for mounting a component on a board,
Each of the plurality of substrate types is included in the transport lane included in the set for each set of transport lanes that form a series of paths so that the substrates of the plurality of substrate types are transported on the plurality of transport lanes. A board type assignment step for assigning one;
For each board type, divide a plurality of components mounted on the board of the board type, and assign components to the plurality of component mounters;
A component that determines a component arrangement position for arranging the components allocated in the component allocation step for each component mounting machine in a unit of the board type of the board on which the components are mounted in the component supply unit that supplies the components. A mounting condition determining method comprising: an arrangement position determining step. Each of the plurality of component mounting machines includes a plurality of mounting heads that alternately mount components on a substrate, and a plurality of the component supply units that respectively supply components to the plurality of mounting heads.
In the component placement position determination step, the component placement for placing the components assigned in the component assignment step in units of the board types of the boards on which the components are mounted, in the component assignment unit, for each component supply unit. The mounting condition determining method according to claim 1, wherein the position is determined. In the substrate type assigning step, the substrate type after replacement is assigned to the substrate type after replacement when any one of the plurality of substrate types is replaced with another substrate type. Assigned to a transport lane included in the set of lanes,
In the component allocation step, further, a plurality of components mounted on the substrate of the substrate type after the replacement are divided and allocated to the plurality of component mounting machines,
In the component arrangement position determination step, the component mounted on the board of the board type after replacement is further arranged at the arrangement position in the component supply unit of the component mounted on the board of the board type to be replaced. The mounting condition determining method according to claim 1, wherein a component arrangement position for determining the mounting condition is determined. In the component assignment step, for each board type, a plurality of parts mounted on the board of the board type are divided so that the number of parts assigned between the plurality of component mounters is equal, and the plurality of parts It assigns to a mounting machine. The mounting condition determination method of any one of Claims 1-3 characterized by the above-mentioned. A mounting condition determining device that determines a mounting condition of a component in a production line each having a plurality of transfer lanes and connected with a plurality of component mounting machines for mounting components on a board,
Each of the plurality of substrate types is included in the transport lane included in the set for each set of transport lanes that form a series of paths so that the substrates of the plurality of substrate types are transported on the plurality of transport lanes. A board type assigning means for assigning one;
For each board type, a component allocation unit that divides a plurality of components mounted on the board of the board type and assigns the components to the plurality of component mounting machines;
A component that determines the component placement position for arranging the components allocated by the component allocation means for each component mounting machine in a unit of board type of the board on which the components are mounted in the component supply unit that supplies the components. A mounting condition determining device comprising: an arrangement position determining means. A component mounting method for mounting components in a production line, each of which has a plurality of transfer lanes, and a plurality of component mounters for mounting components on a board are connected,
5. For each of the component mounting machines, the component is taken out from the component supply unit in which the component is arranged at the component arrangement position determined by the mounting condition determining method according to any one of claims 1 to 4, and the removed component is a substrate. A component mounting method comprising a mounting step for mounting on a component. A component mounter in a production line, each having a plurality of transfer lanes, and a plurality of component mounters for mounting components on a board connected to each other,
A component supply unit in which a component is arranged at a component arrangement position determined by the mounting condition determination method according to any one of claims 1 to 4,
A component mounting machine comprising: mounting means for taking out a component from the component supply unit and mounting the taken out component on a substrate. A program for determining component mounting conditions in a production line each having a plurality of transfer lanes and connected to a plurality of component mounters for mounting components on a board,
Each of the plurality of substrate types is included in the transport lane included in the set for each set of transport lanes that form a series of paths so that the substrates of the plurality of substrate types are transported on the plurality of transport lanes. A board type assignment step for assigning one;
For each board type, divide a plurality of components mounted on the board of the board type, and assign components to the plurality of component mounters;
A component that determines a component arrangement position for arranging the components allocated in the component allocation step for each component mounting machine in a unit of the board type of the board on which the components are mounted in the component supply unit that supplies the components. A program for causing a computer to execute an arrangement position determining step.

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