JP2013038281A - Electronic component attachment device, and electronic component attachment method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount an electronic component efficiently while preventing interference of respective attachment heads, in an electronic component attachment device having a plurality of lanes capable of independent production by dual conveyance.SOLUTION: For each step described in the attachment data, priority for each beam is compared, and the steps of attraction, recognition, and attachment for an attachment head of a high priority beam are performed until the end of cycle. For an attachment head of a low priority beam, a determination is made as to whether or not the beam interferes with the other beam, only the steps not interfering with the other beam is executed, and execution of steps interfering with the other beam is waited until the beam does not interfere with the other beam. When a running cycle finishes for a pair of beams, a priority lower than that of the other beam is imparted with reference to the priority of the other beam.

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method, and particularly suitable for use in efficiently mounting electronic components in an electronic component mounting apparatus having a plurality of lanes that can be independently produced by dual conveyance. The present invention relates to an electronic component mounting apparatus and an electronic component mounting method.

  In recent years, electronic component mounting equipment that mounts electronic components on printed circuit boards has proposed a dual transport configuration in which two substrate transport lines are provided and components are mounted by heads that operate independently from the viewpoint of improving productivity. Has been.

  For example, in Patent Document 1, in an electronic component mounting apparatus having a dual transfer line provided with two parallel substrate transfer lines, a fixed chute and a movable chute are provided on the chute constituting the line in order to improve productivity. Disclosed techniques.

JP 2010-10436 A

  When mounting electronic components with two mounting heads, it is important to control so that one mounting head does not interfere with the other mounting head.

  When the mounting heads do not interfere with each other, they can operate independently, but may interfere with each other depending on the arrangement of components. In that case, an algorithm for giving priority to each head and controlling it can be considered.

Hereinafter, the operation of the electronic component mounting apparatus that mounts electronic components with two mounting heads according to the prior art will be described with reference to FIGS. 9A to 10.
9A and 9B are schematic views seen from the upper surface of an electronic component mounting apparatus that mounts electronic components with two mounting heads according to the prior art.
FIG. 10 is a diagram showing a processing order when priorities are assigned by respective beams of the electronic component mounting apparatus according to the related art.

  In a general electronic component mounting apparatus, which will be described in detail later, the mounting head moves in the same direction (X direction) as the substrate transport direction according to a guide called a beam for positioning the apparatus. By moving in a direction (Y direction) orthogonal to the transport direction, the mounting position of the component is positioned. In the description of the operation shown in FIG. 10, the independently operable beams are A beam and B beam.

  The electronic component mounting apparatus operates in one cycle, after the board is loaded, the component is sucked by the component feeder by the mounting head, the component is recognized by the component recognition camera, and the component is mounted at a predetermined position.

  In this case, conventionally, as shown in FIG. 10, the operations of the A beam and the B beam are prioritized for each cycle, and are operated within the operation ranges of the respective heads shown in FIGS. 9A and 9B, respectively. It was. That is, the component is operated with priority given to the beam having a high priority.

  FIG. 9A shows a phase in which the mounting head 20a moving according to the A beam 8a picks up a component from the feeder of the component supply unit 3a, recognizes the component by the component recognition camera 16a, and mounts it on the board P. 9B shows a phase in which the mounting head 20b, which moves according to the B beam 8b, picks up the component from the feeder of the component supply unit 3b, recognizes the component by the component recognition camera 16b, and mounts it on the substrate P. .

  This electronic component mounting apparatus according to this prior art has one lane (that is, one board that is simultaneously transported) and two mounting heads. However, in a dual transport electronic component mounting apparatus having two lanes, the board is transported independently to each lane, so the timing is asynchronous, and priority is given to each beam efficiently. There was a problem that it was difficult.

  That is, in dual conveyance, it is possible to give priority to each beam and operate according to it, but depending on how the priority is given, the waiting time becomes large even in a range where the head does not interfere, resulting in inefficiency. There was a fear.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic component mounting apparatus having a plurality of lanes that can be independently produced by dual transport, while preventing interference between the mounting heads. It is an object to provide an electronic component mounting apparatus that can efficiently mount the device.

  The electronic component mounting apparatus according to the present invention has a lane for transporting two substrates, and electronic components that can be independently produced by so-called dual transport, in which components are independently mounted on the substrate transported from each lane. A component mounting apparatus, a control unit that controls each unit, a storage unit that stores data, a pair of component supply units that include a feeder that supplies components, and a component that is picked up from the component supply unit and mounted on a substrate A pair of mounting heads, a pair of beams (A beam and B beam) that independently position the mounting head on the substrate, and a pair of recognition cameras that recognize the components adsorbed by the mounting head.

  In addition, the storage unit includes mounting data that describes the specifications of the steps for sucking, recognizing, and mounting parts for each pair of beams, and sucking, recognizing, and mounting parts for each pair of beams. For each series of cycles, priority and interference area information that determines the area in which each pair operates are stored.

  Then, the control unit compares the priority for each beam for each step described in the mounting data, and causes the steps of sucking, recognizing and mounting the beam with a high priority to the mounting head to be executed until the end of the cycle. For the mounting head of the beam having a low priority, the interference area information is used to determine whether or not to interfere with the beam of the other party, and only the step that does not interfere is executed. Wait until the other beam no longer interferes, and execute when the other beam no longer interferes.

  Then, the control unit refers to the priority of the partner beam and gives a priority lower than the partner beam to the pair of beams when the cycle being executed is completed.

  According to the present invention, an electronic component mounting apparatus having a plurality of lanes that can be independently produced by dual conveyance and capable of efficiently mounting electronic components while preventing interference between the mounting heads is provided. be able to.

It is a top view of the electronic component mounting apparatus which concerns on one Embodiment of this invention. It is a block diagram of the electronic component mounting apparatus which concerns on one Embodiment of this invention. It is a figure which shows an example of a beam execution control table. It is a figure which shows an example of component mounting data. It is a figure which shows an example of an interference area | region table. It is the schematic diagram seen from the upper surface of the electronic component mounting apparatus which mounts an electronic component with two mounting heads which concern on one Embodiment of this invention (the 1). It is the schematic diagram seen from the upper surface of the electronic component mounting apparatus which mounts | wears an electronic component with the two mounting heads concerning one Embodiment of this invention (the 2). It is a flowchart which shows the process regarding the component mounting of the board | substrate of the electronic component mounting apparatus which concerns on one Embodiment of this invention. It is a figure which shows the process order when the priority by each beam of the electronic component mounting apparatus which concerns on one Embodiment of this invention is given. It is the schematic diagram seen from the upper surface of the electronic component mounting apparatus which mounts an electronic component with two mounting heads based on a prior art (the 1). It is the schematic diagram seen from the upper surface of the electronic component mounting apparatus which mounts an electronic component with two mounting heads based on a prior art (the 2). It is a figure which shows the process order when the priority by each beam of the electronic component mounting apparatus which concerns on a prior art is given.

  Hereinafter, the electronic component mounting apparatus according to each embodiment of the present invention will be described with reference to FIGS. 1 to 8.

First, the structure of an electronic component mounting apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.
FIG. 1 is a top view of an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a block diagram of an electronic component mounting apparatus according to an embodiment of the present invention.
As shown in FIG. 1, the electronic component mounting apparatus according to this embodiment has a so-called dual transport lane having an A lane that allows components to be mounted on a board independently and a B lane. It is.

  In the following, the device part and operation in one lane will be described, but the same applies to other lanes.

  On the base 2 of the electronic component mounting apparatus according to the present embodiment, a plurality of component supply units 3 for supplying various electronic components one by one to the component take-out portion (component suction position) are arranged in parallel. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the opposing component supply unit 3 groups. The supply conveyor 4 transports the printed circuit board P received from the upstream device to the positioning unit 5, and after the electronic component is mounted on the printed circuit board P positioned and fixed by the positioning mechanism (not shown) in the positioning unit 5. , And conveyed to the discharge conveyor 6.

  The beam 8 is extended long in the X direction, and the screw shaft 10 is rotated by driving the Y-axis motor 9, respectively, and the component extraction position (components) of the printed circuit board P and the component supply unit 3 along the pair of left and right guides 11. The suction position is moved individually in the Y direction.

  The beam 8 is provided with a mounting head 20 that moves along a guide (not shown) by an X-axis motor 12 in the longitudinal direction, that is, in the X direction, so as to be rotatable by a θ-axis motor 14 (not shown). Yes. Each mounting head 20 is equipped with a vertical axis motor 13 for vertically moving any of n (n is an integer of 1 or more) suction nozzles, and a θ-axis motor 14 is mounted. . Therefore, each suction nozzle of the mounting head 20 can move in the X direction and the Y direction (plane direction), can rotate about a vertical line, and can move up and down.

  The component recognition camera 16 is a camera that captures an image of the electronic component sucked and held by the suction nozzle from below.

The board recognition camera 18 is a camera that is attached to the mounting head 20 and images a positioning mark attached to the printed board P. Also, a functional block of the electronic component mounting apparatus according to the present embodiment is shown in FIG. Come to show.

  Although only one block is shown in FIG. 2, the component recognition camera 16, the board recognition camera 18, the X-axis motor 12, the Y-axis motor 9, the vertical axis motor 13, and the θ-axis motor 14 Each exists in the system.

  Each part of the electronic component mounting apparatus 1 is controlled in response to an instruction from a CPU (Central Processing Unit) 30. A ROM (Read Only Memory) 31 storing a program related to this control and a RAM (Random Access Memory) 32 storing various data are connected via a bus line 33. Further, a monitor 34 for displaying an operation screen and the like, and a touch panel switch 35 as input means formed on the display screen of the monitor 34 are connected to the CPU 30 via an interface 36. A Y-axis motor 9, an X-axis motor 12, a vertical axis motor 13, and a θ-axis motor 14 are connected to the CPU 30 via a drive circuit 38 and an interface 36.

  The RAM 32 stores mounting data for each type of printed circuit board P related to component mounting. For each mounting order (step number), the X direction of the mounting coordinates of each electronic component in the printed circuit board P, Y direction and angle information, arrangement number information of each component supply unit 3, and the like are stored. The RAM 32 stores information on the types of electronic components corresponding to the component supply unit arrangement numbers of the component supply units 3 and component arrangement data. Furthermore, shape data, recognition data, control data, and components are stored. Parts library data consisting of supply data is stored. The RAM 32 also stores management data for the electronic component mounting apparatus.

  The image recognition processing device 37 is connected to the CPU 30 via the interface 36, and the image recognition processing device 37 performs recognition processing of an image captured and captured by the component recognition camera 16. The processing result is sent out. That is, the CPU 30 outputs an instruction to the image recognition processing device 37 so as to perform recognition processing (calculation of misalignment amount, etc.) on the image captured by the component recognition camera 16, and the recognition processing result is output from the image recognition processing device 37. It is what you receive.

  Next, an outline of the component mounting operation of the electronic component mounting apparatus according to the present embodiment will be described.

  First, the production operation of the printed circuit board P is started. When the printed circuit board P is inherited from the upstream device (not shown) and exists on the supply conveyor 4, the printed circuit board P on the supply conveyor 4 is transferred to the positioning unit 5. Move and fix the positioning. Then, mounting data stored in the RAM 32, that is, mounting in which the XY coordinate position to be mounted on the printed circuit board P, the rotation angle position around the vertical axis, the feeder number (arrangement number of each component supply unit 3), and the like are designated. According to the data, in the Y direction, the Y-axis motor 9 is driven to move the beam 8 along the pair of guides 11, and in the X direction, the X-axis motor 12 is driven to correspond to the suction nozzle of the corresponding mounting head 20. One of them is moved above a predetermined component supply unit 3 for supplying an electronic component to be mounted, and the vertical axis motor 13 is driven to lower the suction nozzle to pick up and take out the electronic component.

  Further, while moving the suction nozzle above the component recognition camera 16, the electronic component held by suction is imaged (fly imaging) and recognized by the image recognition processing device 37, and the beam 8 is moved above the printed circuit board P. Then, the positioning mark affixed to the printed circuit board P is imaged by the board recognition camera 18, the amount of positional deviation is recognized by the image recognition processing device 37, and based on those results, the board P is again moved above the mounting position of the board P. All the electronic components sucked and held by the suction nozzle of the mounting head 20 are mounted on the printed circuit board P while the suction nozzle corrects the positional deviation by adding both recognition results to the mounting coordinates of the mounting data.

  In this way, the adsorption, recognition, and mounting of the electronic components are repeated until all the electronic components to be mounted on one printed circuit board P are completed. When all the electronic components are completed, the printed circuit board is transferred from the positioning unit 5 to the discharge conveyor 6. P is transported, the production related to the mounting of electronic components on the first printed board P is completed, and the production for the second printed board P is performed.

Next, a data structure used for processing of the electronic component mounting apparatus according to the embodiment of the present invention will be described with reference to FIGS.
FIG. 3 is a diagram illustrating an example of a beam execution control table.
FIG. 4 is a diagram illustrating an example of component mounting data.
FIG. 5 is a diagram illustrating an example of the interference area table.

  These tables are stored in the RAM 32 and referred to in a control program executed by the CPU 30.

  The beam execution control table is a table that stores data used for control by the control program executed by the CPU 30 to execute each beam.

  As shown in FIG. 3, the beam execution control table stores priority and execution step data for each beam.

  The “priority” is a priority value indicating data that is an index used to indicate which beam is to be preferentially controlled with respect to each current beam. The beam control using this priority will be described later in detail.

  The “execution step” is an ID indicating the execution step of the component mounting data currently being executed.

  The component mounting data is a recognition step in which each component of the A beam and the B beam is sucked from the feeder of the component supply unit 3 from the suction nozzle of the mounting head 20 and sucked to the suction nozzle by the component recognition camera 16. This is data for describing each operation of the step and the step of mounting the component on the board P.

  As shown in FIG. 4, the component mounting data stores data of X, Y, θ, cycle, operation type, and feeder number.

  “X”, “Y”, and “θ” are data representing coordinates for mounting a component.

  “Cycle” is data indicating a number indicating a cycle representing an operation unit composed of a series of adsorption, recognition, and mounting. That is, the operations of steps belonging to the same cycle are continuously performed.

  “Action type” indicates the type of action to be performed in the step. That is, in the case of “suction”, the mounting head 20 sucks the component from the component supply unit 3 by the suction nozzle, and in the case of “recognition”, the component sucked by the suction nozzle is brought near the recognition camera 16. An image is captured and captured as image data, and recognition processing is performed. In “mounting”, the component is mounted at a corresponding position on the board.

  The “feeder number” is data representing the feeder number of the component supply unit 3. Although not shown, the feeder ID and the component ID representing the component type are uniquely associated by the component arrangement data. The component library stores data representing the shape and specification of the component with the component ID.

  In the example of the figure, in the cycle of cycle number = 1 (hereinafter also simply referred to as “cycle 1”), the component is sucked from the feeder of feeder number 101 in step 001, and in step 004, the component recognition camera is used. 16, recognition is performed, and in step 009, the component is mounted at a position of (X, Y, θ) = (50, 30, 0).

  The interference area table is a table that holds the Y coordinate data of the interference area in each beam for each cycle. As shown in FIG. 5, each interference cycle has “interference area coordinates” for each “cycle”. ing.

  As described above, “cycle” is data indicating a number indicating a cycle representing an operation unit composed of a series of adsorption, recognition, and mounting.

  The “interference area coordinates” are coordinate values indicating areas occupied by the A beam and the B beam in the currently executed cycle, respectively, and data indicating coordinates that are most likely to move at a step in the cycle. It is. The other beam can operate in parallel if it does not interfere with the interference area indicated by the interference area coordinates, and when the beam interferes with the interference area indicated by the interference area coordinates, the priority of the beam is low. Sometimes you will wait.

  The “interference area coordinates” are updated to the latest value each time the beam step is executed.

  In the example shown, cycle A of the A beam includes steps that may move from the origin of the beam reference position to a position where the Y coordinate data is 350 mm.

Next, processing of the electronic component mounting apparatus according to the embodiment of the present invention will be described with reference to FIGS. 6A to 8.
6A and 6B are schematic views seen from the upper surface of an electronic component mounting apparatus that mounts electronic components with two mounting heads according to an embodiment of the present invention.
FIG. 7 is a flowchart showing processing related to component mounting on the board of the electronic component mounting apparatus according to the embodiment of the present invention.

  FIG. 8 is a diagram showing a processing order when priorities are assigned by respective beams of the electronic component mounting apparatus according to the embodiment of the present invention.

  Control of the electronic component mounting apparatus is performed by the CPU 30 executing a control program stored in the RAM 32.

  First, the control program executed by the CPU 30 initializes the control table shown in FIGS. 3 to 5 (S01).

First, component mounting data corresponding to a board is read from an auxiliary storage device such as an HDD, and from the step corresponding to each cycle, the interference area of the cycle corresponding to each of the A beam and the B beam is obtained. Set the interference area coordinates of the interference area table Next, the interference area coordinates and execution steps in the current cycle of each of the A beam and the B beam are set in the beam execution control table shown in FIG.

  In addition, initial values of the priorities of the A beam and the B beam are set in the beam execution control table. Here, the initial value of the A beam priority is 1, and the initial value of the B beam priority is 2.

  In the present embodiment, the beam priority is an integer of 1, 2, 3, 4 and the order of priority is 1> 2> 3> 4. 4> 1.

  Next, the substrate P is carried into each lane from the upstream process (S02).

  Next, with reference to the beam control table, it is determined whether the priority of either the A beam or the B beam is high (S03), and the component mounting data step for the beam with a high priority is executed (S04). Then, the value of the execution step for that beam in the beam control table is updated. At this time, the interference area coordinates of the interference area table of the beam are also updated.

  When the component mounting data step is executed and the mounting data of the board is completed (S05), the process returns to S02, and the next board is carried into the beam.

  When the mounting data of the board is not completed, it is determined whether or not it corresponds to the start of the beam cycle in the component mounting data (S06). When the beam cycle starts, the priority of the beam in the beam control table is set (S07).

  For the priority setting, when the partner beam priority is 1, 2, or 3, the priority of the beam is set to the priority obtained by adding 1 to the partner beam priority, and the partner beam priority is 4 In this case, the priority of the beam is set to 1. That is, the priority of the own beam is set lower than the priority of the partner beam.

  When in the middle of a cycle, the next step in the cycle is executed.

  Next, it is determined whether the priority of either the A beam or the B beam is high. If the beam has a low priority, whether or not to interfere with the partner beam before executing the component placement data step. Is determined (S08). For this purpose, the current cycle of the partner beam is obtained from the component mounting data from the partner execution step of the beam control table, the interference region coordinates are obtained from the interference region table of the partner beam, and the execution at that step interferes. This is done by determining whether or not.

  And when it interferes, the beam waits (S09).

  Next, it waits until the interference area coordinates of the partner beam are updated, and when the partner beam cycle is completed or the interference area coordinates are updated (S10), the process returns to S03.

  If the part mounting data step is determined not to interfere with the partner beam, the beam step is executed (S11). Then, the value of the execution step for that beam in the beam control table is updated. At this time, the interference area coordinates of the interference area table of the beam are also updated.

  When the mounting data of the substrate is completed (S12), the process returns to S02, and the next substrate is carried into the beam.

  On the other hand, when the mounting data of the board is not completed (S12), the process returns to S02 to determine the priority.

  Hereinafter, a specific example will be described with reference to FIGS. 6A and 6B and FIG.

  First, for initialization, A beam priority = 1 and B beam priority = 2 are set (FIG. 7, S01).

  At this time, the priority of the A beam and the priority of the B beam are compared (S02). Since the priority of the A beam is high, the A beam cycle 1 is preferentially executed until the end.

  This is illustrated in FIG. 6A.

  Since the B beam has a lower priority than the A beam, the B beam can operate only when it does not interfere with the interference region of the A beam. It is assumed that the adsorption and recognition steps of the B beam cycle 1 do not interfere with the A beam and the interference area, and interference occurs in the middle of the mounting step of the B beam cycle 1. At this time, as shown in FIG. 6A, the adsorption / recognition step of cycle 1 of the B beam can be operated regardless of the A beam, and the B beam waits at the mounting step of cycle 1 and waits for the A beam. Wait until it no longer interferes with cycle 1 (S08, S09).

  When the A beam cycle 1 ends, the priority of the A beam is set (S07). The priority of the A beam is set to 3 by adding 1 to 2 of the priority of the B beam.

  For the B beam, since the A beam cycle is completed (S10), the beam priorities are compared (S03). At this time, the A beam priority = 3 and the B beam priority = 2, and the waiting step for mounting the B beam cycle 1 is executed. As a result, the state transitions from FIG. 6A to FIG. 6B.

  Comparing the priority of the A beam and the priority of the B beam, the priority of the A beam is lower than that of the B beam, so that it can operate only when it does not interfere with the interference region of the B beam. The adsorption / recognition step of cycle 1 of A beam does not interfere with the interference region of cycle 1 of B beam.

  When the cycle 1 of the B beam is completed, the next priority of the B beam is set (S07). The next priority of the B beam is set to 4 by adding 1 to the priority of the A beam = 3.

  When the B beam cycle 1 ends, the A beam priority = 3, the B beam priority = 4, the A beam priority becomes high, and the subsequent steps of the A beam cycle 2 are all performed. Works preferentially.

  In the cycle 2 of the B beam, the priority is lower than the priority of the A beam, but it is assumed that all of the steps of adsorption, recognition and mounting did not interfere with the cycle 2 of the A beam.

  Then, if the A-beam cycle 2 is not completed at the stage where the B-beam cycle 2 is completed, the priority of the partner A-beam = 3 is added to 1, and is set to 4 again.

  The next B beam cycle 3 is also lower than the priority of the A beam, but it is assumed that it does not interfere with the A beam cycle 2 in the adsorption and recognition steps.

  When cycle 2 of the A beam ends, the next priority of the A beam is set. Since the priority of the B beam = 4, the next priority of the A beam is 1.

  According to the priority rule described above, the B beam priority = 4 has priority over the A beam priority = 1, so that in the subsequent cycle 3, the B beam operates preferentially.

  In the A-beam cycle 3, the adsorption and recognition did not interfere with the interference region of the B-beam, but if there is a step of interference in the middle of mounting, it waits and no longer interferes with the three cycles of the B-beam. wait.

  When the waiting step of the A-beam cycle 3 no longer interferes with the three B-beam cycles, the execution of the mounting step of the A-beam cycle 3 is resumed.

  When the end of the 3 cycles of the B beam is completed, 1 is added to the priority of the partner's A beam = 1 to obtain 2.

  Hereinafter, similarly, the operations of the A beam and the B beam are controlled.

  DESCRIPTION OF SYMBOLS 1 ... Electronic component mounting apparatus, 3 ... Component supply unit, 8 ... Beam, 16 ... Component recognition camera, 20 ... Mounting head.

Claims (2)

In an electronic component mounting apparatus that has two lanes for transporting substrates, and that independently mounts components on the substrates transported from each lane,
A control unit for controlling each unit;
A storage unit for holding data;
A pair of component supply units for supplying components;
A pair of mounting heads for sucking components from the component supply unit and mounting them on a substrate;
A pair of beams for independently positioning the mounting head on a substrate;
A pair of recognition cameras for recognizing the parts adsorbed by the mounting head;
The storage unit includes mounting data that describes the specifications of steps for picking up, recognizing, and mounting parts for each pair of beams, and a series of suction, recognition, and mounting of parts for each pair of beams. For each cycle, and for each pair of beams, hold the interference area information that determines the area to operate,
The controller is
For each step described in the mounting data, compare the priority for each beam,
The steps of sucking, recognizing and mounting a high-priority beam on the mounting head are executed until the end of the cycle,
For a mounting head with a beam having a low priority, the interference area information is used to determine whether or not to interfere with the partner beam, and only the step without interference is executed. Wait until it no longer interferes with the beam,
Electronic component mounting characterized in that a priority lower than that of the partner beam is given to each pair of beams when the cycle being executed is completed with reference to the priority of the partner beam. apparatus. In the electronic component mounting method of the electronic component mounting apparatus, which has lanes for transporting two substrates, and independently mounts components on the substrates transported from each lane.
The electronic component mounting apparatus includes a control unit that controls each unit;
A storage unit for holding data;
A pair of component supply units for supplying components;
A pair of mounting heads for sucking components from the component supply unit and mounting them on a substrate;
A pair of beams for independently positioning the mounting head on a substrate;
A pair of recognition cameras for recognizing the parts adsorbed by the mounting head;
The storage unit includes mounting data that describes the specifications of steps for picking up, recognizing, and mounting parts for each pair of beams, and a series of suction, recognition, and mounting of parts for each pair of beams. For each cycle, and for each pair of beams, hold the interference area information that determines the area to operate,
In accordance with the mounting data, the mounting head sucks components from the component supply unit;
In accordance with the mounting data, the recognition camera recognizes a component adsorbed on the mounting head;
In accordance with the mounting data, positioning the beam, and mounting a component on the substrate by the mounting head;
The control unit compares the priority for each beam for each step described in the mounting data;
In accordance with the result of the procedure for comparing the priorities, the control unit causes the steps of attracting, recognizing, and mounting the high-priority beam to the mounting head to be executed until the end of the cycle;
According to the result of the procedure for comparing the priorities, the control unit determines whether or not to interfere with the beam of the other party using the interference area information for the mounting head of the beam having a low priority, Only the steps that do not interfere are executed, and the execution of the interfering step waits until it does not interfere with the partner beam,
The control unit refers to the priority of the partner beam when each of the pair of beams is completed, and gives a priority lower than that of the partner beam. An electronic component mounting method comprising:

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