JP2009043947A - Mounting facility, mounting machine, mounting line, mounting work optimizing equipment, and mounting work optimizing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide mounting work optimizing equipment that can improve productivity. <P>SOLUTION: The present invention aims at mounting work optimizing equipment for a mounting facility in which a plurality of mounting work sections each having a component supply means, a component recognition means, and head units A to D are prepared. The mounting work optimizing equipment has an advantage portion information acquisition means for acquiring information about a mounting advantage portion set up for each of the head units A to D, a component information acquisition means for acquiring component information on each component, an allocating means for allocating each of the head units A to D to each region made by dividing a substrate into multiple regions based on information of the mounting advantage portion, and a specifying means for specifying each of the head units A to D that performs mounting work on each component based on the divided regions to which the head units A to D are allocated and the component information. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a mounting facility, a mounting machine, a mounting line, a mounting work suitability apparatus, and a mounting work suitability method for optimizing mounting work.

  In a mounting machine that mounts electronic components on a printed circuit board using a head unit, a number of methods for optimizing mounting work in consideration of the amount of movement of the head unit have been proposed for the purpose of improving productivity.

For example, in the mounting work suitability method disclosed in Patent Document 1, in a mounting machine having a head unit capable of simultaneously sucking a plurality of components, a plurality of components whose mounting positions on a board are close to each other are set as the same suction group. Are simultaneously adsorbed and mounted on a substrate.
Patent No. 3767390 (Claims)

  However, in the technical field of electronic component mounting, the present situation is that improvement of productivity is pursued as much as possible by optimizing mounting work.

  The present invention has been made in view of the above problems, and an object thereof is to provide a mounting facility, a mounting machine, a mounting line, a mounting work suitability apparatus, and a mounting work suitability method capable of improving productivity. And

  The present invention provides the following means.

[1] A component supply unit for supplying a component, a component recognition unit for recognizing a component, a component supplied from the component supply unit is picked up and recognized by the component recognition unit, and then the component is placed on the mounting work area. A mounting work suitability apparatus for mounting equipment provided with a plurality of mounting work units having a head unit to be mounted on a substrate,
For each head unit, a superior part information acquisition unit that acquires information about a mounting superior part that is set based on the position of the corresponding component recognition unit and the mounting work area, and that indicates a portion that can be effectively mounted;
For each component, component information acquisition means for acquiring component information associated with the mounting position on the board;
Based on the information of the mounting superior part, the board is divided into a plurality of areas, and an allocation unit that allocates a corresponding head unit for each divided area;
A mounting work suitability apparatus comprising: a specifying unit that specifies a head unit for performing a mounting work for each component based on a divided area to which the head unit is allocated and component information.

  [2] The mounting work optimizing device according to item 1 above, wherein the specifying unit specifies a head unit allocated to the divided area as a head unit that performs a mounting operation on a component mounted in one divided area. .

  [3] The specifying unit is a head unit assigned to a divided region including an average position of the mounting positions of each component as a head unit that performs mounting work on a plurality of components of the same type that are mounted. The mounting work suitability apparatus according to the preceding item 1 or 2, which specifies

  [4] The specifying means assigns each component to the divided region including the mounting position of each component as a head unit for performing mounting on each component that is the same type of component and is mounted in each of the plurality of divided regions. 4. The mounting work suitability apparatus according to any one of the preceding items 1 to 3, wherein each mounted head unit is specified.

[5] A mounting facility for mounting components on a board,
The mounting work suitability apparatus according to any one of the preceding items 1 to 4 is provided.
Mounting equipment characterized by the suitability of its own mounting work by the mounting work suitability device.

[6] A component supply unit that supplies a component, a component recognition unit that recognizes the component, and picks up the component supplied from the component supply unit and causes the component recognition unit to recognize the component. A mounting work suitability method for mounting equipment provided with a plurality of mounting work units having a head unit to be mounted on a substrate,
For each head unit, based on the corresponding component recognition means and the position of the mounting work area,
Preliminarily setting information about a mounting superior part indicating a portion that can be effectively mounted, and obtaining information of the mounting superior part;
For each component, obtaining component information associated with the mounting position on the board;
Based on the information of the mounting superior part, the substrate is divided into a plurality of areas, and the allocation means for allocating the corresponding head unit to each divided area,
A mounting work suitability method comprising: a specifying unit that specifies a head unit for performing a mounting operation for each component based on a divided area to which the head unit is allocated and component information.

[7] A mounting machine for mounting components on a board,
Comprising storage means for storing the component and head unit related information output from the mounting work suitability apparatus according to any one of items 1 to 4;
A mounting machine in which a mounting operation is performed according to information related to components and a head unit in a storage unit.

[8] A mounting line including a mounting machine for mounting components on a board,
Comprising storage means for storing the component and head unit related information output from the mounting work suitability apparatus according to any one of items 1 to 4;
A mounting line in which mounting work is performed by a mounting machine in accordance with information related to components and head units in a storage means.

  The mounting process suitability apparatus according to the above invention [1] can shorten the moving distance of the head unit from component recognition to component mounting, and can improve production efficiency.

  According to the mounting process optimizing apparatus according to the invention [2], the components can be mounted by an appropriate head unit, and the production efficiency can be further improved.

  According to the mounting process suitability apparatus according to the above invention [3], it is possible to efficiently mount components mounted in a wide range, and the production efficiency can be further improved.

  According to the mounting process optimizing apparatus according to the invention [4], each component mounted in a wide range can be mounted by an appropriate head unit, and the production efficiency can be further improved.

  According to the mounting equipment according to the invention [5], the production efficiency can be improved as described above.

  According to the mounting work suitability method according to the invention [6], the production efficiency can be improved as described above.

  With the mounting machine according to the invention [7], the mounting work can be performed efficiently.

  With the mounting line according to the invention [8], the mounting operation can be performed efficiently.

  Similarly to the above, production efficiency can be improved.

  FIG. 1 is a plan view showing a mounting machine M in which mounting work suitability is achieved by a mounting work suitability apparatus 7 according to an embodiment of the present invention. As shown in the figure, this mounting machine (mounting equipment) M includes a substrate transport path 2 for transporting a substrate disposed along the X-axis direction and two front sides provided on the front side of the substrate transport path 2. Mounting tables 1A, 1C, two rear-side mounting tables 1B, 1D provided on the rear side of the board transport path 2, component supply units 3 provided in the mounting tables 1A-1D, and each mounting table 1A ˜1D are provided, and the electronic component mounting head units A to D are provided.

  The substrate transport path 2 is configured by a conveyor or the like capable of transporting the printed circuit board W from the upstream side (right side in FIG. 1) to the downstream side (left side) substrate unloading portion along the X-axis direction. Yes.

  The mounting tables 1A to 4D are alternately arranged on both sides of the substrate transport path 2 in the order of the front side (lower side in FIG. 1) and the rear side (upper side) along the X-axis direction.

  The component supply units 3 are provided on the front side of the front side mounting tables 1A and 1C and on the rear side of the rear side mounting tables 1B and 1D, respectively.

  The component supply units 3 and 3 of the front mounting tables 1A and 1C are provided with component recognition cameras 5 and 5 including line sensors or the like as component recognition means on the downstream side along the X-axis direction. As will be described later, the component recognition cameras 5 and 5 can recognize and recognize the components transferred by the head units A and C of the front side mounting tables 1A and 1C from the lower side.

  Further, a plurality of tape feeders 31 are arranged in parallel and attached to the component supply units 3 and 3 of the front side mounting tables 1A and 1C as component supply means, except for the region where the component recognition cameras 5 and 5 are installed. It has been.

  The component supply units 3 and 3 of the rear mounting tables 1B and 1D are provided with component recognition cameras 5 and 5 including line sensors or the like as component recognition means on the upstream side in the X-axis direction. As will be described later, the component recognition cameras 5 and 5 can recognize and recognize the components transferred by the head units B and D of the rear mounting tables 1B and 1D from the lower side.

  Further, a plurality of tape feeders 31 are arranged in parallel and attached to the component supply units 3 and 3 of the rear side mounting tables 1B and 1D as component supply means, except for the region where the component recognition cameras 5 and 5 are installed. It has been.

  In the present invention, a tray feeder in which component supply containers such as pallets are stacked can also be employed as the component supply means.

  Each of the mounting tables 1A to 1D is provided with mounting work areas 15 in the vicinity of the component supply units 3. As will be described later, in each of the mounting tables 1A to 1D, mounting work (mounting processing) is performed on the printed circuit board W arranged in the mounting work area 15.

  Each of the mounting tables 1A to 1D is provided with Y-axis transfer means (not shown) for transferring the printed circuit board W on the board transfer path 2 along the Y-axis direction orthogonal to the X-axis direction in the horizontal plane. When the printed circuit board W is transported along the circuit board transport path 2 to a position corresponding to each of the mounting tables 1A to 1D, the printed circuit board W is mounted on the mounting tables 1A to 1D by the Y-axis transfer means. The printed board W is returned to the board conveyance path 2 by the Y-axis transfer means after being transferred to the region 15 and after the mounting operation is completed.

  The head units A to D can pick up a component from the tape feeder 31 of the corresponding component supply unit 3 and mount the component on the printed circuit board W on the mounting work region 15. The area over 15 can be moved. Specifically, on each of the mounting tables 1A to 1D, head unit support members 45 that extend in the X-axis direction are supported movably in the Y-axis direction by using a Y-axis motor (not shown) as a drive source. The head unit supporting members 45... Support head units A to D movably in the X-axis direction using an X-axis motor (not shown) as a drive source.

  Each head unit A to D is mounted with a plurality of heads (not shown) arranged in the X-axis direction. Each head is driven in the Z-axis direction (up and down direction) by an elevating mechanism (not shown) using a Z-axis motor as a drive source, and is rotated by a rotary drive mechanism (not shown) using an R-axis motor as a drive source. It is driven in the direction (rotation direction around the vertical axis).

  Each head is equipped with a suction nozzle (not shown) for sucking and sucking electronic components.

  The head units A to D are provided with, for example, a substrate recognition camera (not shown) made up of a CCD camera or the like, and the substrate recognition camera images the components supplied from the printed circuit board W or the tape feeder 31. Can be recognized.

  FIG. 2 is a block diagram showing a control system of the mounting machine M. As shown in the figure, the mounting machine M of the present embodiment includes a controller (control device) 6 composed of a personal computer or the like, and the operation of each operation unit of the mounting machine M is controlled by the controller 6.

  The controller 6 includes an arithmetic processing unit 60, a mounting program storage unit 63, a conveyance system data storage unit 64, a motor control unit 65, an external input / output unit 66, an image processing unit 67, and a server communication unit 68.

  The arithmetic processing unit 60 comprehensively manages various operations of the mounting tables 1A to 1D included in the mounting machine M.

  The mounting program storage unit 63 stores a mounting program for mounting each electronic component on the printed circuit board W. This mounting program includes the type and size of electronic components to be mounted, the position where each electronic component is supplied (suction position coordinates), the suction sequence of each electronic component, and the mounting point (mounting position) on the board on which each component is mounted. Information on recognition setting information necessary for recognizing (coordinates) and orientation, the mounting order of each component, the component type, and the like.

  In the present embodiment, the mounting program storage unit 63 constitutes a storage unit that stores the relevant information of the components and the head unit output from the mounting work suitability apparatus 7.

  The transfer system data storage means 64 stores various data related to the transfer of the substrate W on the production line.

  The motor control unit 65 controls the operation of the drive motors and the like of the XYZR axes of the head units A to D (heads) of the mounting tables 1A to 1D.

  The external input / output unit 66 inputs / outputs various types of information to / from various sensors included in the mounting machine M and a driving unit such as a stopper.

  The image processing unit 67 processes image data captured by the component recognition camera 5 and the board recognition camera of each of the mounting tables 1A to 1D.

  The server communication means 68 is a computer such as a print server, a file server, and a database server, a host computer or the like, a computer as a controller for other equipment, and various data via a network line such as a LAN. Send and receive.

  The controller 6 is connected to an input unit 61 such as a keyboard and a mouse for inputting various information, and a display unit 62 such as a liquid crystal display for displaying various information.

  The configuration of the mounting tables 1B to 1D is substantially the same as that of the mounting table 1A. Therefore, in FIG. 2, the detailed configuration of the mounting tables 1B to 1D is not shown in order to avoid duplication.

  In the mounting machine M of the present embodiment, the driving is controlled by the controller 6 based on the mounting program, and the mounting work is automatically performed.

  In the mounting operation, after the printed circuit board W is transported to the position corresponding to the mounting table 1A along the substrate transport path 2, the printed circuit board W is transferred to the mounting work area 15 of the mounting table 1A by the Y-axis transport means. Is done.

  Next, the head unit A moves to the component supply unit 3 and the first component supplied from the predetermined tape feeder 31 of the component supply unit 3 by the first head of the head unit A as shown in FIG. Is adsorbed. In the same manner, the components sequentially supplied from the predetermined tape feeder 31 are sequentially sucked by the remaining heads of the head unit A. In FIG. 3, N heads are provided in the head unit A, and N parts picked up at the same time form the same picking group.

  When all the parts in the same suction group are picked up, the head unit A passes over the part recognition camera 5 and all the parts picked up by each head of the head unit A are sequentially recognized. Thereafter, the head unit A moves to the position of the printed circuit board W, and the components sucked by the heads of the head unit A are sequentially mounted at predetermined positions on the printed circuit board W.

  Such an operation is repeatedly performed, and predetermined components are mounted on the printed circuit board W in the mounting table 1A.

  Thereafter, after the printed board W is returned to the board conveyance path 2 by the Y-axis transfer means, the printed board W is conveyed along the board conveyance path 2 to a position corresponding to the mounting table 1B. Subsequently, the printed circuit board W is transferred to the mounting work area 15 of the mounting table 1B by the Y-axis transfer means, and the components are mounted on the mounting table 1B as described above.

  In this way, after predetermined components are sequentially mounted on the printed circuit board W by the mounting tables 1B to 1D, they are carried out downstream along the substrate transport path 2. In the present embodiment, the mounting operations for the printed circuit board W are simultaneously performed in parallel on each of the mounting tables 1A to 1D.

  On the other hand, in the present embodiment, as shown in FIGS. 4 and 5, a mounting work suitability apparatus 7 is provided for optimizing the mounting work by the mounting machine M. This mounting work suitability apparatus 7 is constituted by a personal computer or the like, such as a controller (computer) provided in each facility such as the mounting machine M, or a host computer (host computer) that supervises these computers. It is connected to another computer or the like via a network line such as a LAN.

  The mounting work suitability apparatus 7 does not necessarily need to be connected to another computer, and may be arranged in an independent state with respect to other devices.

  In the present invention, the mounting work suitability apparatus 7 can also be configured by the controller 6 of the mounting machine M.

  The mounting work suitability apparatus 7 includes an arithmetic processing unit 70, data storage means 73, and a mounting work suitability part 74.

  The arithmetic processing unit 70 comprehensively manages various operations of the mounting work suitability apparatus 7.

  The data storage unit 73 holds various data necessary for the suiting process, for example, information such as a mounting program of the mounting machine M.

  The mounting work suitability unit 74 includes a program for executing the suitability of the mounting work, and various types of information are processed by the arithmetic processing unit 70 in accordance with this program. Appropriate mounting work can be achieved.

  Further, an input unit 71 such as a keyboard and a mouse for inputting various information is connected to the mounting work suitability apparatus 7 and a display unit 72 such as a liquid crystal display for displaying various information is connected. ing.

  In the present embodiment, the mounting work optimizing device 7 such as a personal computer for optimizing the mounting work functions as a superior part information acquiring unit, a component information acquiring unit, an allocating unit, and a specifying unit.

  Next, a case where the mounting work suitability of the mounting machine M is optimized using the mounting work suitability apparatus 7 will be described.

  When the mounting work suitability apparatus 7 starts the mounting work suitability program, as shown in FIG. 6, the mounting program of the mounter M as the suitability target is read (step S1).

  For example, the mounting program can be obtained from a host computer or another computer such as the controller 6 of the mounting machine M via a LAN or Internet network line, or can be a recording medium such as a CD-ROM, DVD-ROM, or diskette. Obtained from a storage device such as a hard disk.

  Next, the spec information (information about the mounting superior part) set in each mounting machine M is read (step S2).

  In the present embodiment, the spec information is information relating to a mounting superiority part that is preset for each head unit A to D of the mounting machine M and indicates a portion that can be efficiently mounted in each head unit A to D. In the present embodiment, the spec information is obtained according to what positional relationship the position of the component recognition camera 5 is with respect to the mounting work area 15. For example, when the position of the component recognition camera 5 is arranged at a position biased to the downstream side in the X-axis direction with respect to the mounting work area 15, the downstream (left side) portion becomes the mounting dominant portion. Information that the left side is the mounting superior part is set as the specification information. That is, the spec information is information indicating a portion that can be efficiently moved when the head units A to D are moved from the position of the component recognition camera 5 for mounting. The movement of the head units A to D from the component recognition camera 5 to the component mounting position is an operation that requires a relatively long time. By shortening the movement time, the mounting operation time can be greatly shortened.

  The specification information will be described more specifically. In the head units A and C of the front side mounting tables 1A and 1C of the mounting machine M of the present embodiment, the component recognition cameras 5 and 5 are located downstream along the X-axis direction. As shown in FIG. 7, in the head units A and C, spec information is set that the downstream (left side) portion is a mounting superior portion that can be mounted efficiently. Yes. Further, in the head units B and D of the rear side mounting tables 1B and 1D, the component recognition camera is arranged at a position biased upstream along the X-axis direction. Spec information is set that the side (right side) portion is a mounting superior portion that can be mounted efficiently.

  The spec information is set in advance for each head unit as described above, and the spec information is read into the mounting work suitability apparatus 7 as described above.

  In addition, another example of the mounting superiority part (spec information) will be described. As shown in FIG. 19, in the mounting machine M provided with one mounting table 1A, one head unit A, and one component recognition camera 5, mounting work is performed. When the component recognition camera 5 is set in the vicinity of the front side of the area 15, the mounting machine (mounting work unit) is set with specification information that the front side is the mounting dominant part.

  Furthermore, as shown in FIG. 20, in the mounting machine M in which the mounting table 1A and the head unit A are provided one by one and the two component recognition cameras 5 and 5 are provided, Spec information that the front side is the mounting superior part is set.

  In the present invention, the spec information is provided for each head unit. Even when the number of head units installed is larger than the number of installation tables, the specification information is provided for each head unit, that is, the number of head units installed. Correspondingly, a mounting superior part (spec information) is set. For example, as shown in FIG. 21, in the mounting machine M provided with one mounting table 1A, two head units A and B, and two component recognition cameras 5 and 5, two mounting superior parts are set. That is, since the front-side component recognition camera 5 is disposed in the vicinity of the front side of the mounting work area 15, the front-side head unit A corresponding to the front-side component recognition camera 5 has a specification that the front side is the mounting dominant portion. Information is set. Further, since the rear component recognition camera 5 is disposed in the vicinity of the rear side of the mounting work area 15, the rear head unit B corresponding to the rear component recognition camera 5 is the mounting dominant portion. The spec information is set.

  In the present invention, the mounting work unit includes a component supply means (component supply unit), a mounting work area, and a head unit. In this embodiment, the mounting work unit corresponds to a mounting table. However, in the present invention, the mounting operation unit does not necessarily correspond to the mounting table. For example, as shown in FIG. 21, when a plurality of head units A and B are provided on one mounting table 1A, it is assumed that each head unit A and B is also used as the mounting work area 15. Thus, in the present invention, a mounting work unit is provided for each head unit, and a plurality of mounting work units may be provided in one mounting table. For reference, the mounting machine M of FIG. 21 has a plurality of mounting working units, and therefore the present invention can be applied even when used alone.

  As shown in FIG. 6, when the spec information is read, the printed circuit board W to be mounted is divided (segmented) into a plurality of areas based on the spec information (step S3).

  That is, since the head units A and C hold the specification information that the left side is the mounting dominant portion and the head units B and D are the right mounting dominant portion, the printed circuit board W is shown in FIG. As shown, it is divided into a left side (downstream side) and a right side (upstream side). In the present embodiment, among the divided areas, the left area is referred to as a divided area (partition area) “1”, and the right area is referred to as a divided area (partition area) “2”.

  In this embodiment, as will be described in detail later, the component P whose mounting coordinates are included in the divided area “1” is basically mounted by the head units A and C, and the mounting coordinates are divided into the divided area “1”. The component P included in “2” is basically mounted by the head units B and D. In other words, the divided area “1” is a priority area for the head units A and C, and the divided area “2” is a priority area for the head units B and D.

  In this embodiment, one unit (group) processed by the head units A and C is referred to as a processing unit “1”. Similarly, one unit (group) processed by the head units B and D is referred to as a processing unit “2”.

  After the printed circuit board W is divided into the divided areas “1” and “2”, initial distribution is performed (step S4 in FIG. 6).

  In this initial distribution, based on the mounting coordinates (mounting position) of components included in the mounting program, it is determined which processing unit “1” or “2” is used to process each component.

  If a specific example is given and demonstrated, as shown in FIG. 15, the component information contained in a mounting program will be read. The component information includes component information in which mounting coordinates (X, Y, Z) and component types (component types) “a” to “e” are associated with each of the mounting points “P0” to “P8”. include.

  In the present embodiment, the mounting points “P0” to “P8” are unique symbols set for each component, correspond to the registration number of the component in the mounting program, and are generally used synonymously with the component. . In this embodiment, when the mounting points “P0” to “P8” shown in FIG. 15 are indicated by positions on the printed circuit board W, it will be assumed that they are arranged (mounted) as shown in FIG.

  Subsequently, the parts are sorted in order of frequency of use, and the index number “j” is added to the mounting points (parts) in descending order of frequency of use (step S41 in FIG. 9).

  For example, as shown in FIG. 15, the component type “a” has one mounting point “P0”, so the usage frequency is “1”, and the component type “b” has the mounting point “P3” and the usage frequency. Is “1”, the component type “c” is “P2”, “P4”, “P5”, “P8” and the usage frequency is “4”, and the component type “d” is “P7” and the usage frequency is “P7”. For “1” and component type “e”, the mounting points are “P1” and “P6” and the usage frequency is “2”. Further, as shown in FIG. 16, the mounting points are sorted in order of use frequency based on the use frequency for each component type, and an index number “j” is added in order of use frequency.

  Here, when there are a plurality of usage frequencies such as the component type “c” or “e”, the mounting point numbers “P0” to “P8” are prioritized and arranged in the order of the mounting point numbers for each component type. Furthermore, in the case of mounting points with the same usage frequency, such as component types “a”, “b”, and “d”, the mounting point numbers “P0” to “P8” are prioritized and arranged in the order of mounting point numbers.

  Thus, after the mounting points (parts) are sorted according to the usage frequency, initial priority distribution is performed (step S42).

  As shown in FIG. 10, in the initial priority distribution, first, the index number “j” is set to “1” (step S421), and the first part to be processed is selected.

  Then, it is determined whether or not the component to be processed is a restricted component (step S422).

  Here, in the present embodiment, the constrained component is a component in which the head unit that can be handled is limited in terms of the performance of the apparatus (in terms of specifications). For example, a part that can be picked up only by a specific suction nozzle mounted on the head of a predetermined head unit, a part that can be recognized only by a specific part recognition camera corresponding to the predetermined head unit, and a predetermined head unit It is a component stored in a component supply means that can be set only in a specific component supply unit.

  If the component is a restricted component (YES in step S422), whether or not component supply means (tape feeder or the like) for the component can be installed in the component supply unit corresponding to the head unit capable of mounting the component. Determination is made (step S423).

  If it cannot be installed (NO in step S423), the mounting machine M cannot mount the component and cannot produce the planned printed board W, resulting in an error (step S13 in FIG. 6). When an error occurs, the suiting process is stopped (terminated), and information for notifying the error, information regarding the error content, and the like are displayed on the display unit 72, or an alarm sound is generated.

  If the component supply means for the component can be installed in the component supply section of the corresponding head unit (YES in step S423), the processing unit number to which the corresponding head unit belongs is assigned (step S424).

  In this embodiment, when there are a plurality of assignable processing units (divided regions) in one restricted component, based on the component information, the processing unit corresponding to the divided region including the mounting coordinates of the component, Alternatively, a processing unit corresponding to the divided area closest to the component mounting coordinates is assigned.

  After the processing unit number is assigned to the part, or when the part is not a restricted part (NO in step S422), the priority distribution to the part ends.

  Next, when there is a remaining part to be preferentially distributed (NO in step S425), one index number “j” is added (step S426), and preferential distribution is performed for the next part in the same manner as described above. (Steps S422 to S424).

  When priority distribution is performed for all parts in this way (YES in step S425), initial priority distribution is completed.

  In the specific examples shown in FIGS. 14 to 16, all the components to be mounted are not restricted components.

  As shown in FIG. 9, when the initial priority distribution is completed (step S42), the initial first distribution is performed (step S43).

  As shown in FIG. 11, in the initial first distribution, first, the index number “j” is set to “1” (step S431), and the first part to be processed is selected.

  In the initial first distribution, it is determined whether the component to be processed is a restricted component (step S432). Constrained parts are as described in the above-mentioned initial priority distribution (see FIG. 10). In the case of constrained parts (YES in step S432), the allocation (distribution) of the parts is not performed here, and the following Are processed (YES in step S437, step S438).

  If it is not a constrained part (NO in step S432), it is determined whether all parts of the part type corresponding to the part are included in a single divided region (step S433).

  For example, the part of the index number “1” and the mounting point “P2” has the part type “c”, and in addition to the part “P2”, the part (mounting point) corresponding to the part type “c” is “ P4 "," P5 ", and" P8 ". Further, based on the mounting coordinates of the component information, it is determined which divided areas “1” and “2” the mounting coordinates of the respective components “P2”, “P4”, “P5”, and “P8” are included. When all the mounting coordinates of “P2”, “P4”, “P5”, and “P8” are included only in one of the divided areas “1” and “2”, the part (P2) is a single component. It is determined that the part is used in the divided area (YES in step S433). When the mounting coordinates of the parts “P2”, “P4”, “P5”, and “P8” are included in both of the divided areas “1” and “2”, the part “P2” is included in the single divided area. It is determined that the part is not used (NO in step S433).

  In the specific examples illustrated in FIGS. 14 to 16, the component “P4” having the index number “1” is included in the divided region “1”, and the components “P2”, “P5”, and “P8” are included in the divided region “2”. Therefore, it is determined that the part “P2” is not included in the single divided region (NO in step S433).

  Thus, when it is not a component in a single division area, the initial distribution with respect to the said component is complete | finished. That is, in the initial first distribution, the component “P2” is not allocated, and is “not allocated” in the initial first distribution as shown in FIG.

  Thereafter, when there are remaining parts to be subjected to the initial first distribution (NO in step S437), one index number “j” is added (step S438), and the initial first distribution is performed on the next part. Done in the same way.

  As described above, since the parts with the index numbers “2” to “4” are not parts within the single divided area, no assignment is performed in the initial first distribution, and all are “unassigned” (FIG. 16). reference).

  On the other hand, if it is determined that the component is used in a single divided region (YES in step S433), a head unit having a divided region including the mounting coordinates of the component as a priority region is identified, and the head unit It is determined whether or not a component supply unit for the component can be installed in the component supply unit (desired component supply unit) corresponding to (Step S434). That is, it is determined whether or not there is an installation space for installing the component supply means for the component in the desired component supply unit.

  If the component supply means for the component can be installed in the desired component supply unit (YES in step S434), the processing unit number of the head unit corresponding to the desired component supply unit is assigned (step S436).

  Specifically, the part “P1” with the index number “5” has the part type “e”, and in addition to the part “P1”, the part corresponding to the part type “c” is “P6”. It is a part. In the same manner as described above, it is determined in which divided areas “1” and “2” these parts “P1” and “P6” are included, and both parts “P1” and “P6” are both in either area. It is judged whether it is included in. Here, as shown in FIG. 14, since both the parts “P1” and “P6” are included in the divided area “2”, the part “P1” is determined to be a used part in the single divided area. (YES in step S433).

  Subsequently, the head units B and D having the divided area “2” of the part “P1” as the priority area are selected, and the parts “P1” are supplied to the parts supply unit corresponding to the head units B and D. It is determined whether or not the means can be installed (step S434).

  If it can be installed (YES in step S434), the processing unit “2” of the corresponding head unit B, D is assigned to the component “P1” (see step S436, FIG. 16).

  If the component supply means for the component cannot be installed in the desired component supply section (NO in step S434 in FIG. 11), it is determined whether or not the component supply means for the component can be installed in another component supply section. (Step S435).

  If there is no installation space for the component in another component supply unit (NO in step S435), the mounting machine M cannot mount the component and cannot produce the planned printed board W, resulting in an error. (Step S13 in FIG. 6). If an error occurs, as described above, the suiting process is stopped, error notification information and error content information are displayed, and an alarm sound is generated.

  If there is an installation space for the component in another component supply unit (YES in step S435), the processing unit number of the head unit corresponding to the other component supply unit is assigned (step S436).

  In the same manner, the initial first distribution is performed for all components (mounting points), and a processing unit number is assigned to each component according to the divided area.

  In the specific example, as shown in FIG. 16, in the initial first distribution, the parts “P2”, “P4”, “P5”, and “P8” with the index numbers “1” to “4” are not used parts in the single divided area. Therefore (NO in step S433), it becomes “unassigned”, and the parts “P0” and “P7” having the index numbers “7” and “9” have the divided area “1” as a single divided area. “1” is assigned, and the parts “P1”, “P6”, and “P3” having the index numbers “5”, “6”, and “8” have the divided area “2” as a single divided area, and therefore, “2” as the processing unit number. Is assigned.

  After the initial first distribution is thus performed (step S43 in FIG. 9), the initial second distribution is performed (step S44).

  As shown in FIG. 12, in the initial second distribution, first, the index number is set to “1” (step S441), and the first component (mounting point) to be processed is selected.

  Then, it is determined whether the part to be processed is a restricted part (step S442). If there is no restricted part (NO in step S442), whether the part is a used part in a single divided area. Is determined (step S443). Constrained parts are as described in the above initial priority distribution (see FIG. 10), and used parts in the single divided area are as described in the above initial first distribution (see FIG. 11).

  If the component to be processed is a restricted component (YES in step S442), and if it is a used component in a single divided area (YES in step S443), here, the allocation (distribution) of the component Is not performed, and the next part is processed (YES in step S448, step S449).

  If the component to be processed is not a used component in the single divided area (NO in step S443), the average value (average coordinate) of the mounting coordinates of all components (mounting points) including the same type of components as the relevant component is obtained. The head unit that is calculated and has the priority area as the divided area including the average value is identified (step S444).

  Subsequently, it is determined whether or not component supply means for the component can be installed in the component supply unit (desired component supply unit) corresponding to the head unit (step S445). That is, it is determined whether or not there is an installation space for installing the component supply means for the component in the desired component supply unit.

  If the component supply means for the component can be installed in the desired component supply unit (YES in step S445), the processing unit number of the head unit corresponding to the desired component supply unit is assigned (step S447).

  To explain with a specific example, the component “P2” with the index number “1” is not a used component in the single divided area (NO in step S443), and therefore the same type of components “P4” and “P5”. An average value (average coordinate) of the mounting coordinates of all the parts “P2”, “P4”, “P5”, and “P8” including “P8” is calculated. Here, assuming that the average coordinates are included in the divided area “2”, the head units B and D having the divided area “2” including the average coordinates as the priority area are specified (step S444).

  Subsequently, it is determined whether there is an installation space for installing the component supply means for the component (P2) in the component supply unit corresponding to the head units B and D (step S445). Here, assuming that there is an installation space (YES in step S445), the processing unit number “2” of the corresponding head unit B, D is assigned (step S447, see FIG. 16).

  On the other hand, when the component supply means for the component cannot be installed in the desired component supply section (NO in step S445), it is determined whether or not the component supply means for the component can be installed in another component supply section ( Step S446).

  If there is no installation space for the component in the other component supply units (NO in step S446), the mounting machine M cannot mount the component and cannot produce the planned printed board W, resulting in an error. (Step S13 in FIG. 6). If an error occurs, as described above, the suiting process is stopped, error notification information and error content information are displayed, and an alarm sound is generated.

  If there is an installation space for the component in another component supply unit (YES in step S446), the processing unit number of the head unit corresponding to the other component supply unit is assigned (step S447).

  In this way, until all the components (mounting points) are completed (NO in step S448, step 449), the initial second distribution (steps S442 to S447) is performed, and each component (not a used component in a single divided area). A processing unit number is assigned to (component).

  In the specific example, as shown in FIG. 16, in the initial second distribution, the parts “P2”, “P4”, “P5”, and “P8” with the index numbers “1” to “4” are assigned “2” as the processing unit numbers. Is assigned.

  As shown in FIG. 9, after the initial second distribution (step S44) is completed, the initial third distribution is performed (step S45).

  As shown in FIG. 13, in the initial third distribution, first, the index number is set to “1” (step S451), and the first component (mounting point) to be processed is selected.

  Then, it is determined whether the part to be processed is a restricted part (step S452). If the part is not a restricted part (NO in step S452), whether the part is a used part in a single divided area. Is determined (step S453). Constrained parts are as described in the above-mentioned initial priority distribution (see FIG. 10), and used parts in a single divided area are as described in the above-mentioned initial first distribution (see FIG. 11).

  If the component to be processed is a constrained component (YES in step S452), and if it is a used component in a single divided area (YES in step S453), the component is allocated (distributed) here. Is not performed, and the next part is processed (YES in step S457, step S458).

  If the component to be processed is not a used component in the single divided area (NO in step S453), it is determined whether or not a plurality of component supply means can be used for a component of the same component type as the component (step S453). S455).

  This determination is performed, for example, by setting in advance whether or not a plurality of component supply means can be used for each component type at the start of the optimization process, and performing the determination based on the addition availability information, or in a database. It is only necessary to refer to the component management data and the like held in the table based on the factory inventory quantity of the component corresponding to the component type of the component. The addability information includes addition prohibition information indicating that a component supply unit cannot be added for the component (component type).

  If a plurality of component supply means can be installed (YES in step S454), the original mounting coordinates of the component to which the processing unit number that does not correspond to the divided area including the original mounting coordinates is added in the initial second distribution process. It is determined whether or not a component supply unit for the component can be additionally installed in the component supply unit corresponding to the included divided area (step S455).

  If the component supply means for the component can be additionally installed (YES in step S455), the processing unit number is updated. That is, a processing unit number corresponding to a component supply unit that can be additionally installed is newly set (step S456).

  Note that the determination in step S455 is performed for a part to which a processing unit number that does not correspond to the divided area including the original mounting coordinates is added in the initial second distribution processing, and the original mounting coordinates are determined in the initial second distribution. For the parts to which the processing unit numbers corresponding to the included divided areas are added, it is determined that additional installation of the part supply means is not possible (NO in step S455), and the previous processing unit number is maintained.

  To explain with a specific example, the component “P4” with the index number “2” is not a restricted component or a used component in a single divided area (NO in step S452 and NO in step S453), and the component supply means It is determined whether or not a plurality of devices can be installed (step S454). Assuming that a plurality of components can be installed, the original mounting coordinates of the part “P4” are included in the divided area “1” as shown in FIG. 14, so the processing unit number is “1” if the original mounting coordinates are referred to. Is different from the processing unit number “2” assigned in the initial second distribution. Therefore, it is determined whether or not a component supply unit for the component “P4” can be additionally installed in the component supply unit corresponding to the divided region “1” including the original mounting coordinates of the component “P4” (step S455). ).

  If the component supply means for the component “P4” can be additionally installed (YES in step S455), the processing unit number “2” previously set as shown in FIG. Is updated to the processing unit number “1” corresponding to (step S456).

  Note that in the parts “P2”, “P5”, and “P8” with the index numbers “1”, “3”, and “4”, the processing unit number “2” corresponding to the divided area “2” that includes the original mounting coordinates is the initial value. Since it is equal to the processing unit number “2” assigned in the second distribution, additional installation is impossible (NO in step S455), and the previous processing unit number “2” is maintained.

  On the other hand, if the part is a restricted part (YES in step S452), if it is a used part in a single divided area (YES in step S453), or if a plurality of part supply means cannot be used (NO in step S454). When the component supply means cannot be additionally installed (NO in step S455), or when the processing unit number is updated (step S456), the distribution (assignment) for the component ends.

  Subsequently, when there is an unprocessed part (NO in step S457), the next part is selected as a processing target (step S458), and distribution (assignment) is performed in the same manner as described above.

  When all the parts are processed in this way (YES in step S457), the initial third distribution process is completed.

  When the initial distribution (step S4 in FIG. 6) is completed due to the completion of the initial third distribution process, as shown in FIG. 17, the related information on the parts (mounting points) and the processing unit numbers is divided for each processing unit. An estimated cycle time is calculated for each head unit by simulation for each processing unit, and a balancer process for improving the mounting efficiency is performed based on the estimated cycle time.

  More specifically, as shown in FIG. 6, the processing unit number “i” is set to “1”, and the first processing unit to be inspected is selected (step S5).

  Subsequently, a well-known suiting process is performed in the processing unit to be processed (step S6). In this suiting process, a head unit for mounting a component is assigned to each component (mounting point) based on information (see FIG. 16) in which the component (mounting point) and the processing unit number are associated with each other. Based on the allocation information, the set position of the component supply means for each component is determined, and each component supply means is allocated to an appropriate component supply section. Further, in the suiting process, information obtained by the above initial distribution, for example, information (part and head unit related information) associated with a part (mounting point) and a head unit may be referred to. good.

  In the present embodiment, the suiting process at this stage is an assignment operation for which component supply means the component supply means is installed in, and a finer assignment operation, for example, the component supply means Allocation work such as which position of the part is installed is performed in the next step (downstream side). Needless to say, in the present invention, fine assignment work may be performed.

  After the component supply means is allocated to the appropriate component supply unit in this manner, a mounting operation is virtually executed under the allocation conditions, and the cycle time (CT) for each head unit is calculated based on the virtual mounting operation (simulation). ) Is estimated, and information (result) of the estimated cycle time is held (step S7).

  As a result, when the processing unit to be inspected remains after the inspection in the processing unit is completed (NO in step S8), the processing unit number is added (step S9), and the simulation is performed for the next processing unit. The inspection is performed in the same manner as described above (steps S6 and S7).

  Thus, after the inspection is performed for every processing unit, it is determined whether or not the end condition is satisfied (step S10).

  As an end condition, for example, when the maximum value and the minimum value of the estimated cycle time result in each head unit are within a specified range, the number of trials (time) for inspection (steps S5 to S9) and balancer processing (step S11) described later Is more than the predetermined number of times (predetermined time), there is a case where further redistribution cannot be performed in the balancer processing (step S11) described later.

  If the termination condition is not satisfied (NO in step S10), balancer processing is performed (step S11).

  As shown in FIG. 18, in the balancer process, first, an estimated cycle time result in the previous simulation inspection is acquired (step S111).

  Next, the component (mounting point) allocation position is moved from the head unit with the maximum estimated cycle time to another head unit by the amount estimated from the difference in estimated cycle time (step S112).

  Among the parts to be moved in the allocation position, the parts with the highest priority are exemplified by the parts that are processed by the same head unit and that have the same number of parts and have a small number of mounted parts. Examples of components with high priority include components whose mounting coordinates are close to the priority area of the destination head unit.

  Further, the head unit to which the component is moved is changed as necessary depending on the availability of the component supply unit corresponding to the destination head unit (step S113).

  Next, the processing unit number is updated as necessary based on the moved parts (step S114).

  After the balancer process (step S11 in FIG. 6) is thus completed, a simulation inspection is performed in the same manner as described above (steps S5 to S9).

  Thus, until the above end condition is satisfied (NO in step S10), balancer processing (step S11) and simulation inspection (steps S5 to S9) are performed, and when the end condition is satisfied (YES in step S10), the estimated cycle time The shortest best result program is selected and stored (step S12).

  This completes the suitability of the mounting operation of this embodiment.

  As described above, according to the mounting work suitability apparatus of the present embodiment, the head unit to be used with priority for each divided area of the printed circuit board W based on the positional relationship between the component recognition camera 5 and the mounting work area 15. Since A to D are assigned, the moving distance of the head units A to D from component recognition to component mounting is shortened. The movement of the head units A to D from component recognition to mounting is a relatively time-consuming operation. Therefore, by shortening the movement distance and shortening the movement time, the mounting work time can be shortened, and thus production. Efficiency can be improved.

  Further, in the present embodiment, for each component that is the same type of component and is mounted in each of the plurality of divided regions by the initial second distribution process, the divided region that includes the average coordinates of the mounting coordinates of each component Since the head unit having the priority area is assigned, it can be efficiently mounted even on components mounted in a wide range, and the production efficiency can be further improved.

  Furthermore, in the present embodiment, by the initial third distribution process, for each component that is the same type of component and is mounted in each of the plurality of divided regions, a divided region including the original mounting coordinates of each component is added. Since the head unit as the priority area is allocated, each component can be mounted more efficiently by the appropriate head unit, and the production efficiency can be further improved.

  In the present embodiment, when a plurality of single type components are mounted in the same divided area, if possible, an additional component supply means for the component is installed in the component supply section corresponding to the divided area. Then, the component may be supplied from a plurality of component supply means.

  In the above-described embodiment, the case where the printed circuit board W is divided into the left and right (X-axis direction) based on the specification information has been described as an example. However, the present invention is not limited thereto, and in the present invention, the printed circuit board W is Further, it may be divided into three or more in the X-axis direction, or may be divided into two or more in the front-rear direction (Y-axis direction).

  For example, as shown in FIG. 22, in a mounting machine M having four head units A to D, the head units A and C have spec information that the front side is the mounting superior part, and the head units B and D have the rear side. In the case of having the specification information indicating that it is a mounting superior part, as shown in FIG. 23, the printed circuit board W is divided into two in the Y-axis direction (front-rear direction), and the front divided area “1” is the head. Units A and C and rear divided area “2” are preferentially processed by head units B and D.

  Further, as shown in FIG. 24, in the mounting machine M having four head units A to D, the head unit A is mounted on the right front side in the mounting dominant part, the head unit B is mounted on the left rear side, and the head unit C is mounted on the left front side. When the dominant portion and the head unit D have spec information that the right rear side is the mounting dominant portion, as shown in FIG. 25, the printed circuit board W is left and right (X-axis direction) and front and rear (Y-axis direction). The left front divided area “1” is the head unit C, the right front divided area “2” is the head unit A, the right rear divided area “3” is the head unit D, and the left rear divided area “4”. Are preferentially processed by the head unit B.

  The present invention can also be applied to a mounting line (mounting equipment) in which a plurality of mounting machines are arranged side by side. For example, as shown in FIG. 26, a mounting machine MA having a head unit A and a mounting machine MB having a head unit B are arranged side by side to form a mounting line, and the mounting machine MA is on the left side (downstream side). ) Is the mounting superior part, and the mounting machine MB has the spec information that the right side (upstream side) is the mounting dominant part, as shown in FIG. The divided area “1” is preferentially processed by the mounting machine MA (head unit A), and the right divided area “2” is preferentially processed by the mounting machine MB (head unit B).

  The suiting process of the present invention is particularly beneficial when the number of head units is the same as or larger than the number of divided areas of the printed circuit board W. In other words, in this case, one divided region can be preferentially processed by one or more head units, the operation range of each head unit is narrow, the moving distance is shortened, and the tact time can be further improved. .

  However, the suiting process of the present invention can be applied even when the number of head units is smaller than the number of divided areas of the printed circuit board W. However, in this case, at least one of the head units is responsible for a plurality of divided areas, and there is a possibility that the operating range of the head unit is widened. Even when the number of head units is smaller than the number of divided areas, the cycle time of the head units can be shortened to some extent by balancer processing or the like (see FIG. 18).

  In the above embodiment, the mounting equipment having a head unit provided with a plurality of heads for picking up components has been described as an example. However, the present invention is not limited to this, and in the present invention, the head has a single head unit. It can also be applied to facilities.

  Further, in the above-described embodiment, the case where the mounting machine (mounting equipment) having a plurality of head units is optimized has been described as an example. However, the present invention is not limited to this. In the present invention, the mounting machine has one head unit. The same applies to a mounting line (mounting equipment) in which a plurality of mounting units are arranged side by side, and a mounting line (mounting equipment) in which a mounting unit having one head unit and a plurality of mounting units are arranged side by side. Can be made suitable.

  Further, as described above, the present invention can also be applied to a case where a mounting machine in which a plurality of head units are provided on one mounting table is used alone.

It is a top view which shows the mounting machine which is embodiment of this invention. It is a block diagram which shows the control system of the mounting machine of embodiment. It is a block diagram for demonstrating mounting operation | movement of the mounting machine of embodiment. 1 is a front view of a mounting work suitability apparatus that is an embodiment of the present invention. It is a block diagram which shows the control system of the mounting work suitability apparatus of embodiment. It is a flowchart for demonstrating the operation | movement of suitability by the mounting work suitability apparatus of embodiment. It is a figure which shows the specification information table employ | adopted as embodiment. It is a top view for demonstrating the division | segmentation area | region of the board | substrate in the mounting work suitability apparatus of embodiment. It is a flowchart for demonstrating the operation | movement of the initial distribution by the mounting work suitability apparatus of embodiment. It is a flowchart for demonstrating the operation | movement of the initial priority distribution by the mounting work suitability apparatus of embodiment. It is a flowchart for demonstrating the operation | movement of the initial 1st distribution by the mounting work suitability apparatus of embodiment. It is a flowchart for demonstrating the operation | movement of the initial second distribution by the mounting work suitability apparatus of the embodiment. It is a flowchart for demonstrating the operation | movement of the initial 3rd distribution by the mounting work suitability | suitability apparatus of embodiment. It is a top view for demonstrating the relationship between the mounting point in a board | substrate which is a specific example of embodiment, and a division area. It is a figure which shows the components information table used as a specific example of embodiment. It is a figure which shows the relevant information table | surface of the mounting point used as a specific example of embodiment, and a process unit number. It is a block diagram for demonstrating the operation | movement from the test | inspection as a specific example of embodiment to a balancer process. It is a flowchart for demonstrating the operation | movement of the balancer process by the mounting work suitability apparatus of embodiment. It is a top view for demonstrating the mounting advantage part of a mounting machine as a 1st example of this invention. It is a top view for demonstrating the mounting predominance part of a mounting machine as the 2nd example of this invention. It is a top view for demonstrating the mounting predominance part of a mounting machine as the 3rd example of this invention. It is a figure which shows the specification information table | surface of the mounting machine which is the 1st modification of this invention. It is a figure for demonstrating the division | segmentation form of the board | substrate divided | segmented based on the specification information of a 1st modification. It is a figure which shows the specification information table | surface of the mounting machine which is the 2nd modification of this invention. It is a figure for demonstrating the division | segmentation form of the board | substrate divided | segmented based on the specification information of a 2nd modification. It is a figure which shows the specification information table | surface of the mounting line which is the 3rd modification of this invention. It is a figure for demonstrating the division | segmentation form of the board | substrate divided | segmented based on the specification information of a 3rd modification.

Explanation of symbols

5. Component recognition camera (component recognition means)
15 ... Mounting work area 31 ... Tape feeder (component supply means)
A to D: Head units M, MA, MB ... Mounting machine P ... Parts W ... Board

Claims (8)

A component supplying means for supplying a component, a component recognizing means for recognizing the component, and picking up a component supplied from the component supplying means and recognizing it by the component recognizing means, and then mounting the component on the substrate on the mounting work area A mounting work suitability apparatus for mounting equipment provided with a plurality of mounting work units having a head unit to be provided,
For each head unit, a superior part information acquisition unit that acquires information about a mounting superior part that is set based on the position of the corresponding component recognition unit and the mounting work area, and that indicates a portion that can be effectively mounted;
For each component, component information acquisition means for acquiring component information associated with the mounting position on the board;
Based on the information of the mounting superior part, the board is divided into a plurality of areas, and an allocation unit that allocates a corresponding head unit for each divided area;
A mounting work suitability apparatus comprising: a specifying unit that specifies a head unit for performing a mounting work for each component based on a divided area to which the head unit is allocated and component information.   2. The mounting work optimizing device according to claim 1, wherein the specifying unit specifies a head unit assigned to the divided area as a head unit for performing a mounting work on a component mounted in one divided area.   The specifying unit specifies a head unit allocated to a divided area including an average position of the mounting positions of each component as a head unit for performing a mounting operation on a plurality of components of the same type that are mounted. The mounting work suitability apparatus according to claim 1 or 2.   The identifying means is a head unit that performs mounting work for each component that is the same type of component and is mounted in each of the plurality of divided regions, and is assigned to each divided region that includes the mounting position of each component. The mounting work suitability apparatus according to any one of claims 1 to 3, wherein the head unit is specified. A mounting facility for mounting components on a board,
A mounting work suitability apparatus according to any one of claims 1 to 4,
Mounting equipment characterized by the suitability of its own mounting work by the mounting work suitability device. A component supplying means for supplying a component, a component recognizing means for recognizing the component, and picking up a component supplied from the component supplying means and recognizing it by the component recognizing means, and then mounting the component on the substrate on the mounting work area A mounting work suitability method for a mounting facility provided with a plurality of mounting work units each having a head unit,
For each head unit, based on the corresponding component recognition means and the position of the mounting work area,
Preliminarily setting information about a mounting superior part indicating a portion that can be effectively mounted, and obtaining information of the mounting superior part;
For each component, obtaining component information associated with the mounting position on the board;
Based on the information of the mounting superior part, the substrate is divided into a plurality of areas, and the allocation means for allocating the corresponding head unit to each divided area,
A mounting work suitability method comprising: a specifying unit that specifies a head unit for performing a mounting operation for each component based on a divided area to which the head unit is allocated and component information. A mounting machine for mounting components on a board,
Comprising storage means for storing the relevant information of the component and the head unit output from the mounting work suitability apparatus according to claim 1;
A mounting machine in which a mounting operation is performed according to information related to components and a head unit in a storage unit. A mounting line including a mounting machine for mounting components on a board,
Comprising storage means for storing the relevant information of the component and the head unit output from the mounting work suitability apparatus according to claim 1;
A mounting line in which mounting work is performed by a mounting machine in accordance with information related to components and head units in a storage means.

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