JP6515343B2 - Component mounting method and component mounting apparatus - Google Patents

Description

  The present invention relates to a component mounting method and component mounting apparatus for mounting a component such as an electronic component on a substrate.

  In a component mounting apparatus for mounting a component such as an electronic component on a substrate, a component mounting operation of taking an electronic component from a component supply unit by a mounting head and transferring and mounting the component on a substrate is repeatedly performed. As a substrate to be a target of such component mounting, there is a multi-chamfered substrate in which a plurality of unit substrates are built into one parent substrate. In the component mounting operation for a multi-chamfered substrate, the same mounting step prescribed in advance in mounting data is sequentially executed on each of the unit substrates, and the multi-chamfered substrate is targeted by completing all the mounting steps. Component mounting is completed (see, for example, Patent Document 1). In such a multi-chamfered substrate, a defective unit substrate determined to be unusable as a product by substrate inspection performed in the previous step can be identified in the subsequent step so that the unit substrate is defective. A bad mark is attached for good or bad identification. Then, the defective unit board in which the bad mark is detected in the component mounting is excluded from the target of the component mounting operation.

Unexamined-Japanese-Patent No. 2004-111998

  However, in the component mounting for a multi-chamfered substrate in the prior art including the prior art shown in the above-mentioned patent document example, there were cases in which the productivity decreased due to the handling of the defective unit substrate. That is, in the prior art, when a defective unit substrate is detected in a component mounting operation for a multi-chamfered substrate, component mounting for the defective unit substrate is canceled, but the defective unit substrate is mounted for the mounting operation. The implementation turn itself, whose action content was set as a target, was not the target of any correction. For this reason, although the number of unit substrates to be substantially produced in the target multiple-chamfered substrate is reduced by the number of defective unit substrates, the number of mounting turns that initially defines the workload for component mounting is initially As the implementation data of (1), the result is a substantial decrease in productivity.

  Therefore, the present invention is to provide a component mounting method and a component mounting apparatus capable of suppressing the decrease in productivity by reducing unnecessary mounting turns when targeting a multi-chamfered substrate including a defective unit substrate. To aim.

The component mounting method according to the present invention mounts a series of component mounting operations for mounting a plurality of components taken out of the component supply unit by the mounting head on the multi-chamfered substrate for a multi-chamfered substrate consisting of a plurality of unit substrates A component mounting method for mounting a component on the multi-chamfered substrate based on mounting data consisting of a plurality of pre-defined mounting turns, wherein the plurality of unit substrates have a defective unit substrate. A step of determining whether or not each of the mounting turns includes a canceled component whose mounting on the defective unit substrate has been canceled, and it is determined that the canceled component is included among the plurality of mounting turns and the component mounting is performed. In the correction mounting turn requiring the correction of the operation, the number of mounting turns of the plurality of predetermined mounting turns is reduced. The Nseru parts, only contains a complementary step, to complement in a complementary parts that are included in other modifications implementation turn, the plurality of implementation turn, are those in which the cancellation components are sorted in less order, the completion process And in the correction mounting turn, the cancellation parts included in the correction mounting turn are complemented by complementary parts included in the correction mounting turn after the correction mounting turn .

The component mounting apparatus according to the present invention mounts a series of component mounting operations for mounting a plurality of components taken out of the component supply unit by the mounting head on the multi-chamfered substrate for a multi-chamfered substrate consisting of a plurality of unit substrates A component mounting apparatus for mounting a component on the multiple-circumscribed board based on mounting data consisting of a plurality of predetermined mounting turns, wherein the component mounting mechanism performs the component mounting operation, and the plurality of units A defective substrate information acquiring unit for acquiring defective substrate information as to whether or not there is a defective unit substrate for the substrate, and when there is a defective unit substrate in the plurality of unit substrates, the defective unit substrate is obtained for each of the plurality of mounting turns. And a cancellation part presence / absence determination unit that determines whether or not the cancellation part including the cancellation of the mounting is included among the plurality of mounting turns. In a correction mounting turn that is determined to include a cancellation component and requires correction of the component mounting operation, the number of mounting turns of the plurality of predetermined mounting turns is reduced in the correction mounting turn, and the correction component turns other correction mounting turns And the plurality of mounting turns are rearranged in the order of the small number of the canceled parts, and the complementing processing part is included in the modified mounting turn. The canceled part is complemented by a complementary part included in the corrected mounting turn that is subsequent in order to the corrected mounting turn .

  According to the present invention, in the case where a multi-chamfered substrate including a defective unit substrate is targeted, unnecessary mounting turns can be reduced to suppress a decrease in productivity.

Top view of a component mounting apparatus according to an embodiment of the present invention Partial cross-sectional view of a component mounting apparatus according to an embodiment of the present invention Explanatory drawing of the board | substrate used as the operation target of the component mounting apparatus of one embodiment of this invention Block diagram showing a configuration of a control system of a component mounting apparatus according to an embodiment of the present invention Explanatory drawing of the turn data used in the component mounting method of one embodiment of this invention Flow chart showing correction processing of all mounting turns of the component mounting method according to one embodiment of the present invention Flow chart showing the complementing process in the correction mounting turn of the component mounting method of one embodiment of the present invention Explanatory drawing of the correction mounting turn data in the component mounting method of one embodiment of this invention Explanatory drawing of optimization of the mounting order in the component mounting method of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, with reference to FIG. 1 and FIG. 2, the structure of the component mounting apparatus 1 which mounts components on a board | substrate is demonstrated. The component mounting apparatus 1 has a function of mounting an electronic component on a substrate, and FIG. 2 partially shows an AA cross section in FIG.

  In FIG. 1, a substrate transfer mechanism 2 is disposed at the center of the base 1a in the X direction (substrate transfer direction). The substrate transport mechanism 2 transports the substrate 3 carried in from the upstream side, and positions and holds the substrate 3 on the mounting stage set for performing the component mounting operation. Component supply units 4 are disposed on both sides of the substrate transfer mechanism 2, and a plurality of tape feeders 5 are mounted in parallel to each of the component supply units 4. The tape feeder 5 feeds components to a component suction position by the mounting head 9 of the component mounting mechanism 10 described below by pitch-feeding the carrier tape containing the components in the tape feeding direction.

  A Y-axis moving beam 7 provided with a linear drive mechanism is disposed in the Y direction orthogonal to the X direction at one end of the upper surface of the base 1 a in the X direction. Similarly, two X-axis moving beams 8 having a linear drive mechanism are movably coupled in the Y direction. The mounting heads 9 are attached to the two X-axis moving beams 8 so as to be movable in the X direction. The mounting head 9 is a multiple head having a plurality of holding heads, and at the lower end portion of each holding head, a suction nozzle 9a (FIG. 2) capable of individually holding components by suction is provided. ing.

  Here, as shown in FIG. 2B, the mounting head 9 includes two nozzle rows NL1 and NL2 in which eight suction nozzles 9a are arranged in series in the X direction, and the mounting head 9 is a total of The 16 suction nozzles 9a are provided. In these suction nozzles 9a, nozzle numbers M (M = 1 to 16) for identifying the individual suction nozzles 9a are numbered.

  By driving the Y-axis moving beam 7 and the X-axis moving beam 8, the mounting head 9 moves in the X direction and the Y direction. As a result, the two mounting heads 9 suction and hold the components by the suction nozzle 9a from the component suction positions of the tape feeders 5 of the corresponding component supply units 4 and take them out, and mount the substrate 3 positioned in the substrate transport mechanism 2 Transfer and mount at coordinates. The Y-axis moving beam 7, the X-axis moving beam 8 and the mounting head 9 constitute a component mounting mechanism 10 for performing a component mounting operation for mounting a component on the substrate 3 by moving the mounting head 9 holding the component. . In the component mounting apparatus 1 shown in the present embodiment, the mounting head 9 transfers and mounts 16 components onto the substrate 3 in the mounting turn in which the mounting head 9 reciprocates between the component supply unit 4 and the substrate 3. Is possible.

  A component recognition camera 6 is disposed between the component supply unit 4 and the substrate transfer mechanism 2. The component recognition camera 6 obtains a three-dimensional image of a component held by the mounting head 9 by positioning the mounting head 9 obtained by removing the component from the component supply unit 4 above the component recognition camera 6. The mounting head 9 is mounted with a substrate recognition camera 11 positioned on the lower surface side of the X-axis moving beam 8 and moving integrally with the mounting head 9.

  As the mounting head 9 moves, the substrate recognition camera 11 moves above the substrate 3 positioned by the substrate transport mechanism 2. Then, the position recognition mark (not shown) of the substrate 3 is imaged. In the present embodiment, in addition to the imaging of the position recognition mark described above, the board recognition camera 11 is a bad mark applied to the unit board 3a (refer to FIG. 3) constituting the board 3 to indicate the result of good or bad judgment. It also has a function of detecting the presence or absence of the BM (see FIG. 3B).

  As shown in FIG. 2, the carriage 12 in a state in which the plurality of tape feeders 5 are attached to the feeder base 12 a in advance is set in the component supply unit 4. A feeder address for specifying a feeder position at which each tape feeder 5 is attached is set to the feeder base 12a, and in component mounting work, each tape in the feeder base 12a is connected via these feeder addresses. Parts stored in the carrier tape 14 set in the feeder 5 are identified. The carriage 12 mounted on the parts supply unit 4 holds a supply reel 13 for storing the carrier tape 14 containing the parts in a wound state. The carrier tape 14 drawn out from the supply reel 13 is pitch-fed by the tape feeder 5 to a component suction position by the suction nozzle 9a.

  Next, with reference to FIG. 3, the substrate 3 to be worked by the component mounting apparatus 1 will be described. As shown in FIG. 3A, the substrate 3 is a multi-faceted substrate in which a plurality of (in this case, 24) unit substrates 3a are formed, and in order to distinguish each of the unit substrates 3a (1) The numbers of (24) are attached. As shown in FIG. 3B, a plurality of components P constituting wiring circuits of the same pattern are mounted on each unit substrate 3a. In the example shown here, 62 components P including different types are mounted on each of the 24 unit substrates 3a.

  In the component mounting operation for mounting the component P on the substrate 3 by the component mounting apparatus 1 in the present embodiment, the mounting head 9 holding the component P on each of the plurality of suction nozzles 9a is the component supply unit 4 and the substrate 3 By repeatedly executing the component mounting operation (mounting turn) reciprocating between them, the components P are sequentially mounted on each unit substrate 3a. That is, in the component mounting operation in the component mounting apparatus 1, a plurality of components P taken out of the component supply unit 4 by the mounting head 9 are mounted on the substrate 3 for the substrate 3 which is a multiple chamfered substrate consisting of a plurality of unit substrates 3 a A series of component mounting operations to be performed is one mounting turn. A plurality of components P are mounted on the substrate 3 by causing the mounting head 9 to perform a component mounting operation based on mounting data consisting of a plurality of predetermined mounting turns.

  As shown in FIG. 3B, a bad mark application position (BM) for applying the determination result of the inspection performed in the inspection apparatus on the upstream side is set to each unit substrate 3a. That is, in the upstream side apparatus, an inspection for determining whether the unit substrate 3a is usable as a product is performed, and a defective unit substrate determined to be unusable in this inspection is applicable to the bad mark application position (BM). A bad mark BM indicating that the unit substrate 3a is a defective unit substrate is applied.

  In imaging by the substrate recognition camera 11 targeting the substrate 3 carried into the component mounting apparatus 1, the unit substrate 3a for which the bad mark BM is detected at the bad mark application position is inappropriate to be a target for component mounting work It is determined that the defective unit substrate 3a * is mounted, and the mounting of the component P in the component mounting apparatus 1 is canceled for the defective unit substrate 3a *. In FIG. 3C, in the substrate 3 shown in FIG. 3A, the unit substrates 3a with the numbers (3), (10) and (21) become the defective unit substrates 3a * to which the bad marks BM are attached. ing. In this case, all the component mounting operations originally planned for the unit substrates 3a (3), (10) and (21) are canceled.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 4, the component mounting apparatus 1 is connected to the host system and other devices constituting the component mounting system via the communication network 22 and the communication unit 21, and acquires various data and information from the other devices. Is possible. The control unit 20 is a control device having a CPU function, and controls each unit described below based on various programs and data stored in the storage unit 23. The storage unit 23 stores mounting data 24 including turn data 25 and defective board information 26. The mechanism driving unit 27 is controlled by the control unit 20 to drive the substrate transfer mechanism 2 and the component mounting mechanism 10. At the time of this operation control, various data stored in the storage unit 23 are referred to.

  The mounting data 24 is production data to be referred to in the component mounting operation for the substrate 3. In the case of the present embodiment, the turn data 25 is included together with the arrangement of the unit substrates 3a on the substrate 3, the component type of the component P mounted on each unit substrate 3a, and mounting coordinate data indicating the mounting position. The turn data 25 is data defining an execution mode of a mounting turn in which the mounting head 9 reciprocates between the component supply unit 4 and the substrate 3 for component mounting.

  That is, as shown in FIG. 5, in the turn data 25, for each "turn No." 25a indicating the execution order of each mounting turn, each suction nozzle 9a indicated by "nozzle No." 25b in the mounting turn holds The type of part P is defined. Here, in FIG. 5, the parts P held by the respective suction nozzles 9a are described in a subscript form of "Pij", and (ij) represents the (i) th turn No. The nozzle No. It shows that the component P is held by the suction nozzle 9a of (j).

  In the component mounting operation, by referring to the mounting data 24 including the turn data 25, the mounting head 9 for aligning the component P held by each suction nozzle 9a of the mounting head 9 with the corresponding mounting coordinates. Movement control is performed. The defective substrate information 26 is information related to the defective unit substrate 3a * in the substrate 3. By referring to the defective substrate information 26, the defective unit substrate 3a * is specified for each substrate 3 carried in.

  The recognition processing unit 28 recognizes an imaging result by the substrate recognition camera 11 and the component recognition camera 6. By performing recognition processing on the imaging result of the substrate 3 by the substrate recognition camera 11, the position recognition of the position recognition mark of the substrate 3 is performed. The recognition result of the imaging result by the component recognition camera 6 is recognized to recognize the component P held in the mounting head 9. In the component mounting operation on the substrate 3 by the mounting head 9, the mounting position correction is performed in consideration of the recognition result of the component by the component recognition camera 6 and the substrate recognition result of the substrate recognition camera 11. Further, the imaging result of the substrate 3 is recognized by the substrate recognition camera 11 to detect the presence or absence of the bad mark BM in each unit substrate 3a. Then, the unit substrate 3a in which the bad mark BM is detected is stored in the storage unit 23 as the defective substrate information 26.

  Therefore, the substrate recognition camera 11 and the recognition processing unit 28 function as a defective substrate information acquisition unit that acquires defective substrate information on whether or not there is a defective unit substrate 3a * for a plurality of unit substrates 3a. It should be noted that instead of acquiring the defective substrate information based on the imaging result by the substrate recognition camera 11, if the inspection device disposed on the upstream side has a function of specifying the defective unit substrate 3a *, the substrate The defective board information acquired every three may be acquired via the communication network 22 and the communication unit 21 and stored in the storage unit 23 as the defective board information 26. In this case, the communication network 22 and the communication unit 21 become a defective substrate information acquisition unit that acquires defective substrate information on whether or not there is a defective unit substrate 3a * for a plurality of unit substrates 3a.

  When there is a defective unit substrate 3a * in the plurality of unit substrates 3a, the cancellation component presence / absence determination unit 29 determines whether or not the cancellation components Pc in which the mounting on the defective unit substrate 3a * is canceled for each of the plurality of mounting turns. (Refer to the correction processing flow of all mounting turns shown in FIG. 6). The complementing processing unit 30 determines that the canceled part Pc is included among the plurality of mounting turns, and the corrected mounting turn requiring the correction of the part mounting operation is a complementary part PR including the canceled part Pc in the other corrected mounting turns. A process of complementing with (a component other than the cancel component Pc) is performed (see the complementary processing flow in the correction mounting turn shown in FIG. 7).

  Next, with reference to FIG. 6, FIG. 7, and FIG. 8, the component mounting method by the component mounting apparatus 1 shown in the present embodiment will be described. This component mounting method is a series of component mounting operations for mounting a plurality of components P taken out of the component supply unit 4 by the mounting head 9 on the multi-chamfered substrate 3 for the multi-chamfered substrate 3 consisting of a plurality of unit substrates 3a Is one mounting turn, and the component is mounted on the multiple-circumferential board 3 based on mounting data 24 consisting of a plurality of predetermined mounting turns.

  First, correction processing of all mounting turns in the above-described component mounting method will be described with reference to the flow of FIG. Here, for the “turn No.” 25a shown in the turn data 25 of FIG. 5, when there is a defective unit substrate 3a *, the mounting on the defective unit substrate 3a * is canceled for each of the plurality of mounting turns. The processing function of the cancellation part presence / absence determination unit 29 is used to determine whether the canceled part Pc is included. That is, in the process executed here, if there is a defective unit substrate 3a * in a plurality of unit substrates 3a, whether or not the cancel parts Pc whose mounting on the defective unit substrate 3a * is canceled for each of the mounting turns are included. Is a process of determining

  When correction processing of all mounting turns is started (ST1), first, the number N as an index specifying "turn No." 25a is set to N = 0, and then the turn data is rearranged (ST2). Here, sorting is performed in order of decreasing number of cancel parts Pc included in the turn data. Thereby, the corrected turn data 25A shown in FIG. 8 is created. That is, as shown in FIG. 8, similarly to the turn data 25 in the post-correction turn data 25A, for each "turn No." 25a indicating the execution order of each mounting turn, "nozzle No." 25b in the mounting turn. The kind of the part P which each suction nozzle 9a shown hold | maintains is prescribed | regulated. In the post-correction turn data 25A created in this way, the number of cancel parts Pc (hatched parts P) is small for the mounting turns with small “turn No.” 25a described at the top of the data table, The percentage of the canceled parts Pc is large for the mounting turn where the "turn No." 25a is large described in the lower part of the data table.

  Next, the number N is incremented to N + 1 (ST3), and the data of the Nth mounting turn is referred to (ST4). Then, it is determined whether or not there is a cancellation component Pc in the mounting turn (ST5). In the example shown in the present embodiment, the component P originally assigned to the defective unit substrate 3a * (3), (10) and (21) shown in FIG. 3C corresponds to the cancel component Pc. Then, in the case of YES in (ST5), that is, for a mounting turn including such a cancellation part Pc, a complementing process is executed as a correction mounting turn (ST6).

  Then, in the case of YES in (ST5) and after performing the complementing process of (ST6), it is checked whether the process has been completed for all mounting turns (ST7). If YES here, the process ends in (ST8). If NO in (ST7), the process returns to (ST3) and repeats the subsequent processes until YES is confirmed in (ST7).

  Next, the complementing process in the correction mounting turn shown in (ST6) in the flow of FIG. 6 will be described with reference to FIG. Here, first, “Turn No.” 25a (2A) determined to have cancel parts Pc in the post-correction turn data 25A is to be corrected. At the start of processing (ST1), the nozzle number M specifying the suction nozzle 9a in the mounting head 9 is set to an initial value (M = 0), and then the nozzle number M is stepped to M + 1 (ST2). Next, the Mth part is referred to (ST13).

  In this manner, in the process of confirming the component data in the order of M = 1, 2,..., It is determined whether the component data corresponds to the cancellation component Pc (ST14). In the example shown in FIG. 8, since the component data corresponding to the suction nozzle 9a of M = 2 is the cancel component Pc, the determination of (ST14) is YES. In this case, parts of the same type are searched from the turn data of the other modified mounting turn (ST15). If there are a plurality of parts of the same type as a result of the search, a part of mounting coordinates close to the cancellation mounting coordinates (mounting coordinates at which the mounting of the cancellation parts Pc is canceled) is selected from them. Then, it is determined whether the selection is successful (ST16).

  In the example shown here, the part corresponding to the suction nozzle 9a of M = 2 in the mounting turn whose “turn No.” 25a is (93A) in FIG. 8 meets this condition, and this part P ** The “turn No.” 25a to be corrected is selected as a complementary part PR that complements the part corresponding to the suction nozzle 9a of M = 2 in (2A) (see arrow a).

  If the parts of the same type can not be selected in (ST15), that is, if the selection is not successful in (ST16), the mounting data closer to the cancellation mounting coordinates from the turn data of the other correction mounting turns The part of the coordinate is selected (ST17). That is, in this case, although the type of component is different, the complementary component PR is selected with the proximity to the cancellation mounting coordinates which was to be mounted before the correction as the priority of selection.

  Then, if it is determined as NO in (ST14) and the part does not correspond to the cancel part Pc, or if the selection is successful in (ST16), the process proceeds to (ST18) and whether M = 16 or not In other words, it is determined whether the process has been completed for all the suction nozzles 9 a of the mounting head 9. Here, if the process has not been completed for all the suction nozzles 9a, the process returns to (ST12), and the subsequent processes are similarly repeated, and the process is completed for all the suction nozzles 9a in (ST18). To complete the complementing process of the cancellation part Pc.

  Similarly, for the other "turn No." 25a determined to have cancel parts Pc in the post-correction turn data 25A, for example, "turn No." 25a (3A), a part corresponding to the suction nozzle 9a of M = 4. Is the target of the complement process. In this case, the part corresponding to the suction nozzle 9a of M = 3 in the mounting turn in which the "turn No." 25a is (91A) in FIG. 8 meets this condition. The "turn No." 25a to be corrected is selected as a complementary part PR that complements the part corresponding to the suction nozzle 9a of M = 4 in (3A) (see the arrow b).

  Further, with regard to the “turn No.” 25a (4A), the component corresponding to the suction nozzle 9a of M = 15 is the target of the complementing process. In this case, the part corresponding to suction nozzle 9a of M = 15 in the mounting turn in which "turn No." 25a is (92A) in FIG. 8 meets this condition, and this part P ** is The "turn No." 25a to be corrected is selected as a complementary part PR for complementing the part corresponding to the suction nozzle 9a of M = 15 of (4A) (see the arrow c).

  As described above, when the defective unit substrate 3a * is detected, the mounting of all the parts P allocated to the defective unit substrate 3a * is canceled in the initial mounting data. Then, in the complementing process in the correction mounting turn, for the mounting turn in which the hole in the data is generated by the cancellation, the hole allowance is complemented by the complementary component PR selected from the other correction mounting turns.

  At this time, as shown in FIG. 8, since the rearrangement of the turn data performed prior to the complementing process is performed in the ascending order of the number of cancel parts Pc included in the corresponding turn data, the correction is made. In the post-turn data 25A, the "turn No." 25a located at the end of the table such as "turn No." 25a (93A), (92A). . Then, by selecting and extracting all parts belonging to one turn data, the mounting turn corresponding to the turn data disappears. Thus, the correction of the turn data makes it possible to reduce the number of mounting turns.

  For example, as shown in the present embodiment, when there are three defective unit substrates 3a *, 62 × 3 = 186 canceled parts Pc are generated, so the number of these parts is 16 suction nozzles 9a. In terms of the number of mounting turns for transferring and mounting the component P according to, it corresponds to at least 11 mounting turns. That is, it becomes possible to complete the component mounting operation for the substrate 3 which required 93 mounting turns in the initial turn data 25 with 82 mounting turns obtained by reducing the reduction described above. There is.

  That is, the above-described process includes a cancellation part Pc among the plurality of mounting turns so as to reduce the number of mounting turns of the plurality of mounting turns specified in advance, and the cancellation part in the correction mounting turn requiring correction of the component mounting operation. It is a complementary process that complements Pc with a complementary part PR included in another correction mounting turn. Then, in the present embodiment, in this complementation process, the complementation part PR is selected so as to complement the cancel parts Pc as much as possible with the parts of the same type as the cancellation parts Pc. By adopting such a complementation form, it is possible to make the part arrangement in the turn data after correction as close as possible to the part arrangement at the beginning of the preparation of mounting data as much as possible, and it is possible to minimize the influence of data change. .

  As described above, when complementation can not be performed with parts of the same type as the cancellation part Pc, the mounting coordinates of the cancellation part Pc to be targeted is cancellation mounting coordinates (the mounting of the cancellation part Pc is the next best method) Complement with a part (complementary part PR) close to the canceled mounting coordinates). That is, assuming that the mounting coordinates at which the mounting of the cancel part Pc has been canceled is taken as the cancellation mounting coordinates, and the cancel part Pc can not be complemented by the parts of the same type in the complementing process, I try to complement it. By adopting such a complementation form, the movement form of the mounting head 9 based on the post-correction turn data can be made as similar as possible to the movement form at the time of preparation of the mounting data as much as possible. Is possible.

  In this way, if M = 16, that is, completion processing of the cancel parts Pc necessary for all the suction nozzles 9a is completed, the mounting operation is performed such that the total movement distance in the complemented corrected mounting turns is minimized. The sequence of is changed (ST19), and with this sequence change, the complementing process flow in the modified mounting turn is ended (ST20). FIG. 9 schematically shows an example of the sequence change of the mounting operation performed in (ST19).

  FIG. 9A shows the movement path of the mounting head 9 before the sequence change, and the mounting coordinates P1 to the mounting coordinates P8 indicate the parts P held by the respective suction nozzles 9a. In this movement path, with mounting coordinates P1 as a mounting start point, → (arrow d) mounting coordinates P2 → (arrows e) mounting coordinates P3 → (arrows f) mounting coordinates P4 → (arrow g) mounting coordinates P5 → (arrow h The mounting operation is executed along the movement path of mounting coordinates P6 → (arrow i) mounting coordinates P7 → (arrow j) mounting coordinates P8.

  9B shows the movement path of the mounting head 9 after the sequence change, and in this movement path, the movement path from the mounting start point to the mounting coordinate P5 is shown in FIG. It is the same as the path shown in a), but then → (arrow k) mounting coordinate P7 → (arrow l) mounting coordinate P8 → (arrow m) moving path of mounting coordinate P6 The mounting operation is executed along the moving route as That is, in the above-described sequence change, the mounting operation efficiency is improved by optimizing the mounting order so that the total movement distance of the mounting head 9 becomes short in the complemented correction mounting turn.

  As described above, according to the component mounting method described in the present embodiment, when mounting the component P on the substrate 3 which is a multi-chamfering substrate based on the mounting data 24 consisting of a plurality of predetermined mounting turns, When there is a defective unit substrate 3a * in the unit substrate 3a, it is determined whether or not each of the mounting turns includes a canceled part Pc whose mounting on the defective unit substrate 3a * is canceled, and a plurality of predetermined mountings Of the multiple mounting turns, the cancellation part Pc is included so as to reduce the number of mounting turns. In the correction mounting turn that requires correction of the part mounting operation, the cancellation part Pc is included in the other correction mounting turns It is made to complement by non-complementary parts PR. As a result, in the case where a multi-chamfered substrate including the defective unit substrate 3a * is targeted, unnecessary mounting turns can be reduced to suppress a decrease in productivity.

  The component mounting method and the component mounting apparatus according to the present invention have an effect of being able to reduce unnecessary mounting turns and suppress a decrease in productivity when targeting a multi-chamfered substrate including a defective unit substrate. The present invention is useful in the component mounting field where components are mounted on a multiple substrate.

1 Component mounting apparatus 3 Substrate 3a Unit substrate 3a * Defective unit substrate 4 Component supply unit 9 Mounting head 10 Component mounting mechanism P component Pc Canceling component PR Complementary component

Claims (5)

A plurality of component mounting operations for mounting a plurality of components taken out of the component supply section by the mounting head on the multi-chamfered substrate for a multi-chamfered substrate consisting of a plurality of unit substrates is one mounting turn. A component mounting method for mounting a component on the multi-chamfered substrate based on mounting data consisting of
If there is a defective unit substrate in the plurality of unit substrates, it is determined whether or not each of the plurality of mounting turns includes a canceled component whose mounting on the defective unit substrate is canceled;
Of the plurality of mounting turns, it is determined that the canceled part is included, and in the case of a modified mounting turn requiring correction of the part mounting operation, the cancellation is performed so that the number of mounting turns of the plurality of mounting turns defined in advance is reduced. the part, only contains a complementary step, to complement in a complementary parts that are included in other modifications implementation turn,
The plurality of mounting turns are sorted in ascending order of the number of the canceled parts,
A component mounting method, wherein in the complementing step, the cancel component included in the correction mounting turn is complemented by a complementing component included in a correction mounting turn after the correction mounting turn .   The component mounting method according to claim 1, wherein in the complementing step, the cancel component is complemented by a component of the same type as the cancel component. The mounting coordinates at which the mounting of the cancel component has been canceled is taken as the cancellation mounting coordinates,
The component mounting method according to claim 2, wherein, in the complementing step, when the cancel component can not be complemented by a component of the same type, the cancel component is complemented by a component whose mounting coordinates are close to the cancel mounting coordinates.   The component mounting method according to any one of claims 1 to 3, wherein the mounting order is optimized so that the total movement distance of the mounting head becomes short in the complemented corrected mounting turn. A plurality of component mounting operations for mounting a plurality of components taken out of the component supply section by the mounting head on the multi-chamfered substrate for a multi-chamfered substrate consisting of a plurality of unit substrates is one mounting turn. A component mounting apparatus for mounting a component on the multi-chamfered substrate based on mounting data consisting of
A component mounting mechanism for executing the component mounting operation;
A defective substrate information acquisition unit that acquires defective substrate information indicating whether or not there is a defective unit substrate for the plurality of unit substrates;
When there is a defective unit board in the plurality of unit boards, a cancel component presence / absence determination unit that determines whether or not a canceled part whose mounting on the defect unit board is canceled is included in each of the plurality of mounting turns;
Among the plurality of mounting turns, it is determined that the canceled part is included, and in the correction mounting turn requiring correction of the part mounting operation, the number of mounting turns of the plurality of mounting turns defined in advance is reduced. And a complementary processing unit that complements the canceled part with the complementary part included in the other modified mounting turn ,
The plurality of mounting turns are sorted in ascending order of the number of the canceled parts,
The component mounting apparatus, wherein the complement processing unit complements the canceled component included in the corrected mounting turn with a complementary component included in a corrected mounting turn that follows the corrected mounting turn .

Images