JP2005302919A - Component attaching apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make the speed of the attachment of a component drastically faster and achieve a better processing cycle time by reducing operating time for suction nozzle replacement to a minimum with the structure of a head kept small and simple. <P>SOLUTION: A component transfer head 37 is provided for allowing an electronic component supplied by a component supply unit 35 to be suctioned by a suction nozzle and attached to a circuit substrate 15. The component transfer head 37 is constituted by a first head unit and a second head unit each comprising a revolver type sub head 67. In the revolver type sub head 67, a nozzle unit is circularly provided for the attachment of the suction nozzle. The revolver type sub head is supported such that it can be rotated upon an axis along the direction of the arrangement of a component supply position 33 in the component supply unit 35. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a component mounting apparatus for mounting a component such as an electronic component on a substrate.

Due to remarkable advances in electronic technology in recent years, the shapes and sizes of electronic components have become diverse, and a desired electronic circuit is often configured by combining extremely fine chip components to large components. For such a component mounting apparatus, high speed and high reliability have been strongly demanded.
Conventionally, as a component mounting apparatus for mounting components such as electronic components on a substrate such as a circuit board, a variety of devices including a plurality of suction units that suck and hold components and a mounting head that performs simultaneous suction of components, etc. The thing of this form is proposed and used for practical use. As such a mounting head, for example, as shown in FIG. 40, a row type component transfer head 3 (see Patent Document 1) in which nozzle units 2 for mounting the suction nozzles 1 are arranged in a single row or multiple rows is used. Many rotary-type component mounting heads in which nozzle units are arranged in an annular shape are used.

In the horizontal type component transfer head 3, by attaching suction nozzles of different sizes from the nozzle holder 5 in which various suction nozzles are stored to each nozzle unit 2, from a chip component of a small size to a large IC component. It can be automatically mounted on the board. In addition, in the rotary type component mounting head, operations from component adsorption to component mounting are performed in a rotating track, enabling high-speed component mounting.
Similarly to the rotary type component mounting head, as shown in FIG. 41, the component transfer head 7 in which a plurality of suction nozzles 1 are arranged radially is rotated to switch to a desired suction nozzle 1 (Patent Literature). 3) and a configuration of a revolver type component transfer head in which a plurality of suction nozzles are arranged in an arc shape is also known (see Patent Document 4).

JP 2001-191288 A JP 2000-36696 A U.S. Pat. No. 4,875,285

  However, in the conventional row-type component transfer head 3, an XY robot for moving the component transfer head 3 on the substrate is mounted so that one component transfer head 3 is movable with respect to one axis. This is a so-called 1-beam 1-head configuration. For this reason, if the type (large or small) of the suction nozzle attached to the component transfer head 3 is a large suction nozzle, there is a restriction that the necessary number of nozzle units to which a small suction nozzle is attached cannot be secured. As a result, the component mounting apparatus is practically a dedicated machine that is either a chip mounting machine or an odd-shaped part mounting machine, and it is difficult to respond to quick model switching corresponding to the production form.

  When the nozzle unit of the component transfer head is configured to be replaceable, the relative position of each part (recognition camera, nozzle, etc.) of the component transfer head 3 is changed when each nozzle unit is replaced or when the power is turned on. Calibration to detect and perform initial adjustment is performed. For this reason, when the model switching is frequently performed, calibration must be performed each time, resulting in production loss. Further, if the component transfer head 3 itself is replaced, there is a problem that the use frequency of each nozzle unit cannot be managed and the maintenance timing cannot be understood.

  Further, it is necessary to select the type of the suction nozzle 1 in accordance with the type of component to be mounted on the substrate. In this nozzle replacement operation, the component transfer head 3 is used in the configuration described in Patent Document 1. Moving to the position of the nozzle holder 5 will cause the suction nozzle 1 to be detached and replaced within the nozzle holder 5, resulting in time loss. In the configuration described in Patent Document 2, a gear mechanism for rotational operation is required for the structure of the component transfer head 7, and the component transfer head 7 becomes complicated and causes an increase in cost. This is disadvantageous for high-speed driving.

Here, in the revolver-type component transfer head described in Patent Document 3 in which a plurality of suction nozzles are provided in an arc shape, a plurality of electronic components sucked by each suction nozzle can be sequentially mounted on the substrate. It becomes difficult to cope with the higher speed. In other words, in order to mount electronic components having greatly different sizes or the like on the substrate, the component transfer head must be replaced each time, and the work efficiency cannot be improved.
Further, the head is provided with a camera that detects the suction posture of the electronic component sucked and held by the suction nozzle. When using this camera to rotate a component in a predetermined direction (for example, 90 ° rotation or 180 ° rotation) and then mounting it on a board, the rotation of the component is performed after the suction posture is confirmed by the camera. Misalignment of parts due to operation may occur. This positional deviation of the components is caused by a mechanical dimensional error such as a positional deviation between the rotation center of the rotation operation and the central axis of the suction nozzle, or an error accompanying a change in environmental conditions such as a temperature change over time. As a result, accurate component mounting may not be performed.

The present invention has been made in view of such circumstances, and the object thereof is as follows.
(1) It is possible to simultaneously mount different types of components such as chip components and odd-shaped components, and to enable high-speed component mounting so that any production form can be handled at high speed and with high efficiency.
(2) To keep the configuration of the component transfer head small and simple and minimize the operation time for exchanging the suction nozzle, thereby improving the tact time.
(3) It is possible to perform an accurate replacement operation in a short time even when switching the model that requires replacement of the suction nozzle.
(4) To smooth the component mounting operation from the component supply unit to mounting the component sucked and held by the suction nozzle on the substrate.

The above object is achieved by the following configuration.
(1) A component supply unit that supplies components from a plurality of the component supply positions that are arranged, and a component transfer head that includes a plurality of nozzle units that hold the components supplied from the component supply unit to the suction nozzle. A component mounting apparatus for mounting the component held by suction on the substrate by moving the component transfer head relative to a mounting position on the substrate, wherein the component transfer head moves the suction nozzle to the sub head. A sub-head in which the plurality of nozzle units are arranged with the component suction side of the suction nozzle facing the outside of the circumference in a circular shape around the rotation axis, and a rotary drive that rotationally drives the sub-head around the rotation axis A plurality of head units, and the sub head is arranged along the arrangement direction of the component supply position of the component supply unit with the sub head rotation axis in the head unit. Component mounting apparatus characterized by being arranged in the direction.

  According to this component mounting apparatus, since the suction nozzles are provided with a plurality of head units having rotatable sub-heads mounted circumferentially, the component mounting operation is performed by mounting the components using the plurality of suction nozzles. Can be greatly speeded up. In addition, since different types of suction nozzles can be mounted on these multiple sub heads, even when changing the model of the substrate to be produced, the operation time for replacement of the suction nozzles can be minimized and the tact time can be increased smoothly. Can support model changes. Furthermore, since the sub head has the sub head rotation axis arranged in the direction along the arrangement direction of the component supply positions, the component transfer head can be kept small and simple even with a configuration including a plurality of sub heads, enabling high-speed driving. it can.

  (2) The component transfer head is installed in the head unit at a distance that makes the interval between the suction nozzles between the sub-heads an integer multiple of the adjacent interval of the component supply position in the component supply unit. The component mounting apparatus according to (1).

  According to this component mounting apparatus, the suction nozzle interval between the sub-heads is set to an integral multiple of the adjacent interval of the component supply position, so that when suctioning the component from the component supply unit to the suction nozzle, At the same time, parts can be picked up and the time required for picking up parts can be shortened.

  (3) The component mounting apparatus according to (1) or (2), wherein the suction nozzles mounted on the sub heads are suction nozzles having different sizes for the sub heads.

  According to this component mounting apparatus, by mounting suction nozzles of different sizes for each sub head, a small suction nozzle and a large suction nozzle can be mounted and used for each sub head. Thereby, each subhead can be used in appropriate combination as a subhead for chip component mounting, a subhead for mounting odd-shaped components, etc., and can efficiently cope with various production forms.

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(4) The component mounting apparatus according to any one of (1) to (3), wherein the head unit is detachably mounted to the component transfer head.

  According to this component mounting apparatus, since the head unit is detachable from the component transfer head, it is possible to easily replace the head unit to which the sub head according to the production form is attached to the component transfer head, Productivity is improved.

  (5) The component mounting according to any one of (1) to (4), wherein the head unit includes an imaging unit that detects a posture of a component sucked and held by the suction nozzle of the sub head. apparatus.

  According to this component mounting apparatus, by providing an imaging unit in the head unit, the component sucked and held by the suction nozzle of the sub head can be imaged on the head unit side, so component recognition processing for the component before mounting is performed by the component mounting of the sub head. It can be carried out at a position other than the position. As a result, the time required for the component recognition process can be minimized and the tact time can be increased.

  (6) The component mounting apparatus according to (5), wherein the imaging unit images a component sucked and held by a suction nozzle located at an upper end of the sub head.

According to this component mounting apparatus, the imaging unit captures a component located at the upper end of the sub head, so that the imaging unit can be accommodated in the head unit in a compact manner.
(7) A nozzle rotation driving unit that is provided in each of the nozzle units and rotationally drives the suction nozzle of the nozzle unit, and a rotation drive command to the nozzle rotation driving unit is sent to the lower end position of the sub head and the upper end position of the sub head. (6) The component mounting apparatus according to (6), further comprising nozzle rotation control means for outputting within a predetermined rotation angle on the near side in the sub head rotation direction.

  According to this component mounting apparatus, since the suction nozzle rotation drive command is output only within a predetermined rotation angle on the front side in the rotation direction of the lower end position and the upper end position of the sub head, the rotation drive command for all the suction nozzles provided in the sub head is provided. There is no need to wire signal lines, and the sub-head configuration can be simplified.

  (8) The nozzle rotation control means rotates the component sucked and held by the suction nozzle so that the mounting direction to the substrate is a preset direction with respect to the suction nozzle at the upper end side of the sub head. A rotation drive command is output, and a rotation drive command is output to the suction nozzle on the lower end side of the sub head to correct the suction posture of the component held by suction based on the imaging result of the imaging unit. The component mounting apparatus according to (7).

  According to this component mounting apparatus, the suction posture is imaged by the imaging unit with the component held by suction on the upper end side of the sub head rotated in a predetermined direction in advance, and the suction posture is corrected based on the imaging result. Therefore, it is not affected by an error component due to rotation. Therefore, the suction posture correction process can be performed with higher accuracy than in the case where the suction posture is corrected by imaging before rotating the component in a predetermined direction.

  (9) The head unit includes an annular cam groove facing the nozzle unit in which the suction nozzle is arranged in the circumferential shape, and a lower portion of the cam groove is divided to be freely raised and lowered. Each nozzle unit is provided with a cam follower that engages with an annular cam groove fixed to the head unit. When the component is sucked and held by the suction nozzle from the component supply unit, the nozzle unit is sucked and held by the suction nozzle. When mounting a component on the board, it comprises nozzle lifting means for moving up and down a lower portion of the divided cam groove that engages with a cam follower of a nozzle unit located at the lower end of the sub head. The component mounting apparatus according to any one of 1) to (8).

  According to this component mounting device, the cam follower of the nozzle unit moves in the annular cam groove as the sub head rotates. When the divided lower part of the cam groove is driven up and down by the nozzle lifting / lowering means, the nozzle unit at the lower end of the sub head moves up and down following this lifting and lowering operation.

  (10) The component mounting apparatus according to any one of (1) to (9), wherein each of the head units includes an information storage unit including identification information of the head unit.

  According to this component mounting device, since the head unit includes the information storage unit, information related to the head unit can be stored for each head unit. For example, various information required for production can be easily stored from the information storage unit. Thus, productivity can be improved.

  (11) The information storage unit is a memory tag capable of rewriting information, and the component transfer head includes a tag read / write unit that reads and writes information from and to the memory tag. Component mounting device.

  According to this component mounting apparatus, when the head unit is attached to the component transfer head, the tag read / write unit can input / output information to / from the information storage unit.

  (12) The component mounting apparatus according to (11), wherein the memory tag is a wireless tag that reads and writes information by wireless communication.

  According to this component mounting apparatus, since the memory tag is a wireless tag, connection between the memory tag and the tag read / write unit is not required, and information can be input / output without contact, thereby simplifying the configuration. .

  (13) The identification information of the head unit stored in the memory tag includes calibration data having information on a relative position between the suction nozzle and the nozzle unit. Component mounting device.

  According to this component mounting apparatus, the calibration data is included in the identification information stored in the memory tag, and the calibration data is read to perform calibration every time the head unit is attached to the component transfer head. It is no longer necessary to execute the process, and the time to start production can be shortened.

  (14) The component mounting apparatus according to any one of (11) to (13), wherein the identification information of the head unit stored in the memory tag includes operation time data of a component mounting operation.

  According to this component mounting apparatus, since the operating time data is included in the identification information stored in the memory tag, even if the head unit is replaced, the usage frequency of the head unit can be accurately grasped, and maintenance can be performed. Etc. can be easily managed.

  (15) The identification information of the head unit stored in the memory tag includes component type data for identifying a component of the head unit, according to any one of (11) to (14). Parts mounting device.

  According to this component mounting apparatus, the component type data is included in the identification information stored in the memory tag, so that even if a failure occurs in the head unit, the component that needs to be replaced can be immediately identified. Can be notified.

  (16) The nozzle unit has a small diameter portion at the lower end and a large diameter portion at the upper end, and has a support portion that is thicker than the thin diameter portion and thinner than the large diameter portion in the middle, and has an intake / exhaust hole in the center. A first nozzle provided, and a second nozzle supported on an outer periphery of a support portion of the first nozzle so as to be slidable in a vertical direction, and disposed concentrically with the first holder. The nozzle has an upper lock portion and a lower lock portion at different positions in the vertical direction of the outer periphery of the support portion, and the second nozzle is arranged on the inner peripheral side facing the support portion of the first nozzle. When the second nozzle is at an upper position where the engagement portion and the upper lock portion engage with each other, the suction operation by the first nozzle is performed. The component suction operation by the second nozzle is performed, and the second nozzle is connected to the engaging portion. In the lower position where the lower lock portion is engaged, the component suction by the second nozzle is disabled and the component suction is performed only by the first nozzle (1) to (15) The component mounting apparatus according to any one of (15).

  According to this component mounting device, the state of the nozzle tip for component suction is changed by the change in the relative position between the first nozzle and the second nozzle, and the suction nozzle itself is relatively small without requiring replacement. Switching between suction targets such as parts and relatively large parts can be easily performed.

  (17) When the second nozzle is in a lower position, the lower end surface of the second nozzle is positioned below the lower end surface of the first nozzle, and is used for suction between the first nozzle and the second nozzle. The component mounting apparatus according to (16), wherein a space is defined.

  According to this component mounting apparatus, the suction space is defined when the second nozzle is in the lower position, and the suction area contributing to the component suction is increased. As a result, relatively large components can be sucked. .

  (18) The second nozzle includes a flange portion on an outer periphery of the second nozzle, and the first nozzle is moved up and down while the flange portion is fixed by a flange fixing means provided in the head unit. The component mounting apparatus according to (16) or (17), wherein the relative position with respect to the first nozzle is changed.

  According to this component mounting apparatus, the relative position of the second nozzle relative to the first nozzle is changed by fixing the flange portion of the second nozzle by the flange fixing means and moving the first nozzle up and down in this state.

  (19) The component mounting device according to (18), wherein the flange portion includes a pair of upper and lower flanges, and the flange fixing means inserts a stopper between the pair of flanges.

  According to this component mounting apparatus, even when the second nozzle is moved in either the upper position or the lower position, it can be easily performed by inserting a stopper between the pair of flanges.

  (20) A valve mechanism in which the sub head is selectively connected to each of the plurality of nozzle units to a negative pressure source that performs suction holding of the component by the suction nozzle and a positive pressure source that releases suction holding of the component. The component mounting apparatus according to any one of (1) to (19), wherein:

  According to this component mounting device, the operation of the valve mechanism can cause the suction nozzle of the sub head to suck and hold the component or release the suction of the component.

  (21) The valve mechanism moves the spool for switching the flow path according to the pressure difference, and the air operated valve that changes the flow path from the negative pressure source and the positive pressure source connected to the adsorption valve. The component mounting apparatus according to (20), wherein the component mounting apparatus is configured.

  According to this component mounting apparatus, since the air operated valve that operates the spool according to the pressure is used, a configuration excellent in space saving can be achieved.

  (22) The sub-head includes a nozzle fixing rotating member in which a hollow shaft portion is connected to a flange portion where the plurality of nozzle units and the plurality of valve mechanisms corresponding to the nozzle units are supported. The component mounting apparatus according to (20) or (21), wherein the rotation driving means is disposed on an outer periphery of a shaft portion of the nozzle fixing rotation member and rotationally drives the shaft portion.

  According to this component mounting apparatus, the nozzle unit and the valve mechanism are supported on the flange portion of the nozzle fixing rotation member, and the rotation driving means is disposed on the outer periphery of the shaft portion, whereby the sub head rotation mechanism can be made thin.

  (23) A signal taken out from the control circuit board via a slip ring in the inner space of the shaft portion of the nozzle fixing rotary member, on which the sub head is mounted with a control circuit board for controlling the nozzle unit and the valve mechanism. The component mounting device according to (22), wherein a line is laid and an intake passage to the nozzle mechanism is formed.

  According to this component mounting device, the sub-head rotating mechanism can be further reduced in size by laying the signal line and forming the intake passage by effectively using the inner space of the shaft portion of the nozzle fixing rotating member.

  In the component mounting apparatus of the present invention, the component transfer head includes a plurality of head units, and the head unit is configured such that the suction nozzle has a circular shape around the rotation axis of the sub head, and the suction side of the suction nozzle is set to the circular shape. It has a sub head in which a plurality of nozzle units are arranged toward the outside of the circumference, and a rotation driving means for driving the sub head to rotate about the sub head rotation axis. Further, the sub head is supplied with the sub head rotation axis as a component in the head unit. It is set as the structure arrange | positioned in the direction along the arrangement direction of the component supply position of a part. For this reason, by attaching different types of suction nozzles to each sub head, it is possible to simultaneously mount different types of parts such as chip parts and odd-shaped parts, and also enables high-speed part mounting. It can be made available with efficiency. In addition, while the configuration of the component transfer head is small and simple, the operation time for exchanging the suction nozzle can be minimized and the tact time can be increased. Furthermore, even when the model needs to be replaced, it is possible to perform an accurate replacement operation in a short time. Further, it is possible to facilitate the component mounting operation from the component supply unit to mounting the component sucked and held by the suction nozzle on the substrate.

DESCRIPTION OF EMBODIMENTS Hereinafter, a preferred embodiment of a component mounting apparatus according to the present invention will be described in detail with reference to the drawings.
FIG. 1 is a plan view showing a schematic configuration of a component mounting apparatus according to the present invention, and FIG. 2 is a plan view for explaining the movement of a component transfer head in the component mounting apparatus.
The component mounting apparatus 100 includes a base 11 and a plurality of (two by way of example) component mounting stages 13 a and 13 b on the base 11. The base 11 is provided with a substrate fixing portion 17 at the center for supporting the circuit board 15 at a predetermined position. The substrate fixing portion 17 places the circuit board 15 at a predetermined component mounting operation position (the component shown in FIG. 1). It has a substrate transfer section 19 that is carried into and positioned in the approximate center of the mounting apparatus. The substrate transport unit 19 has a fixed-side transport rail 24a having a transport belt 23 wound between a pair of pulleys 21a and 21b, and a rail-to-rail width variably movable with respect to the fixed-side transport rail 24a. It has the movable conveyance rail 24b arranged. By driving the conveyor belt 23 of each of the conveyor rails 24a and 24b, the circuit board 15 fed from the loader 25 provided on the side of the base 11 is placed on the conveyor belt 23 to be conveyed, and the circuit board 15 is carried into a predetermined position of the substrate fixing unit 17.

The component mounting stages 13 a and 13 b have substantially the same function, and are arranged symmetrically on the base 11. Hereinafter, the component mounting stage 13a will be mainly described. The component mounting stage 13 a mainly includes a component supply unit 35 to which a plurality of parts feeders 31 and the like for continuously supplying electronic components are attached, so that various types of electronic components can be sucked at the component supply position 33.
The component mounting stage 13 includes a component transfer head 37 that holds an electronic component at a predetermined component supply position 33 of the component supply unit 35 and mounts the electronic component on the circuit board 15. The component transfer head 37 is supported by an XY robot 39. The XY robot 39 moves the component transfer head 37 in the XY direction in FIG. Move to.

  The XY robot 39 has an X-axis beam 43 supported by shafts 41 on both sides of the base 11, and a component transfer head 37 is supported by the X-axis beam 43 so as to be movable in the X direction. The X-axis beam 43 is movable in the Y direction along the shaft 41, and the ball screw shaft 45 provided in parallel with the shaft 41 is rotated by the Y-axis moving motor 47, so that the X-axis beam 43 is moved in the Y-axis direction. Moved.

  On the base 11, a nozzle change unit 49, a component recognition unit 51, and a waste tray 52 are disposed between the component supply unit 35 and the board fixing unit 17. The nozzle change unit 49 holds a suction nozzle 65 for mounting various components to be mounted on the component transfer head 37, and the component transfer head 37 exchanges the suction nozzle 65 by the nozzle change unit 49. Can do. The nozzle change unit 49 is provided with various suction nozzles 65 of different sizes and types depending on the production form. The component recognizing unit 51 includes an optical sensor such as a line sensor, and recognizes the posture (component position, rotation angle, and the like) of the electronic component sucked by the suction nozzle 65 of the component transfer head 37. In the disposal tray 52, when the electronic component attracted by the suction nozzle 65 of the component transfer head 37 has a type error or malfunction, the electronic component is discarded.

  As shown in FIGS. 2A to 2C, the component transfer head 37 having the above-described configuration attracts an electronic component at the component supply position 33 (FIG. 2A). The posture is recognized from the position in the XY direction and the position in the rotation direction (θ direction) of the electronic component that is moved horizontally on the recognition unit 51 (FIG. 2B), and then the board fixing unit 17. The electronic component is mounted on the circuit board 15 (FIG. 2C).

Next, the component transfer head 37 will be described.
3 is an external perspective view of the component transfer head, FIG. 4 is a perspective view of a head unit constituting the component transfer head, FIG. 5 is an enlarged perspective view of a main part of a revolver type subhead to which a suction nozzle is attached, and FIG. FIG. 7 is a side view seen from one side of the head unit, FIG. 8 is a side view seen from the other side of the head unit, and FIG. 9 illustrates the structure of the imaging unit. It is principal part sectional drawing.

  As shown in FIG. 3, the component transfer head 37 includes a first head unit 61 and a second head unit 63 detachably. Each of the head units 61 and 63 is a unit having substantially the same function arranged side by side with a symmetrical structure. Therefore, here, the structure of the first head unit 61 will be described as an example.

As shown in FIGS. 3 and 4, the first head unit 61 includes a revolver-type sub head 67 in which a plurality of suction nozzles 65 are rotatably arranged around the R axis that is the sub head rotation center, and the sub head 67 rotates. A sub-head rotation motor 69 as a rotational drive means for driving, a push-down mechanism 71 as a nozzle raising / lowering means for lowering the suction nozzle 65 at the lower end position of the sub head 67, and an electron adsorbed by the suction nozzle 65 at the upper end position of the sub head 67 And an imaging unit 73 that images the component.
The revolver-type sub head 67, the sub head rotating motor 69, the push-down mechanism 71, and the imaging unit 73 are assembled to a head unit outer frame 75 that is L-shaped in a longitudinal sectional view.

As shown in FIG. 5, the revolver-type sub head 67 has the suction nozzle 65 on the circumference centering on the R axis that is the sub head rotation axis, with the component suction side of the suction nozzle 65 facing the outside of the circumference. A plurality (eight as an example in the present embodiment) of nozzle units 77 are arranged. In this way, a plurality of nozzle units 77 arranged radially at intervals in the circumferential direction are provided, and these nozzle units 77 are attached to a disk-shaped flange portion 78 as a nozzle fixing rotating member, which will be described in detail later. It has been.
These nozzle units 77 have a chuck mechanism 79 for the suction nozzle 65 at the tip, and the chuck mechanism 79 detachably holds the suction nozzle 65 for sucking and holding electronic components.
The nozzle unit 77 is provided with a θ-axis motor 81 as nozzle rotation driving means for rotating the suction nozzle 65 around the θ-axis that is the center axis on the base end side, and one side surface (in FIG. 5). A cam follower 83 protrudes from the front side surface. These nozzle units 77 are supported by a guide rail 80 fixed to the flange portion 78 so as to be movable in the radial direction of the sub head 67.

As shown in FIG. 4, a rotation guide plate 85, which is a constituent member of the push-down mechanism 71, is disposed on one side of the sub head 67 from which the cam follower 83 of the nozzle unit 77 protrudes. The rotation guide plate 85 is fixed to the unit outer frame 75. As shown in FIG. 6 showing the state of the rotation guide plate 85 as viewed from the back side of FIG. 4, the rotation guide plate 85 includes a cylindrical cam member 88 having an annular cam groove 87 on the sub head 67 side. Yes.
A cam follower 83 provided in each nozzle unit 77 of the sub head 67 is rotatably disposed in the cam groove 87, and the cam follower 83 is moved in the cam groove 87 by rotating about the R axis. Move while being guided.

  The rotation guide plate 85 includes an elevating cam member 89 that is movable in the vertical direction at the lower portion thereof. The elevating cam member 89 has an elevating cam groove 91 constituting a part of the cam groove 87 on the sub head 67 side. As shown in FIGS. 7 and 8, the elevating cam member 89 includes an elevating cam groove 91 that is continuous with other parts as a part of the cam groove 87 at an upper position indicated by a solid line, and is indicated by a two-dot chain line. It is divided from the other portion of the cam groove 87 at the lower position shown.

  Thereby, in the state where the cam follower 83 of the nozzle unit 77 located at the lower end of the sub head 67 is disposed in the lift cam groove 91, the lift cam member 89 moves downward, thereby moving the cam follower 83 downward, The nozzle unit 77 is moved downward together with the cam follower 83 so that the suction nozzle 65 receives the electronic component from the component supply unit 35 or mounts the electronic component on the circuit board 15.

As shown in FIG. 7, the lift cam member 89 is provided with an engagement pin 93 that protrudes on the opposite side of the sub head 67. The engagement pin 93 is engaged with a notch 97 formed at one end of a nozzle lifting / lowering drive arm 95 whose intermediate portion is rotatably connected to the rotation guide plate 85.
The nozzle lifting / lowering drive arm 95 is also formed with a notch 101 at the other end. The notch 101 is supported by one side of the rotation guide plate 85 so as to be movable up and down. A rod lower end pin 105 provided at the lower end of the rod 103 for engagement is engaged.
As shown in FIG. 4, the lifting rod 103 has an upper end connected to the connecting arm 107. The connecting arm 107 is fixed to a rotating shaft of a nozzle lifting / lowering motor 109 provided above the sub head 67.

  When the nozzle lifting / lowering motor 109 is driven and the connecting arm 107 is rotated, the lifting / lowering rod 103 is moved up and down by the rotation. As a result, the nozzle raising / lowering drive arm 95 rotates about the connection fulcrum 96 with the rotation guide plate 85, and the raising / lowering cam member 89 is raised / lowered. Accordingly, the nozzle unit 77 positioned at the lower end of the sub head 67 is moved. It is driven up and down.

  As shown in FIGS. 4 and 9, an illumination unit 111 is provided on the upper portion of the sub head 67. The illumination unit 111 includes a side illumination LED group 113 and an upper illumination LED group 115. The side illumination LED group 113 and the upper illumination LED group 115 are each composed of a plurality of light emitting sources (for example, LEDs) arranged in the circumferential direction, and the side illumination LED group 113 is centered from the side. The LED light 115 for upper illumination irradiates the light of the LED from diagonally upward to the lower center.

  Thereby, the electronic component sucked by the suction nozzle 65 of the nozzle unit 77 at the upper end position of the sub head 67 is arranged immediately below the illumination unit 111, and the side illumination LED group 113 and the upper illumination LED of the illumination unit 111 are arranged. Illuminated by group 115.

Further, an imaging unit 73 is disposed above the illumination unit 111. The imaging unit 73 includes a housing 119 having a lens group 117 therein, and an imaging device 121 such as a CMOS and a substrate 123 for driving the imaging device 121 are sequentially provided on the upper end of the housing 119. Yes.
The imaging unit 73 converts the image of the electronic component illuminated by the illumination unit 111 into an imaging signal composed of an electrical signal by the imaging element 121 and outputs the image, and the posture of the electronic component sucked by the suction nozzle 65 is changed. To detect.

  Moreover, as shown in FIG. 10, it is good also as a structure which integrated each imaging part of the adjacent 1st head unit 61 and the 2nd head unit 63 into one. That is, by providing mirrors 76 and 82 above the uppermost suction nozzle 65 and deflecting the optical path, one imaging unit 74 images the suction components of the head units 61 and 63 at a time. The mirrors 76 and 82 configured as described above may be prisms. Moreover, it is good also as a structure which integrates an image in the one imaging part 74 via flexible light transmission means, such as an optical fiber.

By the way, the revolver type sub head 67 is provided with mechanical valves 131 corresponding to the respective nozzle units 77 between the respective nozzle units 77.
The mechanical valve 131 is a valve for attaching / detaching an electronic component to / from the suction nozzle 65.

Here, a detailed structure of the nozzle unit 77 and an electronic component suction structure in the suction nozzle 65 will be described.
11 is a front view of the revolver-type subhead, FIG. 12 is a cross-sectional view of the main part for explaining the flow path in the mechanical valve and the nozzle unit, FIG. 12 is a cross-sectional view for explaining the switching of the flow path in the mechanical valve, and FIG. It is an equivalent circuit diagram explaining the flow-path structure of this.

An air passage 135 is formed at the tip of the motor shaft 133 of the θ-axis motor 81 of the nozzle unit 77. An opening 133 a is formed at the base end of the motor shaft 133, and the opening 133 a communicates with the flow path 137. Further, a pipe 139 is connected to the nozzle unit 77, and the pipe 139 communicates with the flow path 137.
The mechanical valve 131 has a first port I, a second port II, a third port III, a fourth port IV, and a fifth port V. The pipe 139 is connected to the first port I of the mechanical valve 131.

A cylinder chamber 151 is formed in the mechanical valve 131, and a spool 153 is slidably provided in the cylinder chamber 151. An intermediate portion of the spool 153 is a small diameter portion 153 a, and an annular flow path 155 is formed between the small diameter portion 153 a and the cylinder chamber 151.
The mechanical valve 131 has flow paths 157, 159, and 161 that allow the first port I, the second port II, and the third port III to communicate with the cylinder chamber 151.
Here, the flow path 157 always communicates with the annular flow path 155 regardless of the sliding of the spool 153. The channel 159 communicates with the annular channel 155 only when the spool 153 is disposed below, and the channel 161 communicates with the annular channel 155 only when the spool 153 is disposed above. .

The mechanical valve 131 has a flow path 163 that communicates the upper end of the cylinder chamber 151 and the fourth port IV and a flow path 165 that communicates the lower end of the cylinder chamber 151 and the fifth port V.
The second port II communicates with a negative pressure flow path 167 formed in the flange portion 78 and evacuated, and is always at a negative pressure. The negative pressure channel 167 is formed radially in the flange portion 78 corresponding to the mechanical valve 131 of each nozzle unit 77. Further, the third port III, the fourth port IV, and the fifth port V are opened on the surface side of the mechanical valve 131.

An air supply unit 169 is provided below the revolver type sub head 67. This air supply unit 169 abuts the surface of the mechanical valve 131 corresponding to the nozzle unit 77 at the lowest position on the circumference, and passes the flow path 171 that is supplied with positive air pressure through the third port III, The third port III, the fourth port IV, and the fifth port V are connected to the openings of the 4 port IV and the fifth port V to make positive pressure, and the switching is performed.
Here, the air supply unit 169 always sets the third port III to positive pressure, and sets either the fourth port IV or the fifth port V to positive pressure.

  When the fourth port IV is set to a positive pressure by the air supply unit 169, the upper end of the cylinder chamber 151 is set to a positive pressure via the flow path 163 as shown in FIGS. 13 (a) and 14 (a). Thus, the spool 153 moves downward. As a result, the second port II and the first port I communicate with each other via the annular flow path 155, and the first port I is set to a negative pressure. Therefore, a negative pressure is generated in the air passage 135 in the motor shaft 133 of the nozzle unit 77 through the pipe 139, and the electronic component is adsorbed to the tip of the adsorption nozzle 65 held by the chuck mechanism 79.

  On the other hand, when the fifth port V is set to a positive pressure by the air supply unit 169, the lower end of the cylinder chamber 151 passes through the flow path 165 as shown in FIGS. 13 (b) and 14 (b). Positive pressure is applied, and the spool 153 moves upward. As a result, the third port III and the first port I communicate with each other via the annular flow path 155, and the first port I is set to a positive pressure. Therefore, the pressure in the air passage 135 in the motor shaft 133 of the nozzle unit 77 becomes positive via the pipe 139, and the suction of the electronic components at the tip of the suction nozzle 65 held by the chuck mechanism 79 is released.

Next, the peripheral structure of the revolver type sub head 67 will be described.
15 is a cross-sectional view of the revolver-type subhead and its peripheral portion, FIG. 16 is a cross-sectional view (a) and a front view (b) of the subhead rotating motor, FIG. 17 is a front view showing a negative pressure flow path of the flange portion, and FIG. It is a block diagram of a control circuit board.
A rotary cylinder 181 is formed at the center of the flange 78 that supports each nozzle unit 77, and this rotary cylinder 181 is fixed to the sub head rotary motor 69, and the sub head rotary motor 69 is fixed. It is supported by the head unit outer frame 75.

  The sub head rotation motor 69 has a fixing member 183 fixed to the head unit outer frame 75. The fixing member 183 has a stator tube portion 185, and the rotating tube portion 181 of the flange portion 78 is rotatably supported by the bearing 187 in the stator tube portion 185. The stator cylinder portion 185 has a coil 189 on its outer periphery. Further, the flange portion 78 is formed with a rotor cylinder portion 191, and a magnet 193 facing the coil 189 is provided on the inner peripheral surface of the rotor cylinder portion 191. Thereby, when electric power is supplied to the coil 189, a rotational force is generated in the rotor cylinder portion 191 having the magnet 193, and the flange portion 78 that supports the nozzle unit 77 is rotated.

  A slit plate portion 195 is formed on the outer periphery of the rotor cylinder portion 191 of the flange portion 78 in the circumferential direction. The slit plate portion 195 is formed on the encoder cover 197 that covers the outer periphery of the rotor cylinder portion 191. The groove portion 199 is disposed. A plurality of slits 201 are formed in the slit plate portion 195 at intervals in the circumferential direction.

  A reading sensor unit 203 is provided on a part of the outer periphery of the sub head rotation motor 69. The reading sensor unit 203 includes a projector 205 that emits light toward the slit plate unit 195, and a light detection that receives the light emitted from the projector 205 and passes through the slit 201 of the slit plate unit 195 and converts it into an electrical signal. And a container 207. Based on the detection signal from the photodetector 207, the amount of rotation of the revolver type sub head 67 is detected.

  A cylindrical connecting cylinder 211 is provided on the rotating cylinder part 181 of the flange part 78. The connecting cylinder 211 has a connecting port 213 formed in the side portion on the rear end side thereof, and a pressure reducing pipe 215 connected to a vacuum pump (not shown) is connected to the connecting port 213. The connecting cylinder 211 is provided with two O-rings 217 on the outer periphery on the tip side thereof, and the space between the connecting cylinder 211 and the rotating cylinder portion 181 is hermetically sealed.

The connecting cylinder 211 has an opening 219 between the two O-rings 217, and the negative pressure flow path 167 of the flange 78 and the inside of the connecting cylinder 211 are communicated with each other through the opening 219. Yes.
A filter 221 that covers the opening 219 is provided on the outer periphery of the connecting cylinder 211 between the O-rings 217. The connecting cylinder 211 is formed with a female screw at the tip, and a lid member 223 is screwed into the female screw and is closed in an airtight state.
When the inside of the connecting cylinder 211 is depressurized by operating a vacuum pump, the inside of each negative pressure flow path 167 of the flange portion 78 communicating with the inside of the connecting cylinder 211 is set to a negative pressure. As shown in FIG. 17, the negative pressure channel 167 is formed radially in the flange portion 40.

A slip ring 225 is provided on the lid member 223 attached to the distal end portion of the connecting cylinder 211. The slip ring 225 includes a central power feeding shaft 227 and a power receiving cylinder 229 that covers the outer periphery of the power feeding shaft 227, and the power receiving cylinder 229 is rotatably provided. A power supply line 231 including a signal line and a power line is connected to the power supply shaft 227 through a lid member 223.
A sliding contact (not shown) is provided between the power feeding shaft 227 and the power receiving cylinder 229 of the slip ring 225, and signals and driving power are exchanged between the power feeding shaft 227 and the power receiving cylinder 229. . The power supply line 231 passes through the connecting cylinder 211 and is drawn from a side portion on the rear end side of the connecting cylinder 211. Note that the lead-out portion of the power supply line 231 from the connecting cylinder 211 is airtight.

A disc-shaped control circuit board 241 is provided at the tip of the slip ring 225. The control circuit board 241 is supported on the flange portion 78 by the stay 242.
A power switch 243 and a rotation control element 245 corresponding to each nozzle unit 77 are mounted on the control circuit board 241. Further, the control circuit board 241 is provided with servo switching circuits 247 at two locations on the inner peripheral side, and a power receiving cylinder 229 of a slip ring 225 is electrically connected to these servo switching circuits 247. The servo switch circuit 247 is electrically connected to power switches 243 and rotation control elements 245 corresponding to the four nozzle units 77.

  Further, as shown in FIG. 18, the control circuit board 241 is provided with connectors 244 corresponding to the respective power switches 243 and the rotation control element 245. A cable 246 connected to each nozzle unit 77 is connected to these connectors 244, and signals and driving power are supplied to each nozzle unit 77 via this cable 246.

Next, details of the suction nozzle 65 mounted on the nozzle unit 77 of the revolver type sub head 67 will be described.
19 is a front view of the sub-head portion of the component transfer head for explaining the suction nozzle, FIG. 20 is a sectional view for explaining the detailed structure of the suction nozzle, and FIG. 21 is a plan view for explaining the component mounting portion at the tip of the suction nozzle. 22 is a schematic cross-sectional view showing the QQ cross section of FIG. 21, and FIG. 23 is a schematic cross-sectional view of the suction nozzle for explaining the movement of the suction nozzle.

The revolver-type sub head 67 includes a nozzle size changing mechanism 251 below it. The nozzle size changing mechanism 251 includes a piston inside, and causes the stopper 253 to appear and disappear by the piston.
Then, the stopper 253 is projected and engaged with the flange 255 of the suction nozzle 65 mounted on the nozzle unit 77 at the lowest circumferential position, and the suction nozzle 65 is displaced in the θ-axis direction, thereby causing the suction nozzle 65 to be displaced. The size of the electronic component to be picked up is changed in two stages by changing the shape of the tip.

The suction nozzle 65 has a nozzle holder 261 coupled to the chuck mechanism 79 of the nozzle unit 77. The nozzle holder 261 is formed in a cylindrical shape, and a first nozzle 263 and a second nozzle 265 are accommodated on the inner peripheral side thereof.
The first nozzle 263 is slidably passed through the cylindrical second nozzle 265. The first nozzle 263 has an air passage 267 at the center thereof, and the air passage 267 communicates with the air passage 135 of the motor shaft 133 of the nozzle unit 77. Moreover, the 2nd nozzle 265 has the flange 255 mentioned above on the outer periphery.

  The first nozzle 263 has a small component nozzle 269 attached to the tip thereof. The second nozzle 265 has a middle / large component nozzle 271 that covers the outer periphery of the small component nozzle 269 at the tip.

The first nozzle 263 is provided with a first engagement groove 273 and a second engagement groove 275 having a V-shaped cross section formed in the circumferential direction on the outer peripheral surface thereof with a gap in the axial direction. . Further, the second nozzle 265 has a fitting groove 277 formed on the outer peripheral side thereof in the circumferential direction. Three holes 279 are spaced apart in the circumferential direction at the bottom of the fitting groove 277. Is formed.
Engaging balls 281 are placed in these holes 279, and an annular spring 283 is mounted in the fitting groove 277. As a result, the engagement ball 281 is urged in the inner circumferential direction by the annular spring 283, and a part thereof protrudes from the inner circumferential surface of the second nozzle 265.
Then, the engagement balls 281 protruding from the inner peripheral surface of the second nozzle 265 are fitted into either the first engagement groove 273 or the second engagement groove 275 of the first nozzle 263, and the first nozzle A second nozzle 265 is held with respect to H.263.

  The small component nozzle 269 has a flow path 285 at the center thereof, and the flow path 285 communicates with the air passage 267 of the first nozzle 263. Further, a flow path 287 is also formed between the medium / large component nozzle 271 and the small component nozzle 269, and this flow path 287 is connected to the first through a communication hole 289 formed in the first nozzle 263. The air passage 267 of the nozzle 263 communicates with the air passage 267.

  In the suction nozzle 65, as shown in FIG. 20A, when the second nozzle 265 is moved forward, the engagement ball 281 is fitted in the first engagement groove 273 of the first nozzle 263. Medium and large parts are absorbed. As a result, the tip portions of the small component nozzle 269 and the medium / large component nozzle 271 are flush with each other, and as shown in FIG. 21A, the opening 285a of the flow channel 285 and the opening 287a of the flow channel 287 Are opened, and medium- and large-sized electronic components are adsorbed by the suction force in the openings 285a and 287a.

  Further, as shown in FIG. 20B, when the second nozzle 265 is moved rearward, a small component adsorption state in which the engagement ball 281 is fitted in the second engagement groove 275 of the first nozzle 263 is set. The As a result, the medium / large component nozzle 271 is moved backward relative to the small component nozzle 269 so that only the tip of the small component nozzle 269 protrudes, and the inner peripheral surface at the tip of the medium / large component nozzle 271 is The flow path 287 is closed in close contact with the outer peripheral surface of the small component nozzle 269, and only the opening 285a of the small component nozzle 269 is opened as shown in FIG. The small electronic component is attracted to the portion by the suction force in the opening 285a.

Here, a case where the medium / large component adsorption state is shifted to the small component adsorption state will be described.
First, as shown in FIG. 23A, the stopper 253 protrudes from the suction nozzle 65 in the middle / large component suction state, and as shown in FIG. Is placed.
In this state, when the suction nozzle 65 is moved in the distal direction along the θ axis, the engagement ball 281 is removed from the first engagement groove 273 as shown in FIG. The second nozzle 265 is moved rearward with respect to H.263.

  When the suction nozzle 65 is further moved in the distal direction, the engagement ball 281 engages with the second engagement groove 275 and only the opening 285a of the small component nozzle 269 opens, as shown in FIG. The small parts are in a sucked state. When the suction nozzle 65 is brought into the small component suction state, the stopper 253 is pulled.

When shifting from the small component adsorption state to the medium / large component adsorption state, the adsorption nozzle 65 is moved along the θ axis in the rear end direction with the stopper 253 disposed on the rear end side of the flange 255. Let
As a result, the engagement ball 281 is removed from the second engagement groove 275, the second nozzle 265 is moved forward with respect to the first nozzle 263, and the engagement ball 281 is engaged with the first engagement groove 273. In this case, the small and large component nozzles 269 and the medium and large component nozzles 271 are flush with each other, and the medium and large component adsorption state in which the openings 285a and 287a are opened.
Here, FIG. 24 shows a time chart in which the tip shape of the suction nozzle 65 is changed before the component is sucked and mounted, and the size of the electronic component that can be sucked is changed.
The revolver-type sub head 67 is rotated at a 45 ° pitch, but a plurality of operations of each part are performed simultaneously. More specifically, the switching stopper 253 starts to feed out the suction nozzle, which is index-moved by the rotation of the R axis, from 15 ° before the position in increments of 45 °. Then, with the stopper 253 extended, the Z-axis is driven downward to change the tip shape of the suction nozzle 65. Thereafter, the suction nozzle 65 is lowered to the reference height, and is lowered to the suction mounting height at the component suction mounting position. When the suction nozzle 65 is raised to reach the reference height, the index rotation of the R axis is resumed.

  FIG. 25 shows a time chart in which the tip shape of the suction nozzle 65 is changed after the component suction / attachment is performed. In this case, the stopper 253 is extended after sucking and mounting the components, and thereafter, when the suction nozzle 65 reaches the nozzle tip switching height, the tip shape of the suction nozzle 65 is changed.

As another example of the suction nozzle, FIG. 26 shows a schematic sectional view of the suction nozzle.
As shown in FIG. 26, two flanges 255 for switching between the small component adsorption state and the middle / large component adsorption state may be formed. When the two flanges 255 are formed in this way, the stopper 253 is inserted between the flanges 255 and the suction nozzle 65 is moved to the front end or the rear end side. The nozzle 265 can be easily moved to switch between the small component adsorption state and the medium / large component adsorption state.

Next, an identification method of the first head unit 61 and the second head unit 63 having the above structure will be described.
FIG. 27 is a front view and a sectional view of a component transfer head including a first head unit and a second head unit, and FIG. 28 is a schematic perspective view of a revolver type subhead of the first head unit and the second head unit.
As shown in FIG. 27, the first head unit 61 and the second head unit 63 constituting the component transfer head 37 are detachably attached to the attachment plate 291. The mounting plate 291 is supported by the X-axis beam 43 constituting the XY robot 39, and is movable in the X direction along the rail 293 of the X-axis beam 43.

A tag mounting base 295 is provided at the upper end of each of the first head unit 61 and the second head unit 63, and a memory tag 297 made of RFID or the like is mounted on the tag mounting base 295.
Further, a tag read / write unit 299 is attached to the upper end of the mounting plate 291, and these tag read / write units 299 are arranged at positions facing the memory tags 297 of the first head unit 61 and the second head unit 63. .

Information on the first head unit 61 and the second head unit 63 is recorded in the memory tag 297 provided in each of the first head unit 61 and the second head unit 63.
The recorded information of the first head unit 61 and the second head unit 63 includes the operation history such as the operating time of the head units 61 and 63, the type such as the size of the revolver type sub head 67, and the nozzle unit 77. There is a parts list including types and combinations of the suction nozzles 65, calibration data composed of data such as relative positions of the suction nozzles 65, and part numbers and model numbers of the components constituting the head units 61 and 63.

When the first head unit 61 and the second head unit 63 are attached to the attachment plate 291, information stored in the memory tags 297 of the first head unit 61 and the second head unit 63 is read by the tag read / write unit 299. The production mode is adjusted and the position of the suction nozzle 65 is corrected.
In addition, after the start of production, the operation time is written in the memory tag 297, and further, the part number and model number of the part that has reached the end of its life and the part that has failed such as a failure are displayed on the display unit.

The place where the memory tag 297 is attached is not limited to the upper ends of the first head unit 61 and the second head unit 63.
In FIG. 28, a memory tag 297 is attached to the revolver type sub head 67 of each of the first head unit 61 and the second head unit 63. In addition, one read / write unit 299 reads and writes information with respect to each memory tag 297 attached to the revolver type sub head 67 in this way.
That is, the structure can be simplified by reading and writing information with respect to the two memory tags 297 by one read / write unit 299.

Next, a control system of the component mounting apparatus 100 having the above structure will be described.
FIG. 29 is a block diagram showing a control system of the component mounting apparatus 100.
As shown in the figure, the component mounting apparatus 100 includes a control unit 301.
The control unit 301 is connected to the substrate transfer unit 19, the component supply unit 35, and the XY robot 39. The control unit 301 transmits control signals to the substrate transfer unit 19, the component supply unit 35, and the XY robot 39. Thus, each drive is controlled.

In addition, a component recognition unit 51 and a tag read / write unit 299 are connected to the control unit 301. The control unit 301 receives image data from the component recognition unit 51. Further, the control unit 301 reads data from the memory tag 297 of the first head unit 61 and the second head unit 63 and writes data to the memory tag 297.
Further, the control unit 301 is connected to a drive mechanism of the component transfer head 37 and the like.

  Specifically, a sub head rotation motor 69, an imaging unit 73, a chuck mechanism 79, a θ-axis motor 81, a nozzle lifting / lowering motor 109, an air supply unit 169, and a nozzle size changing mechanism 251 are connected to the control unit 301. The control unit 301 transmits control signals to the sub head rotation motor 69, the imaging unit 73, the chuck mechanism 79, the θ-axis motor 81, the nozzle lifting / lowering motor 109, the air supply unit 169, and the nozzle size changing mechanism 251 to drive them. To control.

Further, a reading sensor unit 203 is connected to the control unit 301, and the rotation angle of the revolver type sub head 67 is calculated based on a detection signal from the reading sensor unit 203.
Further, for example, various sensors 303 provided in each mechanism unit that detects air leakage and the like are connected to the control unit 301, and detection signals from the respective sensors 303 are input.

  The control unit 301 is connected to a display unit 305 including a display, an input unit 307 including a keyboard and a touch panel, and a storage unit 309. The control unit 301 performs various displays on the display unit 305, receives various setting data from the input unit 307, and further reads and writes various data to and from the storage unit 309.

Next, an electronic component mounting operation by the component mounting apparatus 100 will be described.
When the circuit board 15 is sent to the board fixing unit 17 by the board conveying unit 19, the component mounting apparatus 100 starts an operation of mounting the electronic component on the circuit board 15.
When the mounting operation is started, the component transfer head 37 moves above the component supply position 33 of the electronic component to be sucked so that the XY robot 39 sucks the predetermined electronic component to the suction nozzle 65.

  Next, at the component supply position 33, the respective revolver-type sub heads 67 are sequentially rotated by the sub head rotating motor 69 and the nozzle lifting / lowering motor 109 is driven to move the nozzle unit 77 at the lowest circumferential position in the Z direction. The electronic components are sequentially picked up by the suction nozzle 65.

  Here, since the component transfer head 37 is movable in the X direction which is the arrangement direction with respect to the component supply position 33 of the component supply unit 35, it is shown in FIGS. 30 (a) and 30 (b). As described above, the components can be adsorbed at all the component supply positions 33 by the revolver type sub heads 67 of the first head unit 61 and the second head unit 63.

  Thereafter, the component transfer head 37 is moved horizontally on the recognition unit 51 by the XY robot 39. As a result, the position of the sucked electronic component in the XY direction and the position in the rotation direction (θ direction) is detected by the recognition unit 51, and the detection data is transmitted to the control unit 301.

  Thereafter, the component transfer head 37 is moved to a predetermined mounting position on the circuit board 15 supported by the board fixing unit 17 by the XY robot 39. In this state, the nozzle lifting / lowering motor 109 is driven, the nozzle unit 77 at the lowest position in the circumference is moved downward in the Z direction, and the electronic component sucked by the suction nozzle 65 is moved to the circuit board 15. Is mounted at a predetermined position.

When pulling up the suction nozzle 65, the control unit 301 controls the air supply unit 169, so that the suction nozzle 65 has a positive pressure, and the suction of the electronic components is reliably released.
Thereafter, the revolver type sub head 67 is sequentially rotated by the sub head rotating motor 69, and the electronic components sucked by the suction nozzle 65 are sequentially mounted at predetermined mounting positions of the circuit board 15.
If the control unit 301 determines that the sucked electronic component is defective based on the detection data from the recognition unit 51, the control unit 301 drives the XY robot 39 to move the component transfer head 37 to the disposal tray 52. The electronic component sucked by the suction nozzle 65 is moved to the disposal tray 52.

  In the above mounting operation, in the first head unit 61 and the second head unit 63 of the component transfer head 37, when the sucked electronic component is mounted to be rotated in order to match the mounting direction, the electronic component is placed at the outermost circumference. After sucking at the lower position, the suction nozzle 65 that sucks the electronic component is rotated by the θ-axis motor 81 before moving to the uppermost circumferential position.

Here, in the first head unit 61 and the second head unit 63 of the component transfer head 37, the revolver-type sub head 67 is sequentially rotated so that the electronic component is adsorbed to the adsorption nozzle 65 at the lowest circumferential position, The posture of the electronic component sucked by the suction nozzle 65 at the uppermost circumferential position is photographed by the imaging unit 73.
The imaging data from the imaging unit 73 is transmitted to the control unit 301. The control unit 301 calculates the deviation of the posture of the electronic component and drives the θ-axis motor 81 before mounting on the circuit board 15. Correct the misalignment.

Next, details of the movement of the component transfer head 37 will be described.
FIG. 31 is an explanatory diagram showing the movement of the component transfer head when the component transfer head reaches the target position after rotating the R axis.
The component transfer head 37 is shown in the figure with the timing of rotation around the R axis by the sub head rotation motor 69, movement in the Z axis (θ axis direction) by the nozzle lifting / lowering motor 109, and movement in the XY direction by the XY robot 39. As shown.

  That is, as shown in FIG. 31, when the movement in the XY direction is completed before the end of the rotation of the R axis, the movement of the suction nozzle 65 for sucking or mounting the electronic component starts downward in the Z axis direction. This timing is set slightly before the end of the rotation of the revolver-type sub head 67 around the R axis for the suction nozzle 65 that performs the suction or mounting to be rotated by 45 ° and disposed at the lowest position on the circumference. In addition, the timing of the end of the movement of the suction nozzle 65 upward in the Z-axis direction is slightly later than the start of the rotation of the revolver-type subhead 67 around the R-axis.

  Further, at least 20 ms before and after the suction nozzle 65 is moved downward in the Z-axis direction to pick up or mount the electronic component, the revolver type sub head 67 is rotated by the sub head rotation motor 69 and the component transfer head 37 by the XY robot 39 is used. The movement of is stopped.

  This eliminates vibrations caused by the rotation of the revolver-type sub head 67 by the sub head rotating motor 69 and the movement of the component transfer head 37 by the XY robot 39 when the electronic component is sucked or mounted by the suction nozzle 65. Adsorption or mounting can be performed.

FIG. 32 is an explanatory diagram showing the movement of the component transfer head when the component transfer head reaches the target position before rotating the R axis.
If the movement in the XY direction is not completed before the rotation of the R axis is completed, the timing for moving the suction nozzle 65 to the suction mounting height for the suction or mounting of the electronic component is after the movement of the component transfer head is completed. The driving of the R axis and the XY robot 39 is stopped at least 20 ms before and after the suction nozzle 65 is moved downward in the Z-axis direction to suck or mount electronic components.

Next, details of the operation of the nozzle unit 77 provided in the revolver type sub head 67 will be described.
FIG. 33 is a schematic front view showing the timing of power supply to the θ-axis motor of the nozzle unit, and FIG. 34 is an explanatory diagram showing the operation of the nozzle unit.
As shown in FIG. 33, in the revolver type sub head 67, the power supply to the θ-axis motor 81 which is the servo motor of each nozzle unit 77 extends from 45 ° before the lowest position of the circumference to the lowest position of the circumference. It is performed in the range from the 45 ° effort at the circumferential top position to the circumferential top position. Thereby, the power supply to each nozzle unit 77 of the revolver-type sub head 67 can be greatly reduced, and power can be supplied by the slip ring 225 having a limited number of contacts.

  Then, in the servo ON section, which is the power supply section to the θ-axis motor 81, the pre-rotation is performed by controlling the drive of the θ-axis motor 81 to correct the deviation of the electronic component sucked by the suction nozzle 65 and to align the electronic component. The operation is performed as follows.

(Θ operation at suction mounting position)
As shown in FIG. 34, the control unit 301 (see FIG. 29) drives the θ-axis motor 81 of the nozzle unit 77 that enters the servo-on section on the suction mounting side, and calculates from the imaging data of the imaging unit 73. The deviation around the θ axis is corrected based on the correction data. This misalignment correction is terminated before the suction nozzle 65 reaches the lowest point in the Z-axis direction and the electronic component is mounted.
As a result, when the electronic component is mounted on the circuit board 15, the misalignment is reliably corrected, and smooth and reliable mounting can be performed.
Note that the control unit 301 simultaneously corrects the deviation in the XY directions based on the detection data from the recognition unit 53.

(Θ operation at recognition position)
When the electronic component sucked by the suction nozzle 65 needs to be rotated in order to match the orientation, the control unit 301 moves the θ-axis motor 81 of the nozzle unit 77 in the servo-on section on the recognition side by the imaging unit 73. And the electronic component is rotated before being imaged by the imaging unit 73.
As described above, the electronic component is photographed by the imaging unit 73 and before the position shift around the θ axis is detected, the electronic component is already rotated, so that the shift caused by the rotation after the position shift is detected. Can be prevented.

The above-described operation of sucking and mounting parts by the control unit 301 is summarized as shown in FIGS.
FIG. 35 and FIG. 36 show an example of the time sequence of the component suction operation to the suction nozzle 65 and the mounting operation of the sucked component on the substrate for each axis. In this way, the component supply unit 35 sequentially sucks the components to the suction nozzles of the respective axes, and moves to the component mounting position on the board. Then, the sucked and held components are sequentially mounted on the substrate at the component mounting position. This operation is merely an example, and the component insertion / removal operation is performed by appropriately changing the sequence according to the component to be mounted and the production form.

As the revolver-type sub head 67 described above, various types that can be mounted with various suction nozzles 65 corresponding to various types of electronic components can be used according to the production form.
For example, what is shown in FIG. 37 (a) is an example in which one of the revolver-type subheads 67 can be mounted with a small suction nozzle 65 and the other is mounted with a large suction nozzle 65. FIG. 37B shows an example in which both the revolver-type sub head 67 can be attached with a small suction nozzle 65.

In particular, when one of the revolver-type sub heads 67 can be fitted with a small suction nozzle 65 and the other can be fitted with a large suction nozzle 65, as shown in FIG. With the revolver-type sub head 67, electronic components of different sizes can be simultaneously sucked onto the suction nozzle 65.
Further, if a plurality of arrays of parts feeders 31 capable of simultaneously sucking electronic components of different sizes are set, without waiting for the supply of electronic parts by the parts feeder 31, (a) in FIG. By moving the component transfer head 37 along the component supply position 33 as shown in (b) → (c), the electronic components having different sizes are adsorbed to the adsorption nozzle 65 of each revolver type sub head 67. Can be done quickly.

Further, in the component mounting apparatus 100, the first head unit 61 or the second head unit 63 is exchanged for various types according to a change in production form or the like.
Here, the case where the first head unit 61 or the second head unit 63 is replaced will be described with reference to the flowchart shown in FIG. 39, taking the replacement of the first head unit 61 as an example.
When replacing the first head unit 61 with another type due to a change in production mode, etc., the first head unit 61 mounted on the mounting plate 291 is removed, and then the first head unit 61 adapted to the subsequent production mode is removed. One head unit 61 is mounted on the mounting plate 291 (step S1).

As a result, information stored in the memory tag 297 of the new first head unit 61 attached to the attachment plate 291 is read by the tag read / write unit 299 by wireless communication (step S2).
The information of the first head unit 61 read by the tag read / write unit 299 is transmitted to the control unit 301.
The control unit 301 corrects the position of each suction nozzle 65 using calibration data including data such as the relative position of the suction nozzle 65 among the information, and starts production by component mounting (step S3). .

  That is, the component mounting apparatus 100 is stored in advance in the memory tag 297 without detecting the position of the suction nozzle 65 again and performing the alignment when the first head unit 61 or the second head unit 63 is replaced. Information is read and position correction is performed, and production is started quickly and smoothly.

As described above, according to the component mounting apparatus 100 according to the present embodiment, since the suction nozzle 65 includes a plurality of rotatable revolver-type subheads 67 mounted in an arc shape, the plurality of revolver-type subheads 67 are provided. As a result, the mounting speed of electronic parts can be greatly increased.
In particular, since the suction nozzle 65 is mounted in an arc shape, tact-up can be achieved by minimizing the operation time for replacing the suction nozzle 65 while keeping the configuration of the head small and simple.

Further, by moving the plurality of revolver-type sub heads 67 along the component supply position 33 while rotating, the electronic components can be adsorbed to each of the adsorbing nozzles 65 very quickly, and further tact-up can be achieved.
Furthermore, various electronic parts such as chip parts and odd-shaped parts can be supported simultaneously, and any production form can be handled at high speed and with high efficiency.

In addition, since the orientation of the electronic component is matched with the orientation to be mounted on the circuit board 15 before the orientation of the electronic component is detected by the imaging unit 73, positional deviation due to the orientation adjustment of the electronic component is detected after the orientation is detected. Thus, the positional displacement of the electronic component can be reliably corrected and smooth mounting on the circuit board 15 can be performed.
Further, even when the model is switched to replace the revolver type sub head 67, the position of the suction nozzle 65 and the like can be corrected based on the information from the memory tag 297, and it is unnecessary to perform a calibration operation again. .

Further, the provision of the tag read / write unit 299 makes it possible to easily and quickly read / write information from / to the memory tag 297. In particular, the first head unit 61 and the second head unit having the revolver type sub head 67 are provided. The start of production after the replacement of 63 can be speeded up.
Furthermore, if the tag read / write unit 299 is configured to read / write information from / to the plurality of memory tags 297, the structure can be simplified, and the cost can be reduced accordingly.

  Further, since the control unit 301 manages the revolver-type subhead 67 based on the information read from the memory tag 297, the revolver-type subhead 67 is used by utilizing information such as various management data of the revolver-type subhead 67. Can be managed appropriately, and the installation work can be facilitated.

  In particular, after the start of production, from the read information, it is possible to display on the display unit 305 the part number and model number of a part that has reached the end of its life or a part that has failed such as a failure, thereby prompting the operator to replace it. The display on the display unit 305 is not only a display using symbols, characters, or sentences, but also a display that can be easily recognized visually by lighting the relevant part in red in a three-dimensional overall display. it can.

  Further, since the control unit 301 writes the operation time in the memory tag 297, each suction of the revolver type sub head 67 when the first head unit 61 or the second head unit 63 including the revolver type sub head 67 is used thereafter. It becomes possible to grasp the life of the nozzle 65 etc. very easily and accurately.

  Further, the suction nozzle 65 includes a small component nozzle 269 capable of mounting small electronic components and a medium / large component nozzle 271 capable of mounting medium / large electronic components. The electronic parts can be mounted, and it is possible to easily cope with a variety of production forms.

  In addition, a nozzle size changing mechanism 251 that switches the suction of the electronic components in the suction nozzle 65 by moving the medium / large component nozzle 271 in the axial direction by moving relative to the suction nozzle 65 in the axial direction is provided. Therefore, it is possible to easily switch the suction of the electronic component in the suction nozzle 65 by the nozzle size changing mechanism 251, and it is possible to smoothly and quickly mount a plurality of types of electronic components.

It is a top view which shows schematic structure of the component mounting apparatus which concerns on this invention. It is a top view explaining the movement of the component transfer head in a component mounting apparatus. It is an external appearance perspective view of a component transfer head. It is a perspective view of the head unit which comprises a component transfer head. It is a principal part expansion perspective view of the revolver type subhead to which the suction nozzle is attached. It is a partial exploded perspective view of a head unit. It is the side view seen from the one side part side of a head unit. It is the side view seen from the other side part side of a head unit. It is principal part sectional drawing explaining the structure of an imaging part. It is explanatory drawing which shows the structure which images the adsorption | suction component of each head unit at once with one imaging part. It is a front view of a revolver type sub head. It is principal part sectional drawing explaining the flow path in a mechanical valve and a nozzle unit. FIG. 6 is a cross-sectional view for explaining switching of flow paths in a mechanical valve, where (a) shows a case where an electronic component is adsorbed to the tip of an adsorption nozzle held by a chuck mechanism, and (b) shows a case where adsorption is released. FIG. It is the equivalent circuit diagram (a), (b) explaining the channel composition of a mechanical valve. It is sectional drawing in a revolver type subhead and its peripheral part. It is sectional drawing (a) and a front view (b) of a sub head rotation motor. It is a front view which shows the negative pressure flow path of a flange part. It is a block diagram of a control circuit board. It is a front view in the sub head part of the component transfer head explaining a suction nozzle. It is sectional drawing explaining the detailed structure of a suction nozzle. It is a top view explaining the component mounting part of the front-end | tip part of a suction nozzle, (a) is a nozzle for medium and large sized electronic components, (b) is a figure showing a small component nozzle. It is a schematic cross-sectional view showing the QQ cross section of FIG. It is a schematic sectional drawing of the suction nozzle explaining the movement of a suction nozzle. It is a time chart which changes the size of the electronic component which can be picked up by changing the tip shape of the suction nozzle before sucking and mounting of the component. It is a time chart which changes the front-end | tip shape of a suction nozzle after performing component suction mounting. It is a schematic sectional drawing which shows the other example of a suction nozzle. It is the front view (a) and sectional drawing (b) of a component transfer head provided with the 1st head unit and the 2nd head unit. It is a schematic perspective view of the revolver type sub head of the first head unit and the second head unit. It is a block diagram which shows the control system of a component mounting apparatus. It is a front view (a), (b) explaining the method of adsorption | suction of an electronic component by the revolver type sub head of a 1st head unit and a 2nd head unit. It is explanatory drawing which shows a motion of a component transfer head when a component transfer head reaches | attains a target position after R-axis rotation. It is explanatory drawing which shows a motion of the component transfer head when a component transfer head reaches | attains a target position before R-axis rotation. It is a schematic front view which shows the timing of the electric power supply to the (theta) axis | shaft motor of a nozzle unit. It is explanatory drawing which shows operation | movement of a nozzle unit. It is explanatory drawing (the 1) which showed the time sequence of the components adsorption | suction operation | movement to an adsorption | suction nozzle, and the mounting | wearing operation | movement to the board | substrate of the adsorbed components for every axis | shaft. It is explanatory drawing (the 2) which showed the time sequence of the components adsorption | suction operation | movement to an adsorption | suction nozzle, and the mounting | wearing operation | movement of the adsorbed components on the board | substrate for every axis | shaft. It is a schematic perspective view (a), (b) of a revolver type subhead explaining various revolver type subheads. It is a schematic front view (a), (b), (c) explaining how to adsorb electronic components by various revolver type sub heads. It is a flowchart explaining the flow of work at the time of head unit exchange. It is a schematic perspective view which shows the conventional 1 head row type mounting head. It is a schematic side view which shows the conventional rotary type mounting head.

Explanation of symbols

15 Circuit board (board)
33 Component supply position 35 Component supply unit 37 Component transfer head 65 Suction nozzle 67 Revolver type sub head (sub head)
73 Imaging unit 100 Component mounting device 251 Nozzle size changing mechanism 269 Small component nozzle 271 Medium / large component nozzle 297 Memory tag 299 Tag read / write unit 301 Control unit

Claims (23)

A component supply unit that supplies components from a plurality of the component supply positions arranged; and a component transfer head that has a plurality of nozzle units that suck and hold the components supplied from the component supply unit by suction nozzles, A component mounting apparatus for mounting the suction held component on the substrate by relatively moving the component transfer head to the mounting position on the substrate,
The component transfer head includes a sub head in which the plurality of nozzle units are arranged with the component nozzle side of the suction nozzle facing the outside of the circumference in a circumferential shape centering on the sub head rotation axis. A plurality of head units having a rotation driving means for rotating the sub head around the rotation axis,
The component mounting apparatus, wherein the sub-head is disposed in the head unit with the sub-head rotation axis in a direction along an arrangement direction of component supply positions of the component supply unit.   The component transfer head is installed in the head unit at a distance that makes an interval between suction nozzles between the sub-heads an integral multiple of an interval between adjacent component supply positions in the component supply unit. Item mounting apparatus according to Item 1.   3. The component mounting apparatus according to claim 1, wherein the suction nozzles mounted on the sub heads are suction nozzles having different sizes for the sub heads.   The component mounting apparatus according to any one of claims 1 to 3, wherein the head unit is detachably mounted on the component transfer head.   5. The component mounting apparatus according to claim 1, wherein the head unit includes an imaging unit that detects an orientation of a component sucked and held by the suction nozzle of the sub head.   The component mounting apparatus according to claim 5, wherein the imaging unit images a component sucked and held by a suction nozzle positioned at an upper end of the sub head. Nozzle rotation driving means that is provided in each of the nozzle units and rotationally drives the suction nozzle of the nozzle unit;
Nozzle rotation control means for outputting a rotation drive command to the nozzle rotation drive means within a predetermined rotation angle on the front side in the sub head rotation direction at the lower end position of the sub head and the upper end position of the sub head, respectively. The component mounting apparatus according to claim 6.   Rotation drive command for rotating the component sucked and held by the suction nozzle so that the nozzle rotation control means is attached to the substrate in a predetermined direction with respect to the suction nozzle on the upper end side of the sub head The rotation drive command for correcting the suction posture of the suction-held component based on the imaging result of the imaging unit is output to the suction nozzle on the lower end side of the sub head. 7. The component mounting apparatus according to 7. The head unit includes an annular cam groove facing the nozzle unit in which the suction nozzle is arranged in the circumferential shape, and a lower portion of the cam groove is divided to be freely raised and lowered.
Each nozzle unit of the sub head includes a cam follower that engages with an annular cam groove fixed to the head unit,
Engage with the cam follower of the nozzle unit located at the lower end of the sub head when the component is sucked and held by the suction nozzle from the component supply unit and when the component sucked and held by the suction nozzle is mounted on the substrate. The component mounting apparatus according to any one of claims 1 to 8, further comprising a nozzle lifting / lowering means for moving up and down a lower portion of the divided cam groove.   The component mounting apparatus according to claim 1, wherein each of the head units includes an information storage unit including identification information of the head unit. The information storage unit is a memory tag capable of rewriting information,
The component mounting apparatus according to claim 10, wherein the component transfer head includes a tag read / write unit that reads and writes information from and to the memory tag.   The component mounting apparatus according to claim 11, wherein the memory tag is a wireless tag that reads and writes information by wireless communication.   The component mounting apparatus according to claim 11 or 12, wherein the identification information of the head unit stored in the memory tag includes calibration data having information on a relative position between the suction nozzle and the nozzle unit. .   The component mounting apparatus according to claim 11, wherein the identification information of the head unit stored in the memory tag includes operation time data of a component mounting operation.   The component mounting according to any one of claims 11 to 14, wherein the identification information of the head unit stored in the memory tag includes component type data for identifying a component of the head unit. apparatus. The nozzle unit has a narrow-diameter portion at the lower end and a large-diameter portion at the upper end, and has a support portion that is thicker than the thin-diameter portion and thinner than the large-diameter portion in the middle, and has a suction / exhaust hole in the center. 1 nozzle, and a second nozzle supported on the outer periphery of the support portion of the first nozzle so as to be slidable in the vertical direction and disposed concentrically with the first holder,
The first nozzle has an upper lock portion and a lower lock portion at different positions in the vertical direction of the outer periphery of the support portion,
The second nozzle has an engagement portion that engages with one of the two lock portions on the inner peripheral side facing the support portion of the first nozzle,
When the second nozzle is in an upper position where the engagement portion and the upper lock portion are engaged, the component suction operation by the second nozzle is performed by the suction operation by the first nozzle, and the second nozzle However, when the engagement portion and the lower lock portion are in a lower position where the engagement portion and the lower lock portion are engaged, the component adsorption by the second nozzle is invalidated and the component adsorption is performed only by the first nozzle. The component mounting apparatus according to claim 1, wherein the component mounting apparatus is characterized in that:   When the second nozzle is in the lower position, the lower end surface of the second nozzle is positioned below the lower end surface of the first nozzle, and an adsorption space is defined between the first nozzle and the second nozzle. The component mounting apparatus according to claim 16, wherein the component mounting apparatus is formed.   The second nozzle includes a flange portion on an outer periphery of the second nozzle, and the first nozzle is moved up and down while the flange portion is fixed by a flange fixing means provided in the head unit. The component mounting apparatus according to claim 16 or 17, wherein a relative position with respect to is changed.   19. The component mounting apparatus according to claim 18, wherein the flange portion includes a pair of upper and lower flanges, and the flange fixing means inserts a stopper between the pair of flanges.   The sub head includes, in each of the plurality of nozzle units, a negative pressure source that performs component suction by the suction nozzle and a valve mechanism that is selectively connected to a positive pressure source for releasing component suction. The component mounting apparatus according to any one of claims 1 to 19.   The valve mechanism includes a negative pressure source connected to the adsorption valve and an air operated valve for changing the flow path from the positive pressure source by moving a flow path switching spool according to a pressure difference. 21. The component mounting apparatus according to claim 20, wherein The sub head includes a nozzle fixing rotating member in which a hollow shaft portion is connected to a flange portion where the plurality of nozzle units and a plurality of the valve mechanisms corresponding to the nozzle units are supported,
The component mounting apparatus according to claim 20 or 21, wherein the rotation driving means is disposed on an outer periphery of a shaft portion of the nozzle fixing rotation member and rotationally drives the shaft portion. The sub head is equipped with a control circuit board for controlling the nozzle unit and the valve mechanism,
The signal line taken out from the control circuit board via a slip ring is laid in the inner space of the shaft portion of the nozzle fixing rotating member, and an intake passage to the nozzle mechanism is formed. 22. The component mounting apparatus according to 22.

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