JP2008205318A - Checking method of suction nozzle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a checking method of a suction nozzle for producing a part mounting board accurately and efficiently, in a part mounter provided with the suction nozzle for sucking an electronic part and mounting it to the board. <P>SOLUTION: This method relates to checking up the suction nozzle which is provided in the part mounter for sucking the part and mounting it on the board. This method contains; the component information obtaining step S1 of obtaining identification information of respective components stored in storing means disposed in respective components constituting the suction nozzle; and the first determining step S2 of determining whether a combination of a plurality of identification information items is right in accordance with whether the plurality of obtained identification information items have a predetermined relationship. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for collating suction nozzles that are attached to a mounting head and suck electronic components and mount them on a substrate in a component mounter that mounts components such as electronic components on a substrate.

  2. Description of the Related Art Conventionally, a component mounter that mounts electronic components on a printed circuit board is, for example, an electronic component that is stored or fixed on a component tape while the component tape is pulled out from a reel on which the component tape that stores or fixes the electronic component is wound. Take out.

  Further, the picked-up electronic component is picked up using a pick-up nozzle attached to the mounting head, the picked-up electronic component is recognized and corrected using a recognition camera, and the electronic component is mounted on a printed circuit board.

  In recent years, in a component mounter that performs such an operation, various types of suction nozzles corresponding to the types of components can be mounted on the mounting head so as to be compatible with various types of components.

  Therefore, almost all types of electronic components (from 0.4 mm × 0.2 mm chip resistance to 200 mm connector as the components to be mounted) can be mounted on the board, and the required number of such component mounting machines are arranged. Thus, a substrate production line can be configured.

  In addition, when configuring such a production line, various types can be achieved by selecting the type of mounting head and suction nozzle to be equipped for each component mounter, the type of component supply unit, etc., and combining these component mounters in a modular manner. Types of production lines. Therefore, such a component mounting machine is sometimes called a modular machine.

  In recent component mounting machines, the mounting head moves to a nozzle station that holds a plurality of replacement suction nozzles, and automatically performs replacement of the suction nozzles (hereinafter referred to as “nozzle replacement”). There is something that can be done. However, even in a component mounter that automatically performs nozzle replacement, the placement of the suction nozzles in the nozzle station is manually performed by an operator.

  On the other hand, in a component mounter that cannot replace the nozzle while the equipment is in operation, or a component mounter that eliminates the nozzle replacement function, it matches the type of electronic component that the operator installs on the board before starting production. The suction nozzle is manually attached to the mounting head.

  Therefore, when the operator manually replaces or attaches the suction nozzle, an erroneous replacement or attachment of the suction nozzle can occur. This is because the operator is likely to make a determination error because there are many types of suction nozzles.

  Further, even when the component mounting machine has a function of automatically replacing the suction nozzle, as described above, the placement of the suction nozzle in the nozzle station is manually performed by an operator. For this reason, the type of suction nozzles that are planned are not always correctly arranged at the planned positions.

  Under such circumstances, component mounting may be performed with an incorrect suction nozzle arrangement pattern, that is, an incorrect suction nozzle arrangement. In this case, the problem that the mounting precision of the electronic component to the board | substrate and the fall of the adsorption | suction rate of an electronic component will arise will occur.

In view of this, a technique for suppressing the occurrence of the above-described problem by acquiring information indicating an actual suction nozzle array from a component mounting machine and comparing the information with a correct suction nozzle array is also disclosed (for example, Patent Document 1). reference).
JP 2006-108138 A

  In recent years, in order to achieve higher functionality and downsizing of electronic devices, and to reduce the production cost of electronic devices, it has been possible to produce component mounting boards more accurately and efficiently than the current situation. There is a strong demand.

  Here, the above-mentioned conventional technology is a technology that suppresses the occurrence of problems caused by errors in the suction nozzle arrangement by focusing on the suction nozzle arrangement in the component mounting machine and judging the suitability of the actual suction nozzle arrangement. is there.

  Therefore, for example, when the correct suction nozzle arrangement is “a, b, c” (a, b, c represent the types of suction nozzles), the actual suction nozzle arrangement is “a, b, c”. ", Component mounting is performed as it is.

  However, the suction nozzle is manufactured by using a base body having a flange to be attached to the mounting head as a main body and assembling the base body and other components such as a nozzle tip portion for sucking parts.

  Further, if the substrate is shown as “a”, for example, the suction nozzle is recognized as “a”.

  For this reason, the suction nozzle that is recognized as “a” may incorporate a component that is not inherently correct as the suction nozzle for “a”, for example, a nozzle tip that is not for “a”. .

  FIG. 22 is an exploded perspective view showing main components of a conventional suction nozzle. In the figure, only the main components of the suction nozzle are shown, and the other components are not shown.

  The suction nozzle 311 shown in FIG. 22 has a base 312, a background plate 313, a spring 314, and a nozzle tip 315.

  Note that the background plate 313 is a component that becomes the background when the component adsorbed by the nozzle tip 315 is recognized and transmitted. Therefore, it is not necessary when used in a component mounter that does not transparently recognize components.

  Thus, the suction nozzle has a plurality of components and can be disassembled. Thus, the operator can disassemble the suction nozzle and perform maintenance such as repair, cleaning, and replacement of each component.

  Therefore, for example, when an operator disassembles a suction nozzle and then assembles it, there is a possibility that the constituent parts of the suction nozzle and the constituent parts of other suction nozzles are assembled in combination. Further, there is a possibility that the suction nozzle is assembled while the originally required components are missing.

  Therefore, even if the actual nozzle arrangement is “a, b, c”, for example, the nozzle tip to be used for “a” and the nozzle tip to be used for “b” are interchanged. there is a possibility.

  In this case, the part that “a” should be picked up by itself is picked up by the nozzle tip to be used for “b”, and the part is not picked up, or the part is not held at the nozzle tip in the correct posture. Adsorption mistakes such as may occur.

  Conventionally, the combination of a component and a suction nozzle that mounts the component on a substrate is determined mainly by attributes such as the size and shape of the component and the nozzle, which are so-called visible or easy to measure. Yes.

  When the component mounting is performed with the combination of the component determined in this way and the suction nozzle, each suction nozzle can suck the component at a correct position, hold the component in a correct posture, and the like.

  However, even in such a case, for example, when the suction nozzle picks up the component or mounts the component on the substrate, the characteristics caused by the material of the nozzle tip portion which is a constituent part of the suction nozzle are incompatible with the component. For this reason, the nozzle tip may be missing, or the component and the nozzle tip may stick.

  Also, for example, even when a part is sucked at the tip of the nozzle suitable for the part, the background plate is not incorporated at the time of assembling the suction nozzle, so that the part recognition cannot be substantially performed. In some cases.

  That is, according to the conventional technique, it is possible to determine whether or not the arrangement is correct in units of suction nozzles. As a result, the probability that each of the plurality of suction nozzles attached to the mounting head correctly sucks and mounts the component can be maintained at a certain level or higher.

  However, the suction nozzle is manufactured by assembling a plurality of components as described above. Therefore, there are cases where each component is assembled in an inherently incorrect combination, and it is not possible to prevent the occurrence of errors such as a suction error due to this.

  In addition, regarding the suction nozzle that is determined to be suitable for mounting a certain component on the board, when considering the component part of the suction nozzle, it is actually a combination of component parts that are not suitable for the implementation of that component This also causes errors.

  In consideration of the above-described problems, the present invention provides a suction nozzle for accurately and efficiently producing a component mounting board in a component mounting machine having a suction nozzle for sucking and mounting an electronic component. The purpose is to provide a verification method.

  In order to achieve the above object, a suction nozzle collation method of the present invention is a method for collating a suction nozzle that is provided in a component mounting machine and sucks a component and mounts it on a substrate, and constitutes the suction nozzle Depending on whether or not the component information acquisition step for acquiring the identification information of each component stored in the storage means arranged in each unit and the plurality of acquired identification information have a predetermined relationship, A first determination step of determining whether or not the combination of the plurality of identification information is correct.

  Thus, according to the suction nozzle collation method of the present invention, it is possible to determine whether the combination of the constituent parts of the suction nozzle is correct.

  As a result, it is possible to prevent the occurrence of an error due to an incorrect combination of the components in the suction nozzle, which has occurred in the past. For example, it is possible to prevent the occurrence of a suction error or the like caused by the fact that the nozzle tip portion of a certain suction nozzle is not originally suitable as a constituent portion of the suction nozzle due to its size or shape.

  As a result, the component mounting board can be produced accurately and efficiently by the component mounting machine.

  Further, in the component information acquisition step, characteristic information indicating characteristics of the component corresponding to each of the identification information is acquired, and the collation method further acquires component information relating to a component sucked by the suction nozzle. The component information acquisition step to be performed and the characteristic information and the component information are collated to determine whether or not the combination of the plurality of components is a combination suitable for adsorption of the component or mounting on the substrate. A second determination step.

  Thereby, the compatibility of each component mounted on the board and the suction nozzle that actually sucks and mounts these parts on the board can be determined on a unit basis.

  In addition, the suction nozzle includes, as the component, a nozzle tip portion that sucks a component, and a background plate that serves as a background when the component sucked by the nozzle tip portion is optically recognized. The information includes a suction condition to be satisfied by the suction nozzle for suction of the component, and a recognition condition to be satisfied by the suction nozzle for recognition of the component. In the second determination step, the nozzle tip portion When the characteristic information of the nozzle satisfies the suction condition and the characteristic information of the background board satisfies the recognition condition, it is determined that the combination of the nozzle tip and the background board is suitable for suction of the component or mounting on the board You may do that.

  As a result, for example, it is possible to prevent a suction error from occurring due to the use of a nozzle tip that is not suitable for suction of the component, or a recognition error from occurring because the suction nozzle does not have a background plate. be able to.

  Further, the storage means may be an IC (Integrated Circuit) tag, and in the component information acquisition step, the characteristic information may be acquired by reading the characteristic information stored in the IC tag.

  In this way, by using an IC tag that is a very fine storage means as a storage means in the present invention, for example, a storage means having a sufficient storage capacity in an aspect that does not interfere with component mounting in each component part. There is an advantage that it can be arranged.

  As a result, for example, it is possible to store a large amount of information indicating various characteristics for each component, and it is possible to make a more detailed determination in the above-described suitability determination.

  In addition, the characteristic information includes availability information indicating whether or not a component corresponding to the property information can be used, and the collation method further cannot use any of the plurality of components based on the availability information. It may be possible to include a third determination step for determining whether or not.

  This makes it possible to determine whether the suction nozzle can actually be used for component mounting in units of components. That is, when a suction nozzle has at least one component that cannot be used, it is possible to prevent the suction nozzle from being used, and mounting accuracy and production efficiency in the production of a component mounting board. Is improved.

  Further, when the detection step of detecting the degree of malfunction of the constituent part and the detected degree of malfunction is greater than or equal to a threshold, the constituent part is unusable and the degree of malfunction is less than the threshold. In this case, the configuration unit may include a determination step for determining whether or not the component is usable, and a writing step for writing the determination result in the determination step to the storage unit as the permission information.

  Such determination of availability is, for example, processing performed by a computer, and writing of availability information to the storage means is realized by the computer controlling the writing device.

  Therefore, for example, it is possible to prevent the unusable component from being used for component mounting without the operator himself / herself determining whether or not each component can be used.

  In addition, when the degree of malfunction is less than the threshold, it is determined that the component is usable, and the determination result is written in the storage means as availability information, so that the component can be reused efficiently. It becomes.

  Specifically, the component may become usable by performing cleaning, repair work, or the like on the component that has become unusable. That is, there are cases where the component can be reused. In this case, it is not necessary for the operator to determine whether or not the suction nozzle including the component is usable and to write to the storage means, and the component can be reused efficiently.

  The present invention can also be realized as a component mounting method in which a component is mounted on a substrate by a component mounter using the verification method of the present invention.

  Specifically, in the component mounting method of the present invention, when it is determined in the first determination step that the combination of the plurality of identification information is a correct combination, the component is mounted on the board using the suction nozzle. When it is determined that the combination of the plurality of pieces of identification information is not a correct combination, a mounting step of mounting a component on the substrate with a suction nozzle having a combination of components different from the combination of the plurality of components is included.

  Moreover, it can also be realized as a nozzle verification device having a function of executing characteristic steps in the verification method of the present invention.

  Further, the suction nozzle of the present invention has storage means in which at least identification information is stored in each component. As a result, it is possible to determine whether the combination of the component parts is correct, to determine compatibility with the component in units of the component parts, and to determine whether or not it can be used.

  Moreover, the collation method of this invention can also be applied to the component of component mounting machines other than a suction nozzle. For example, a method of collating a feeder that is provided in a component mounter and that supplies a component to the component mounter, and that is stored in a storage unit disposed in each component that configures the feeder A first step of determining whether the combination of the plurality of pieces of identification information is correct according to whether or not the plurality of pieces of identification information acquired have a predetermined relationship; It can also be realized as a feeder verification method including a determination step.

  In addition, it goes without saying that each step in the collation method and the component mounting method of the present invention is realized by information processing by a computer having a CPU (Central Processing Unit), a storage device, a communication interface, and the like.

  Furthermore, the present invention can be realized as a program for causing a computer to execute characteristic steps in the collation method and the component mounting method of the present invention. It goes without saying that such a program can be distributed via a recording medium such as a CD-ROM or a transmission medium such as the Internet.

  According to the suction nozzle collating method of the present invention, it is possible to determine whether or not the combination of the components is the correct combination for the suction nozzle provided in the component mounting machine.

  Therefore, it is possible to prevent the use of suction nozzles configured in an incorrect combination. Thereby, components can be mounted on a substrate with high accuracy, and efficient production of a component mounting substrate can be realized.

  Further, it can be determined whether or not the combination of the constituent parts of the suction nozzle is an appropriate combination for part suction and the like, and whether or not the suction nozzle includes an unusable constituent part.

  That is, it is possible to determine the suitability of the suction nozzle and whether or not the suction nozzle can be used in units of components. Accordingly, it is possible to scrutinize whether or not the suction nozzle is used more precisely, and it is possible to further improve the mounting accuracy and efficiency in the production of the component mounting board.

  Hereinafter, embodiments of a component mounting system and a component mounter using the suction nozzle collating method of the present invention will be described with reference to the drawings.

  First, the configuration of the component mounting system and each device in the embodiment will be described with reference to FIGS.

FIG. 1 is a configuration diagram showing a configuration of a component mounting system in the embodiment.
The component mounting system shown in FIG. 1 is a system that mounts electronic components (hereinafter simply referred to as “components”) while sending circuit boards (hereinafter simply referred to as “substrates”) from upstream to downstream. .

  As shown in FIG. 1, the component mounting system according to the embodiment includes two component mounters 100 and 200 and a nozzle verification device 800 that constitute a production line.

  The component mounter 100 and the component mounter 200 are component mounters having the same configuration and the same functions. Therefore, a description of the configuration and operation of the component mounter 200 and a description of information exchange between the component mounter 200 and the nozzle verification device 800 are omitted.

  The component mounter 100 includes two sub facilities (a front sub facility 110 and a rear sub facility 120) that perform component mounting simultaneously and independently.

  Each of the front sub-equipment 110 and the rear sub-equipment 120 is an orthogonal robot type mounting stage, which includes component supply units 115a and 115b, a multi mounting head 112 (hereinafter simply referred to as “mounting head 112”), and an XY robot 113. , A component recognition camera 116, a tray supply unit 117, an RW (Read and Write) unit 701, and the like.

  The component recognition camera 116 may be movably disposed on the mounting head 112. An arrangement example of the component recognition camera 116 will be described with reference to FIG.

  Each of the component supply units 115a and 115b includes an array of up to 48 feeders 114 for storing component tapes.

  The mounting head 112 includes ten suction nozzles 301 by having ten heads each having one suction nozzle 301 detachably attached thereto.

  Such a mounting head 112 is also called a 10 nozzle head. Further, the mounting head 112 itself may be simply referred to as a head.

  The mounting head 112 can use the ten suction nozzles 301 to suck and mount a maximum of ten components from the feeder 114 on the substrate 20.

  The XY robot 113 is a component that moves the mounting head 112. The component recognition camera 116 is a component that inspects the suction state of the component sucked by the mounting head 112 two-dimensionally or three-dimensionally.

  The tray supply unit 117 is a component that supplies tray components. Each of the four IC tags of the IC tags 500a to 500d is an example of a storage unit in the verification method of the present invention, and is a device that performs contactless communication using a so-called RFID (Radio Frequency Identification) technology.

  Moreover, in this Embodiment, it arrange | positions 1 each at the main structure part of the suction nozzle 301. FIG. Each component of the suction nozzle 301 will be described later with reference to FIG.

  Further, in the present embodiment, individual data, which is data relating to the components in which the IC tags 500a to 500d are arranged (hereinafter also simply referred to as “each IC tag”), is stored. ing. Each individual data will be described later with reference to FIGS.

  The RW unit 701 is a configuration unit that reads information stored in each IC tag and writes information to each IC tag.

  Each IC tag can store information received through communication with the RW unit 701 and can transmit the stored information to the RW unit 701.

  The front sub-equipment 110 and the rear sub-equipment 120 which are configured as described above and face each other execute component mounting on the boards in charge of them independently and in parallel.

  The component mounter 100 has a communication function for receiving information from the nozzle verification device 800 and transmitting information to the nozzle verification device 800.

  In the component mounting machine 100 configured as described above, operations such as reading of individual data from each IC tag by the RW unit 701 and information exchange with the nozzle verification device 800, and control of these operations are performed by the CPU. And information processing by a computer including a storage device and a communication interface.

  The nozzle verification device 800 is a device that determines whether the suction nozzle 301 attached to the mounting head 112 of the component mounter 100 is appropriate.

  More specifically, the apparatus determines whether or not the suction nozzle 301 attached to the mounting head 112 is configured by a combination of components that are inherently correct.

  The nozzle verification device 800 can also determine whether each component of the suction nozzle 301 is suitable for a component that the suction nozzle 301 sucks and is scheduled to be mounted on the substrate.

  The nozzle collating apparatus 800 includes a database unit 807, and the database unit 807 stores a component library including information for making the above determination. The component library will be described later with reference to FIG.

  In the present embodiment, as shown in FIG. 1, the nozzle verification device 800 is hardware different from the component mounter 100. However, the present invention is not limited to such a configuration. For example, the component mounter 100 may be configured to include the nozzle verification device 800.

  Further, the component mounting machine 100 shown in the figure is a mounting machine that has both functions of a component mounting machine called a high-speed mounting machine and a component mounting machine called a multi-function mounting machine.

  A high-speed mounting machine is a facility characterized by high productivity that mainly mounts parts of 10 mm square or less at a speed of about 0.1 seconds per point.

  The multi-function mounting machine is a facility for mounting large-sized parts of 10 mm square or more, atypical parts such as switches and connectors, and IC parts such as QFP (Quad Flat Package) and BGA (Ball Grid Array).

  In other words, the component mounting machine 100 is designed so that almost all types of components (from 0.4 mm × 0.2 mm chip resistance to 200 mm connectors as the components to be mounted) can be mounted. A production line for the substrate 20 can be configured by arranging the required number of component mounting machines 100.

FIG. 2 is a plan view showing a main internal configuration of the component mounter 100.
The shuttle conveyor 118 shown in FIG. 2 is a moving table (moving conveyor) for placing the components taken out from the tray supply unit 117 and transporting them to a predetermined position where they can be picked up by the mounting head 112.

  The nozzle station (nozzle ST) 119 is a table on which replacement suction nozzles 301 corresponding to various components are placed.

  The two component supply units 115a and 115b constituting the front sub-equipment 110 (rear sub-equipment 120) are respectively arranged on the left and right with the component recognition camera 116 interposed therebetween. Therefore, the mounting head 112 that has picked up the component in the component supply unit 115a or 115b moves to the mounting point of the substrate 20 after passing over the component recognition camera 116, and sequentially mounts all the sucked components. Further, by repeating such a series of suction and mounting operations one or more times, component mounting on one board 20 is completed.

  Note that the component supply unit 115a on the left side is also referred to as a “left block” and the component supply unit 115b on the right side is also referred to as a “right block” toward each sub facility.

  Further, by one operation (suction / moving / mounting) in a repetition of a series of operations of picking and moving the component by the mounting head 112 and mounting the sucked component on the substrate, or by such a single operation. A group of components to be mounted is called a “task”.

  For example, the maximum number of components mounted by one task is 10 by the mounting head 112 provided in the component mounting machine 100.

  Here, “suction” includes all suction operations from when the head starts to pick up components until it moves. For example, ten suction operations (up and down operation of the mounting head 112) This includes not only the case of simultaneously picking up parts but also the case of picking up 10 parts by a plurality of picking operations.

  The target of the collation method of the present invention is not limited to the suction nozzle used in the component mounting machine having the configuration shown in FIG. As long as the component mounting machine mounts a component on the board with the suction nozzle provided in the head, the suction nozzle used in the component mounting machine can be used for the collation method of the present invention. Can be targeted.

  For example, it may be an alternating component mounting machine in which two heads alternately perform a component mounting operation on a single substrate, or a rotary mounting machine in which a suction nozzle rotates intermittently around a rotary head.

  In any case, whether or not the combination of the constituent parts of the suction nozzles used in these component mounting machines can be appropriately determined by the verification method of the present invention.

  FIG. 3 is an external view of the mounting head 112. The mounting head 112 shown in the figure is a work head called a “gang pickup system”, and a maximum of ten suction nozzles 301 for suctioning and mounting parts independently can be attached and detached.

  In FIG. 3, ten suction nozzles 301 are expressed as suction nozzles 301a to 301b, and these suction nozzles 301a to 301b may all be of the same type, or may be of different types. is there.

  By using these ten suction nozzles 301a to 301b, it is possible to simultaneously suck components from each of up to ten feeders 114 (by one up and down movement of the mounting head 112).

  Specifically, the mounting head 112 moves to the component supply units 115a and 115b and sucks the components. At this time, for example, when ten parts cannot be picked up at the same time, a maximum of ten parts can be picked up by performing the picking up and down operation a plurality of times while moving the picking position.

  FIG. 4 is an exploded perspective view showing main components of the suction nozzle 301 in the embodiment. In the figure, only the main components of the suction nozzle 301 are shown, and the other components are not shown.

  As shown in FIG. 4, the suction nozzle 301 has a base 302, a background plate 303, a spring 304, and a nozzle tip 305, similarly to the conventional suction nozzle 311 shown in FIG.

  However, the suction nozzle 301 of the present embodiment is different from the conventional suction nozzle 311 in that an IC tag is disposed in each of these components.

  Specifically, an IC tag 500a is disposed on the base 302, an IC tag 500b is disposed on the background plate 303, an IC tag 500c is disposed on the spring 304, and an IC tag 500d is disposed on the nozzle tip 305.

  Note that the background plate 303 is a constituent part that becomes a background when the component attracted by the nozzle tip 305 is recognized as transmitted as described above. Therefore, although not shown in the drawing, the lower surface of the background plate 303 is black, and the component recognition camera 116 that images the component from below can optically recognize the contour of the component.

Further, the spring 304 is a pressing spring for buffering when the components are mounted.
Moreover, the arrangement position of the IC tag in each component shown in FIG. 4 is an exemplification, and may be a position other than that shown in the figure. Any position may be used for each component as long as it does not interfere with component mounting and can communicate with the RW unit 701.

  For example, the RW unit 701 may be arranged so that the distance between the IC tags is minimized so that information can be easily acquired from all the IC tags at once. Alternatively, each IC tag may be arranged so that the distance from the RW unit 701 is minimized.

  Further, in this embodiment, the collation method of the present invention will be described using the suction nozzle 301 having the configuration shown in FIG. 4, but the suction nozzle that is the target of the collation method of the present invention is other than the configuration shown in FIG. It may be.

  For example, the suction nozzle may be configured by the suction nozzle body including the base 302, the background plate 303, and the spring 304, and the nozzle tip 305.

  In this case, IC tags are arranged on the suction nozzle main body and the nozzle tip 305, respectively, and the respective unit IDs are stored. Thereby, it is possible to determine whether or not the combination of the suction nozzle body and the nozzle tip 305 is right before the mounting operation or the like.

  That is, the collation method of the present invention can be implemented without being limited to the number, type, and the like of the constituent parts of the suction nozzle, and in any case, the correctness of the combination of the constituent parts can be appropriately determined. .

  Further, as described above, individual data relating to the components where the IC tag is arranged is stored in each IC tag. The individual data stored in each IC tag will be described with reference to FIGS.

  FIG. 5 is a diagram showing a data configuration example of individual data stored in the IC tag 500 a arranged on the base 302.

  As shown in FIG. 5, the individual data of the substrate 302 includes “error flag”, “individual number”, “unit ID”, “product name”, “part maintenance count”, “Rev number”, and “data items” as data items. The number of parts ”.

  The “error flag” is a kind of characteristic information, and is a data item indicating whether or not the base body 302 can be used. More specifically, “0” means that it can be used, and “1” means that it cannot be used.

  For example, when it is determined by the worker that use is not possible due to some factor, for example, that a predetermined period has elapsed since the start of use, the worker uses the same writing means as the RW unit 701 to set “1”. Write.

  The “error flag” is also included in individual data of other components described later, and indicates whether or not the corresponding component can be used.

  The “individual number” is a data item indicating a number for identifying the individual among all the constituent parts including the constituent parts of the other suction nozzles 301. That is, the base 302 is the only component having “S001” shown in FIG.

  The “unit ID” is a data item indicating identification information that is commonly assigned to the same type of configuration unit, unlike the individual number. In other words, the substrate with “1005” shown in FIG.

  Further, the base 302 is a constituent part as a main body of the suction nozzle 301 as described above. Therefore, this unit ID “1005” is a so-called parent ID, and is identification information included in common with unit IDs of other components such as the background plate 303.

  That is, it can be said that the components other than the base 302 of the suction nozzle 301 are children whose parent is the base 302.

  “Product name” is a data item indicating the product name of the base body 302 having the unit ID “1005”.

  The “number of parts maintenance” is a number indicating the total number of maintenance of each component other than the base body 302.

  “Rev number” is a data item indicating the revision number of the substrate 302. In the example shown in FIG. 5, the base body 302 having the individual number “S001” is the base body having the revision number “2.1” of the product name “ZS1005”.

  The revision number is a kind of characteristic information, and is information indicating that a relatively small improvement has been made and the progress of the improvement. Specifically, the larger the revision number, the more improvements are made.

  Also, when the revision number is different for the same product, the material, fine shape, etc. are different, but the difference is often not visible.

  “Number of parts” is a data item indicating the number of components other than the base 302. Specifically, it is a value indicating the number of main components where IC tags are arranged in the suction nozzle 301. Therefore, in the present embodiment, “3” of the background plate 303, the spring 304, and the nozzle tip 305 is recorded.

  In FIG. 5 and the suction nozzle 301 shown in FIG. 6, FIG. 8, and FIG. 9 to be referred to below, the spring 304 is illustrated so as to be visible from the outside including the nozzle tip 305 for ease of explanation. .

  However, the arrangement position of each component of the suction nozzle 301 may not be such an arrangement position. For example, the spring 304 may be accommodated inside the base body 302.

  FIG. 6 is a diagram illustrating a data configuration example of individual data stored in the IC tag 500 b arranged on the background plate 303.

  As shown in FIG. 6, there are “error flag”, “individual number”, “unit ID”, “product name”, and “Rev number” as data items of the individual data of the background plate 303, and their meanings are as follows. This has the same meaning as the data item of the same name in the individual data of the base body 302 described above.

  Here, the unit ID of the background plate 303 is “1005-Ref” and has the above-mentioned parent ID “1005”.

  That is, the numbers or symbols before the hyphen in the unit IDs of the components other than the base 302 including the background plate 303 indicate the parent ID.

  Accordingly, it can be seen that the parent of the background plate 303, that is, the base to be combined with the background plate 303 is the base 302 having “1005” as a unit ID.

  The individual data of the background plate 303 further includes “maintenance count”, “light source condition”, “scratch condition”, and “dirt condition” as data items.

  “Maintenance count” is a data item indicating the number of times this background plate 303 has been maintained.

  The “light source condition” is a data item indicating a condition required for the light source when the transmission of the component is recognized using the background plate 303. That is, the light source condition is a kind of characteristic information indicating the characteristics of the background plate 303. The example shown in FIG. 6 indicates that a “circular light” is necessary.

  "Scratch condition" is a data item indicating the degree of scratches on the lower surface of the background plate 303, and any one of 1 to 10 is recorded.

  FIG. 7 is a diagram schematically illustrating how the suction nozzle 301 is held by the nozzle ST and the progress of damage to the background plate 303.

  As shown in FIG. 7A, when the suction nozzle 301 is held by the nozzle ST, a portion below the background plate 303 is accommodated in the nozzle ST and is locked to the nozzle ST by the background plate 303.

  Each time the suction nozzle is returned to the nozzle ST, the above operation is repeated, and scratches increase in proportion to the number of times of use on the lower surface of the background plate 303 in contact with the nozzle ST.

  This scratch is digitized based on the result of optical recognition by a component recognition camera 116 described later, and written in the IC tag 500b as a scratch condition.

  Similarly, the degree of contamination is digitized based on the result of optical recognition by the component recognition camera 116, and the degree of adhesion of foreign matter is digitized, and any one of 1 to 10 is written in the IC tag 500b.

  Among the data items of the individual data of the background plate 303 described above, as shown in FIG. 6, “error flag” to “Rev number” are components constituting the child whose parent is the base 302, ie, the background plate 303. , The spring 304, and the nozzle tip 305 are common items commonly used as individual data.

  Among these common items, “individual ID”, “unit ID”, “product name”, and “Rev number” are not changed in principle in each component, and are in the manufacturing stage of each component. It is written in advance in each IC tag.

  In addition, data items that are not changed in principle in each individual data, such as “shape” and “material” in the individual data of the nozzle tip 305, are similarly written in advance to each IC tag in the manufacturing stage.

  For other data items such as “error flag”, these components are assembled, used as component nozzles 301 for component mounting, and then written and updated by the RW unit 701.

  The fact that the individual data of the background plate 303 exists in the suction nozzle 301 means that the suction nozzle 301 has the background plate 303. That is, the presence of the individual data itself indicates the characteristic that the suction nozzle 301 is suitable for mounting a component that is recognized by transmission.

  FIG. 8 is a diagram showing a data configuration example of individual data stored in the IC tag 500 c arranged on the spring 304.

  As shown in FIG. 8, the individual data of the spring 304 has the above-mentioned common items as data items.

  The “unit ID” is “1005-Spr” and includes “1005”. That is, it can be seen that the base body to be combined with the spring 304 is the base body 302 having “1005” as the unit ID.

  The individual data of the spring 304 further has “spring force” as a data item. The spring force is a value indicating an elastic force which is a kind of characteristic information. The unit is Newton (N).

  FIG. 9 is a diagram showing a data configuration example of individual data stored in the IC tag 500d arranged at the nozzle tip 305. As shown in FIG.

  As shown in FIG. 9, the individual data of the nozzle tip 305 has the above-mentioned common items as data items.

  “Unit ID” is “1005-Noz” and includes “1005”. That is, it can be seen that the substrate to be combined with the nozzle tip 305 is the substrate 302 having “1005” as the unit ID.

  The individual data of the nozzle tip 305 further includes “shape”, “attachment”, “part range”, “scratch condition”, “dirt condition”, and “rubber deterioration condition” as data items. .

  “Shape” is a data item indicating the shape of the suction hole of the nozzle tip 305. In the example shown in FIG. 9, “A” is recorded, and “A” means that the shape is an asterisk type as shown in FIG.

FIG. 10 is a diagram illustrating an example of the shape of the suction hole at the tip of the nozzle.
As shown in FIG. 10, the shape of the suction hole at the tip of the nozzle is of an asterisk type, a square type or a round type. For example, as shown in FIG. B ”and“ C ”are associated.

  Further, it is possible to determine whether or not the tip of the nozzle is suitable for the part based on the relationship between the shape of the suction hole and the size and weight of the part.

“Material” is a data item indicating the material of the nozzle tip 305.
“Appendix” is a data item indicating an item that the nozzle tip 305 has as an accessory. In the example shown in FIG. 9, “rubber pad” is recorded, and a rubber pad is attached to the tip of the nozzle tip 305 to prevent damage to the component and the nozzle tip 305 and air leakage at the time of suction of the component. means.

  That is, it means that the nozzle tip 305 has characteristics that it is difficult to damage components and hardly cause air leakage. Therefore, the information shown in “Appendix” is a kind of characteristic information.

  The “component range” is a data item indicating a range of types of components that can be attached to the substrate by the nozzle tip 305 being sucked. In the example shown in FIG. 9, “1005” is recorded.

  Here, a part whose length × width is 1.0 mm × 0.5 mm is referred to as “1005 part”, and a part whose length × width is 1.6 mm × 0.8 mm is similarly designated as “1608”. It is called “parts”.

  That is, the component range of “1005” means that the nozzle tip 305 is suitable for mounting 1005 components and components of the same size in size.

FIG. 11 is a diagram illustrating an example of a component range.
“Parent ID” shown in FIG. 11 is a parent ID included in the unit ID of the nozzle tip, and the parent ID in the unit ID of the nozzle tip 305 shown in FIG. 9 is “1005”.

  Further, for example, the nozzle tip portion whose parent ID is “1608” is suitable for mounting components from approximately 1005 components to 1608 components in terms of size.

  Conversely, for mounting 1608 components, for example, a nozzle tip including a hatched rectangle in the figure as a component range, that is, a unit ID including “1608”, “MG” or “SL” as a parent ID. It can be seen that the suction nozzle is suitable.

  As described above, the component range is characteristic information indicating what size component the nozzle tip 305 is suitable for mounting.

  Further, “scratch condition” and “dirt condition” in the individual data of the nozzle tip 305 are data items similar to “scratch condition” and “dirt condition” in the individual data of the background plate 303 shown in FIG. 6, respectively. is there.

  That is, “scratch condition” is a data item indicating the degree of damage to the nozzle tip 305, and “dirt condition” is a data item indicating the degree of adhesion of foreign matter. These are digitized based on the result of optical recognition by the component recognition camera 116, and any one of 1 to 10 is written in the IC tag 500d.

  “Rubber degradation level” is a data item recorded when the nozzle tip 305 has a rubber pad as the accessory, and is a data item in which the degree of degradation of the rubber pad is recorded.

  Specifically, as in “scratch condition”, the degree of unevenness of the rubber pad surface obtained by optical recognition by the component recognition camera 116, the magnitude of the difference from the original shape, and the like are quantified. Any integer of -10 is written into the IC tag 500d.

  Alternatively, since the rubber pad deteriorates in proportion to the number of times the component is sucked, the number of times of use is recorded.

  In any case, it is possible to determine whether or not the rubber pad can be continuously used with a predetermined numerical value as a threshold value.

  As described above, each component of the suction nozzle 301 of the present embodiment has individual data including identification information and characteristic information.

  Specifically, each individual data is written in an IC tag arranged one by one in each component.

  Here, for example, when the error flag is “1” in any one of the individual data of the background plate 303, the spring 304, and the nozzle tip 305, the suction nozzle 301 has an unusable component. become.

  In such a case, the error flag of the individual data of the base 302 may be rewritten to “1”. Accordingly, it is possible to determine that at least the suction nozzle 301 should not be used in the combination of the components as it is, by referring only to the individual data of the substrate 302.

  In this case, the background plate 303, the spring 304, and the nozzle tip 305 do not have to have an error flag.

  Each IC tag need not store all the data items shown in FIG. For example, each IC tag stores only identification information such as an individual number, a unit ID, or a product name of a component where the IC tag is arranged. Further, other characteristic information and the like are associated with the identification information and stored in another storage device, for example, the nozzle information storage unit 805 of the nozzle verification device 800 described later.

  In this case, for example, by reading the unit ID as identification information from the IC tag 500d arranged at the nozzle tip 305, and reading the data item “material” corresponding to the read unit ID from the nozzle information storage unit 805, It is possible to specify what “material” is a kind of characteristic information of the nozzle tip 305.

  In addition, as described above, all the components have a unit ID that is identification information, the unit ID of the base 302 is a parent ID, and the other components are units obtained by adding the respective symbols to the parent ID. I have an ID.

  That is, by confirming these unit IDs, it can be determined whether or not the suction nozzle 301 is assembled with a correct combination of components.

FIG. 12 is a diagram illustrating an example of a correct combination of components.
FIG. 12A is a diagram illustrating a combination of components in the suction nozzle 301 according to the embodiment. As shown in FIG. 12A, the unit IDs of the background plate 303, the spring 304, and the nozzle tip 305, which are constituent parts of the suction nozzle 301, are units of the base 302, which is the constituent part of the parent. It has the ID “1005”.

In addition, the unit ID may be represented by characters instead of numbers.
FIG. 12B is a diagram illustrating another example of a correct combination of components. Also in the combination shown in FIG. 12B, the unit ID of each component other than the base includes “M” which is the unit ID of the base.

  Also, the correct background plate to be combined with the base having the unit ID “M” is not limited to one type. For example, “M-Ref1” or “M-Ref1” other than “M-Ref2” shown in FIG. M-Ref3 "etc. may be sufficient.

  The same applies to the spring and the nozzle tip, and the same applies to the combination example shown in FIG.

  The individual data of each component including the unit ID and the characteristic information is read by the RW unit 701 from each IC tag and transmitted to the nozzle verification device 800.

  In addition, the component recognition camera 116 recognizes scratches or the like of each component, and the degree of the scratch or the like quantified by a predetermined means is written by the RW unit 701 to an IC tag arranged in each component.

  FIG. 13 is a diagram illustrating an arrangement example of the RW unit 701 and the component recognition camera 116. For simplification of illustration and description, only the nozzle tip 305 and the IC tag 500d arranged on them are shown among the constituent parts of each suction nozzle 301, and the gap between the IC tag 500d and the RW unit 701 is shown. The communication will be described. The following description is the same even if the communication partner of the RW unit 701 is another IC tag, that is, the IC tag 500a, the IC tag 500b, or the IC tag 500c.

  The RW unit 701 can read information from each IC tag as described above. Specifically, a radio wave having a predetermined frequency including a read command is transmitted to each IC tag 500d of the plurality of nozzle tip portions 305, and a radio wave having a predetermined frequency including information stored in each IC tag is transmitted from each IC tag 500d. Can be received. The RW unit 701 is disposed at a position where it can communicate with each IC tag 500d.

  For example, as shown in FIG. 13A, the RW unit 701 is provided in the flying head unit, and the RW unit 701 reads information stored in each IC tag 500d while the flying head unit moves. Alternatively, information is written to each IC tag 500d.

  In addition, the component recognition camera 116 may be provided in the flying head unit in the same manner as the RW unit 701. In this case, while the RW unit 701 is moving to communicate with each IC tag 500d, not only the nozzle tip 305 recognizes each component sucked but also the nozzle tip not sucking the component. Scratches of 305 and the background plate 303, adhesion of foreign matter, and the like can be recognized from below.

  Further, as shown in FIG. 13B, the RW unit 701 may be fixedly arranged under the space through which the mounting head 112 passes, like the component recognition camera 116 shown in FIG.

  In this case, when the mounting head 112 to which the plurality of suction nozzles 301 are attached passes over the RW unit 701, information is read from the IC tag 500d attached to each nozzle tip 305, and those IC tags 500 can write information.

  In this case, as in the case of FIG. 13A, the component recognition camera 116 not only recognizes the component, but also scratches the components such as the nozzle tip 305 that passes above the component recognition camera 116. Can be recognized.

  Further, the RW unit 701 may be provided in the mounting head corresponding to each suction nozzle 301 as shown in FIG.

  Moreover, as shown in FIG.13 (d), you may provide in the both ends by the side of a mounting head. In this case, two RW units 701 can receive radio waves transmitted from one IC tag 500d.

  Therefore, the position of the IC tag 500d that is the source of the radio wave can be specified from the direction in which each of the two RW units 701 receives the radio wave.

  Further, as shown in FIGS. 13A, 13C, and 13D, the RW unit 701 may not be installed in the vicinity of the mounting head or the mounting head. For example, FIG. ), The nozzle ST may be provided.

  In the example shown in FIG. 13E, in the nozzle ST, the RW unit 701 is arranged in the vicinity of the position where each nozzle tip 305 is stored.

  The component mounting machine 100 has information indicating which position of the nozzle ST the suction nozzle 301 is attached to which position of the mounting head 112.

  Therefore, the component mounting machine 100 can specify the suction nozzle 301 corresponding to the information acquired by a certain RW unit 701 from among the plurality of suction nozzles 301 attached to the mounting head 112.

  For example, when information is acquired from the IC tag 500b of a certain background plate 303, the position of the IC tag 500b in the mounting head 112 is determined by which RW unit 701 has acquired the information, and at which position the RW unit 701 is. Acquired or specified by the radio wave reception directions of the two RW units 701 as shown in FIG.

  Similarly, the positions of other IC tags are specified. Thereby, it is specified which individual data of the suction nozzle 301 is the acquired individual data.

  That is, the nozzle verification device 800 acquires the individual data acquired by the RW unit 701 and the information indicating which position is the individual data of the constituent part of the suction nozzle 301 by communication with the component mounting machine 100. Can do.

  For example, the information indicating that the suction nozzle 301 at the left end of the front row of the mounting head 112 has a combination of (“1005”, “1005-Ref”, “1005-Spr”, “1005-Noz”) Along with the characteristic information and the like, it is transmitted from the component mounter 100 to the nozzle verification device 800.

  Alternatively, each piece of individual data and information indicating “the left end of the previous row” are transmitted to the nozzle collation apparatus 800, and the nozzle collation apparatus 800 can specify which position the suction nozzle 301 belongs to. .

  That is, the nozzle verification device 800 can determine whether or not each suction nozzle 301 is configured by a correct combination of components, and can also determine compatibility with components.

  Specifically, a component that each component of a certain suction nozzle 301 is scheduled to be attracted to the suction nozzle 301 by collating a component library described later with the characteristic information of each component. It can be determined whether or not it is compatible.

  The transmission medium received by each IC tag is not limited to radio waves, but may be electromagnetic waves, infrared rays (optical communication), or other media.

  FIG. 14 is a functional block diagram illustrating a functional configuration of the nozzle verification device 800 according to the embodiment.

  As described above, the nozzle verification device 800 is a device that determines whether or not the suction nozzle 301 attached to the mounting head 112 is a correct combination of components.

  As shown in FIG. 14, the nozzle verification device 800 includes an arithmetic control unit 801, a display unit 802, an input unit 803, a memory 804, a nozzle information storage unit 805, a communication I / F unit 806, a database unit 807, and a determination unit 808. It has.

  The arithmetic control unit 801 is a component that downloads and executes a necessary program in the memory 804 in accordance with an instruction from an operator who operates the nozzle verification device 800 and controls each component in accordance with the execution result. Specifically, it is realized by a CPU, a numerical processor, or the like.

  The display unit 802 is a component that displays information, and is realized by a CRT (Cathode-Ray Tube), an LCD (Liquid Crystal Display), or the like.

  The input unit 803 is a component for an operator to input an instruction or the like to the nozzle verification device 800, and is realized by a keyboard, a mouse, or the like. That is, the display unit 802 and the input unit 803 allow the component mounter 100 and the operator to interact with each other under the control of the arithmetic control unit 801.

  The memory 804 is a component that provides a work area for the arithmetic control unit 801, and is realized by a RAM (Random Access Memory) or the like.

  The nozzle information storage unit 805 stores nozzle data for all the suction nozzles 301 (including the suction nozzles 301 not attached to the mounting head 112 and held by the nozzles ST119) of the component mounting machine 100. Yes.

  As these nozzle data, for example, individual data is read from each IC tag of all the suction nozzles 301 in advance, and is stored in the nozzle information storage unit 805 as nozzle data for each suction nozzle 301.

  The nozzle data for each suction nozzle 301 can be acquired during the collation process described with reference to FIG. 16 and the like, and thus the individual data acquired during this collation process is accumulated in the nozzle information storage unit 805 as nozzle data. You may make it do.

  The communication I / F unit 806 is an example of a component information acquisition unit in the nozzle verification device of the present invention, and is a component for communicating with the component mounter 100. Specifically, it is realized by a LAN (Local Area Network) adapter or the like.

  The database unit 807 is a storage device that stores various data (mounting point data 807a, component library 807b, mounting machine information 807c, and the like) used for the collating process of the suction nozzle 301 by the nozzle collating device 800. Specifically, it is realized by a hard disk or the like.

  The mounting point data 807a is information indicating, for each component mounted on the substrate in the component mounting machine 100, the component name, the mounting position, and the suction nozzle 301 at which position of the mounting head 112 is suctioned and mounted on the substrate. Etc. are recorded data.

  Based on the mounting point data 807a, the configuration of the component group for each task when a certain component mounting board is produced is specified.

  The component library 807b is data in which the name and size of components mounted on the board in the component mounter 100, the suction conditions for each component, and the like are recorded. The component library 807b will be described later with reference to FIG.

  The mounter information 807c is data in which information related to the component mounter that communicates with the nozzle verification device 800, such as the order of arrangement of the feeders 114 of the component mounter 100, is recorded.

  The database unit 807 stores information necessary for processing related to nozzle verification, such as which parts are scheduled to be attracted to the suction nozzle 301 at which attachment position of the mounting head 112. What is necessary is just to be able for the judgment part 808 to read these information when needed.

  That is, the data may be held in any way, such as whether the multiple types of data are one file or individual files.

  Further, these various data stored in the database unit 807 may be acquired from the component mounter 100 via a communication network, for example, when necessary.

  The determination unit 808 is a processing unit that determines whether or not each suction nozzle 301 is configured with a correct combination of components based on the unit ID of each component read by the RW unit 701 in the component mounter 100. That is, it is a processing unit that determines whether or not the combination of identification information of each component unit is a correct combination.

  In addition, the determination unit 808 acquires component information regarding the component stored in the database unit 807, and collates with the information read by the RW unit 701 in the component mounter 100, so that each suction nozzle 301 can pick up the component. It can also be determined whether or not the combination of components is suitable for mounting on the substrate.

  Specifically, as the component information, the determination unit 808 acquires the suction condition, the recognition condition, and the like included in the component library 807b stored in the database unit 807.

  Further, the determination unit 808 can determine whether each component is usable by referring to the individual data of each component of each suction nozzle.

  FIG. 15 is a diagram illustrating a data configuration example of the component library 807b according to the embodiment.

  As shown in FIG. 15, the component library 807b is data in which component information for each component is recorded. In addition to basic items such as part names, sizes, and weights, data items include “suction conditions”, “recognition conditions”, “nozzle material”, and “lightning”.

  For example, “Pad required” is recorded as the suction condition for the part A. This indicates that a pad such as a rubber pad is required to be attached to the nozzle tip 305 of the suction nozzle 301 for mounting the component A on the substrate.

  In addition, “requires no background plate” is recorded as the recognition condition for the component C. This indicates that the component C is not permeation-recognized but is, for example, a component that is recognized by reflection, and therefore the suction nozzle 301 that mounts the component C on the substrate does not need to include the background plate 303. .

  Also, “NA” is recorded as the nozzle material for parts C and D. This indicates that the material of the nozzle tip 305 of the suction nozzle 301 for mounting the component C and the component D on the substrate is not limited.

  Next, the operation flow of the component mounting system according to the embodiment will be described with reference to FIGS. Specifically, the operation flow of each process related to component verification will be described using FIGS. 16 to 19, and the operation flow of the component mounting system when these processes are performed in combination using FIG. 20. Will be explained.

(About the first operation)
FIG. 16 is a flowchart illustrating a flow of a first operation related to nozzle verification in the embodiment.

  Specifically, FIG. 16 shows a flow of operations when the nozzle collating device 800 determines whether or not the combination of the components in the suction nozzle 301 provided in the component mounter 100 is correct.

  For clarification of the description, an operation for determining whether or not the combination of the constituent parts of one suction nozzle 301 is correct will be described. Similarly, in each description using FIGS. 17 to 20 described later, the description will be given with respect to one suction nozzle 301 as well.

  First, the determination unit 808 of the nozzle verification device 800 acquires each unit ID from the individual data read from each IC tag by the RW unit 701 of the component mounter 100 (S1).

  Among these unit IDs, a unit ID of the base 302, that is, a parent ID for another component is specified, and it is confirmed whether or not the parent ID is included in the other component unit ID.

  Thereby, it is determined whether or not the combination of these unit IDs is correct, that is, whether or not the combination of these components is correct (S2).

  For example, the nozzle verification device 800 can specify a unit ID of individual data having a specific product name as a parent ID. Alternatively, a unit ID that does not include a hyphen can be specified as the parent ID.

  Alternatively, the component mounter 100 identifies that the data is the individual data of the base 302, adds a flag indicating that to the individual data, and transmits it to the nozzle verification device 800. The nozzle verification device 800 can specify the unit ID as the parent ID by referring to the individual data with the flag.

  That is, the nozzle verification device 800 can specify the parent ID from the plurality of unit IDs by any one of various methods. The parent ID is specified by the determination unit 808.

  If the parent ID specified in this way is included in the unit IDs of all other components, the determination unit 808 determines that the combination of these unit IDs is correct (Yes in S2), and the suction nozzle A series of processing relating to the combinational correctness determination for 301 ends. Thereafter, for example, whether the combination of the constituent parts is correct or not is determined for the other suction nozzle 301.

  Further, when the specified parent ID is not included in the unit ID of any component, it is determined that the combination of these unit IDs is not correct (No in S2).

  In this case, the arithmetic control unit 801 receives the determination result of the determination unit 808, and displays on the display unit 802 a unit ID that does not include the parent ID and a warning that the combination of the component parts of the suction nozzle 301 is incorrect. To do.

  If the determination is made after the component mounter 100 starts the operation related to the mounting, the arithmetic control unit 801 transmits the warning or the like to the component mounter 100 and gives an instruction to stop the operation. Alternatively, the component mounter 100 that has received the warning or the like stops its operation upon receiving the warning or the like (S3).

  An operator who operates the component mounting machine 100 replaces the suction nozzle 301 and restarts component mounting. Alternatively, automatic replacement is performed in which the component mounting machine 100 itself selects the same kind of suction nozzle 301 from the plurality of suction nozzles 301 held by the nozzle ST 119 and replaces the selected suction nozzle 301 with the selected suction nozzle 301.

  In addition, a series of processing relating to the above-described correct / incorrect determination is also performed on the suction nozzle 301 after replacement.

  As described above, the nozzle verification device 800 can determine whether or not the combination of the identification information of the components is correct for the suction nozzle 301, that is, whether or not the combination of the components is correct.

  Thereby, it is possible to eliminate the possibility that the suction nozzle 301 configured by an incorrect combination of components is used.

  Therefore, it is possible to prevent the occurrence of a suction error or the like caused by using such a suction nozzle 301, and to make the component mounting machine 100 produce the component mounting board accurately and efficiently.

  The determination process can be performed before or after the component mounter 100 starts the mounting operation.

  For example, when the RW unit 701 is provided in the nozzle ST119 in the manner illustrated in FIG. 13E, the combination of the constituent units for all the suction nozzles held in the nozzle ST119 before starting the mounting operation. Can be judged.

  In this case, it is possible to efficiently mount components without replacing the suction nozzle 301 due to an incorrect combination of components during the mounting operation.

  Further, for example, when the RW unit 701 is provided in the nozzle ST119 in a manner as illustrated in FIG. 13A, the suction nozzle 301 is immediately before the suction nozzle 301 picks up a component after the mounting operation is started. Whether the combination of the constituent parts is correct or not can be determined.

  In this case, the correctness of the combination of the constituent parts is determined immediately before the suction nozzle 301 is actually used for component mounting, and the use of the suction nozzle 301 configured with an incorrect combination can be reliably prevented.

  Also, before the component mounting machine 100 starts the mounting operation, it is determined whether or not the combination of the constituent parts is correct for all the suction nozzles, and the combination of the constituent parts for the suction nozzle 301 immediately before the suction nozzle 301 picks up the components. It may be judged whether or not.

  In other words, whether the combination of the components is correct or not may be determined a plurality of times before the suction nozzle 301 picks up the component. By doing so, it is possible to more reliably prevent the use of the suction nozzle 301 configured in an incorrect combination.

  The timing of such an operation is the same in the second to fourth operations described below, and may be appropriately determined in consideration of the production efficiency of the component mounting machine 100 and the like.

  Further, when determining whether or not the combination of the constituent parts is a correct combination, it is not determined based on whether or not the parent ID, that is, the unit ID of the base 302 is included in the unit IDs of the other constituent parts. You may judge by other criteria.

  For example, it may be a criterion that a part of the parent ID is included in the unit IDs of other components. Further, for example, identification information such as a unit ID of a component to be combined with the substrate 302 is included in the individual data of the substrate 302, and this information is used to determine whether the combination of the components is correct. May be.

  Further, for example, each component other than the substrate 302 records the unit ID of the substrate 302 to be a parent in individual data separately from its own unit ID, and the combination of the components is correct using this information. It may be determined whether or not.

  Further, the unit IDs of the components may not have a parent-child relationship, and may be numbers or symbols that can be handled in the same row. For example, the unit IDs of all the constituent units may be configured only with a predetermined number of digits.

  In addition, in order to determine whether or not the combination of the constituent parts of the suction nozzle 301 is correct, there may be no regularity such as a common item in the identification information of each constituent part. Even in such a case, it is possible to determine whether the combination of the component parts is correct or not if there is information indicating the correct combination of the component parts.

  For example, if the nozzle collation device 800 stores information indicating the correct combination of the component parts, whether the combination is correct even if the unit IDs of the component parts of the suction nozzle 301 are not regular in relation to each other. Judgment is possible.

  An individual number for identifying an individual is also a kind of identification information. Therefore, for example, the determination may be made based on whether or not a part of the individual number of the base body 302 is included in the individual number or unit ID of another component.

  In short, it is only necessary to determine whether or not each identification information has a predetermined relationship by using each identification information itself or via other information. It is possible to determine whether or not.

(About the second operation)
Next, the flow of the second operation related to nozzle verification in the component mounting system of the embodiment will be described with reference to FIG.

  FIG. 17 is a flowchart showing a flow of the second operation relating to nozzle collation in the embodiment.

  Specifically, FIG. 17 shows a flow of an operation related to confirmation of a defect in each component of the suction nozzle 301 in the component mounting system.

  In the present embodiment, the degree of dirt or scratches, which is a malfunction of the background plate 303 and the nozzle tip 305, is confirmed.

  In the component mounting machine 100, when the mounting head 112 returns the suction nozzle 301 to the nozzle ST119 or when the suction nozzle 301 is taken out from the nozzle ST119 and returns to the component suction position (Yes in S10), the component recognition camera 116 Dirt and scratches on the background plate 303 and the nozzle tip 305 are recognized (S12).

  Alternatively, every time when a certain period of time has elapsed since the suction nozzle 301 was used, or every time the number of times the suction nozzle 301 has been used for component mounting exceeds a certain number (Yes in S11), the component recognition camera 116. Thus, dirt and scratches on the background plate 303 and the nozzle tip 305 are recognized (S12).

  If it is confirmed by this recognition that the background plate 303 or the nozzle tip 305 is contaminated or scratched (Yes in S13), a predetermined numerical value (any integer of 1 to 10) is made.

  Further, the numerical value is written as “dirt condition” or “scratch condition” on the IC tag 500b or the IC tag 500d arranged on the background plate 303 or the nozzle tip 305 where the confirmed dirt or scratch exists (S14). ).

  When a numerical value already exists as “dirty condition” or “scratch condition”, the “dirty condition” or “scratch condition” is updated by overwriting the above numerical value.

  The nozzle collation apparatus 800 receives the updated individual data via the RW unit 701, and if the numerical value of “dirt condition” or “scratch condition” is a predetermined threshold value or more, for example, 6 or more (Yes in S15). The RW unit 701 is instructed to rewrite the “error flag” of the individual data from “0” to “1” (S16).

  That is, the degree of malfunction of the component is detected, and if the degree is equal to or greater than the threshold, the component is disabled.

  It should be noted that the component mounter 100 may determine whether or not the numerical value of “dirt condition” or “scratch condition” is greater than or equal to a threshold value. Further, the predetermined threshold value may be different depending on “soil condition” and “scratch condition”, and may be determined to be a value that does not cause a recognition error, an adsorption error, or the like based on an experimental value and an empirical rule, respectively.

  For example, when a foreign substance such as solder adheres to the nozzle tip 305 and “dirt condition” is “6”, “6” is written as “dirt condition” in the IC tag 500d, and the error flag is “1”. To "". That is, the nozzle tip 305 cannot be used.

  In this case, since the suction nozzle 301 should not be used, the component mounter 100 and the nozzle verification device 800 or both warn that the suction nozzle 301 cannot be used because the nozzle tip 305 cannot be used. Is displayed on its own display.

  In addition, when neither the background plate 303 nor the nozzle tip 305 is dirty or scratched (No in S13), and there is dirt or scratches in these components, the “dirt condition” or “ When the “scratch condition” is less than the threshold value (No in S15), a series of processes related to the defect confirmation for the suction nozzle 301 ends. Thereafter, for example, the malfunction is confirmed for the other suction nozzles 301.

  Thereafter, the suction nozzle 301 to be warned is replaced with another suction nozzle 301 of the same type by an operator or automatically. In addition, a series of processes relating to the above-described defect confirmation is also performed on the suction nozzle 301 after replacement.

  Note that the target of the defect check is not limited to the background plate 303 and the nozzle tip 305, and the base 302 and the spring 304 may be the targets. In this case, dirt or the like on the base 302 and the spring 304 may be recognized within a range that can be recognized by the component recognition camera 116. For this purpose, the component recognition camera 116 may be moved to a position where these components can be observed, or a camera for recognizing defects of these components may be provided separately.

  In this case, a data item such as “dirt condition” may be provided in the individual data of the base body 302 and the spring 304.

  Also, the type of defect to be confirmed may be other than dirt and scratches. For example, chipping or deformation is a factor that induces the occurrence of suction mistakes, etc., so that the presence / absence and degree of these are recognized by the component recognition camera 116. Also good.

  Similarly, with respect to the rubber pad that is an accessory of the nozzle tip portion 305, the degree to which dirt and scratches are recognized by the component recognition camera 116 and digitized (any one of 1 to 10) is determined by the RW unit 701. It is recorded as “rubber deterioration condition” in the individual data of the tip 305.

  Alternatively, the RW unit 701 writes the number of times of use of the nozzle tip 305 as “rubber deterioration” as described above, and the error flag is set to “1” when it exceeds a predetermined threshold.

  Further, in the above-described operation flow, the nozzle verification device 800 acquires the “number of times of component maintenance” in the individual data of the base 302, and if it is equal to or greater than a predetermined threshold, sets the error flag of the base 302 to the RW unit 701. It may be updated to “1”.

  The “number of parts maintenance” is a number indicating the total number of times of maintenance of each component other than the base 302 as described above. In the example shown in FIG. 5, it is shown that the spring 304 is replaced twice.

  Therefore, the “number of component maintenances” is a kind of characteristic information indicating the amount of maintenance of the suction nozzle 301 as a whole having the base body 302 as a main body. Therefore, when the “number of parts maintenance” exceeds a predetermined threshold, the use of the suction nozzle 301 is considered to be temporarily stopped, so the error flag may be set to “1”.

  In addition, the error flag may be returned to “0” for the configuration unit that has become unusable due to the error flag being “1” and for the configuration unit that can be reused.

  For example, it is conceivable that a large amount of solder adheres to the nozzle tip 305, so that the “dirt condition” becomes a predetermined threshold value or more and the error flag becomes “1”.

  In this case, the nozzle tip 305 can be used again by removing the attached solder. Therefore, in this case, for example, the operator changes the error flag of the IC tag 500d at the nozzle tip 305 to “0” using the same writing means as the RW unit 701.

  Alternatively, the error flag may be returned to the component mounter 100 with “1”. In this case, in the above-described dirt or scratch recognition (S12), if the dirt or scratch is not recognized (No in S13), the error flag of the component in which the dirt or scratch is not recognized is rewritten to “0”. By controlling the RW unit 701, the components that are free from wrinkles such as dirt can be used in terms of data.

  Further, even when dirt or scratches are recognized, the RW unit 701 is controlled so as to rewrite the error flag of the constituent unit to “0” in the same manner even when it is less than the predetermined threshold (No in S15). As a result, the components that are free from wrinkles such as dirt can be used in terms of data.

  That is, the flow shown in FIG. 17 is a flow in which the error flag is set to “1” if the degree of malfunction is equal to or greater than the threshold, but when there is no malfunction and the degree of malfunction is less than the threshold. The RW unit 701 may be controlled to actively write the error flag “0”.

  In this case, the operator does not have to rewrite the error flag to “0” and the work load is reduced. In addition, it is possible to efficiently perform the reuse of the components that are once disabled.

  As described above, the component mounter 100 and the nozzle verification device 800 prevent the use of the suction nozzle when the suction nozzle 301 has a defect in each component and the degree thereof is equal to or greater than a predetermined threshold. be able to.

  As a result, it is possible to prevent occurrence of recognition errors, suction errors, and the like caused by using such a defective suction nozzle 301, and accurately and efficiently produce a component mounting board in the component mounting machine 100. Can be done.

(About the third operation)
Next, a third operation flow relating to nozzle verification in the component mounting system of the embodiment will be described with reference to FIG.

  FIG. 18 is a flowchart illustrating a third operation flow according to nozzle verification in the embodiment.

  Specifically, FIG. 18 shows a flow of operations when the nozzle collating apparatus 800 controls the component mounter 100 not to use a suction nozzle that cannot be used.

  First, the determination unit 808 of the nozzle verification device 800 refers to the error flag included in the individual data of each component of the suction nozzle 301 read by the RW unit (S20).

  That is, the error flags of the base 302, the background plate 303, the spring 304, and the nozzle tip 305 are referred to, and if any of them is “1” (Yes in S21), the suction is performed because the component is not usable. A warning that the nozzle 301 is not usable is displayed on the display unit 802.

  When the warning is given after the component mounter 100 starts the operation related to the mounting, the arithmetic control unit 801 transmits the warning to the component mounter 100 and gives an instruction to stop the operation. Alternatively, the component mounter 100 that has received the warning stops operation when it receives the warning.

  Thereafter, the suction nozzle 301 to be warned is replaced with another suction nozzle 301 of the same type by an operator or automatically. In addition, a series of processes relating to the above-described determination as to whether or not the suction nozzle 301 can be used is also performed.

  Thus, the nozzle verification device 800 determines whether or not the suction nozzle 301 can be used in units of components, and if any of the components is unusable, the use of the suction nozzle is determined. Can be prevented.

  Thereby, for example, it is possible to eliminate the possibility of using a suction nozzle having a background plate 303 that has many scratches and is no longer suitable as a background for transmission recognition.

  Accordingly, it is possible to prevent the occurrence of a recognition error or the like caused by using such a suction nozzle 301, and to cause the component mounting machine 100 to accurately and efficiently produce a component mounting board.

(About the fourth operation)
Next, a fourth operation flow related to nozzle verification in the component mounting system of the embodiment will be described with reference to FIG.

  FIG. 19 is a flowchart illustrating a fourth operation flow according to nozzle verification in the embodiment.

  Specifically, FIG. 19 shows an operation flow when the nozzle collating apparatus 800 determines compatibility between the component and the suction nozzle 301.

  First, the nozzle verification device 800 acquires each characteristic information from the individual data read from each IC tag by the RW unit 701 of the component mounter 100 (S30).

  For example, information indicating “circular light” (see FIG. 6), which is a light source condition, is acquired from the individual data of the background plate 303. Further, information indicating “ceramic” of “material” and “rubber pad” of “accessory” (see FIG. 9) is acquired from the individual data of the nozzle tip 305.

  The determination unit 808 identifies a component that the suction nozzle 301 is scheduled to suck from the mounting point data 807a and the like. Further, the suction condition or the like which is the part information of the part is read from the part library 807b.

  Based on the characteristic information acquired from the individual data and the component information read from the component library 807b, the determination unit 808 has a combination of components of the suction nozzle 301 that is appropriate for mounting the component on the board. Whether or not (S31).

  For example, when the part is the part A shown in FIG. 15, the “light source condition” in the characteristic information of the background plate 303 is “circular light”, and “lighting” which is a kind of part information about the part A is It is also a “circular light”.

  In addition, since the suction nozzle 301 includes the background plate 303, the “background plate required” which is a recognition condition which is a kind of component information regarding the component A is satisfied.

  Further, “material” in the characteristic information of the nozzle tip 305 is “ceramic”, and “nozzle material” which is a kind of component information regarding the component A is also “ceramic”.

  Further, “attachment” in the characteristic information of the nozzle tip 305 is “rubber pad”, and satisfies “pad required” which is a kind of component information regarding the component A.

  Thus, the characteristic information of each component of the suction nozzle 301 satisfies all the various conditions indicated in the component information of the component A. Therefore, the combination of the constituent parts of the suction nozzle 301 is determined to be a combination suitable for mounting the component A on the board (Yes in S31). A series of processes related to the suitability determination for the suction nozzle 301 ends. Thereafter, for example, the compatibility determination is performed for the other suction nozzle 301.

  In addition, when the characteristic information of any component part of a certain suction nozzle 301 does not satisfy the conditions indicated by the component information corresponding to the characteristic information, the suction nozzle 301 is a combination suitable for mounting the component on the substrate. (No in S31), information indicating a component that does not satisfy the condition and a warning that the suction nozzle 301 is not suitable for mounting the component are displayed on the display unit 802. To do.

  If the determination is made after the component mounter 100 starts the operation related to the mounting, the arithmetic control unit 801 transmits the warning or the like to the component mounter 100 and gives an instruction to stop the operation. Alternatively, the component mounter 100 that has received the warning or the like stops its operation upon receiving the warning or the like (S32).

  Thereafter, the suction nozzle 301 to be warned is replaced with another suction nozzle 301 of the same type by an operator or automatically. In addition, a series of processes relating to the suitability determination is performed for the suction nozzle 301 after replacement.

  In this way, the nozzle verification device 800 can determine whether or not the combination of the constituent parts of the suction nozzle 301 is suitable for a component that the suction nozzle 301 is scheduled to suck.

  Thereby, it is possible to prevent the component from being mounted on the substrate without compatibility between the suction nozzle 301 and the component.

  Therefore, it is possible to prevent the occurrence of suction mistakes and sticking between the component and the nozzle tip 305 due to the incompatibility between the components of the suction nozzle 301 and the components. The production of the component mounting board can be performed accurately and efficiently.

(Composite operation of the first to fourth operations)
Next, the overall flow of the operation related to nozzle verification in the component mounting system of the embodiment will be described with reference to FIG.

  FIG. 20 is a flowchart showing an overall flow of operations related to nozzle verification in the embodiment.

  Note that it is assumed that the second operation described with reference to FIG. 17, that is, the failure of each component has already been confirmed, and the error flag has been updated in the individual data of each component.

  First, the determination unit 808 of the nozzle verification device 800 acquires individual data of each component of the suction nozzle read from each IC tag by the RW unit 701 of the component mounter 100, and from each individual data, the respective data is obtained. Information such as the unit ID is acquired (S40).

  Next, it is determined whether or not the acquired combination of these unit IDs is a correct combination, that is, whether or not the combination of these components is correct (S41).

  When it is determined that the combination of these components is correct (Yes in S41), it is determined whether or not the error flag of each component is “1”. That is, it is determined whether or not any of the components is unusable (S42).

  If none of the error flags is “1” (Yes in S42), based on the acquired characteristic information of each component and the component information of the component that the suction nozzle 301 is scheduled to suck. It is determined whether or not the combination of the constituent parts of the suction nozzle 301 is an appropriate combination for mounting the component on the substrate (S43).

  Three types of determinations such as the correct / incorrect determination of the combination of components (S41), the availability determination of each component (S42), and the suitability determination (S43) for the components of the combination are a plurality of suction nozzles 301, For example, it is performed for the suction nozzle 301 attached to the mounting head 112 at that time.

  Also, if any of these three types of determination results in a determination result of “No” (No in S41, No in S42, or No in S43), the nozzle verification device 800 or the component mounting machine 100 or both Information indicating the suction nozzle 301 and the component that cannot be used and a warning that the combination of the component of the suction nozzle 301 is not correct are displayed on the display unit.

  Further, the component mounter 100 stops the operation in response to an instruction from the nozzle verification device 800 or when the warning or the like is received from the nozzle verification device 800 (S46).

  After that, maintenance such as replacement of the suction nozzle 301 to be warned or replacement of a component that is determined to be incorrect is performed by an operator or the like. The above three types of determination are also made for the suction nozzle 301 that is newly held by the component mounting machine 100 due to maintenance.

  The above three types of determination regarding the suction nozzle 301 are performed for each task, for example, and if any of the suction nozzles 301 used in the task clears the three types of determination (Yes in S43), these suction nozzles 301 picks up each component and mounts it on the substrate (S44).

  While the production amount of the component mounting board of the component mounting machine 100 does not reach the predetermined amount (No in S45), the above operations are repeated, and when the production amount reaches the predetermined amount, that is, when the production is finished (in S45) Yes), the operation related to nozzle verification in the component mounting system is also terminated.

  As described above, the nozzle verification device 800 can superimpose the determination of whether or not the combination of the components is correct, whether or not each component is usable, and the suitability of the combination of the components for the suction nozzle 301.

  As a result, in the component mounting machine 100, only the suction nozzle 301 that is configured in a correct combination, does not have a malfunction that cannot be used in each component, and has a good compatibility with the component is actually used for component mounting. Will be used.

  That is, for example, the suction nozzle 301 to which the nozzle tip 305 that is not suitable for the substrate 302 is attached, the combination of the constituent parts is correct, but the combination of the suction nozzle 301 having the nozzle tip 305 that is severely soiled and the constituent parts is Although there is no problem that makes each component part unusable correctly, it is possible to exclude the use of an improper suction nozzle 301 such as a suction nozzle 301 having a nozzle tip 305 that is incompatible with a part. it can.

  Therefore, it is possible to prevent the occurrence of an error such as that the component cannot be properly sucked or mounted or the component cannot be correctly recognized due to the use of the inappropriate suction nozzle 301. The mounting board can be produced accurately and efficiently.

  Note that the flow of FIG. 20 has been described on the assumption that the malfunction of each component has already been confirmed. However, in the flow shown in FIG. 20, the malfunction of each component may be confirmed.

  For example, before determining whether or not each component can be used (S42), the component recognition camera 116 recognizes a scratch or the like of each component and if there is a scratch exceeding a predetermined threshold, the error flag of the component is set to “ 1 ”.

  That is, every time a certain suction nozzle 301 mounts a component on a substrate, it may be confirmed whether or not each component has a problem that hinders component mounting. Alternatively, such confirmation may be performed every predetermined period or every predetermined number of times the suction nozzle 301 is used.

  As a result, for example, during the production of a component mounting board, it is possible to prevent the nozzle tip 305 that has failed due to some factor from being used.

  Further, the order of the above three types of determinations may not be the order shown in FIG. For example, it may be determined whether or not the suction nozzle 301 can be used (S42), the suitability of the combination of the constituent parts with respect to the parts (S43), and whether the combination is correct (SS41).

  That is, in any order, only the suction nozzle 301 that has cleared these three types of determination is used for component mounting. Therefore, the order can be appropriately determined in consideration of production efficiency and the like. Good.

  Moreover, it is not necessary to make all these three types of determinations. For example, when each component of each suction nozzle 301 is unused, and it has been found to some extent that each suction nozzle 301 has compatibility with components to be mounted on the substrate. Only the suitability of the combination of components may be determined.

  That is, all of these three types of determinations may be made, or only a part may be made. In short, it is only necessary to select a judgment that is considered necessary at the site of component mounting, and in any case, the possibility of an error such as a suction error can be reduced.

  Further, in the present embodiment, an explanation has been given using an IC tag as a storage means for storing individual data. However, the storage unit can be realized by, for example, a two-dimensional barcode, a memory, or the like that can be read (or read and written) by the RW unit 701 in addition to the IC tag.

  The storage unit may not be capable of non-contact communication with the RW unit 701 like an IC tag.

  For example, the base 302 of the suction nozzle 301 includes a storage unit such as a memory that stores individual data, and the base 302 is attached to the mounting head 112 so that it is provided on both the RW unit 701 side and the storage unit side. The RW unit 701 and the storage unit can communicate with each other.

  In this case, for example, a contact point is also provided in the storage means disposed in each of the background plate 303, the spring 304, and the nozzle tip 305, which are other components.

  Further, when the suction nozzle 301 is assembled by combining these components, the contacts of each storage means are connected to the contacts of the other storage means closest to each other, so that each storage means is connected to the RW unit 701 in a relay form. It is also possible to communicate.

  Even with such a configuration, the RW unit 701 can read individual data from a storage unit such as a memory, or read and write.

  In the present embodiment, the configuration and operation for determining whether the combination of the components of the suction nozzle 301 included in the component mounting machine 100 is correct or not have been described.

  However, the present invention can also be applied to a member for mounting a component other than the suction nozzle 301, such as a mechanical chuck that grips the component and mounts and inserts it on the substrate.

  Furthermore, the present invention can be applied not only to a member for mounting a component on a board but also to other components of the component mounter 100, which enables accurate and efficient production of a component mounter plate. It can also be done.

  An example of such a component is a feeder 114 that supplies components to the component mounting machine 100.

  The feeder 114 is a component supply device that holds a component tape inside and feeds the component to a suction position where the suction nozzle 301 sucks the component by a mechanical mechanism or a motor.

  For this reason, it is required to send the component to the component supply position in a correct posture in a timely manner, and when the feeder 114 does not satisfy such requirements, there is a possibility that suction mistakes and the like frequently occur.

  Further, like the suction nozzle 301, the feeder 114 has a plurality of main components, and these are assembled and manufactured. Therefore, it is necessary to judge whether the combination of each component is correct, whether there is a defect that makes each component unusable, etc. It is important to improve production efficiency.

  Therefore, a case where the present invention is applied to the feeder 114 will be described as an application example of the suction nozzle collating method of the present invention.

  FIG. 21 is an exploded perspective view showing main components of the feeder 114 in the embodiment. Note that components other than these components are omitted for clarity of illustration and description.

  As shown in FIG. 21, the feeder 114 includes a main main body 811 and a left main body 812 that are main bodies, a feed mechanism portion 813 that feeds out components, and an attachment portion that is attached to the component mounter 100 as main components. 814.

  Therefore, an IC tag is disposed in each of these main components as in the suction nozzle 301 shown in FIG.

  Specifically, the IC tag 500e is disposed on the right main body 811, the IC tag 500f is disposed on the left main body 812, the IC tag 500g is disposed on the feed mechanism portion 813, and the IC tag 500h is disposed on the attachment portion 814.

  Further, the right main body 811 is regarded as a parent in the feeder 114, and individual data similar to the individual data of the base body 302 shown in FIG. 5 is stored in the IC tag 500e. Further, the individual data of the constituent units as children belonging to the parent as shown in FIG. 6 and the like are stored in the other constituent units.

  Here, for example, the feed mechanism unit 813 is considered to deteriorate in proportion to the number of uses, the use period, and the like. Therefore, the “number of feed parts” is stored in the individual data of the feed mechanism unit 813, and a predetermined amount is stored. When the threshold is exceeded, the error flag is changed to “1”.

  Further, for example, the “use period” is stored in the individual data of the feed mechanism unit 813, and the error flag is changed to “1” when a predetermined threshold is exceeded.

  Similarly, for the attachment portion 814, the number of attachments and the like are stored in the individual data, and the error flag is changed to “1” when the value exceeds a predetermined threshold.

  By doing so, it is possible to prevent the use of components that are expected to be degraded and to become unstable in operation and the like. In addition, what is necessary is just to determine these predetermined threshold values suitably from an empirical rule, an experimental value, etc.

  In addition, the RW unit 701 that reads and writes information from and to these IC tags may be arranged at a position where the component mounter 100 can communicate with these IC tags.

  For example, when the RW unit 701 is disposed at or near the mounting head 112 as shown in FIGS. 13A, 13C, and 13D, when the suction nozzle 301 picks up a component The RW unit 701 may read / write the individual data of each component of each feeder 114.

  By configuring the feeder 114 and the component mounting machine 100 in this way, as in the case of the suction nozzle 301 described above, the feeder 114 is also determined as to whether the combination of the components is correct, whether to use each component, and the like. It becomes possible.

  Therefore, it is possible to prevent the occurrence of a suction error or the like due to an incorrect combination of the components of the feeder 114 and that the feeder 114 includes a component that should not be used. The production of the component mounting board can be performed accurately and efficiently.

  The present invention can cause a component mounting machine such as a modular machine or a rotary machine, that is, a device that performs component mounting using a component holding member such as a suction nozzle, to perform accurate and efficient component mounting. This is useful as a method for collating suction nozzles in a component mounting machine that mounts components on a substrate using suction nozzles having a plurality of components.

It is a block diagram which shows the structure of the component mounting system in embodiment. It is a top view which shows the main internal structures of the component mounting machine in embodiment. It is an external view of the mounting head in an embodiment. It is a disassembled perspective view which shows the main components of the suction nozzle in an embodiment. It is a figure which shows the data structural example of the separate data memorize | stored in the IC tag arrange | positioned at a base | substrate. It is a figure which shows the data structural example of the separate data memorize | stored in the IC tag arrange | positioned on the background board. It is a figure which shows typically a mode that a suction nozzle is hold | maintained at nozzle ST, and the progress of the damage of a background board. It is a figure which shows the data structural example of the separate data memorize | stored in the IC tag arrange | positioned at the spring. It is a figure which shows the data structural example of the separate data memorize | stored in the IC tag arrange | positioned at the nozzle front-end | tip part. It is a figure which shows the example of the shape of the suction hole of a nozzle front-end | tip part. It is a figure which shows the example of a components range. It is a figure which shows the example of the correct combination of a structure part. It is a figure which shows the example of arrangement | positioning of RW part and a component recognition camera. It is a functional block diagram which shows the functional structure of the nozzle collation apparatus in embodiment. It is a figure which shows the example of a data structure of the components library in embodiment. It is a flowchart which shows the flow of the 1st operation | movement which concerns on the nozzle collation in embodiment. It is a flowchart which shows the flow of the 2nd operation | movement which concerns on the nozzle collation in embodiment. It is a flowchart which shows the flow of the 3rd operation | movement which concerns on the nozzle collation in embodiment. It is a flowchart which shows the flow of the 4th operation | movement which concerns on the nozzle collation in embodiment. It is a flowchart which shows the flow of the whole operation | movement which concerns on the nozzle collation in embodiment. It is a disassembled perspective view which shows the main components of the feeder in embodiment. It is a disassembled perspective view which shows the main components of the conventional suction nozzle.

Explanation of symbols

100, 200 Component mounting machine 110 Front sub-equipment 112 Mounting head 113 XY robot 114 Feeder 115a, 115b Component supply unit 116 Component recognition camera 117 Tray supply unit 118 Shuttle conveyor 119 Nozzle ST
120 Sub-equipment 301 Adsorption nozzle 302 Substrate 303 Background plate 304 Spring 305 Nozzle tip 500 IC tag 500a, 500b, 500c, 500d, 500e, 500f, 500g, 500h IC tag 701 RW unit 800 Nozzle verification device 801 Operation control unit 802 Display unit 803 Input unit 804 Memory 805 Nozzle information storage unit 806 Communication I / F unit 807 Database unit 807a Mounting point data 807b Component library 807c Mounting machine information 808 Judgment unit 811 Right main body 812 Left main body 813 Mechanism unit 814 Mounting unit

Claims (10)

A method of collating a suction nozzle that is provided in a component mounting machine and sucks a component and mounts it on a substrate,
A component information acquisition step of acquiring identification information of each component stored in storage means arranged in each component constituting the suction nozzle;
A first determination step of determining whether or not the combination of the plurality of identification information is correct depending on whether or not the plurality of identification information acquired has a predetermined relationship. The component information acquisition step further acquires characteristic information indicating characteristics of the component corresponding to each of the identification information,
The matching method further includes:
A component information acquisition step of acquiring component information related to a component sucked by the suction nozzle;
A second determination step of determining whether or not the combination of the plurality of components is a combination suitable for adsorption of the component or mounting on a substrate by collating the characteristic information with the component information. The collation method according to claim 1. The suction nozzle has, as the component, a nozzle tip portion that sucks a component, and a background plate that serves as a background when the component sucked by the nozzle tip portion is optically recognized,
The component information includes a suction condition to be satisfied by the suction nozzle for suction of the component, and a recognition condition to be satisfied by the suction nozzle for recognition of the component,
In the second determination step, when the characteristic information of the nozzle tip satisfies the suction condition and the characteristic information of the background plate satisfies the recognition condition, a combination of the nozzle tip and the background plate is the component. The verification method according to claim 2, wherein the method is determined to be suitable for suction or mounting on a substrate. The property information includes availability information indicating availability of a configuration unit corresponding to the property information,
The verification method according to claim 2, further comprising a third determination step of determining whether any of the plurality of components is unusable based on the availability information. Furthermore, a detection step for detecting the degree of malfunction of the component part;
A determination step for determining whether or not the component is unusable when the degree of the detected defect is equal to or greater than a threshold;
The verification method according to claim 4, further comprising: a writing step of writing the determination result in the determination unit in the storage unit as the determination information. A component mounting method for mounting a component on a board by a component mounter using the verification method according to claim 1,
A component mounting method including a mounting step of mounting a component on a substrate using the suction nozzle when it is determined in the first determination step that the combination of the plurality of identification information is a correct combination. A nozzle verification device provided in a component mounter for verifying a suction nozzle that sucks a component and mounts it on a substrate,
Component information acquisition means for acquiring identification information of each component stored in storage means arranged in each component constituting the suction nozzle;
A nozzle verification device comprising: a determination unit that determines whether or not a combination of a plurality of acquired pieces of identification information is a correct combination. A suction nozzle that is provided in a component mounting machine and sucks a component and mounts it on a substrate.
A plurality of components including a nozzle tip for sucking parts;
A suction nozzle comprising: storage means arranged in each of the plurality of constituent parts and storing identification information of each constituent part. A method of collating a feeder provided in a component mounter and supplying a component to the component mounter,
A component information acquisition step of acquiring identification information of each component stored in storage means arranged in each component configuring the feeder;
A feeder verification method comprising: a first determination step of determining whether or not a combination of the plurality of identification information is correct depending on whether or not the plurality of identification information acquired has a predetermined relationship. A program for collating suction nozzles that are mounted on a component mounter and suck components and place them on a board,
A component information acquisition step of acquiring identification information of each component stored in storage means arranged in each component constituting the suction nozzle;
A program for causing a computer to execute a determination step of determining whether or not a combination of a plurality of pieces of acquired identification information is a correct combination.

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